Intelligent testing and screening device for electronic components

Abstract

The invention discloses an electronic component intelligent testing and screening device, and belongs to the technical field of electronic component testing and screening, the electronic component intelligent testing and screening device comprises two groups of connecting plates, two groups of transmission wheels are rotatably mounted between the two groups of connecting plates, the outer surfaces of the two groups of transmission wheels are sleeved with multiple groups of conveying belts, and adsorption mechanisms are fixedly mounted in the intervals of the multiple groups of conveying belts; a detection mechanism is fixedly installed on the upper surfaces of the two sets of connecting plates, a turnover mechanism is rotationally installed in the middle of the detection mechanism, a first bearing plate and a second bearing plate are fixedly installed at the two ends of the lower surfaces of the two sets of connecting plates correspondingly, and a flapping mechanism is fixedly installed on the upper surface of the second bearing plate. Through the design of the overturning mechanism and the flapping mechanism, the electronic component can be automatically overturned in the process of detecting the electronic component, so that the detection comprehensiveness is greatly improved, the possibility of detection omission caused by the position problem of an electrode plate is reduced, and the detection efficiency is improved. And when unqualified electronic components are detected, the unqualified electronic components can be automatically discharged and stored in a centralized manner.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component testing and screening, and particularly to an intelligent testing and screening device for electronic components. Background Art

[0002] With the rapid development of the electronic information industry, electronic components, as the core basic components of modern electronic devices, their performance stability and reliability directly affect the quality and service life of terminal products. The traditional manual detection method has disadvantages such as low efficiency, poor accuracy, and strong subjectivity, and it has been difficult to meet the requirements of large-scale production. Therefore, developing an efficient, accurate, and automated intelligent detection and screening device has become an urgent need in the industry.

[0003] For example, the patent with the national authorization patent publication number CN208476963U discloses an intelligent testing terminal for electronic components, including an outer frame, an electric telescopic rod, a top frame, a stabilizing device, a stabilizing frame, a sliding head, a connecting rod, a top seat, a lead screw, a moving block, a fixing frame, a vertical plate, a nut, a moving plate, and a fixing plate. The bottom of the inner wall of the outer frame is fixedly connected with a resistor tester, a capacitor tester, and an inductor tester in sequence from left to right. Both sides of the top of the inner wall of the outer frame are fixedly connected with electric telescopic rods, and the bottom of the electric telescopic rods is fixedly connected with a top frame. Both sides of the top of the top frame are fixedly connected with stabilizing devices. This intelligent testing terminal for electronic components achieves the purpose of facilitating the clamping and fixing of electronic components, and at the same time can adapt to electronic components of different sizes, enabling the device to adapt to a variety of electronic components, increasing the applicable range of the device, improving the stability of the device during movement, realizing intelligent detection, eliminating the need for manual detection, and reducing the burden on workers.

[0004] However, in the process of detecting electronic components by the above intelligent testing terminal for electronic components, it cannot automatically flip the electronic components to ensure that the electrodes of the electronic components are in contact with the electrodes of the detection module. Therefore, manual intervention is required, which will reduce efficiency and increase the risk of human errors. Moreover, after detection, it cannot automatically discharge unqualified electronic components from the conveying track, and manual identification and removal of unqualified electronic components are needed, which increases the labor input, and there may be misjudgment or omission in manual operation, resulting in unqualified components being mixed into qualified products and affecting product quality. Summary of the Invention

[0005] The purpose of the present invention is to provide an intelligent testing and screening device for electronic components to solve the problems proposed in the above background art, that is, in the process of detecting electronic components, it cannot automatically flip the electronic components to ensure that the electrodes of the electronic components are in contact with the electrodes of the detection module, and after detection, it cannot automatically discharge unqualified electronic components from the conveying track.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An intelligent test and screening device for electronic components, comprising: two groups of connecting plates, between which two groups of driving wheels are rotatably installed. A plurality of conveyor belts are sleeved on the outer surfaces of the two groups of driving wheels. An adsorption mechanism is fixedly installed within the spacing of the plurality of conveyor belts, so that the adsorption mechanism can be driven by the conveyor belts to convey electronic components. One end of the adsorption mechanism is connected and installed with two first air pipes, and the other ends of the two first air pipes are respectively communicated with the air nozzles of an air compressor. The air compression mechanism is fixedly installed within the mounting plate, and the mounting plate is fixedly installed at the lower surfaces of the two groups of connecting plates, so that the air compressor can extract the air within the adsorption mechanism through the first air pipes, and enable the adsorption mechanism to apply an adsorption force to the electronic components placed on its surface through the air holes opened on the outer surface;

[0008] Wherein, a detection mechanism is fixedly installed on the upper surfaces of the two groups of connecting plates, and the detection end of the detection mechanism naturally hangs down into the adsorption mechanism, so that the conveyed electronic components can slide past the lower end of the detection end of the detection mechanism, and the electrode plates of the electronic components are in contact with the pins of the detection mechanism, enabling the detection mechanism and the electronic components to form a circuit, and then enabling the detection mechanism to detect the current and other conditions in the circuit to determine whether the electronic component is normal;

[0009] Wherein, a flipping mechanism is rotatably installed in the middle of the detection mechanism, the outer surface of the flipping mechanism rotates within the adsorption mechanism, and the other end of the flipping mechanism is connected and installed with a three-way pipe, and the other end of the three-way pipe is communicated with the adsorption mechanism, so that the adsorption mechanism can extract the air within the flipping mechanism through the three-way pipe, and further enable the outer surface of the flipping mechanism to generate an adsorption force through the extraction of air, enabling the rotating flipping mechanism to adsorb the electronic components conveyed in front of it on the outer surface to flip them, so that the electrode plates on the lower surface are flipped to the upper surface or the side to be in contact with the pins of the detection mechanism;

[0010] Wherein, a first receiving plate and a second receiving plate are respectively fixedly installed at the two ends of the lower surfaces of the two groups of connecting plates. A patting mechanism is fixedly installed on the upper surface of the second receiving plate, and the patting end of the patting mechanism can rotate into the adsorption mechanism, so as to achieve patting out the unqualified electronic components adsorbed by the adsorption mechanism from the conveying track and dropping them into the second receiving plate.

[0011] Preferably, the adsorption mechanism includes a sealing plate, which is fixedly installed between two groups of connecting plates. A group of H-shaped annular belts are rotatably installed on the outer surface of each sealing plate, and each H-shaped annular belt is fixedly connected within the spacing between each group of conveyor belts. In this way, the H-shaped annular belt can be driven by the conveyor belt to slide on the outer surface of the sealing plate, and at the same time, a sealing cavity is formed between the H-shaped annular belt and the sealing plate. Air holes are provided on the outer surface of the H-shaped annular belt.

