Anti-seepage protection and leakage test method for electronic equipment

Abstract

Systems and methods for an electronic device housing are provided herein. In one example, a method for manufacturing an electronic device housing includes molding the housing using a first material, including molding a plurality of interconnected channels extending across a surface of the housing and around a plurality of power end holes of the housing, and injecting a second material into the plurality of interconnected channels to form a continuous seal.

Description

Related Applications

[0001] This application claims priority to U.S. Provisional Application No. 63 / 618,048, filed on January 5, 2024, titled "Voltage Resistance Protection and Leakage Test Method for Electronic Devices", the entire content of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to an electronic device, and more particularly, to anti-seepage protection of the electronic device. Background Art

[0003] Electronic devices can be sensitive to the environment; a small amount of dust or water interacting with the electronic device can cause a decline in the performance of the electronic device. This is especially true for electronic devices that use high input or output currents, such as converters and inverters. Standards provided by the International Electrotechnical Commission (IEC) can rate the dust and water protection performance of such devices. Power converters and inverters can adopt the highest protection levels of IEC67 or IEC68, requiring the device to have dust and water protection functions. This can be achieved by a well-sealed housing that surrounds the device on three sides and is fixed to the bottom plate. The housing can be made of plastic or metal, and the bottom plate can be made of metal to serve as a heat sink for the device.

[0004] Some electronic devices may include components that extend outside the housing of the electronic device. For example, an electronic device can include power terminals that extend from the inside of the electronic device to the outside through power terminal holes in the housing. The power terminals can be made of a conductive material, so that the power source or load connected to the external terminals of the device can make electrical contact with the electronic device inside the device. These power terminals can include a threaded hole located at the center of the outer surface of the power terminal, and an external wire can be connected to the power terminal through a bolt. To prevent dust and water from entering, the power terminal can also be sealed so that dust or water cannot enter the internal space of the housing through the space between the power terminal and the housing. In addition, the interface between the housing and the bottom plate can also be sealed to provide anti-seepage protection.

[0005] Previous attempts to establish a seal between the power terminal and the housing involved rubber O-rings. For example, the power terminal can be machined to create a groove on the circumference of the bolt where the power terminal is to be inserted. The O-ring can be manually placed in the groove. To form a seal between the housing and the bottom plate, a washer can be inserted into a groove shared by the bottom surface of the housing and the bottom plate. The washer can close the gap between the housing and the bottom plate to prevent water and dust from entering.

[0006] The inventors have found that this solution has several drawbacks. Manually placing the O-rings may require more time and labor, and there is a risk of misplacing one or more O-rings. This can result in an incomplete seal around the power terminals, allowing water or dust to enter the electronic device. Additionally, each O-ring on each power terminal may be placed manually, and the gasket used to seal the housing to the base plate may also be placed individually, further increasing the time required to manufacture the product. Summary of the Invention

[0007] The present inventors have recognized the above challenges and developed a method for manufacturing an electronic device housing to overcome these challenges. In one example, the method includes molding the housing using a first material, where the molding includes molding a plurality of interconnected channels that span the surface of the housing and extend around a plurality of power terminal holes in the housing, and injecting a second material into the plurality of interconnected channels to form a continuous seal. In this way, the plurality of interconnected channels enable the second material to form a continuous seal, and during a single injection process, the second material can provide a seal around each power terminal and along the sealing interface with the base plate (e.g., the location where a gasket is typically placed). According to the method of the present disclosure, no part of the seal needs to be placed manually, thereby reducing the risk of misplacing the seal and also reducing the time required to manufacture the housing.

[0008] It should be understood that the above summary is to introduce some concepts further described in the detailed description in a simplified form. It is not intended to identify the key or essential features of the claimed subject matter, the scope of which is uniquely determined by the claims that follow the detailed description. Additionally, the claimed subject matter is not limited to embodiments that solve any disadvantages noted above or in any part of the present disclosure. Brief Description of the Drawings

[0009] Figure 1 is an external view of an example inverter including the housing.

[0010] Figure 2A is a bottom view of an inverter housing according to an embodiment of the present disclosure.

[0011] Figure 2B is Figure 2A a bottom perspective view of the box.

[0012] Figure 3 is Figure 2A and Figure 2B a cross-sectional view of a power terminal of the housing and a plastic-coated seal.

[0013] Figure 4A is Figure 2A and Figure 2B an enlarged cross-sectional view of a seal for a power terminal of the housing.

[0014] Figure 4BYes Figure 2A And Figure 2B An enlarged external view of the power supply terminal of the housing and the seal.

[0015] Figure 5 Yes Figure 2A And Figure 2B A cross-sectional view of the power supply terminal with a test channel in it for performing a leak test.

[0016] Figure 6 Yes Figure 2A And Figure 2B An external view of the housing in which an inverter and a device for performing an air leak test are integrated.

[0017] Figure 7 During the leak test Figure 6 A graph showing the variation of the air pressure inside the housing shown over time.

[0018] Figure 8 A schematic diagram of the connection between the wire terminal and the power supply terminal of the inverter.

[0019] Figure 9 A cross-sectional view of the power supply terminal of the inverter with a bolt inserted.

[0020] Figure 10 A cross-sectional view of the power supply terminal of the inverter with a valve for closing the test channel.

