Temperature control module structure of wearable equipment

Abstract

The invention discloses a temperature control module structure of wearable equipment, and aims to overcome the defects that an existing air conditioning suit mainly adopts a compressor to refrigerate and heat and is large in weight and high in price. The wearable device comprises a machine shell, the machine shell is fixedly connected with the wearable device, an installation cavity is formed in the machine shell, a thermoelectric semiconductor chilling plate and a radiator are installed in the installation cavity, and the thermoelectric semiconductor chilling plate is arranged close to the bottom face of the installation cavity. The temperature control module is installed on the wearable equipment for use, the weight is light, the price is low, and the temperature control module is connected with the wearable equipment conveniently and reliably.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor temperature control, and more specifically, it relates to a temperature control module structure for wearable equipment. Background Art

[0002] Currently, in order to ensure the comfort of outdoor workers during operations, portable air-conditioning suits are worn during outdoor operations, which can provide heating in winter and cooling in summer. At home and abroad, the portable air-conditioning suits for outdoor operations mainly use compressors for refrigeration and heating. However, such air-conditioning suits are heavy and expensive. The lightest compressor-based air-conditioning suit system host on the market weighs 2.5 kg. Adding the battery and the cooling suit, the entire air-conditioning suit system weighs more than 10 kg, and the price ranges from 10,000 yuan to 20,000 yuan. The market prospects for civilian and commercial individual users are significantly limited by its price. For example, Chinese Patent Application No. 2016111005775 discloses an air-conditioning suit, whose main structure consists of a hollow body, connected trouser sleeves, and a portable air conditioner, an electric heater, and a rechargeable battery that are assembled with it. Such an air-conditioning suit is heavy and has poor use comfort. Summary of the Invention

[0003] In order to overcome the above deficiencies, the present invention provides a temperature control module structure for wearable equipment. The temperature control module is installed on the wearable equipment for use, with light weight, low price, and convenient and reliable connection between the temperature control module and the wearable equipment.

[0004] To solve the above technical problems, the present invention adopts the following technical solution: A temperature control module structure for wearable equipment, including a housing, the housing is fixedly connected to the wearable device, an installation cavity is provided inside the housing, a thermoelectric semiconductor refrigeration sheet and a radiator are installed in the installation cavity, and the thermoelectric semiconductor refrigeration sheet is arranged close to the bottom surface of the installation cavity.

[0005] Installing the temperature control module on the wearable equipment can achieve refrigeration and heating of the wearable device. The thermoelectric semiconductor refrigeration sheet is installed inside the housing of the temperature control module, and refrigeration and heating are achieved through the thermoelectric semiconductor refrigeration sheet, which can reduce the volume and weight of the entire temperature control module. The housing of the temperature control module is connected to the wearable equipment, and the connection is convenient and reliable. Compared with the compressor-based wearable equipment, the thermoelectric semiconductor refrigeration sheet-based wearable equipment is more portable, lighter, and more convenient for diversified design, and has the advantage of a significant reduction in cost compared to the compressor. The temperature control module of this patent application is installed on the wearable equipment for use, with light weight, low price, and convenient and reliable connection between the temperature control module and the wearable equipment.

[0006] Preferably, a temperature protection switch is installed in the installation cavity, and the temperature sensing side of the temperature protection switch is arranged close to the bottom surface of the installation cavity.

[0007] The temperature protection switch plays a protective role. When the thermoelectric semiconductor refrigeration chip is reversely powered for heating and the temperature is higher than the set threshold, the temperature protection switch disconnects to cut off the thermoelectric semiconductor refrigeration chip, preventing scalding. After the temperature recovers, the temperature protection switch closes to conduct the thermoelectric semiconductor refrigeration chip to work.

[0008] Preferably, a heat conduction plate is installed at the bottom of the casing, and the heat conduction plate is close to the semiconductor refrigeration chip.

[0009] The heat conduction plate plays an effect of temperature equalization, enabling the cold or heat on the thermoelectric semiconductor refrigeration chip to be quickly transferred to the wearable device, improving the use effect.

[0010] Preferably, a number of positioning inserts are circumferentially and spacedly arranged at the edge of the heat conduction plate, and the positioning inserts are inserted into the casing to achieve connection and positioning.

[0011] The heat conduction plate is installed on the casing through the positioning inserts, and the connection is convenient.

