Method for controlling production of nanomaterials, production equipment, device for preparing nanomaterials

By accurately acquiring the target shape and ablation properties, designing a non-repeating covering moving path and coordinating the adjustment of laser parameters, the problem of low target utilization and ablation efficiency in liquid phase laser technology was solved, and efficient and uniform preparation of nanomaterials was achieved.

CN120285919BActive Publication Date: 2025-10-17HEFEI INSTITUTE OF PHYSICAL SCIENCE CHINESE ACADEMY OF SCIENCES
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Patent Information

Application Number
CN202510782459.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-06-12
Publication Date
2025-10-17
Estimated Expiration
2045-06-12

AI Technical Summary

Technical Problem

The target material utilization rate and ablation efficiency of liquid phase laser technology in the preparation of nanomaterials are low, resulting in the fact that large-scale production has not yet been popularized.

Method used

By accurately acquiring the target shape, melting properties, and laser parameters, a non-repeating target movement path is designed. The target movement speed is determined by combining the ease of target melting, spot size, and pulse frequency, balancing energy input and heat dissipation efficiency, and nanomaterials are prepared using liquid phase laser technology.

Benefits of technology

It improves the utilization rate and melting efficiency of the target material, ensures that the laser energy is applied uniformly to the entire surface of the target material, reduces ineffective repeated melting, and increases the melting area per unit time, making it suitable for the efficient and uniform preparation of nanoparticles in large-scale production.

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Abstract

The application relates to a nano-material production control method and production equipment and a nano-material preparation device. The method comprises the following steps: acquiring the shape of a target material, the melting and corrosion property of the target material, a preset light spot size and a preset pulse frequency; determining a target movement path according to the shape of the target material; determining a target movement speed according to the melting and corrosion property of the target material, the preset light spot size and the preset pulse frequency; driving a movement platform to move along the target movement path at the target movement speed, and controlling a laser to generate laser light so that the laser light melts and corrodes the target material along the target movement path during the movement of the movement platform. The method can improve the utilization rate and the melting and corrosion efficiency of the target material.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of nanomaterial preparation, in particular to a production control method and production equipment of nanomaterials and a device for preparing nanomaterials. BACKGROUND

[0002] With the continuous improvement of the performance of laser equipment and the gradual reduction of the cost, more and more industries have shown great interest in liquid-phase laser technology, expecting to use the nanomaterials prepared by liquid-phase laser to manufacture high-performance catalysts, battery materials, functional coatings and high-value-added products for biomedical applications.

[0003] Although laser technology has been maturely applied in industrial batch processing, the industrial application of liquid-phase laser technology in nanoparticle preparation is still in its infancy and has not yet fully matured, and large-scale production has not yet been popularized.

[0004] Currently, the preparation of nanomaterials by liquid-phase laser technology is mostly fixed-point ablation, which can easily lead to low utilization rate of target material and low ablation efficiency. SUMMARY

[0005] Therefore, it is necessary to provide a production control method and production equipment of nanomaterials and a device for preparing nanomaterials in view of the above technical problems.

[0006] In a first aspect, the present application provides a production control method of nanomaterials, which is applied to a device for preparing nanomaterials by liquid-phase laser technology, the device comprising a laser, a light guide assembly, a sample cell and a moving platform, the laser being configured to generate laser light with a preset spot size and a preset pulse frequency, the sample cell being arranged on the moving platform and configured to contain a target material and a solution to be reacted, and the light guide assembly being arranged in a light path between the sample cell and the laser to guide the laser light into the sample cell containing the target material and the solution to be reacted, the method comprising:

[0007] obtaining the shape of the target material, the ablation property of the target material, the preset spot size and the preset pulse frequency;

[0008] determining a target moving path according to the shape of the target material;

[0009] determining a target moving speed according to the ablation property of the target material, the preset spot size and the preset pulse frequency;

[0010] driving the moving platform to move along the target moving path at the target moving speed, and controlling the laser to generate laser light during the movement of the moving platform so that the laser light ablates the target material along the target moving path.

[0011] In one embodiment, the target moving path is determined according to the shape of the target material, comprising:

[0012] In a case where the target material has a rectangular shape, the target movement path is determined as a Z-shaped path.

[0013] In one of the embodiments, the method further comprises:

[0014] During driving the mobile platform to move along the target movement path at the target movement speed, a real-time movement speed of the mobile platform is acquired;

[0015] In a case where the real-time movement speed of the mobile platform is less than the target movement speed, the pulse frequency of the laser is decreased;

[0016] In a case where the real-time movement speed of the mobile platform is greater than the target movement speed, the pulse frequency of the laser is increased.

[0017] In one of the embodiments, the method further comprises:

[0018] During driving the mobile platform to move along the target movement path at the target movement speed, a real-time spot size of the laser is acquired;

[0019] In a case where the real-time spot size of the laser is less than a preset spot size, the movement speed of the mobile platform is increased;

[0020] In a case where the real-time spot size of the laser is greater than the preset spot size, the movement speed of the mobile platform is decreased.