[0021] Figure 11 A flowchart of the method for manufacturing and performing a leak test on an inverter housing with an overmolded seal. Detailed implementation

[0022] The following describes an implementation for protecting an electronic device from dust, water, and other objects against ingress. Ingress protection can prevent certain forms of degradation of the electronic device and is particularly important for electronic devices operating in harsh conditions, such as those installed on vehicles operating in dusty or humid environments. The disclosed ingress protection embodiments include fabricating and testing a housing of the electronic device. The housing may include holes through which power terminals may extend from the interior of the housing to the exterior. The internal portion of each power terminal may be in contact with the electronic device within the housing, and the external portion of each power terminal may be in contact with an external power source and load. The housing may be mounted on a metal base plate that can serve as a heat sink. To ensure ingress protection, the housing may be tightly sealed to the base plate and around the power terminals by a continuous molded seal. In some examples, the housing may first be formed (e.g., molded) from a first material such as hard plastic. The housing may include a plurality of interconnected channels, including channels on the bottom surface of the housing (e.g., configured to be coplanar with the base plate), channels around the power terminal holes of the housing, and channels coupled to the channels on the bottom surface and around the power terminal holes. Then a second material (such as rubber) may be injected into the plurality of interconnected channels. The plurality of interconnected channels may enable the second material to be distributed to all parts of the housing including the sealing structures, such as around the power terminal holes and the bottom surface of the housing.

[0023] Once the housing is formed and loaded with an electronic device such as an inverter, an on-line leak test as described herein can be used to test the airtightness of the housing. This test can evaluate the sealing state of the housing. If the housing is airtight, it indicates that the seal can work properly; if the housing leaks, it indicates that the seal does not work properly. The leak test may include injecting air into the sealed housing through a test channel in the housing power terminal and measuring the rate of change of air pressure or pressure decay in the sealed housing over time. The leak test can be applicable to cases where the housing may or may not have vents. After the leak test is completed, the test channel in the power terminal can be sealed by inserting a bolt. In some examples, as described below, other mechanisms for sealing the channel may also be included, such as an overmold seal or a thread lock on the bolt.

[0024] Figures 2-6 and Figures 8 - 10 include a rectangular coordinate system 299 for determining the view direction. This coordinate system can be arranged according to the position of the components after being assembled into an electronic device such as an inverter. The Z-axis of the coordinate system 299 can be the vertical axis (e.g., parallel to the gravity axis), the Y-axis of the coordinate system 299 can be the longitudinal axis (e.g., the horizontal axis), and / or the X-axis of the coordinate system 299 can be the transverse axis. However, in other examples, the axes can also have other directions. When referring to directions, positive can refer to the arrow directions of the x-axis, y-axis, and z-axis, and negative can refer to the opposite directions of the arrows of the x-axis, y-axis, and z-axis. Filled circles can represent the arrows and axes facing the view or the front view. Unfilled circles represent the arrows and axes facing away from the view, or in the negative direction of the view. Additionally,Figures 1 - 6 and Figures 8 - 10 are drawn to scale, but other relative dimensions can be used if desired.

[0025] Figure 1 Describes an external view of the inverter 100. According to the present disclosure, the inverter 100 includes a housing 102. The inverter is a non-limiting example of an electronic device that the disclosed housing can be used to protect. Although the housing and continuous seal described herein can be used for other electronic devices without departing from the scope of the present disclosure, such as power distribution equipment. The electronic devices of the inverter 100 are installed in the housing 102, and the housing 102 can be made of a first material such as rigid plastic. The housing 102 can be fixed to the metal base plate 104 with fasteners, and the fasteners include a first fastener 120, a second fastener 122, and a third fastener 124. The fasteners can be bolts, screws, or other similar fasteners. Figure 1 Only three of the fasteners are shown therein, but the inverter 100 can be equipped with one or more fasteners at each of the four corners of the housing 102. The metal base plate 104 can act as a heat sink to conduct the heat generated by the electronic devices out of the housing 102.

[0026] The housing 102 can include a plurality of holes, also known as apertures, such as hole 106, and each hole can accommodate a power terminal, such as power terminal 126. These holes allow the power terminals to extend out of the housing 102 and contact an external power source and load ( Figure 1 not shown in the figure). These holes also allow the power terminals to extend within the housing 102 and contact internal power electronic components. The housing 102 can also include a ventilation cover 110 to ensure air circulation between the inside and outside of the housing 102. In addition, the housing 102 can also include a port 118, which can be connected to a computing system through a wired connection with a plug.

[0027] Figure 2A and 2B Show two different views of the housing 200 with an overmolded continuous seal. The housing 200 can be installed in an inverter for encapsulating electronic devices. In this way, the housing 200 can be Figure 1 a non-limiting example of the housing 102 in Figure 2A is a bottom view, depicting the housing from below, while Figure 2B is a bottom perspective view, depicting the housing from a small angle. Figure 2A and Figure 2Bwill be described together. The housing 200 can be formed of a first material, such as acrylonitrile-butadiene-styrene (ABS), polymethyl methacrylate (PMMA or acrylic), or other suitable materials (such as other hard plastics), and can be molded to include various holes and contours to accommodate internal power electronics and interfaces with the outside of the housing. The housing 200 can include a top 280, and power terminal holes and ventilation holes can be located in the top 280. The top 280 can be positioned in the x-y plane defined by the coordinate system 299. The housing 200 also includes four sides that can be positioned perpendicular to the top 280 along the outer edge of the top 280. The first side 282 is located on the left side of the top 280 and is in the y-z plane defined by the coordinate system 299. The second side 284 is located on the right side of the top 280 and is also in the y-z plane defined by the coordinate system 299. The third side 286 is located on the upper edge of the top 280 relative to the y-axis and is in the x-z plane defined by the coordinate system 299. The fourth side 288 is located on the lower edge of the top 280 relative to the y-axis and is also in the x-z plane defined by the coordinate system 299. The housing also includes a bottom circular edge 290 that is in the y-x plane and is formed by the bottom edges of the first side 282, the second side 284, the third side 286, and the fourth side 288 respectively.

[0028] The housing 200 can include additional holes that are not used to accommodate power terminals. For example, a first screw hole 240, a second screw hole 242, a third screw hole 244, and a fourth screw hole 246 can be located at each corner of the housing 200. These screw holes on the housing 200 can allow the housing to be fixed to the bottom plate using screws, bolts, or other fasteners, as described above with respect to Figure 1 the metal bottom plate 104 described. The housing 200 can be fixed in surface contact with the bottom plate, and the electronics of the inverter can be assembled on the bottom plate.

