Semiconductor process chamber and semiconductor process equipment

Abstract

The invention discloses a semiconductor process chamber and semiconductor process equipment. The disclosed semiconductor process chamber comprises a chamber body, a plurality of boat bearing frames and a plurality of electrode groups, the chamber body is provided with an inner cavity, the boat bearing frames are oppositely arranged in the inner cavity at intervals in the bearing direction, the boat bearing frames are used for supporting the bearing boats respectively, and the electrode sets are used for being connected with the bearing boats in a one-to-one correspondence mode. One of the two electrode ends of each electrode group is used for realizing the electric connection between the corresponding bearing boat and the positive electrode of the radio frequency assembly, and the other one of the two electrode ends of each electrode group is used for realizing the electric connection between the corresponding bearing boat and the negative electrode of the radio frequency assembly. According to the scheme, the problem that the process yield is difficult to guarantee while the process efficiency is improved due to the fact that a silicon wafer in a semiconductor process chamber related to the related technology is easy to damage due to the fact that the bearing boat is easy to deform after being extruded can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor process equipment design, and particularly relates to a semiconductor process chamber and a semiconductor process equipment. Background Art

[0002] Semiconductor process equipment such as PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment usually processes semiconductor wafers (such as silicon wafers) in a carrier boat in a semiconductor process chamber. In order to reduce production costs, it is necessary to improve process efficiency.

[0003] The semiconductor process chamber related to the related technology stacks two carrier boats directly together and places the two carrier boats in the semiconductor process chamber, so that more silicon wafers can be accommodated by the two carrier boats, thereby improving the process efficiency. However, the carrier boat located below is easily deformed due to the extrusion of the carrier boat stacked above it, so that the silicon wafers in the lower carrier boat are easily damaged, which easily reduces the process yield. How to improve the process efficiency while avoiding reducing the process yield is a technical problem that those skilled in the art urgently need to solve. Summary of the Invention

[0004] The present invention discloses a semiconductor process chamber and a semiconductor process equipment to solve the problem that the semiconductor process chamber related to the related technology has the problem that the carrier boat is easily deformed due to extrusion, resulting in the silicon wafers therein being easily damaged and it is difficult to ensure the process yield while improving the process efficiency.

[0005] To solve the above technical problems, the present invention provides the following technical solutions: In a first aspect, the present application discloses a semiconductor process chamber. The disclosed semiconductor process chamber includes a chamber body, a plurality of boat carriers, and a plurality of electrode groups; The chamber body has an inner cavity. The plurality of boat carriers are spaced and oppositely arranged in the inner cavity in the loading direction. The plurality of boat carriers are respectively used to support a plurality of carrier boats. At least part of the structure of each electrode group is arranged in the inner cavity. The plurality of electrode groups are used to be connected to the plurality of carrier boats one by one. Each electrode group includes two electrode ends. One of the two electrode ends of each electrode group is used to realize the electrical connection between the corresponding carrier boat and the positive electrode of the radio frequency component, and the other of the two electrode ends of each electrode group is used to realize the electrical connection between the corresponding carrier boat and the negative electrode of the radio frequency component.

[0006] In a second aspect, the present application discloses a semiconductor process equipment. The disclosed semiconductor process equipment includes a plurality of carrier boats and the semiconductor process chamber described above; The multiple boat carriers are respectively used to support the multiple boats, and each of the boats is electrically connected to the radio frequency component through the two electrode ends of the corresponding electrode group.

[0007] The technical solution adopted by the present invention can achieve the following technical effects: The semiconductor process chamber disclosed in the embodiment of the present application improves the structure of the semiconductor process chamber involved in the related art. By arranging multiple boat carriers at intervals and oppositely in the loading direction in the inner cavity, the multiple boat carriers can respectively support multiple boats, so as to improve the process efficiency and avoid the multiple boats being stacked together, causing the lower boats to be easily deformed by extrusion, resulting in easy damage to the silicon wafers in the boats and affecting the process yield. Therefore, it is possible to avoid affecting the process yield while improving the process efficiency. Description of the Drawings

[0008] Figure 1 is a schematic structural diagram of a semiconductor process chamber disclosed in an embodiment of the present application; Figure 2 is a schematic structural diagram of another semiconductor process chamber disclosed in an embodiment of the present application; Figure 3 is a schematic structural diagram of yet another semiconductor process chamber disclosed in an embodiment of the present application; Figure 4 is a schematic structural diagram of a semiconductor process equipment disclosed in an embodiment of the present application; Figure 5 is a schematic structural diagram of the semiconductor process equipment disclosed in an embodiment of the present application from another perspective; Figure 6 is a schematic structural diagram of the semiconductor process equipment disclosed in an embodiment of the present application from yet another perspective; Figure 7 is a schematic structural diagram of another semiconductor process equipment disclosed in an embodiment of the present application; Figure 8 is a schematic structural diagram of yet another semiconductor process equipment disclosed in an embodiment of the present application.

