Mass transfer device and mass transfer method thereof

Abstract

The invention discloses a mass transfer device and a mass transfer method thereof, and relates to an array substrate and a mass transfer device applying the array substrate. The array substrate comprises a body and a plurality of slots formed on the body, wherein at least one of the slots comprises the following structures: a first side wall, a second side wall, a first bottom surface and a second bottom surface. The first side wall surrounds the periphery of the first bottom face, and the bottom of the first side wall is connected with the first bottom face. And one side of the second bottom surface is connected with the top of the first side wall. The second side wall surrounds the periphery of the second bottom face, and the bottom of the second side wall is connected with the other side of the second bottom face. The sum of the height of the first side wall and the height of the second side wall is larger than the width of the first bottom face.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and particularly to a mass transfer device and a mass transfer method thereof. Background Art

[0002] The size of an LED varies according to the field of its application. Among them, large-sized LEDs can be applied to lighting or disinfection (such as UV LEDs), while small-sized LEDs (such as mini-LEDs or micro-LEDs) can be applied to the backlight module of a display, or directly used as pixels of a display panel (such as self-emitting display panels like OLEDs).

[0003] For small-sized LED chips, especially micro-LEDs, considering the lattice matching of materials and the difference in substrate size, after the epitaxial fabrication process is completed, a micro-LED thin film transfer fabrication process must be carried out to transfer millions of micro-scale micro-LEDs to a display substrate. The above fabrication process of transferring micro-LEDs to a display substrate is called a mass transfer technology. In the field of mass transfer technology, if the transfer fabrication process cannot be effectively completed within a reasonable time, mass production cannot be achieved.

[0004] In addition, in the prior art, although various different types of mass transfer technologies have been introduced, there is no solution that can simultaneously meet the requirements of high single transfer quantity and high precision. Therefore, there are still many challenges in the commercialization of mass transfer technology. Summary of the Invention

[0005] An object of the present invention is to provide a mass transfer device and a mass transfer method thereof, which can effectively improve the transfer efficiency and precision.

[0006] An embodiment of the present invention provides a mass transfer device, which includes a carrying part, a picking and placing part, a detecting part, and a controlling part. The carrying part is used to fix at least one of a first substrate and a second substrate, and is used to adjust the position of at least one of the first substrate and the second substrate. The picking and placing part is disposed opposite to the carrying part, and is used to obtain a target object from the first substrate under control, or place the target object on the second substrate. The detecting part is disposed opposite to the carrying part and the picking and placing part, and is used to detect the relative positions of at least one of the first substrate and the second substrate and the picking and placing part, so as to generate relative position information for controlling the movement of the carrying part and the picking and placing part. The controlling part is coupled to the carrying part, the picking and placing part, and the detecting part, and is used to control the operations of the carrying part and the picking and placing part according to the relative position information. When the picking and placing part places the target object on the second substrate, the carrying part is controlled to output energy to the second substrate, so that the adhesion force of the target object to the second substrate is greater than the adhesion force of the target object to the picking and placing part.

[0007] An embodiment of the present invention provides a mass transfer device, which includes a carrying part, a picking and placing part, a detecting part, a controlling part, and an aligning part. The carrying part is adapted to carry an aligned substrate. The aligning part is disposed on the carrying part and is used to apply a force to the aligned substrate on the carrying part, so that the LED chips on the aligned substrate are neatly arranged to corresponding positions on the aligned substrate.

[0008] An embodiment of the present invention provides an aligned substrate, which includes a body and a plurality of slots formed on the body. At least one of the slots includes the following structure: a first side wall, a second side wall, a first bottom surface, and a second bottom surface. The first side wall surrounds the periphery of the first bottom surface, and the bottom of the first side wall is connected to the first bottom surface. One side of the second bottom surface is connected to the top of the first side wall. The second side wall surrounds the periphery of the second bottom surface, and the bottom of the second side wall is connected to the other side of the second bottom surface. Wherein, the sum of the heights of the first side wall and the second side wall is greater than the width of the first bottom surface.

[0009] An embodiment of the present invention provides a mass transfer method, which is applicable to a mass transfer device including a pick-and-place unit and a carrier unit. The carrier unit is used to carry a first substrate and a second substrate. The method is characterized by including the following steps: detecting the position of at least one of the first substrate and the second substrate to obtain relative position information; adjusting the relative positions of the pick-and-place unit and the carrier unit according to the relative position information; controlling the pick-and-place unit to pick up an object from the first substrate; controlling the pick-and-place unit to place the picked-up object on the second substrate; and outputting energy to the second substrate so that the adhesion of the object to the second substrate is greater than the adhesion of the object to the pick-and-place unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of the mass transfer device according to an embodiment of the present invention;

[0011] Figure 2 is a flowchart of the steps of the mass transfer method according to an embodiment of the present invention;

[0012] Figure 3 is a schematic configuration diagram of the mass transfer device according to an embodiment of the present invention;

[0013] Figures 4A to 4F is a schematic flowchart of the mass transfer process of the mass transfer device according to some embodiments of the present invention;

[0014] Figures 5A to 5L is a schematic flowchart of the mass transfer process of the mass transfer device according to some embodiments of the present invention;

[0015] Figure 6A and Figure 6B is a schematic configuration diagram of the aligned substrate according to some embodiments of the present invention; and

[0016] Figure 7A and Figure 7B is a schematic cross-sectional structure diagram of the aligned substrate according to different embodiments of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] To make the above objectives, features, and advantages of the technical solution more obvious and understandable, the following will describe in detail the specific embodiments of the proposed technical solution with reference to the accompanying drawings. The descriptions of the embodiments of the technical solution of the present invention below are only for illustration and are not intended to represent all embodiments of the present invention or limit the present invention to specific embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0018] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right", "upper", "lower" and similar expressions used herein are only for indicating the relative positional relationship based on the drawings, and do not limit that the elements using the said terms can only be implemented in the indicated manner. When the absolute position of the described object changes, the description of the relative position may also change accordingly.