[0012] Preferably, the radiator includes a heat dissipation plate and a heat dissipation fan. One side of the heat dissipation plate is connected to the thermoelectric semiconductor refrigeration chip, heat dissipation fins are arranged on the other side of the heat dissipation plate, and the heat dissipation fan is installed on the heat dissipation fins.

[0013] The heat dissipation plate has a good heat dissipation effect on the thermoelectric semiconductor refrigeration chip, and the heat dissipation fan blows the hot air outwards to improve the heat dissipation effect.

[0014] Preferably, the casing includes an upper cover and a lower cover connected together. A circle of outwardly protruding support platforms is arranged on the outer wall of the lower cover. A fixing plate is connected to the casing, and the fixing plate is connected to the lower cover through a locking buckle. Mounting holes are arranged on the wearable device, and the edges of the mounting holes are clamped between the fixing plate and the support platforms.

[0015] The upper cover and the lower cover are connected together to form a casing with an installation cavity, facilitating the installation of the thermoelectric semiconductor refrigeration chip and the radiator in the installation cavity. The edges of the mounting holes on the wearable device are clamped between the fixing plate and the support platforms, and the fixing plate is connected to the lower cover through a locking buckle, thereby realizing the reliable connection between the temperature control module and the wearable device.

[0016] Preferably, a number of locking buckles are arranged on the outer wall of the lower cover. The fixing plate is sleeved on the lower cover, and the lower cover is tightly connected to the fixing plate through the locking buckles.

[0017] The fixing plate is snap-fitted and connected with the locking buckles on the lower cover, which is convenient for disassembly and assembly and has a reliable connection.

[0018] In another solution, the fixing plate and the upper cover are of an integral structure. A number of locking buckles are arranged on the fixing plate, and a number of locking holes are arranged on the support platform. The locking buckles are snap-fitted and connected with the locking holes.

[0019] The fixed plate and the upper cover are of an integrated structure. The locking buckle provided on the fixed plate is snap-fitted with the lock hole on the support platform, which not only realizes the connection between the fixed plate and the support platform, but also realizes the connection between the upper cover and the lower cover.

[0020] Preferably, a plurality of air outlet holes are provided on the upper cover, and a plurality of air inlet holes are provided on the side wall of the lower cover.

[0021] During operation, the cooling fan sucks the air flow from the air inlet holes and discharges it out from the air outlet holes, which is beneficial to improving the heat dissipation effect.

[0022] Preferably, a concave wire groove is provided on the support platform, and a wire passing hole corresponding to the wire groove is provided on the side wall of the lower cover.

[0023] The arrangement of the wire groove and the wire passing hole facilitates the installation of the wire harness.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The temperature control module of this patent application is installed on the wearable device and is used. It is light in weight and low in price, and the connection between the temperature control module and the wearable device is convenient and reliable; (2) When the thermoelectric semiconductor refrigeration sheet is reversely powered to generate heat, if the temperature is higher than the set threshold, the temperature protection switch will disconnect to cut off the thermoelectric semiconductor refrigeration sheet, preventing scalding; (3) The upper cover and the lower cover are connected together to form a casing with an installation cavity, which facilitates the installation of the thermoelectric semiconductor refrigeration sheet and the radiator in the installation cavity. Description of the Drawings

[0025] Figure 1 It is the structure diagram of Embodiment 1 of the present invention.

[0026] Figure 2 It is a sectional view in one direction of Embodiment 1 of the present invention.

[0027] Figure 3 It is a sectional view in another direction of Embodiment 1 of the present invention.

[0028] Figure 4 It is an exploded view of Embodiment 1 of the present invention.

[0029] Figure 5 It is the structure diagram of Embodiment 2 of the present invention.

[0030] Figure 6 It is a sectional view of Embodiment 2 of the present invention.

[0031] Figure 7 It is an exploded view of the casing of Embodiment 2 of the present invention.

[0032] Figure 8 It is a partial sectional view of Embodiment 3 of the present invention.

[0033] Figure 9 It is the structure diagram of the adjusting ring of Embodiment 3 of the present invention.