[0021] In one of the embodiments, the method further comprises:

[0022] During driving the mobile platform to move along the target movement path at the target movement speed, a real-time pulse frequency of the laser is acquired;

[0023] In a case where the real-time pulse frequency of the laser is less than a preset pulse frequency, the movement speed of the mobile platform is decreased;

[0024] In a case where the real-time pulse frequency of the laser is greater than the preset pulse frequency, the movement speed of the mobile platform is increased.

[0025] In one of the embodiments, before the step of driving the mobile platform to move along the target movement path at the target movement speed, the method comprises:

[0026] A starting target position of the target material is acquired;

[0027] In a case where the starting target position of the target material is aligned with the exit position of the laser, the mobile platform is driven to move along the target movement path at the target movement speed.

[0028] In a second aspect, the application further provides a controller comprising a memory and a processor, the memory storing a computer program, and the processor implementing the steps of the method in the above embodiments when executing the computer program.

[0029] In a third aspect, the application further provides a device for preparing nanomaterials by liquid-phase laser technology, the device comprising:

[0030] a laser, the laser being configured to generate laser light with a preset spot size and a preset pulse frequency;

[0031] a moving platform;

[0032] a sample cell, the sample cell being arranged on the moving platform and configured to contain a solution to be reacted and a target material;

[0033] a light guide assembly, the light guide assembly being arranged in a light path between the sample cell and the laser and configured to guide the laser light into the solution to be reacted and the target material in the sample cell;

[0034] and the controller in the above embodiment, the controller being connected to the laser and the moving platform, respectively.

[0035] In a fourth aspect, the application further provides a production device for nanomaterials, the production device comprising:

[0036] a sealed cabinet, the sealed cabinet having a containing space;

[0037] and the device for preparing nanomaterials by liquid-phase laser technology in the above embodiment, the device for preparing nanomaterials by liquid-phase laser technology being arranged in the containing space.

[0038] In an embodiment, the production device further comprises:

[0039] a human-computer interaction terminal, the human-computer interaction terminal being connected to the controller and configured to input an external shape of the target material, a melting property of the target material, the preset spot size and the preset pulse frequency.

[0040] The production control method for nanomaterials, the production device and the device for preparing nanomaterials have at least the following beneficial effects:

[0041] By accurately obtaining the external shape of the target material, the melting property and the laser parameters, a target moving path with no repeated coverage is designed based on the external shape of the target material, so as to avoid local excessive consumption and waste in uncovered areas caused by repeated melting in the annular area. Meanwhile, the target moving speed is determined in combination with the melting difficulty of the target material, the spot size and the pulse frequency, so as to balance the energy input and the heat dissipation efficiency. The combination of the above two aspects makes the laser energy uniformly act on the whole surface of the target material, reduces invalid repeated melting, increases the melting area per unit time while reducing material loss, thereby significantly improves the utilization rate and the melting efficiency of the target material, and lays a foundation for efficient and uniform preparation of nanometer particles in large-scale production. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the accompanying drawings in the following description only only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0043] Figure 1 Flowchart of a production control method of nanomaterials in one embodiment;

[0044] Figure 2 Structure diagram of a device for preparing nanomaterials by using liquid-phase laser technology in one embodiment;

[0045] Figure 3 Diagram of a melting path formed on a target material in one embodiment;

[0046] Figure 4 Flowchart of a production control method of nanomaterials in one embodiment;

[0047] Figure 5 Flowchart of a production control method of nanomaterials in one embodiment;

[0048] Figure 6 Flowchart of a production control method of nanomaterials in one embodiment;

[0049] Figure 7 Flowchart of a production control method of nanomaterials in one embodiment;

[0050] Figure 8 Structure diagram of a production device of nanomaterials in one embodiment;

[0051] Figure 9 Structure diagram of a production device of nanomaterials in another embodiment;

[0052] Figure 10 Structure block diagram of a production control device of nanomaterials in one embodiment;

[0053] Figure 11 Internal structure diagram of a controller in one embodiment. DETAILED DESCRIPTION

[0054] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The embodiments of the present application are shown in the accompanying drawings. However, the present application can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0056] Spatially relative terms, such as "under", "below", "lower", "over", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device described is turned over, elements described as "under" or "below" other elements or features would then be oriented "over" the other elements or features. Thus, the exemplary term "under" can encompass both an orientation of over and under. The device can also be oriented in the other direction, and the spatially relative terms used herein are intended to encompass all of these additional orientations. It is noted that the terms "comprises" and / or "comprising", or "includes" and / or "including" when used herein, specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0057] It is to be noted that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or connected to the other element with intervening elements. Also, "connected" in the following embodiments, if there is a transmission of electric signals or data between the connected objects, should be understood as "electrically connected", "communicatively connected", etc.

[0058] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It should also be understood that the term "comprising" or "comprises" or "including" or "includes" when used herein, specifies the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0059] In one exemplary embodiment, as shown in FIG. 1, the present application provides a method for controlling production of nanomaterials, in which the method is applied to a process for producing nanomaterials, as shown in FIG. 2. Figure 1 In one exemplary embodiment, as shown in FIG. 1, the present application provides a method for controlling production of nanomaterials, in which the method is applied to a process for producing nanomaterials, as shown in FIG. 2. Figure 2 and Figure 3The device for preparing nanomaterials by liquid-phase laser technology shown in the embodiment comprises a laser 2, a light guide assembly 4, a sample cell 6 and a moving platform 8. The laser 2 is used to generate laser light with a preset spot size and a preset pulse frequency. The sample cell 6 is arranged on the moving platform 8 and is used to hold a solution to be reacted and a target material 300. The light guide assembly 4 is arranged in the light path between the sample cell 6 and the laser 2 to guide the laser light into the sample cell 6 to hold the solution to be reacted and the target material 300. The method comprises the following steps:

[0060] In S102, the shape of the target material, the ablation property of the target material, the preset spot size and the preset pulse frequency are obtained.

