Processing device for SMD (Surface Mount Device) diode

Abstract

The invention relates to the field of SMD diode welding processing, in particular to a processing device for an SMD diode. The technical problem of the invention is to provide the processing device for the SMD diode, which can perform high-precision welding processing on the SMD diode and is high in automation degree. According to the technical scheme, the device comprises an external connection frame, a first electric sliding rail is fixedly connected to the external connection frame, and a mounting cabin is fixedly connected to a moving part of the first electric sliding rail. The PCB is arranged below the shifting mechanism, the copper welding position, needing secondary processing, of the PCB is located below the paste outlet pipes by moving the PCB, the distance between the two paste outlet pipes can be adjusted, and compared with the mode that a solder paste needle tube is manually held by hand to be aligned with the copper welding position, the copper welding position of the PCB can be subjected to secondary processing; according to the invention, the tinning position of the SMD diode welded and processed on the PCB can be accurate.

Description

Technical Field

[0001] The present invention relates to the field of soldering processing of surface mount diodes, and particularly to a processing device for surface mount diodes. Background Art

[0002] When a surface mount diode is soldered onto a PCB board, especially during the process of screen printing solder paste, there is a phenomenon that some copper solder pads on the PCB board have solder paste leakage or insufficient solder paste amount. As a result, when the surface mount diode is subsequently assembled and processed automatically using a surface mount diode automatic assembly machine, the welding stability between the surface mount diode and some copper solder pads on the PCB board is insufficient, which further leads to abnormal on-off of the circuit signal. All these need to be carried out on the subsequent quality inspection line of the PCB board; and there is also a possibility that the surface mount diode itself has a fault in the case of abnormal current or resistance signals detected on the quality inspection line. Therefore, it is necessary to perform secondary soldering processing on the abnormal points on the PCB board with abnormalities.

[0003] Currently, the PCB board with the abnormal points identified through the quality inspection line cannot be sent into the surface mount diode automatic assembly machine for automated assembly and processing again. To avoid scrapping of this PCB board, it is necessary to manually perform secondary soldering processing on this PCB board; however, currently, when performing secondary soldering processing on the abnormal points on the PCB board, it requires a lot of manpower and time, the operation steps are very cumbersome, and the operation accuracy also needs to be very high. It is necessary to squeeze a certain amount of solder paste at the small copper solder pads on the PCB board manually, then use a micro tweezer to pick up the surface mount diode and accurately place it on the PCB board, and then use a hot air gun to melt the solder paste to complete the soldering; but it is difficult to achieve a certain standard amount of solder paste extrusion in this way. If the solder paste amount is insufficient or excessive, it is easy to cause poor soldering or the solder paste to adhere to the surrounding solidified solder paste; it is also necessary to accurately control the blowing position and time of the hot air gun, otherwise the hot air gun is likely to cause the surrounding solidified solder paste to melt.

[0004] Therefore, it is necessary to design a processing device for surface mount diodes to solve the above problems. Summary of the Invention

[0005] In order to overcome the disadvantages of insufficient manual operation accuracy and high operation difficulty when performing secondary soldering processing of surface mount diodes on the abnormal points of the PCB board, the purpose of the present invention is to provide a processing device for surface mount diodes that can perform high-precision soldering processing and has a high degree of automation.

[0006] The technical solution of the present invention is as follows: A processing device for a surface-mounted diode includes an external frame. A first electric slide rail is fixedly connected to the external frame. An installation cabin is fixedly connected to the moving part of the first electric slide rail. A propulsion frame is fixedly connected to the lower side of the installation cabin. An installation frame is fixedly connected to the lower side of the right external frame. A fixed cabin is fixedly connected to the lower side of the installation frame. A connection cabin is fixedly connected to the lower side of the fixed cabin. A suction mechanism is provided at the left side position inside the installation cabin. The suction mechanism is used for sucking and releasing the surface-mounted diode. A driving mechanism is provided at the right side position inside the installation cabin. The driving mechanism is used for driving the suction mechanism to perform lifting movement and supplying the gas for suction. An adjusting mechanism is provided inside the fixed cabin. Two lifting mechanisms are provided at the adjusting mechanism. Shifting mechanisms are provided at both of the lifting mechanisms. A discharging mechanism and a heating mechanism are provided at both of the shifting mechanisms. The discharging mechanism is used for squeezing solder paste into the brazing position of the PCB board. The heating mechanism is used for melting the squeezed solder paste to weld the surface-mounted diode. The adjusting mechanism can adjust and control the distance between the two lifting mechanisms. The lifting mechanism is used for controlling the height of the shifting mechanism. The shifting mechanism can be pushed by the propulsion frame to move the discharging mechanism and the heating mechanism as a whole to the right.