[0034] In the figure: 1. Housing, 2. Wearable device, 3. Installation cavity, 4. Upper cover, 5. Lower cover, 6. Support platform, 7. Fixed plate, 8. Locking buckle, 9. Installation hole, 10. Air outlet hole, 11. Air inlet hole, 12. Wire trough, 13. Wire passing hole, 14. Thermoelectric semiconductor refrigeration chip, 15. Radiator, 16. Temperature conduction plate, 17. Flange, 18. Card slot, 19. Positioning insert bar, 20. Temperature protection switch, 21. Heat preservation cotton, 22. Heat dissipation plate, 23. Heat dissipation fan, 24. Heat dissipation fin, 25. Rectangular groove, 26. Chuck, 27. Guide surface, 28. Positioning convex block, 29. Positioning ring, 30. Card joint, 31. Lock hole, 32. Reinforcing rib plate, 33. Adjusting ring, 34. Adjusting convex strip, 35. Support plane, 36. Pushing surface, 37. Extension convex ring, 38. Sliding ring groove, 39. Rotating ring, 40. Slide column, 41. Operating rod. Specific embodiments

[0035] The technical solutions of the present invention will be further specifically described below through specific embodiments in conjunction with the accompanying drawings: Embodiment 1: A temperature control module structure of a wearable device (see Figures 1 to 4 ), including a housing 1, the shape of the housing 1 is designed according to needs, and various shapes such as circular, square, and oval are all acceptable. In this embodiment, the housing 1 has a circular structure. The housing 1 is fixedly connected to the wearable device 2, and an installation cavity 3 is provided inside the housing 1. The housing 1 includes an upper cover 4 and a lower cover 5 connected together. A ring of outwardly protruding support platforms 6 is provided on the outer wall of the lower cover 5. The support platforms 6 and the lower cover 5 are of an integral structure. A fixed plate 7 is connected to the housing 1, and the fixed plate 7 is connected to the lower cover 5 through a locking buckle 8. Installation holes 9 are provided on the wearable device, and the edges of the installation holes 9 are clamped between the fixed plate 7 and the support platforms 6. A plurality of air outlet holes 10 are provided on the upper cover 4, and a plurality of air inlet holes 11 are provided on the side wall of the lower cover 5. A concave wire trough 12 is provided on the support platform 6, and a wire passing hole 13 corresponding to the wire trough 12 is provided on the side wall of the lower cover 5. The provision of the wire trough 12 and the wire passing hole 13 facilitates the installation of the wire harness. A thermoelectric semiconductor refrigeration chip 14 and a radiator 15 are installed in the installation cavity 3, and the thermoelectric semiconductor refrigeration chip 14 is arranged close to the bottom surface of the installation cavity 3.

[0036] The upper cover 4 and the lower cover 5 are connected together to form a housing 1 with an installation cavity 3, which facilitates the installation of the thermoelectric semiconductor refrigeration chip 14 and the radiator 15 in the installation cavity 3. The edges of the installation holes 9 on the wearable device are clamped between the fixed plate 7 and the support platforms 6, and the fixed plate 7 is connected to the lower cover 5 through a locking buckle 8, thereby realizing the reliable connection between the temperature control module and the wearable device.

[0037] A heat conduction plate 16 is installed at the bottom of the housing 1, and the heat conduction plate 16 is close to the thermoelectric cooler. A flanging 17 that turns up is provided at the edge of the heat conduction plate 16, and a clamping groove 18 adapted to the flanging 17 is provided on the lower end surface of the lower cover 5, and the flanging 17 is clamped in the clamping groove 18. A plurality of positioning inserts 19 are circumferentially and spacedly arranged at the edge of the heat conduction plate 16, and the positioning inserts 19 are inserted into the housing 1 to achieve connection and positioning. A jack corresponding to the positioning insert 19 is provided on the bottom surface of the clamping groove 18, and the positioning insert 19 is inserted into the jack. A temperature protection switch 20 is installed in the installation cavity 3, and the temperature sensing side of the temperature protection switch 20 is close to the bottom surface of the installation cavity 3. A heat insulation cotton 21 is installed between the upper end of the temperature protection switch 20 and the radiator 15, and the lower end surface of the temperature protection switch 20 is attached to the heat conduction plate 16. The temperature protection switch 20 is connected in series in the circuit where the thermoelectric cooler 14 is located.

[0038] The heat conduction plate 16 plays an effect of temperature uniformity, enabling the cold or heat on the thermoelectric cooler 14 to be quickly transferred to the wearable device, improving the use effect. The temperature protection switch 20 plays a protective role. When the thermoelectric cooler 14 is reversely powered to generate heat and the temperature is higher than the set threshold, the temperature protection switch 20 disconnects to cut off the circuit of the thermoelectric cooler 14, preventing scalding. After the temperature recovers, the temperature protection switch 20 connects to make the thermoelectric cooler 14 conduct and work.