[0029] Other openings may have their respective special functions. The ventilation hole 220 is a hole that allows air to circulate between the inside and outside of the housing, helping to remove heat from the power electronics. Before the manufacturing process is completed, a ventilation hole cover can be installed on the ventilation hole 220 to prevent dust or water from entering. The housing 200 also includes a port hole 222 that can accommodate a port with I / O pins. The I / O pins can be connected to an external electronic circuit and conduct input and output signals. When the inverter is in use, the port hole 222 can be connected to a suitable plug.

[0030] The housing 200 can include a first power terminal hole 210, a second power terminal hole 212, a third power terminal hole 214, a fourth power terminal hole 216, and a fifth power terminal hole 218, which are formed in the top 280 of the housing, and each hole is sized appropriately to allow a power terminal to extend through the hole. The power terminal holes can be sealed to prevent water, dust, and debris from entering between the edge of the top 280 and the power terminal insertion hole.

[0031] The housing 200 may form a plurality of interconnecting channels on the inner surface 281 of the top 280 and the first side 282, the second side 284, the third side 286, and the fourth side 288. The interconnecting channels may include channels surrounding each power terminal hole and port hole 222, a bottom channel formed at the bottom circumferential edge 290, and additional channels interconnecting the surrounding channels. The seal 201 may be formed by injecting a second (e.g., soft) material such as rubber or silicon into the interconnecting channels. The seal 201 may protect the device from water or dust entering through the housing edges or openings. The seal 201 can be achieved by injecting the soft material in one go, as the interconnecting nature of the channels allows the soft material to flow through the entire channel network during injection. The seal 201 may consist of different parts to define the functions of different areas of the seal, and all parts of the seal 201 are interconnected to form a single seal.

[0032] On the inner surface 281 of the housing top 280, the seal 201 may include power terminal seals surrounding each power terminal hole. The first power terminal seal 228 surrounds the first power terminal hole 210, the second power terminal seal 230 surrounds the second power terminal hole 212, the third power terminal seal 232 surrounds the third power terminal hole 214, the fourth power terminal seal 234 surrounds the fourth power terminal hole 216, and the fifth power terminal seal 236 surrounds the fifth power terminal hole 218. The I / O port seal 238 may surround the port hole 222. The first power terminal seal 228, the second power terminal seal 230, the third power terminal seal 232, the fourth power terminal seal 234, the fifth power terminal seal 236, and the I / O port seal 238 are all connected by seal segments. The first seal segment 248 is connected to the first power terminal seal 228 and the second seal segment 208. The second seal segment 208 is connected to the second power terminal seal 230. The second power terminal seal 230 is connected to the third seal segment 274 and the fourth seal segment 272, and the fourth seal segment 272 is connected to the third power terminal seal 232. The third power terminal seal 232 is connected to the fifth seal segment 270 and the sixth seal segment 268. The sixth seal segment 268 is connected to the seventh seal segment 266 and the eighth seal segment 264. The eighth seal segment 264 is connected to the I / O port seal 238, which is connected to the ninth seal segment 262. The ninth seal segment 262 is connected to the tenth seal segment 260, which is connected to the fifth power terminal seal 236. The fifth power terminal seal 236 is connected to the eleventh seal segment 258 and the twelfth seal segment 256. The twelfth seal segment 256 is connected to the fourth power terminal seal 234. The fourth power terminal seal 234 is connected to the thirteenth seal segment 254 and the fourteenth seal segment 252. The fourteenth seal segment 252 is connected to the fifteenth seal segment 250, which is connected to the first power terminal seal 228. The first power terminal seal 228 is connected to the second seal segment 208.

[0033] Additional channels formed on the inner surfaces of the first side 282, second side 284, third side 286, and fourth side 288 can connect the channels on the inner surface of the top 280 of the housing to the bottom seal channels on the bottom circumferential edge 290 of the housing. During the injection molding process, each channel is filled to produce the partial seal 201. Thus, the seal 201 also includes a seal gasket portion 206 that is located around the perimeter of the bottom circumferential edge 290 of the housing. The seal gasket portion 206 is connected to the seal / seal segment on the top 280 of the first side 282 by a first vertical seal segment 278 and a second vertical seal segment 276. The first vertical seal segment 278 is connected to a third seal segment 274, and the second vertical seal segment 276 is connected to a fifth seal segment 270. The seal gasket portion 206 is connected to the seal on the top 280 of the third side 286 by a third vertical seal segment 292 and a fourth vertical seal segment 294. The third vertical seal segment 292 is connected to a seventh seal segment 266, and the fourth vertical seal segment 294 is connected to a tenth seal segment 260. In Figure 2A or Figure 2B the inner surfaces of the second side 284 of the housing and the fourth side 288 of the housing are not visible. However, the channels and seals on the second side 284 can be arranged in a manner similar to that of the first side 282, and the channels and seals on the fourth side can be arranged in a manner similar to that of the third side 286. In this way, all the channels on all sides of the housing 200 can be interconnected to form a continuous seal 201.

