Packaging control system for multi-core particle production

Abstract

The invention discloses a packaging control system for multi-core particle production, and relates to the technical field of chip packaging. A first guide track and a second guide track are both communicated with a conversion mounting port, the first guide track is communicated with the second guide track, a first plastic package assembly and a second plastic package assembly are arranged on one side of the conversion mounting port, and a track conversion assembly comprises a third guide track communicated with the first guide track. The lifting control assembly is provided with a turn-over control assembly, the supporting plate is provided with a hollow negative pressure part used for adsorbing a chip, and the supporting disc is provided with four sets of elastic guide parts in an annular array mode. Through the combined action of the first guide track, the second guide track and the track conversion assembly, a chip can rotate by 90 degrees in the same direction in the conveying process between the first plastic package assembly and the second plastic package assembly, and therefore plastic package processing of the four side faces of the peripheral side of the chip on a closed-loop line is achieved; the efficiency of chip packaging work is improved through the closed-loop circuit plastic packaging mode.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and particularly relates to a packaging control system for multi-chiplet production. Background Art

[0002] Chiplet, also known as a chiplet or a small chip, is a die (bare chip) that meets specific functions. Through die-to-die internal interconnection technology, multiple module chips and the underlying basic chip are packaged together to form a system chip to achieve a new form of IP reuse. Currently, the mainstream system-on-a-chip (SoC) integrates multiple computing units responsible for different types of computing tasks onto the same wafer through photolithography. Chiplet + Chiplet decomposes a complex SoC chip into different computing units or functional units during the design phase, then manufactures each unit using the most suitable semiconductor manufacturing process, and finally interconnects the units through advanced packaging technology and integrates them into a system-level chipset.

[0003] During the multi-chiplet manufacturing process, after the single-chiplet manufacturing is completed, it is often necessary to perform plastic encapsulation on its periphery. The plastic encapsulation process uses a polyester film coated with hot melt adhesive. Through the processing of a laminating machine, the item to be encapsulated is bonded within the plastic film. Since the processing is carried out under certain pressure and high temperature, and high-quality polyester film and hot melt adhesive with good transparency are used, the chip needs to be encapsulated and protected with plastic encapsulation resin under certain pressure and temperature during production. The entire process requires the use of plastic encapsulation equipment.

[0004] However, most of the existing chip plastic encapsulation processes directly fix the chip on the plastic encapsulation table. After the plastic encapsulation of one side of the chip is completed, the chip needs to be removed from the plastic encapsulation table, flipped, and then fixed to the plastic encapsulation table again to continue the plastic encapsulation of the other side of the chip. This plastic encapsulation process requires frequent disassembly and assembly of the chip and adjustment of its position, which greatly affects the working efficiency of chip packaging. Therefore, we provide a packaging control system for multi-chiplet production to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a packaging control system for multi-chiplet production, which solves the problems in the above background art through the specific structural design of the plastic encapsulation mechanism, the trajectory conversion component, and the chip conveying mechanism.

[0006] To solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a packaging control system for multi-die production, including a plastic encapsulation mechanism. The plastic encapsulation mechanism includes a conversion installation port, a first guiding track, and a second guiding track. Both the first guiding track and the second guiding track are connected to the conversion installation port, and the first guiding track is connected to the second guiding track. One side of the conversion installation port is provided with a plastic encapsulation component one and a plastic encapsulation component two; a track conversion component, which is rotatably installed inside the conversion installation port. The track conversion component includes a third guiding track connected to the first guiding track. When the track conversion component is controlled to rotate 180°, the third guiding track is connected to the second guiding track; a chip conveying mechanism, which includes a lifting control component slidably arranged on the plastic encapsulation mechanism, and a turning control component is arranged on the lifting control component; wherein, the turning control component includes a support disk and a support plate that rotate synchronously. The support plate is provided with a hollow negative pressure part for adsorbing chips. Four groups of elastic guiding parts are circumferentially and arrayedly arranged on the support disk. The elastic guiding part includes a guide wheel part. An electromagnet magnetically repulsive to the corresponding guide wheel part is installed on the support disk. When the guide wheel part is controlled to pass through the third guiding track, the chip rotates 90°.

[0007] In some embodiments, the plastic encapsulation mechanism further includes a plastic encapsulation carrier. The conversion installation port is arranged on the plastic encapsulation carrier. Horizontal guide rails are fixedly arranged at the top and bottom of the plastic encapsulation carrier. Both the plastic encapsulation component one and the plastic encapsulation component two are installed inside the plastic encapsulation carrier and are arranged oppositely. A power screw is rotatably arranged at the bottom of the plastic encapsulation carrier, and the power screw is connected to the output end of a power motor on the plastic encapsulation carrier.

[0008] In some embodiments, the first guiding track includes a first guide groove and a second guide groove arranged on both sides of the conversion installation port. The second guide groove is arranged above the first guide groove and both are connected to the conversion installation port; the second guiding track includes a third guide groove and a fourth guide groove arranged on both sides of the conversion installation port. The fourth guide groove is arranged below the third guide groove and both are connected to the conversion installation port. The third guide groove is connected to the second guide groove above it through a descending channel, and the fourth guide groove is connected to the first guide groove above it through an ascending channel.

[0009] In some embodiments, the track conversion component further includes a track conversion disk rotatably installed inside the conversion installation port. A support ring is fixedly arranged on one side of the track conversion disk. An external tooth ring is fixedly arranged on the circumferential side of the support ring. The third guiding track is arranged on the other side of the track conversion disk. The third guiding track is composed of a first conversion groove, a second conversion groove, and an arc conversion groove. The arc conversion groove is connected to the first conversion groove and the second conversion groove on both sides of it. The arc conversion groove is a quarter-circle structure.