[0039] The radiator 15 includes a heat dissipation plate 22 and a heat dissipation fan 23. One side of the heat dissipation plate 22 is connected to the thermoelectric cooler 14, and heat dissipation fins 24 are provided on the other side of the heat dissipation plate 22. A plurality of heat dissipation fins 24 are arranged in a rectangular array, and the heat dissipation fan 23 is installed on the heat dissipation fins 24. A rectangular groove 25 is provided at the bottom of the lower cover 5, and the thermoelectric cooler 14 is installed at the position of the rectangular groove 25.

[0040] A plurality of locking buckles 8 are provided on the outer wall of the lower cover 5. In this embodiment, two locking buckles 8 are axially and evenly distributed above the support platform 6. The fixing plate 7 has an annular structure, and the fixing plate 7 is sleeved on the lower cover 5. The lower cover 5 is fixedly connected to the fixing plate 7 through the locking buckles 8. The lower end of the locking buckle 8 is an integral structure with the lower cover 5, and both the left and right sides of the locking buckle 8 are separated from the lower cover 5, so that the locking buckle 8 has elasticity. A clamping head 26 is provided at the upper end of the locking buckle 8, and the clamping head 26 protrudes from the outer wall of the locking buckle 8. An inclined guiding surface 27 is provided at the outer end of the clamping head 26. During the process of sleeving the fixing plate 7 onto the lower cover 5, the inner edge of the fixing plate 7 presses against the guiding surface 27 of the clamping head 26, so that the locking buckle 8 and the fixing plate 7 are clamped together to achieve positioning.

[0041] The edge of the upper cover 4 is provided with a positioning bump 28, and the positioning bump 28 is clamped into the wire passing hole 13. The upper cover 4 is provided with a downwardly extending positioning ring 29, the positioning ring 29 is sleeved on the inner wall of the upper part of the lower cover 5, and the lower end of the upper cover 4 is abutted against the upper end of the lower cover 5. The inner wall of the positioning ring 29 is provided with a clamping joint 30, a clamping seat is arranged in the lower cover 5, and the clamping joint 30 is clamped and connected with the clamping seat to achieve positioning.

[0042] A temperature control module is installed on the wearable device, which can realize the refrigeration and heating of the wearable device 2. A thermoelectric semiconductor refrigeration sheet 14 is installed in the casing 1 of the temperature control module, and refrigeration and heating are realized through the thermoelectric semiconductor refrigeration sheet 14, which can reduce the volume and weight of the entire temperature control module. The casing 1 of the temperature control module is connected to the wearable device, and the connection is convenient and reliable. During operation, the cooling fan 23 sucks air flow from the air inlet hole 11 and discharges it outward from the air outlet hole 10, which is beneficial to improving the heat dissipation effect, thereby improving the refrigeration and heating effects of the thermoelectric semiconductor refrigeration sheet 14. The thermoelectric semiconductor refrigeration sheet 14 type wearable device is more portable, lightweight and more convenient for diversified design compared with the compressor type wearable device, and has the advantage of a magnitude reduction in cost compared with the compressor. The temperature control module of this patent application is installed on the wearable device and is lightweight and low-cost, and the connection between the temperature control module and the wearable device is convenient and reliable.

[0043] Embodiment 2: A temperature control module structure of a wearable device (see Figures 5 to 7 ), including a casing 1, the shape of the casing 1 is designed according to needs, and various shapes such as circular, square, oval, etc. are acceptable. In this embodiment, the casing 1 has a circular structure, and the casing 1 is firmly connected to the wearable device 2. An installation cavity 3 is provided in the casing 1. The casing 1 includes an upper cover 4 and a lower cover 5 connected together. A support platform 6 protruding outward is provided on the outer wall of the lower cover 5. The support platform 6 and the lower cover 5 are of an integral structure. A fixing plate 7 is connected to the casing 1, and the fixing plate 7 is connected to the lower cover 5 through a locking buckle 8. An installation hole 9 is provided on the wearable device, and the edge of the installation hole 9 is clamped between the fixing plate 7 and the support platform 6. A plurality of air outlet holes 10 are provided on the upper cover 4, and a plurality of air inlet holes 11 are provided on the side wall of the lower cover 5. A downwardly concave wire groove 12 is provided on the support platform 6, and a wire passing hole 13 corresponding to the wire groove 12 is provided on the side wall of the lower cover 5. The arrangement of the wire groove 12 and the wire passing hole 13 facilitates the installation of the wire harness.