[0007] Preferably, the suction mechanism includes a first moving pair, which is fixedly connected to the left side position inside the installation cabin. A guiding frame is fixedly connected to the moving part of the first moving pair. The guiding frame is a double-layer frame structure. Guiding rings are fixedly connected to both the upper and lower layer structures of the guiding frame. A first elastic member is fixedly connected to the upper layer structure of the guiding frame. A fixed ring is fixedly connected to the lower side of the first elastic member. A suction tube is slidably sleeved between the guiding rings. The suction tube is fixedly connected to the fixed ring. A suction cup is detachably installed on the lower side of the suction tube.

[0008] Preferably, the driving mechanism includes a second electric slide rail, which is fixedly connected to the right side of the installation cabin. A driving plate is fixedly connected to the moving part of the second electric slide rail. The left side of the driving plate is fixedly connected to the guiding frame. An air pump is fixedly connected to the upper side of the driving plate. The suction end of the air pump is fixedly connected to a flexible air tube. The other end of the flexible air tube is fixedly connected to the upper end of the suction tube.

[0009] Preferably, the adjusting mechanism includes a double-shaft motor, which is installed in the middle of the fixed cabin. Lead screw pairs are installed at the output shafts of the double-shaft motor. The lead screw pairs are reverse threads. Second moving pairs are installed at the front and rear side positions of the left side wall of the fixed cabin. The moving parts of the second moving pairs are respectively connected to the moving parts of the adjacent lead screw pairs. Moving plates are fixedly connected to the left sides of the moving parts of the second moving pairs. The lifting mechanisms are respectively provided at the moving plates.

[0010] Preferably, the lifting mechanism includes a third electric slide rail which is fixedly connected to the moving plate respectively, and a mounting seat is fixedly connected to the lower side of the moving part of the third electric slide rail.

[0011] Preferably, the shifting mechanism includes a third moving pair which is fixedly connected to the lower side of the mounting seat respectively. Second elastic members are installed at the third moving pairs. A connecting seat is fixedly connected to the moving part of the third moving pair. Paste discharging pipes are fixedly connected to the right sides of the lower sides of the connecting seats, and air discharging pipes are fixedly connected to the left sides of the lower sides of the connecting seats. Contact frames are fixedly connected to the opposite sides of the connecting seats, and the pushing frame can contact with the contact frames.

[0012] Preferably, the discharging mechanism includes solder paste cylinders which are fixedly connected to the front and rear positions inside the connecting cabin respectively. Piston seats are slidably and sealingly arranged inside the solder paste cylinders. An electric push rod is installed in the middle of the connecting cabin, and the moving part of the electric push rod is connected to the right end of the piston seat respectively. Delivery pipes are fixedly connected to the left sides of the solder paste cylinders, and the delivery pipes are connected to the adjacent paste discharging pipes respectively.

[0013] Preferably, the heating mechanism includes hot air blowers which are fixedly connected to the front and rear sides of the connecting cabin respectively. Air outlet pipes are fixedly connected to the air outlet ends of the hot air blowers, and the air outlet pipes are connected to the adjacent air discharging pipes respectively.

[0014] Preferably, a laser sensor is further included, and the laser sensor is fixedly connected to the right side of the contact frame respectively.

[0015] Preferably, a monitoring probe is further included, and the monitoring probe is fixedly connected to the middle of the left side of the fixed cabin.

[0016] The beneficial effects of the present invention are as follows: 1. By placing the PCB board below the shifting mechanism, moving the PCB board so that the brazing position to be processed secondarily is below the paste discharging pipe, and adjusting the distance between the two paste discharging pipes, compared with manually holding a solder paste syringe to align with the brazing position, the present invention can accurately position the soldering position of the surface mount diode on the PCB board. And by controlling the electric push rod to make the solder paste cylinder discharge solder, compared with the control accuracy of manually extruding the solder paste amount, the present invention can accurately control the solder amount of the surface mount diode soldering process on the PCB board.

