Three-dimensional uniform temperature plate

Abstract

A three-dimensional uniform temperature plate comprises a uniform temperature plate module and a heat pipe module. The vapor chamber module comprises an upper shell structure, and the upper shell structure comprises an upper shell and an upper shell capillary structure formed in the upper shell. The heat pipe module is fixed to the vapor chamber module and communicated with the vapor chamber module. In addition, the heat pipe module comprises a heat pipe shell fixed on the upper shell and a heat pipe capillary structure formed in the heat pipe shell and connected to the upper shell capillary structure, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to a vapor chamber, and more particularly to a three-dimensional vapor chamber. Background Art

[0002] With the increasing progress of technology and the growing computing power of electronic devices, temperature control of electronic components such as processors in electronic devices has become increasingly important. Especially when the computing speed of working chips in electronic devices such as mobile phones, tablets, and notebook computers continues to increase, it also raises the ambient temperature within the electronic device system, thereby reducing the system stability.

[0003] To solve the above problems, the industry uses various different heat dissipation devices, such as heat pipes and vapor chambers, to dissipate heat from the working chips, so that the heat energy of the working chips can be quickly discharged outside the system, thereby controlling the temperature within the systems of mobile phones, tablets, notebook computers, or electronic devices with higher heat sources, such as servers, network devices, wireless transmission devices, etc., and thus maintaining the stability of the system.

[0004] The three-dimensional vapor chamber combines a vapor chamber and a heat pipe to connect to a heat source that needs to be cooled and connect to heat dissipation fins or other heat dissipation devices, so as to transfer heat to the heat dissipation fins or other heat dissipation devices through the three-dimensional vapor chamber, thereby taking the heat out of mobile phones, tablets, notebook computers, or electronic devices with higher heat sources, and thus improving the working reliability of electronic components.

[0005] Therefore, how to improve the heat dissipation efficiency of the three-dimensional vapor chamber will help improve the working efficiency of the processor and electronic devices. Summary of the Invention

[0006] An object of the present invention is to provide a three-dimensional vapor chamber to improve the heat dissipation efficiency of the vapor chamber.

[0007] According to an embodiment of the present invention, a three-dimensional vapor chamber is provided. The three-dimensional vapor chamber includes a vapor chamber module and a heat pipe module. The vapor chamber module includes an upper shell structure, and the upper shell structure includes an upper shell body and an upper shell body capillary structure formed in the upper shell body. The heat pipe module is fixed to the vapor chamber module and communicates with the vapor chamber module, wherein the heat pipe module includes a heat pipe shell fixed to the upper shell body and a heat pipe capillary structure formed in the heat pipe shell and connected to the upper shell body capillary structure.

[0008] In some embodiments, the upper shell body includes an upper shell main body and a raised joint portion formed in the upper shell main body, and the heat pipe shell penetrates through the raised joint portion.

[0009] In some embodiments, the heat pipe housing includes a heat pipe main body and an expanded tube joint portion. The expanded tube joint portion is connected to the heat pipe main body and joined to the raised joint portion of the upper housing.

[0010] In some embodiments, the upper housing capillary structure includes an upper housing main capillary structure and an upper housing raised capillary structure. The upper housing main capillary structure is formed on the inner surface of the upper housing main body, and the upper housing raised capillary structure is connected to the upper housing main capillary structure and formed on the inner side of the raised joint portion.

[0011] In some embodiments, the heat pipe capillary structure includes a heat pipe main capillary structure and a heat pipe expanded tube capillary structure. The heat pipe main capillary structure is formed on the inner surface of the heat pipe main body, and the heat pipe expanded tube capillary structure is connected to the heat pipe main capillary structure and formed on the inner side of the expanded tube joint portion.

[0012] In some embodiments, the end face of the upper housing raised capillary structure is connected to the end faces of the heat pipe expanded tube capillary structure and the expanded tube joint portion.

[0013] In some embodiments, the heat pipe expanded tube capillary structure is fitted into the upper housing raised capillary structure.

[0014] In some embodiments, the heat pipe expanded tube capillary structure is joined between the upper housing raised capillary structure and the expanded tube joint portion.

[0015] In some embodiments, the upper housing raised capillary structure is joined between the heat pipe expanded tube capillary structure and the raised joint portion.