[0034] Figure 3 Details of the above power terminals are shown. Figure 3 is a cross-sectional view 300 taken along line A-A' across Figure 2A the housing 200 after it is installed in an inverter, including components extending through a power terminal of the housing 200. In particular, Figure 3is a cross-sectional view 300 of a first power terminal 302 that extends through a second power terminal hole 212 in a housing 200 and is surrounded by a second power terminal seal 230. The center of the second power terminal hole 212 is marked by a centerline 318. The first power terminal 302 can be located at the center of the second power terminal hole 212. The first power terminal 302 and the second power terminal seal 230 surrounding the first power terminal 302 are non-limiting examples of power terminals extending through other power terminal holes in the housing 200 and seals surrounding other power terminal holes in the housing 200. The first power terminal 302 is located in an internal cavity (such as an internal space 310) of the housing 200. The first power terminal 302 extends vertically through the second power terminal hole 212 in the top 280 of the housing 200. The upper end face 316 of the first power terminal 302 is in contact with the environment outside the housing 200, while the lower part of the first power terminal 302 is in contact with internal power electronics (such as a first power electronics 312 and a second power electronics 314). The first power terminal 302 can include a first internal socket 306 within the first power terminal 302 that extends to a limited depth inside the first power terminal 302. An external power source or an external load can be fixed to the inverter through the first internal socket 306 by screws, bolts, or other connection mechanisms. Thus, in some examples, the first internal socket 306 can include threads for connection to the connection mechanism and can be referred to as a threaded socket in some examples. The first power terminal 302 can be surrounded by the second power terminal seal 230. The second power terminal seal 230 (and similarly other power terminal seals of the housing 200) can have a double-lip shape at the edge of the second power terminal seal 230 in contact with the first power terminal 302. The double-lip shape of the power terminal seal can prevent dust and water from entering through the interface between the second power terminal seal 230 and the first power terminal 302. The shape of the second power terminal seal 230 will be in Figure 4A described in detail. A second seal section 208 connected to the second power terminal seal 230 is shown in the figure. As previously described, the second seal section 208 can connect the second power terminal seal 230 to the rest of the seal 201 and the power terminal seal.

[0035] Figure 4A A cross-span is provided across Figure 2ACross-sectional view 400 of the second power terminal seal 230 in the top 280 of the chassis 200 taken along A-A'. The first power terminal 302 is not shown in the figure, so the contour of the second power terminal seal 230 cannot be seen. The second power terminal seal 230 is circular, and the center line 318 extends vertically through the center of the second power terminal seal 230. The second power terminal seal 230 is radially symmetric about the center line 318. As previously described, the second power terminal seal 230 is part of the seal 201 and is connected to the second seal section 208. The second power terminal seal 230 can be distinguished from the second seal section 208 by the line 446.

[0036] The cross-section of the second power terminal seal 230 shows the contour of the second power terminal seal 230. The contour shape of the second power terminal seal 230 facilitates the insertion of the power terminal parallel to the Z-axis. The contour can be a double-lip shape with an upper lip 408 and a lower lip 412, and an inlet 410 between the upper lip 408 and the lower lip 412.

[0037] The upper lip 408 may have a first edge 426 that is coplanar with the power terminal during inverter assembly. The top surface 448 of the upper lip 408 may extend above the top 280 at an angle 450. Below the first edge 426, the top lip may include a first inner side surface 428 that may recede from the top lip at an acute angle 438 in the x-z plane.

[0038] The first inner surface 428 may include a fan-shaped edge 422 that protrudes along its top edge and contacts the first edge 426. The first inner surface 428 may be connected to the second inner surface 430. The second inner surface 430 may be located within the inlet 410, and the second inner surface 430 may be parallel to the side surface of the power terminal inserted into the second power terminal seal 230. The second inner surface 430 may include a ridge 432 that extends towards the center line 318. The ridge 432 may include an inlet 440 on the surface of the ridge 432 that faces the center of the second power terminal seal 230. The bottom of the second inner surface 430 may be connected to the bottom lip 412 of the second power terminal seal 230. The bottom lip 412 may extend upward at an angle 442 towards the center line 318. The bottom lip 412 may include a second edge 434 that is coplanar with the power terminal when the inverter is assembled. The bottom surface 436 of the bottom lip 412 may have an angle 442 aligned. The bottom surface 436 may include a fan-shaped edge 424 that protrudes along its bottom edge.

[0039] The double - lip profile of the second power - terminal seal 230 (and the remaining power - terminal seals of the housing 200) can promote contact between the second power - terminal seal 230 and the power terminal inserted into the corresponding opening after the inverter is fully assembled, thereby providing ingress protection. The raised sectors along the first inner surface and the bottom surface can further improve the ingress protection by increasing the friction between the seal and the power terminal. The increased friction can prevent the power terminal from slipping out of contact with the seal, which could cause leakage of electricity. During the injection - molding process, one or more molds can be used to form the double - lip shape of the second power - terminal seal 230, which includes an upper lip 408, a lower lip 412, and an inlet 410. During the injection process, a second liquid material can flow into the cavity within the mold. After the second material solidifies, the mold can be removed.

[0040] Figure 4A Also shown is a second seal section 208 that connects the second power - terminal seal 230 to other seal sections within the seal 201. The second seal section 208 is located in a channel 414 of a plurality of interconnected channels. The channel 414 can be defined by three channel surfaces, including a top surface 416 and two side - channel surfaces ( Figure 4A not shown). In some examples, the top surface 416 can be a part of the inner surface 281 of the housing 200.

[0041] Figure 4B A top - view of the power terminal 504 surrounded by the first power - terminal seal 228 as viewed from outside the housing 200 is shown. The power terminal 504 is surrounded by the first power - terminal seal 228, which, as described above, can be manufactured by injecting a second material into a plurality of interconnected channels within the housing 200. The second material can have a color that contrasts with the color of the housing 200, so text can also be created on the outer surface of the housing 200 by integrating text - shaped holes in the housing 200. In Figure 4B one example, the housing 200 contains a V - shaped hole, thereby forming a V - shaped seal 420. The V - shaped seal 420 can be produced during the same injection - molding process as the seal 201 and can be connected to the seal 201. There is a threaded socket at the center of the power terminal 504, hereinafter referred to as the second inner socket 506. The second inner socket 506 can be used to mount an external power source and load to the device.

[0042] During the manufacturing process, the above - mentioned continuous seal 201 can be leak - tested through a test channel provided in one of the power terminals. Figure 5 A cross - sectional view of the power terminal 504 installed in the first power - terminal hole 210 of the housing 200 is described (e.g., through Figure 2A(taken along line B-B'). As described above, the power terminal 504 may be sealed by the first power terminal seal 228. The power terminal 504 includes a central second inner socket 506 for securing an external wire with a bolt or screw. A test passage 502 in the power terminal fluidly couples the second inner socket 506 to the interior space 310 of the housing 200. Before a bolt is installed on the second inner socket 506, the test passage 502 may allow air to enter the interior space 310 from the external environment of the chassis through the second inner socket 506.

