High-precision chip mounting equipment and mounting method

Abstract

The invention discloses high-precision chip mounting equipment and a mounting method. The high-precision chip mounting equipment comprises a transfer mounting unit, a chip feeding unit and an adjusting platform, wherein the chip feeding unit and the adjusting platform are sequentially arranged in the conveying direction; the chip feeding unit is used for providing chips of different specifications for the transferring and mounting unit and roughly adjusting the angles of the chips needing to be picked up. The transfer mounting unit is used for moving a chip on the chip feeding unit to the adjusting platform, and the adjusting platform is used for finely adjusting the chip; and the transferring and mounting unit picks up the chip on the adjusting platform and then finely adjusts the chip. According to the invention, the angle of the chip is adjusted for three times in the process from feeding to mounting, the angle of the chip can be greatly adjusted before the chip is preliminarily picked up, and only the angle of the chip needs to be finely adjusted subsequently, so that the high-precision mounting requirement of the chip is met.

Description

Technical Field

[0001] This application relates to the technical field of chip mounting, and particularly relates to a high-precision chip mounting device and a mounting method. Background Art

[0002] As a core component of electronic communication products such as optical modules, the mounting of chips is an important process content during the manufacturing of electronic communication products. Due to the small size of chips and the high requirement for position accuracy during mounting, it is difficult to complete the mounting by pure handwork. Therefore, there is a need for automation in chip mounting. Although existing chip mounting devices can meet the automation requirements for chip mounting, they usually perform a calibration on the chip after picking it up before mounting. After picking up the chip through the mounting mechanism from the feeding device and placing it on the transfer table for adjustment, and then picking it up again through the mounting mechanism for mounting after the adjustment is completed; due to the large skew angle of the chip picked up for the first time, the time for adjusting the chip angle is long, and it is difficult to meet the requirements of high-precision mounting through a single adjustment. Summary of the Invention

[0003] This application provides a high-precision chip mounting device and a mounting method, which can coarsely adjust, finely adjust, and finely tune the chip angle in sequence before mounting, greatly adjust the chip before initially picking it up, shorten the chip angle adjustment time, and meet the requirements of high-precision mounting through three adjustments. The following technical solutions are adopted: A high-precision chip mounting device includes a transfer and mounting unit, as well as a chip feeding unit and an adjustment platform arranged in sequence along the conveying direction; The chip feeding unit is used to provide chips of different specifications for the transfer and mounting unit and coarsely adjust the angle of the chips to be picked up; The transfer and mounting unit is used to move the chips on the chip feeding unit to the adjustment platform, and the adjustment platform is used to finely adjust the chips; After the transfer and mounting unit picks up the chips on the adjustment platform, it then finely tunes the chips.

[0004] Preferably, the chip feeding unit includes a support platform that can rotate around its own axis, and an xy moving module that drives the support platform to move. A number of trays that can rotate synchronously are distributed on the support platform, and any one of the trays can rotate by itself.

[0005] Preferably, a carrier horizontal translation unit for adjusting the position of the carrier is arranged on one side of the adjustment platform. The transfer and mounting unit includes a horizontal translation platform arranged along the conveying direction, as well as a transfer mechanism and a mounting mechanism that move along the horizontal translation platform. The transfer mechanism is located between the chip feeding unit and the adjustment platform, and the mounting mechanism is located between the adjustment platform and the carrier horizontal translation unit.

[0006] Further preferably, the mounting mechanism includes a picking component, a yz moving module for driving the picking component to move, and a fine-tuning mechanism for swinging and adjusting the angle of the picking component around the z-axis. The picking component is provided with a through perforation structure, and the picking component provides a mounting pressure through a pressure regulating component to control the chip mounting force.

[0007] Further preferably, the picking component includes an air bearing and a nozzle component. The air bearing includes a bearing seat and a driving shaft slidably supported in the bearing seat by an air film. The nozzle component is connected to the bottom of the driving shaft, and a sealed driving cavity communicating with the pressure regulating component is formed between the driving shaft and the bearing seat. The picking component is connected to the yz moving module through the fine-tuning component.

[0008] Further preferably, the perforation structure includes a through hole provided on the nozzle component, a placement groove for placing a transparent plate, and a vertical groove provided on the driving shaft. The placement groove communicates with the through hole, and the angle of the chip picked up by the nozzle component can be observed through the vertical groove.