[0010] In some embodiments, the lifting control assembly includes a U-shaped mounting frame sleeved on the plastic encapsulation carrier. A limiting channel slidably engaged with the horizontal guide rail is formed on the U-shaped mounting frame. A support frame is fixedly arranged at the top of the U-shaped mounting frame. A lifting cylinder is mounted on the support frame. An internally threaded plate sleeved on the power screw is fixed at the bottom of the U-shaped mounting frame. The internally threaded plate is in threaded connection with the power screw. A limiting channel and a limiting guide seat are arranged on one side of the U-shaped mounting frame. A U-shaped lifting plate connected to the output end of the lifting cylinder is arranged inside the U-shaped mounting frame.

[0011] In some embodiments, the turning control assembly further includes a lifting frame slidably arranged on the limiting guide seat. A first rotating shaft and a second rotating shaft are respectively rotatably arranged on the lifting frame. One end of the first rotating shaft penetrates through the limiting channel and the U-shaped lifting plate and is fixedly connected to the support disc. A first transmission wheel is fixedly installed at the other end of the first rotating shaft. A positioning disc rotatably connected to the U-shaped lifting plate is fixed on the circumferential side of the first rotating shaft. A second transmission wheel is fixedly installed on the circumferential side of the second rotating shaft. The first transmission wheel and the second transmission wheel are connected by a transmission belt. The support plate is fixedly arranged at the end of the second rotating shaft. A negative pressure generator for controlling the negative pressure inside the cavity of the hollow negative pressure part is installed on the support plate.

[0012] In some embodiments, the elastic guiding part further includes a first moving rod slidably arranged at an eccentric position of the support disc. A connecting disc fixedly arranged at one end of the first moving rod is connected to the support disc by a first elastic member. The guide wheel member is installed at the other end of the first moving rod. Pressure sensors are installed at both the inner top and the inner bottom of the U-shaped mounting frame.

[0013] In some embodiments, a first guiding member is slidably arranged inside the second guiding groove. A through channel is formed inside the second guiding groove. A first magnetic plate fixed to the first guiding member is arranged outside the plastic encapsulation carrier. A conversion tooth plate meshed with the external gear ring is fixed on one side of the first magnetic plate. A second magnetic plate is fixedly installed at the end of the conversion tooth plate. A second moving rod is fixedly arranged on the other side of the first magnetic plate. A first locking plate and a second locking plate are respectively installed on the plastic encapsulation carrier. An electromagnet and a pressure sensor are installed on the first locking plate. An electromagnet magnetically attracted to the second magnetic plate is installed on the second locking plate. The electromagnet on the first locking plate is magnetically attracted to the first magnetic plate. The second moving rod slidably penetrates through the first locking plate. A connecting disc fixed to the end of the second moving rod is connected to the first locking plate by a second elastic member.

[0014] In some embodiments, an extension channel communicating with the fourth guide groove is formed in the plastic encapsulation carrier. A moving member is slidably disposed inside the extension channel. A second guiding member is slidably disposed inside the fourth guide groove. The second guiding member is connected to the moving member through a linkage rod. A moving plate fixed to the moving member is disposed outside the plastic encapsulation carrier. A signal triggering portion is fixedly disposed on one side of the moving plate. The moving plate and the limiting mounting plate on the plastic encapsulation carrier are connected through a third elastic member. A pressure sensor is mounted on the limiting mounting plate.

[0015] The present invention has the following beneficial effects: 1. Through the combined action of the first guiding track, the second guiding track and the track conversion component, the present invention can enable the chip to rotate 90° in the same direction during the conveying process between the first plastic encapsulation component and the second plastic encapsulation component, so as to realize the plastic encapsulation treatment of the four side surfaces on the circumference of the chip on a closed-loop line. The efficiency of the entire chip packaging work is improved through this closed-loop line plastic encapsulation method.

[0016] 2. When the guide wheel member slides along the second guide groove and pushes the first guiding member to move synchronously, the first magnetic plate moving synchronously with the first guiding member drives the second moving rod to move and stretch the second elastic member. At the same time, the moving conversion tooth plate drives the entire track conversion component to rotate counterclockwise until the first magnetic plate is firmly adsorbed on the first locking plate, and the entire track conversion component rotates 180° counterclockwise. Through this control method, the automatic rotation of the track conversion component is realized, and the automation degree of the entire packaging device is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic structural diagram of the packaging control system for multi-core particle production in the present invention.

[0019] Figure 2 is Figure 1 A schematic structural diagram from another angle.

[0020] Figure 3 It is a schematic structural diagram of the plastic encapsulation mechanism in the present invention.

[0021] Figure 4 is Figure 3 A schematic structural diagram from another angle.

[0022] Figure 5 It is a structural sectional view of the plastic encapsulation mechanism in the present invention.

[0023] Figure 6 is Figure 5 The enlarged view of the local structure at position A in

[0024] Figure 7 is Figure 5 The enlarged view of the local structure at position B in

[0025] Figure 8 The structural schematic diagram of the trajectory conversion component in the present invention.

[0026] Figure 9 is Figure 8 The side view of the structure of

[0027] Figure 10 The structural schematic diagram of the chip conveying mechanism in the present invention.

[0028] Figure 11 The structural schematic diagram of the lifting control component in the present invention.