[0016] In some embodiments, the upper housing further includes a joint flange connected to the raised joint portion to be joined to the expanded tube joint portion of the heat pipe housing.

[0017] In some embodiments, the heat pipe expanded tube capillary structure portion of the heat pipe capillary structure is connected to the upper housing raised capillary structure of the upper housing capillary structure.

[0018] In some embodiments, the heat spreader module further includes a lower housing structure closely attached to the upper housing structure. The lower housing structure includes a lower housing and a lower housing capillary structure. The lower housing capillary structure is formed on the inner surface of the lower housing, and the periphery of the upper housing capillary structure is connected to the lower housing capillary structure.

[0019] Therefore, according to the embodiments of the three-dimensional heat spreader of the present invention, the three-dimensional heat spreader can utilize the heat pipe expanded tube capillary structure portion of the heat pipe capillary structure or the upper housing raised capillary structure that annularly connects the upper housing capillary structure to increase the flow efficiency of the heat dissipation fluid, thereby increasing the heat dissipation efficiency of the three-dimensional heat spreader.

[0020] The above is only used to elaborate on the problems to be solved by the present invention, the technical means for solving the problems, and the effects produced thereby. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. Brief Description of the Drawings

[0021] To make the above and other objects, features, advantages, and embodiments of the present invention more obvious and understandable, the description of the accompanying drawings is as follows:

[0022] Figure 1 It is an exploded schematic view of a three-dimensional heat pipe plate according to an embodiment of the present invention.

[0023] Figure 2 It is a partially enlarged cross-sectional schematic view of a three-dimensional heat pipe plate according to an embodiment of the present invention.

[0024] Figure 3 It is a partially enlarged cross-sectional schematic view of a three-dimensional heat pipe plate according to another embodiment of the present invention.

[0025] Figure 4 It is a partially enlarged cross-sectional schematic view of a three-dimensional heat pipe plate according to still another embodiment of the present invention.

[0026] Figure 5 It is a partially enlarged cross-sectional schematic view of a three-dimensional heat pipe plate according to yet another embodiment of the present invention.

[0027] Among them, the description of the reference numerals is as follows:

[0028] 100: Three-dimensional heat pipe plate

[0029] 102: Heat pipe plate module

[0030] 103: Lower housing structure

[0031] 104: Upper housing structure

[0032] 106: Heat pipe module

[0033] 110: Lower housing

[0034] 120: Upper housing

[0035] 122: Upper housing main body

[0036] 124: Bulging joint part

[0037] 126: Joint flange

[0038] 130: Heat pipe housing

[0039] 132: Heat pipe main body

[0040] 134: Expanded pipe joint part

[0041] 140: Lower housing capillary structure

[0042] 150: Upper housing capillary structure

[0043] 152: Upper housing main capillary structure

[0044] 154: Upper housing raised capillary structure

[0045] 156: Surroundings

[0046] 160: Heat pipe capillary structure

[0047] 162: Heat pipe main capillary structure

[0048] 164: Heat pipe expanded tube capillary structure

[0049] 201: Joint

[0050] 202: Angle

[0051] 301: Joint

[0052] 302: Angle

[0053] 401: Joint

[0054] 402: Angle

[0055] 501: Joint

[0056] 502: Angle Detailed implementation manners

[0057] The following will disclose multiple embodiments of the present invention with diagrams. For the sake of clear illustration, many practical details will be described together in the following narration. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in the embodiments of the present invention, these practical details are not necessary. In addition, for the purpose of simplifying the diagrams, some conventional structures and elements will be shown in a simple schematic manner in the diagrams.

[0058] Figure 1 is a schematic exploded view of a three-dimensional heat spreader, and Figures 2 to 5 is a partial enlarged cross-sectional schematic view of multiple embodiments.

[0059] Refer to Figure 1, the three-dimensional vapor chamber 100 includes a vapor chamber module 102 and a heat pipe module 106. The vapor chamber module 102 includes an upper shell structure 104 and a lower shell structure 103. Among them, the upper shell structure 104 includes an upper shell body 120 and an upper shell body capillary structure 150 formed in the upper shell body 120. Among them, the upper shell body 120 and the upper shell body capillary structure 150 can be integrally formed or separately fabricated and then processed and combined, or the upper shell body 120 can be formed first, and then the upper shell body capillary structure 150 can be processed and formed on the upper shell body 120, such as by sintering or bonding, etc., and none of them deviate from the spirit and protection method of the present invention.