[0017] 2. By arranging a right discharge pipe and a left air outlet pipe on the interconnection base, and cooperating with the rightward propulsion of the contact frame by the propulsion frame, after the soldering of the PCB board is completed and the suction mechanism sucks the surface mount diode and resets to the right, the paste discharge pipe can be directly displaced to the right, and at the same time, the air outlet pipe can be positioned directly above the soldering position on the PCB board. Then, a hot air blower is used to convey hot air to the lower end of the air outlet pipe to discharge and melt the solder paste. Compared with the current soldering process of surface mount diodes, the present invention reduces the manual operation steps. And by using the method of blowing hot air through the air outlet pipe to align with the solder paste, precise hot air melting can be carried out on the soldering position of the PCB board. Compared with the traditional large-diameter hot air gun, the present invention will not cause the disadvantage of melting the solidified solder on the other normal copper soldering positions.

[0018] 3. By adopting the method that the suction cup of the suction mechanism contacts the upper surface of the surface mount diode, and in combination with the guiding ring and the first elastic member, the suction cup can flexibly contact the upper surface of the surface mount diode for suction and release, ensuring the safety of the surface mount diode and avoiding damage to the surface mount diode due to mechanical extrusion. And by controlling the displacement of the first electric slide rail and combining with the conveyor belt installed at the external frame, the suction process of the surface mount diode can be automated, eliminating the need for manual clamping with micro tweezers, thus improving the picking accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is the first three-dimensional structure schematic diagram of the present invention.

[0020] Figure 2 It is the second three-dimensional structure schematic diagram of the present invention.

[0021] Figure 3 It is the third three-dimensional structure schematic diagram of the present invention.

[0022] Figure 4 It is the first three-dimensional structure schematic diagram of the installation cabin part of the present invention.

[0023] Figure 5 It is the second three-dimensional structure schematic diagram of the installation cabin part of the present invention.

[0024] Figure 6 It is the third three-dimensional structure schematic diagram of the installation cabin part of the present invention.

[0025] Figure 7 It is the first three-dimensional structure schematic diagram of the fixed cabin part of the present invention.

[0026] Figure 8 It is the second three-dimensional structure schematic diagram of the fixed cabin part of the present invention.

[0027] Figure 9 It is the third three-dimensional structure schematic diagram of the fixed cabin part of the present invention.

[0028] Figure 10 This is a schematic perspective view of the lifting mechanism part of the present invention.

[0029] Figure 11 This is a schematic perspective view of the shifting mechanism part of the present invention.

[0030] Figure 12 This is a partial schematic perspective view of the shifting mechanism part of the present invention.

[0031] Figure 13 This is a schematic perspective view of the connection cabin part of the present invention.

[0032] Figure 14 This is a schematic perspective view of the assembly of the present invention.

[0033] Reference numerals in the drawings: 1, external frame; 2, first electric slide rail; 3, installation cabin; 31, propulsion frame; 4, mounting rack; 5, fixed cabin; 51, connection cabin; 6, suction mechanism; 7, driving mechanism; 8, adjusting mechanism; 9, lifting mechanism; 10, shifting mechanism; 11, discharging mechanism; 12, heating mechanism; 61, first moving pair; 62, guiding frame; 63, guiding ring; 64, first elastic member; 65, fixed ring; 66, suction pipe; 67, suction cup; 71, second electric slide rail; 72, driving plate; 73, air pump; 74, flexible air pipe; 81, biaxial motor; 82, lead screw pair; 83, second moving pair; 84, moving plate; 91, third electric slide rail; 92, mounting seat; 101, third moving pair; 102, second elastic member; 103, interconnecting seat; 104, paste discharging pipe; 105, air outlet pipe; 106, contact frame; 111, solder paste cylinder; 112, piston seat; 113, electric push rod; 114, conveying pipe; 121, hot air blower; 122, air outlet duct; 13, laser sensor; 14, monitoring probe. Detailed implementation manners