[0029] Figure 12 is Figure 11 The front view of the structure of

[0030] Figure 13 The structural schematic diagram of the flipping control component in the present invention.

[0031] Figure 14 is Figure 13 The rear view of the structure of

[0032] In the attached drawings, the list of components represented by each reference numeral is as follows: 1 - Plastic encapsulation mechanism, 101 - Conversion and installation port, 102 - First plastic encapsulation component, 103 - Second plastic encapsulation component, 104 - Plastic encapsulation carrier, 105 - Horizontal guide rail, 106 - Power screw, 107 - Power motor, 108 - First guide groove, 109 - Second guide groove, 110 - Third guide groove, 111 - Fourth guide groove, 112 - Descending channel, 113 - Ascending channel, 114 - First guide member, 115 - Through channel, 116 - First magnetic plate, 117 - Conversion gear plate, 118 - Second magnetic plate, 119 - Second moving rod, 120 - First locking plate, 121 - Second locking plate, 122 - Second elastic member, 123 - Extension channel, 124 - Moving member, 125 - Second guide member, 126 - Linking rod, 127 - Moving plate, 128 - Signal triggering part, 129 - Limit mounting plate, 130 - Third elastic member, 2 - Trajectory conversion component, 201 - Third guiding trajectory, 202 - Trajectory conversion disk, 203 - Support ring, 204 - External gear ring, 205 - First conversion groove, 206 - Second conversion groove, 207 - Arc-shaped conversion groove, 3 - Chip conveying mechanism, 4 - Lifting control component, 401 - U-shaped mounting frame, 402 - Limit channel, 403 - Support frame, 404 - Lifting cylinder, 405 - Internal thread plate, 406 - Limit channel, 407 - Limit guide seat, 408 - U-shaped lifting plate, 5 - Flipping control component, 501 - Support disk, 502 - Support plate, 503 - Hollow negative pressure part, 504 - Guide wheel part, 505 - Lifting frame, 506 - First rotating shaft, 507 - Second rotating shaft, 508 - First transmission wheel, 509 - Positioning disk, 510 - Second transmission wheel, 511 - Transmission belt, 512 - Negative pressure generator, 513 - First moving rod, 514 - First elastic member, 6 - Chip. Detailed implementation mode

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0034] For the first specific embodiment, please refer to Figure 1-14, the present invention is a packaging control system for multi-chiplet production, including a plastic encapsulation mechanism 1, a trajectory conversion component 2, and a chip conveying mechanism 3; the plastic encapsulation mechanism 1 includes a conversion installation port 101, a first guiding trajectory, and a second guiding trajectory. Both the first guiding trajectory and the second guiding trajectory are connected to the conversion installation port 101, and the first guiding trajectory is connected to the second guiding trajectory. On one side of the conversion installation port 101, there are a first plastic encapsulation component 102 and a second plastic encapsulation component 103; the trajectory conversion component 2 is rotatably installed inside the conversion installation port 101. The trajectory conversion component 2 includes a third guiding trajectory 201 connected to the first guiding trajectory. When the trajectory conversion component 2 is controlled to rotate 180°, the third guiding trajectory 201 is connected to the second guiding trajectory; the chip conveying mechanism 3 includes a lifting control component 4 slidably arranged on the plastic encapsulation mechanism 1, and a turning control component 5 is arranged on the lifting control component 4; wherein, the turning control component 5 includes a supporting disk 501 and a supporting plate 502 that rotate synchronously. A hollow negative pressure part 503 for adsorbing the chip 6 is arranged on the supporting plate 502. Four groups of elastic guiding parts are circumferentially and arrayedly arranged on the supporting disk 501. The elastic guiding part includes a guide wheel member 504. An electromagnet magnetically repulsive to the corresponding guide wheel member 504 is installed on the supporting disk 501. When the guide wheel member 504 is controlled to pass through the third guiding trajectory 201, the chip 6 is rotated 90° (through this method, the entire chip 6 can be flipped four times, and each time the flip is controlled by 90° to ensure that a surface to be plastic encapsulated faces upward, so as to facilitate plastic encapsulation treatment by the first plastic encapsulation component 102 or the second plastic encapsulation component 103).

[0035] In some embodiments, such as Figure 3 , Figure 4 and Figure 5 shown, the plastic encapsulation mechanism 1 further includes a plastic encapsulation carrier 104. The conversion installation port 101 is arranged on the plastic encapsulation carrier 104. Horizontal guide rails 105 are fixedly arranged at the top and bottom of the plastic encapsulation carrier 104. The first plastic encapsulation component 102 and the second plastic encapsulation component 103 are both installed inside the plastic encapsulation carrier 104 and are arranged oppositely (both the first plastic encapsulation component 102 and the second plastic encapsulation component 103 in this embodiment are common plastic encapsulation components in the prior art, and they belong to the publicly disclosed conventional designs, so the specific structures thereof will not be described in detail here). A power screw 106 is rotatably arranged at the bottom of the plastic encapsulation carrier 104. The power screw 106 is connected to the output end of a power motor 107 on the plastic encapsulation carrier 104. The power motor 107 is controlled to start and stop through a control system.