[0012] Preferably, an air extraction pipe is installed through between multiple groups of the sealing plates, so that multiple formed sealing cavities are connected to each other. The two ends of the air extraction pipe respectively penetrate out from within the connecting plates, and one end of the air extraction pipe is connected to the first air pipe, and the other end of the air extraction pipe is connected to a three-way pipe.

[0013] Preferably, a partition plate is fixedly installed between two groups of the sealing plates within the H-shaped annular belt, so that the upper half and the lower half within the H-shaped annular belt respectively form an isolation area and an air extraction area. The isolation area can avoid air being extracted by the air compressor, and the air extraction area can be extracted by the air compressor. Furthermore, an adsorption force can be generated through the air holes on the outer surface of the air extraction area of the H-shaped annular belt to adsorb the electronic components conveyed on the surface.

[0014] Preferably, the detection mechanism includes two groups of n-shaped frames. A top cover is fixedly installed between the two groups of n-shaped frames. An oscilloscope is fixedly installed on the upper surface of the top cover. Multiple enameled wires are fixedly connected to the lower surfaces of the two groups of n-shaped frames. The flexible conductive wires of the multiple enameled wires are combined into a curtain yarn shape and extend into the H-shaped annular belt. Furthermore, when the H-shaped annular belt drives the electronic components to be brushed past the lower ends of the flexible conductive wires of the enameled wires, the electrode plates of the electronic components can be in contact with the flexible conductive wires of the enameled wires, that is, the pins. The oscilloscope and the electronic components can form a circuit, and the oscilloscope can detect the current and other conditions in the circuit to determine whether the electronic component is normal.

[0015] Preferably, the flipping mechanism includes a first motor, which is fixedly installed at one end of the connecting plate. One end of the output shaft of the first motor is fixedly installed with a rotating pipe. An adsorption wheel is communicated and installed on the outer surface of the rotating pipe. The adsorption wheel rotates in the air through the rotating pipe within the H-shaped annular belt, and the adsorption wheel rotates between the two groups of n-shaped frames. The other end of the rotating pipe is rotatably communicated with the three-way pipe.

[0016] Preferably, air holes are provided on the outer surface of the adsorption wheel. The adsorption wheel is communicated with the sealing cavity inside the H-shaped annular belt through the three-way pipe. Furthermore, the air compressor can extract the air inside the adsorption wheel through the sealing cavity and the three-way pipe together. Furthermore, the adsorption wheel can suck external air through the air holes provided on the outer surface. The rotating adsorption wheel can adsorb the electronic components conveyed in front of it on the outer surface to flip them.

[0017] Preferably, after the adsorption wheel drives the electronic components adsorbed on its outer surface to flip to the other end, it can make them touch the outer surface of the arc shovel to cut off the adsorption, and then let them fall into the H-shaped belt again. The arc shovel is fixedly installed between two connecting plates, and its lower surface slides in the H-shaped belt. After the electronic components are flipped, the electrode plates on the lower surface can be flipped to the upper surface or side surface, and then be transported into another set of n-shaped frames by the H-shaped belt to be in electrical contact with the flexible conductive wires of the enameled wires.

[0018] Preferably, the flapping mechanism includes an L-shaped rod fixedly installed on the upper surface of the second receiving plate. A flapping rod is rotatably installed on the outer surface of the L-shaped rod. One end of the flapping rod is fixedly installed with a first gear, which meshes with a second gear. The second gear is fixedly connected to the output shaft of a second motor, and the second motor is fixedly installed on the upper surface of the second receiving plate. In this way, the flapping rod can be driven by the second motor to rotate and extend into the H-shaped belt to realize flapping the unqualified electronic components adsorbed by the H-shaped belt out of the conveying track and falling into the second receiving plate.

[0019] Preferably, the second motor is controlled by a controller. The signal input end of the controller is electrically connected to the electronic control end of the oscilloscope. The models of the oscilloscope and the controller are TBS1000C and Arduino Uno respectively.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. When detecting the circuit connection of electronic components through the design of an air compressor, conveyor belt, three-way pipe, first air pipe, detection mechanism, flipping mechanism, adsorption mechanism and flapping mechanism, the air compressor, flipping mechanism and drive motor of the drive wheel can be started together. The air compressor can extract the air in the adsorption mechanism through the first air pipe, and the adsorption mechanism is connected to the flipping mechanism through the three-way pipe at the other end. Thus, the air compressor can extract the air in the flipping mechanism at the same time, enabling the adsorption mechanism and the flipping mechanism to apply an adsorption force to the surface through the air holes opened on the outer surface. The flipping mechanism and the drive wheel can be driven to rotate, and the rotating drive wheel will drive the conveyor belt on the outer surface to drive the adsorption mechanism within the spacing of the conveyor belt to move together. Subsequently, the operator can pour the electronic components into the adsorption mechanism fixedly connected between the conveyor belts and transport them into the detection mechanism, making the electrode pads on the upper surface contact the pins of the detection mechanism, forming a circuit between the detection mechanism and the electronic components. Then, the detection mechanism can detect the current and other conditions in the circuit to determine whether the electronic component is normal. The electronic components entering the detection mechanism can be adsorbed on the outer surface by the rotating flipping mechanism as they are transported. The rotating flipping mechanism can adsorb the electronic components transported in front on the outer surface, flip them by 180° and then drop them onto the surface of the adsorption mechanism again, enabling the electrode pads originally on the lower surface to flip to the upper surface or side and contact the pins of the detection mechanism, greatly improving the comprehensiveness of detection and reducing the possibility of detection omission due to the position of the electrode pads. The flipped electronic components can be transported into another set of detection mechanisms by the adsorption mechanism and contact the pins for secondary detection. If the detection fails during the two detections, it will be judged as unqualified. The detection mechanism can send a signal to the controller, and the controller can calculate the time when this unqualified electronic component is transported out of the detection mechanism for the first or second time. After the electronic component is transported through the detection mechanism, it will be adsorbed on the outer surface by the air holes opened on the surface of the adsorption mechanism. Thus, when the adsorption mechanism transports this electronic component to the calculated time, it can be accurately transported in front of the flapping mechanism. The flapping mechanism is located at the lower end of the adsorption mechanism, enabling the adsorption mechanism to transport the electronic component to the lower end through the adsorption force until the calculated time is reached. Then, the controller can control the flapping mechanism to rotate together to slap this unqualified electronic component out of the adsorption range from the lower end of the adsorption mechanism, making it fall into the second receiving plate for storage. The automated discharging process eliminates the need for manual sorting of unqualified products, saving labor costs and time and improving the overall production efficiency. Subsequently, with the continuous transportation of the adsorption mechanism, the electronic components can be transported to a non-adsorbing area, i.e., the upper end of the first receiving plate, enabling the electronic components at the lower end of the adsorption mechanism to freely fall into the first receiving plate for centralized storage. Thus, the entire process of component feeding → transportation → detection → flipping → secondary detection → sorting is realized without human operation.

