Temperature control device of power amplifier module

Abstract

The invention relates to the technical field of power amplifier modules, in particular to a temperature control device of a power amplifier module, which comprises an annular seat, a vertical rail is fixedly mounted at the top of the annular seat, a mounting strip is slidably connected in the vertical rail, and a connecting ring is fixedly mounted at the lower end of the inner side of the mounting strip. The heat dissipation performance can be greatly improved through cooperative operation of the inner heat dissipation mechanism and the outer heat dissipation mechanism, heat generated by operation of the power amplifier module body is conducted to the heat conduction aluminum sleeve and then transmitted to the heat conduction aluminum ring sleeve through the heat conduction fins, once the temperature sensor monitors that the temperature of the heat conduction aluminum ring sleeve rises to a warning threshold value, the temperature is fed back to the single-chip microcomputer controller, and the warning effect is achieved. Then, the single-chip microcomputer controller controls the micro pump, the cooling liquid in the cooling box circulates in the heat exchange coil pipe and exchanges heat with the heated heat conduction aluminum ring sleeve, after heat energy enters the cooling box, the semiconductor cooler is started to cool the cooling liquid, and the cooling capacity of the cooling liquid is maintained.

Description

Technical Field

[0001] This application relates to the technical field of power amplifier modules, and in particular to a temperature control device for a power amplifier module. Background Art

[0002] In modern science and technology and industrial production, ion source systems play a crucial role and are widely used in many fields such as mass spectrometry, ion beam processing, semiconductor manufacturing, etc. As the core device for generating ions, the normal operation of the ion source depends on specific energy input to promote the ionization of atoms or molecules to form ions. The ion source power amplifier module plays an indispensable role in the ion source system and is mainly responsible for amplifying the electrical signals input to the ion source to meet the energy requirements for the normal operation of the ion source.

[0003] For example, in the field of mass spectrometry, precise ion generation is crucial for the accurate detection of the composition of substances. The ion source power amplifier module provides stable and appropriate energy for the ion source, enabling the ion source to ionize sample molecules into ions, and then analyzing the ions through a mass spectrometer to obtain information on the structure and composition of the substances. In ion beam processing, the high-energy ion beam generated by the ion source is used for processing technologies such as etching and coating of the material surface. The ion source power amplifier module ensures the stable output of the ion beam by the ion source, ensuring the accuracy and quality of the processing. In semiconductor manufacturing, ion implantation is an important process step. The ion source power amplifier module provides sufficient energy for the ion source to achieve the generation and implantation of ions, meeting the requirements for the manufacture of semiconductor devices.

[0004] The ion source requires precise energy supply to achieve the ionization of gas, the generation and extraction of ions. The ion source power amplifier module amplifies the input small-power electrical signals through carefully designed internal circuits and selected electronic components such as power transistors. The amplified electrical signals provide sufficient energy for key components such as filaments and electrodes in the ion source, enabling them to generate a stable electric or magnetic field, thereby achieving the effective generation of ions. Taking the electron bombardment ion source as an example, the power amplifier module provides appropriate voltage and current for the filament. The filament emits electrons, and these electrons bombard gas molecules, ionizing them into ions, providing an ion source for subsequent analysis or processing. However, as a precision electronic component, the ion source power amplifier module has extremely high requirements for the stability of the working environment, especially the temperature conditions. Excessive temperature will not only significantly affect its service life, but in severe cases it will even cause the ion source to fail to operate normally, thereby affecting the performance and reliability of the entire system. At present, there are relevant technical solutions for the heat dissipation problem of the ion source power amplifier module. For example, the Chinese patent with the announcement number "CN106385785A" discloses a power amplifier module heat dissipation device. The main body of the device adopts a circular cylindrical structure, and the top is an amplifier motherboard module with an integrated avionics socket. The two ends of the cylinder are designed as a watertight structure with hole-shaft matching, which ensures good assemblability. The power amplifier modules in the device are evenly arranged radially along the circumference, achieving high integration and assembly convenience, improving the heat dissipation performance to a certain extent, and ensuring the reliability of the power amplifier module.

[0005] However, the existing technology still has obvious defects in actual use. Its heat dissipation method mainly relies on the annular heat dissipation shell. When the temperature is too high, the heat dissipation rate is difficult to meet the actual needs only by relying on the natural heat conduction of the annular heat dissipation shell. Even if the annular heat dissipation shell can increase the heat dissipation area, it is still impossible to quickly and effectively dissipate the high heat under high temperature conditions. This is a problem that needs to be solved urgently for the ion source power amplifier module, which is extremely sensitive to temperature, because excessively high temperature may cause the performance of electronic components to decline, resulting in unstable output of the ion source power amplifier module, which in turn affects the normal operation of the ion source and ultimately affects the accuracy and efficiency of analysis, processing and other operations in related fields. In summary, the existing ion source power amplifier module heat dissipation technology is insufficient and cannot meet the growing requirements for the stability and reliability of the ion source system, and it is urgently needed to improve its design. Summary of the invention

[0006] In order to improve the heat dissipation efficiency during the application of the prior art, the present application provides a temperature control device for a power amplifier module.

