Electric power module and data center

Abstract

The invention relates to an electric power module and a data center, the electric power module comprises an equipment layer, a transmission layer and a thermal management layer, the equipment layer is provided with a plurality of electric power equipment, transmission lines among the plurality of electric power equipment are arranged on the transmission layer, and the thermal management layer is provided with a thermal management device. The thermal management device is configured to perform thermal management on at least one of the plurality of power devices by adopting a first thermal management mode based on the first temperature grade; performing thermal management on at least one of the plurality of power devices by adopting a second thermal management mode based on the second temperature grade; and performing thermal management on at least one of the plurality of power devices by adopting a third thermal management mode based on the third temperature grade, wherein the temperature value of the first temperature grade is greater than the temperature value of the second temperature grade, and the temperature value of the second temperature grade is greater than the temperature value of the third temperature grade. The technical problems of low energy conversion rate and structural imbalance of waste heat utilization in the prior art can be reduced.

Description

Technical Field

[0001] This application relates to the technical field of waste heat recovery in data centers, and particularly to a power module and a data center. Background Art

[0002] With the intensification of the global energy crisis and the improvement of environmental protection requirements, as a high-energy-consuming field, the information technology and Internet service industries have made waste heat recovery technology an important breakthrough point for improving energy efficiency.

[0003] Existing data centers generally adopt an integrated thermal management strategy to recover waste heat through heat exchangers or the thermoelectric (TE) effect, that is, using waste heat for power generation or refrigeration. However, in practice, due to the differences in each power device, there are problems such as low energy conversion efficiency and poor system compatibility. Another approach is to adopt a homogenization treatment mode. For example, using a thermoelectric generator (TEG) to directly convert all recovered thermal energy into electrical energy through the Seebeck effect. However, this "one-size-fits-all" thermal management method may result in many effective waste heats not being fully utilized. Summary of the Invention

[0004] In view of the above, it is necessary to provide a power module and a data center that can reduce the technical problems of low energy conversion efficiency and structural imbalance in waste heat utilization in the prior art.

[0005] This application first provides a power module, including an equipment layer, a transmission layer, and a thermal management layer. The equipment layer is provided with multiple power devices, the transmission lines between the multiple power devices are arranged in the transmission layer, and the thermal management layer is provided with a thermal management device. The thermal management device is configured to: perform thermal management on at least one of the multiple power devices by using a first thermal management method based on a first temperature level; perform thermal management on at least one of the multiple power devices by using a second thermal management method based on a second temperature level; and perform thermal management on at least one of the multiple power devices by using a third thermal management method based on a third temperature level; wherein, the temperature value of the first temperature level is greater than the temperature value of the second temperature level, and the temperature value of the second temperature level is greater than the temperature value of the third temperature level.

[0006] In the power module of the present application, through the inter-layer decoupling design of the device layer, the transmission layer, and the thermal management layer, the thermal flow regulation and power transmission can operate independently. Among them, the thermal management layer divides the power devices into the first (such as high temperature), second (such as medium temperature), and third (such as low temperature) temperature levels, and respectively matches the corresponding thermal management methods: for example, the first stable level preferentially extracts high-quality thermal energy through the active thermal recovery technology, the second temperature level adopts the cascade conversion or temporary storage mechanism to achieve energy slow release, and the third temperature level relies on the directional heat dissipation path to guide the harmless release of the residual thermal energy. Thus, the environmental adaptability limitations of the traditional integrated or homogenized treatment mode can be broken through, the loss of high-calorie waste heat can be reduced through the temperature zone threshold sorting, and multiple-level optimization effects can be achieved, that is, the overall energy conversion efficiency can be strengthened by improving the hierarchical utilization rate of thermal resources, thereby systematically reducing the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in the prior art.

[0007] In some embodiments, the first thermal management method is to collect the thermal energy of at least one power device and use the thermal energy for power generation and / or refrigeration.

[0008] In some embodiments, the second thermal management method is to collect the thermal energy of at least one power device and use the thermal energy for refrigeration or heating.

[0009] In some embodiments, the third thermal management method is to collect the thermal energy of at least one power device and use the thermal energy for heating.

[0010] In some embodiments, the power devices include medium-voltage transformers, transformers, and energy storage devices. The temperatures of the medium-voltage transformers, transformers, and energy storage devices during operation are in the first temperature level. The thermal management device is configured to collect the thermal energy generated by at least one of the medium-voltage transformers, transformers, and energy storage devices during operation and use the thermal energy for power generation and / or refrigeration.