[0022] 2. Through the design of the H-shaped annular belt, the exhaust pipe, the sealing plate, the partition plate, the oscilloscope and the enameled wire, when the conveyor belt is driven to rotate, the H-shaped annular belt within the spacing of the conveyor belt can be driven to move on the outer surface of the sealing plate. A sealing cavity is formed between the H-shaped annular belt and the two groups of sealing plates, and a partition plate is fixedly installed between the two groups of sealing plates, so that the upper half and the lower half within the H-shaped annular belt respectively form an isolation area and an air extraction area, enabling the isolation area to avoid air extraction by the air compressor, while the air extraction area is connected to the exhaust pipe, allowing the air compressor to extract the air within the air extraction area. Furthermore, an adsorption force can be generated through the air holes on the outer surface of the air extraction area of the H-shaped annular belt to adsorb the electronic components conveyed on the surface, while no adsorption force can be generated on the outer surface of the isolation area of the H-shaped annular belt, enabling the electronic components placed on the upper surface of the H-shaped annular belt to be free from the adsorption force, allowing them to be first conveyed past the first group of n-shaped frames and the flexible conductive wires of the internal enameled wire to brush the outer surface of the electronic components, enabling the electrode plates of the electronic components to contact the flexible conductive wires of the enameled wire, enabling the oscilloscope to form a circuit with the electronic components, and thus enabling the oscilloscope to detect the current and other conditions in the circuit to determine whether the electronic component is normal. After the electronic component passes the first group of n-shaped frames, it will be continuously conveyed by the H-shaped annular belt and come into contact with the flipping mechanism. Furthermore, the flipping mechanism can adsorb the electronic component on its outer surface and flip it 180° through the adsorption force applied by the air holes on the outer surface. After driving the electronic component to rotate 180°, the electronic component can fall onto the surface of the H-shaped annular belt again, enabling the electrode plate originally on the lower surface to flip to the upper surface or the side to contact the pins through the second group of n-shaped frames for detection. After the electronic component undergoes secondary detection, it will be conveyed by the H-shaped annular belt to the air extraction area, enabling the H-shaped annular belt to adsorb the electronic component on its outer surface through the air holes opened on the surface. Subsequently, as the H-shaped annular belt continues to convey, it will be located below the H-shaped annular belt. If the electronic component is unqualified, it will be slapped out by the slapping mechanism at the lower end, while the qualified electronic components will enter the isolation area as the H-shaped annular belt continues to convey and break away from the adsorption force, enabling the electronic components at the lower end of the H-shaped annular belt to freely fall into the first receiving plate for centralized storage. By setting the isolation area and the air extraction area on the H-shaped annular belt, the air extraction area can generate an adsorption force to adsorb the electronic components, while the isolation area has no adsorption force, enabling the electronic components to be adsorbed or not affected by the adsorption force as needed at different stages during the detection process. For example, during the first detection, the electronic components on the upper surface are not affected by the adsorption force, facilitating the natural drooping of the enameled wire and avoiding adsorption skew. During subsequent conveying and flipping, the adsorption force in the air extraction area can ensure that the electronic components are operated at the appropriate positions.

[0023] 3. Through the design of the first motor, rotating pipe, adsorption wheel and arc shovel, when the air compression mechanism extracts the air inside the sealing plate and the H-shaped belt, it can extract air from the three-way pipe through the air extraction pipe at the other end of the sealing plate. The other end of the three-way pipe is connected to the rotating pipe of the adsorption wheel. Thus, the adsorption wheel can apply an adsorption force to its outer surface through the air holes opened on the outer surface. Then, the adsorption wheel can be continuously driven to rotate by the first motor. When the adsorption wheel drives the electronic component to rotate 180°, it will touch the arc shovel attached to the outer surface, enabling the arc shovel attached to the surface to scrape off the electronic component on the outer surface of the adsorption wheel, allowing the electrode sheet originally on the lower surface to flip to the upper surface or the side to contact the flexible conductive wire of the enameled wire, greatly improving the comprehensiveness of detection and reducing the possibility of detection omission caused by the position problem of the electrode sheet.

[0024] 4. Through the design of the second motor, second gear, flapping rod and first gear, after the electronic component fails the detection by the oscilloscope and is judged as unqualified, the oscilloscope can send a signal to the controller. The controller can calculate the time for this unqualified electronic component to pass through the first group of n-shaped frames or the second group of n-shaped frames. After the electronic component is conveyed through the second group of n-shaped frames, it will be adsorbed on the outer surface by the air extraction area of the H-shaped belt. Then, when the H-shaped belt conveys this electronic component to the calculated time, it can be accurately conveyed in front of the flapping rod. When the calculated time is reached, the controller can control the second motor to drive the second gear to mesh and drive the first gear to rotate, enabling the first gear to drive the flapping rod to rotate, so that the flapping rod can slap this unqualified electronic component out of the adsorption range from the lower end of the H-shaped belt, making it fall into the second receiving plate for storage. Ensuring that the unqualified electronic component is accurately conveyed in front of the flapping rod according to the calculated time, this precise positioning process avoids the situation of mis-slapping qualified components or missing unqualified components, and realizes automated operation, improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is the overall structural schematic diagram of the intelligent test and screening device for electronic components of the present invention;

[0026] Figure 2 is the structural schematic diagram of the first receiving plate and the second receiving plate of the present invention;

[0027] Figure 3 is the structural schematic diagram of the driving wheel and the conveyor belt of the present invention;

[0028] Figure 4 is the structural schematic diagram of the H-shaped belt sliding on the outer surface of the sealing plate of the present invention;

[0029] Figure 5 is the structural schematic diagram of the isolation area and the air extraction area of the present invention;

[0030] Figure 6 The structural schematic diagram of the detection mechanism of the present invention;

[0031] Figure 7 The structural schematic diagram of the enameled wire of the present invention extending into the H-shaped ring belt;

[0032] Figure 8 The structural schematic diagram of the flipping mechanism of the present invention;

[0033] Figure 9 The structural schematic diagram of the flapping mechanism of the present invention.