[0036] Further, the first guiding track includes a first guide groove 108 and a second guide groove 109 arranged on both sides of the conversion mounting opening 101. The second guide groove 109 is arranged above the first guide groove 108, and both are communicated with the conversion mounting opening 101. The second guiding track includes a third guide groove 110 and a fourth guide groove 111 arranged on both sides of the conversion mounting opening 101. The fourth guide groove 111 is arranged below the third guide groove 110, and both are communicated with the conversion mounting opening 101. The third guide groove 110 is communicated with the second guide groove 109 above it through a descending channel 112, and the fourth guide groove 111 is communicated with the first guide groove 108 above it through an ascending channel 113 (that is, the second guiding track presents a U-shaped structure, and the first guiding track is arranged above the second guiding track and the two are communicated).

[0037] In some embodiments, such as Figure 1 , Figure 8 and Figure 9 shown, the track conversion assembly 2 further includes a track conversion disk 202 rotatably mounted inside the conversion mounting opening 101. A support ring 203 is fixedly arranged on one side of the track conversion disk 202. An external gear ring 204 is fixedly arranged on the circumferential side of the support ring 203. The third guiding track 201 is arranged on the other side of the track conversion disk 202. The third guiding track 201 is composed of a first conversion groove 205, a second conversion groove 206 and an arc conversion groove 207. The arc conversion groove 207 is communicated with the first conversion groove 205 and the second conversion groove 206 on both sides of it. The arc conversion groove 207 is a quarter-circle structure. In the initial state, the first conversion groove 205 is aligned with the first guide groove 108 and the two are communicated, and the second conversion groove 206 is aligned with the second guide groove 109 and the two are communicated. The entire chip conveying mechanism 3 is in the initial position (as Figure 1 shown).

[0038] In some embodiments, such as Figure 1 , Figure 11 and Figure 12As shown, the lifting control assembly 4 includes a U-shaped mounting bracket 401 sleeved on the plastic-sealed carrier 104. A limiting channel 402 slidably engaged with the horizontal guide rail 105 is formed on the U-shaped mounting bracket 401. A support bracket 403 is fixedly arranged at the top of the U-shaped mounting bracket 401. A lifting cylinder 404 is mounted on the support bracket 403. A threaded inner plate 405 sleeved on the power screw 106 is fixed at the bottom of the U-shaped mounting bracket 401. The threaded inner plate 405 is in threaded connection with the power screw 106. Through the cooperation relationship between the limiting channel 402 and the horizontal guide rail 105 and the cooperation relationship between the threaded inner plate 405 and the power screw 106, the entire lifting control assembly 4 can slide smoothly back and forth along the plastic-sealed carrier 104. A limiting channel 406 and a limiting guide base 407 are arranged on one side of the U-shaped mounting bracket 401. A U-shaped lifting plate 408 connected to the output end of the lifting cylinder 404 is arranged inside the U-shaped mounting bracket 401. The top of the U-shaped lifting plate 408 in the initial state abuts against the inner top of the U-shaped mounting bracket 401.

[0039] In some embodiments, as Figure 1 、 Figure 13 and Figure 14 shown, the turning control assembly 5 further includes a lifting frame 505 slidably arranged on the limiting guide base 407 (to ensure the smooth up and down movement of the entire turning control assembly 5 through the cooperation relationship between the lifting frame 505 and the limiting guide base 407). A first rotating shaft 506 and a second rotating shaft 507 are respectively rotatably arranged on the lifting frame 505. One end of the first rotating shaft 506 penetrates through the limiting channel 406 and the U-shaped lifting plate 408 and is fixedly connected to the support disk 501 (when controlling the up and down movement of the U-shaped lifting plate 408, the first rotating shaft 506 can be driven to slide along the limiting channel 406, and the first rotating shaft 506 in the initial state abuts against the top of the limiting channel 406). A first transmission wheel 508 is fixedly installed at the other end of the first rotating shaft 506. A positioning disk 509 rotatably connected to the U-shaped lifting plate 408 is fixed on the circumferential surface of the first rotating shaft 506. A second transmission wheel 510 is fixedly installed on the circumferential surface of the second rotating shaft 507. The first transmission wheel 508 and the second transmission wheel 510 are connected by a transmission belt 511. A support plate 502 is fixedly arranged at the end of the second rotating shaft 507 (so that the synchronous rotation between the support disk 501 and the support plate 502 can be realized). A negative pressure generator 512 for controlling the negative pressure in the cavity of the hollow negative pressure part 503 is installed on the support plate 502 (this negative pressure generator 512 is a conventional device in the prior art, so its structure will not be described in detail).

[0040] When a chip 6 (the chip 6 is a single chip structure in a multi-chiplet structure, which includes a conventional chip and a metal wiring layer) is closely attached to the surface of the hollow negative pressure part 503, the negative pressure environment in the inner cavity of the hollow negative pressure part 503 is controlled by the negative pressure generator 512, so that the chip 6 is tightly adsorbed and fixed on the hollow negative pressure part 503. In this way, the position of the chip 6 on the hollow negative pressure part 503 is fixed. At this time, there is a certain distance between the top surface (the first side surface) of the chip 6 and the first plastic encapsulation component 102. Subsequently, the lifting cylinder 404 is used to control the U-shaped lifting plate 408 to move upward until it abuts against the inner top of the U-shaped mounting frame 401. At this time, the first rotating shaft 506 just abuts against the top of the limiting channel 406, and the first rotating shaft 506 just aligns with the intersection position of the first guide groove 108 and the rising channel 113. The top surface (the first side surface) of the chip 6 is close to the bottom of the first plastic encapsulation component 102. During this process, a guide wheel part 504 is slidably fitted inside the rising channel 113 (that is, the lower guide wheel part 504 is fitted in the rising channel 113, and the electromagnet at this position is energized and magnetized, so that the lower guide wheel part 504 is inserted into the rising channel 113 under the action of magnetic repulsion force). During the process of controlling the entire flipping control component 5 to move upward by the lifting cylinder 404, the lower guide wheel part 504 gradually slides upward along the rising channel 113 from the intersection position of the fourth guide groove 111 and the rising channel 113. Subsequently, the first plastic encapsulation component 102 is used to perform plastic encapsulation treatment on the top surface (the first side surface) of the chip 6 (of course, the first plastic encapsulation component 102 and the second plastic encapsulation component 103 can also be designed into a structure with adjustable height up and down. For example, the height of the first plastic encapsulation component 102 and the second plastic encapsulation component 103 is finely adjusted by a cylinder, and it is specifically set according to actual production requirements) (step one).