[0009] Further preferably, it further includes a vision detection unit for detecting the angle and state of the chip. The vision detection unit includes a first detection component, a second detection component, and a third detection component that are respectively arranged opposite to the chip loading unit, the adjustment platform, and the carrier transverse movement unit.

[0010] Preferably, it further includes a glue dipping unit. The glue dipping unit includes a linear driving mechanism, and a dispensing mechanism and a glue scraping mechanism that move along the y-axis direction and are provided on the linear driving mechanism.

[0011] Preferably, it further includes a nozzle storage unit. The nozzle storage unit includes a first supply device for providing nozzles for the transfer mechanism and a second supply device for providing nozzles for the mounting mechanism.

[0012] This application also provides a chip mounting method, including the above high-precision mounting device, and further including the following steps: Loading: Placing chips of different specifications on the chip loading unit; Coarse adjustment: The chip loading unit cooperates with the vision detection unit to adjust the chips of the required mounting specification to the picking station and perform the first adjustment on the angle of the chips to be picked up. Transfer: After the transfer mechanism picks up the corresponding chips at the picking station, it transfers the chips to the adjustment platform. Fine adjustment: The adjustment platform cooperates with the vision detection unit to perform the second adjustment on the chips. Fine adjustment: The mounting mechanism picks up the chip on the adjustment platform and moves it below the vision detection unit, and cooperates with the vision detection unit to detect the angle of the chip picked up by the mounting mechanism, and the mounting mechanism makes a third adjustment to the picked-up chip; Mounting: The mounting mechanism cooperates with the vision detection unit to determine the mounting position on the carrier board of the carrier board transverse movement unit, and mounts the picked-up chip on the corresponding mounting position.

[0013] Compared with the prior art, the beneficial effects of the present application are: (1) Before chip mounting, the present application adjusts the chip angle by sequentially performing rough adjustment, fine adjustment and fine adjustment on the chip, and before initially picking up the chip, the chip feeding device can greatly adjust the chip angle, and only fine adjustment of the chip angle is required subsequently, which can shorten the chip angle adjustment time; through the three adjustments of the chip, the chip is ensured to be in a horizontal state, the mounting accuracy after mounting is improved, and the mounting quality of the product is ensured.

[0014] (2) The chip feeding unit can greatly adjust the chip angle by driving movement, rotation and self-rotation, and at the same time can improve the feeding speed of the chip and improve the mounting efficiency.

[0015] (3) The transfer mechanism and the mounting mechanism pick up and mount the chip in sequence, avoiding long-distance reciprocating movement to pick up and mount the chip, and can improve the mounting efficiency.

[0016] (4) The mounting mechanism realizes driving the picking component to apply a mounting force to the chip by precisely controlling the air pressure, with high force control accuracy, simple structure, small volume and light overall weight; the cooperation with the perforated structure is convenient for observing the chip angle state and making adjustments, and the mounting accuracy is high. Description of the Drawings

[0017] Figure 1 is the chip skew schematic diagram of the present application (the dotted line is the chip in the inclined state); Figure 2 is the three-dimensional structure schematic diagram of the present application; Figure 3 is the front view of the present application; Figure 4 is the three-dimensional structure schematic diagram of the chip feeding unit of the present application; Figure 5 is the structure schematic diagram of the mounting mechanism of the present application; Figure 6 is the structure schematic diagram of the picking component of the present application; Figure 7 is the internal structure schematic diagram of the picking component of the present application.

[0018] In the figure: 1. Chip loading unit, 10. XY moving module, 20. Support platform, 30. Tray; 2. Adjustment platform, 21. Suction platform, 22. Fine adjustment mechanism, 3. Carrier plate transverse movement unit; 4. Transfer and mounting unit, 41. Transfer mechanism, 42. Mounting mechanism, 421. Pick-up component, 4211. Air floating bearing, 42111. Drive shaft, 42112. Bearing seat, 4212. Nozzle component, 42121. Connection part, 42122. Nozzle, 4213. First air supply channel, 4214. Second air supply channel, 4215. Vertical groove, 4216. Through hole, 4217. Placement groove, 4218. Limiting component, 422. Fine adjustment mechanism, 423. YZ moving module, 424. Pressure adjustment component, 43. Transverse movement platform; 5. Vision detection unit, 51. First detection component, 52. Second detection component, 53. Third detection component, 6. Carrier plate loading unit, 7. Glue dipping unit, 71. Linear drive mechanism, 72. Dispensing mechanism, 73. Glue removing mechanism, 8. Nozzle storage unit, 81. First supply device, 82. Second supply device, 100. Drive cavity, 1000. Chip. Detailed implementation manners