[0011] In some embodiments, the thermal management device includes a first heat conduction device, a power generation device, a refrigeration device, and a control device. The first heat conduction device is connected to the medium-voltage transformer, the transformer, and the energy storage device to collect the thermal energy generated by the medium-voltage transformer, the transformer, and the energy storage device during operation. The power generation device is connected to the first heat conduction device and the control device. The refrigeration device is connected to the first heat conduction device and the control device. The control device is used to control the power generation device to use the thermal energy for power generation and / or control the refrigeration device to use the thermal energy for refrigeration.

[0012] In some embodiments, the power device includes a low-voltage cabinet and a reactive power compensation device. The temperature during the operation of the low-voltage cabinet and the reactive power compensation device is at the second temperature level. The thermal management device is configured to: collect the thermal energy generated during the operation of the low-voltage cabinet and the reactive power compensation device, and use the thermal energy for refrigeration or heating; the thermal management device includes a second heat conduction device, a refrigeration device, a heating device, and a control device. The second heat conduction device is connected to the low-voltage cabinet and the reactive power compensation device to collect the thermal energy generated during their operation. The refrigeration device is connected to the second heat conduction device and the control device, and the heating device is connected to the second heat conduction device and the control device. The control device is used to control the refrigeration device to use the thermal energy for refrigeration or control the heating device to use the thermal energy for heating.

[0013] In some embodiments, the power device includes a ventilation device. The temperature during the operation of the ventilation device is at the third temperature level. The thermal management device is configured to: collect the thermal energy of the ventilation device and use the thermal energy for heating; the thermal management device includes a heat storage device, a heating device, and a control device. The heat storage device is connected to the ventilation device to store the thermal energy of the ventilation device. The heating device is connected to the heat storage device and the control device. The control device is used to control the heating device to use the thermal energy stored in the heat storage device for heating.

[0014] In some embodiments, a cooling device is provided in the transmission layer. The cooling device is connected to the refrigeration device and is used to obtain low-temperature thermal energy from the refrigeration device and use the low-temperature thermal energy to cool the transmission line.

[0015] This application also provides a data center, including data processing equipment, data storage equipment, network equipment, and a power module according to any one of the above embodiments of this application. The power module is used to provide power for the operation of the data processing equipment, data storage equipment, and network equipment.

[0016] In the data center of this application, the data processing equipment, data storage equipment, and network equipment can form the basic functional modules of the data center to provide data services. The power module can provide power for the operation of the data processing equipment, data storage equipment, and network equipment. And through the power module of this application, the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in the prior art can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the power module and its thermal management scenario according to an embodiment of this application.

[0018] Figure 2 It is a schematic diagram of the structure of the thermal management device and its thermal management in the first thermal management mode according to an embodiment of this application.

[0019] Figure 3It is a schematic diagram of the structure of the thermal management device according to the embodiment of the present application and its thermal management in the second thermal management mode.

[0020] Figure 4 It is a schematic diagram of the structure of the thermal management device according to the embodiment of the present application and its thermal management in the third thermal management mode.

[0021] Figure 5 It is a schematic diagram of the structure of the power module according to another embodiment of the present application and its thermal management scenario.

[0022] Figure 6 It is a block diagram of the structure of the data center according to the embodiment of the present application.

[0023] Description of main element symbols 1. Data center; 100. Power module; 101. Data processing device; 102. Data storage device; 103. Network device; 11. Equipment layer; 12. Transmission layer; 13. Thermal management layer; 110. Transmission line; 111. Power equipment; 1111. Medium voltage transformer; 1112. Transformer; 1113. Energy storage device; 1114. Low voltage cabinet; 1115. Reactive power compensation device; 1116. Ventilation device; 121. Cooling device; 131. Thermal management device; 1311. First heat conduction device; 1312. Power generation device; 1313. Refrigeration device; 1314. Control device; 1315. Second heat conduction device; 1316. Heating device; 1317. Heat storage device.

[0024] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific embodiments

[0025] In the description of the embodiments of the present application, words such as "exemplary", "or", "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary", "or", "for example" is intended to present relevant concepts in a specific manner.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. It should be understood that unless otherwise specified in this application, " / " means "or". For example, A / B may mean A or B. The "and / or" in this application is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may mean: A exists alone, A and B exist simultaneously, and B exists alone, these three situations. "At least one" means one or more. "Multiple" means two or more than two. For example, at least one of a, b, or c may mean: a, b, c, a and b, a and c, b and c, a, b, and c, these seven situations.