[0060] In addition, the heat pipe module 106 is fixed to the vapor chamber module 102 and is fluidly connected to the vapor chamber module 102 so that the heat dissipation fluid can flow between the vapor chamber module 102 and the heat pipe module 106. Among them, the heat pipe module 106 includes a heat pipe housing 130 fixed to the upper shell body 120 and a heat pipe capillary structure 160 formed in the heat pipe housing 130 and connected to the upper shell body capillary structure 150. Among them, the heat pipe housing 130 and the heat pipe capillary structure 160 can be integrally formed or separately fabricated and then processed and combined, or the heat pipe housing 130 can be formed first, and then the heat pipe capillary structure 160 can be processed and formed on the heat pipe housing 130, such as by sintering or bonding, etc., and none of them deviate from the spirit and protection method of the present invention.

[0061] In some embodiments, the lower shell body 110 is joined to the upper shell body 120 to form a sealed space, in which a heat dissipation fluid is provided to dissipate heat from the heat source. And the heat pipe housing 130 is fixed on the upper shell body 120 and is fluidly connected to the sealed space so that the heat dissipation fluid can flow in the heat pipe housing 130 and the sealed space between the lower shell body 110 and the upper shell body 120.

[0062] In addition, an upper shell body capillary structure 150 is formed on the inner surface of the upper shell body 120, and a heat pipe capillary structure 160 is formed in the heat pipe housing 130, and the heat pipe capillary structure 160 is connected to the upper shell body capillary structure 150 to increase the flow rate and efficiency of the heat dissipation fluid in the three-dimensional vapor chamber 100, thereby increasing the heat dissipation efficiency of the three-dimensional vapor chamber 100.

[0063] In addition, a lower shell body capillary structure 140 is formed on the inner surface of the lower shell body 110, which can also effectively increase the flow rate and efficiency of the heat dissipation fluid. In some embodiments, the periphery 156 of the upper shell body capillary structure 150 is preferably connected to the lower shell body capillary structure 140 to increase the flow rate and efficiency of the heat dissipation fluid.

[0064] In some embodiments, the lower housing 110 and the upper housing 120 can be joined by means such as brazing, soldering, high-frequency welding, laser welding, and resistance welding, or an adhesive can also be used for joining, all of which do not depart from the spirit and scope of protection of the present invention.

[0065] Also refer to Figure 2 , in some embodiments, the upper housing 120 includes an upper housing main body 122 and a raised joint portion 124. The raised joint portion 124 is formed in the upper housing main body 122, and the heat pipe housing 130 passes through the raised joint portion 124 so that the sealed space between the heat pipe housing 130, the lower housing 110, and the upper housing 120 is in fluid communication.

[0066] In some embodiments, the heat pipe housing 130 includes a heat pipe main body 132 and an expanded tube joint portion 134. The expanded tube joint portion 134 is connected to the heat pipe main body 132, and the expanded tube joint portion 134 is joined to the raised joint portion 124 of the upper housing 120 to closely fit the heat pipe housing 130 and the upper housing 120.

[0067] In some embodiments, the heat pipe housing 130 and the upper housing 120 can be joined by means such as brazing, soldering, high-frequency welding, laser welding, and resistance welding, or an adhesive can also be used for joining, all of which do not depart from the spirit and scope of protection of the present invention.

[0068] In some embodiments, the upper housing capillary structure 150 includes an upper housing main capillary structure 152 and an upper housing raised capillary structure 154. The upper housing main capillary structure 152 is formed on the inner surface of the upper housing main body 122, and the upper housing raised capillary structure 154 is connected to the upper housing main capillary structure 152 and is formed on the inner side of the raised joint portion 124.

[0069] In addition, the heat pipe capillary structure 160 includes a heat pipe main capillary structure 162 and a heat pipe expanded tube capillary structure 164. The heat pipe main capillary structure 162 is formed on the inner surface of the heat pipe main body 132, and the heat pipe expanded tube capillary structure 164 is connected to the heat pipe main capillary structure 162 and is formed on the inner side of the expanded tube joint portion 134.