[0061] In S104, the target moving path is determined according to the shape of the target material.

[0062] In S106, the target moving speed is determined according to the ablation property of the target material, the preset spot size and the preset pulse frequency.

[0063] In S108, the moving platform is driven to move along the target moving path at the target moving speed, and the laser is controlled to generate laser light to ablate the target material along the target moving path during the movement of the moving platform.

[0064] The shape of the target material can refer to the physical shape, size, and surface features of the target material, such as diameter, thickness, flatness, etc., and the shape of the target material directly affects the design of the laser ablation path. For example, if the target material is a circular sheet, the traditional rotary displacement table can only make it do circular motion, resulting in the ablation path being limited to the annular area, low ablation efficiency, and low utilization rate of the target material. By identifying the shape of the target material (such as size, shape), determining the movement trajectory of the moving platform (such as translation path length, direction), ensuring that the laser spot uniformly covers the target material surface, and avoiding local overheating or insufficient ablation. The ablation properties of the target material can refer to the response characteristics of the target material to laser energy, including melting point, boiling point, thermal conductivity, laser absorption rate, and other physical properties, as well as whether spatter, oxidation, or composition segregation occurs during the ablation process. In particular, in this application, the ablation properties of the target material mainly refer to the degree of difficulty of ablation of the target material. The ablation properties of the target material affect the utilization rate of the target material and the uniformity of the nanoparticles. If the thermal conductivity of the target material is low, fast movement can result in insufficient local energy accumulation and incomplete ablation. If the thermal conductivity is high, the moving speed needs to be increased to avoid excessive ablation. Adjust the moving speed according to the ablation properties to balance the laser energy input and the heat dissipation efficiency of the target material, ensure the stability of the ablation process, and improve the yield and uniformity of the nanoparticles. The preset spot size can refer to the diameter of the spot formed on the target material surface after the laser beam output by the laser is focused by the light guide assembly (such as light guide arm, focusing mirror). The spot size directly affects the distribution of laser energy on the target material surface. Small spot has high energy density, suitable for fine ablation; large spot has wide coverage area, suitable for large-area rapid ablation. Combined with the properties of the target material and the moving speed, the ablation efficiency and uniformity can be optimized. The preset pulse frequency can refer to the number of laser pulses output by the laser per second, reflecting the time interval of laser energy input. The pulse frequency of the laser affects the heat accumulation effect on the target material surface. High-frequency pulses can cause local temperature to rise rapidly, which requires increasing the moving speed to disperse energy and avoid excessive ablation or spatter; low-frequency pulses allow slower moving speed to ensure sufficient energy absorption. The preset spot size and preset pulse frequency of the laser can be set by the operator before production by setting the laser and light guide assembly.

[0065] Exemplarily, the target movement path refers to the movement trajectory of the sample pool or target material under the driving of the movement platform, and the design needs to ensure that the laser spot uniformly covers the surface of the target material, avoids repeated ablation or local non-ablation, and improves the ablation efficiency and nanoparticle uniformity. For example, when the target material is a circular sheet, if a rotary displacement table is used, the target material can only make circumferential movement, resulting in that the laser ablation path is limited to a ring-shaped area (the actual ablation path is a circumference). Such a path will cause the laser to repeatedly irradiate the same ring-shaped area, resulting in local over-ablation of the target material, and the uncovered area cannot be effectively utilized, affecting the ablation efficiency and uniformity. By analyzing the shape of the target material (such as size, shape), a matching movement mode (rotation or translation) is selected to ensure that the laser spot forms a continuous, non-overlapping scanning trajectory on the surface of the target material, and to avoid energy concentration in a local area. The target movement speed refers to the movement rate of the sample pool or target material on the movement platform, and needs to be coordinated with the ablation properties of the target material, the spot size and pulse frequency of the laser to balance the energy input and heat dissipation of the target material, and to avoid excessive ablation or insufficient ablation. For example, if the target material is a high-melting-point material, more laser energy is needed for its ablation, and the movement speed needs to be reduced so that the laser pulse stays on the surface of the target material for a longer time and the energy accumulation is more sufficient, thereby improving the ablation efficiency. Conversely, if the target material is a low-melting-point material, the movement speed needs to be increased to avoid local overheating leading to target material spatter or excessive evaporation. The spot size and pulse frequency of the laser often reflect the energy density of the laser, and the size of the energy density will also affect the ablation effect. Therefore, when determining the movement speed of the movement platform, in addition to considering the ablation properties of the target material, the preset spot size and preset pulse frequency also need to be considered comprehensively to improve the energy utilization efficiency and nanoparticle uniformity.