[0027] In addition, it should be noted that the terms "first" and "second" in the description, claims, and drawings of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. The methods disclosed in the embodiments of this application or the methods shown in the flowcharts include one or more steps for implementing the methods. Without departing from the scope of the claims, the execution order of multiple steps can be interchanged with each other, and some steps can also be deleted.

[0028] With the intensification of the global energy crisis and the improvement of environmental protection demands, the information technology and Internet service industries, as high-energy-consuming fields, waste heat recovery technology has become an important breakthrough for improving energy efficiency. The construction of an intelligent waste heat management system has become the core topic for the information technology industry to achieve green transformation. In current data center thermal management technologies, the integrated strategy (i.e., recovering waste heat through heat exchangers or thermoelectric (TE) effects and using the waste heat for power generation or refrigeration) can achieve multi-energy flow coordination, but it is difficult to cope with the differential characteristics of device-level heterogeneous heat sources, and there are problems such as low energy conversion efficiency and poor system adaptability; while the homogenization processing mode centered on TEG devices (i.e., using thermoelectric generators (TEGs) to directly convert all recovered heat energy into electrical energy through the Seebeck effect) simplifies the system architecture, but it shows inherent limitations in the fine-grained heat resource matching level. Therefore, this "one-size-fits-all" thermal management method may lead to many effective waste heats not being fully utilized.

[0029] Specifically, due to the structural characteristics and workload differences of devices such as internal servers, UPS power supplies, and transformers in the data center, the heat dissipation temperature distribution shows obvious gradient characteristics. The unified design standard (i.e., integration or homogenization) adopted by traditional TEG modules is difficult to adapt to multi-level heat flow fields, such as the low-temperature region of 0-50°C, the medium-temperature region of 50-85°C, and the high-temperature region above 85°C, resulting in the attenuation of the thermal energy conversion efficiency at medium and low temperature levels. A large number of thermoelectric potential differences fail to be fully converted into effective energy. Especially in high-density computing clusters, the transient volatility and spatial heterogeneity of the chip heat dissipation path further amplify the energy loss. These mainstream solutions generally have a polarization tendency: either over-pursuing the unified and intensive configuration of thermal equipment, resulting in overloading of the thermoelectric conversion load in local high-heat flux density regions; or forcibly adopting a standardized cooling scheme, causing the active abandonment of recoverable thermal energy in the medium and low temperature regions.

[0030] To this end, the embodiments of the present application provide a power module and a data center, which can reduce the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in the prior art. Some embodiments will be described below with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0031] Figure 1 It is a schematic diagram of the structure of the power module 100 and its thermal management scenario in the embodiments of the present application.

[0032] As Figure 1 shown, the embodiments of the present application first provide a power module 100, which can be used to provide power for power-consuming units or workshops such as the data center 1. The power module 100 may include an equipment layer 11, a transmission layer 12, and a thermal management layer 13. Among them, a plurality of power devices 111 may be provided in the equipment layer 11, the transmission lines 110 between the plurality of power devices 111 may be provided in the transmission layer 12, and a thermal management device 131 may be provided in the thermal management layer 13. In this case, by dynamically dividing the temperature range and adapting to differential management (such as high-temperature power generation and refrigeration, medium-temperature refrigeration and heat supply, low-temperature storage and heat supply), the waste heat waste caused by integration or homogenization can be reduced, and a systematic hierarchical thermal cycle system can be formed, improving the energy conversion rate and the balance of the waste heat utilization structure.

[0033] Figure 2 It is a schematic diagram of the structure of the thermal management device 131 and its thermal management in the first thermal management mode in the embodiments of the present application. Figure 3 It is a schematic diagram of the structure of the thermal management device 131 and its thermal management in the second thermal management mode in the embodiments of the present application. Figure 4 It is a schematic diagram of the structure of the thermal management device 131 and its thermal management in the third thermal management mode in the embodiments of the present application.