[0007] The present application provides a temperature control device for a power amplifier module, which adopts the following technical solution: comprising an annular seat, a vertical rail fixedly mounted on the top of the annular seat, a mounting bar slidably connected inside the vertical rail, a connecting ring fixedly mounted on the inner lower end of the mounting bar, a power amplifier module body mounted on the inner side of the connecting ring by bolts, a limiting mechanism mounted on the top of the annular seat on the outer side of the vertical rail, the mounting bar mounted inside the vertical rail by the limiting mechanism, an inner heat dissipation mechanism fixedly mounted on the top of the power amplifier module body, an outer heat dissipation mechanism fixedly mounted between the inner sides of each vertical rail, the outer heat dissipation mechanism covering the outer side of the inner heat dissipation mechanism, and a wiring mechanism provided at the bottom of the power amplifier module body; The internal heat dissipation mechanism includes a heat-conducting aluminum sleeve and a heat-conducting component. The heat-conducting aluminum sleeve is fixedly connected to the outer surface of the top of the power amplifier module body. The outer surface of the heat-conducting aluminum sleeve is fixedly connected with heat-conducting fins arranged in an equidistant annular pattern. The heat-conducting component is coated on the outer surface of the heat-conducting aluminum sleeve.

[0008] Optionally, the heat-conducting component includes a heat-conducting aluminum ring sleeve. The heat-conducting aluminum ring sleeve is sleeved on the outer surface of the heat-conducting aluminum sleeve. The outer surface of the heat-conducting aluminum ring sleeve is fixedly connected with a heat exchange coiled pipe. One side of the heat-conducting aluminum ring sleeve is fixedly installed with a cooling box. The inside of the cooling box is provided with coolant. One side of the cooling box is fixedly installed with a micro pump. The input end of the micro pump is communicated with the cooling box. The output end of the micro pump is communicated with the input end of the heat exchange coiled pipe. The output end of the heat exchange coiled pipe is communicated with the cooling box. One side of the cooling box is fixedly connected with a semiconductor refrigerator.

[0009] Optionally, a single-chip microcomputer controller is fixedly connected to the outside of the micro pump. A temperature sensor is fixedly connected to one side of the micro pump. The detection end of the temperature sensor is in fit connection with the outer concave surface of the heat-conducting aluminum ring sleeve.

[0010] Optionally, heat dissipation grooves are equidistantly opened on the inner side of the heat-conducting aluminum ring sleeve. The heat-conducting fins are all slidably connected and fitted inside the heat dissipation grooves.

[0011] Optionally, the external heat dissipation mechanism includes arc-shaped plates. The arc-shaped plates are all fixedly installed at the gaps between the vertical rails. Heat dissipation windows are opened at both the upper and lower ends of the arc-shaped plates. Heat dissipation fans are movably installed inside the heat dissipation windows.

[0012] Optionally, heat dissipation holes are equidistantly opened on the connecting ring. The heat dissipation holes penetrate through the connecting ring. The internal cross-sectional shapes of the installation strip and the guide rail are both set as convex shapes.

[0013] Optionally, the limiting mechanism includes limiting holes and a ring-shaped groove. The ring-shaped groove is opened at the top of the ring-shaped seat. A torsion spring is fixedly installed inside the ring-shaped groove. The top of the torsion spring is fixedly installed with a sliding ring. The sliding ring is rotatably connected to the inner side of the ring-shaped groove. Arc-shaped limiting rods are fixedly connected to the inner side of the sliding ring at equal intervals. The limiting holes are all opened at the lower ends of the installation strip and the vertical rail. The ends of the arc-shaped limiting rods penetrate through the limiting holes on the vertical rail and are inserted into the limiting holes.

[0014] Optionally, anti-slip arc grooves are equidistantly opened on the outer side of the sliding ring. The overall shape of the limiting hole is set as an arc shape. The arc-shaped limiting rod and the limiting hole are both concentric with the torsion spring.

[0015] Optionally, mounting plates are fixedly connected to the outer side of the ring-shaped seat in an equidistant annular pattern. Mounting holes are opened on the outer sides of the mounting plates. The mounting holes are set as countersunk holes.

