Novel vacuum evaporator

Abstract

The invention provides a novel vacuum evaporator which comprises a vacuumizing system, a carrier rotating system, a light-operated integrated system, a crystal oscillation system, a heating system, a water cooling system and an evaporation system, and the light-operated integrated system and the crystal oscillation system are arranged in a hollow cavity of a first rotating mechanism, so that cooperative work of rotary coating and real-time detection is realized; a detection light path is shortened, and the signal-to-noise ratio is improved; rotation axis detection ensures data representativeness; the top radiation heating and the side wall conduction heating have a synergistic effect, so that the surface temperature difference of the substrate is smaller than + / -1.5 DEG C, the cooling efficiency of the evaporation system is improved by 40% through the water cooling system, the equipment is highly integrated through the modular architecture design, and the space is saved by 30% through the coaxial design of the carrier rotating system and the detection system; a rotating system, a heating system and a detecting system are cooperatively controlled, a dynamic compensation algorithm automatically adjusts the evaporation rate and the carrier rotating speed by comparing light control data with crystal oscillator data in real time, the film thickness control precision is + / -2 nm, and the refractive index deviation is smaller than 0.5%.

Description

Technical Field

[0001] The present invention relates to the technical field of vacuum evaporation coating machines, and more specifically, to a novel vacuum evaporation coating machine. Background Art

[0002] With the rapid development of fields such as optoelectronic display, semiconductor packaging, and optical coating, higher technical requirements are put forward for vacuum evaporation coating equipment. The following technical pain points generally exist in traditional vacuum evaporation coating machines:

[0003] 1) The film layer uniformity is limited by the static carrier structure, and it is difficult to achieve three-dimensional coating;

[0004] 2) There is a lack of real-time monitoring means during the coating process, and the film thickness and optical parameters need to be detected in the subsequent process to be confirmed;

[0005] 3) The uneven distribution of the substrate temperature field leads to differences in the density of film material adhesion;

[0006] 4) The loose structure layout of the equipment makes it difficult to maintain vacuum;

[0007] 5) The high-temperature radiation of the evaporation source affects the stability of the equipment.

[0008] Although the rotating carrier adopted in the prior art such as CN112626486B improves the uniformity, the separate setting of the rotating mechanism and the detection system results in a large equipment volume, and the vibration generated by rotation will affect the detection accuracy.

[0009] Therefore, there is an urgent need to develop a highly integrated vacuum evaporation coating equipment that integrates dynamic coating, on-line detection, and precise temperature control. Summary of the Invention

[0010] In view of this, to solve the above problems, the present invention provides a novel vacuum evaporation coater, which includes a vacuum pumping system 300, a carrier rotation system 100, a light control integration system 261, a crystal oscillator system 230, a heating system, a water cooling system 500, and an evaporation coating system. By placing the light control integration system 261 and the crystal oscillator system 230 inside the hollow cavity of the first rotating mechanism 101, the collaborative operation of rotating coating and real-time detection is achieved, shortening the detection optical path by 20 - 30% and improving the signal-to-noise ratio; the rotation axis detection ensures the representativeness of data; the combined action of top radiation heating 400 and sidewall conduction heating makes the temperature difference on the substrate surface < ±1.5°C, and combined with the rotation of the carrier, a gradient temperature field is formed, promoting the directional arrangement of film material molecules and increasing the film layer density by 15 - 20%. The water cooling system 500 adopts an annular manifold design, and the flow channel layout is optimized through computational fluid dynamics, increasing the cooling efficiency of the evaporation coating system by 40%. In cooperation with the molecular pump group of the vacuum pumping system 300, the temperature rise during continuous 8-hour evaporation coating is < 3°C. The modular architecture design enables high integration of the equipment, and the coaxial design of the carrier rotation system 100 and the detection system saves 30% of the space; the collaborative control of the rotation-heating-detection three systems makes the process repeatability error < 0.8%. The dynamic compensation algorithm automatically adjusts the evaporation coating rate and the carrier rotation speed by comparing the light control data and the crystal oscillator data in real time, achieving a film thickness control accuracy of ±2 nm and a refractive index deviation < 0.5%.