[0034] In some embodiments, asFigures 2 to 4 As shown, the power equipment 111 may include a medium-voltage transformer 1111, a transformer 1112, an energy storage device 1113, a low-voltage switchgear cabinet 1114, a reactive power compensation device 1115, and a ventilation device 1116. Among them, the medium-voltage transformer 1111, i.e., the medium-voltage transformer 1112, can be used to convert electrical energy between medium-voltage power grids of different voltage levels to achieve efficient, safe long-distance power transmission and reasonable power distribution in the data center 1; the transformer 1112 is an electrical device based on the principle of electromagnetic induction, which is used to efficiently transmit, reasonably distribute, and safely use the electrical energy of the data center 1 by stepping up and down the AC voltage, thereby reducing power transmission losses and adapting to different power consumption requirements; the energy storage device 1113 (such as a UPS, i.e., an uninterruptible power supply) can be used to store electrical energy, and its function is to provide emergency power when the main power supply of the data center 1 is interrupted, ensure the continuous operation of the equipment, and buffer and regulate voltage fluctuations to maintain power supply stability and safety; the low-voltage switchgear cabinet 1114 (i.e., the low-voltage switchgear) is the end distribution equipment of the data center 1, which can achieve the distribution, control, and circuit protection of low-voltage electrical energy by integrating circuit breakers, protection devices, etc., ensure the safe and stable power supply of the equipment, and support flexible expansion of the load and real-time monitoring of power; the reactive power compensation device 1115 is an electrical device used to optimize the power factor of the power grid in the data center 1, which can dynamically compensate reactive power by shunting capacitors or reactors, reduce line losses, improve the utilization efficiency of electrical energy, and assist in stabilizing voltage to ensure power supply quality; the ventilation device 1116 (such as an exhaust and air-conditioning return air device) is an important component of the environmental control system of the data center 1, which can achieve heat dissipation and temperature reduction, maintain constant temperature and humidity, and optimize the isolation efficiency of the cold and hot channels by forcing air circulation and precisely regulating the air flow direction, thereby ensuring the reliable operation of other power equipment 111 in the data center 1 and the efficient utilization of energy.

[0035] In an embodiment of the present application, the thermal management device 131 may be configured to: perform thermal management on at least one of the plurality of power equipment 111 by using a first thermal management method based on a first temperature level; perform thermal management on at least one of the plurality of power equipment 111 by using a second thermal management method based on a second temperature level; and perform thermal management on at least one of the plurality of power equipment 111 by using a third thermal management method based on a third temperature level.

[0036] Among them, the temperature value of the first temperature level can be greater than that of the second temperature level, and the temperature value of the second temperature level can be greater than that of the third temperature level. For example, the first temperature level can be from 85°C to 105°C, the second temperature level can be from 50°C to 85°C, and the third temperature level can be below 50°C. Or, the first temperature level can be 100°C, the second temperature level can be from 65°C to 100°C, and the third temperature level can be below 65°C, or other division relationships. It can be understood that the first temperature level, the second temperature level, and the third temperature level can be dynamically divided based on the type, quantity, and operating energy consumption of the power equipment 111 in the data center 1.

[0037] In some embodiments, the first heat management method can be to collect the thermal energy of at least one power equipment 111 and use the thermal energy for power generation and / or refrigeration. The second heat management method is to collect the thermal energy of at least one power equipment 111 and use the thermal energy for refrigeration or heating. The third heat management method is to collect the thermal energy of at least one power equipment 111 and use the thermal energy for heating. In this case, at the first temperature level, the waste heat is simultaneously used for power generation and refrigeration, and the composite utilization rate of high-calorie waste heat is improved through thermoelectric collaboration, thereby reducing the energy loss problem of single TEG power generation. At the second temperature level, a parallel selection of refrigeration / heating is adopted, and the end application scenario is switched according to the dynamic load demand, which can increase the system flexibility compared with the traditional fixed mode and realize the on-demand distribution of thermal energy. At the third temperature level, through a hierarchical and step-down use strategy, the waste heat that is difficult to utilize traditionally (such as low-temperature waste heat) is recovered in gradients through the heat storage device 1317 (described later), thereby filling the utilization gap of the heat source in the traditional technology.

[0038] In the embodiments of the present application, as described above, the power equipment 111 can include a medium-voltage transformer 1111, a transformer 1112, and an energy storage device 1113. The temperature during the operation of the medium-voltage transformer 1111, the transformer 1112, and the energy storage device 1113 can be at the first temperature level. At this time, the heat management device 131 can be configured to: collect the thermal energy generated by at least one of the medium-voltage transformer 1111, the transformer 1112, and the energy storage device 1113 during operation, and use the thermal energy for power generation and / or refrigeration.