[0034] In the figure: 1, connecting plate; 101, mounting plate; 102, air compressor; 103, three-way pipe; 104, first receiving plate; 105, second receiving plate; 106, conveyor belt; 107, first air pipe; 108, driving wheel; 2, detection mechanism; 201, n-shaped frame; 202, top cover; 203, oscilloscope; 204, enameled wire; 3, flipping mechanism; 301, first motor; 302, rotating pipe; 303, adsorption wheel; 304, arc shovel; 4, adsorption mechanism; 401, H-shaped ring belt; 402, extraction pipe; 403, sealing plate; 404, partition plate; 405, isolation area; 406, extraction area; 5, flapping mechanism; 501, L-shaped rod; 502, second motor; 503, second gear; 504, flapping rod; 505, first gear. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Such as Figures 1 - 3As shown in the figure, this embodiment provides an intelligent test and screening device for electronic components, including: two groups of connecting plates 1. Between the two groups of connecting plates 1, two groups of driving wheels 108 are rotatably installed. On the outer surfaces of the two groups of driving wheels 108, multiple groups of conveyor belts 106 are sleeved. Inside the spacing of the multiple groups of conveyor belts 106, an adsorption mechanism 4 is fixedly installed, so that the adsorption mechanism 4 can be driven by the conveyor belt 106 to convey electronic components. One end of the adsorption mechanism 4 is connected and installed with two groups of first air pipes 107, and the other ends of the two groups of first air pipes 107 are respectively communicated with the air nozzles of an air compressor 102. The air compression mechanism 102 is fixedly installed inside a mounting plate 101, and the mounting plate 101 is fixedly installed on the lower surfaces of the two groups of connecting plates 1, so that the air compressor 102 can extract the air inside the adsorption mechanism 4 through the first air pipe 107, and the adsorption mechanism 4 can apply an adsorption force to the electronic components placed on its surface through the air holes opened on the outer surface;

[0037] Among them, a detection mechanism 2 is fixedly installed on the upper surfaces of the two groups of connecting plates 1, and the detection end of the detection mechanism 2 naturally hangs down into the adsorption mechanism 4, so that the conveyed electronic components can slide past the lower end of the detection end of the detection mechanism 2, and the electrode plates of the electronic components are in contact with the pins of the detection mechanism 2, so that the detection mechanism 2 forms a circuit with the electronic components, and the detection mechanism 2 can detect the current and other conditions in the circuit to judge whether the electronic component is normal;

[0038] Among them, a flipping mechanism 3 is rotatably installed in the middle of the detection mechanism 2. The outer surface of the flipping mechanism 3 rotates inside the adsorption mechanism 4. The other end of the flipping mechanism 3 is connected and installed with a three-way pipe 103, and the other end of the three-way pipe 103 is communicated with the adsorption mechanism 4, so that the adsorption mechanism 4 can extract the air inside the flipping mechanism 3 through the three-way pipe 103, and further the outer surface of the flipping mechanism 3 can generate an adsorption force through the extraction of air, and the rotating flipping mechanism 3 can adsorb the conveyed electronic components on the outer surface to flip them, so that the electrode plates on the lower surface are flipped to the upper surface or the side to be in contact with the pins of the detection mechanism 2;

[0039] Among them, at both ends of the lower surfaces of the two groups of connecting plates 1, a first receiving plate 104 and a second receiving plate 105 are respectively fixedly installed. On the upper surface of the second receiving plate 105, a flapping mechanism 5 is fixedly installed. The flapping end of the flapping mechanism 5 can rotate into the adsorption mechanism 4, so as to realize slapping out the unqualified electronic components adsorbed by the adsorption mechanism 4 from the conveying track and dropping them into the second receiving plate 105.

[0040] Through the design of the air compressor 102, conveyor belt 106, three-way pipe 103, first air pipe 107, detection mechanism 2, flipping mechanism 3, adsorption mechanism 4 and flapping mechanism 5, when detecting the circuit connection of electronic components, the air compressor 102, flipping mechanism 3 and the drive motor of the drive wheel 108 can be started together. The air compressor 102 can extract the air in the adsorption mechanism 4 through the first air pipe 107, and the adsorption mechanism 4 is connected to the flipping mechanism 3 through the three-way pipe 103 at the other end. Thus, the air compressor 102 can extract the air in the flipping mechanism 3 together, enabling the adsorption mechanism 4 and the flipping mechanism 3 to apply an adsorption force to the surface through the air holes opened on the outer surface. The flipping mechanism 3 and the drive wheel 108 can be driven to rotate, and the rotating drive wheel 108 will drive the conveyor belt 106 on the outer surface to drive the adsorption mechanism 4 within the spacing of the conveyor belt 106 to move together. Subsequently, the staff can pour the electronic components into the adsorption mechanism 4 fixedly connected between the conveyor belts 106 and be transported into the detection mechanism 2, making the electrode plates on the upper surface contact the pins of the detection mechanism 2, forming a circuit between the detection mechanism 2 and the electronic components. Then, the detection mechanism 2 can detect the current and other conditions in the circuit to determine whether the electronic component is normal. The electronic components entering the detection mechanism 2 can be adsorbed on the outer surface by the rotating flipping mechanism 3 during transportation. The rotating flipping mechanism 3 can adsorb the electronic components transported in front on the outer surface, flip them by 180°, and then drop them onto the surface of the adsorption mechanism 4 again, enabling the electrode plates originally on the lower surface to flip to the upper surface or side and contact the pins of the detection mechanism 2, greatly improving the comprehensiveness of detection and reducing the possibility of detection omission due to the position of the electrode plates. The flipped electronic components can be transported into another set of detection mechanisms 2 by the adsorption mechanism 4 again to contact the pins for secondary detection. During the two detection processes, if the detection fails, it is judged as unqualified. The detection mechanism 2 can send a signal to the controller, and the controller can calculate the time when this unqualified electronic component is transported out of the detection mechanism 2 for the first or second time. After the electronic component is transported through the detection mechanism 2, it will be adsorbed on the outer surface by the air holes opened on the surface of the adsorption mechanism 4. Thus, when the adsorption mechanism 4 transports this electronic component to the calculated time, it can be accurately transported to the front of the flapping mechanism 5. The flapping mechanism 5 is located at the lower end of the adsorption mechanism 4, enabling the adsorption mechanism 4 to transport the electronic component to the lower end through the adsorption force until the calculated time is reached. Then, the controller can control the flapping mechanism 5 to rotate together to slap this unqualified electronic component out of the adsorption range from the lower end of the adsorption mechanism 4, making it fall into the second receiving plate 105 for storage. The automated discharging process eliminates the need for manual sorting of unqualified products, saving labor costs and time and improving the overall production efficiency. Subsequently, with the continuous transportation of the adsorption mechanism 4, the electronic components can be transported to the non-adsorbing area, i.e., the upper end of the first receiving plate 104.The electronic components at the lower end of the adsorption mechanism 4 can freely fall into the first receiving plate 104 for centralized storage, thus realizing the fully automated operation of the entire process of component feeding → conveying → detecting → flipping → secondary detecting → sorting.