[0019] In this text, descriptions such as "substantially", "roughly", "about", etc. are to commend the error range implied by possible unexpected effects and deviations in the manufacturing process or material selection. The said error range can include a range of changes that do not significantly change the material structure, configuration, characteristics, and effects, such as a range of 0%-10% deviation, and the said error range is clear to those skilled in the art. For example, when it is described that "two objects are substantially parallel", and in fact, although there is a slight height difference between the two objects, this difference can be ignored relative to the size of the objects themselves (for example, less than 10%) and does not affect the effect, then the relative configuration observed between the two objects will still be interpreted as within the range of "substantially parallel" described herein.

[0020] In all descriptions related to specific numerical values in the present invention, although not directly described, they all contain the meaning of "about" or "substantially", that is, these specific numerical values will cover the possible numerical error range, so as to commend the possible unexpected effects and deviations in the manufacturing process or material selection. The said numerical error range can include numerical changes that do not significantly change the material structure, characteristics, and effects, such as a range of 0% to 10% deviation, and this error range is clear to those of ordinary skill in the art.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention in this specification are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0022] Figure 1 Schematic diagram of the mass transfer device according to the embodiment of the present invention. Please refer to Figure 1, this embodiment relates to a mass transfer device 100 for transferring at least one target object CP on a first substrate SUB1 to a second substrate SUB2. The target object CP can be, for example, small-sized electronic components such as LED chips, specifically, for example, sub-micron light-emitting diodes (MiniLEDs) or micro light-emitting diodes (Micro LEDs), but the present invention is not limited thereto. In other embodiments, the mass transfer device 100 can also be used to transfer other types of target objects CP other than LED chips. In some embodiments, the first substrate SUB1 can be a source substrate for carrying the target object CP or an alignment substrate for adjusting the arrangement of the target object CP, and the second substrate SUB2 can be the alignment substrate or a target substrate for carrying the transferred target object CP. In other words, the mass transfer device 100 of this embodiment can transfer the target object CP between the source substrate and the target substrate, between the source substrate and the alignment substrate, and between the alignment substrate and the target substrate.

[0023] The mass transfer device 100 of this embodiment includes a carrying part 110, a picking and placing part 120, a detecting part 130, and a controlling part 140. In this embodiment, the carrying part 110 is used to fix the first substrate SUB1 and / or the second substrate SUB2, and is used to adjust the positions of the first substrate SUB1 and / or the second substrate SUB2.

[0024] The picking and placing part 120 is disposed relative to the carrying part 110, and is used to obtain the target object CP from the first substrate SUB1 under control, or place the obtained target object CP on the second substrate SUB2. In some embodiments, the picking and placing part 120 can include a sticky substrate (not shown, which will be further exemplified in subsequent embodiments) and a clamping mechanism. The sticky substrate can be a rigid substrate, and one side thereof is configured to have an adhesive force (or called an adhesive surface). The clamping mechanism is used to fix the sticky substrate, and when the picking and placing part 120 picks an object from the first substrate SUB1, it is controlled to drive the sticky substrate to move towards the first substrate SUB1, and make the adhesive surface of the sticky substrate contact the target object CP on the first substrate SUB1. Then, the clamping mechanism can drive the sticky substrate away from the first substrate SUB1 and return to a preset position (or other positions that do not contact the first substrate SUB1). At this time, the target object CP on the first substrate SUB1 will adhere to the sticky substrate due to the adhesive force on the sticky substrate and leave the first substrate SUB1, thus completing the operation of the picking and placing part 120 to obtain the target object CP from the first substrate SUB1.

[0025] The detection unit 130 is disposed relative to the carrying unit 110 and the picking and placing unit 120, so that the detection range can cover at least part of the areas of the carrying unit 110 and the picking and placing unit 120. The detection unit 130 is used to detect the relative positions of the first substrate SUB1 and / or the second substrate SUB2 disposed on the carrying unit 110 and the picking and placing unit 120, so as to generate relative position information PDT for controlling the movement of the carrying unit 110 and the picking and placing unit 120. In some embodiments, the detection unit 130 may include one or more image capturing devices, and the image capturing devices may be, for example, one or a combination of an optical microscope, a charge coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, and an industrial camera. The present invention is not limited thereto.

[0026] The control unit 140 is coupled to the carrying unit 110, the picking and placing unit 120, and the detection unit 130, and is used to control the operations of the carrying unit 110 and the picking and placing unit 120 according to the relative position information PDT. In some embodiments, the control unit 140 can be implemented by hardware, firmware, or software, and is not necessarily disposed inside the machine of the mass transfer device 100. For example, the control unit 140 can be implemented by an external computer, and the external computer can transmit signals to each module in the mass transfer device 100 through a specific transmission interface to achieve control.

[0027] In this embodiment, when the picking and placing unit 120 places the target object CP on the second substrate SUB2, the carrying unit 110 will be controlled to output energy to the second substrate SUB2 so that the adhesion force of the target object CP to the second substrate SUB2 is greater than the adhesion force of the target object CP to the picking and placing unit 120, so that the target object CP can be transferred from the picking and placing unit 120 to the second substrate SUB2. Among them, the action of the carrying unit 110 outputting energy to the second substrate SUB2 can be, for example, heating the second substrate SUB2 to reduce the adhesion force between the target object CP and the picking and placing unit 120; or applying a contact or non-contact force to the second substrate SUB2 to increase the adhesion force of the target object CP to the second substrate SUB2.