[0019] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings of the present application. Obviously, the described embodiments of the present application are only partial embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0020] Refer to Figures 2 to 7 , and further elaborate on the present application in detail: In combination with Figure 2 , a high-precision chip mounting device includes a transfer and mounting unit 4 and a vision detection unit 5, and a chip loading unit 1, an adjustment platform 2, and a carrier plate transverse movement unit 3 for adjusting the position of the carrier plate that are sequentially arranged along the conveying direction (x-axis direction); the chip loading unit 1 is used to provide different specifications of chips for the transfer and mounting unit 4 and preliminarily adjust the angle of the chips to be picked up.

[0021] In combination with Figure 2, the vision detection unit 5 is used to detect the chip angle and status; the vision detection unit 5 is located at the top in the conveying direction; among them, the vision detection unit 5 includes a first detection component 51, a second detection component 52, and a third detection component 53 that are respectively arranged opposite to the chip loading unit 1, the adjustment platform 2, and the carrier plate transverse movement unit 3. The first detection component 51 is used to cooperate with the chip loading unit 1 to move the chip to be picked up to the picking station of the transfer and mounting unit 4 and roughly adjust the chip angle; the second detection component 52 is used to cooperate with the adjustment platform 2 to finely adjust the chip thereon; the third detection component 53 is used to cooperate with the carrier plate transverse movement unit 3 to determine the chip mounting position.

[0022] The transfer and mounting unit 4 is used to transfer or mount chips between the chip loading unit 1 and the adjustment platform 2, and between the adjustment platform 2 and the carrier plate transverse movement unit 3. The adjustment platform 2 is used to finely adjust the chips; after picking up the chips on the adjustment platform 2, the transfer and mounting unit 4 finely adjusts the chips by cooperating with the vision detection unit 5 and fits them on the carrier plate.

[0023] Compared with the prior art, before chip mounting, in this application, the chip angle is adjusted three times by sequentially performing rough adjustment, fine adjustment, and fine tuning on the chip, thereby improving the chip mounting quality and the mounting quality; before the chip is picked up, the chip loading unit 1 can greatly adjust the chip angle, reducing the subsequent adjustment angle of the chip. Only fine adjustment of the chip angle is required subsequently, which can greatly shorten the chip angle adjustment time and ensure that the chip mounting angle meets the high-precision requirements.

[0024] Combined with Figure 2 and Figure 3 , the transfer and mounting unit 4 includes a transverse movement platform 43 arranged along the conveying direction, and a transfer mechanism 41 and a mounting mechanism 42 that move along the transverse movement platform 43; among them, the transfer mechanism 41 and the mounting mechanism 42 The transfer mechanism 41 can be driven by a lead screw mechanism or a rack and pinion mechanism, etc., and linearly move along the transverse movement platform 43 (in the x-axis direction). The transfer mechanism 41 can have the same structure as the mounting mechanism 42 or adopt an existing mounting mechanism, as long as it can realize the transfer of chips; compared with the prior art of using a single mounting mechanism to complete the picking and mounting of chips, the working efficiency of this application is higher, and at the same time, it can greatly shorten the moving distance of the transfer mechanism and the mounting mechanism during picking and mounting, avoiding long-distance movement.

[0025] Combined with Figure 2, the transfer mechanism 41 is used to move between the chip loading unit 1 and the adjustment platform 2, pick up the chips at the picking station, and transfer the chips to the adjustment platform 2; the mounting mechanism 42 is used to move between the adjustment platform 2 and the carrier plate transverse movement unit 3, can pick up the chips on the adjustment platform 2, cooperate with the second detection component 52 or the third detection component 53 to finely adjust the picked chips, and move to the mounting position for mounting.

[0026] Combined with Figure 2 and Figure 4 , the chip loading unit 1 includes a rotatable support platform 20 and an xy movement module 10 for driving the movement of the support platform 20; the support platform 20 can rotate around its own axis. Among them, the support platform 20 can be driven to rotate by a motor. The xy movement module 10 can drive the support platform 20 to move within the x and y axis planes to adjust the position of the support platform 20.