[0044] The upper cover 4 and the lower cover 5 are connected together to form a casing 1 with an installation cavity 3, which facilitates the installation of the thermoelectric semiconductor refrigeration sheet 14 and the radiator 15 in the installation cavity 3. The edge of the installation hole 9 on the wearable device is clamped between the fixing plate 7 and the support platform 6, and the fixing plate 7 is connected to the lower cover 5 through a locking buckle 8, thereby realizing the reliable connection between the temperature control module and the wearable device.

[0045] The thermoelectric semiconductor refrigeration sheet 14 and the radiator 15 are installed in the installation cavity 3, and the thermoelectric semiconductor refrigeration sheet 14 is arranged close to the bottom surface of the installation cavity 3. The heat conduction plate 16 is installed at the bottom of the casing 1, and the heat conduction plate 16 is close to the semiconductor refrigeration sheet. The edge of the heat conduction plate 16 is provided with an upwardly turned-up flange 17, and a clamping groove 18 adapted to the flange 17 is arranged on the lower end surface of the lower cover 5, and the flange 17 is clamped in the clamping groove 18. A plurality of positioning inserts 19 are circumferentially and spacedly arranged at the edge of the heat conduction plate 16, and the positioning inserts 19 are inserted on the casing 1 to achieve connection and positioning. A jack corresponding to the positioning insert 19 is arranged on the bottom surface of the clamping groove 18, and the positioning insert 19 is inserted into the jack. The temperature protection switch 20 is installed in the installation cavity 3, and the temperature sensing side of the temperature protection switch 20 is arranged close to the bottom surface of the installation cavity 3. A heat insulation cotton 21 is installed between the upper end of the temperature protection switch 20 and the radiator 15, and the lower end surface of the temperature protection switch 20 is attached to the heat conduction plate 16. The temperature protection switch 20 is connected in series in the circuit where the thermoelectric semiconductor refrigeration sheet 14 is located.

[0046] The heat conduction plate 16 plays an effect of temperature equalization, enabling the cold or heat on the thermoelectric semiconductor refrigeration sheet 14 to be quickly transferred to the wearable device, improving the use effect. The temperature protection switch 20 plays a protective role. When the thermoelectric semiconductor refrigeration sheet 14 is reversely powered to generate heat and the temperature is higher than the set threshold, the temperature protection switch 20 disconnects to cut off the thermoelectric semiconductor refrigeration sheet 14, preventing scalding. After the temperature recovers, the temperature protection switch 20 turns on to make the thermoelectric semiconductor refrigeration sheet 14 conduct and work.

[0047] The radiator 15 includes a heat dissipation plate 22 and a heat dissipation fan 23. One side of the heat dissipation plate 22 is connected to the thermoelectric semiconductor refrigeration sheet 14, and the other side of the heat dissipation plate 22 is provided with heat dissipation fins 24. A plurality of heat dissipation fins 24 are arranged in a rectangular array, and the heat dissipation fan 23 is installed on the heat dissipation fins 24. A rectangular groove 25 is arranged at the bottom of the lower cover 5, and the thermoelectric semiconductor refrigeration sheet 14 is installed at the position of the rectangular groove 25.

[0048] The fixing plate 7 is placed at the lower edge of the upper cover 4. The fixing plate 7 has an annular structure and is an integral structure with the upper cover 4. The fixing plate 7 protrudes from the outer wall of the upper cover 4. A plurality of locking buckles 8 are arranged on the fixing plate 7. The locking buckles 8 extend downward from the lower surface of the fixing plate 7. In this embodiment, five locking buckles 8 are circumferentially and evenly arranged. A plurality of lock holes 31 are arranged on the support platform 6, and the lock holes 31 are arranged in one-to-one correspondence with the locking buckles 8. The locking buckles 8 are clamped and connected with the lock holes 31.