[0041] As Figures 4 - 6 shown, the adsorption mechanism 4 includes a sealing plate 403, which is fixedly installed between two groups of connecting plates 1. And a group of H-shaped belts 401 are rotatably installed on the outer surface of each sealing plate 403. Each group of H-shaped belts 401 is fixedly connected within the spacing between each group of conveyor belts 106, so that the H-shaped belts 401 can be driven by the conveyor belts 106 to slide on the outer surface of the sealing plate 403. At the same time, a sealing cavity is formed between the H-shaped belts 401 and the sealing plate 403. Air holes are formed on the outer surface of the H-shaped belts 401.

[0042] Among them, an air extraction pipe 402 is installed through between multiple groups of sealing plates 403, so that the multiple formed sealing cavities are connected to each other. The two ends of the air extraction pipe 402 respectively penetrate out of the connecting plate 1, and one end of the air extraction pipe 402 is connected to the first air pipe 107, and the other end of the air extraction pipe 402 is connected to the three-way pipe 103.

[0043] Among them, a partition plate 404 is fixedly installed between two groups of sealing plates 403 within the H-shaped belt 401, so that the upper half and the lower half within the H-shaped belt 401 respectively form an isolation area 405 and an air extraction area 406. The isolation area 405 can avoid being extracted of air by the air compressor 102, and the air extraction area 406 can be extracted of air by the air compressor 102. Furthermore, an adsorption force can be generated through the air holes on the outer surface of the air extraction area 406 of the H-shaped belt 401 to adsorb the electronic components conveyed on the surface.

[0044] Among them, in order to ensure that the adsorption force of the adsorption mechanism 4 is always greater than the gravity of the electronic components and does not exceed the limit, this embodiment introduces an adaptive adsorption force equation:

[0045]

[0046] Parameter description:

[0047] K is the air hole structure coefficient (determined by the air hole distribution of the H-shaped belt);

[0048] ΔP is the pressure difference inside and outside the sealing cavity;

[0049] Aeff is the effective adsorption area (the total area of the air holes in contact with the electronic components);

[0050] t is the adsorption time;

[0051] τ is the pressure response time constant (related to the air extraction rate of the air compressor);

[0052] β is the conveyor belt speed decay factor;

[0053] Vbelt is the linear speed of the conveyor belt;

[0054] Fads is the adsorption force.

[0055] This equation combines the transient adsorption effect and the dynamic conveying speed, describes the progressive process of negative pressure establishment through the exponential term, and the quadratic term reflects the attenuation characteristics of the adsorption force under high-speed conveying. Example: When the electronic component enters the air extraction area, t = 0, the adsorption force exponentially increases with time to the steady-state value; if the conveying speed is too fast (Vbelt increases), the adsorption force decreases to prevent the component from detaching due to inertia. This equation optimizes the matching of adsorption parameters and reduces problems such as missed adsorption or over-adsorption. The adsorption force is optimized by adjusting the power of the air compressor (changing ΔP) and the conveyor belt speed (Vbelt) to make Fads always greater than the gravity of the electronic component and not exceed the limit.

[0056] Among them, the detection mechanism 2 includes two groups of n-shaped frames 201. A top cover 202 is fixedly installed between the two groups of n-shaped frames 201. An oscilloscope 203 is fixedly installed on the upper surface of the top cover 202. A plurality of enameled wires 204 are fixedly connected to the lower surfaces of the two groups of n-shaped frames 201. The flexible conductive wires of the plurality of enameled wires 204 are combined into a curtain-like shape and extend into the H-shaped ring belt 401. Then, when the H-shaped ring belt 401 drives the electronic component to be brushed past the lower ends of the flexible conductive wires of the enameled wires 204, the electrode pads of the electronic component can be in contact with the flexible conductive wires of the enameled wires 204, that is, the pins, so that the oscilloscope 203 and the electronic component can form a circuit, and the oscilloscope 203 can detect the current and other conditions in the circuit to determine whether the electronic component is normal.

[0057] Through the design of the H-shaped annular belt 401, the extraction pipe 402, the sealing plate 403, the partition plate 404, the oscilloscope 203 and the enameled wire 204, when the conveyor belt 106 is driven to rotate, the H-shaped annular belt 401 within the spacing of the conveyor belt 106 can be driven to move on the outer surface of the sealing plate 403. A sealing cavity is formed between the H-shaped annular belt 401 and the two groups of sealing plates 403, and a partition plate 404 is fixedly installed between the two groups of sealing plates 403, so that the upper half and the lower half within the H-shaped annular belt 401 respectively form an isolation area 405 and an air extraction area 406, enabling the isolation area 405 to avoid having air extracted by the air compressor 102, while the air extraction area 406 is connected to the extraction pipe 402, allowing the air compressor 102 to extract the air within the air extraction area 406. Furthermore, an adsorption force can be generated through the air holes on the outer surface of the air extraction area 406 of the H-shaped annular belt 401 to adsorb the electronic components conveyed on the surface, while no adsorption force can be generated on the outer surface of the isolation area 405 of the H-shaped annular belt 401, enabling the electronic components placed on the upper surface of the H-shaped annular belt 401 to be free from the adsorption force, allowing them to be first conveyed past the first group of n-shaped frames 201 and brushed by the flexible conductive wires of the enameled wire 204 on the outer surface of the electronic components, enabling the electrode plates of the electronic components to contact the flexible conductive wires of the enameled wire 204, enabling the oscilloscope 203 to form a circuit with the electronic components, and thus enabling the oscilloscope 203 to detect the current and other conditions in the circuit to determine whether the electronic component is normal. After the electronic component passes through the first group of n-shaped frames 201, it will be continuously conveyed by the H-shaped annular belt 401 and come into contact with the flipping mechanism 3. Furthermore, the flipping mechanism 3 can adsorb the electronic component on its outer surface through the adsorption force applied by the air holes on the outer surface and flip it by 180°. After driving the electronic component to rotate by 180°, the electronic component can be made to fall onto the surface of the H-shaped annular belt 401 again, enabling the original electrode plate on the lower surface to be flipped to the upper surface or the side to be detected by contacting the pins through the second group of n-shaped frames 201. After the electronic component undergoes secondary detection, it will be conveyed by the H-shaped annular belt 401 to the air extraction area 406, enabling the H-shaped annular belt 401 to adsorb the electronic component on its outer surface through the air holes opened on the surface. Subsequently, as the H-shaped annular belt 401 continues to convey, it will be located below the H-shaped annular belt 401. If the electronic component is unqualified, it will be slapped out by the slapping mechanism 5 at the lower end, while the qualified electronic components will enter the isolation area 405 along with the continuous conveyance of the H-shaped annular belt 401 to be released from the adsorption force, enabling the electronic components at the lower end of the H-shaped annular belt 401 to freely fall into the first receiving plate 104 for centralized storage. By setting the isolation area 405 and the air extraction area 406 on the H-shaped annular belt 401, the air extraction area 406 can generate an adsorption force to adsorb the electronic components, while the isolation area 405 has no adsorption force, enabling the electronic components to be adsorbed or not affected by the adsorption force as needed at different stages during the detection process. For example, during the first detection, the electronic components on the upper surface are not affected by the adsorption force, facilitating the natural drooping of the enameled wire 204 and avoiding being adsorbed and deflected. During subsequent conveyance and flipping,The adsorption force in the air extraction area 406 can ensure that the electronic components are operated in the appropriate positions.