[0070] Further refer to Figure 2 , as shown in the figure, in some embodiments, at the joint 201, the heat pipe expanded tube capillary structure 164 and the expanded tube joint portion 134 are mutually engaged. In other words, the end face of the heat pipe expanded tube capillary structure 164 protrudes from the end face of the expanded tube joint portion 134 and is engaged with the upper housing raised capillary structure 154 to effectively increase the connection strength and the transmission efficiency of the heat dissipation fluid.

[0071] Also refer to Figure 3, in some embodiments, as shown in the figure, at the joint 301, the end face of the heat pipe expanded capillary structure 164 is connected to the end face of the upper housing raised capillary structure 154. In other words, the end face of the heat pipe expanded capillary structure 164 is flush with the end face of the expanded joint 134, and the end face of the heat pipe expanded capillary structure 164 is used to connect to the end face of the upper housing raised capillary structure 154, and a space can be formed at the joint 301 to accommodate the heat dissipation fluid, or the upper housing raised capillary structure 154 is used to seal this space, so as to facilitate the connection between the heat pipe expanded capillary structure 164 and the upper housing raised capillary structure 154, thereby effectively increasing the transmission efficiency of the heat dissipation fluid.

[0072] Further refer to Figure 4 , in some embodiments, as shown in the figure, at the joint 401, the heat pipe expanded capillary structure 164 is joined between the upper housing raised capillary structure 154 and the expanded joint 134. In other words, the heat pipe expanded capillary structure 164 is clamped between the upper housing raised capillary structure 154 and the expanded joint 134, and the expanded joint 134 is joined to the inner side of the raised joint 124, effectively increasing the connection area and connection strength of the capillary structure, and further increasing the transmission efficiency of the heat dissipation fluid to improve the heat dissipation efficiency of the three-dimensional heat spreader 100.

[0073] In addition, refer to Figure 5 , in some embodiments, as shown in the figure, at the joint 501, the upper housing raised capillary structure 154 is joined between the heat pipe expanded capillary structure 164 and the raised joint 124. In other words, the upper housing raised capillary structure 154 is clamped between the heat pipe expanded capillary structure 164 and the raised joint 124, and the expanded joint 134 is joined to the inner side of the raised joint 124, effectively increasing the connection area and connection strength of the capillary structure, and further increasing the transmission efficiency of the heat dissipation fluid to improve the heat dissipation efficiency of the three-dimensional heat spreader 100.

[0074] In some embodiments, refer to Figures 2 to 5 , as shown in the figure, the heat pipe expanded capillary structure 164 and the heat pipe main capillary structure 162 form an expansion angle, such as the expansion angles 202, 302, 402, and 502 in the figure. Preferably, it is greater than 0.5 degrees and less than 90 degrees, such as 1 degree, 5 degrees, 10 degrees, 15 degrees, 25 degrees, 30 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 85 degrees, or 89 degrees, etc., all of which do not depart from the spirit and protection scope of the present invention.

[0075] In some embodiments, it is worth noting that the upper housing 120 further includes a joint flange 126 connected to the raised joint portion 124 for engaging with the expanded tube joint portion 134 of the heat pipe housing 130. In some embodiments, the inner diameter of the joint flange 126 is approximately equal to the outer diameter of the heat pipe body 132, such as greater than 2 mm, so as to effectively transfer the heat dissipation fluid and improve the working efficiency.

[0076] In addition, in some embodiments, the heat pipe expanded tube capillary structure 164 of the heat pipe capillary structure 160 and the upper housing raised capillary structure 154 of the upper housing capillary structure 150 are connected in a full circumference, for example, connected in a circular full circumference, so as to increase the heat dissipation efficiency.

[0077] In some embodiments, the heat pipe expanded tube capillary structure 164 of the heat pipe capillary structure 160 is not connected to the upper housing raised capillary structure 154 of the upper housing capillary structure 150 in a full circumference. In other words, only a part of the heat pipe expanded tube capillary structure 164 of the heat pipe capillary structure 160 is connected to the upper housing raised capillary structure 154 of the upper housing capillary structure 150, that is, only a part of the heat pipe expanded tube capillary structure 164 of the heat pipe capillary structure 160 is connected to the upper housing raised capillary structure 154 of the upper housing capillary structure 150, so as to facilitate the production of the three-dimensional heat spreader 100 and also increase the heat dissipation efficiency of the three-dimensional heat spreader 100.