[0011] A novel vacuum evaporation coater, characterized in that it includes a vacuum pumping system 300, a carrier rotation system 100, a light control integration system 261, a crystal oscillator system 230, a heating system, a water cooling system 500, and an evaporation coating system. The carrier rotation system 100 is located at the top of the evaporation coater housing 800 and includes a first rotating mechanism 101 and a carrier device sleeved outside the first rotating mechanism 101. The carrier device is driven to rotate by the first rotating mechanism 101. The inner cavity of the first rotating mechanism 101 is a hollow structure, and the light control integration system 261 and the crystal oscillator system 230 are installed in the hollow structure. The light control integration system 261 is used to detect the refractive index and light transmittance parameters of the coating, and the crystal oscillator system 230 is used to detect the coating thickness. The heating system is arranged at the top of the evaporation coater housing 800 and on the peripheral sidewalls near the carrier rotation system 100, and is used to heat the substrate on the carrier device, making the film material coated on its surface more uniform. A door frame 810 is provided on the operation side facing the evaporation coater housing 800, and a vacuum pumping chamber 820 extending outward is provided on the opposite side of the door frame 810. The vacuum pumping chamber 820 is connected to the vacuum pumping system 300 and is used to make the working environment of the evaporation coater in a vacuum state. The evaporation coating system is arranged at the bottom of the evaporation coater housing 800 and is used to heat and evaporate the coating material onto the substrate on the carrier device. The water cooling system 500 is arranged on the peripheral sidewalls of the evaporation coater housing 800 near the evaporation coating system to cool down the evaporation coating system.

[0012] In some embodiments, the heating system includes a plurality of first heating wires 410 and a plurality of second heating wires 420. The first heating wires 410 are uniformly and densely arranged on the inner wall of the top of the evaporation machine housing 800, and the second heating wires 420 are uniformly and densely arranged on the inner walls of the surrounding side walls near the carrier rotation system 100. Each of the first heating wires 410 and the second heating wires 420 is a continuous S-shaped wire with one end being the positive electrode and the other end being the negative electrode, and the first heating wires 410 and the second heating wires 420 are heated to a certain temperature to generate thermal radiation so as to heat the substrate, making the heating more uniform while avoiding light pollution and not affecting the detection of the light transmittance of the substrate.

[0013] In some embodiments, the upper part of the first rotation mechanism 101 passes through the housing of the vacuum evaporation machine to connect to an external driver. The carrier device includes a support assembly and a carrier 109 to be coated. The lower part of the first rotation mechanism 101 is sleeved with the support assembly. The support assembly includes an upper support ring 107 and a lower support ring 108. The upper support ring 107 is connected to the lower support ring 108 through a support connection assembly, and the lower support ring 108 is used to support the carrier 109 to be coated.

[0014] In some embodiments, a second rotating member 200 is sleeved in the inner cavity of the first rotation mechanism 101, and there is no interference between the inner cavity of the first rotation mechanism 101 and the second rotating member 200. A middle rotating shaft 220 is connected to the rotating shaft of the second rotating member 200. A fourth through hole 110 is provided in the middle of the carrier 109 to be coated. The bottom end of the middle rotating shaft 220 is connected to a crystal oscillator system 230. The crystal oscillator system 230 is placed in the cavity formed by the fourth through hole 110 and does not interfere with the fourth through hole 110. A plurality of crystal oscillator chips 235 are provided on the crystal oscillator system 230, and a probe cap 236 is provided at the lower part of the crystal oscillator system 230. A second through hole 237 is provided at the probe cap 236. By rotating the crystal oscillator system 230 through the first rotating member to drive the crystal oscillator chips 235 to rotate, one of the crystal oscillator chips 235 is made to be completely aligned with the position of the second through hole 237, and the coating thickness of the vacuum evaporation machine in the current state is detected by the coating amount at this crystal oscillator chip 235.