[0058] As Figures 7 - 8 shown, the flipping mechanism 3 includes a first motor 301 fixedly installed at one end of the connecting plate 1. One end of the output shaft of the first motor 301 is fixedly installed with a rotating pipe 302. An adsorption wheel 303 is communicated and installed on the outer surface of the rotating pipe 302. The adsorption wheel 303 rotates in the H-shaped belt 401 through the rotating pipe 302 in a suspended manner, and the adsorption wheel 303 rotates between two groups of n-shaped frames 201. The other end of the rotating pipe 302 is rotationally communicated with a three-way pipe 103.

[0059] Among them, air holes are provided on the outer surface of the adsorption wheel 303. The adsorption wheel 303 is communicated with the sealed cavity inside the H-shaped belt 401 through the three-way pipe 103. Furthermore, the air compressor 102 can extract the air inside the adsorption wheel 303 together with the sealed cavity and the three-way pipe 103. Furthermore, the adsorption wheel 303 can suck the external air through the air holes provided on the outer surface, and the rotating adsorption wheel 303 can adsorb the electronic components delivered in front of it on the outer surface to flip them.

[0060] Among them, after the adsorption wheel 303 drives the electronic components adsorbed on the outer surface to flip to the other end, it can make them touch the outer surface of the arc shovel 304 to cut off the adsorption, and then make them fall into the H-shaped belt 401 again. The arc shovel 304 is fixedly installed between two groups of connecting plates 1 and the lower surface is slidably attached to the inside of the H-shaped belt 401. After the electronic components are flipped, the electrode plates on the lower surface can be flipped to the upper surface or the side and be transported into another group of n-shaped frames 201 by the H-shaped belt 401 to be in electrical contact with the flexible conductive wires of the enameled wires 204.

[0061] Through the design of the first motor 301, the rotating pipe 302, the adsorption wheel 303 and the arc shovel 304, when the air compression mechanism 102 extracts the air inside the sealing plate 403 and the H-shaped belt 401, it can extract the air from the three-way pipe 103 through the air extraction pipe 402 at the other end of the sealing plate 403. The other end of the three-way pipe 103 is communicated with the rotating pipe 302 of the adsorption wheel 303. Furthermore, the adsorption wheel 303 can apply an adsorption force to the outer surface through the air holes provided on the outer surface. Furthermore, the adsorption wheel 303 can be continuously driven to rotate by the first motor 301. When the adsorption wheel 303 drives the electronic components to rotate 180°, it will touch the arc shovel 304 attached to the outer surface. The arc shovel 304 attached to the surface can scrape off the electronic components on the outer surface of the adsorption wheel 303, and make the electrode plates originally on the lower surface flip to the upper surface or the side to be in contact with the flexible conductive wires of the enameled wires 204, greatly improving the comprehensiveness of detection and reducing the possibility of detection omission due to the position problem of the electrode plates.

[0062] In order to enable the flipping mechanism 3 to work stably and accurately, the flipping critical angular velocity equation is introduced:

[0063]

[0064] Parameter description

[0065] μ: Friction coefficient between the adsorption wheel and the electronic component;

[0066] r: Radius of the adsorption wheel;

[0067] m: Mass of the electronic component;

[0068] d: Distance between the centroid of the component and the adsorption point;

[0069] Fads: Adsorption force;

[0070] ωc: Flipping critical angular velocity.

[0071] Define the minimum angular velocity ωc of the adsorption wheel to ensure that the electronic component is stably attached during the flipping process due to the balance of centrifugal force and adsorption force. Example: If the centroid of the component is offset (d > 0), it is necessary to increase ωc to avoid slipping. This equation guides the speed setting of the first motor to ensure the success rate of 180° flipping.

[0072] As Figure 9 shown, the flapping mechanism 5 includes an L-shaped rod 501. The L-shaped rod 501 is fixedly installed on the upper surface of the second receiving plate 105. A flapping rod 504 is rotatably installed on the outer surface of the L-shaped rod 501. One end of the flapping rod 504 is fixedly installed with a first gear 505. The first gear 505 meshes with a second gear 503. The second gear 503 is fixedly connected to the output shaft of a second motor 502. The second motor 502 is fixedly installed on the upper surface of the second receiving plate 105, so that the flapping rod 504 can be driven by the second motor 502 to rotate and extend into the H-shaped ring belt 401 to realize slapping the unqualified electronic components adsorbed by the H-shaped ring belt 401 out of the conveying track and dropping into the second receiving plate 105. The second motor 502 is controlled by a controller. The signal input end of the controller is electrically connected to the electronic control end of the oscilloscope 203. The models of the oscilloscope 203 and the controller are TBS1000C and Arduino Uno respectively.

[0073] Through the design of the second motor 502, the second gear 503, the flapping rod 504 and the first gear 505, after the electronic component fails the detection by the oscilloscope 203 and is judged as unqualified, the oscilloscope 203 can send a signal to the controller, and the controller can calculate the time for this unqualified electronic component to pass through the first group of n-shaped frames 201 or the second group of n-shaped frames 201. And after the electronic component is conveyed through the second group of n-shaped frames 201, it will be adsorbed on the outer surface by the air extraction area 406 of the H-shaped annular belt 401. Furthermore, the H-shaped annular belt 401 can convey this electronic component to the front of the flapping rod 504 accurately after reaching the calculated time. And after reaching the calculated time, the controller can control the second motor 502 to drive the second gear 503 to mesh and drive the first gear 505 to rotate together, and then the first gear 505 can drive the flapping rod 504 to rotate, so that the flapping rod 504 can slap this unqualified electronic component out of the adsorption range from the lower end of the H-shaped annular belt 401, making it fall into the second receiving plate 105 for storage. According to the calculated time, it is ensured that the unqualified electronic component is accurately conveyed to the front of the flapping rod 504. This precise positioning process avoids the situation of mis-slapping qualified components or missing unqualified components, and realizes automated operation, improving production efficiency.