[0027] Combined with Figure 2 , a number of trays 30 that can rotate synchronously are distributed on the support platform 20 to carry chips of different specifications. Synchronous rotation between the trays 30 can be achieved through a belt drive method. Of course, it can also be a chain drive or a gear drive method, etc. In this embodiment, there are three trays 30, which are circumferentially evenly distributed on the support platform 20 and can carry three different specifications of chips at the same time. The number and arrangement method of the trays 30 are not limited here.

[0028] Combined with Figure 4 , any one of the trays 30 can rotate self - sufficiently. In this embodiment, the support platform 20 and any one of the trays 30 are connected by a belt drive for synchronous rotation, but it is not limited to this. In an embodiment not shown, any one of the trays 30 can also be driven to rotate self - sufficiently by an independent motor.

[0029] When the support platform 20 rotates, it will drive the trays 30 to rotate and replace. At the same time, the trays 30 will rotate synchronously around their own axes, thereby greatly adjusting the angle of the chips on the trays 30, reducing the subsequent adjustment deviation of the chip angle, and greatly shortening the adjustment time; cooperating with the xy movement module 10 can quickly adjust the tray 30 carrying chips of the corresponding specification to the picking station (the picking position of the transfer mechanism 41), improving the feeding speed.

[0030] Combined with Figure 3, the adjustment platform 2 includes a suction platform 21 and a fine adjustment mechanism 22 for adjusting the rotation of the suction platform 21 along the z-axis, thereby adjusting the angle of the chip thereon. The suction platform 21 can adjust its position in the horizontal plane to align with the transfer mechanism 41; the suction platform 21 can fix the chips supplied by the transfer mechanism 41 through vacuum adsorption; the fine adjustment mechanism 22 can be an electric displacement stage or a motor; wherein, the adjustment platform 2 can achieve the alignment of the suction platform 21 and the transfer mechanism 41 through an xy-axis linear movement module.

[0031] Combined with Figure 5 , the mounting mechanism 42 includes a yz movement module 423, a fine adjustment mechanism 422, and a pick-up component 421. The yz movement module 423 is used to adjust the movement of the pick-up component 421 in the y-axis and z-axis directions to pick up or mount chips. The fine adjustment mechanism 422 is used to drive the pick-up component 421 to adjust the pick-up chip angle around the z-axis. Among them, the pick-up component 421 is connected to the yz movement module 423 through the fine adjustment mechanism 422; the yz movement module 423 cooperates with the transverse movement platform 43 to achieve movement in the x, y, and z-axis directions, thereby adjusting the position of the pick-up component 421 to pick up or mount chips.

[0032] Combined with Figure 6 , the pick-up component 421 includes an air bearing 4211 and a nozzle assembly 4212. The air bearing 4211 includes a bearing seat 42112 and a drive shaft 42111 passing through the bearing seat 42112. The drive shaft 42111 is supported by an air film and slides within the bearing seat 42112. The nozzle assembly 4212 is connected to the bottom end of the drive shaft 42111. The pick-up component 421 controls the chip mounting force through a pressure adjustment component 424; a through perforation structure is provided on the pick-up component 421 for cooperating with the vision detection unit 5 to detect the pick-up chip angle.

[0033] In this embodiment, the drive shaft 42111 is connected to the nozzle assembly 4212 through vacuum adsorption; in an embodiment not shown, it can also be mechanically fixed through a connecting piece or a magnetic attraction component is provided within the drive shaft 42111, and through an external power supply, thereby realizing the detachable connection between the nozzle 42122 and the drive shaft 42111.

[0034] Combined with Figure 6, the nozzle assembly 4212 includes a connecting portion 42121 and a nozzle 42122 provided on the connecting portion 42121; the perforated structure includes a through hole 4216 provided on the connecting portion 42121 and communicating with the nozzle 42122, and a placement groove 4217 provided on the connecting portion 42121 and communicating with the through hole 4216. The placement groove 4217 is used to place a transparent plate, and the transparent plate seals one end of the through hole 4216 so as to form a negative pressure environment in the through hole 4216 to pick up the chip; a vertical groove 4215 for the vision detection unit 5 to observe the through hole 4216 is further provided on the driving shaft 42111.