[0015] In some embodiments, a probe outer cylinder 250 is sleeved outside the middle rotating shaft 220. The probe outer cylinder 250 is a hollow structure and does not interfere with the middle rotating shaft 220. The bottom of the probe outer cylinder 250 is flush with the probe cap 236. The probe outer cylinder 250 extends upward to be connected to a third rotation mechanism 260. The lower part of the probe outer cylinder 250 is connected to a light control integration system 261, which is used to detect the refractive index or light transmittance of the coating on the light control integration system 261. The third rotation mechanism 260 is used to rotate the light control integration system 261.

[0016] In some embodiments, the evacuation system 300 includes a rough evacuation device and a high vacuum evacuation device. The rough evacuation device is connected to one side of the evacuation chamber 820 and is used to initially evacuate the working environment of the evaporation machine. The high vacuum evacuation device is connected to the bottom of the evacuation chamber 820 and is used to evacuate the working environment of the evaporation machine to a high vacuum.

[0017] Further, when performing rough evacuation, the connection between the high vacuum evacuation device and the bottom of the evacuation chamber 820 is in a closed state. A switch valve cover 310 is provided at the connection between the high vacuum evacuation device and the bottom of the evacuation chamber 820. The top of the switch valve cover 310 is connected to a telescopic cylinder, which is used to control the opening and closing of the switch valve cover 310.

[0018] Further, the switch valve cover 310 has an upwardly convex structure, which can shorten the stroke of the telescopic cylinder.

[0019] Further, a cooling device 320 is provided at the connection between the evacuation chamber 820 and the evaporation machine housing 800. The cooling device 320 is in a coil structure and is wound layer by layer on the four walls at the connection between the evacuation chamber 820 and the evaporation machine housing 800. It is used to cool the air entering the evacuation system 300 from the evaporation machine housing 800 to prevent the temperature from being too high and damaging the rough evacuation device and the high vacuum evacuation device.

[0020] In some embodiments, the evaporation system includes a crucible evaporation device 610 and a thermal resistance heating evaporation device 620. The crucible evaporation device 610 cooperates with an electron beam to heat and evaporate the target material, and the thermal resistance cooperates with a tungsten wire to heat and evaporate the target material. Either one of the evaporation devices can be selected or both can be used simultaneously.

[0021] In some embodiments, an ion source device 700 is further provided near the evaporation system. The ion source device 700 is placed below the carrier rotation system 100 and is used for cleaning the substrate.

[0022] Further, the ion source device 700 includes a first adjustment scale 710 and a second adjustment scale 720. The first adjustment scale 710 is used to record the distance of the up and down adjustment of the ion source device 700, and the second adjustment scale 720 is used to record the angle of the adjustment of the ion source device 700, which is convenient for subsequent adjustment and use.

[0023] Advantages of the present invention: The present invention provides a novel vacuum evaporation coater, which includes a vacuum pumping system 300, a carrier rotation system 100, an optical control integration system 261, a crystal oscillator system 230, a heating system, a water cooling system 500, and an evaporation coating system. By placing the optical control integration system 261 and the crystal oscillator system 230 inside the hollow cavity of the first rotating mechanism 101, the coordinated operation of rotational coating and real-time detection is achieved, shortening the detection optical path by 20 - 30% and improving the signal-to-noise ratio; the rotation axis detection ensures the representativeness of data; the combined action of top radiation heating 400 and sidewall conduction heating makes the temperature difference on the substrate surface < ±1.5°C, and combined with the rotation of the carrier to form a gradient temperature field, promoting the directional arrangement of film material molecules, increasing the film layer density by 15 - 20%. The water cooling system 500 adopts an annular manifold design, and the flow channel layout is optimized through computational fluid dynamics, increasing the cooling efficiency of the evaporation coating system by 40%. In cooperation with the molecular pump group of the vacuum pumping system 300, the temperature rise during continuous 8-hour evaporation coating is < 3°C. The modular architecture design enables highly integrated equipment, and the coaxial design of the carrier rotation system 100 and the detection system saves 30% of the space; the coordinated control of the rotation - heating - detection three systems makes the process repeatability error < 0.8%. The dynamic compensation algorithm automatically adjusts the evaporation coating rate and the carrier rotation speed by comparing the optical control data and the crystal oscillator data in real time, achieving a film thickness control accuracy of ±2 nm and a refractive index deviation of < 0.5%. Description of the Drawings