[0016] Optionally, the wiring mechanism includes a conductive wiring frame, which is arranged in a ring at equal intervals and fixedly connected to the bottom of the power amplifier module body. A wiring screw is threadedly connected to the upper end of the conductive wiring frame, and an insulating knob handle is fixedly connected to the outer end of the wiring screw.

[0017] In summary, the present application includes the following beneficial technical effects: Through the cooperation of the limiting mechanism, the vertical rail and the mounting strip, the present device realizes the quick disassembly and assembly of the power amplifier module body. During installation, press the anti-slip arc groove on the outer side of the slip ring to push the slip ring to rotate, drive the torsion spring to compress, and the arc-shaped limiting rod disengages from the lower limiting hole of the vertical rail, then the mounting strip can be inserted into the vertical rail. After releasing the slip ring, the torsion spring resets to drive the slip ring and the arc-shaped limiting rod to rotate in the opposite direction, and the arc-shaped limiting rod penetrates through the vertical rail and the bottom limiting hole of the mounting strip to complete the limiting and fixing of the mounting strip. During disassembly, twist the slip ring again to make the arc-shaped limiting rod disengage from the limiting hole, and then the mounting strip can be pulled out to remove the power amplifier module body. This design greatly facilitates the subsequent maintenance work of the device and improves the usability. The present device sets the internal heat dissipation mechanism and the external heat dissipation mechanism to work together, which can effectively improve the heat dissipation performance. The heat generated during the operation of the power amplifier module body is conducted to the heat-conducting aluminum sleeve, and then transferred to the heat-conducting aluminum ring sleeve through the heat-conducting fins. When the temperature sensor monitors that the temperature of the heat-conducting aluminum ring sleeve rises to the warning threshold, it feeds back information to the single-chip microcomputer controller. The single-chip microcomputer controller controls the micro pump to make the coolant in the cooling tank circulate in the heat exchange coil, and conduct heat exchange with the heat-conducting aluminum ring sleeve with increased temperature. After the heat energy enters the cooling tank, the semiconductor refrigerator starts to cool the coolant to maintain its continuous cooling ability. At the same time, the single-chip microcomputer controller controls the operation of the cooling fan to promote air circulation and conduct heat exchange with each heat dissipation component and the power amplifier module body. The combination of air cooling and liquid cooling significantly enhances the overall heat dissipation effect of the device. Description of the Drawings

[0018] Figure 1 is the overall structure schematic diagram in the embodiment of the present application; Figure 2 is the bottom view structure schematic diagram in the embodiment of the present application; Figure 3 is the top view structure schematic diagram in the embodiment of the present application; Figure 4 is the disassembled state structure schematic diagram in the embodiment of the present application; Figure 5 is the separated state structure schematic diagram of the limiting mechanism in the embodiment of the present application; Figure 6 is the bottom view structure schematic diagram of the internal heat dissipation mechanism and the power amplifier module in the embodiment of the present application; Figure 7It is a schematic top view of the split state of the internal heat dissipation mechanism and the power amplifier module in the embodiment of the present application; Figure 8 It is a schematic bottom view of the split state of the internal heat dissipation mechanism and the power amplifier module in the embodiment of the present application.

[0019] Reference numerals: 1, annular seat; 2, vertical rail; 3, mounting strip; 4, connecting ring; 5, power amplifier module body; 6, limiting mechanism; 61, limiting hole; 62, annular groove; 63, torsion spring; 64, sliding ring; 65, arc-shaped limiting rod; 66, anti-slip arc groove; 7, internal heat dissipation mechanism; 71, heat-conducting aluminum sleeve; 72, heat-conducting component; 721, heat-conducting aluminum ring sleeve; 722, heat exchange coil; 723, cooling box; 724, micro pump; 725, single-chip microcomputer controller; 726, temperature sensor; 727, heat dissipation groove; 728, semiconductor refrigerator; 73, heat-conducting fin; 8, external heat dissipation mechanism; 81, arc-shaped plate; 82, heat dissipation window; 83, heat dissipation fan; 9, wiring mechanism; 91, conductive wiring frame; 92, wiring screw; 93, insulating knob handle; 10, heat dissipation hole; 11, mounting plate; 12, mounting hole. Detailed implementation manners

[0020] The following further Figure 1-8 describes the present application in detail.