[0049] The lower end of the locking buckle 8 is provided with a chuck 26. The chuck 26 protrudes from the outer side wall of the locking buckle 8, and an inclined guiding surface 27 is arranged at the outer end of the chuck 26. During the connection process of the fixing plate 7 and the support platform 6, the chuck 26 of the locking buckle 8 is inserted into the locking hole 31, the guiding surface 27 slides over the edge of the locking hole 31, and then the chuck 26 is stuck on the lower surface of the support platform 6 to realize the connection between the fixing plate 7 and the support platform 6. A plurality of reinforcing rib plates 32 are arranged on the inner wall of the upper cover 4, and the reinforcing rib plates 32 are integrally connected with the top of the upper cover 4 to form an integral structure. The fixing plate 7 and the upper cover 4 are of an integral structure, and the locking buckle 8 arranged on the fixing plate 7 is clamped and connected with the locking hole 31 on the support platform 6, which not only realizes the connection between the fixing plate 7 and the support platform 6, but also realizes the connection between the upper cover 4 and the lower cover 5.

[0050] A temperature control module is installed on the wearable device, which can realize the refrigeration and heating of the wearable device 2. A thermoelectric semiconductor refrigeration chip 14 is installed in the casing 1 of the temperature control module. Refrigeration and heating are realized through the thermoelectric semiconductor refrigeration chip 14, which can reduce the volume and weight of the entire temperature control module. The casing 1 of the temperature control module is connected with the wearable device, and the connection is convenient and reliable. During operation, the cooling fan 23 sucks air flow from the air inlet hole 11 and discharges it outward from the air outlet hole 10, which is beneficial to improving the heat dissipation effect, thereby improving the refrigeration and heating effects of the thermoelectric semiconductor refrigeration chip 14. The thermoelectric semiconductor refrigeration chip 14 type wearable device is more portable, lightweight and more convenient for diversified design compared with the compressor type wearable device, and has the advantage of a magnitude reduction in cost compared with the compressor. The temperature control module of this patent application is installed on the wearable device for use, with light weight and low price, and the connection between the temperature control module and the wearable device is convenient and reliable.

[0051] Embodiment 3: A temperature control module structure of a wearable device (see Figure 8 , Figure 9 ), which includes a casing 1. The shape of the casing 1 is designed according to needs, and various shapes such as circular, square, oval, etc. are all acceptable. In this embodiment, the casing 1 has a circular structure, and the casing 1 is firmly connected with the wearable device 2. An installation cavity 3 is arranged in the casing 1. The casing 1 includes an upper cover 4 and a lower cover 5 connected together. A circle of outwardly protruding support platforms 6 are arranged on the outer wall of the lower cover 5. The support platforms 6 and the lower cover 5 are of an integral structure. A fixing plate 7 is connected to the casing 1, and the fixing plate 7 is connected with the lower cover 5 through a locking buckle 8. An installation hole 9 is arranged on the wearable device, and the edge of the installation hole 9 is clamped between the fixing plate 7 and the support platform 6. A plurality of air outlet holes 10 are arranged on the upper cover 4, and a plurality of air inlet holes 11 are arranged on the side wall of the lower cover 5. A downwardly concave wire groove 12 is arranged on the support platform 6, and a wire passing hole 13 corresponding to the wire groove 12 is arranged on the side wall of the lower cover 5. The arrangement of the wire groove 12 and the wire passing hole 13 facilitates the installation of the wire harness.

[0052] The upper cover 4 and the lower cover 5 are connected together to form the casing 1 with the installation cavity 3, which facilitates the installation of the thermoelectric semiconductor refrigeration sheet 14 and the radiator 15 in the installation cavity 3. The edge of the mounting hole 9 on the wearable device is clamped between the fixing plate 7 and the support platform 6, and the fixing plate 7 is connected to the lower cover 5 through the locking buckle 8, thereby realizing the reliable connection between the temperature control module and the wearable device.

[0053] The thermoelectric semiconductor refrigeration sheet 14 and the radiator 15 are installed in the installation cavity 3, and the thermoelectric semiconductor refrigeration sheet 14 is arranged close to the bottom surface of the installation cavity 3. The temperature conduction plate 16 is installed at the bottom of the casing 1, and the temperature conduction plate 16 is close to the semiconductor refrigeration sheet. The edge of the temperature conduction plate 16 is provided with an upturned flange 17, and a clamping groove 18 adapted to the flange 17 is arranged on the lower end surface of the lower cover 5, and the flange 17 is clamped in the clamping groove 18. A plurality of positioning insertion strips 19 are arranged at intervals in the circumferential direction on the edge of the temperature conduction plate 16, and the positioning insertion strips 19 are inserted on the casing 1 for connection and positioning. Corresponding insertion holes are arranged on the bottom surface of the clamping groove 18, and the positioning insertion strips 19 are inserted into the insertion holes. The temperature protection switch 20 is installed in the installation cavity 3, and the temperature sensing side of the temperature protection switch 20 is arranged close to the bottom surface of the installation cavity 3. A heat insulation cotton 21 is installed between the upper end of the temperature protection switch 20 and the radiator 15, and the lower end surface of the temperature protection switch 20 is attached to the temperature conduction plate 16. The temperature protection switch 20 is connected in series in the circuit where the thermoelectric semiconductor refrigeration sheet 14 is located.