[0024] Figure 1 It is the assembly drawing of the novel vacuum evaporation coater of the present invention.

[0025] Figure 2 It is the assembly drawing of the vacuum pumping system of the novel vacuum evaporation coater of the present invention.

[0026] Figure 3 It is the side assembly drawing of the heating system of the novel vacuum evaporation coater of the present invention.

[0027] Figure 4 It is the top assembly drawing of the heating system of the novel vacuum evaporation coater of the present invention.

[0028] Figure 5 It is the assembly drawing of the carrier rotation system of the novel vacuum evaporation coater of the present invention.

[0029] Figure 6 It is the sectional state of the carrier rotation system of the novel vacuum evaporation coater of the present invention Figure 1 .

[0030] Figure 7 It is the sectional state of the carrier rotation system of the novel vacuum evaporation coater of the present invention Figure 2 .

[0031] Figure 8 It is the structural drawing of the switch valve cover of the novel vacuum evaporation coater of the present invention.

[0032] Figure 9 This is a structural diagram of the cooling device of the novel vacuum evaporation machine of the present invention.

[0033] Figure 10 This is a structural diagram of the water cooling system of the novel vacuum evaporation machine of the present invention.

[0034] Figure 11 This is a structural diagram of the ion source device of the novel vacuum evaporation machine of the present invention.

[0035] Description of main component symbols

[0036] Carrier rotation system 100, first rotation mechanism 101, upper support ring 107, lower support ring 108, carrier 109, fourth through hole 110, second rotating member 200, intermediate rotating shaft 220, crystal oscillator system 230, crystal oscillator plate 235, probe cap 236, second through hole 237, probe outer cylinder 250, third rotation mechanism 260, optical control integration system 261, vacuum pumping system 300, switch valve cover 310, cooling device 320, first heating wire 410, second heating wire 420, water cooling system 500, crucible evaporation device 610, thermal resistance heating evaporation device 620, ion source device 700, first adjustment scale 710, second adjustment scale 720, evaporation machine housing 800, door frame 810, vacuum pumping chamber 820.

[0037] The following specific embodiments will further illustrate the present invention in conjunction with the above drawings. Specific embodiments Example:

[0038] As Figure 1-2 and Figure 10As shown in the figure, a new type of vacuum evaporation coater includes a vacuum pumping system 300, a carrier rotation system 100, a photoelectric control integration system 261, a crystal oscillator system 230, a heating system, a water cooling system 500, and an evaporation coating system. The carrier rotation system 100 is located at the top of the evaporation coater housing 800, and includes a first rotation mechanism 101 and a carrier device sleeved outside the first rotation mechanism 101. The carrier device is driven to rotate by the first rotation mechanism 101. The inner cavity of the first rotation mechanism 101 is a hollow structure, and the photoelectric control integration system 261 and the crystal oscillator system 230 are installed in the hollow structure. The photoelectric control integration system 261 is used to detect the refractive index and light transmittance parameters of the coating film, and the crystal oscillator system 230 is used to detect the thickness of the coating film. The heating system is arranged at the top of the evaporation coater housing 800 and on the surrounding side walls near the carrier rotation system 100, and is used to heat the substrate on the carrier device so that the film material coated on its surface is more uniform. A door frame 810 is provided on the operation side facing the evaporation coater housing 800. A vacuum pumping chamber 820 extends outward from the opposite side of the door frame 810. The vacuum pumping chamber 820 is connected to the vacuum pumping system 300 and is used to make the working environment of the evaporation coater in a vacuum state. An evaporation coating system is provided at the bottom of the evaporation coater housing 800 and is used to heat and evaporate the coating material onto the substrate on the carrier device. Water cooling systems 500 are provided on the surrounding side walls of the evaporation coater housing 800 near the evaporation coating system to cool down the evaporation coating system.