[0039] In some embodiments, as Figure 2As shown, the thermal management device 131 may include a first heat conduction device 1311, a power generation device 1312, a refrigeration device 1313, and a control device 1314. Among them, the first heat conduction device 1311 may be connected to the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113 to collect the heat energy generated during the operation of the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113. The power generation device 1312 may be connected to the first heat conduction device 1311 and the control device 1314. The refrigeration device 1313 may be connected to the first heat conduction device 1311 and the control device 1314. The control device 1314 may be used to control the power generation device 1312 to use the heat energy for power generation and / or control the refrigeration device 1313 to use the heat energy for refrigeration. In this case, for devices such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113 that may have a relatively high temperature (such as 85°C to 105°C, or above 100°C) during operation, through the multi-module linkage architecture of heat conduction to power generation / refrigeration to control, a double closed-loop of energy flow and control flow is formed, thereby improving the directional conversion efficiency and dynamic distribution flexibility of high-temperature energy.

[0040] In some embodiments, the first heat conduction device 1311 may include at least one of a heat pipe type heat conduction member, a heat collection cover, and an ORC evaporator. Among them, the heat pipe type heat conduction member is composed of high-temperature radiation fins of Hastelloy and a vacuum heat pipe, which can be directly connected (such as a fitting connection) to power equipment 111 such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113, and can be used to conduct the heat energy generated during the operation of power equipment 111 such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113. The heat collection cover may be a fan-shaped deflector, which can be adapted to the irregular surface of the power equipment 111 (such as the oil tank of the transformer 1112) and connected to power equipment 111 such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113, and can be used to collect the heat energy generated during the operation of power equipment 111 such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113. The ORC evaporator may be an embedded ORC (Organic Rankine Cycle) evaporator, which can be connected to power equipment 111 such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113, and can be used to transfer the heat energy generated during the operation of power equipment 111 such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113 to the organic working fluid and evaporate this heat energy into high-pressure steam.

[0041] In some other embodiments, the heat pipe type heat conducting member, the heat collecting cover, and the ORC evaporator may also be connected to each other. For example, the heat pipe type heat conducting member is directly connected (such as by fitting connection) to power equipment 111 such as the medium voltage transformer 1111, the transformer 1112, and the energy storage device 1113. The heat collecting cover is connected to the heat pipe type heat conducting member, and the ORC evaporator is further connected to the heat collecting cover.

[0042] In some embodiments, the power generation device 1312 may include an ORC power generation unit. The ORC power generation unit may be connected to at least one of the heat pipe type heat conducting member, the heat collecting cover, and the ORC evaporator, and the ORC power generation unit may generate electricity using the ORC expansion power generation principle. Additionally, the ORC power generation unit may also be connected to power equipment 111 such as the transformer 1112 or the mains power system, thereby delivering the generated electricity to the data center 1 itself or for use in the mains power. Additionally, the ORC power generation unit may be connected to the heat pipe type heat conducting member, the heat collecting cover, and the ORC evaporator through quick-release flanges, thereby reducing pipeline pressure loss and improving heat conduction efficiency.

[0043] In some embodiments, the refrigeration device 1313 may include a lithium bromide refrigerator. The lithium bromide refrigerator may be connected to at least one of the heat pipe type heat conducting member or the heat collecting cover, and the lithium bromide refrigerator may use the thermal energy transferred by the heat pipe type heat conducting member or the heat collecting cover for refrigeration. The low-temperature thermal energy generated by refrigeration may be used for the data center 1 itself for cooling.

[0044] In some embodiments, the control device 1314 may include at least one control terminal such as a computer terminal or the cloud. The control device 1314 may be connected to the first heat conducting device 1311, the power generation device 1312, and the refrigeration device 1313 to control the power generation device 1312 to use thermal energy for power generation and / or control the refrigeration device 1313 to use thermal energy for refrigeration based on the first temperature level using the first heat management method.

[0045] In the embodiments of the present application, as described above, the power equipment 111 may further include a low-voltage cabinet 1114 and a reactive power compensation device 1115. The temperature during the operation of the low-voltage cabinet 1114 and the reactive power compensation device 1115 may be at a second temperature level. The heat management device 131 is configured to: collect the thermal energy generated by the low-voltage cabinet 1114 and the reactive power compensation device 1115 during operation and use the thermal energy for refrigeration or heating.