[0041] Next, control the electromagnet at the position of the first guide groove 108 to be energized and magnetized. Under the action of magnetic repulsion, the corresponding guide wheel member 504 is inserted into the first guide groove 108. Subsequently, control the electromagnet at the lower position to be de-energized and demagnetized so that the lower guide wheel member 504 disengages from the rising channel 113 (that is, at this time only one guide wheel member 504 is engaged in the first guide groove 108, and the guide wheel members 504 in other directions are in their original states). Subsequently, control the power screw 106 to rotate through the power motor 107 to drive the entire chip conveying mechanism 3 to move the chip 6 towards the plastic encapsulation component two 103. When the guide wheel member 504 in the first guide groove 108 enters the first conversion groove 205 and slides into the second conversion groove 206 along the arc-shaped conversion groove 207, the support plate 501 rotates clockwise by 90° under the action of the arc-shaped conversion groove 207. Under the combined action of the first transmission wheel 508, the second transmission wheel 510, and the transmission belt 511, the hollow negative pressure portion 503 on the support plate 502 rotates clockwise by 90°. At this time, the top surface (second side) of the chip 6 faces upwards until the guide wheel member 504 slides into the intersection position of the second guide groove 109 and the descending channel 112 along the second guide groove 109. At this time, the first rotating shaft 506 is just aligned with the descending channel 112, and the top surface (second side) of the chip 6 is close to the bottom of the plastic encapsulation component two 103. Subsequently, control the trajectory conversion component 2 to rotate counterclockwise by 180°, so that the first conversion groove 205 is aligned with and communicates with the third guide groove 110, and the second conversion groove 206 is aligned with and communicates with the fourth guide groove 111. At the same time, perform plastic encapsulation treatment on the top surface (second side) of the chip 6 through the plastic encapsulation component two 103 (step two).

[0042] Next, the entire turning control assembly 5 is controlled to move downward by the lifting cylinder 404 until the bottom of the U-shaped lifting plate 408 abuts against the inner bottom of the U-shaped mounting bracket 401. At this time, the first rotating shaft 506 just abuts against the bottom of the limiting channel 406, and the first rotating shaft 506 just aligns with the intersection position of the descending channel 112 and the third guiding channel 110. Control the electromagnet at the position of the third guiding channel 110 to be energized and magnetized. Under the action of magnetic repulsion, the corresponding guide wheel member 504 is inserted into the third guiding channel 110. Then, control the electromagnet at the upper position to be de-energized and demagnetized so that the upper guide wheel member 504 disengages from the descending channel 112 (that is, at this time, only one guide wheel member 504 is engaged in the third guiding channel 110, and the guide wheel members 504 in other directions are all in the original state). Subsequently, the power motor 107 is used to control the rotation of the power screw 106 to drive the entire chip conveying mechanism 3 to move the chip 6 in the direction close to the first plastic encapsulation assembly 102. When the guide wheel member 504 in the third guiding channel 110 enters the first conversion groove 205 and slides into the second conversion groove 206 along the arc-shaped conversion groove 207, the support plate 501 rotates clockwise by 90° again under the action of the arc-shaped conversion groove 207. Under the combined action of the first transmission wheel 508, the second transmission wheel 510 and the transmission belt 511, the hollow negative pressure part 503 on the support plate 502 rotates clockwise by 90° again. At this time, the top surface (the third side surface) of the chip 6 faces upward until the guide wheel member 504 slides into the intersection position of the fourth guiding channel 111 and the ascending channel 113 along the fourth guiding channel 111. At this time, the first rotating shaft 506 just aligns with the ascending channel 113. Then, the entire turning control assembly 5 is controlled to move upward by the lifting cylinder 404 again to complete the reset. At this time, the top surface (the third side surface) of the chip 6 is close to the bottom of the first plastic encapsulation assembly 102, and the first rotating shaft 506 just aligns with the intersection position of the first guiding channel 108 and the ascending channel 113. Then, control the trajectory conversion assembly 2 to rotate 180° in the reverse direction to complete the reset. At the same time, the first plastic encapsulation assembly 102 is used to perform the plastic encapsulation treatment on the top surface (the third side surface) of the chip 6 (step three).