[0009] Description of the Reference Numerals: 100 - Chamber body, 110 - Inner cavity, 120 - Opening, 130 - Bottom wall, 131 - Second support block, 132 - Second support rod, 140 - First flange, 141 - First support block, 142 - First support rod, 200 - Boat carrier, 210 - Insulating part, 220 - Support rod, 300 - Electrode group, 310 - Electrode end, 320 - Electrical connection part, 400 - Boat, 410 - Boat foot, 500 - Heater, 600 - Conveyor section, 710 - First support base, 720 - Second support base. Detailed implementation manner

[0010] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0011] The terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of this application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are usually of the same type, and the number of objects is not limited. For example, the first object can be one or multiple.

[0012] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0013] Please refer to Figures 1 to 8 , this application embodiment discloses a semiconductor process chamber. The disclosed semiconductor process chamber includes a chamber body 100, a plurality of boat carriers 200, and a plurality of electrode groups 300.

[0014] The chamber body 100 is a basic component of the semiconductor process chamber, and is used to provide an installation position for other components of the semiconductor process chamber. Among them, a plurality of boat carriers 200 and a plurality of electrode groups 300 are both provided in the chamber body 100. In addition, the chamber body 100 is also used to form some functional spaces or structures, such as an inner cavity 110.

[0015] The boat carrier 200 is a core component in the semiconductor process chamber for supporting the carrier boat 400. A plurality of boat carriers 200 are spaced and oppositely arranged in the inner cavity 110 in the loading direction. The plurality of boat carriers 200 are respectively used to support a plurality of carrier boats 400, so that the plurality of carrier boats 400 can be relatively stably supported in the inner cavity 110 for facilitating the process.

[0016] The electrode group 300 is a core component in the semiconductor process chamber for realizing the electrical connection between the carrier boat 400 and the RF component. A plurality of electrode groups 300 are used to be connected to a plurality of carrier boats 400 one by one. Each electrode group 300 includes two electrode terminals 310. One of the two electrode terminals 310 of each electrode group 300 is used to realize the electrical connection between the corresponding carrier boat 400 and the positive electrode of the RF component, and the other of the two electrode terminals 310 of each electrode group 300 is used to realize the electrical connection between the corresponding carrier boat 400 and the negative electrode of the RF component. Thus, the electrical connection between the corresponding carrier boat 400 and the RF component can be realized through the two electrode terminals 310 of each electrode group 300.

[0017] The semiconductor process chamber disclosed in the embodiments of the present application improves the structure of the semiconductor process chamber involved in the related art. By arranging a plurality of boat carriers 200 spaced and oppositely in the loading direction in the inner cavity 110, each of the plurality of boat carriers 200 can support a plurality of carrier boats 400, so as to improve the process efficiency and avoid the problem that the plurality of carrier boats 400 are stacked together, causing the lower carrier boat 400 to be easily deformed under extrusion, which easily damages the silicon wafers in the carrier boat 400 and affects the process yield. Therefore, the process yield can be avoided while improving the process efficiency.

[0018] In addition, such a structure can avoid the plurality of carrier boats 400 being stacked together and supported on the boat carrier 200, thus avoiding the problem that the boat carrier 200 is under excessive pressure and is prone to fracture, which is beneficial to improving the stability of the semiconductor process chamber.

[0019] In a further technical solution, each of the plurality of boat carriers 200 may include a plurality of insulating members 210, each of the plurality of carrier boats 400 may include a plurality of boat feet 410, the plurality of boat carriers 200 are used to respectively support on the plurality of carrier boats 400 through the plurality of boat feet 410, and the plurality of boat carriers 200 are used to be insulated from the plurality of boat feet 410 respectively through the plurality of insulating members 210. That is to say, each boat carrier 200 is in insulating support cooperation with the plurality of boat feet 410 of the corresponding carrier boat 400 through the plurality of insulating members 210. Specifically, the materials of the plurality of insulating members 210 may all be aluminum nitride, silicon nitride or quartz, and the embodiments of the present application do not limit this.