[0021] The embodiment of the present application discloses a temperature control device for a power amplifier module. As Figure 1-8 shown, it includes an annular seat 1, a vertical rail 2 is fixedly installed on the top of the annular seat 1, a mounting strip 3 is slidably connected inside the vertical rail 2, a connecting ring 4 is fixedly installed at the lower end of the inner side of the mounting strip 3, a power amplifier module body 5 is installed inside the connecting ring 4 through bolts, a limiting mechanism 6 is installed on the top of the annular seat 1 outside the vertical rail 2, the mounting strip 3 is installed inside the vertical rail 2 through the limiting mechanism 6, an internal heat dissipation mechanism 7 is fixedly installed on the top of the power amplifier module body 5, an external heat dissipation mechanism 8 is fixedly installed between the inner sides of each vertical rail 2, the external heat dissipation mechanism 8 covers the outside of the internal heat dissipation mechanism 7, and a wiring mechanism 9 is arranged at the bottom of the power amplifier module body 5; The internal heat dissipation mechanism 7 includes a heat-conducting aluminum sleeve 71 and a heat-conducting component 72. The heat-conducting aluminum sleeve 71 is fixedly connected to the outer surface of the top of the power amplifier module body 5. Heat-conducting fins 73 are fixedly connected to the outer surface of the heat-conducting aluminum sleeve 71 in an equidistant and annular arrangement. The heat-conducting component 72 is wrapped around the outer surface of the heat-conducting aluminum sleeve 71. When the temperature control device of this power amplifier module works, when the power amplifier module body 5 operates to generate heat, the heat is first transferred to the closely connected heat-conducting aluminum sleeve 71. Due to the good heat-conducting performance of the heat-conducting aluminum sleeve 71, the heat can be quickly conducted to the outer surface. The heat-conducting fins 73 arranged in an annular and equidistant manner on the outer surface greatly increase the heat dissipation area and further export the heat from the heat-conducting aluminum sleeve 71. At this time, the heat is transferred to the heat-conducting component 72 wrapped around the outer surface of the heat-conducting aluminum sleeve 71, completing the preliminary heat dissipation work of the internal heat dissipation mechanism 7. Then, the heat is conducted to the external heat dissipation mechanism 8. The external heat dissipation mechanism 8 is wrapped around the outside of the internal heat dissipation mechanism 7 to further enhance the heat dissipation effect. In the whole process, the mounting strip 3 is stably installed inside the vertical rail 2 through the limiting mechanism 6 to ensure the stable installation of the power amplifier module body 5, while the wiring mechanism 9 at the bottom of the power amplifier module body 5 facilitates circuit connection to ensure its normal operation.

[0022] Please refer to Figures 1-6 , the external heat dissipation mechanism 8 includes an arc-shaped plate 81. The arc-shaped plates 81 are fixedly installed at the gaps of each vertical rail 2. Heat dissipation windows 82 are opened at both the upper and lower ends of the arc-shaped plate 81. Heat dissipation fans 83 are movably installed inside the heat dissipation windows 82. Heat dissipation holes 10 are equidistantly opened on the connecting ring 4. The heat dissipation holes 10 penetrate through the connecting ring 4. The internal cross-sectional shapes of the mounting strip 3 and the guide rail are both set to be convex. When the power amplifier module body 5 works, heat will be generated. The heat is conducted through the internal heat dissipation mechanism 7. At this time, the external heat dissipation mechanism 8 starts to play a role. The arc-shaped plates 81 are fixed at the gaps of each vertical rail 2, and the heat dissipation fans 83 movably installed in the heat dissipation windows 82 at both the upper and lower ends start to operate. Air enters from the heat dissipation windows 82. On the one hand, it exchanges heat with the heat dissipated through the heat dissipation holes 10 on the connecting ring 4 of the power amplifier module body 5; on the other hand, it further exchanges heat with the heat conducted by the internal heat dissipation mechanism 7. The internal cross-sections of the mounting strip 3 and the guide rail are convex. This unique structure ensures the stability of the mounting strip 3 sliding inside the guide rail and also helps to maintain the stability of the overall structure, ensuring that the heat dissipation fans 83 continuously and effectively promote air circulation to achieve efficient heat dissipation and ensure the stable operation of the power amplifier module body 5 at an appropriate temperature.