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Embodiment 1, as Figures 1-4 and Figure 14As shown in the figure, a processing device for surface-mounted diodes includes an external frame 1, a first electric slide rail 2, an installation cabin 3, a propulsion frame 31, an installation frame 4, a fixed cabin 5, a connection cabin 51, a suction mechanism 6, a driving mechanism 7, an adjusting mechanism 8, a lifting mechanism 9, a shifting mechanism 10, a discharging mechanism 11 and a heating mechanism 12. There are two groups of external frames 1. A first electric slide rail 2 is fixedly connected between the external frames 1. The first electric slide rail 2 is controlled by a servo system and is horizontally arranged in the left-right direction. A moving part of the first electric slide rail 2 is fixedly connected with an installation cabin 3. The installation cabin 3 is a vertically arranged hollow structure. Starting the first electric slide rail 2 will cause its moving part to drive the installation cabin 3 to move left and right. A propulsion frame 31 is fixedly connected to the lower side of the installation cabin 3. The lower side of the right external frame 1 is fixedly connected with an installation frame 4. The lower side of the installation frame 4 is fixedly connected with a fixed cabin 5. The lower side of the fixed cabin 5 is fixedly connected with a connection cabin 51. A suction mechanism 6 is arranged at the left side position inside the installation cabin 3. The suction mechanism 6 is used for sucking and releasing surface-mounted diodes. A driving mechanism 7 is arranged at the right side position inside the installation cabin 3. The driving mechanism 7 is used for driving the suction mechanism 6 to perform lifting motion and supplying gas for suction. An adjusting mechanism 8 is arranged inside the fixed cabin 5. There are two groups of lifting mechanisms 9 at the adjusting mechanism 8. Shifting mechanisms 10 are arranged at both lifting mechanisms 9. Discharging mechanisms 11 and heating mechanisms 12 are arranged at both shifting mechanisms 10. The discharging mechanism 11 is used for squeezing solder paste into the brazing positions of the PCB board. The heating mechanism 12 is used for melting the squeezed solder paste to weld the surface-mounted diodes. The adjusting mechanism 8 can adjust and control the distance between the two groups of lifting mechanisms 9, and further adjust the distance between the two groups of discharging mechanisms 11 and heating mechanisms 12 to adapt to brazing positions with different lead pitches. The lifting mechanism 9 is used for controlling the height of the shifting mechanism 10, and further positioning the discharging mechanism 11 and the heating mechanism 12 at the brazing positions of the PCB board to squeeze solder paste and perform melting. The shifting mechanism 10 can be pushed by the propulsion frame 31 to move the discharging mechanism 11 and the heating mechanism 12 as a whole to the right. After the discharging mechanism 11 squeezes solder paste at the brazing position of a PCB board, the heating mechanism 12 can move to the right and be located above the brazing position of this PCB board to perform solder paste melting.

[0036] As Figures 4-6As shown in the figure, the suction mechanism 6 includes a first moving pair 61, a guide frame 62, a guide ring 63, a first elastic member 64, a fixed connection ring 65, a suction tube 66, and a suction cup 67. The first moving pair 61 is fixedly connected to the left inner position of the installation cabin 3. The first moving pair 61 is a vertically arranged track pair. A guide frame 62 is fixedly connected to the moving member of the first moving pair 61. The guide frame 62 is a double-layer frame structure. Guide rings 63 are fixedly connected to both the upper and lower layer structures of the guide frame 62. A first elastic member 64 is fixedly connected to the upper layer structure of the guide frame 62. The first elastic member 64 is a straight spring. A fixed connection ring 65 is fixedly connected to the lower side of the first elastic member 64. The fixed connection ring 65 is blocked by the lower layer structure of the guide frame 62. The suction tube 66 is slidably sleeved between the guide rings 63. The suction tube 66 is fixedly connected to the fixed connection ring 65. A suction cup 67 is detachably installed on the lower side of the suction tube 66. The suction cup 67 is made of soft rubber material, and the number and size of the suction cups 67 are not unique.