[0043] Next, control the electromagnet at the position of the first guide groove 108 to be energized and magnetized again. Under the action of magnetic repulsion, the corresponding guide wheel member 504 is inserted into the first guide groove 108. Then, control the electromagnet at the lower position to be de-energized and demagnetized so that the lower guide wheel member 504 disengages from the rising channel 113 (that is, at this time, only one guide wheel member 504 is engaged in the first guide groove 108, and the guide wheel members 504 in other directions are in their original states). Then, control the driving screw 106 to rotate again through the power motor 107 to drive the entire chip conveying mechanism 3 to move the chip 6 towards the plastic encapsulation component two 103 until the guide wheel member 504 slides along the second guide groove 109 to the intersection position of the second guide groove 109 and the descending channel 112. At this time, the first rotating shaft 506 is just aligned with the descending channel 112, and the top surface (the fourth side) of the chip 6 is close to the bottom of the plastic encapsulation component two 103. Then, control the trajectory conversion component 2 to rotate counterclockwise by 180° again, so that the first conversion groove 205 is aligned with the third guide groove 110 and the two are connected, and the second conversion groove 206 is aligned with the fourth guide groove 111 and the two are connected. At the same time, the plastic encapsulation of the top surface (the fourth side) of the chip 6 is realized through the plastic encapsulation component two 103 (step four).

[0044] Next, control the entire chip conveying mechanism 3 to move the chip 6 to the position of the plastic encapsulation component one 102 in the same control manner as in step three (that is, the chip conveying mechanism 3 returns to its initial position). At this time, the top surface (the first side) of the chip 6 faces upward again, and the guide wheel member 504 slides along the fourth guide groove 111 to the intersection position of the fourth guide groove 111 and the rising channel 113. At this time, the first rotating shaft 506 is just aligned with the rising channel 113. In this way, the plastic encapsulation of the four sides on the circumferential side of the chip 6 is completed. Then, control the negative pressure generator 512 to release the negative pressure environment in the inner cavity of the hollow negative pressure part 503, so that the chip 6 falls off from the hollow negative pressure part 503 for collection. After adsorbing and fixing the next chip 6 on the hollow negative pressure part 503, the plastic encapsulation process can be continued in the same control manner as above.

[0045] Specific embodiment two, on the basis of specific embodiment one, such as Figure 11 and Figure 13As shown, the elastic guiding part further includes a first moving rod 513 slidably arranged at an eccentric position of the support disc 501. A connecting disc fixedly arranged at one end of the first moving rod 513 is connected to the support disc 501 through a first elastic member 514. The guide wheel member 504 is installed at the other end of the first moving rod 513. Pressure sensors are installed at both the inner top and inner bottom of the U-shaped mounting bracket 401. When the electromagnet at a certain position on the support disc 501 is energized to generate magnetism, the guide wheel member 504 moves and inserts into the guide groove at the corresponding position under the action of magnetic repulsion force. At this time, the first elastic member 514 at this position is compressed. By arranging a pressure sensor at both the inner top and inner bottom of the U-shaped mounting bracket 401, when controlling the U-shaped lifting plate 408 to move downward until the bottom of the U-shaped lifting plate 408 abuts against the inner bottom of the U-shaped mounting bracket 401, the pressure sensor at the inner bottom of the U-shaped mounting bracket 401 transmits the pressure signal to the control system, and the control system controls to close the lifting cylinder 404. When controlling the U-shaped lifting plate 408 to move upward until the top of the U-shaped lifting plate 408 abuts against the inner top of the U-shaped mounting bracket 401, the pressure sensor at the inner top of the U-shaped mounting bracket 401 transmits the pressure signal to the control system, and the control system controls to close the lifting cylinder 404.

[0046] In some embodiments, such as Figure 4 , Figure 5 , Figure 6 and Figure 7As shown in the figure, a first guiding member 114 is slidably arranged inside the second guiding groove 109. A through-channel 115 is formed inside the second guiding groove 109. A first magnetic plate 116 fixed to the first guiding member 114 is arranged outside the plastic encapsulation carrier 104. A conversion tooth plate 117 meshing with the external tooth ring 204 is fixed to one side of the first magnetic plate 116. A second magnetic plate 118 is fixedly installed at the end of the conversion tooth plate 117. A second moving rod 119 is fixedly arranged on the other side of the first magnetic plate 116; an first locking plate 120 and a second locking plate 121 are respectively installed on the plastic encapsulation carrier 104. An electromagnet and a pressure sensor are installed on the first locking plate 120. An electromagnet with magnetic attraction to the second magnetic plate 118 is installed on the second locking plate 121. The electromagnet on the first locking plate 120 has magnetic attraction to the first magnetic plate 116. The second moving rod 119 slidably penetrates through the first locking plate 120. A connecting disc fixed to the end of the second moving rod 119 is connected to the first locking plate 120 through a second elastic member 122;When the electromagnet on the second locking plate 121 is in the energized and magnetized state in the initial state, the second magnetic plate 118 is firmly adsorbed on the second locking plate 121 under the action of strong magnetic suction force. When the guide wheel member 504 slides from the second conversion groove 206 into the second guide groove 109, the electromagnet on the second locking plate 121 is controlled to be powered off and demagnetized. At the same time, the electromagnet on the first locking plate 120 is controlled to be powered on and magnetized. As the guide wheel member 504 slides along the second guide groove 109 and pushes the first guiding member 114 to move synchronously, the first magnetic plate 116 moving synchronously with the first guiding member 114 drives the second moving rod 119 to move and stretch the second elastic member 122. At the same time, the moving conversion tooth plate 117 drives the entire trajectory conversion assembly 2 to rotate counterclockwise until the first magnetic plate 116 abuts against the first locking plate 120 (at this time, the first magnetic plate 116 is firmly adsorbed on the first locking plate 120), and the entire trajectory conversion assembly 2 rotates counterclockwise by 180°. At this time, the guide wheel member 504 just moves to the intersection position of the second guide groove 109 and the descending channel 112. At this time, the first rotating shaft 506 just aligns with the descending channel 112. The pressure sensor on the first locking plate 120 transmits the pressure signal to the control system, and the power motor 107 is controlled to be turned off through the control system. After the plastic sealing process of a certain side of the chip 6 is completed by the second plastic sealing assembly 103, the U-shaped lifting plate 408 is controlled to move downward so that the guide wheel member 504 at the intersection position of the second guide groove 109 and the descending channel 112 enters the descending channel 112 until the first rotating shaft 506 just aligns with the intersection position of the descending channel 112 and the third guide groove 110. When the control system receives the pressure signal from the pressure sensor at the inner bottom of the U-shaped mounting frame 401, the power motor 107 is controlled to start to drive the entire chip conveying mechanism 3 to move the chip 6 back to the position of the first plastic sealing assembly 102. Subsequently, the electromagnet on the first locking plate 120 is controlled to be powered off and demagnetized, and at the same time, the electromagnet on the second locking plate 121 is controlled to be powered on and magnetized. Under the elastic restoring force of the second elastic member 122, the conversion tooth plate 117 moves in the reverse direction to drive the entire trajectory conversion assembly 2 to rotate 180° in the reverse direction to complete the reset (the entire trajectory conversion assembly 2 is made of lightweight materials). At this time, the second magnetic plate 118 is firmly adsorbed on the second locking plate 121 again under the action of strong magnetic suction force.;