[0066] The above production control method of nanomaterials accurately acquires the shape, ablation properties and laser parameters of the target material, designs a non-repeatedly covered target movement path based on the shape of the target material, avoids local over-consumption and waste of uncovered areas caused by repeated ablation in the ring-shaped area, and simultaneously determines the target movement speed in combination with the ablation difficulty of the target material, the spot size and the pulse frequency to balance the energy input and heat dissipation efficiency. The combination of the above two makes the laser energy uniformly act on the whole surface of the target material, reduces the invalid repeated ablation, improves the ablation area per unit time while reducing the material loss, thereby significantly improves the utilization rate of the target material and the ablation efficiency, and lays a foundation for efficient and uniform preparation of nanoparticles in large-scale production.

[0067] In one exemplary embodiment, as shown in Figure 3 the target movement path is determined according to the shape of the target material, including:

[0068] In the case where the shape of the target material is rectangular, the target movement path is determined as a Z-shaped path.

[0069] Exemplarily, in the case that the target material has a rectangular shape, the target movement path is determined as a Z-shaped path, in which the rectangular target material has regular long and short sides, and the Z-shaped path can be reciprocally linearly scanned along the long axis direction of the rectangle, so that the laser spot covers the entire rectangular surface along a Z-shaped trajectory as shown in Figure 3 On the one hand, the linear reciprocating motion avoids the annular repeated ablation problem of the conventional rotary displacement table, ensures that the laser spot sequentially and non-overlappingly covers the entire area of the rectangular target material row by row, and maximally reduces the energy concentration and local excessive ablation on the surface of the target material; on the other hand, the regularity of the Z-shaped path facilitates the motion control of the moving platform, and the laser pulse can be uniformly applied to each position of the rectangular target material by accurately setting the translation speed and turning interval, thereby improving the uniformity of ablation and the utilization rate of the target material, and being particularly suitable for large-scale production scenarios of large-area rectangular target materials, while ensuring the ablation efficiency and reducing material loss.

[0070] In an exemplary embodiment, as shown in Figure 4 the method further comprises:

[0071] S402, acquiring a real-time movement speed of the moving platform in the process of driving the moving platform to move along the target movement path at a target movement speed.

[0072] S404, in the case that the real-time movement speed of the moving platform is less than the target movement speed, reducing the pulse frequency of the laser.

[0073] S406, in the case that the real-time movement speed of the moving platform is greater than the target movement speed, increasing the pulse frequency of the laser.

[0074] Exemplarily, when the real-time movement speed is less than the target movement speed, the target material stays in the laser action area for a longer time, the energy input per unit area increases, which may cause excessive ablation or splashing. At this time, reducing the pulse frequency can reduce the number of laser pulses per unit time, reduce the energy input density, and avoid local overheating; on the contrary, if the real-time movement speed is greater than the target movement speed, the target material moves too fast, which may cause insufficient laser energy and insufficient ablation, and increasing the pulse frequency can compensate for the energy input by increasing the number of pulses, thereby ensuring the ablation effect. In the present embodiment, the pulse frequency is adjusted preferentially, rather than adjusting the size of the laser spot or directly adjusting the movement speed of the moving platform, because adjusting the size of the laser spot requires physically adjusting the light guide assembly, which is complex and cannot respond in real time, and may interrupt the production process; and directly adjusting the movement speed may destroy the pre-set coordination between the target path and the speed (such as the turning rhythm of the Z-shaped path), resulting in uneven ablation path. The pulse frequency adjustment can be adjusted in real time by the laser control system, which has fast response speed and high precision, and does not affect the pre-set trajectory of the moving platform, and can quickly balance the energy input while maintaining the stability of the path.

[0075] The strategy of prioritizing laser pulse frequency adjustment in this embodiment is suitable for scenarios that require real-time dynamic balancing of energy input and target movement speed, and that place high demands on production continuity and path stability. For example, in long-term, continuous, large-scale production, when the speed of the mobile platform fluctuates due to mechanical factors, the pulse frequency can be adjusted in real time to quickly compensate for energy matching, avoiding production interruptions or disruptions to the preset path. This strategy is also suitable for production scenarios where targets with different ablation properties must be frequently replaced, allowing for rapid adaptation to the energy requirements of different targets without having to readjust the movement speed and path. Because the optimal movement speeds of different targets can vary significantly, readjusting the movement speed and path for each material change increases debugging time and cost. Fixing the movement path and speed and adjusting only the pulse frequency allows for rapid adaptation to the energy requirements of different targets. For example, when processing refractory targets, a lower movement speed is preset and used with low-frequency pulses. When switching to fusible targets, the original speed is maintained, and energy input efficiency is improved solely by increasing the pulse frequency, avoiding path replanning due to speed adjustments. This strategy is also applicable to precision preparation scenarios with high requirements for ablation uniformity and accuracy. In such scenarios, the adjustment of the spot size may cause energy density fluctuations due to the accuracy limitations of optical components (such as focal length errors of the focusing mirror), affecting the uniformity of ablation. The adjustment of the movement speed may cause speed overshoot or lag in the acceleration and deceleration stages due to mechanical inertia, resulting in unstable quality in the starting and ending areas of ablation. The digital adjustment of the pulse frequency has high accuracy and can achieve microsecond-level response to energy input, ensuring the consistency of the number of pulse actions on each section of the target surface, thereby improving the size uniformity and preparation accuracy of the nanoparticles.