[0037] As Figures 4-6 shown in the figure, the driving mechanism 7 includes a second electric slide rail 71, a driving plate 72, an air pump 73, and a flexible air tube 74. The second electric slide rail 71 is fixedly connected to the right side of the installation cabin 3. The second electric slide rail 71 is controlled by a servo system. The second electric slide rail 71 is vertically arranged. A driving plate 72 is fixedly connected to the moving member of the second electric slide rail 71. The left side of the driving plate 72 is fixedly connected to the guide frame 62. When the second electric slide rail 71 is started, the second electric slide rail 71 will drive its moving member and the driving plate 72 to move up and down, thereby driving the guide frame 62 to move up and down. An air pump 73 is fixedly connected to the upper side of the driving plate 72. The suction end of the air pump 73 is fixedly connected to a flexible air tube 74. The other end of the flexible air tube 74 is fixedly connected to the upper end of the suction tube 66. When the air pump 73 is started, the air pump 73 will extract the air in the suction cup 67 through the flexible air tube 74 and the suction tube 66, so that the suction cup 67 can suck the surface-mounted diode to be welded and processed. When the second electric slide rail 71 is started and the suction cup 67 moves downward to contact the surface-mounted diode, the suction cup 67 and the suction tube 66 move relatively upward through the guide ring 63, so that the fixed connection ring 65 moves relatively upward and the first elastic member 64 is in a compressed state, so that the suction cup 67 always maintains flexible contact with the surface-mounted diode through the first elastic member 64, and will not be affected by the mechanical drive of the second electric slide rail 71 working, avoiding hard contact of the suction cup 67 due to the inconsistent height of the surface-mounted diodes, and protecting the safety of the surface-mounted diodes when being sucked and released onto the PCB board.

[0038] As Figures 8-9As shown in the figure, the adjusting mechanism 8 includes a dual-axis motor 81, a lead screw pair 82, a second moving pair 83, and a moving plate 84. The dual-axis motor 81 is installed in the middle of the fixed cabin 5. The dual-axis motor 81 is controlled by a servo system. The output shafts of the dual-axis motor 81 face the front and rear sides respectively. Lead screw pairs 82 are installed at the output shafts of the dual-axis motor 81. The lead screw pairs 82 are reverse threads. Second moving pairs 83 are installed at the front and rear positions on the left side wall of the fixed cabin 5. The second moving pairs 83 are guiding pairs arranged horizontally. The moving parts of the second moving pairs 83 are respectively connected to the moving parts of the adjacent lead screw pairs 82. Moving plates 84 are fixedly connected to the left sides of the moving parts of the second moving pairs 83. Lifting mechanisms 9 are respectively arranged at the moving plates 84. When the dual-axis motor 81 is started, the dual-axis motor 81 can drive the lead screw pair 82 to rotate, and then drive the moving plates 84 to move in opposite sides, so that the moving plates 84 approach or move away from each other.

[0039] As Figures 8-10 shown in the figure, the lifting mechanism 9 includes a third electric slide rail 91 and a mounting seat 92. The third electric slide rails 91 are respectively fixedly connected to the moving plates 84. The third electric slide rails 91 are all synchronously controlled by a servo system. The third electric slide rails 91 are all vertically arranged. A mounting seat 92 is fixedly connected to the lower side of the moving part of the third electric slide rail 91. When the third electric slide rail 91 is started, it will drive the mounting seat 92 to lift.

[0040] As Figures 10-12 shown in the figure, the shifting mechanism 10 includes a third moving pair 101, a second elastic member 102, an interconnecting seat 103, a paste outlet pipe 104, an air outlet pipe 105, and a contact frame 106. The third moving pairs 101 are respectively fixedly connected to the lower sides of the mounting seats 92. The third moving pairs 101 are all arranged horizontally from left to right. Second elastic members 102 are installed at the third moving pairs 101. The second elastic members 102 are straight springs. An interconnecting seat 103 is fixedly connected to the moving part of the third moving pair 101. Paste outlet pipes 104 are fixedly connected to the lower right sides of the interconnecting seats 103. The lower sides of the paste outlet pipes 104 are all structures with rubber heads. Air outlet pipes 105 are fixedly connected to the lower left sides of the interconnecting seats 103. The lower sides of the air outlet pipes 105 are all structures with rubber heads. The height of the air outlet pipes 105 from the ground is higher than that of the paste outlet pipes 104. Contact frames 106 are fixedly connected to the opposite sides of the interconnecting seats 103. The pushing frame 31 can contact with the contact frames 106.