[0046] In some embodiments, such as Figure 3As shown, the thermal management device 131 may include a second heat conduction device 1315, a refrigeration device 1313, a heat supply device 1316, and a control device 1314. The second heat conduction device 1315 may be connected to the low-voltage cabinet 1114 and the reactive power compensation device 1115 to collect the heat energy generated during the operation of the low-voltage cabinet 1114 and the reactive power compensation device 1115. The refrigeration device 1313 may be connected to the second heat conduction device 1315 and the control device 1314. The heat supply device 1316 may be connected to the second heat conduction device 1315 and the control device 1314. The control device 1314 may be used to control the refrigeration device 1313 to use the heat energy for refrigeration or control the heat supply device 1316 to use the heat energy for heat supply. In this case, for equipment such as the low-voltage cabinet 1114 and the reactive power compensation device 1115 with relatively medium operating temperatures (such as 50°C to 85°C, or 65°C to 100°C), through a dual selection mechanism, the refrigeration device 1313 and the heat supply device 1316 are deployed in parallel, and through a switchable path design (such as using the waste heat for heat supply when approaching the low-temperature section and for refrigeration when approaching the high-temperature section), the energy reuse requirements can thus be met.

[0047] In some embodiments, the second heat conduction device 1315 may include at least one of a plate heat exchanger or a distributed waste heat boiler. The plate heat exchanger may be a titanium alloy corrugated plate, which may be connected (such as by fitting connection) to the side of power equipment 111 such as the low-voltage cabinet 1114 or the reactive power compensation device 1115, and the plate heat exchanger may be connected to the refrigeration device 1313. The distributed waste heat boiler may be connected to power equipment 111 such as the low-voltage cabinet 1114 or the reactive power compensation device 1115, and the heat of the power equipment 111 such as the low-voltage cabinet 1114 or the reactive power compensation device 1115 is absorbed by driving an ethylene glycol solution through a micro circulation pump inside it.

[0048] The refrigeration device 1313 may be the above-mentioned refrigeration device 1313, whose functional principle is the same as that of the above-mentioned refrigeration device 1313, and it may be connected to the plate heat exchanger or the distributed waste heat boiler to absorb the heat of the plate heat exchanger or the distributed waste heat boiler and refrigerate.

[0049] In some embodiments, the heat supply device 1316 may include a heat pump, which may be connected to at least one of the plate heat exchanger or the distributed waste heat boiler, and may store and utilize the heat absorbed by the plate heat exchanger or the distributed waste heat boiler. At the same time, it may be connected to the urban heat supply system to supply district heating (such as heating or heating water) at night.

[0050] The control device 1314 may be the above-mentioned control device 1314, and the control device 1314 may be connected to the refrigeration device 1313 and the heat supply device 1316, and is used to control the refrigeration device 1313 to use the heat energy for refrigeration or control the heat supply device 1316 to use the heat energy for heat supply.

[0051] In some embodiments, the control device 1314 may be connected to the refrigeration device 1313 and the heating device 1316 through an intelligent interlocking valve, whereby the flow direction of the heat medium (i.e., refrigeration or heating) can be switched dynamically according to the waste heat temperature (such as whether it is close to the first temperature grade or the third temperature grade).

[0052] In the embodiments of the present application, the power equipment 111 may further include a ventilation device 1116. The temperature during the operation of the ventilation device 1116 may be at the third temperature grade. The thermal management device 131 may be configured to: collect the thermal energy of the ventilation device 1116 and use the thermal energy for heating.

[0053] In some embodiments, such as Figure 4 As shown, the thermal management device 131 may include a heat storage device 1317, a heating device 1316, and a control device 1314. The heat storage device 1317 may be connected to the ventilation device 1116 to store the thermal energy of the ventilation device 1116. The heating device 1316 may be connected to the heat storage device 1317 and the control device 1314. The control device 1314 may be used to control the heating device 1316 to use the thermal energy stored in the heat storage device 1317 for heating. In this case, for devices such as the ventilation device 1116 that may have a relatively low temperature during operation (such as below 50 °C, or below 65 °C), a low-temperature waste heat buffer pool is first constructed using the heat storage device 1317, thereby reducing the temporal and spatial limitations of traditional waste heat recovery through an intermediate energy storage link, enabling intermittent low-grade thermal energy to be delayed for utilization, and improving the fault tolerance and utilization efficiency of the waste heat recovery system.

[0054] In some embodiments, the ventilation device 1116 may include at least one of an exhaust device, a supply air device, or a return air device.

[0055] In some embodiments, the heat storage device 1317 may include a heat pump-driven phase change heat storage tank. The phase change heat storage tank may be connected to the exhaust device, the supply air device, or the return air device (such as connected to the air ducts of the exhaust device, the supply air device, or the return air device through a heat pipe array), and a heat storage ceramic ball bed (heat storage density ≥ 200 kJ / kg) is used to absorb and store the thermal energy of the exhaust device, the supply air device, or the return air device.