[0054] The temperature conduction plate 16 plays an effect of temperature equalization, enabling the cold or heat on the thermoelectric semiconductor refrigeration sheet 14 to be quickly transferred to the wearable device, improving the use effect. The temperature protection switch 20 plays a protective role. When the thermoelectric semiconductor refrigeration sheet 14 is reversely powered to generate heat and the temperature is higher than the set threshold, the temperature protection switch 20 disconnects to cut off the circuit of the thermoelectric semiconductor refrigeration sheet 14, preventing the occurrence of scalding. After the temperature recovers, the temperature protection switch 20 is turned on to make the thermoelectric semiconductor refrigeration sheet 14 conduct and work.

[0055] The radiator 15 includes a heat dissipation plate 22 and a heat dissipation fan 23. One side of the heat dissipation plate 22 is connected to the thermoelectric semiconductor refrigeration sheet 14, the other side of the heat dissipation plate 22 is provided with heat dissipation fins 24, and a plurality of heat dissipation fins 24 are arranged in a rectangular array. The heat dissipation fan 23 is installed on the heat dissipation fins 24. A rectangular groove 25 is arranged at the bottom of the lower cover 5, and the thermoelectric semiconductor refrigeration sheet 14 is installed at the position of the rectangular groove 25.

[0056] A number of locking buckles 8 are provided on the outer wall of the lower cover 5. In this embodiment, two locking buckles 8 are evenly distributed axially above the support platform 6. The fixing plate 7 has an annular structure. The fixing plate 7 is sleeved on the lower cover 5, and the lower cover 5 is fixedly connected to the fixing plate 7 through the locking buckles 8. The lower end of the locking buckle 8 is an integral structure with the lower cover 5, and both the left and right sides of the locking buckle 8 are separated from the lower cover 5, so that the locking buckle 8 has elasticity. The upper end of the locking buckle 8 is provided with a clamping head 26, the clamping head 26 protrudes from the outer wall of the locking buckle 8, and an inclined guiding surface 27 is provided at the outer end of the clamping head 26. During the process of sleeving the fixing plate 7 onto the lower cover 5, the inner edge of the fixing plate 7 presses onto the guiding surface 27 of the clamping head 26, so that the locking buckle 8 and the fixing plate 7 are clamped together to achieve positioning.

[0057] A positioning convex block 28 is provided at the edge of the upper cover 4, and the positioning convex block 28 is clamped into the wire passing hole 13. The upper cover 4 is provided with a downward extending positioning ring 29, the positioning ring 29 is sleeved on the upper inner wall of the lower cover 5, and the lower end of the upper cover 4 is abutted against the upper end of the lower cover 5. A clamping joint 30 is provided on the inner wall of the positioning ring 29, a clamping seat is arranged inside the lower cover 5, and the clamping joint 30 is clamped and connected with the clamping seat to achieve positioning.

[0058] An adjusting ring 33 is rotatably installed on the fixing plate 7. Adjusting convex strips 34 corresponding to the locking buckles 8 are provided on the adjusting ring 33. A number of supporting planes 35 arranged from low to high in sequence along the circumferential direction are provided on the adjusting convex strips 34. An inclined pushing surface 36 is arranged between adjacent supporting planes 35. The clamping head 26 on the locking buckle 8 is supported on the adjusting ring 33. When the temperature control module is connected to wearable devices with different thicknesses, the adjusting ring 33 is rotated to make the supporting planes 35 and the pushing surface 36 slide over the clamping head 26 until the clamping head 26 is supported on the supporting plane 35 at a suitable position, ensuring that the wearable device is clamped between the fixing plate 7 and the support platform 6.