[0020] This structure can prevent current from leaking from multiple carrier boats 400 to multiple boat carriers 200 respectively, thereby avoiding unnecessary energy loss. At the same time, in the case where parts of the multiple boat carriers 200 other than the insulating parts 210 are made of metal, this structure can prevent the multiple carrier boats 400 from directly contacting the parts of the multiple boat carriers 200 other than the insulating parts 210, which easily forms a galvanic cell effect and causes metal ion migration to contaminate the silicon wafers in the multiple carrier boats 400.

[0021] In a feasible technical solution, each boat carrier 200 may further include at least two spaced-apart support rods 220. The insulating parts 210 may be insulating sleeves, and multiple insulating sleeves may be respectively sleeved on the multiple support rods 220. This structure is relatively simple and can occupy a small space in the inner cavity 110, so as to avoid affecting the multiple carrier boats 400 as much as possible, facilitating the loading or unloading of the multiple carrier boats 400 into or out of the inner cavity 110. Specifically, the materials of the multiple support rods 220 may all be alumina, molybdenum or tungsten, and the specific materials of the support rods 220 are not limited in the embodiments of the present application.

[0022] To save costs, each boat carrier 200 may include two spaced-apart support rods 220. When the multiple boat carriers 200 support the multiple carrier boats 400 respectively, multiple boat feet 410 of each carrier boat 400 may all be located between the two support rods 220 of the corresponding boat carrier 200, and the multiple boat feet 410 of the multiple carrier boats 400 may respectively abut against the two support rods 220 of the corresponding boat carrier 200.

[0023] This structure can avoid the multiple carrier boats 400 from moving up and down in the distribution direction of the two support rods 220 of the corresponding boat carrier 200 as much as possible, so that the multiple boat carriers 200 can all stably support the corresponding carrier boats 400.

[0024] In an embodiment, the electrode end 310 may be a first electrical connector. Two first electrical connectors of each electrode group 300 may be respectively arranged on the multiple insulating parts 210 of each boat carrier 200. One of the two first electrical connectors of each electrode group 300 is used to electrically connect with the corresponding boat foot 410 in the corresponding carrier boat 400 to realize the electrical connection between the corresponding carrier boat 400 and the positive electrode of the radio frequency component. The other of the two first electrical connectors of each electrode group 300 is used to electrically connect with the corresponding boat foot 410 in the corresponding carrier boat 400 to realize the electrical connection between the corresponding carrier boat 400 and the negative electrode of the radio frequency component. Thus, the electrical connection between the corresponding carrier boat 400 and the radio frequency component can be realized through the two first electrical connectors of each electrode group 300.

[0025] In such a structure, during the specific design process, the positions and quantities of the first electrical connectors can be arranged more flexibly according to actual requirements, which is conducive to enhancing the flexibility of the design. At the same time, the two first electrical connectors of each electrode group 300 can be more conveniently installed on the insulators 210 of each boat carrier 200 respectively, and the two first electrical connectors of each electrode group 300 can be more conveniently detached from the multiple insulators 210 of each boat carrier 200, that is, the first electrical connectors are easier to install and disassemble, which is conducive to reducing the maintenance difficulty.

[0026] In another embodiment, the electrode end 310 can be an electrode rod, each carrier boat 400 can have two electrode holes, one of the two electrode rods of each electrode group 300 is used for plugging and matching with one of the two electrode holes of the corresponding carrier boat 400 to realize the electrical connection between the corresponding carrier boat 400 and the positive pole of the radio frequency component, and the other of the two electrode rods of each electrode group 300 is used for plugging and matching with the other of the two electrode holes of the corresponding carrier boat 400 to realize the electrical connection between the corresponding carrier boat 400 and the negative pole of the radio frequency component, so that the electrical connection between the corresponding carrier boat 400 and the radio frequency component can be realized through the two electrode rods of each electrode group 300.

[0027] In such a structure, since the electrical connection between the corresponding carrier boat 400 and the radio frequency component can be realized by plugging and matching the two electrode rods of each electrode group 300 with the two electrode holes of the corresponding carrier boat 400 respectively, the connection between each electrode group 300 and the corresponding carrier boat 400 can be made more stable, which is conducive to improving the reliability of the connection between each electrode group 300 and the corresponding carrier boat 400.