[0023] Please refer to Figures 6-8, the heat conduction component 72 includes a heat-conducting aluminum ring sleeve 721. The heat-conducting aluminum ring sleeve 721 is sleeved on the outer surface of the heat-conducting aluminum sleeve 71. A heat exchange coil 722 is fixedly connected to the outer surface of the heat-conducting aluminum ring sleeve 721. A cooling box 723 is fixedly installed on one side of the heat-conducting aluminum ring sleeve 721. A coolant is provided inside the cooling box 723. A micro pump 724 is fixedly installed on one side of the cooling box 723. The input end of the micro pump 724 is communicated with the cooling box 723, and the output end of the micro pump 724 is communicated with the input end of the heat exchange coil 722. The output end of the heat exchange coil 722 is communicated with the cooling box 723. A semiconductor refrigerator 728 is fixedly connected to one side of the cooling box 723. A single-chip microcomputer controller 725 is fixedly connected to the outside of the micro pump 724. A temperature sensor 726 is fixedly connected to one side of the micro pump 724. The detection end of the temperature sensor 726 is in close contact with the outer concave surface of the heat-conducting aluminum ring sleeve 721. Heat dissipation grooves 727 are equidistantly arranged on the inner side of the heat-conducting aluminum ring sleeve 721. The heat-conducting fins 73 are all slidably connected and fitted inside the heat dissipation grooves 727. When the power amplifier module body 5 generates heat, the heat is conducted to the heat-conducting aluminum sleeve 71. Since the heat-conducting aluminum sleeve 71 is in close contact with the heat-conducting aluminum ring sleeve 721, the heat is further transferred to the heat-conducting aluminum ring sleeve 721. The heat exchange coil 722 on the outer surface of the heat-conducting aluminum ring sleeve 721, the cooling box 723 and the micro pump 724 form a circulation system. The temperature sensor 726 monitors the temperature of the heat-conducting aluminum ring sleeve 721 in real time. When the detected temperature reaches a certain threshold, a signal is fed back to the single-chip microcomputer controller 725. The single-chip microcomputer controller 725 controls the micro pump 724 to start, extracts the coolant in the cooling box 723, and makes it enter the heat exchange coil 722 through the micro pump 724. The coolant flows in the heat exchange coil 722 and exchanges heat with the heat-conducting aluminum ring sleeve 721 with increased temperature, takes away the heat and then flows back to the cooling box 723. The semiconductor refrigerator 728 continuously cools the coolant in the cooling box 723 to ensure the cooling capacity of the coolant. The heat dissipation grooves 727 arranged on the inner side of the heat-conducting aluminum ring sleeve 721 are slidably connected and fitted with the heat-conducting fins 73, which helps the heat to be transferred from the heat-conducting fins 73 to the heat-conducting aluminum ring sleeve 721 more efficiently, further improving the heat dissipation effect.

[0024] Please refer to Figures 1-2 and Figure 6, the wiring mechanism 9 includes a conductive wiring frame 91. The conductive wiring frames 91 are arranged in a ring at equal intervals and fixedly connected to the bottom of the power amplifier module body 5. A wiring screw 92 is threadedly connected to the upper end of the conductive wiring frame 91, and an insulating knob 93 is fixedly connected to the outer end of the wiring screw 92. By providing the wiring mechanism 9, when an external circuit needs to be connected, the wire is inserted into the conductive wiring frame 91. These conductive wiring frames 91 are arranged in a ring at equal intervals and fixed to the bottom of the power amplifier module body 5 to meet the connection requirements of different circuits. Then, the insulating knob 93 is rotated. Since the insulating knob 93 is fixedly connected to the wiring screw 92, rotating the insulating knob 93 drives the wiring screw 92 to rotate synchronously. The wiring screw 92 is threadedly connected to the conductive wiring frame 91 and gradually advances towards the wire during rotation. By continuously applying pressure, the wire is firmly squeezed inside the conductive wiring frame 91, realizing a stable and reliable electrical connection between the wire and the power amplifier module body 5, ensuring that the power amplifier module can be normally powered on and operated, and completing the conduction of the circuit and the signal transmission.