[0028] Specifically, through the configuration of the above-mentioned mass transfer device 100, all the objects (or at least some of the objects) on the first substrate SUB1 can be transferred to the second substrate SUB2 in a single operation, without separately picking and placing each individual object CP, thereby significantly reducing the time required for mass transfer. On the other hand, by applying the above-mentioned mass transfer device 100, the objects CP can be arranged in intervals and / or quantities that conform to the final target transfer substrate during the transfer of the entire array of substrates, so that the mass transfer device 100 can transfer all the objects CP on the entire array of substrates to the target substrate at one time, effectively improving the transfer efficiency.

[0029] The mass transfer device 100 can be operated by a mass transfer method such as Figure 2 wherein Figure 2 is a flowchart of the steps of the mass transfer method according to an embodiment of the present invention. Please also refer to Figure 1 and Figure 2 , the mass transfer method of this embodiment includes: detecting the positions of the first substrate SUB1 / second substrate SUB2 to obtain relative position information PDT (step S110); adjusting the relative positions of the picking and placing unit 120 and the carrying unit 110 according to the relative position information PDT (step S120); controlling the picking and placing unit 120 to pick up the object CP from the first substrate SUB1 (step S130); controlling the picking and placing unit 120 to place the picked-up object CP on the second substrate SUB2 (step S140); and outputting energy to the second substrate SUB2 so that the adhesion of the object CP to the second substrate SUB2 is greater than the adhesion of the object CP to the picking and placing unit 120 (step S150).

[0030] Specifically, before performing the above steps, the adhesive substrate (not shown) of the picking and placing unit 120 can be fixed on a clamping mechanism (not shown), and in step S110, the detection unit 130 is used to detect the alignment marks of the first substrate SUB1 / second substrate SUB2 and / or the distance between the picking and placing unit 120 and the first substrate SUB1 / second substrate SUB2 to confirm the relative positional relationship between the adhesive substrate and the first substrate SUB1 / second substrate SUB2, and based on this, generate relative position information PDT, where the alignment marks can be, for example, redundant regions on the first substrate SUB1 / second substrate SUB2 or specific patterns or objects in the redundant regions, and the present invention is not limited thereto. The relative position information PDT can include, for example, the relative displacement amount of the adhesive substrate and the first substrate SUB1 / second substrate SUB2 on a plane, and the distance between the adhesive substrate and the first substrate SUB1 / second substrate SUB2, but the present invention is not limited to this.

[0031] For example, the detection unit 130 can obtain the relative displacement amount of the adhesive substrate and the first substrate SUB1 / second substrate SUB2 on a plane by detecting the alignment marks of the adhesive substrate and the first substrate SUB1 / second substrate SUB2, and obtain the spacing information between the adhesive substrate and the first substrate SUB1 / second substrate SUB2 by recording the displacement amount data of the pick-and-place unit 120 moving to contact the first substrate SUB1 / second substrate SUB2.

[0032] Next, in step S120, the control unit 140 can control the carrier unit 110 and / or the pick-and-place unit 120 to move in two-dimensional or three-dimensional directions according to the relative position information PDT, so that before the pick-and-place unit 120 performs picking and placing, its adhesive substrate is aligned with the first substrate SUB1 on the carrier unit 110 (i.e., pre-alignment). For example, the control unit 140 can respectively control the carrier unit 110 and the pick-and-place unit 120 to relatively translate at a fixed interval, so that the area of the first substrate SUB1 where the target object CP is disposed faces the adhesive substrate of the pick-and-place unit 120.

[0033] After completing the pre-alignment, in step S130, the control unit 140 will control the pick-and-place unit 120 to move toward the first substrate SUB1 on the carrier unit 110 until the adhesive surface of the adhesive substrate contacts the target object CP on the first substrate SUB1, so that the adhesive force of the adhesive substrate acts on the target object CP to be transferred. Then, the control unit 140 will control the pick-and-place unit 120 to move away from the first substrate SUB1, and the target object CP subjected to the adhesive force will move away from the first substrate SUB1 along with the adhesive substrate. Thus, the operation of obtaining the target object CP from the first substrate SUB1 is completed.

[0034] After obtaining the target object CP, in step S140, the control unit 140 will further control the pick-and-place unit 120 to move toward the second substrate SUB2 on the carrier unit 110 so that the target object CP contacts the second substrate SUB2. When the target object CP is placed on the second substrate SUB2, the control unit 110 will further control the carrier unit 110 to output energy to the second substrate SUB2. The output energy will act on the adhesive substrate and / or the second substrate SUB2, so that the adhesion force provided by the second substrate SUB2 to the target object CP is increased and / or the adhesion force provided by the adhesive substrate to the target object CP is decreased, thereby enabling the target object CP to be transferred from the adhesive substrate to the second substrate SUB2.

[0035] In some embodiments, a bonding layer may be disposed on the surface of the second substrate SUB2 that contacts the target object CP. The bonding layer may be implemented using a material that cures upon heating, such as conductive silver paste. In step S150, when the target object CP is placed on the second substrate SUB2, the carrier part 110 may heat the second substrate SUB2 to cure the bonding layer that contacts the target object CP, thereby improving the adhesion of the target object CP to the second substrate SUB2.

[0036] In some embodiments, a microporous structure corresponding to each target object may be provided on the second substrate SUB2 serving as the alignment substrate. In step S150, when the target object CP is placed on the second substrate SUB2, the carrier part 110 may extract the air in the microporous structure to establish a vacuum suction force between the second substrate SUB2 and each target object CP, thereby improving the adhesion of the target object CP to the second substrate SUB2. The structural configuration of this part will be further described in the embodiments of the alignment substrate later.

[0037] The following uses Figure 3 the structure to illustrate a specific implementation example of the mass transfer device, where Figure 3 is a schematic configuration diagram of the mass transfer device according to an embodiment of the present invention. Please refer to Figure 3 In this embodiment, the mass transfer device 200 includes a carrier part 210, a pick-and-place part 220, a detection part 230, and a control part 240. The carrier part 210 includes a first movement control mechanism 211, a carrier platform 212, and a heating component 213; and the pick-and-place part 220 includes a second movement control mechanism 221, a clamping mechanism 222, and a sticky substrate 223. The detection part 230 of this embodiment includes a CCD sensor, and the target object CP to be transferred is, for example, an LED chip (subsequently described as "LED chip CP"), but the present invention is not limited thereto.