[0035] Combined with Figure 7 , a driving cavity 100 communicating with the pressure regulating component 424 is formed between the driving shaft 42111 and the bearing seat 42112. A sliding groove may be provided in the bearing seat 4211, and a bump that slides in the sliding groove may be provided on the driving shaft 42111. A closed driving cavity 100 is formed between the bump and the sliding groove; the air pressure supplied into the driving cavity 100 is precisely controlled by the pressure regulating component 424 to push the driving shaft 42111 to extend out and mount the chip, and the mounting force on the chip is controlled; the pressure regulating component 424 includes a proportional valve; a limiting component 4218 for preventing the driving shaft 42111 from disengaging from the bearing seat 42112 is further provided at the top of the driving shaft 42111.

[0036] A first air supply channel 4213 and a second air supply channel 4214 are further provided on the driving shaft 42111. The first air supply channel 4213 is used to connect the pressure regulating component 424 with the driving cavity 100; the second air supply channel 4214 communicates with an external air source to form an air film between the bearing seat 42112 and the driving shaft 42111, avoiding friction or heat generation between the driving shaft 42111 and the bearing seat 42112, and improving the mounting accuracy and force control accuracy; during operation, the gas supplied to form an air film between the driving shaft 42111 and the bearing seat 42112 does not affect the pressure stability of the gas in the driving cavity 100.

[0037] Combined with Figure 6 , in the normal state, the driving shaft 42111 extends downward by its own gravity. When mounting the chip, the yz moving module 423 drives the picking component 421 close to the part to be mounted. When the nozzle 42122 abuts against the part to be mounted, after pushing the driving shaft 42111 to move upward a certain distance, the yz moving module 423 stops moving to provide a moving space for applying the mounting force; at this time, the gas supplied into the driving cavity 100 is controlled by the pressure regulating component 424, and then the driving shaft 42111 is pushed downward to apply the mounting force for mounting.

[0038] Combined with Figure 2 and Figure 3 also includes a glue dipping unit 7 and a carrier board loading unit 6. The glue dipping unit 7 includes a dispensing mechanism 72 and a scraping mechanism 73, and a linear drive mechanism 71 for driving the dispensing mechanism 72 and the scraping mechanism 73 to move along the y-axis; the carrier board loading unit 6 is located on one side of the carrier board transverse movement unit 33 and is used to provide a carrier board for the carrier board transverse movement unit 33; the carrier board transverse movement unit 33 can move along the x, y, and z axes to adjust the mounting position of the carrier board so that the mounting mechanism 42 can mount the chip, and cooperate with the glue dipping unit 7 for dispensing and degumming.

[0039] Combined with Figure 2 In the mounting process, in order to meet the requirement of mounting chips of multiple specifications; it also includes a nozzle storage unit 8. The nozzle storage unit 8 includes a first supply device 81 for providing a nozzle 42122 for the transfer mechanism 41, and a second supply device 82 for providing a nozzle 42122 for the mounting mechanism 42. So that the corresponding nozzle 42122 can be switched when picking up different chips.

[0040] This application also provides a chip mounting method, including the above high-precision chip mounting equipment, and further includes the following steps: Loading: Place chips of different specifications in different trays 30 on the chip loading unit 1.

[0041] Coarse adjustment: The chip loading unit 1 cooperates with the first detection component 51 to adjust the chips of the required mounting specification to the picking station, and at the same time makes the first adjustment to the chip angle; reduce the tilt angle of the chip before picking up and shorten the subsequent adjustment time of the chip.

[0042] Transfer: After the transfer mechanism 41 picks up the corresponding chip at the picking station, it transfers the chip to the adjustment platform 2; the adsorption platform 21 adsorbs and fixes the chip.

[0043] Fine adjustment: The adjustment platform 2 cooperates with the vision detection unit 5 to make the second adjustment to the chip; the fine adjustment mechanism 2 cooperates with the second detection component 52 to drive the adsorption platform 21 to rotate, and further makes the second adjustment to the chip angle.

[0044] Fine tuning: The mounting mechanism 42 picks up the chip on the adjustment platform 2 and moves it below the second detection component 52 or the third detection component 53. Through the perforated structure, the angle of the chip picked up by the picking component 421 is detected to determine whether the chip angle is skewed. If there is an angle skew, the fine tuning mechanism 422 makes the third adjustment to the chip picked up by the picking component 421; if there is no skew, it directly enters the mounting step.

[0045] Mounting: The mounting mechanism 42 cooperates with the third detection component 53 to determine the mounting positions on the carrier board on the carrier board transverse movement unit 3, and mounts the picked-up chips on the corresponding mounting positions.