[0076] In this embodiment, a closed-loop feedback system of "speed-energy" is established through real-time dynamic adjustment of the pulse frequency to ensure that the laser energy input per unit area remains constant when the target material's moving speed fluctuates, thereby maintaining the ablation efficiency and uniformity of the nanoparticles. At the same time, the frequent movement of mechanical components is reduced, and the stability and service life of the equipment operation are improved. This is particularly suitable for the demand for dynamic control of process parameters in large-scale production.

[0077] In an exemplary embodiment, Figure 5 As shown, the method further includes:

[0078] S502 , while driving the mobile platform to move along the target moving path at the target moving speed, obtaining the real-time spot size of the laser.

[0079] S504 , when the real-time spot size of the laser is smaller than the preset spot size, increasing the moving speed of the moving platform.

[0080] S506 , when the real-time spot size of the laser is larger than the preset spot size, reducing the moving speed of the moving platform.

[0081] Exemplarily, the spot size directly affects the laser energy density (the smaller the spot, the higher the energy density), and the balance between energy input and ablation efficiency needs to be achieved by adjusting the moving speed. When the real-time spot is smaller than the preset value, the energy density increases, and the energy absorbed per unit area of the target material increases. If the original speed is maintained, it may cause excessive ablation. At this time, increasing the moving speed can shorten the laser action time, reduce energy accumulation, and avoid local overheating or splashing. When the real-time spot is larger than the preset value, the energy density decreases, and the energy absorbed per unit area of the target material is insufficient. If the original speed is maintained, it may cause insufficient ablation. At this time, reducing the moving speed can prolong the laser action time, compensate for energy input, and ensure complete ablation. In the present embodiment, the moving speed is preferentially adjusted rather than the pulse frequency or the spot size. The reason is that the pulse frequency adjustment is mainly used to compensate for the energy matching problem caused by speed fluctuations. If the spot size changes are caused by the offset or contamination of the optical components (such as the focusing mirror), adjusting the frequency cannot fundamentally solve the energy density deviation. Directly adjusting the spot size requires manual adjustment of the light guide assembly (such as rotating the focusing mirror barrel), which is complex to operate and may introduce new optical path errors, affecting the ablation accuracy. The adjustment of the moving speed can be dynamically adjusted in real time through the control system, directly changing the relative action time of the target material and the laser, responding quickly and not involving physical adjustment of the optical components, and quickly restoring the matching relationship between the energy density and the ablation efficiency. Moreover, from the perspective of application scenarios, the strategy of the present embodiment is suitable for scenarios where the energy matching needs to be quickly restored due to fluctuations in the spot size caused by temporary offset, contamination of optical components, or changes in environmental temperature and humidity. For example, in long-term continuous production, the light guide arm or focusing mirror may be slightly displaced due to uneven heat dissipation, causing the spot size to deviate from the preset value. When replacing the target material type or solution, the liquid level changes may cause the laser refraction angle to change, indirectly affecting the spot size. After the device is moved or shaken, the collimation of the optical path may be slightly offset, causing abnormal divergence or focusing of the spot.

[0082] In the present embodiment, by adjusting the moving speed in real time, the influence of fluctuations in the spot size on the ablation effect can be quickly offset without interrupting production or manually intervening in the optical path, and the dynamic balance between the energy density and the target material movement can be maintained. With the advantages of fast response speed and low operation cost, it can not only avoid fluctuations in product quality caused by abnormal spots, but also maintain the stability of the pulse frequency of the laser, especially suitable for large-scale scenarios such as batch preparation processes of nanocatalysts and battery materials, which have high requirements for production continuity and ablation accuracy.

[0083] In one exemplary embodiment, as shown in Figure 6 the method further comprises:

[0084] S602, during driving the moving platform to move along the target movement path at the target movement speed, acquiring a real-time pulse frequency of the laser.

[0085] S604, in the case that the real-time pulse frequency of the laser is less than the preset pulse frequency, reducing the moving speed of the moving platform.

[0086] S606, in the case that the real-time pulse frequency of the laser is greater than the preset pulse frequency, increasing the moving speed of the moving platform.

[0087] Exemplarily, the pulse frequency of the laser directly affects the laser energy input per unit time, the higher the frequency, the more intensive the energy input, and the moving speed needs to be adjusted to match the energy density change. When the real-time pulse frequency is less than the preset value, the number of laser pulses per unit time decreases, the energy input is insufficient, and if the original speed is maintained, it may lead to insufficient ablation. At this time, reducing the moving speed can prolong the residence time of the target material in the laser action area, increase the energy accumulation, and ensure the ablation efficiency. When the real-time pulse frequency is greater than the preset value, the number of pulses per unit time increases, the energy input is too dense, and if the original speed is maintained, it may lead to local overheating or excessive ablation. At this time, increasing the moving speed can shorten the action time of the target material and the laser, disperse the energy input, and avoid excessive ablation. In the embodiment, the moving speed is adjusted instead of the spot size or pulse frequency, because the adjustment of the spot size requires physical adjustment of the light guide assembly, which is complex to operate and cannot respond to the dynamic fluctuations of the pulse frequency in real time, which may damage the stability of the optical path; and directly adjusting the pulse frequency may cause system shock or parameter instability if the real-time frequency deviates from the preset value due to temporary failure of the laser control system (such as signal interference, hardware fluctuation), for example, the pulse frequency deviates after the laser runs for a long time due to heating of internal components; or sudden electromagnetic interference during production causes abnormal signals of the laser control system, leading to frequency fluctuations; the adjustment of the moving speed can be adjusted in real time through a digital control system, directly changing the energy action time, responding quickly and not involving the adjustment of optical components, and quickly establishing a new balance between the frequency and the speed.