[0038] Specifically, in the carrier part 210, the carrier platform 212 is disposed on the first movement control mechanism 211 and is used to carry the substrate SUB (which may be the substrate to be transferred or the target substrate). Although only a single carrier platform 212 is shown in the drawings as an example, the present invention is not limited thereto. In some embodiments, the carrier part 210 may also include a plurality of carrier platforms for respectively carrying the substrate to be transferred (such as the aforementioned first substrate SUB1) and the target substrate (such as the aforementioned second substrate SUB2).

[0039] The first movement control mechanism 211 may be driven by the control part 240 or manually to drive the carrier platform 212 to move in the x-z plane (which may be translation or rotation). The heating component 213 is in contact with the carrier platform 212 and is controlled by the control part 240 to heat the carrier platform 212 so that heat can be transferred to the substrate SUB through the carrier platform 212.

[0040] In the pick-and-place unit 220, the clamping mechanism 222 is disposed on the second movement control mechanism 221 and is used to fix the adhesive substrate 223 so that the adhesive substrate 223 and the carrier platform 212 are substantially parallel. The way to fix the adhesive substrate 223 can be to engage the adhesive substrate 223 by a specific structural configuration or to fix the adhesive substrate 223 on the clamping mechanism 222 by adsorption.

[0041] The second movement control mechanism 221 can be configured on the same x-z plane as the first movement control mechanism 211 and can be controlled by the control unit 240 or manually operated to drive the clamping mechanism 222 and the adhesive substrate 223 to move on the x-z plane. In other words, by controlling the first movement control mechanism 211 and the second movement control mechanism 221, a relative displacement can be made between the substrate SUB and the adhesive substrate 223.

[0042] The clamping mechanism 222 can also be controlled by the control unit 240 or manually operated to move on the y-axis perpendicular to the x-z plane, so that the adhesive substrate 223 can be driven to approach or move away from the carrier platform 212. In other words, the clamping mechanism 222 can control the movement of the adhesive substrate in three-dimensional directions through the configuration of the second movement control mechanism 221 and the clamping mechanism 222.

[0043] The adhesive substrate 223 can include a rigid layer and an adhesive layer disposed on one side of the rigid layer. The rigid layer can be implemented, for example, with a glass substrate, and the adhesive layer can be implemented, for example, with a polydimethylsiloxane (PDMS) film. In addition, the adhesive layer of the adhesive substrate 223 can be set as Figure 3 a comb-like structure (i.e., having protrusions arranged at fixed intervals), where the protruding portions can be used to contact the LED chips CP on the substrate SUB, but the adhesive substrate 223 of the present invention is not limited to this structure.

[0044] The CCD sensor of the detection unit 230 is configured to take an image in the direction of the carrier platform 212 so that when the substrate SUB is placed on the carrier platform 212, the substrate SUB will be within the image sensing range of the CCD sensor. The image information captured by the CCD sensor will be transmitted as relative position information PDT to the control unit 240.

[0045] In some embodiments, the mass transfer device 100 / 200 may further include an aligning unit, herein Figure 3The following describes the alignment acting part 250 shown in the figure. The alignment acting part 250 can be arranged on the carrying part 210 to apply a force to the substrate SUB on the carrying part 210 and the LED chips CP on the substrate SUB, so that the LED chips CP can be neatly arranged at the corresponding positions on the substrate SUB. In this embodiment, the alignment acting part 250 can be, for example, arranged at the bottom of the carrying platform 212, and when the alignment acting part 250 acts, the acting force will be applied to the substrate SUB through the carrying platform 212, but the present invention is not limited thereto.

[0046] Specifically, when the aligned substrate is placed on the carrying platform 212, the LED chips CP may be scattered on the aligned substrate and do not fall into the corresponding slots. The alignment acting part 250 can provide a force in this case to make the LED chips CP fall into the corresponding slots. The force provided by the alignment acting part 250 can be, for example, vibration, vacuum suction, etc. For example, in an example where the alignment acting part 250 provides vibration as the acting force, the alignment acting part 250 can be, for example, a plurality of vibration mechanisms (such as voice coil motors), which can provide multi-dimensional vibration forces to make the LED chips CP scattered on the aligned substrate fall into the slots.

[0047] In some embodiments, the alignment acting part 250 can, for example, include at least three vibration mechanisms, wherein one of the three vibration mechanisms causes vibration in the first direction, another one of the three vibration mechanisms causes vibration in the second direction, and the remaining vibration mechanism causes vibration in the third direction. Any one of the above first to third directions is substantially parallel to the normal direction of the plane formed by the remaining two directions. For example, the three vibration mechanisms can be, for example, a first vibration mechanism (not shown), a second vibration mechanism (not shown), and a third vibration mechanism (not shown), wherein the first vibration mechanism causes up and down vibration, the second vibration mechanism causes left and right vibration, and the third vibration mechanism causes front and back vibration. In this way, through multi-dimensional vibration, it is easier to make the LED chips CP fall into the slots of the aligned substrate.

[0048] In some embodiments, the carrying platform 212 can also be provided with a plurality of grooves communicating with the alignment acting part 250, wherein the alignment acting part 250 can adsorb the substrate SUB and / or the LED chips CP on the substrate SUB on the carrying platform 212 by evacuating the grooves of the carrying platform 212.