[0041] As Figure 9 、 Figure 10 and Figure 13As shown in the figure, the discharging mechanism 11 includes a solder paste cylinder 111, a piston seat 112, an electric push rod 113 and a conveying pipe 114. The solder paste cylinders 111 are respectively fixedly connected to the front and rear positions inside the connection cabin 51. The solder paste cylinders 111 are used for placing solder paste. Piston seats 112 are slidably and sealingly arranged inside the solder paste cylinders 111. An electric push rod 113 is installed in the middle of the connection cabin 51. The moving parts of the electric push rod 113 are respectively connected to the right ends of the piston seats 112. Conveying pipes 114 are fixedly connected to the left sides of the solder paste cylinders 111. The conveying pipes 114 are respectively connected to the adjacent paste discharging pipes 104.

[0042] As Figure 9 , Figure 10 and Figure 13 As shown in the figure, the heat supply mechanism 12 includes a hot air blower 121 and an air outlet pipe 122. The hot air blowers 121 are respectively fixedly connected to the front and rear sides of the connection cabin 51. Air outlet pipes 122 are fixedly connected to the air outlet ends of the hot air blowers 121. The air outlet pipes 122 are respectively connected to the adjacent air outlet pipes 105.

[0043] As Figure 7 As shown in the figure, it further includes a laser sensor 13. The laser sensors 13 are respectively fixedly connected to the right sides of the contact frames 106. The laser sensors 13 can detect the positions of the soldering positions on the PCB below them, and the relative positions of the two paste discharging pipes 104 can be determined according to the relative positions of the laser sensors 13, so that the operation of the dual-axis motor 81 can be controlled more precisely.

[0044] As Figure 7 As shown in the figure, it further includes a monitoring probe 14. The monitoring probe 14 is fixedly connected to the middle of the left side of the fixed cabin 5. The monitoring probe 14 can transmit the soldering process of the PCB board below it in real time.

[0045] Embodiment 2, as Figures 1-14 As shown in the figure, the installation method of the processing device for surface-mount diodes: ① Installation: Install the external frames 1 on the left and right sides of the processing device for surface-mount diodes on the workbench base, and then install the conveyor belt for transporting surface-mount diodes below the left external frame 1; Connect and install the power circuit and control circuit of the processing device for surface-mount diodes. ② Assembly: Place the surface-mount diodes to be welded and processed on the conveyor belt, and then place the PCB boards that have been detected and are unqualified and waiting for secondary processing under the fixed cabin 5.

[0046] The material taking method of the processing device for patch diodes: ① Control the first electric slide rail 2 to drive the installation cabin 3 to move leftward, so that the installation cabin 3 drives the suction mechanism 6 and the driving mechanism 7 to move leftward, and make the suction cup 67 of the suction mechanism 6 located directly above the patch diode on the conveyor belt; ② Control the second electric slide rail 71 to operate, so that the driving plate 72 drives the guide frame 62 and the suction cup 67 to move downward, and make the suction cup 67 contact the upper surface of the patch diode; ③ Control the air pump 73 to operate, so that the air pump 73 extracts the air between the suction cup 67 and the upper surface of the patch diode, and make the suction cup 67 suck the patch diode; ④ Control the second electric slide rail 71 to drive the suction cup 67 to move upward, so that the suction cup 67 drives the patch diode it sucks to move upward, and complete the material taking.

[0047] The soldering tin method of the processing device for patch diodes: ① Move the PCB board to make the copper soldering position that needs secondary processing on the PCB board located below the solder paste tube 104, and control the operation of the double-shaft motor 81 to make both solder paste tubes 104 located directly above the copper soldering position that needs secondary processing on the PCB board; ② Control the third electric slide rail 91 to operate, so that the third electric slide rail 91 drives the solder paste tube 104 to move downward, and make the solder paste tube 104 contact the copper soldering position that needs secondary processing on the PCB board; ③ Control the operation of the electric push rod 113 to make the electric push rod 113 drive the piston seat 112 to move to the left, so that the solder paste in the solder paste cylinder 111 is respectively extruded into the solder paste tube 104 through the delivery pipe 114, and is extruded into the surface of the copper soldering position that needs secondary processing on the PCB board at the lower end of the solder paste tube 104; ④ Control the third electric slide rail 91 to drive the solder paste tube 104 to move upward for reset.