[0059] The adjusting ring 33 is installed at the inner edge position of the fixing plate 7. An extending convex ring 37 and a sliding ring groove 38 are provided on the inner wall of the fixing plate 7. A rotating ring 39 extending downward is provided on the adjusting ring 33. A number of sliding columns 40 are connected to the rotating ring 39, and the ends of the sliding columns 40 are movably inserted into the sliding ring groove 38. The outer wall of the rotating ring 39 is adapted to the inner wall of the fixing plate 7, and the rotating ring 39 is supported on the extending convex ring 37. Operating rods 41 are connected to both the fixing plate 7 and the adjusting ring 33, and the operating rods 41 facilitate the relative rotation between the fixing plate 7 and the adjusting ring 33.

[0060] A temperature control module is installed on the wearable device, which can achieve cooling and heating of the wearable device 2. A thermoelectric semiconductor refrigeration chip 14 is installed in the housing 1 of the temperature control module. Cooling and heating are achieved through the thermoelectric semiconductor refrigeration chip 14, which can reduce the volume and weight of the entire temperature control module. The housing 1 of the temperature control module is connected to the wearable device, and the connection is convenient and reliable. During operation, the cooling fan 23 sucks air flow from the air inlet hole 11 and discharges it out through the air outlet hole 10, which is beneficial to improving the heat dissipation effect, thereby improving the cooling and heating effects of the thermoelectric semiconductor refrigeration chip 14. Compared with the compressor-type wearable device, the thermoelectric semiconductor refrigeration chip 14-type wearable device is more portable, lightweight and more convenient for diversified design, and has the advantage of an order-of-magnitude reduction in cost compared with the compressor. The temperature control module of this patent application is installed on the wearable device and is lightweight and low-cost. The connection between the temperature control module and the wearable device is convenient and reliable.

[0061] The above-described embodiments are only preferred solutions of the present invention, and do not impose any form of limitation on the present invention. There are other variations and modifications without exceeding the technical solutions described in the claims.

Claims

1. The temperature control module structure of a wearable device, characterized in that, It includes a housing, which is fixedly connected to the wearable device. An installation cavity is provided inside the housing, and a thermoelectric semiconductor refrigeration chip and a radiator are installed in the installation cavity. The thermoelectric semiconductor refrigeration chip is arranged close to the bottom surface of the installation cavity.

2. The temperature control module structure of a wearable device according to claim 1, characterized in that, A temperature protection switch is installed in the installation cavity, and the temperature sensing side of the temperature protection switch is arranged close to the bottom surface of the installation cavity.

3. The temperature control module structure of a wearable device according to claim 1, characterized in that A heat conduction plate is installed at the bottom of the housing, and the heat conduction plate is close to the semiconductor refrigeration chip.

4. The temperature control module structure of a wearable device according to claim 3, characterized in that, A number of positioning inserts are arranged at intervals in the circumferential direction on the edge of the heat conduction plate, and the positioning inserts are inserted on the housing to achieve connection and positioning.

5. The temperature control module structure of a wearable device according to claim 1, characterized in that, The radiator includes a heat dissipation plate and a cooling fan. One side of the heat dissipation plate is connected to the thermoelectric semiconductor refrigeration chip, heat dissipation fins are arranged on the other side of the heat dissipation plate, and the cooling fan is installed on the heat dissipation fins.

6. The temperature control module structure of a wearable device according to any one of claims 1 to 5, characterized in that, The housing includes an upper cover and a lower cover connected together. A circle of outwardly protruding support platforms is arranged on the outer wall of the lower cover. A fixing plate is connected to the housing, and the fixing plate is connected to the lower cover through a locking buckle. An installation hole is provided on the wearable device, and the edge of the installation hole is clamped between the fixing plate and the support platform.

7. The temperature control module structure of a wearable device according to claim 6, characterized in that, A number of locking buckles are arranged on the outer wall of the lower cover. The fixing plate is sleeved on the lower cover, and the lower cover is fixedly connected to the fixing plate through the locking buckle.

8. The temperature control module structure of a wearable device according to claim 6, characterized in that, The fixing plate and the upper cover are of an integral structure. A number of locking buckles are arranged on the fixing plate, and a number of lock holes are arranged on the support platform. The locking buckle is connected with the lock hole in a snap-fit manner.

9. The temperature control module structure of a wearable device according to claim 6, characterized in that, A number of air outlet holes are arranged on the upper cover, and a number of air inlet holes are arranged on the side wall of the lower cover.

10. The temperature control module structure of a wearable device according to claim 6, characterized in that, A downward concave wire groove is arranged on the support platform, and a wire passing hole corresponding to the wire groove is arranged on the side wall of the lower cover.

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