[0028] In the embodiment of the present application, each electrode group 300 may further include two electrical connection parts 320. The two electrical connection parts 320 of each electrode group 300 may be respectively connected to the two electrode ends 310 of each electrode group 300. Part of the structures of the multiple electrical connection parts 320 may be disposed outside the inner cavity 110 for electrically connecting the radio frequency component. This structure reduces the difficulty of the electrical connection between the multiple electrical connection parts 320 and the radio frequency component by disposing part of the structures of the multiple electrical connection parts 320 outside the inner cavity 110, so as to facilitate the electrical connection of the multiple electrical connection parts 320 to the radio frequency component respectively.

[0029] More specifically, one of the two electrical connection parts 320 of each electrode group 300 is used for connecting to the positive pole of the radio frequency component, and the other of the two electrical connection parts 320 of each electrode group 300 is used for connecting to the negative pole of the radio frequency component, so as to realize the electrical connection between the multiple electrical connection parts 320 and the radio frequency component.

[0030] In a feasible technical solution, the semiconductor process chamber may further include a chamber door. The chamber body 100 may have an opening 120 and a bottom wall 130. The bottom wall 130 is opposite to the opening 120. The opening 120 may communicate with the inner cavity 110. The chamber door is used to seal and block the opening 120. Each boat carrier 200 is used to support a plurality of carrier boats 400 distributed in the first direction. The distribution direction of the opening 120 and the bottom wall 130 may be parallel to the first direction.

[0031] Among the multiple electrode groups 300, the two electrical connection parts 320 of a part of the electrode groups 300 may be both arranged at the opening 120, and the two electrode ends 310 of a part of the electrode groups 300 are respectively used to be electrically connected to the carrier boats 400 close to the opening 120. The two electrical connection parts 320 of another part of the electrode groups 300 may be both arranged at the bottom wall 130, and the two electrode ends 310 of another part of the electrode groups 300 are respectively used to be electrically connected to the carrier boats 400 close to the bottom wall 130. This structure enables each electrode group 300 to be more conveniently connected to the corresponding carrier boat 400, thereby facilitating the process more conveniently.

[0032] Furthermore, the two electrode ends 310 of a part of the electrode groups 300 may both be first electrical connectors, and the two first electrical connectors of a part of the electrode groups 300 may be respectively arranged on the multiple boat carriers 200. The two electrode ends 310 of another part of the electrode groups 300 may both be electrode rods.

[0033] In this structure, since the two electrical connection parts 320 of a part of the electrode groups 300 are both arranged at the opening 120, this makes the two electrode ends 310 of a part of the electrode groups 300 relatively close to the opening 120. In this case, the two electrode ends 310 of a part of the electrode groups 300 are both first electrical connectors, and the two first electrical connectors of a part of the electrode groups 300 are respectively arranged on the multiple boat carriers 200, which can avoid affecting the loading or unloading of the multiple carrier boats 400 into or out of the inner cavity 110 through the opening 120, so as to facilitate the loading or unloading of the multiple carrier boats 400 into or out of the inner cavity 110.

[0034] At the same time, in this structure, the two electrode ends 310 of another part of the electrode groups 300 are both electrode rods, and the cost of the electrode rods is relatively low, so as to reduce the cost while avoiding affecting the loading or unloading of the multiple carrier boats 400 into or out of the inner cavity 110 through the opening 120.

[0035] Optionally, the chamber body 100 may include a process tube and a first flange 140. The first flange 140 and the bottom wall 130 may be respectively connected to opposite ends of the process tube, and the first flange 140, the bottom wall 130, and the process tube may jointly enclose an inner cavity 110. The opening 120 may be provided on the first flange 140. Two electrical connection portions 320 of a part of the electrode group 300 may both be provided on the first flange 140. The first direction may be parallel to the extending direction of the process tube. This structure is relatively simple and easy to implement, thus facilitating production and manufacturing and being conducive to reducing the production difficulty.

[0036] In other embodiments, the bottom wall 130 may include a second flange, and the bottom wall 130 may be connected to the end of the process tube through the second flange, so that the connection between the bottom wall 130 and the end of the process tube can be more easily achieved, which is conducive to reducing the production difficulty.