[0049] The following respectively uses Figures 4A to 4F and Figures 5A to 5L to illustrate the specific processes of operating the mass transfer device 200 for mass transfer in different embodiments. Among them, Figures 4A to 4F describes the action process of the mass transfer device 200 directly transferring LED chips from the source substrate to the target substrate, andFigures 5A to 5L It describes the operation process of the mass transfer device 200 to first transfer the LED chips from the source substrate to the alignment substrate, and then transfer the LED chips on the alignment substrate to the target substrate.

[0050] Please first refer to Figure 3 and Figures 4A to 4F , where Figures 4A to 4F is a schematic flow chart of mass transfer by the mass transfer device according to some embodiments of the present invention. As Figure 4A shown, the source substrate SUBs in this embodiment is taken as an example with a configuration having 3×3 array slots CAV (but the present invention is not limited thereto), and each slot CAV can accommodate one LED chip CP. In other words, the LED chips CP will be arranged in a 3×3 array on the source substrate SUBs. On the other hand, the comb-like protrusion structure on the adhesive substrate 223 will also be configured in a 3×3 array corresponding to the slots CAV.

[0051] When the mass transfer device 200 starts to operate, the carrier part 210 and the pick-and-place part 220 will perform pre-alignment to confirm the horizontal displacement amount W1 in the x-z plane between the protrusions on the adhesive substrate 223 and the corresponding slots CAV, and the vertical spacing L1 between the adhesive substrate 223 and the source substrate SUBs on the y-axis. The above-mentioned action of confirming the horizontal displacement amount W1 can be achieved by detecting the alignment marks of the source substrate SUBs and the adhesive substrate 223 through the CCD sensor of the detection part 230. The above-mentioned action of confirming the vertical spacing L1 can be achieved by moving the adhesive substrate 223 to the redundant area of the source substrate SUBs, and controlling the clamping mechanism 222 to drive the adhesive substrate 223 to move towards the redundant area of the source substrate SUBs until it contacts the redundant area, and calculating the vertical spacing L1 between the source substrate SUBs and the adhesive substrate 223 on the y-axis based on the recorded movement data.

[0052] After obtaining the relative position information such as the horizontal displacement amount W1 and the vertical spacing L1, as Figure 4B shown, the source substrate SUBs and the adhesive substrate 223 will be relatively moved to align the LED chips CP with the corresponding protrusions on the adhesive substrate 223. Then, as Figure 4C shown, the adhesive substrate 223 will move towards the source substrate SUBs based on the detected vertical spacing L1, so that the protruding part contacts the corresponding LED chip CP.

[0053] At this time, due to the adhesive force of the adhesive substrate 223 acting on the LED chip CP, the LED chip CP will adhere to the adhesive substrate 223, and the LED chip CP will be taken away from the source substrate SUBs when the adhesive substrate 223 moves away from the source substrate SUBs. That is, at this time, the LED chips CP on the source substrate SUBs are transferred to the adhesive substrate 223.

[0054] AsFigure 4D As shown, the position of the adhesive substrate 223 is re-corrected to a position aligned with the target substrate SUBt. The correction process can be similar to the pre-alignment process described in Figure 4A and Figure 4B However, the present invention is not limited thereto. In this embodiment, the target substrate SUBt includes, for example, a support layer SL and a bonding layer BL provided on the support layer SL. The bonding layer BL can be implemented using a material that is heat-curable, such as conductive silver paste. When the target substrate SUBt is placed on the carrier platform 212, the bonding layer BL is located on the side close to the adhesive substrate 223.

[0055] In some embodiments, the control unit 240 can also calculate the vertical distance L2 based on the pre-positioning data according to the input parameters of the target substrate SUBt. For example, the user can pre-enter the thicknesses of the LED chip CP and the bonding layer BL. Therefore, when performing the alignment correction of the adhesive substrate 223 and the target substrate SUBt, the displacement amount of the adhesive substrate 223 (equal to the vertical distance L1 - LED chip thickness - bonding layer BL thickness), that is, the vertical distance L2, can be calculated according to the pre-alignment vertical distance L1 and the thicknesses of the LED chip CP and the bonding layer BL.

[0056] As Figure 4E shown, when the position of the adhesive substrate 223 is corrected, the clamping mechanism 222 drives the adhesive substrate 223 to move towards the target substrate SUBt so that the LED chip CP contacts the bonding layer BL of the target substrate SUBt. After the LED chip CP contacts the target substrate SUBt, the heating component 213 is activated to heat the target substrate SUBt through the carrier platform 212. The heated bonding layer BL gradually cures, and the adhesion of the LED chip CP to the target substrate SUBt gradually increases.

[0057] After a set heating time, the clamping mechanism 222 drives the adhesive substrate 223 to move away from the target substrate SUBt, as Figure 4F shown. At this time, since the adhesion of the LED chip CP to the target substrate SUBt is greater than the adhesion to the adhesive substrate 223, the LED chip CP detaches from the adhesive substrate 223 and is transferred and fixed to the target substrate SUBt, thus completing the transfer process.

[0058] In some embodiments, the set heating temperature of the heating component 213 can be, for example, 120 °C, and the set heating time can be, for example, 30 minutes, but the present invention is not limited thereto.

[0059] Through the above-mentioned mass transfer process, the mass transfer device 200 can use the adhesive substrate 223 to transfer all the LED chips CP on the source substrate SUBt to the target substrate SUBt at one time, so the efficiency of mass transfer can be effectively improved.

[0060] Please refer to Figure 3 and Figures 5A to 5L , in which Figures 5A to 5L is a schematic flow diagram of mass transfer by the mass transfer device according to some other embodiments of the present invention. The main difference between this embodiment and the aforementioned Figures 4A to 4F embodiment is that in this embodiment, the mass transfer device 200 will first transfer the source substrate SUBs to the entire row substrate SUBa corresponding to the size of the target substrate SUBt, and then transfer all the LED chips CP on the entire row substrate SUBa to the target substrate SUBt at one time. In this way, the operation of transferring the LED chips CP from the small-sized source substrate SUBs to the large-sized target substrate SUBt can be realized.