[0046] Before mounting, the angle of the chip can be adjusted three times, so as to meet the high-precision requirements for the mounting angle of the chip and improve the product quality.

Claims

1. A high-precision chip mounting device, characterized in that: It includes a transfer and placement unit, a chip loading unit and an adjustment platform arranged in sequence along the conveying direction; The chip loading unit is used to provide chips of different specifications for the transfer and placement unit and roughly adjust the angles of the chips to be picked up; The transfer and placement unit is used to move the chips on the chip loading unit to the adjustment platform, and the adjustment platform is used to finely adjust the chips; After the transfer and placement unit picks up the chips on the adjustment platform, it further finely adjusts the chips.

2. The high-precision chip mounting device according to claim 1, wherein: The chip loading unit includes a support platform that can rotate around its own axis, and an xy moving module that drives the movement of the support platform. A number of trays that can rotate synchronously are distributed on the support platform, and any one of the trays can rotate itself.

3. The high-precision chip mounting device according to claim 1, wherein: A carrier plate transverse movement unit for adjusting the position of the carrier plate is arranged on one side of the adjustment platform. The transfer and placement unit includes a transverse movement platform arranged along the conveying direction, a transfer mechanism and a placement mechanism that move along the transverse movement platform. The transfer mechanism is located between the chip loading unit and the adjustment platform, and the placement mechanism is located between the adjustment platform and the carrier plate transverse movement unit.

4. The high-precision chip mounting device according to claim 3, characterized in that: The placement mechanism includes a picking component, a yz moving module that drives the movement of the picking component, and a fine adjustment mechanism for swinging and adjusting the angle of the picking component around the z-axis. A through-hole structure is provided on the picking component, and the picking component provides a placement pressure through a pressure adjustment component to control the placement force of the chips.

5. The high-precision chip mounting device according to claim 4, characterized in that: The picking component includes an air bearing and a nozzle assembly. The air bearing includes a bearing seat and a driving shaft that slides in the bearing seat supported by an air film; the nozzle assembly is connected to the bottom of the driving shaft, and a sealed driving cavity communicating with the pressure adjustment component is formed between the driving shaft and the bearing seat; the picking component is connected to the yz moving module through the fine adjustment component.

6. The high-precision chip mounting device according to claim 5, wherein: The through-hole structure includes a through-hole provided on the nozzle assembly and a placement groove for placing a transparent plate, and a vertical groove is provided on the driving shaft. The placement groove communicates with the through-hole, and the angle of the chip picked up by the nozzle assembly can be observed through the vertical groove.

7. The high-precision chip mounting device according to claim 3, characterized in that: It further includes a vision detection unit for detecting the angle and state of the chips. The vision detection unit includes a first detection component, a second detection component and a third detection component that are respectively arranged opposite to the chip loading unit, the adjustment platform and the carrier plate transverse movement unit.

8. The high-precision chip mounting device according to claim 1, characterized in that: It further includes a glue dipping unit. The glue dipping unit includes a linear driving mechanism, and a dispensing mechanism and a glue scraping mechanism that move along the y-axis direction and are arranged on the linear driving mechanism.

9. The high-precision chip mounting device according to claim 3, wherein: It further includes a nozzle storage unit. The nozzle storage unit includes a first supply device for providing nozzles for the transfer mechanism and a second supply device for providing nozzles for the placement mechanism.

10. A chip mounting method, characterized in that: It includes the high-precision placement device according to claim 7, and further includes the following steps: Loading: Place chips of different specifications on the chip loading unit; Rough adjustment: The chip loading unit cooperates with the vision detection unit to adjust the chips of the required placement specification to the picking station and perform the first adjustment on the angles of the chips to be picked up; Transfer: After picking up the corresponding chip at the picking station, the transfer mechanism transfers the chip to the adjustment platform; Fine adjustment: The adjustment platform cooperates with the vision detection unit to perform a second adjustment on the chip; Micro adjustment: The mounting mechanism picks up the chip on the adjustment platform, moves it under the vision detection unit, cooperates with the vision detection unit to detect the angle of the chip picked up by the mounting mechanism, and the mounting mechanism performs a third adjustment on the picked-up chip; Mounting: The mounting mechanism cooperates with the vision detection unit to determine the mounting position on the carrier plate of the carrier plate transverse movement unit, and mounts the picked-up chip on the corresponding mounting position.

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