[0037] In an alternative technical solution, the first flange 140 may include a plurality of first support blocks 141, and the bottom wall 130 may include a plurality of second support blocks 131. The first ends of the plurality of boat carriers 200 may be respectively connected to the plurality of first support blocks 141 in a one-to-one correspondence, and the second ends of the plurality of boat carriers 200 may be respectively connected to the plurality of second support blocks 131 in a one-to-one correspondence. This structure can respectively raise the plurality of boat carriers 200 through the plurality of first support blocks 141 and the plurality of second support blocks 131, which is conducive to determining the height of the plurality of boat carriers 200 in the inner cavity 110.

[0038] To facilitate the maintenance of the plurality of boat carriers 200, the first ends of the plurality of boat carriers 200 may be detachably connected to the plurality of first support blocks 141 in a one-to-one correspondence, and the second ends of the plurality of boat carriers 200 may be detachably connected to the plurality of second support blocks 131 in a one-to-one correspondence, so that the plurality of boat carriers 200 can be disassembled for maintenance.

[0039] When each boat carrier 200 includes at least two spaced-apart support rods 220, each first support block 141 may be provided with a first positioning groove, each second support block 131 may be provided with a second positioning groove, the first end of each support rod 220 may be respectively positioned in the plurality of first positioning grooves in a one-to-one correspondence, and the second end of each support rod 220 may be respectively positioned in the plurality of second positioning grooves in a one-to-one correspondence. This structure can achieve the quick disassembly and assembly of the plurality of support rods 220, which is conducive to improving the installation efficiency and making the maintenance more convenient.

[0040] Of course, the first ends of multiple boat carriers 200 can also be detachably connected to multiple first support blocks 141 one by one in a threaded connection manner, and the second ends of multiple boat carriers 200 can also be detachably connected to multiple second support blocks 131 one by one in a threaded connection manner. The embodiments of the present application do not limit this.

[0041] In one embodiment, the first flange 140 may further include a first support rod 142, and the bottom wall 130 may further include a second support rod 132. Among multiple first support blocks 141 and multiple second support blocks 131, a part of the first support blocks 141 may be fixed to the edge of the first flange 140, and a part of the second support blocks 131 may be fixed to the edge of the bottom wall 130, so as to realize the fixation of the boat carrier 200 at the lowermost position in the loading direction. At the same time, another part of the first support blocks 141 may be fixed to the first support rod 142, and another part of the second support blocks 131 may be fixed to the second support rod 132, so as to realize the fixation of other boat carriers 200. Specifically, in this case, the semiconductor process chamber may be a horizontal furnace.

[0042] This structure can more conveniently realize the fixation of multiple first support blocks 141 and multiple second support blocks 131, so as to facilitate the fixation of multiple boat carriers 200.

[0043] In the embodiments of the present application, the semiconductor process chamber may further include multiple heaters 500. The multiple heaters 500 may be arranged in the inner cavity 110 at intervals and oppositely. Each boat carrier 200 may be located between two adjacent heaters 500, so that the two adjacent heaters 500 can heat the boat carrier 200 located between the two adjacent heaters 500, avoiding the situation that the local temperature of the inner cavity 110 is uneven due to difficult uniform heating, which is likely to affect the process effect. At the same time, this structure can heat more efficiently, which is beneficial to improving the heating efficiency and further beneficial to improving the process efficiency.

[0044] When the chamber body 100 includes a process tube and a first flange 140, the second ends of each heater 500 may be respectively connected to the bottom wall 130, the first ends of a part of the heaters 500 may be respectively connected to the first flange 140, and the first ends of another part of the heaters 500 may be connected to the inner wall of the process tube, so as to realize the installation of each heater 500 in the inner cavity 110. This structure can avoid that the first ends of each heater 500 are all connected to the first flange 140, which is likely to block the opening 120 and thus is likely to affect the loading or unloading of multiple carrier boats 400 into or out of the inner cavity 110.

[0045] In one embodiment, the semiconductor process chamber may be a horizontal furnace. When the semiconductor process chamber is a horizontal furnace and the chamber body 100 includes a process tube and a first flange 140, the semiconductor process chamber may further include a first support base 710 and a plurality of second support bases 720. The first support base 710 may be fixed to the inner wall of the process tube, and the plurality of second support bases 720 may be fixed to the first flange 140.

[0046] In the heater 500, the first end of the heater 500 at the bottom (i.e., the lowermost in the loading direction) may be supported on the first support base 710 through lap joint, so as to be connected to the inner wall of the process tube through the first support base 710. The first ends of the remaining heaters 500 may be supported on the plurality of second support bases 720 through lap joint, so as to be respectively connected to the first flange 140 through the plurality of second support bases 720. Such a structure can more conveniently realize the installation of the plurality of heaters 500, which is beneficial to improving the installation efficiency.