[0061] Specifically, in this embodiment, the pick-and-place unit 220 includes a plurality of replaceable adhesive substrates 223_1 and 223_2, where the adhesive substrate 223_1 is used for transferring the LED chips CP between the source substrate SUBs and the entire row substrate SUBa, and the adhesive substrate 223_2 is used for transferring the LED chips CP between the entire row substrate SUBa and the target substrate SUBt.

[0062] As Figure 5A shown, the source substrate SUBs in this embodiment takes the configuration with 5×3 array slots CAV1 as an example (but the present invention is not limited thereto), and one LED chip CP can be accommodated in each slot CAV1. In other words, the LED chips CP are arranged in a 5×3 array on the source substrate SUBs. On the other hand, the comb-like protrusion structure on the first adhesive substrate 223_1 corresponding to the source substrate SUBs is configured in a 3×3 array.

[0063] When the mass transfer device 200 starts to operate, the carrier unit 210 and the pick-and-place unit 220 perform pre-alignment to confirm the horizontal displacement amount W1 in the x-z plane between the protrusions on the first adhesive substrate 223_1 and the corresponding slots CAV1, and the vertical spacing L1 between the adhesive substrate 223 and the source substrate SUBs on the y-axis. The action of confirming the horizontal displacement amount W1 can be achieved by detecting the alignment marks of the source substrate SUBs and the first adhesive substrate 223_1 through the CCD sensor of the detection unit 230. The action of confirming the vertical spacing L1 can be achieved by moving the first adhesive substrate 223_1 to the redundant area of the source substrate SUBs, and controlling the clamping mechanism 222 to drive the first adhesive substrate 223_1 to move towards the redundant area of the source substrate SUBs until it contacts the redundant area, and calculating the vertical spacing L1 between the source substrate SUBs and the first adhesive substrate 223_1 on the y-axis based on the recorded movement data.

[0064] After obtaining the relative position information such as the horizontal displacement amount W1 and the vertical spacing L1, as Figure 5B shown, the source substrate SUBs and the first adhesive substrate 223_1 are relatively moved to align the LED chips CP with the corresponding protrusions on the adhesive substrate 223. Then, as Figure 5C shown, the first adhesive substrate 223_1 moves towards the source substrate SUBs based on the detected vertical spacing L1, so that the protruding portions contact the corresponding LED chips CP.

[0065] At this time, as Figure 5D shown, since the adhesive force of the first adhesive substrate 223_1 acts on some of the LED chips CP of the source substrate SUBs, the LED chips CP in contact with the first adhesive substrate 223_1 will adhere to the adhesive substrate 223, and when the first adhesive substrate 223_1 moves away from the source substrate SUBs, these LED chips CP will be taken away from the source substrate SUBs. That is, at this time, some of the LED chips CP on the source substrate SUBs are transferred to the first adhesive substrate 223_1.

[0066] Next, as Figure 5E and Figure 5F shown, the position of the first adhesive substrate 223_1 is re-calibrated to the position aligned with the whole row substrate SUBa, and it moves towards the whole row substrate SUBa to place the LED chips CP in the corresponding slots CAV2 of the whole row substrate SUBa. In this embodiment, the whole row substrate SUBa is configured with slots CAV2 arranged in a 9×9 array as an example, and each slot CAV2 can also accommodate one LED chip CP, but the present invention is not limited to this. Figure 5F Illustrated is an example where the first adhesive substrate 223_1 places the LED chips CP arranged in a 3×3 array in the upper left corner 3×3 empty slots of the whole row substrate SUBa.

[0067] In this embodiment, the carrier portion 210 can apply forces such as suction force or adhesive force to the slot CAV2 where the LED chip CP is placed, so that the adhesion of the LED chip CP to the entire substrate SUBa is greater than the adhesion of the LED chip CP to the first adhesive substrate 223_1. The first adhesive substrate 223_1 will then move in a direction away from the entire substrate SUBa. At this time, the LED chip CP originally on the first adhesive substrate 223_1 will be transferred to the corresponding slot CAV2 of the entire substrate SUBa.

[0068] Next, the mass transfer device 200 will repeat Figures 5A to 5F the above operation to sequentially transfer the LED chips CP on multiple source substrates SUBs to the empty slots CAV2 of the entire substrate SUBa until all the slots CAV2 of the entire substrate SUBa are filled with the LED chips CP, as Figure 5G shown.

[0069] After all the LED chips CP are transferred to the entire substrate SUBa, the first adhesive substrate 223_1 of the pick-and-place portion 220 will be replaced with a second adhesive substrate 223_2 having a comb-like protrusion structure arranged in a 9×9 array, and a similar Figures 5A to 5D step process as above will be executed to transfer all the LED chips CP on the entire substrate SUBa to the second adhesive substrate 223_2, as Figure 5I shown.

[0070] Next, as Figure 5J shown, the position of the second adhesive substrate 223_2 will be re-calibrated to a position aligned with the target substrate SUBt. The calibration process can be similar to the pre-alignment process described in Figure 4A and Figure 4B , but the present invention is not limited thereto. In this embodiment, the configuration of the target substrate SUBt is similar to that of the foregoing embodiment, and the difference is only in the size, which will not be repeated here.

[0071] As Figure 5K shown, when the position of the second adhesive substrate 223_2 is calibrated, the clamping mechanism 222 will drive the second adhesive substrate 223_2 to move towards the target substrate SUBt so that the LED chip CP contacts the bonding layer BL of the target substrate SUBt. After the LED chip CP contacts the target substrate SUBt, the heating component 213 will be activated to heat the target substrate SUBt through the carrier platform 212. The heated bonding layer BL will gradually solidify, and the adhesion of the LED chip CP to the target substrate SUBt will gradually increase.