[0078] In some embodiments, the heat pipe expanded tube capillary structure 164 and the upper housing raised capillary structure 154 can be single or multiple point connections, line connections, surface connections, end face connections or overlapping connections, or even full circumference connections, all of which do not depart from the spirit and protection scope of the present invention.

[0079] In some embodiments, the heat pipe capillary structure 160 and the upper housing capillary structure 150 include but are not limited to porous capillary structures, powder sintered capillary structures, micro-groove capillary structures, woven mesh capillary structures or woven strip capillary structures and other structures or materials that can generate capillary phenomena, or composite capillary structures of any combination of the above, all of which do not depart from the spirit and protection scope of the present invention.

[0080] Therefore, according to the architecture of the various embodiments of the three-dimensional heat spreader of the present invention, the three-dimensional heat spreader of the present invention can utilize the heat pipe expanded tube capillary structure part of the heat pipe capillary structure or annularly connect the upper housing raised capillary structure of the upper housing capillary structure to increase the flow efficiency of the heat dissipation fluid, and further increase the heat dissipation efficiency of the three-dimensional heat spreader.

[0081] Finally, in the above-disclosed various embodiments, they are not intended to limit the present invention. Any person skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention, and all can be protected by the present invention. Therefore, the protection scope of the present invention shall be determined by the appended claims.

Claims

1. A three-dimensional heat pipe, characterized in that, Comprising: A heat pipe module, including an upper shell structure, where the upper shell structure includes an upper shell body and an upper shell body capillary structure formed within the upper shell body; and A heat pipe module, fixed to the heat pipe module and communicating with the heat pipe module, where the heat pipe module includes a heat pipe shell fixed to the upper shell body; and a heat pipe capillary structure formed within the heat pipe shell and connected to the upper shell body capillary structure.

2. The three-dimensional heat spreader according to claim 1, wherein, The upper shell body includes: An upper shell main body; and A raised joint portion formed within the upper shell main body, and the heat pipe shell passes through the raised joint portion.

3. The three-dimensional heat spreader according to claim 2, wherein, The heat pipe shell includes: A heat pipe main body; and An expanded pipe joint portion connected to the heat pipe main body and joined to the raised joint portion of the upper shell body.

4. The three-dimensional heat pipe as claimed in claim 3, wherein, The upper shell body capillary structure includes: An upper shell main capillary structure formed on the inner surface of the upper shell main body; and An upper shell raised capillary structure connected to the upper shell main capillary structure and formed on the inner side of the raised joint portion.

5. The three-dimensional heat pipe according to claim 4, wherein, The heat pipe capillary structure includes: A heat pipe main capillary structure formed on the inner surface of the heat pipe main body; and A heat pipe expanded pipe capillary structure connected to the heat pipe main capillary structure and formed on the inner side of the expanded pipe joint portion.

6. The three-dimensional heat pipe as claimed in claim 5, wherein, The end face of the upper shell raised capillary structure is connected to the end face of the heat pipe expanded pipe capillary structure and the end face of the expanded pipe joint portion.

7. The three-dimensional heat spreader according to claim 5, wherein, The heat pipe expanded pipe capillary structure is embedded in the upper shell raised capillary structure.

8. The three-dimensional heat pipe as claimed in claim 5, wherein, The heat pipe expanded pipe capillary structure is joined between the upper shell raised capillary structure and the expanded pipe joint portion.

9. The three-dimensional vapor chamber according to claim 5, wherein, The upper shell raised capillary structure is joined between the heat pipe expanded pipe capillary structure and the raised joint portion.

10. The three-dimensional vapor chamber according to claim 5, wherein, The upper shell body further includes: A joint flange connected to the raised joint portion to join to the expanded pipe joint portion of the heat pipe shell.

11. The three-dimensional heat spreader according to claim 5, wherein, The heat pipe expanded pipe capillary structure portion of the heat pipe capillary structure is connected to the upper shell raised capillary structure of the upper shell body capillary structure.

12. The three-dimensional vapor chamber according to claim 1, wherein, The heat pipe module further includes: A lower shell structure closely attached to the upper shell structure, where the lower shell structure includes a lower shell body and a lower shell body capillary structure formed on the inner surface of the lower shell body, and the periphery of the upper shell body capillary structure is connected to the lower shell body capillary structure.

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