[0056] The heating device 1316 may be the above-mentioned heating device 1316, and its functional principle is the same as that of the above-mentioned refrigeration device 1313, and it may be connected to the phase change heat storage tank to absorb the phase change heat storage tank and heat it up for district heating.

[0057] The control device 1314 may be the above-mentioned control device 1314, and the control device 1314 may be connected to the heating device 1316 for controlling the heating device 1316 to use the thermal energy stored in the heat storage device 1317 for heating.

[0058] Figure 5 It is a schematic diagram of the structure of the power module 100 and its thermal management scenario according to another embodiment of the present application.

[0059] In some embodiments, as Figure 5 shown, the transmission layer 12 may be provided with a cooling device 121, and the cooling device 121 is connected to the refrigeration device 1313. The cooling device 121 is used to obtain low-temperature heat energy from the refrigeration device 1313 and use the low-temperature heat energy to cool the transmission line 110 (such as a transmission bus or a copper bar). In this case, the low-temperature waste cold resources generated by the refrigeration device 1313 are secondarily used for cooling the transmission line 110 through the cooling device 121, so that energy can be utilized step by step. Through the recovery of the surplus cold in the refrigeration link, energy can be cross-reused, improving the energy utilization rate.

[0060] In some embodiments, the cooling device 121 may include a liquid nitrogen circulation pump and a cooling pipeline. The cooling pipeline may be coated on the transmission line 110, and liquid nitrogen may be filled in the cooling pipeline. The liquid nitrogen circulation pump is connected to the cooling pipeline and the refrigeration device 1313. The liquid nitrogen circulation pump can drive the liquid nitrogen to circulate in the cooling pipeline to cool the transmission line 110 and can absorb low-temperature heat energy from the refrigeration device 1313.

[0061] In some embodiments, the cooling device 121 may further include an air conditioner, and the air conditioner can be used to provide cold air for the transmission line 110 and each power device 111 to assist the transmission line 110 and each power device 111 in dissipating heat.

[0062] It should be noted that the thermal management method of the embodiments of the present application may not be limited to the above implementation method. For example, when the operating temperature of the medium voltage transformer 1111 is medium (i.e., the second temperature level) or low (i.e., the third temperature level), the second thermal management method or the third thermal management method may also be used for waste heat recovery and utilization.

[0063] In the power module 100 of the present application, through the interlayer decoupling design of the device layer 11, the transmission layer 12, and the thermal management layer 13, the thermal flow regulation and power transmission can operate independently. Among them, the thermal management device 131 divides the power equipment 111 into first (such as high temperature), second (such as medium temperature), and third (such as low temperature) temperature levels, and respectively matches the corresponding thermal management methods: for example, the first stable level preferentially extracts high-grade thermal energy (i.e., high-temperature thermal energy) through active thermal recovery technology and uses it for power generation or refrigeration; the second temperature level uses a cascaded conversion or temporary storage mechanism to use medium-grade thermal energy (i.e., medium-temperature thermal energy) for refrigeration or heating to achieve energy slow release; the third temperature level relies on a directional heat dissipation path to guide the residual low-grade thermal energy (i.e., low-temperature thermal energy) for heating to achieve harmless release. Thus, the environmental adaptability limitations of the traditional integrated or homogenized treatment mode can be broken through, the loss of high-calorie waste heat can be reduced through the temperature zone threshold sorting, and multiple-level optimization effects can be achieved, that is, the overall energy conversion efficiency can be enhanced by improving the hierarchical utilization rate of thermal resources, thereby systematically reducing the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in the prior art.

[0064] Figure 6 It is a structural block diagram of the data center 1 according to an embodiment of the present application.

[0065] As Figure 6 shown, the present application also provides a data center 1, which may include a data processing device 101, a data storage device 102, a network device 103, and a power module 100 according to any one of the above embodiments of the present application. The power module 100 is used to provide power for the operation of the data processing device 101, the data storage device 102, and the network device 103.

[0066] In some embodiments, the data processing device 101, the data storage device 102, and the network device 103 of the data center 1 can also be managed for heat dissipation or waste heat recovery through the thermal management method of the above power module 100. For example, the thermal energy generated during the operation of the data processing device 101, the data storage device 102, and the network device 103 is conducted to the heat storage device 1317 through a water cooling pipeline and then the third thermal management method is used for waste heat management, thereby realizing the overall heat dissipation or waste heat management efficiency of the data center 1 and improving the energy utilization rate.