[0072] After a set heating time, the clamping mechanism 222 drives the second adhesive substrate 223_2 to move away from the target substrate SUBt, as Figure 5L shown. At this time, since the adhesion of the LED chip CP to the target substrate SUBt is greater than the adhesion to the second adhesive substrate 223_2, the LED chip CP will detach from the second adhesive substrate 223_2 and be transferred and fixed onto the target substrate SUBt, thus completing the transfer process.

[0073] It should be noted here that in the cross-sectional structure shown in the above Figures 4A to 5L embodiment, in order to clearly show the relative configuration relationship between the LED chip CP and the source substrate SUBs / assembly substrate SUBs / target substrate SUBt, it is shown as a structure where the LED chip CP protrudes from the source substrate SUBs / assembly substrate SUBs / target substrate SUBt, but the present invention is not limited thereto. In actual applications, according to the structural design of the source substrate SUBs / assembly substrate SUBs / target substrate SUBt, the LED chip CP can also be configured to have the same height as the source substrate SUBs / assembly substrate SUBs / target substrate SUBt (i.e., the top of the LED chip CP is generally in the same plane as the top surface of the source substrate SUBs / assembly substrate SUBs / target substrate SUBt), or be configured to be slightly lower than the height of the source substrate SUBs / assembly substrate SUBs / target substrate SUBt (i.e., the top of the LED chip CP is slightly lower than the top surface of the source substrate SUBs / assembly substrate SUBs / target substrate SUBt), where the top surface of the source substrate SUBs / assembly substrate SUBs / target substrate SUBt refers to the surface on the side away from the carrier platform 212.

[0074] Figure 6A and Figure 6B are schematic diagrams of the structural configuration of the assembly substrate of some embodiments of the present invention, where Figure 6A is a top view structural schematic diagram of the assembly substrate SUBa, and Figure 6B is a cross-sectional structural schematic diagram of the assembly substrate SUBa on the cutting line AA'. Please refer to Figure 6A and Figure 6B simultaneously. The assembly substrate SUBa of this embodiment includes a main body BD and a plurality of slots CAV formed on the main body BD and arranged in an array, where the size of each slot CAV is designed to roughly correspond to the size of a single LED chip CP. Looking from the appearance, the slot CAV is a recessed accommodation space on the main body BD. When the LED chip CP is placed in the slot CAV, the bottom or top of the LED chip CP can be roughly flat against the bottom surface of the slot CAV. In other words, when the LED chip CP is placed in the slot CAV, the bottom surface of the slot CAV will be roughly parallel to the bottom or top of the LED chip CP.

[0075] Through the above configuration of the alignment substrate SUBa, when the alignment action part acts, the LED chip CP can fall into the corresponding slot CAV, so as to realize the neat arrangement of the LED chips CP. Further below, Figure 7A and Figure 7B are used to illustrate the structural design of the alignment substrate SUBa in different embodiments.

[0076] Figure 7A and Figure 7B are schematic cross-sectional structural diagrams of the alignment substrates in different embodiments of the present invention. Each of the attached drawings shows the structural configuration of a single slot as an example. Those skilled in the art should understand that the slot structures described in each embodiment can be applied to at least part / all of the slots of the alignment substrate. In addition, the following described embodiments of each alignment substrate are mainly described in a two-dimensional cross-sectional structure. Therefore, only the width (the horizontal distance of the drawing; that is, the x-direction distance) and height (the vertical distance of the drawing; that is, the y-direction distance) of the LED chip / slot will be shown on the drawing. However, those skilled in the art should understand that the design consideration of the length (the normal direction distance of the drawing; that is, the z-direction distance) of the LED chip / slot is similar to the width of the LED chip / slot. Therefore, although the subsequent embodiments are described mainly in terms of width, those skilled in the art should be able to understand the design consideration of the length of the LED chip / slot based on the relevant description.

[0077] Please first refer to Figure 7A . In this embodiment, the alignment substrate SUBa1 includes a cubic slot CAV. The cubic slot CAV can be used to accommodate the LED chip CPa which is also cubic. The width of the LED chip CPa is Wcp, the height is Hcp, and the width of the slot CAV is Wa, and the depth is Ha.

[0078] In this embodiment, the width Wa of the slot CAV is designed to be slightly larger than the width Wcp of the LED chip CPa, and the depth Ha of the slot CAV is designed to be slightly larger than the height Hcp of the LED chip CPa.

[0079] In some embodiments, the width Wa of the slot CAV is designed to be between 101% and 140% of the width Wcp of the LED chip CPa, so as to prevent multiple LED chips CPa from falling into the same slot CAV. Since LED chips CPa with different emission wavelengths may have different sizes, the width Wcp of the LED chip CPa described here can be determined based on the LED chip CPa with the largest width, but the present invention is not limited thereto.

[0080] In some embodiments, the depth Ha of the slot CAV is designed to be between 101% and 140% of the height Hcp of the LED chip CPa, preferably between 101% and 110% for example, to prevent the LED chip CPa that has fallen into the slot CAV from being shaken or affected by other forces and running out of the slot CAV later, or for two LED chips CPa to enter the same slot. Similarly, the height Hcp of the LED chip CPa described herein can be determined based on the LED chip CP with the maximum height, but the present invention is not limited thereto.

[0081] For example, if the width Wcp / height Hcp of the LED chip CPa is 5 μm, the width Wa / depth Ha of the slot CAV can be designed to be between 5.25 μm and 6.5 μm.

[0082] Please refer to Figure 7B , this embodiment illustrates an implementation example of another slot CAV structure. In this embodiment, the slots CAV on the entire substrate SUBa2 are designed to accommodate the LED chip CPb with a double-layer structure. Specifically, the LED chip CPb with a double-layer structure includes a first part P1 and a second part P2, where both the first part P1 and the second part P2 can be, for example, cube-shaped structures, and the first part P1 is formed on one side (the upper side in the drawing) of the second part P2.