[0025] Please refer to Figures 1-5The limiting mechanism 6 includes a limiting hole 61 and an annular groove 62. The annular groove 62 is opened at the top of the annular seat 1. A torsion spring 63 is fixedly installed inside the annular groove 62. A slip ring 64 is fixedly installed on the top of the torsion spring 63. The slip ring 64 is rotatably connected to the inner side of the annular groove 62. The inner side of the slip ring 64 is fixedly connected with arc-shaped limiting rods 65 at equal intervals. The limiting holes 61 are all opened at the lower ends of the mounting bar 3 and the vertical rail 2. The ends of the arc-shaped limiting rods 65 pass through the limiting holes 61 on the vertical rail 2 and are inserted into the limiting holes 61. The outer side of the slip ring 64 is evenly spaced. An anti-slip arc groove 66 is provided, and the overall shape of the limiting hole 61 is set to be an arc shape. The arc-shaped limiting rod 65 and the limiting hole 61 are arranged concentrically with the torsion spring 63. The outer side of the annular seat 1 is evenly spaced and arranged in an annular shape and fixedly connected with a mounting plate 11. The outer side of the mounting plate 11 is provided with a mounting hole 12, and the mounting hole 12 is set as a countersunk hole. When the mounting bar 3 needs to be installed in the vertical rail 2, the operator presses the anti-slip arc groove 66 on the outer side of the slip ring 64, and the slip ring 64 rotates in the annular groove 62, driving the torsion spring 63 to twist and be in a compressed state, and at the same time When the sliding ring 64 is in place, the arc-shaped limit rod 65 fixedly connected at equal intervals on the inner side of the sliding ring 64 rotates with the sliding ring 64 and disengages from the limit hole 61 at the lower end of the vertical rail 2. At this time, the mounting bar 3 can be smoothly inserted into the interior of the vertical rail 2. When the mounting bar 3 is in place, the sliding ring 64 is loosened, and the torsion spring 63 loses the external force restriction and starts to reset, driving the sliding ring 64 to rotate in the opposite direction. The arc-shaped limit rod 65 rotates accordingly, and its end passes through the limit hole 61 on the vertical rail 2 and is accurately inserted into the limit hole 61 at the lower end of the mounting bar 3. Since the limit hole 61 is an arc shape, and the arc-shaped limit rod 65 and the limit hole are 61 and the torsion spring 63 are arranged in concentric circles, so that the limit is more stable, so that the mounting bar 3 is firmly fixed in the vertical rail 2, and then the power amplifier module body 5 on the inner side of the connecting ring 4 is stably installed. If the power amplifier module body 5 is to be removed, the anti-slip arc groove 66 is pressed again to rotate the slip ring 64 to make the arc-shaped limit rod 65 disengage from the limit hole 61, and the mounting bar 3 can be pulled out from the vertical rail 2. In addition, the mounting plates 11 are arranged in a ring shape at equal intervals on the outside of the annular seat 1, and the countersunk holes on the outside thereof are convenient for using bolts and other connecting parts to fix the entire device to other equipment.