[0047] In some embodiments, such as Figure 4 and Figure 7As shown, an extension channel 123 communicating with the fourth guide groove 111 is formed in the plastic-sealed carrier 104. A moving member 124 is slidably disposed inside the extension channel 123, and a second guiding member 125 is slidably disposed inside the fourth guide groove 111. The second guiding member 125 and the moving member 124 are connected by a linkage rod 126. A moving plate 127 fixed to the moving member 124 is disposed outside the plastic-sealed carrier 104. A signal triggering portion 128 is fixedly disposed on one side of the moving plate 127. The moving plate 127 and a limit mounting plate 129 on the plastic-sealed carrier 104 are connected by a third elastic member 130, and a pressure sensor is mounted on the limit mounting plate 129. When the entire chip conveying mechanism 3 is driven by the power motor 107 to move the chip 6 back to the position of the first plastic-sealing assembly 102, the guide wheel member 504 sliding inside the fourth guide groove 111 pushes the second guiding member 125 to move. The moving member 124 moving synchronously with the second guiding member 125 drives the moving plate 127 to move and compress the third elastic member 130 until the signal triggering portion 128 abuts against the limit mounting plate 129. At this time, the control system receives the pressure signal from the pressure sensor on the limit mounting plate 129 and controls to turn off the power motor 107. The guide wheel member 504 sliding along the fourth guide groove 111 just moves to the intersection position of the fourth guide groove 111 and the rising channel 113. When the entire turning control assembly 5 is controlled by the lifting cylinder 404 to move upward to complete the reset, the signal triggering portion 128 is reset under the elastic restoring force of the third elastic member 130, and the second guiding member 125 returns to the fourth guide groove 111 again.

[0048] In the description of this specification, the descriptions referring to the terms "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0049] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the relevant art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. An encapsulation control system for multi-die production, characterized in that, Comprising: A plastic encapsulation mechanism (1), the plastic encapsulation mechanism (1) includes a conversion installation port (101), a first guiding track and a second guiding track. Both the first guiding track and the second guiding track are communicated with the conversion installation port (101), and the first guiding track is communicated with the second guiding track. One side of the conversion installation port (101) is provided with a first plastic encapsulation component (102) and a second plastic encapsulation component (103); A track conversion component (2), the track conversion component (2) is rotatably installed inside the conversion installation port (101). The track conversion component (2) includes a third guiding track (201) communicated with the first guiding track. When the track conversion component (2) is rotated 180°, the third guiding track (201) is communicated with the second guiding track; A chip conveying mechanism (3), the chip conveying mechanism (3) includes a lifting control component (4) slidably arranged on the plastic encapsulation mechanism (1), and a turning control component (5) is arranged on the lifting control component (4); Wherein, the turning control component (5) includes a supporting disk (501) and a supporting plate (502) that rotate synchronously. A hollow negative pressure part (503) for adsorbing the chip (6) is arranged on the supporting plate (502). Four groups of elastic guiding parts are circumferentially and arrayedly arranged on the supporting disk (501). The elastic guiding part includes a guide wheel part (504). An electromagnet magnetically repulsive to the corresponding guide wheel part (504) is installed on the supporting disk (501). When the guide wheel part (504) is controlled to pass through the third guiding track (201), the chip (6) is rotated 90°; 2. The encapsulation control system for multi-die production according to claim 1, characterized in that The plastic encapsulation mechanism (1) further includes a plastic encapsulation carrier (104). The conversion installation port (101) is arranged on the plastic encapsulation carrier (104). Horizontal guide rails (105) are fixedly arranged at the top and bottom of the plastic encapsulation carrier (104). The first plastic encapsulation component (102) and the second plastic encapsulation component (103) are both installed inside the plastic encapsulation carrier (104) and are arranged oppositely. A power screw (106) is rotatably arranged at the bottom of the plastic encapsulation carrier (104), and the power screw (106) is connected to the output end of a power motor (107) on the plastic encapsulation carrier (104); 3. The encapsulation control system for multi-die production according to claim 2, wherein, The first guiding track includes a first guide groove (108) and a second guide groove (109) arranged on both sides of the conversion installation port (101). The second guide groove (109) is arranged above the first guide groove (108), and both are communicated with the conversion installation port (101); The second guiding track includes a third guide groove (110) and a fourth guide groove (111) arranged on both sides of the conversion installation port (101). The fourth guide groove (111) is arranged below the third guide groove (110), and both are communicated with the conversion installation port (101). The third guide groove (110) is communicated with the second guide groove (109) above it through a descending channel (112). The fourth guide groove (111) is communicated with the first guide groove (108) above it through an ascending channel (113).