[0083] In this embodiment, the width Wcp1 of the first part P1 is smaller than the width Wcp2 of the second part P2, and the sum of the height Hcp1 of the first part P1 and the height Hcp2 of the second part P2 (i.e., the height of the LED chip CPb) is greater than the width Wcp1 of the first part P1. In other words, the LED chip CPb has a structure similar to a "convex" shape.

[0084] On the other hand, the slot CAV of this embodiment is arranged corresponding to the double-layer structure of the LED chip CPb. The slot CAV includes a first sidewall SW1, a second sidewall SW2, a first bottom surface BS1, and a second bottom surface BS2. The first sidewall SW1 surrounds the periphery of the first bottom surface BS1, and the bottom of the first sidewall SW1 is connected to the first bottom surface BS1. The space (hereinafter referred to as the first accommodation space) jointly defined by the first sidewall SW1 and the first bottom surface BS1 is used to accommodate the first part P1 of the LED chip CPb, where the height of the first sidewall SW1 is Ha1, and the width defined by the first bottom surface BS1 is Wa1. One side of the second bottom surface BS2 is connected to the top of the first sidewall SW1. The second sidewall SW2 surrounds the periphery of the second bottom surface BS2, and the bottom of the second sidewall SW2 is connected to the other side of the second bottom surface BS2. The space jointly defined by the second sidewall SW2, the first bottom surface BS1, and the second bottom surface BS2 (i.e., the space in the slot CAV that does not overlap with the first accommodation space, hereinafter referred to as the second accommodation space) is used to accommodate the second part P2 of the LED chip CPb, where the height of the second sidewall SW2 is Ha2, and the sum of the widths of the first bottom surface BS1 and the second bottom surface BS2 is Wa2.

[0085] Specifically, the slot CAV of this embodiment forms a groove corresponding to the double-layer structure LED chip CPb in a "convex" shape, where the width Wa1 is smaller than the width Wa2. In some embodiments, the width Wa2 may be 110% to 200% of the width Wa1, but the present invention is not limited thereto. In addition, in this embodiment, the sum of the heights Ha1 and Ha2 (i.e., the depth of the slot CAV) is designed to be greater than the width Wa1 to limit that the LED chip CPb can correctly fall into the slot CAV only when the first part P1 faces the first accommodation space (i.e., the first part P1 is located in the first accommodation space, and the second part P2 is located in the second accommodation space).

[0086] In some embodiments, the width Wa1 / Wa2 of the slot CAV may be 101% to 140% of the width Wcp1 / Wcp2 of the LED chip CPb, and the depth Ha1 / Ha2 of the slot CAV may be 101% to 140% of the height Hcp1 / Hcp2 of the LED chip CPb, but the present invention is not limited thereto.

[0087] In some embodiments, the width Wa2 may be, for example, a value selected from the numerical range greater than 5 μm and less than 100 μm, but the present invention is not limited thereto either.

[0088] With the above structural configuration, if the LED chip CPb falls into the slot CAV at an angle where the first part P1 is not facing the first accommodating space, it will be easily shaken out of the slot CAV during the process of the overall columnar force acting. Therefore, it can be avoided that the LED chip CPb is placed into the slot CAV of the overall columnar substrate in an unexpected manner, resulting in subsequent failure of mass transfer. On the other hand, once the LED chip CPb correctly falls into the slot CAV, during the process of vibration or being subjected to other forces, the LED chip CPb is more likely to be restricted by the side walls SW1 / SW2 and the bottom surface BS1 / BS2 and is not easily shaken out of the slot CAV again. Therefore, the overall columnar success rate of the overall columnar substrate can be ensured. To sum up, the mass transfer device and the mass transfer method proposed in the embodiments of the present invention can use the viscous substrate configuration with a rigid layer and a viscous layer to realize the transfer of the target object on the source substrate to the target substrate in a single action, thereby effectively improving the efficiency of mass transfer. In addition, through the application of the intermediate overall columnar substrate, the mass transfer device in the embodiments of the present invention can arrange the target objects on the source substrate according to the required size of the target substrate first, and then transfer all the target objects aligned by the overall columnar substrate to the target substrate at one time, further improving the efficiency of mass transfer between substrates of different sizes. In addition, the overall columnar substrate proposed in the embodiments of the present invention can form a slot structure adaptable to the LED chip with a double-layer structure, so that the LED chip can correctly fall into the corresponding slot during the overall columnar process and is not easily shaken out again after falling into the slot, thereby improving the overall columnar success rate.

[0089] Although the present invention has been disclosed by using the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications to the above embodiments without departing from the spirit and scope of the present invention, and these still belong to the technical scope protected by the present invention. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A mass transfer device, characterized in that, Comprising: A carrying part, adapted to fix a whole row of substrates; And A whole row acting part, disposed on the carrying part, for applying a force to the whole row of substrates on the carrying part, so that the LED chips on the whole row of substrates are neatly arranged to corresponding positions on the whole row of substrates.

2. The mass transfer device according to claim 1, wherein the whole row acting part comprises: A first vibration mechanism, for causing vibration in a first direction; A second vibration mechanism, for causing vibration in a second direction; And A third vibration mechanism, for causing vibration in a third direction, wherein any one of the first to third directions is substantially parallel to the normal direction of the plane formed by the remaining two directions.

3. A whole row substrate, comprising: A body; A plurality of slots arranged in an array, formed on the body, wherein at least one of the slots includes the following structure: A first bottom surface; A first side wall, surrounding the periphery of the first bottom surface, and the bottom of the first side wall is connected to the first bottom surface; A second bottom surface, one side of which is connected to the top of the first side wall; And A second side wall, surrounding the periphery of the second bottom surface, and the bottom of the second side wall is connected to the other side of the second bottom surface, wherein the total height of the first side wall and the second side wall is greater than the width of the first bottom surface.

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