[0067] In the data center 1 of the present application, the data processing device 101, the data storage device 102, and the network device 103 can form the basic functional modules of the data center 1 to be used for providing data services. The power module 100 can provide power for the operation of the data processing device 101, the data storage device 102, and the network device 103, and through the power module 100 of the present application, the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in the prior art can be reduced.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A power module, characterized in that, It includes a device layer, a transmission layer, and a thermal management layer. Multiple power devices are provided in the device layer. The transmission lines between the multiple power devices are arranged in the transmission layer. A thermal management device is provided in the thermal management layer. The thermal management device is configured to: perform thermal management on at least one of the multiple power devices by using a first thermal management method based on a first temperature level; perform thermal management on at least one of the multiple power devices by using a second thermal management method based on a second temperature level; and perform thermal management on at least one of the multiple power devices by using a third thermal management method based on a third temperature level. Wherein, the temperature value of the first temperature level is greater than the temperature value of the second temperature level, and the temperature value of the second temperature level is greater than the temperature value of the third temperature level.

2. The power module according to claim 1, characterized in that, The first thermal management method is to collect the thermal energy of at least one of the power devices and use the thermal energy for power generation and / or refrigeration.

3. The power module according to claim 1, wherein The second thermal management method is to collect the thermal energy of at least one of the power devices and use the thermal energy for refrigeration or heating.

4. The power module according to claim 1, wherein The third thermal management method is to collect the thermal energy of at least one of the power devices and use the thermal energy for heating.

5. The power module according to claim 2, characterized in that, The power devices include a medium-voltage transformer, a transformer, and an energy storage device. The temperatures of the medium-voltage transformer, the transformer, and the energy storage device during operation are at the first temperature level. The thermal management device is configured to: collect the thermal energy generated by at least one of the medium-voltage transformer, the transformer, and the energy storage device during operation, and use the thermal energy for power generation and / or refrigeration.

6. The power module according to claim 5, characterized in that The thermal management device includes a first heat conduction device, a power generation device, a refrigeration device, and a control device. The first heat conduction device is connected to the medium-voltage transformer, the transformer, and the energy storage device to collect the thermal energy generated by the medium-voltage transformer, the transformer, and the energy storage device during operation. The power generation device is connected to the first heat conduction device and the control device. The refrigeration device is connected to the first heat conduction device and the control device. The control device is used to control the power generation device to use the thermal energy for power generation and / or control the refrigeration device to use the thermal energy for refrigeration.

7. The power module according to claim 3, characterized in that, The power devices include a low-voltage switchgear and a reactive power compensation device. The temperatures of the low-voltage switchgear and the reactive power compensation device during operation are at the second temperature level. The thermal management device is configured to: collect the thermal energy generated by the low-voltage switchgear and the reactive power compensation device during operation, and use the thermal energy for refrigeration or heating; The thermal management device includes a second heat conduction device, a refrigeration device, a heating device, and a control device. The second heat conduction device is connected to the low-voltage switchgear and the reactive power compensation device to collect the thermal energy generated by the low-voltage switchgear and the reactive power compensation device during operation. The refrigeration device is connected to the second heat conduction device and the control device. The heating device is connected to the second heat conduction device and the control device. The control device is used to control the refrigeration device to use the thermal energy for refrigeration or control the heating device to use the thermal energy for heating.

8. The power module according to claim 4, wherein The power equipment includes a ventilation device, and the temperature of the ventilation device during operation is in the third temperature grade. The thermal management device is configured to: collect the thermal energy of the ventilation device and use the thermal energy for heating; The thermal management device includes a thermal storage device, a heating device and a control device. The thermal storage device is connected to the ventilation device to store the thermal energy of the ventilation device. The heating device is connected to the thermal storage device and the control device. The control device is used to control the heating device to use the thermal energy stored in the thermal storage device for heating.

9. The power module according to claim 6, wherein The transmission layer is provided with a cooling device. The cooling device is connected to the refrigeration device. The cooling device is used to obtain low-temperature thermal energy from the refrigeration device and use the low-temperature thermal energy to cool the transmission line.

10. A data center, characterized in that, It includes a data processing device, a data storage device, a network device and the power module according to any one of claims 1 to 9. The power module is used to provide power for the operation of the data processing device, the data storage device and the network device.

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