Optical device dispensing method
By controlling the movement and air pressure of the dispensing head, combined with delayed glue release time and no glue release secondary coating technology, the problem of uneven dispensing of optical devices is solved, and the uniformity and reliability of the product are improved. It is suitable for highly demanding communication optical devices.
Patent Information
- Application Number
- CN202510425326.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-07
- Publication Date
- 2025-07-11
AI Technical Summary
In the existing optical device dispensing process, the amount of dispensing is difficult to accurately control, resulting in uneven distribution of glue, affecting device performance and reliability, and being sensitive to the environment.
By controlling the movement and air pressure of the dispensing head, combined with delaying the glue release time, the un-glued secondary coating technology is used to achieve uniform coating of the glue, forming an accurate glue output amount and uniform distribution.
Improves the uniformity of dispensing, improves the yield and reliability of the product, is suitable for high-demand fields, is cheap and does not require additional equipment.
Smart Images

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Figure HDA0005346552370000012
Abstract
Description
Technical Field
[0001] The present invention relates to the preparation technology of optical devices and their use equipment. Specifically, it is a method for dispensing glue on optical devices. Background Art
[0002] In the production of optical communication devices, glue has many applications, including fixing, sealing, and protecting optical components to ensure the performance reliability of the devices. There are mainly two solutions for fixing between the metal structural parts and the TO of optical devices such as BOSA / TOSA, namely penetration welding and glue bonding. Currently, penetration welding is mainly used for optical devices, especially BOSA. The advantages of penetration welding are firm connection and high mechanical strength. The disadvantages are that it requires special equipment, has high control precision requirements, and leaves marks on the appearance. The advantages of the dispensing process are high flexibility, simple equipment, high automation, and no change in the appearance of the device. The disadvantages are complex process, poor mechanical strength, and being more sensitive to the environment such as temperature and humidity.
[0003] The reasons for the poor mechanical strength and large environmental influence of the dispensing solution are mainly caused by the dispensing process and method in addition to the characteristics of the glue itself. Currently, the programs of dispensing machines are all "dispensing - displacement - stopping glue". This method results in a relatively large amount of glue dispensed at the first point of dispensing, making it impossible to accurately control the starting amount of glue dispensed, easily leading to excessive glue dispensing, and causing uneven distribution of the overall glue amount at the TO bonding position. After the glue cures, the thickness is uneven. When used in a long-term high-temperature environment, the expansion stress of the glue is unbalanced, and the extrusion force acts on the main optical path, resulting in optical path deviation and affecting the device performance.
[0004] Therefore, it is necessary to provide a method for dispensing glue on optical devices to solve the above problems. Summary of the Invention
[0005] The purpose of the present invention is to provide a method for dispensing glue on optical devices.
[0006] The technical solution is as follows:
[0007] A method for dispensing glue on optical devices, the steps include:
[0008] 1) The dispensing head moves, and after delaying for time A, glue is dispensed to form precise control of the amount of glue dispensed;
[0009] 2) Glue is dispensed at the bonding dispensing position, and the dispensing machine controls the stability of the air pressure;
[0010] 3) The glue dispensing stops, completing one cycle of glue dispensing;
[0011] 4) The dispensing head does not dispense glue and corresponds to the bonding dispensing position;
[0012] 5) When the glue dispensing program is performed again, the dispensing head moves, and the glue on the bonding dispensing position is further evenly coated by the glue-free dispensing head to form a non-dispensing type secondary coating and leveling program;
[0013] 6) The dispensing head returns to its original position to complete dispensing.
[0014] Furthermore, time A is determined according to the viscosity of the glue, and one of them is 40 - 60 ms.
[0015] Furthermore, when the viscosity of the glue is 4000 cPs, the air pressure in step 2) is controlled at 0.3 - 0.6 MPa.
[0016] Furthermore, step 5) is performed several times according to the viscosity of the glue.
[0017] Furthermore, step 5) is performed 1 - 5 times according to the viscosity of the glue.
[0018] Compared with the prior art, the present invention can be used in various fields with high requirements for dispensing uniformity, especially products such as communication optical devices that require stress balance of the glue; it can improve the problem of dispensing uniformity, enhance the product yield and reliability; there is no need to add or transform equipment, the method is simple and easy to implement, has a wide application range, and low cost. Description of the Drawings
[0019] Figure 1 It is a product photo of a dispensing method without using the present invention, where there is uneven dispensing glue volume.
[0020] Figure 2 It is a product photo of a dispensing method using the present invention, where the glue volume at the feet is uniform. Detailed Embodiments
[0021] Embodiment:
[0022] This embodiment shows a method for dispensing an optical device, and the steps include:
[0023] 1) The dispensing head moves, delays for time A to discharge glue, and forms precise control of the discharged glue volume;
[0024] 2) Dispense glue at the bonding dispensing position, and the dispenser controls the stability of the air pressure;
[0025] 3) Stop discharging glue to complete one cycle of dispensing;
[0026] 4) The dispensing head does not discharge glue and corresponds to the bonding dispensing position;
[0027] 5) When performing the dispensing program again, the dispensing head moves, and the glue-free dispensing head further evenly coats the glue on the bonding dispensing position to form a non-discharging type secondary coating and evenness program;
[0028] 6) The dispensing head returns to its original position to complete dispensing.
[0029] Among them:
[0030] The time of A is determined according to the viscosity of the glue, and one of them is 40 - 60 ms.
[0031] When the viscosity of the glue is 4000 cPs, the air pressure in step 2) is controlled at 0.3 - 0.6 MPa.
[0032] Step 5) is carried out several times according to the viscosity of the glue.
[0033] One implementation mode is that step 5) is carried out 1 - 5 times according to the viscosity of the glue.
[0034] Compare the products with the original glue application method and the glue application method of the present invention. Refer to Figure 1 、 Figure 2 , at the glue application position of the stepped part of the middle tank body. Through comparison, it can be clearly obtained that the glue application method of the present invention has uniform glue application amount and can adapt to high - requirement occasions.
[0035] Compared with the prior art, the present invention can be used in various fields with high requirements for glue application uniformity, especially products such as communication optical devices that have requirements for glue stress balance; improve the problem of glue application uniformity, enhance the product yield and reliability; without adding or modifying equipment, the method is simple and easy to implement, has a wide application range and low cost.
[0036] For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.
Claims
1. A method for dispensing glue on an optical device, characterized in that: the steps Including: 1) The dispensing head moves, and glue is dispensed after a delay of time A to achieve precise control of the glue dispensing volume; 2) Glue is dispensed at the bonding and dispensing position, and the dispenser controls the stability of the air pressure; 3) The glue dispensing stops to complete one cycle of glue dispensing; 4) The dispensing head does not dispense glue and corresponds to the bonding and dispensing position; 5) When the glue dispensing process is carried out again, the dispensing head moves. The glue-free dispensing head further evenly coats the glue on the bonding and dispensing position to form a non-glue dispensing type secondary coating and leveling process; 6) The dispensing head returns to its original position to complete the glue dispensing.
2. The method for dispensing glue on an optical device according to claim 1, characterized in that: The time A is determined according to the glue viscosity, and one of them is 40 - 60 ms.
3. A method for dispensing glue on an optical device according to claim 1, characterized in that: When the glue viscosity is 4000 cPs, the air pressure in step 2) is controlled at 0.3 - 0.6 MPa.
4. A method for dispensing glue on an optical device according to claim 1, characterized in that: Step 5) is carried out several times according to the glue viscosity.
5. A method for dispensing glue on an optical device according to claim 1, characterized in that: Step 5) is carried out 1 - 5 times according to the glue viscosity.