[0088] In the embodiment, by adjusting the moving speed in real time, the influence of the pulse frequency fluctuation on the ablation effect can be quickly offset without interrupting the production and manually intervening the laser hardware. This avoids the optical path errors or equipment losses that may be caused by frequent adjustment of the spot or pulse frequency, while maintaining the stability of the laser energy mode (such as constant spot size), ensuring the uniformity of ablation. Its advantages are strong real-time response and low operation cost, especially suitable for continuous production scenarios with high requirements for equipment stability, such as automatic production lines that need to run stably for a long time in the large-scale preparation of nanoparticles, which can effectively reduce the waste rate caused by parameter fluctuations and improve the production efficiency and product quality consistency.

[0089] In one exemplary embodiment, as shown in Figure 7 Before the step of driving the moving platform to move along the target moving path at the target moving speed, the method comprises:

[0090] S702, acquiring a starting target position of the target material.

[0091] S704, driving the moving platform to move along the target moving path at the target moving speed in a case where the starting target position of the target material is aligned with the exit position of the laser.

[0092] In the embodiment, by acquiring the starting target position of the target material and aligning the starting target position with the exit position of the laser, the accurate starting ablation of the laser beam from the preset region of the target material is ensured, the ablation region deviation or repeated adjustment caused by the initial position deviation is avoided, the positioning accuracy of the ablation process can be significantly improved, the target material edge waste or ablation path disorder caused by the starting position error is reduced, especially in large-scale production, the uniform ablation of each batch of target material from the uniform position can be ensured, the consistency of the nanoparticle preparation and the standardization degree of the production process are improved, the debugging cost and time loss caused by improper position calibration are reduced, and a reliable initial condition for automatic continuous production is laid.

[0093] In an exemplary embodiment, the present application also provides a controller comprising a memory and a processor, the memory storing a computer program, and the processor implementing the steps of the method in the above-mentioned embodiments when executing the computer program.

[0094] In an exemplary embodiment, the present application also provides a device for preparing a nanomaterial by using a liquid-phase laser technology, which comprises a laser 2, a moving platform 8, a sample pool 6, a light guide assembly 4, and the controller in the above-mentioned embodiments. The laser 2 is used to generate laser with a preset spot size and a preset pulse frequency; the sample pool 6 is arranged on the moving platform 8, and the sample pool 6 is used to contain a target material 300 and a solution to be reacted; the light guide assembly 4 is arranged in a light path between the sample pool 6 and the laser 2, so as to guide the laser into the sample pool 6 containing the target material 300 and the solution to be reacted; and the controller is connected with the laser 2 and the moving platform 8 respectively.

[0095] The device for preparing a nanomaterial by using a liquid-phase laser technology integrates the controller capable of executing the production method of the nanomaterial in the above-mentioned embodiments, and cooperates with the laser 2, the moving platform 8, the sample pool 6, and the light guide assembly 4, so as to improve the utilization rate of the target material 300 and the ablation efficiency.

[0096] In an exemplary embodiment, as shown in Figure 8 The present application also provides a production equipment for a nanomaterial, which comprises a sealed cabinet 500 and the device for preparing a nanomaterial by using a liquid-phase laser technology in the above-mentioned embodiments. The sealed cabinet 500 has a containing space, and the device for preparing a nanomaterial by using a liquid-phase laser technology is arranged in the containing space.

[0097] In the embodiment, the device for preparing nanomaterials by liquid-phase laser technology is arranged in the accommodation space of the sealed cabinet 500, which can effectively isolate external dust, particulate matter and volatile pollutants from entering the interior of the device to contaminate the target material, solution or laser light path system. For example, in large-scale production, impurities in the air may be adsorbed on the surface of nanoparticles to affect the purity of the product, or deposited on optical elements such as focusing mirrors to cause spot distortion. The independent clean space formed by the sealed cabinet 500 can significantly reduce such risks. In addition, the sealed design can also prevent aerosols or liquid splashes generated during the preparation process from spreading to the external environment, maintain the cleanliness of the production environment, and reduce potential harm to operators, especially in fields such as biomedicine and electronic information that have extremely high requirements for the purity of nanomaterials, to ensure the controllability of the production process and the stability of the product quality.