[0047] Further, when the first flange 140 includes a first support rod 142, a part of the second support bases 720 may be fixed to the first support rod 142, so as to make full use of the first support rod 142. Of course, another part of the second support bases 720 may be fixedly connected to the edge of the first flange 140, so as to realize the fixation of the other part of the second support bases 720 on the first flange 140.

[0048] Based on the semiconductor process equipment disclosed in the embodiments of the present application, the embodiments of the present application further disclose a semiconductor process equipment. The disclosed semiconductor process equipment includes a plurality of carrier boats 400 and the semiconductor process chamber described in any one of the above embodiments. Among them, a plurality of boat carriers 200 are respectively used to support the plurality of carrier boats 400, and each carrier boat 400 is electrically connected to the radio frequency component through two electrode ends 310 of the corresponding electrode group 300. Specifically, the semiconductor process equipment may be a PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment.

[0049] Optionally, the semiconductor process equipment may further include a radio frequency component and a plurality of carrier boats 400. The radio frequency component may be at least partially disposed in the inner cavity 110. Each carrier boat 400 is electrically connected to the radio frequency component through two electrode ends 310 of the corresponding electrode group 300. The plurality of carrier boats 400 are all used to carry semiconductor wafers. Specifically, the plurality of carrier boats 400 may all be graphite boats, and the semiconductor wafers may be silicon wafers.

[0050] Further, the semiconductor process equipment may further include a conveying mechanism, which may have a plurality of conveying parts 600 for respectively conveying a plurality of boat carriers 200 into or out of the inner cavity 110 through the plurality of conveying parts 600, so as to avoid the situation that the pressure borne by each conveying part 600 is too large and it is easy to break, and thus is beneficial to improving the stability of the semiconductor process equipment.

[0051] In the specific working process, the plurality of conveying parts 600 may work simultaneously, which enables the plurality of boat carriers 200 to be respectively conveyed into or out of the inner cavity 110 through the plurality of conveying parts 600 simultaneously, thus being beneficial to improving the working efficiency. Of course, each conveying part 600 may also work independently, and the embodiments of the present application do not limit this.

[0052] In the above embodiments of the present invention, the differences between the embodiments are mainly described. As long as the different optimized features of the embodiments do not conflict, they can be combined to form a more optimal embodiment. Considering the simplicity of the text, it will not be elaborated here.

[0053] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above specific embodiments. The above specific embodiments are merely illustrative rather than restrictive. Under the inspiration of the present invention, those of ordinary skill in the art can also make many forms without departing from the purpose of the present invention and the scope protected by the claims, and all of them belong to the protection scope of the present invention.

Claims

1. A semiconductor process chamber, characterized in that, It includes a chamber body (100), a plurality of boat carriers (200) and a plurality of electrode groups (300); The chamber body (100) has an inner cavity (110). The plurality of boat carriers (200) are arranged in the inner cavity (110) at intervals and oppositely in the loading direction. The plurality of boat carriers (200) are respectively used to support a plurality of boats (400). At least part of the structure of each electrode group (300) is arranged in the inner cavity (110). The plurality of electrode groups (300) are used to be connected to the plurality of boats (400) one by one. Each electrode group (300) includes two electrode ends (310). One of the two electrode ends (310) of each electrode group (300) is used to realize the electrical connection between the corresponding boat (400) and the positive electrode of the radio frequency component. The other of the two electrode ends (310) of each electrode group (300) is used to realize the electrical connection between the corresponding boat (400) and the negative electrode of the radio frequency component.

2. The semiconductor process chamber according to claim 1, wherein, The plurality of boat carriers (200) each include a plurality of insulating members (210). The plurality of boats (400) each include a plurality of boat feet (410). The plurality of boat carriers (200) are used to support the plurality of boats (400) respectively through the plurality of boat feet (410). The plurality of boat carriers (200) are used to be insulated from the plurality of boat feet (410) respectively through the plurality of insulating members (210).

3. The semiconductor process chamber according to claim 2, wherein Each boat carrier (200) further includes at least two spaced support rods (220). The insulating member (210) is an insulating sleeve. The plurality of insulating sleeves are respectively sleeved on the plurality of support rods (220).