[0048] The soldering process of the processing device for surface mount diodes is as follows: ① Control the suction cup 67 that has completed material taking to reset to the right through the installation cabin 3 and the first electric slide rail 2, so that the propulsion frame 31 pushes the contact frame 106 to the right; ② When the contact frame 106 is pushed to the right, it will drive the moving part of the third moving pair 101 to move to the right, thereby driving the solder paste tube 104 and the air outlet pipe 105 to move to the right, so that the air outlet pipe 105 moves to directly above the soldering position on the PCB board after tinning; ③ Control the second electric slide rail 71 to lower and run again, so that the suction cup 67 drives the surface mount diode it holds to move downward to the soldering position on the PCB board after tinning. Then control the air pump 73 to blow air to make the suction cup 67 release the surface mount diode it holds, so that the surface mount diode is released at the soldering position on the PCB board after tinning; ④ Control the hot air blower 121 to operate, so that the hot air blower 121 blows hot air from the air outlet pipe 122 through the air outlet pipe 105, making the air outlet pipe 105 accurately align with the soldering position on the PCB board after tinning, melting the solder paste, and then welding the electrodes of the surface mount diode to the soldering position on the PCB board through the solder paste; ⑤ After completing the soldering at this point, the processing device for surface mount diodes can enter the material taking process as described above in the "material taking method of the processing device for surface mount diodes" again. When the installation cabin 3 moves to the left during this process, the propulsion frame 31 disengages from the contact with the contact frame 106, and the second elastic member 102 will enter the reset state, thereby driving the interconnection base 103 to move to the left for reset, thereby driving the solder paste tube 104 and the air outlet pipe 105 to move to the left for reset. At this time, the PCB board can be moved as described above, so that the soldering position of the next PCB board that needs secondary processing moves below the solder paste tube 104.

[0049] Further explanation: The slide rail clamping platform of the PCB board can be installed below the processing device for surface mount diodes to make the movement process of the PCB board more accurate and stable.

[0050] It should be understood that the above description is only for exemplary purposes and does not mean to limit the present invention. Those skilled in the art will understand that the variant forms of the present invention will be included within the scope of the claims herein.

Claims

1. A processing device for surface mount diodes, characterized in that: It includes an external frame (1), and is characterized in that: a first electric slide rail (2) is fixedly connected to the external frame (1), an installation cabin (3) is fixedly connected to the moving part of the first electric slide rail (2), a propulsion frame (31) is fixedly connected to the lower side of the installation cabin (3), an installation frame (4) is fixedly connected to the lower side of the right external frame (1), a fixed cabin (5) is fixedly connected to the lower side of the installation frame (4), and a connection cabin (51) is fixedly connected to the lower side of the fixed cabin (5). An absorption mechanism (6) is arranged at the left position inside the installation cabin (3), and the absorption mechanism (6) is used for absorbing and releasing patch diodes. A driving mechanism (7) is arranged at the right position inside the installation cabin (3), and the driving mechanism (7) is used for driving the absorption mechanism (6) to perform lifting movement and supply gas for absorption. An adjustment mechanism (8) is arranged inside the fixed cabin (5), two lifting mechanisms (9) are arranged at the adjustment mechanism (8), a displacement mechanism (10) is arranged at each of the lifting mechanisms (9), and a discharging mechanism (11) and a heating mechanism (12) are arranged at each of the displacement mechanisms (10). The discharging mechanism (11) is used for squeezing solder paste into the copper soldering position of the PCB board, and the heating mechanism (12) is used for thermally melting the squeezed solder paste to weld the patch diode. The adjustment mechanism (8) can adjust and control the distance between the two lifting mechanisms (9), and the lifting mechanism (9) is used for controlling the height of the displacement mechanism (10). The displacement mechanism (10) can be pushed by the propulsion frame (31) to move the discharging mechanism (11) and the heating mechanism (12) as a whole to the right.