[0043] Figure 6 Figure shows an inverter 600 undergoing a leak test, which can evaluate the sealing state of the housing. The inverter 600 includes a housing 200 connected to a base plate 602. As described above, the housing 200 may include a vent 220 that allows air to flow out of the housing 200. In some examples, there may be a lid on the vent 220 to prevent water or dust from entering. As previously mentioned, the housing 200 may also include port holes 222 for connecting the inverter 600 to an external computing system via I / O pins. Finally, the top surface of the housing 200 may have multiple power terminals, each with its own power terminal seal. In this case, the power terminal 504, the second power terminal 610, the third power terminal 612, the fourth power terminal 614, and the fifth power terminal 616 are respectively surrounded by the first power terminal seal 228, the second power terminal seal 230, the third power terminal seal 232, the fourth power terminal seal 234, and the fifth power terminal seal 236. As Figure 5 described, the power terminal 504 includes a test passage extending from a threaded socket of the power terminal into the interior cavity of the housing. For the leak test, a tube 632 connected to an air compressor may be inserted into the power terminal 504 (e.g., into the second inner socket 506). The insertion end of the tube may have a nozzle configured to fit tightly against the power terminal 504. Air from the compressor may pass through the inlet 618 of the tube 632 before entering the threaded socket of the power terminal 504, pass through the test passage, and enter the interior space of the housing 200. A pressure gauge 630 may be connected to the tube 632 to determine the pressure inside the housing. To perform the leak test, an air compressor may be used to pressurize the interior of the housing 200 to a predetermined pressure measured by the pressure gauge through the test passage. After a predetermined time, the pressure inside the housing may be measured again, and the pressure change between the two measurements may be used to determine the leak rate. The determined leak rate or pressure decay rate may be compared with the leak rate of a tightly sealed housing to evaluate the sealing state of the housing, e.g., to determine whether the housing being tested is leaking.

[0044] Figure 7The graph 700 in [description] vividly shows this process. In Figure 700, the X-axis represents the time (in seconds) elapsed since the air compressor starts pumping air into the housing through the power terminal. The Y-axis represents the relative pressure inside the housing, in millibars, with the pressure before the air compressor starts pressurizing the housing being represented as zero. The relevant time points are indicated by vertical lines. The graph is divided into two phases: filling the device and measuring the pressure drop. Phase 1 is the inflation of the device and occurs before time t1. During this phase, air can be pumped into the housing through the test channel in the power terminal (such as test channel 502 in power terminal 504) as described above. The increasing pressure during this phase is represented by line 709. Once the pressure inside the housing reaches a predetermined threshold pressure, the air compressor can be turned off at time t1, and the pressure inside the housing can start to decrease due to the air escaping through the vent (such as vent 220). Immediately after the air compressor is turned off, the second phase of the process begins; the second phase is measuring the pressure drop. When the air compressor is turned off or shortly after it is turned off, the pressure inside the housing can be measured for the first time at time t2. After a certain period of time, the pressure inside the housing can be measured again at time t3.

[0045] Three different pressure change scenarios are shown on Figure 700. The first pressure change scenario is shown by line 716 and includes the pressure inside the housing decaying at a rate consistent with a fully sealed housing, with air leaking from the housing only through the vent. The first pressure change scenario indicates that the inverter has an operable continuous seal during manufacturing and can prevent dust or water from entering. The second pressure change scenario is shown by line 718 and includes a calculated pressure change between two measurement points that is less than the change calculated for the first pressure change scenario / line 716. In the second pressure change scenario, the air is not escaping from the housing as fast as expected, which may be due to a blocked exhaust cap hindering the air from escaping. In the third pressure change scenario (represented by straight line 720 in the figure), the air is escaping from the housing faster than in the first pressure change scenario / straight line 716. In the third pressure change scenario, the change in air pressure between t2 and t3 is greater than expected. This may be due to a leak in the housing, causing air to escape from a location other than the vent cap. The cause of the leak may be a manufacturing problem with the continuous seal, such as partial degradation of the gasket between the housing and the base plate, or poor contact between any power terminal seals in the housing and the power terminal.

[0046] After the leak test, the test channel in the power terminal can be sealed to prevent air from leaking through the test channel. For example, the test channel can be sealed by inserting a bolt into the threaded socket of the power terminal. The bolt can be used to connect a wire (or other electrical connector) to each power terminal of the inverter to connect to an external power source or load. Figure 8 Shows the components that can be used to connect wires to the power terminal through bolts. Figure 8It is a schematic diagram showing a cross-sectional view 800 of a wire 822 connected to a power terminal 810. The wire 822 can have a lug head 808 placed on top of the power terminal 810. A washer 806 is located on top of the terminal head, and then an O-ring 804. A screw or bolt 802 can pass through the O-ring 804, washer 806, and wire lug 808 and be screwed into the threaded socket 824 of the power terminal 810. Figure 6 Each power terminal of the inverter 600 in Figure 6 can be connected to an external power source or an external load through a similar mechanism (e.g., a wire including an ear-shaped head can be connected to Figure 6 the power terminal in Figure 6 through the above-mentioned bolt).