4. The semiconductor process chamber according to claim 2, wherein, The electrode end (310) is a first electrical connector. The two first electrical connectors of each electrode group (300) are respectively arranged on the plurality of insulating members (210) of each boat carrier (200); One of the two first electrical connectors of each electrode group (300) is used to be electrically connected to the corresponding boat foot (410) in the corresponding boat (400) to realize the electrical connection between the corresponding boat (400) and the positive electrode of the radio frequency component. The other of the two first electrical connectors of each electrode group (300) is used to be electrically connected to the corresponding boat foot (410) in the corresponding boat (400) to realize the electrical connection between the corresponding boat (400) and the negative electrode of the radio frequency component.

5. The semiconductor process chamber according to claim 1, wherein The electrode end (310) is an electrode rod. Each of the carrier boats (400) has two electrode holes. One of the two electrode rods of each electrode group (300) is used for plugging and mating with one of the two electrode holes of the corresponding carrier boat (400) to achieve the electrical connection between the corresponding carrier boat (400) and the positive electrode of the radio frequency component. The other of the two electrode rods of each electrode group (300) is used for plugging and mating with the other of the two electrode holes of the corresponding carrier boat (400) to achieve the electrical connection between the corresponding carrier boat (400) and the negative electrode of the radio frequency component.

6. The semiconductor process chamber according to claim 1, wherein Each electrode group (300) further includes two electrical connection parts (320). The two electrical connection parts (320) of each electrode group (300) are respectively connected to the two electrode ends (310) of each electrode group (300). Part of the structure of the multiple electrical connection parts (320) is arranged outside the inner cavity (110) for electrically connecting the radio frequency component.

7. The semiconductor process chamber according to claim 6, wherein, The semiconductor process chamber further includes a chamber door. The chamber body (100) has an opening (120) and a bottom wall (130). The opening (120) communicates with the inner cavity (110). The chamber door is used to seal and block the opening (120). Each boat carrier (200) is used to support a plurality of carrier boats (400) distributed in the first direction. The distribution directions of the opening (120) and the bottom wall (130) are parallel to the first direction. Among the multiple electrode groups (300), the two electrical connection parts (320) of some electrode groups (300) are both arranged in the opening (120). The two electrode ends (310) of some electrode groups (300) are respectively used for electrically connecting with the carrier boats (400) close to the opening (120). The two electrical connection parts (320) of another part of the electrode groups (300) are both arranged on the bottom wall (130). The two electrode ends (310) of another part of the electrode groups (300) are respectively used for electrically connecting with the carrier boats (400) close to the bottom wall (130).

8. The semiconductor process chamber according to claim 7, wherein, The two electrode ends (310) of some electrode groups (300) are both first electrical connectors, and the two first electrical connectors of some electrode groups (300) are respectively arranged on the multiple boat carriers (200). The two electrode ends (310) of another part of the electrode groups (300) are both electrode rods.

9. The semiconductor process chamber according to claim 7, wherein, The chamber body (100) includes a process tube and a first flange (140); The first flange (140) and the bottom wall (130) are respectively connected to opposite ends of the process tube, and the first flange (140), the bottom wall (130) and the process tube together enclose the inner cavity (110). The opening (120) is provided on the first flange (140). The two electrical connection parts (320) of a part of the electrode group (300) are both provided on the first flange (140). The first direction is parallel to the extension direction of the process tube.

10. The semiconductor process chamber according to claim 9, wherein, The first flange (140) includes a plurality of first support blocks (141), and the bottom wall (130) includes a plurality of second support blocks (131). The first ends of the plurality of boat carriers (200) are connected to the plurality of first support blocks (141) in a one-to-one correspondence, and the second ends of the plurality of boat carriers (200) are connected to the plurality of second support blocks (131) in a one-to-one correspondence.

11. The semiconductor process chamber according to claim 1, wherein The semiconductor process chamber further includes a plurality of heaters (500). The plurality of heaters (500) are all arranged in the inner cavity (110) at intervals and oppositely, and each boat carrier (200) is located between two adjacent heaters (500).

12. A semiconductor process equipment, characterized in that, It includes a plurality of susceptors (400) and the semiconductor process chamber according to any one of claims 1 to 11; The plurality of boat carriers (200) are respectively used to support the plurality of susceptors (400), and each susceptor (400) is electrically connected to the RF component through the two electrode ends (310) of the corresponding electrode group (300).

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