2. The processing device for a surface mount diode according to claim 1, characterized in that: The absorption mechanism (6) includes a first moving pair (61), the first moving pair (61) is fixedly connected to the left position inside the installation cabin (3), a guiding frame (62) is fixedly connected to the moving part of the first moving pair (61), the guiding frame (62) is a double-layer frame structure, guiding rings (63) are fixedly connected to both the upper and lower layer structures of the guiding frame (62), a first elastic member (64) is fixedly connected to the upper layer structure of the guiding frame (62), a fixed connection ring (65) is fixedly connected to the lower side of the first elastic member (64), an absorption tube (66) is slidably sleeved between the guiding rings (63), the absorption tube (66) is fixedly connected to the fixed connection ring (65), and a suction cup (67) is detachably installed at the lower side of the absorption tube (66).

3. The processing device for a surface mount diode according to claim 2, characterized in that: The driving mechanism (7) includes a second electric slide rail (71), the second electric slide rail (71) is fixedly connected to the right side of the installation cabin (3), a driving plate (72) is fixedly connected to the moving part of the second electric slide rail (71), the left side of the driving plate (72) is fixedly connected to the guiding frame (62), an air pump (73) is fixedly connected to the upper side of the driving plate (72), a flexible air tube (74) is fixedly connected to the suction end of the air pump (73), and the other end of the flexible air tube (74) is fixedly connected to the upper end of the absorption tube (66).

4. A processing device for a surface mount diode according to claim 3, characterized in that: The adjusting mechanism (8) includes a biaxial motor (81) installed in the middle of the fixed cabin (5). Screw pairs (82) are installed at the output shafts of the biaxial motor (81). The screw pairs (82) are reverse threads. Second moving pairs (83) are installed at the front and rear positions on the left side wall of the fixed cabin (5). The moving parts of the second moving pairs (83) are respectively connected to the moving parts of the adjacent screw pairs (82). Moving plates (84) are fixedly connected to the left sides of the moving parts of the second moving pairs (83). The lifting mechanism (9) is respectively arranged at the moving plates (84).

5. The processing device for a surface mount diode according to claim 4, characterized in that: The lifting mechanism (9) includes third electric slide rails (91) fixedly connected to the moving plates (84). A mounting seat (92) is fixedly connected to the lower side of the moving part of the third electric slide rail (91).

6. The processing device for a surface mount diode according to claim 5, wherein: The shifting mechanism (10) includes third moving pairs (101) fixedly connected to the lower sides of the mounting seats (92). Second elastic members (102) are installed at the third moving pairs (101). An interconnecting seat (103) is fixedly connected to the moving part of the third moving pair (101). Paste discharge pipes (104) are fixedly connected to the lower right sides of the interconnecting seats (103). Air discharge pipes (105) are fixedly connected to the lower left sides of the interconnecting seats (103). Contact frames (106) are fixedly connected to the opposite sides of the interconnecting seats (103). The pushing frame (31) can contact the contact frames (106).

7. A processing device for a surface mount diode according to claim 6, characterized in that: The discharging mechanism (11) includes solder paste cylinders (111) fixedly connected to the front and rear positions in the connection cabin (51). Piston seats (112) are slidably and sealingly arranged in the solder paste cylinders (111). An electric push rod (113) is installed in the middle of the connection cabin (51). The moving parts of the electric push rod (113) are respectively connected to the right ends of the piston seats (112). Delivery pipes (114) are fixedly connected to the left sides of the solder paste cylinders (111). The delivery pipes (114) are respectively connected to the adjacent paste discharge pipes (104).

8. A processing device for a surface mount diode according to claim 7, characterized in that: The heating mechanism (12) includes hot air blowers (121) fixedly connected to the front and rear sides of the connection cabin (51). Air outlet pipes (122) are fixedly connected to the air outlet ends of the hot air blowers (121). The air outlet pipes (122) are respectively connected to the adjacent air discharge pipes (105).

9. A processing device for a surface mount diode according to claim 8, characterized in that: It further includes laser sensors (13) fixedly connected to the right sides of the contact frames (106).

10. A processing device for a surface mount diode according to claim 9, characterized in that: It further includes monitoring probes (14) fixedly connected to the middle of the left side of the fixed cabin (5).

Images