[0047] Figure 9 It shows a cross-sectional view of a bolt installed in the threaded socket of the power terminal. Specifically, Figure 9 it shows a bolt 902 that has been inserted into the second inner socket 506 of the power terminal 504. A washer 906 and an O-ring 904 are located between the outer surface of the power terminal 504 and the head of the bolt 902. The power terminal 504 is located in the first power terminal hole 210 of the chassis 200 and is surrounded by a first power terminal seal 228. A test channel 502 is located on one side of the power terminal, which connects the second inner socket 506 inside the power terminal 504 to the internal space 310 of the chassis. In this case, the bolt 902 inserted into the second inner socket 506 prevents the test channel 502 from connecting to the second inner socket 506. Once the leak test is completed, this blockage prevents air from leaking out of the power terminal through the test channel. The test channel 502 remains in the power terminal, but the end of the test channel that was previously in fluid contact with the second inner socket 506 is blocked by the bolt 902. Once the test is completed and the inverter is fully assembled, this blockage ensures that no air flows through the test channel 502 from the inside of the chassis to the outside of the chassis. In some cases, a thread lock, sealant, or glue can be used around the bolt to further ensure leak protection at the test channel 502. A small rubber plug can also be inserted at the bottom of the second inner socket 506 to block the test channel 502. These methods can ensure that air is prevented from flowing through the test channel 502 after the test.

[0048] Figure 10Shows another method of entrance protection at the test channel site. The figure shows a cross-sectional view of the power supply terminal 504 extending through the housing 200. The power supply terminal 504 is surrounded by the first power supply terminal seal 228. The top of the power supply terminal 504 includes a second inner socket 506 into which a bolt or screw can be inserted, and the bottom includes connectors for connecting internal device electronic components, such as the first connector 1004 and the second connector 1006. Inside the power supply terminal 504 is the test channel 502, which connects the threaded socket inside the power supply terminal to the internal space 310 of the housing 200. After the leak test is completed, the soft plastic valve 1002 can be implemented by soft plastic injection to block the test channel 502. After the test is over, the test channel 502 remains inside the power supply terminal, but the valve 1002 can prevent air from exchanging through the test channel 502.

[0049] When the test channel 502 is not blocked, air is allowed to exchange from the inside of the chassis to the environment, which can be used to facilitate the leak test. A method is disclosed herein that uses a test channel (such as the test channel 502) inside the power supply terminal to test whether devices such as inverters are leaking. To determine whether a device is properly protected against the entry of water and dust, the device can be tested to determine whether air can leak out of the housing of the device. Previous methods of performing this test included an air compressor, a pressure storage tank housing with a pressure gauge, and a vacuum cover connected to a hose with a valve. The first step of the method is to inflate the pressure storage tank housing from a gas source so that its pressure is greater than the ambient pressure. The vacuum cover can be connected to the pressure housing through a hose. The vacuum cover can be attached to the ventilation opening of the device to form an airtight seal around the ventilation opening. The valve in the vacuum cover hose can allow air to flow from the pressure storage tank into the vacuum cover after the pressure storage tank reaches a specific overpressure. Once air is allowed to flow from the gas tank into the device interior, the pressure inside the box and inside the gas tank will begin to equalize over time. Measuring the gas tank pressure once at the start of the equalization process and then again later can verify the air flow rate through the ventilation hole. Measuring the pressure of the reservoir a third time, at a later time, can test the airtightness of the housing. If the pressure at the third measurement is equal to the equilibrium pressure, it indicates that the housing is airtight. But if the pressure at the third measurement is lower than the equilibrium pressure, it indicates that the device housing is leaking.

[0050] The inventors have found some drawbacks of this method. This method may require specialized equipment such as a vacuum lid and a reservoir, which may be bulky and incur additional manufacturing costs. In addition, this method may take several minutes to complete. This can cause serious production delays when producing a large number of cases. To overcome these drawbacks, the inventors have developed the method disclosed herein to test whether the device leaks. This method is applicable to electronic devices including a power supply terminal, such as an inverter. The method includes creating a through-hole (such as a test channel) in the internal threaded socket of the power supply terminal to enable fluid communication between the interior of the device and the internal threaded socket. An air compressor can be connected to the threaded socket and air can be pumped into the device through the through-hole, thereby creating an overpressure in the internal space of the device (such as the internal space of the device housing). The air will escape from the housing through the vent at a known rate. The rate at which the air escapes from the vent can be determined by taking a first pressure measurement after the air compressor is turned off and a second air pressure measurement after a predetermined time has elapsed after the air compressor is turned off. Comparing the pressure difference between the two measurements with the expected pressure drop in a sealed box where air can only escape through the vent cap enables the manufacturer to diagnose a leak in the housing of the manufactured device or a blockage in the vent.

[0051] Figure 11 FIG. 4 is a flowchart showing a method 1100 of manufacturing and testing a housing of an electronic device (such as an inverter). At 1102, the method 1100 may include molding a housing having a plurality of interconnected channels that connect a plurality of holes for the electronic device and the fastening device. In some examples, molding may include filling a hollow mold in the shape of the housing with a first material (such as a liquid form of plastic that will solidify into a hard material). Once the first material hardens, the mold can be removed, leaving a hard plastic housing (such as housing 200) with interconnected channels and a plurality of holes. At 1104, the method 1100 may include injecting a second material into the plurality of interconnected channels. Injection molding may include placing a mold on the housing to form the shape of a power supply terminal seal and restricting the flow of the second material within the interconnected channels formed in the housing. The second material may be a soft material such as rubber or silicone and can be injected into the cavity formed between the housing and the mold. This soft material is capable of flowing through all the channels when the channels are interconnected. When the soft material hardens from a liquid to a solid state, seals are formed around the holes in the housing and within the channels. At 1106, the method includes securing the housing to the device baseplate and enclosing the electronic device. For example, the housing can be positioned on the baseplate such that all power supply terminals pass through the appropriate holes in the housing and the bottom of the housing contacts the baseplate surface. The housing can be secured to the baseplate with screws or other fasteners. It can be understood that, at least in some examples, the power supply terminals can be mounted on the baseplate before the housing is mounted on the baseplate.