[0098] In one exemplary embodiment, as shown in FIG. 7, the production device further includes a human-computer interaction terminal 700. The human-computer interaction terminal 700 is connected with the controller, and the human-computer interaction terminal 700 is used for inputting the shape of the target material, the ablation property of the target material, the preset spot size and the preset pulse frequency. Figure 9

[0099] In the embodiment, the connection between the human-computer interaction terminal 700 and the controller provides an easy parameter input interface for the operator, which can intuitively and efficiently transmit the shape of the target material, the ablation property and the laser parameters (the preset spot size and the pulse frequency) to the control system, significantly improving the ease of use of the production device. The operator can quickly complete parameter configuration through the terminal interface without relying on complex code programming or hardware debugging, which is especially suitable for parameter adjustment requirements when switching between multiple types of target materials in large-scale production. At the same time, the standardized input process reduces the error of manual recording and parameter transmission, ensures that the system generates the target moving path and speed based on accurate data, thereby improving the accuracy of the ablation process and the production efficiency, and provides a friendly operation basis for automated and intelligent nanomaterial preparation.

[0100] It should be understood that, although each step in the flowchart involved in each of the above-described embodiments is shown in sequence according to the direction of the arrow, these steps are not necessarily executed in sequence according to the direction of the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other sequences. Moreover, at least part of the steps in the flowchart involved in each of the above-described embodiments can include multiple steps or stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of these steps or stages is not necessarily sequential, but can be executed in rotation or alternation with at least part of other steps or steps or stages in other steps.

[0101] ​Based on the same inventive concept, the embodiments of the present application further provide a nanomaterial production control device for implementing the above-mentioned nanomaterial production control method. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above-mentioned method, and therefore the specific limitations in one or more embodiments of the nanomaterial production control device provided below can refer to the limitations of the nanomaterial production control method described above, which will not be described here again.

[0102] In one exemplary embodiment, as shown in Figure 10 a nanomaterial production control device is provided, comprising:

[0103] The parameter acquisition module 1002 is configured to acquire the shape of the target material, the ablation property of the target material, a preset spot size, and a preset pulse frequency.

[0104] The target movement path determination module 1004 is configured to determine a target movement path according to the shape of the target material.

[0105] The target movement speed determination module 1006 is configured to determine a target movement speed according to the ablation property of the target material, the preset spot size, and the preset pulse frequency.

[0106] The drive control module 1008 is configured to drive the movement platform to move along the target movement path at the target movement speed, and control the laser to generate laser light to ablate the target material along the target movement path during the movement of the movement platform.

[0107] In one exemplary embodiment, the above-mentioned target movement path determination module 1004 comprises:

[0108] The target movement path determination unit is configured to determine the target movement path as a Z-shaped path when the shape of the target material is rectangular.

[0109] In one exemplary embodiment, the above-mentioned nanomaterial production control device further comprises:

[0110] The real-time movement speed acquisition module is configured to acquire a real-time movement speed of the movement platform during the driving of the movement platform to move along the target movement path at the target movement speed.

[0111] The first laser pulse frequency adjustment unit is configured to decrease the pulse frequency of the laser light when the real-time movement speed of the movement platform is less than the target movement speed.

[0112] The second laser pulse frequency adjustment unit is configured to increase the pulse frequency of the laser light when the real-time movement speed of the movement platform is greater than the target movement speed.

[0113] In an exemplary embodiment, the production control device of the nanomaterials further comprises:

[0114] The real-time spot size acquisition module is configured to acquire a real-time spot size of the laser during driving the mobile platform to move along the target movement path at the target movement speed.

[0115] The first movement speed adjustment module is configured to increase the movement speed of the mobile platform when the real-time spot size of the laser is smaller than the preset spot size.

[0116] The second movement speed adjustment module is configured to decrease the movement speed of the mobile platform when the real-time spot size of the laser is greater than the preset spot size.

[0117] In an exemplary embodiment, the production control device of the nanomaterials further comprises:

[0118] The real-time pulse frequency acquisition module is configured to acquire a real-time pulse frequency of the laser during driving the mobile platform to move along the target movement path at the target movement speed.

[0119] The third movement speed adjustment module is configured to decrease the movement speed of the mobile platform when the real-time pulse frequency of the laser is smaller than the preset pulse frequency.

[0120] The fourth movement speed adjustment module is configured to increase the movement speed of the mobile platform when the real-time pulse frequency of the laser is greater than the preset pulse frequency.

[0121] In an exemplary embodiment, the production control device of the nanomaterials further comprises:

[0122] The initial target position acquisition module is configured to acquire an initial target position of the target material.

[0123] The driving verification module is configured to drive the mobile platform to move along the target movement path at the target movement speed when the initial target position of the target material is aligned with the exit position of the laser.

[0124] The modules in the production control device of the nanomaterials can be realized by software, hardware, or a combination thereof. The modules can be embedded in or independent of a processor in a computer device in hardware form, or stored in a memory in the computer device in software form, so as to be called and executed by the processor.

[0125] In an exemplary embodiment, a computer device is provided, which can be a controller, and an internal structure diagram of the computer device can be as shown in Figure 11As shown in the figure. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through the system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capability. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the shape of the target material, the melting property of the target material, the preset spot size and the preset pulse frequency and the like. The input / output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used to communicate with the terminal outside through the network connection. The computer program is executed by the processor to realize a kind of production control method of nanomaterial.