4. A packaging control system for multi-die production according to claim 3, characterized in that, The described trajectory conversion component (2) further includes a trajectory conversion disk (202) rotatably mounted inside the conversion mounting opening (101). A support ring (203) is fixedly arranged on one side of the trajectory conversion disk (202). An external tooth ring (204) is fixedly arranged on the circumferential surface of the support ring (203). The third guiding trajectory (201) is arranged on the other side of the trajectory conversion disk (202). The third guiding trajectory (201) is composed of a first conversion groove (205), a second conversion groove (206) and an arc conversion groove (207). The arc conversion groove (207) communicates with the first conversion groove (205) and the second conversion groove (206) on its two sides. The arc conversion groove (207) is a quarter-circle structure.

5. The encapsulation control system for multi-die production according to claim 4, wherein The described lifting control component (4) includes a U-shaped mounting frame (401) sleeved on the plastic-encapsulated carrier (104). A limiting channel (402) slidably matched with the horizontal guide rail (105) is formed on the U-shaped mounting frame (401). A support frame (403) is fixedly arranged at the top of the U-shaped mounting frame (401). A lifting cylinder (404) is mounted on the support frame (403). An internal thread plate (405) sleeved on the power screw (106) is fixed at the bottom of the U-shaped mounting frame (401). The internal thread plate (405) is threadedly connected with the power screw (106). A limiting channel (406) and a limiting guide seat (407) are arranged on one side of the U-shaped mounting frame (401). A U-shaped lifting plate (408) connected to the output end of the lifting cylinder (404) is arranged inside the U-shaped mounting frame (401).

6. The encapsulation control system for multi-die production according to claim 5, characterized in that, The described turning control component (5) further includes a lifting frame (505) slidably arranged on the limiting guide seat (407). A first rotating shaft (506) and a second rotating shaft (507) are respectively rotatably arranged on the lifting frame (505). One end of the first rotating shaft (506) penetrates through the limiting channel (406) and the U-shaped lifting plate (408) and is fixedly connected with the support disk (501). A first transmission wheel (508) is fixedly mounted at the other end of the first rotating shaft (506). A positioning disk (509) rotatably connected with the U-shaped lifting plate (408) is fixed on the circumferential surface of the first rotating shaft (506). A second transmission wheel (510) is fixedly mounted on the circumferential surface of the second rotating shaft (507). The first transmission wheel (508) is connected with the second transmission wheel (510) through a transmission belt (511). A support plate (502) is fixedly arranged at the end of the second rotating shaft (507). A negative pressure generator (512) for controlling the negative pressure in the inner cavity of the hollow negative pressure part (503) is mounted on the support plate (502).

7. A packaging control system for multi-die production according to claim 6, characterized in that, The elastic guiding part further includes a first moving rod (513) slidably arranged at an eccentric position of the support disk (501). A connecting disk fixedly arranged at one end of the first moving rod (513) is connected to the support disk (501) through a first elastic member (514). The guide wheel member (504) is installed at the other end of the first moving rod (513). Pressure sensors are installed at both the inner top and inner bottom of the U-shaped mounting frame (401).

8. A packaging control system for multi-die production according to claim 7, characterized in that, A first guiding member (114) is slidably arranged inside the second guiding groove (109). A through channel (115) is formed inside the second guiding groove (109). A first magnetic plate (116) fixed to the first guiding member (114) is arranged on the outer side of the plastic encapsulation carrier (104). A conversion tooth plate (117) meshing with the outer gear ring (204) is fixed to one side of the first magnetic plate (116). A second magnetic plate (118) is fixedly installed at the end of the conversion tooth plate (117). A second moving rod (119) is fixedly arranged on the other side of the first magnetic plate (116). A first locking plate (120) and a second locking plate (121) are respectively installed on the plastic encapsulation carrier (104). An electromagnet and a pressure sensor are installed on the first locking plate (120). An electromagnet magnetically attracting the second magnetic plate (118) is installed on the second locking plate (121). The electromagnet on the first locking plate (120) magnetically attracts the first magnetic plate (116). The second moving rod (119) slidably penetrates through the first locking plate (120). A connecting disk fixed to the end of the second moving rod (119) is connected to the first locking plate (120) through a second elastic member (122).

9. The encapsulation control system for multi-die production according to claim 8, characterized in that, An extension channel (123) communicating with the fourth guiding groove (111) is formed on the plastic encapsulation carrier (104). A moving member (124) is slidably arranged inside the extension channel (123). A second guiding member (125) is slidably arranged inside the fourth guiding groove (111). The second guiding member (125) is connected to the moving member (124) through a linkage rod (126). A moving plate (127) fixed to the moving member (124) is arranged on the outer side of the plastic encapsulation carrier (104). A signal triggering part (128) is fixedly arranged on one side of the moving plate (127). The moving plate (127) is connected to a limit mounting plate (129) on the plastic encapsulation carrier (104) through a third elastic member (130). A pressure sensor is installed on the limit mounting plate (129).

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