[0052] At 1108, method 1100 may include performing a leak test on the assembled electronic device to ensure that the housing protects the electronic device from dust and water infiltration. The leak test may include coupling an air compressor to the power supply end of the electronic device including a test channel at 1110. For example, a nozzle connected to an air compressor hose may be inserted into the internal threaded socket of the power supply end. The shape of the nozzle may closely fit the threaded socket or include a seal to prevent the air flowing out of the nozzle from escaping into the environment. At 1112, the interior of the electronic device may be pressurized by the air compressor. For example, the air compressor may be turned on, and air may flow out of the air compressor, through the hose and nozzle, through the threaded power supply end socket, and finally through the power supply end test channel into the internal space of the electronic device. The air compressor may be kept on until a relatively high threshold pressure is reached inside the electronic device. At 1114, method 1100 may include measuring the pressure decay rate inside the electronic device. The air pressure inside the housing may be measured over time. If the housing is airtight, the air inside the housing may escape from the vent at a specific rate, or in the case of no vent, the air pressure may remain stable. The rate at which air escapes from the chassis can be used to determine whether the chassis is completely sealed. At 1116, if it is determined that the electronic device is completely sealed, the method may include connecting the electronic device to an external power supply and load by fixing bolts and wires to the power supply end. This process will be described in detail in Figure 8 and may include passing bolts through a plurality of washers, the lug ends of the wires, and inserting them into the threaded socket of the power supply end. The bolts may block the outlet of the test channel connected to the threaded socket of the power supply end. In this way, the test channel remains within the body of the power supply end, but all air flow through the test channel is blocked. This ensures the airtightness of the housing after the test. If it is determined that the electronic device is not completely sealed, for example, the rate of pressure decay is faster than expected, the electronic device may be inspected to determine the source of the leak, and if the source of the leak is determined, the leak may be sealed. In other examples, if it is determined that the electronic device is not completely sealed, the electronic device may be discarded.

[0053] Figures 1 - 6 and Figures 8 - 10Shows an example configuration of the relative positioning of various components. If the components shown in the figure are in direct contact or directly coupled to each other, then in at least one example, these components can be referred to as being in direct contact or directly coupled, respectively. Similarly, in at least one example, components shown as adjacent or contiguous to each other can be adjacent or contiguous to each other, respectively. For example, components that are in face-to-face contact with each other can be referred to as face-to-face contact components. Another example is that in at least one example, components that are placed separately from each other with only space in between and no other components can be referred to as being placed separately from each other. Also, components that are shown above / below each other, on opposite sides of each other, or on the left / right side of each other relative to each other can be referred to as such components. In addition, as shown in the figure, in at least one example, the topmost component or component point can be referred to as the "top" of the component, and the bottommost component or component point can be referred to as the "bottom" of the component. As used herein, up / down, up / down, up / down can be relative to the vertical axis in the figure and are used to describe the positioning of the various elements in the figure relative to each other. Thus, in one example, an element shown above other elements is vertically positioned above the other elements. As another example, the shapes of the components depicted in the figure can be referred to as having those shapes (e.g., such as circular, straight, planar, curved, rounded, chamfered, beveled, or similar shapes). In addition, in one example, components that are coaxial with each other can be referred to as coaxial components. In addition, in at least one example, elements shown as intersecting each other can be referred to as intersecting elements or intersecting each other. In addition, in one example, an element shown inside or outside another element can be referred to as an intersecting element. In other examples, elements that are offset from each other can also be referred to as "offset elements".

[0054] The present disclosure also provides support for a method of manufacturing a housing for an electronic device, the method comprising: molding the housing using a first material, wherein molding includes molding a plurality of interconnect channels that span the surface of the housing and extend around a plurality of power terminal holes of the housing, and injecting a second material into the plurality of interconnect channels to form a continuous seal. In a first example of the method, the continuous seal includes a plurality of power terminal seals, each power terminal seal being received within a respective one of the plurality of interconnect channels that extends around a respective power terminal hole. In a second example of the method, optionally including the first example, the method further comprises: assembling the electronic device by fixing the housing to a substrate and positioning a plurality of power terminals within the housing such that each power terminal hole can receive a respective one of the plurality of power terminals. In a third example of the method, optionally including one or both of the first and second examples, the method further comprises: performing a leak test on the power electronic device by pumping air into an internal space of the power electronic device through a test channel formed in one of the plurality of power terminals, the test channel fluidly coupling the internal space to a socket of the power terminal. In a fourth example of the method, optionally including one or more or each of the first to third examples, performing the leak test further comprises, when the pressure in the internal space reaches a threshold pressure, monitoring a rate of pressure decay in the internal space and determining a sealing state of the electronic device based on the rate of pressure decay. In a fifth example of the method, optionally including one or more or each of the first to fourth examples in response to determining that the sealing state of the electronic device is fully sealed, sealing the test channel. In a sixth example of the method, optionally including one or more or each of the first to fifth examples, the first material includes plastic. In a seventh example of the method, optionally including one or more or each of the first to sixth examples, the second material includes rubber. In an eighth example of the method, optionally including one or more or each of the first to seventh examples, molding the plurality of interconnect channels further includes molding a bottom seal channel within a bottom circumferential edge of the housing, wherein injecting the second material into the plurality of interconnect channels to form a continuous seal includes injecting the second material into the plurality of interconnect channels including the bottom seal channel.

[0055] The present disclosure also provides support for a housing of an electronic device, the housing including: a top including a plurality of power terminal holes, a plurality of sides, and a bottom circular rim, the bottom circular rim being configured to couple with a substrate to enclose the electronic device, wherein an inner surface of the housing includes a plurality of interconnect channels extending around the bottom circular rim, across the top and the plurality of sides, and around the plurality of power terminal holes, and a continuous seal accommodated in the plurality of interconnect channels. In a first example of the system, the system further includes: a power terminal extending through a power terminal hole of the plurality of power terminal holes. In a second example of the system, optionally including the first example, the power terminal includes a test channel fluidly coupling an internal socket of the power terminal to an internal space of the electronic device. In a third example of the system, optionally including one or both of the first and second examples, the continuous seal includes a gasket portion and a plurality of power terminal seals, the gasket portion being accommodated within the bottom circular rim of the housing, and each of the plurality of power terminal seals surrounding a respective power terminal hole. In a fourth example of the system, optionally including one or more or each of the first to third examples, the continuous seal further includes a plurality of seal segments coupling the plurality of power terminal seals to the gasket portion and to each other. In a fifth example of the system, optionally including one or more or each of the first to fourth examples, a portion of the plurality of seal segments extends along one or more of the plurality of sides of the housing.