[0126] Those skilled in the art can understand that, Figure 11 The structure shown in the figure is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the computer device to which the scheme of the present application is applied. The specific computer device can include more or less components than those shown in the figure, or combine certain components, or have a different component arrangement.

[0127] In one exemplary embodiment, a computer device is provided, including a memory and a processor, the memory stores a computer program, and the processor executes the computer program to realize the steps in each of the above method embodiments.

[0128] In one embodiment, a computer readable storage medium is provided, which stores a computer program, and the computer program is executed by the processor to realize the steps in each of the above method embodiments.

[0129] In one embodiment, a computer program product is provided, including a computer program, and the computer program is executed by the processor to realize the steps in each of the above method embodiments.

[0130] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. In the embodiments provided in the present application, any reference to memory, database or other medium can include at least one of non-volatile memory and volatile memory. The non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. The volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, the RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., and is not limited thereto. The processor involved in the embodiments provided in the present application can be a general processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., and is not limited thereto.

[0131] In the description of the present specification, the description of the terms "some embodiments", "other embodiments", "ideal embodiments" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above-mentioned terms does not necessarily refer to the same embodiment or example.

[0132] Any combination of the technical features in the above embodiments can be made, and for the sake of brevity, not all possible combinations are described above, however, as long as the combination of the technical features does not exist in contradiction, it shall be considered within the scope of the present disclosure.

[0133] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it shall not be understood as a limitation on the patent scope of the present application. It shall be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these shall be within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A method for controlling the production of nanomaterials, applied to a device for preparing nanomaterials using liquid-phase laser technology, the device comprising a laser, a light guide component, a sample cell, and a movable platform, the laser being used to generate laser light with a preset spot size and a preset pulse frequency, the sample cell being disposed on the movable platform, the sample cell being used to hold a solution to be reacted and a target material, the light guide component being disposed in the optical path between the sample cell and the laser to guide the laser light into the sample cell containing the solution to be reacted and the target material, characterized in that: The method comprises: Obtaining the shape of the target material, the ablation properties of the target material, the preset spot size, and the preset pulse frequency; Determining a target moving path according to the shape of the target material; Determining a target movement speed according to the ablation properties of the target material, the preset spot size, and the preset pulse frequency; driving the mobile platform to move along the target moving path at the target moving speed, and controlling the laser to generate the laser light during the movement of the mobile platform so that the laser light ablates the target material along the target moving path; The method further comprises: In the process of driving the mobile platform to move along the target moving path at the target moving speed, obtaining the real-time moving speed of the mobile platform; When the real-time moving speed of the mobile platform is less than the target moving speed, reducing the pulse frequency of the laser; When the real-time moving speed of the moving platform is greater than the target moving speed, the pulse frequency of the laser is increased.

2. The method for controlling the production of nanomaterials according to claim 1, wherein: Determining the target movement path according to the shape of the target material includes: When the target material has a rectangular shape, the target moving path is determined to be a Z-shaped path.

3. The method for controlling the production of nanomaterials according to any one of claims 1 to 2, characterized in that: The method further comprises: In the process of driving the mobile platform to move along the target moving path at the target moving speed, obtaining the real-time spot size of the laser; When the real-time spot size of the laser is smaller than the preset spot size, increasing the moving speed of the moving platform; When the real-time spot size of the laser is larger than the preset spot size, the moving speed of the moving platform is reduced.

4. The method for controlling the production of nanomaterials according to any one of claims 1 to 2, characterized in that: The method further comprises: In the process of driving the mobile platform to move along the target moving path at the target moving speed, obtaining the real-time pulse frequency of the laser; When the real-time pulse frequency of the laser is less than the preset pulse frequency, reducing the moving speed of the mobile platform; When the real-time pulse frequency of the laser is greater than the preset pulse frequency, the moving speed of the moving platform is increased.

5. The method for controlling the production of nanomaterials according to claim 1, wherein: Before the step of driving the mobile platform to move along the target moving path at the target moving speed, the method includes: Obtaining a starting target position of the target material; When the starting target position of the target material is aligned with the emission position of the laser, the moving platform is driven to move along the target moving path at the target moving speed.

6. A controller comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 5 are implemented.

7. A device for preparing nanomaterials using liquid phase laser technology, characterized in that: The device comprises: A laser, wherein the laser is used to generate laser light with a preset spot size and a preset pulse frequency; Mobile platforms; A sample pool, the sample pool is arranged on the mobile platform, and the sample pool is used to contain the solution to be reacted and the target material; A light guide assembly, the light guide assembly being arranged in the optical path between the sample cell and the laser to guide the laser into the sample cell containing the solution to be reacted and the target material; And the controller according to claim 6, wherein the controller is connected to the laser and the moving platform respectively.

8. A nanomaterial production device, characterized in that: The production equipment includes: A sealed cabinet having an accommodating space; And the device for preparing nanomaterials using liquid phase laser technology as described in claim 7, wherein the device for preparing nanomaterials using liquid phase laser technology is arranged in the accommodating space.

9. The nanomaterial production equipment according to claim 8, characterized in that: The production equipment also includes: A human-computer interaction terminal is connected to the controller and is used to input the shape of the target material, the ablation properties of the target material, the preset spot size and the preset pulse frequency.

Citation Information

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