[0026] The implementation principle of a temperature control device for a power amplifier module in the embodiment of the present application is as follows: the device innovatively sets a limiting mechanism 6, and makes it cooperate with the vertical rail 2 and the mounting bar 3. In the actual application scenario, when the power amplifier module needs to be installed, the mounting bar 3 is first aligned with the vertical rail 2, ready to be inserted into the vertical rail 2. During the insertion process, the operator presses the anti-slip arc groove 66 carefully designed on the outer side of the slip ring 64 to push the slip ring 64 to rotate. The rotation of the slip ring 64 drives the torsion spring 63 connected thereto to rotate synchronously. During this process, the torsion spring 63 is in a compressed state due to the force. At the same time, the arc-shaped limiting rod 65 linked to the slip ring 64 rotates accordingly, thereby disengaging from the inner side of the limiting hole 61 at the lower end of the vertical rail 2. At this time, the mounting bar 3 can be smoothly and unhinderedly inserted into the interior of the vertical rail 2. When the installation strip 3 is accurately in place, the operator releases the pressure on the slip ring 64. At this time, the torsion spring 63 in the compressed state loses the external limiting force, and according to its own elastic reset characteristics, drives the slip ring 64 to rotate and reset in the opposite direction. The reset of the slip ring 64 further drives the arc-shaped limit rod 65 to rotate and displace. After the arc-shaped limit rod 65 rotates, it accurately penetrates the limit hole 61 on the vertical rail 2 and is inserted into the limit hole 61 corresponding to the bottom of the installation strip 3. Through this process, the arc-shaped limit rod 65 successfully realizes the limit locking of the installation strip 3, thereby ensuring that the installation strip 3 is firmly installed inside the vertical rail 2, and completing the installation of the power amplifier module. If the power amplifier module needs to be dismantled for inspection and maintenance later, the operator can twist the slip ring 64 again to rotate it. The rotation of the slip ring 64 drives the arc-shaped limit rod 65 to rotate synchronously, thereby disengaging from the limit hole 61 at the bottom of the mounting bar 3. Once the arc-shaped limit rod 65 is disengaged from the limit hole 61, the mounting bar 3 loses its limit constraint inside the vertical rail 2. At this time, the mounting bar 3 can be easily pulled out from the inside of the vertical rail 2, and then the power amplifier module body 5 inside the connecting ring 4 on the mounting bar 3 can be quickly removed. This design enables the device to efficiently and conveniently realize the rapid disassembly and assembly of the power amplifier module body 5 during actual use, greatly facilitating subsequent inspection and maintenance work, and significantly improving the practicality and operability of the device. The device has a well-designed internal heat dissipation mechanism 7 and an external heat dissipation mechanism 8, which are coordinated with each other, and the overall heat dissipation performance is significantly improved. During the operation of the power amplifier module body 5, the work of the internal electronic components will inevitably generate heat, and the heat is firstly transferred to the heat-conducting aluminum sleeve 71 in close contact with it. The heat-conducting aluminum sleeve 71, with its good heat conductivity, quickly transfers the heat to the heat-conducting fins 73, and the heat-conducting fins 73 further transfer the heat from the heat-conducting aluminum sleeve 71 to the heat-conducting aluminum ring sleeve 721. With the transfer of heat, the temperature of the heat-conducting aluminum ring sleeve 721 gradually rises; The detection end of the temperature sensor 726 is closely attached to the outer surface of the heat-conducting aluminum ring sleeve 721, and can accurately monitor its temperature change in real time. When the temperature rises to a preset warning threshold, the temperature sensor 726 quickly feeds back the temperature information to the single-chip controller 725. After receiving the signal, the single-chip controller 725 immediately issues a command to control the operation of the micro pump 724. After the micro pump 724 is started, it starts to pump the coolant inside the cooling box 723 to circulate in the heat exchange coil 722. After the coolant flows in the heat exchange coil 722 for a circle, it returns to the inside of the cooling box 723. Since the heat exchange coil 722 is tightly coated on the outside of the heat-conducting aluminum ring sleeve 721, when the temperature of the outer surface of the heat-conducting aluminum ring sleeve 721 rises, it can be efficiently heat-exchanged with the coolant through the heat exchange coil 722, so as to achieve rapid heat dissipation and cooling. When heat energy enters the interior of the cooling box 723 along with the coolant, the semiconductor refrigerator 728 is started to operate. The semiconductor refrigerator 728 utilizes the Peltier effect of semiconductor materials to cool down the coolant inside the cooling box 723, thereby ensuring that the coolant always maintains a relatively low temperature and has the function of continuous cooling for a long time. During the entire cooling process, the single-chip microcomputer controller 725 will also control the operation of the cooling fan 83 according to the actual situation. The cooling fan 83 inside the heat dissipation window 82 rotates at a high speed, promoting efficient air circulation. The external air enters the inner space of the arc-shaped plate 81 through the heat dissipation window 82. During this process, the air comes into full contact with the heat-conducting aluminum sleeve 71, the heat-conducting aluminum ring sleeve 721, the heat-conducting fins 73, the heat exchange coil 722, the cooling box 723, the heat dissipation holes 10, and the power amplifier module body 5 to conduct heat exchange. This combined method of air cooling and liquid cooling can give full play to the advantages of the internal heat dissipation mechanism 7 and the external heat dissipation mechanism 8, greatly enhancing the heat dissipation function of the device, significantly improving the overall heat dissipation effect of the device, further enhancing the heat dissipation performance of this power amplifier module, and ensuring the efficient operation of the power amplifier module in a stable temperature environment; In actual use, in order to meet the need for convenient connection of the power supply wire, the device is specially provided with a wiring mechanism 9. When it is necessary to connect the power supply wire, the operator only needs to align the wire with the conductive wiring rack 91 and then smoothly insert it. Then, the operator twists the insulating knob handle 93. The rotation of the insulating knob handle 93 drives the connected wiring screw 92 to rotate synchronously. During the rotation of the wiring screw 92, it gradually squeezes towards the wire direction. As the squeezing force increases, the wire is firmly fixed inside the conductive wiring rack 91. Through this simple operation process, the stable installation of the power supply wire inside the conductive wiring rack 91 is realized, making the device as a whole have the function of conveniently connecting the power supply wire, providing great convenience for the use of the device, and effectively improving the practicability and ease of use of the device.

[0027] The above are all the preferred embodiments of this application. It does not limit the protection scope of this application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A temperature control device for a power amplifier module, characterized in that; It includes an annular base (1). A vertical rail (2) is fixedly installed on the top of the annular base (1). An installation strip (3) is slidably connected inside the vertical rail (2). A connection ring (4) is fixedly installed at the lower end of the inner side of the installation strip (3). An amplifier module body (5) is installed inside the connection ring (4) through bolts. A limiting mechanism (6) is installed on the top of the annular base (1) outside the vertical rail (2). The installation strip (3) is installed inside the vertical rail (2) through the limiting mechanism (6). An internal heat dissipation mechanism (7) is fixedly installed on the top of the amplifier module body (5). An external heat dissipation mechanism (8) is fixedly installed between the inner sides of each vertical rail (2). The external heat dissipation mechanism (8) covers the outside of the internal heat dissipation mechanism (7). A wiring mechanism (9) is arranged at the bottom of the amplifier module body (5); The internal heat dissipation mechanism (7) includes a heat-conducting aluminum sleeve (71) and a heat-conducting component (72). The heat-conducting aluminum sleeve (71) is fixedly connected to the outer surface of the top of the amplifier module body (5). Heat-conducting fins (73) are fixedly connected to the outer surface of the heat-conducting aluminum sleeve (71) at equal intervals in a circular arrangement. The heat-conducting component (72) covers the outer surface of the heat-conducting aluminum sleeve (71).