[0074] In order to make the flapping mechanism 5 work accurately, the flapping timing dynamic equation is introduced in this embodiment:

[0075]

[0076] Parameter description

[0077] L: The path length from the detection point to the flapping point;

[0078] θlag: The phase lag angle of the flapping rod;

[0079] Tmotor: The period of the second motor;

[0080] Δtsensor: The signal delay of the controller;

[0081] This equation can accurately calculate the moment when the unqualified component reaches the flapping point, combine the conveying speed and the motor movement phase, and compensate for the signal delay. Example: When Vbelt = 0.5 m / s and L = 0.3 m, then t strike = 0.6 s, synchronously adjust θlag to trigger the flapping rod on time, with an error < 1 ms, to avoid mis-slapping qualified components.

[0082] Summarize and sort out the working steps of this solution according to the above technical solution: When detecting the circuit connection of electronic components, the air compressor 102, the first motor 301 and the drive motor of the transmission wheel 108 can be started together. The air compressor 102 can extract the air inside the sealing plate 403 and the H-shaped belt 401 through the first air pipe 107. A partition plate 404 is fixedly installed between the two sealing plates 403, so that the upper half and the lower half inside the H-shaped belt 401 form an isolation area 405 and an air extraction area 406 respectively, enabling the isolation area 405 to avoid air extraction by the air compressor 102, while the air extraction area 406 is connected to the air extraction pipe 402, allowing the air compressor 102 to extract the air inside the air extraction area 406. Thus, an adsorption force can be generated through the air holes on the outer surface of the air extraction area 406 of the H-shaped belt 401 to adsorb the electronic components transported on the surface, while no adsorption force can be generated on the outer surface of the isolation area 405 of the H-shaped belt 401, enabling the electronic components placed on the upper surface of the H-shaped belt 401 to be free from the adsorption force. The sealing plate 403 is connected to the three-way pipe 103 through the air extraction pipe 402 at the other end, and the other end of the three-way pipe 103 is connected to the rotating pipe 302 of the adsorption wheel 303. Therefore, the adsorption wheel 303 can apply an adsorption force to the outer surface through the air holes opened on the outer surface. Subsequently, the staff can pour the electronic components into the H-shaped belt 401 fixedly connected between the conveyor belts 106. First, it is transported into the first group of n-shaped frames 201, and the flexible conductive wires of the enameled wires 204 inside brush the outer surface of the electronic components, enabling the electrode plates of the electronic components to contact the flexible conductive wires of the enameled wires 204, forming a circuit between the oscilloscope 203 and the electronic components. Thus, the oscilloscope 203 can detect the current and other conditions in the circuit to determine whether the electronic component is normal. After passing through the first group of n-shaped frames 201, the electronic components will be continuously transported by the H-shaped belt 401 and come into contact with the adsorption wheel 303. Therefore, the adsorption wheel 303 can adsorb the electronic components on the outer surface through the air holes opened on the outer surface. Then, the adsorption wheel 303 is continuously driven to rotate by the first motor 301. When the adsorption wheel 303 drives the electronic components to rotate 180°, it will touch the arc shovel 304 attached to the outer surface, enabling the arc shovel 304 attached to the surface to scrape the electronic components on the outer surface of the adsorption wheel 303, allowing the electrode plates originally on the lower surface to flip to the upper surface or the side, and then be detected by the oscilloscope 203 through contact with the pins by the second group of n-shaped frames 201. If the detection fails during the two detection processes, it is judged as unqualified. The oscilloscope 203 can send a signal to the controller, and the controller can calculate the time when this unqualified electronic component passes through the first group of n-shaped frames 201 or the second group of n-shaped frames 201. After the electronic components are transported past the second group of n-shaped frames 201, they will be adsorbed on the outer surface by the air extraction area 406 of the H-shaped belt 401. Therefore, after the H-shaped belt 401 transports this electronic component for the calculated time, it can be accurately transported in front of the flapping rod 504. And after reaching the calculated time,The controller can control the second motor 502 to drive the second gear 503 to mesh and drive the first gear 505 to rotate. Further, the first gear 505 can drive the flapping rod 504 to rotate, so that the flapping rod 504 can slap the unqualified electronic component out of the adsorption range from the lower end of the H-shaped annular belt 401, making it fall into the second receiving plate 105 for storage. The qualified electronic components will enter the isolation area 405 to break away from the adsorption force as the H-shaped annular belt 401 continues to convey, and the electronic components at the lower end of the H-shaped annular belt 401 can freely fall into the first receiving plate 104 for centralized storage.

[0083] In summary, during the process of detecting electronic components, the intelligent test and screening device for electronic components can automatically flip the electronic components, making the electrode plate originally on the lower surface flip to the upper surface or the side to contact the flexible conductive wire of the enameled wire 204, greatly improving the comprehensiveness of detection, reducing the possibility of detection omission caused by the position problem of the electrode plate, and automatically discharging and centrally storing the unqualified electronic components when detected.

[0084] Parts not involved in the present invention are the same as or can be implemented using the prior art. Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent test and screening device for electronic components, characterized in that, Including: two sets of connecting plates (1), between which two sets of driving wheels (108) are rotatably installed. On the outer surfaces of the two sets of driving wheels (108), multiple sets of conveyor belts (106) are sleeved. Inside the spacing of the multiple sets of conveyor belts (106), an adsorption mechanism (4) is fixedly installed, so that the adsorption mechanism (4) can be driven by the conveyor belt (106) to convey electronic components. One end of the adsorption mechanism (4) is connected and installed with two sets of first air pipes (107), and the other ends of the two sets of first air pipes (107) are respectively communicated with the air nozzles of an air compressor (102). The air compression mechanism (102) is fixedly installed inside a mounting plate (101), and the mounting plate (101) is fixedly installed at the lower surface of the two sets of connecting plates (1), so that the air compressor (102) can extract the air inside the adsorption mechanism (4) through the first air pipe (107), and the adsorption mechanism (4) can apply an adsorption force to the electronic components placed on the surface through the air holes opened on the outer surface.