[0056] The present disclosure also provides support for a system, including power electronics, and a housing coupled to the power electronics, the housing having a top including a plurality of power terminal holes, a plurality of sides, and a bottom peripheral edge configured to be coupled to a substrate to enclose the power electronics of the power electronics, wherein an inner surface of the housing includes a plurality of interconnect channels that extend around the bottom peripheral edge, the top, and the plurality of sides, and a continuous seal around the plurality of power terminal holes, the continuous seal having a gasket portion and a plurality of power terminal seals, the gasket portion being received within the bottom peripheral edge of the housing, each power terminal seal of the plurality of power terminal seals surrounding a respective power terminal hole, the continuous seal including an internal scallop. In a first example of the system, each power terminal seal further includes a double lip, wherein the continuous seal further includes a plurality of seal segments that couple the plurality of power terminal seals to the gasket portion and to each other. Optionally including the first example, in a second example of the system, a portion of the plurality of seal segments extends along one or more of the plurality of sides of the housing. Optionally including one or both of the first and second examples, in a third example of the system, the system further includes: a power terminal extending through a power terminal hole of the plurality of power terminal holes. Optionally including one or more or each of the first through third examples, in a fourth example of the system, the power terminal includes a test channel that fluidly couples an internal socket of the power terminal to an internal space of the electronic device. Optionally including one or more or each of the first through fourth examples, in a fifth example of the system, the internal scallop of the continuous seal includes an internal scallop on one or more faces of each power terminal seal.

[0057] While the foregoing describes various embodiments, it should be understood that these embodiments are by way of example only and not limitation. It will be apparent to those skilled in the relevant art that the disclosed subject matter may be embodied in other specific forms without departing from the spirit of the subject matter. Accordingly, the embodiments described above are to be considered in all respects illustrative rather than restrictive. Thus, the configurations and routines disclosed herein are exemplary in nature, and these specific examples are not to be considered limiting since there may be many variations. For example, the above techniques may be applied to various power systems. The subject matter of the present disclosure includes all novel and non-obvious combinations and sub-combinations of various systems and configurations, as well as other features, functions, and / or properties disclosed herein.

[0058] As used herein, the term "approximate" shall be understood to mean a range of plus or minus 5%, unless otherwise specified.

[0059] The following claims particularly point out certain combinations and sub - combinations regarded as novel and non - obvious. These claims may refer to "an" element or "a first" element or equivalent elements. These claims are to be understood as covering one or more such elements, neither requiring nor precluding two or more such elements. Other combinations and sub - combinations of the disclosed features, functions, elements, and / or characteristics may be claimed by modifying this claim set or presenting new claim sets in this application or related applications. These claims, whether broader, narrower, the same, or different in scope from the original claims, are also regarded as included in the subject matter disclosed herein.

Claims

1. A method of manufacturing a housing for an electronic device, the method comprising: Molding the housing using a first material, wherein the molding includes molding a plurality of interconnected channels that extend through a surface of the housing and surround a plurality of power terminal holes of the housing; And Injecting a second material into the plurality of interconnected channels to form a continuous seal.

2. The method according to claim 1, wherein the continuous seal includes a plurality of power terminal seals, each of the power terminal seals being received within a respective one of the plurality of interconnected channels that extend around a respective power terminal aperture.

3. The method according to claim 2, further comprising assembling the electronic device by fixing the housing to a substrate and positioning the plurality of power terminals in the housing such that each of the power terminal holes can receive a respective one of the plurality of power terminals.

4. The method according to claim 3, further comprising performing a leak test on the electronic device, the leak test comprising pumping air into an interior space of the electronic device through a test channel formed in one of the plurality of power terminals, the test channel being fluidly connected to the interior space and a socket of the power terminal.

5. The method according to claim 4, wherein performing the leak test further comprises monitoring a pressure decay rate of the interior space when the pressure of the interior space reaches a threshold pressure and determining a sealed state of the electronic device based on the pressure decay rate.

6. The method according to claim 5, sealing the test channel after determining that the sealed state of the electronic device is fully sealed.

7. The method according to claim 1, wherein the first material includes plastic.

8. The method according to claim 1, wherein the second material includes rubber.

9. The method according to claim 1, wherein molding the plurality of interconnected channels further includes molding a bottom seal channel within an inner circumferential edge of a bottom of the housing, and injecting the second material into the plurality of interconnected channels to form a continuous seal further includes injecting the second material into the plurality of interconnected channels including the bottom seal channel.

10. A housing for an electronic device, comprising Top, the top includes a plurality of power terminal holes, a plurality of sides, and a bottom circular edge, the bottom circular edge being coupled to a bottom plate to enclose the electronic device, wherein, An inner surface of the housing includes a plurality of interconnected channels that extend around the inner circumferential edge of the bottom, through the top and a plurality of sides, and around the plurality of power terminal holes; And A continuous seal is received within the plurality of interconnected channels.

11. The housing according to claim 10, further comprising a power terminal that passes through one of the plurality of power terminal holes.

12. The housing according to claim 11, wherein the power terminal includes a test channel that fluidly couples an inner socket of the power terminal to an interior space of the electronic device.

13. The housing according to claim 10, wherein the continuous seal includes a gasket portion and a plurality of power terminal seals, the gasket portion being received within the inner circumferential edge of the bottom of the housing, and each of the plurality of power terminal seals surrounding a respective one of the power terminal holes.

14. The housing according to claim 13, wherein the continuous seal further comprises a plurality of seal segments that couple and mutually couple the plurality of power terminal seals to the gasket portion.

15. The housing according to claim 14, wherein a portion of the plurality of seal segments extends along one or more of the plurality of sides of the housing.

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