2. The temperature control device for a power amplifier module according to claim 1, characterized in that: The heat-conducting component (72) includes a heat-conducting aluminum ring sleeve (721). The heat-conducting aluminum ring sleeve (721) is sleeved on the outer surface of the heat-conducting aluminum sleeve (71). A heat exchange coil (722) is fixedly connected to the outer surface of the heat-conducting aluminum ring sleeve (721). A cooling box (723) is fixedly installed on one side of the heat-conducting aluminum ring sleeve (721). A coolant is arranged inside the cooling box (723). A micro pump (724) is fixedly installed on one side of the cooling box (723). The input end of the micro pump (724) is communicated with the cooling box (723). The output end of the micro pump (724) is communicated with the input end of the heat exchange coil (722). The output end of the heat exchange coil (722) is communicated with the cooling box (723). A semiconductor refrigerator (728) is fixedly connected to one side of the cooling box (723).

3. The temperature control device for a power amplifier module according to claim 2, characterized in that: A single-chip microcomputer controller (725) is fixedly connected to the outside of the micro pump (724). A temperature sensor (726) is fixedly connected to one side of the micro pump (724). The detection end of the temperature sensor (726) is in fit connection with the outer concave surface of the heat-conducting aluminum ring sleeve (721).

4. The temperature control device for a power amplifier module according to claim 3, wherein: Heat dissipation grooves (727) are arranged at equal intervals on the inner side of the heat-conducting aluminum ring sleeve (721). The heat-conducting fins (73) are all slidably connected and fitted inside the heat dissipation grooves (727).

5. The temperature control device for a power amplifier module according to claim 2, characterized in that: The external heat dissipation mechanism (8) includes an arc-shaped plate (81). The arc-shaped plates (81) are all fixedly installed at the gaps between each vertical rail (2). Heat dissipation windows (82) are arranged at the upper and lower ends of the arc-shaped plate (81). Heat dissipation fans (83) are movably installed inside the heat dissipation windows (82).

6. The temperature control device for a power amplifier module according to claim 5, characterized in that: Heat dissipation holes (10) are arranged at equal intervals on the connection ring (4). The heat dissipation holes (10) penetrate through the connection ring (4). The internal cross-sectional shapes of the installation strip (3) and the guide rail are both set to be convex-shaped.

7. The temperature control device for a power amplifier module according to claim 1, characterized in that: The limiting mechanism (6) includes a limiting hole (61) and an annular groove (62). The annular groove (62) is formed in the top of the annular seat (1). A torsion spring (63) is fixedly installed inside the annular groove (62). The top of the torsion spring (63) is fixedly installed with a slip ring (64). The slip ring (64) is rotatably connected to the inner side of the annular groove (62). Arc-shaped limiting rods (65) are fixedly connected to the inner side of the slip ring (64) at equal intervals. The limiting holes (61) are formed in the lower ends of the mounting strip (3) and the vertical rail (2). The ends of the arc-shaped limiting rods (65) penetrate through the limiting holes (61) in the vertical rail (2) and are inserted into the inside of the limiting holes (61).

8. The temperature control device for a power amplifier module according to claim 7, wherein: Anti-slip arc grooves (66) are formed in the outer side of the slip ring (64) at equal intervals. The overall shape of the limiting hole (61) is set to be arc-shaped. Both the arc-shaped limiting rod (65) and the limiting hole (61) are concentric with the torsion spring (63).

9. The temperature control device for a power amplifier module according to claim 1, characterized in that: Mounting plates (11) are fixedly connected to the outer side of the annular seat (1) in an annular arrangement at equal intervals. Mounting holes (12) are formed in the outer sides of the mounting plates (11). The mounting holes (12) are set to be counterbore holes.

10. The temperature control device for a power amplifier module according to claim 1, characterized in that: The wiring mechanism (9) includes a conductive wiring frame (91). The conductive wiring frame (91) is fixedly connected to the bottom of the power amplifier module body (5) in an annular arrangement at equal intervals. A wiring screw (92) is threadedly connected to the upper end of the conductive wiring frame (91). An insulating knob handle (93) is fixedly connected to the outer end of the wiring screw (92).

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