2. An intelligent test and screening device for electronic components according to claim 1, characterized in that: On the upper surfaces of the two sets of connecting plates (1), a detection mechanism (2) is fixedly installed, and the detection end of the detection mechanism (2) naturally hangs down into the adsorption mechanism (4), so that the conveyed electronic components can slide past the lower end of the detection end of the detection mechanism (2), and the electrode plates of the electronic components contact the pins of the detection mechanism (2), so that the detection mechanism (2) and the electronic components form a circuit, and the detection mechanism (2) can detect the current situation in the circuit to judge whether the electronic component is normal. A flipping mechanism (3) is rotatably installed in the middle of the detection mechanism (2). The outer surface of the flipping mechanism (3) rotates inside the adsorption mechanism (4). The other end of the flipping mechanism (3) is connected and installed with a three-way pipe (103), and the other end of the three-way pipe (103) is communicated with the adsorption mechanism (4), so that the adsorption mechanism (4) can extract the air inside the flipping mechanism (3) through the three-way pipe (103), and further the outer surface of the flipping mechanism (3) can generate an adsorption force through the extraction of air, and the rotating flipping mechanism (3) can adsorb the electronic components conveyed in front on the outer surface to flip them, so that the electrode plates on the lower surface are flipped to the upper surface or the side to contact the pins of the detection mechanism (2). At the two ends of the lower surface of the two sets of connecting plates (1), a first receiving plate (104) and a second receiving plate (105) are respectively fixedly installed. On the upper surface of the second receiving plate (105), a patting mechanism (5) is fixedly installed. The patting end of the patting mechanism (5) can rotate into the adsorption mechanism (4) to realize patting out the unqualified electronic components adsorbed by the adsorption mechanism (4) from the conveying track and dropping them into the second receiving plate (105).

3. An intelligent test and screening device for electronic components according to claim 2, characterized in that: The adsorption mechanism (4) includes a sealing plate (403). The sealing plate (403) is fixedly installed between two groups of connecting plates (1). A group of H-shaped belts (401) are rotatably installed on the outer surface of each sealing plate (403). Each group of H-shaped belts (401) is fixedly connected within the spacing between each group of conveyor belts (106), so that the H-shaped belts (401) can be driven by the conveyor belts (106) to slide on the outer surface of the sealing plate (403). At the same time, a sealing cavity is formed between the H-shaped belts (401) and the sealing plate (403). Air holes are formed on the outer surface of the H-shaped belts (401). A suction pipe (402) is installed through between multiple groups of the sealing plates (403), so that the multiple formed sealing cavities are connected to each other. The two ends of the suction pipe (402) respectively penetrate out from within the connecting plates (1). One end of the suction pipe (402) is connected to the first air pipe (107), and the other end of the suction pipe (402) is connected to the three-way pipe (103).

4. An intelligent test and screening device for electronic components according to claim 3, characterized in that: A partition plate (404) is fixedly installed between the two groups of sealing plates (403) within the H-shaped belts (401), so that an isolation area (405) and a suction area (406) are respectively formed in the upper half and the lower half within the H-shaped belts (401). The isolation area (405) can avoid having air extracted by the air compressor (102), and the suction area (406) can have air extracted by the air compressor (102). Furthermore, the outer surface of the suction area (406) of the H-shaped belts (401) can generate an adsorption force through the air holes to adsorb the electronic components conveyed on the surface.

5. An intelligent test and screening device for electronic components according to claim 4, characterized in that: The detection mechanism (2) includes two groups of n-shaped frames (201). A top cover (202) is fixedly installed between the two groups of n-shaped frames (201). An oscilloscope (203) is fixedly installed on the upper surface of the top cover (202). Multiple enameled wires (204) are fixedly connected to the lower surfaces of the two groups of n-shaped frames (201). The flexible conductive wires of the multiple enameled wires (204) are combined into a curtain-like shape and extend into the H-shaped belts (401). Furthermore, when the H-shaped belts (401) drive the electronic components to be brushed past the lower ends of the flexible conductive wires of the enameled wires (204), the electrode plates of the electronic components can be in contact with the flexible conductive wires of the enameled wires (204), that is, the pins. The oscilloscope (203) can form a circuit with the electronic components, and the oscilloscope (203) can detect the current situation in the circuit to determine whether the electronic component is normal.

6. The intelligent test and screening device for electronic components according to claim 5, wherein: The flipping mechanism (3) includes a first motor (301). The first motor (301) is fixedly installed at one end of the connecting plate (1). One end of the output shaft of the first motor (301) is fixedly installed with a rotating pipe (302). An adsorption wheel (303) is communicated and installed on the outer surface of the rotating pipe (302). The adsorption wheel (303) rotates in the H-shaped belt (401) through the rotating pipe (302) in a suspended manner, and the adsorption wheel (303) rotates between two n-shaped frames (201). The other end of the rotating pipe (302) is rotatably communicated with a three-way pipe (103).

7. An intelligent test and screening device for electronic components according to claim 6, characterized in that: Air holes are formed on the outer surface of the adsorption wheel (303). The adsorption wheel (303) is communicated with the sealed cavity inside the H-shaped belt (401) through the three-way pipe (103). Thus, the air compressor (102) can extract the air inside the adsorption wheel (303) through the sealed cavity and the three-way pipe (103). Then, the adsorption wheel (303) can suck external air through the air holes formed on its outer surface. The rotating adsorption wheel (303) can adsorb the electronic components conveyed in front of it on its outer surface and flip them.

8. An intelligent test and screening device for electronic components according to claim 7, characterized in that: After the adsorption wheel (303) drives the electronic components adsorbed on its outer surface to flip to the other end, the electronic components can touch the outer surface of the arc-shaped shovel (304) and be cut off from adsorption, and then fall into the H-shaped belt (401) again. The arc-shaped shovel (304) is fixedly installed between two connecting plates (1), and its lower surface is slidably attached to the inside of the H-shaped belt (401). After the electronic components are flipped, the electrode plates on the lower surface can be flipped to the upper surface or the side surface and be conveyed into another n-shaped frame (201) by the H-shaped belt (401) to be in electrical contact with the flexible conductive wires of the enameled wire (204).

9. An intelligent test and screening device for electronic components according to claim 1, characterized in that: The beating mechanism (5) includes an L-shaped rod (501). The L-shaped rod (501) is fixedly installed on the upper surface of the second receiving plate (105). A beating rod (504) is rotatably installed on the outer surface of the L-shaped rod (501). One end of the beating rod (504) is fixedly installed with a first gear (505). The first gear (505) meshes with a second gear (503). The second gear (503) is fixedly connected to the output shaft of a second motor (502). The second motor (502) is fixedly installed on the upper surface of the second receiving plate (105). In this way, the beating rod (504) can be driven by the second motor (502) to rotate and extend into the H-shaped belt (401) to beat out the unqualified electronic components adsorbed by the H-shaped belt (401) from the conveying track and fall into the second receiving plate (105).

10. An intelligent test and screening device for electronic components according to claim 9, characterized in that: The second motor (502) is controlled by a controller. The signal input end of the controller is electrically connected to the electronic control end of the oscilloscope (203).

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