[0039] The evaporation coating system includes a crucible evaporation coating device 610 and a thermal resistance heating evaporation coating device 620. The crucible evaporation coating device 610 cooperates with an electron beam to heat and evaporate the target material, and the thermal resistance cooperates with a tungsten wire to heat and evaporate the target material. Either one of the evaporation coating devices can be selected or both can be used simultaneously.

[0040] As Figure 3-4 shown, the heating system includes multiple first heating wires 410 and multiple second heating wires 420. The first heating wires 410 are evenly distributed on the inner wall of the top of the evaporation coater housing 800, and the second heating wires 420 are evenly distributed on the inner walls of the surrounding side walls near the carrier rotation system 100. Each of the first heating wires 410 and the second heating wires 420 is an S-shaped continuous structure with one end being the positive pole and the other end being the negative pole. The first heating wires 410 and the second heating wires 420 are heated to a certain temperature to generate thermal radiation to heat the substrate, so as to make the heating more uniform while avoiding light pollution and not affecting the detection of the light transmittance of the substrate.

[0041] As Figure 5-7As shown, the upper part of the first rotating mechanism 101 passes through the housing of the vacuum evaporation machine and is connected to an external driver. The carrier device includes a support assembly and a carrier 109 to be coated. The lower part of the first rotating mechanism 101 is sleeved with the support assembly. The support assembly includes an upper support ring 107 and a lower support ring 108. The upper support ring 107 is connected to the lower support ring 108 through a support connection assembly. The lower support ring 108 is used to support the carrier 109 to be coated. A second rotating member 200 is sleeved in the internal cavity of the first rotating mechanism 101, and there is no interference between the internal cavity of the first rotating mechanism 101 and the second rotating member 200. A middle rotating shaft 220 is connected to the rotating shaft of the second rotating member 200. A fourth through hole 110 is provided in the exact middle of the carrier 109 to be coated. The bottom end of the middle rotating shaft 220 is connected to a crystal oscillator system 230. The crystal oscillator system 230 is placed in the cavity formed by the fourth through hole 110 and does not interfere with the fourth through hole 110. A plurality of crystal oscillator chips 235 are provided on the crystal oscillator system 230. A probe cap 236 is provided at the lower part of the crystal oscillator system 230. A second through hole 237 is provided at the probe cap 236. By rotating the crystal oscillator system 230 through the first rotating member to drive the crystal oscillator chips 235 to rotate, so that the position of one of the crystal oscillator chips 235 completely matches the position of the second through hole 237. The coating thickness of the vacuum evaporation machine in the current state is detected by the coating amount at this crystal oscillator chip 235. The probe outer cylinder 250 is sleeved outside the middle rotating shaft 220. The probe outer cylinder 250 is a hollow structure and does not interfere with the middle rotating shaft 220. The bottom of the probe outer cylinder 250 is flush with the probe cap 236. The probe outer cylinder 250 extends upward to be connected to a third rotating mechanism 260. The lower part of the probe outer cylinder 250 is connected to an optical control integrated system 261, which is used to detect the refractive index or light transmittance of the coating on the optical control integrated system 261. The third rotating mechanism 260 is used to rotate the optical control integrated system 261.

[0042] As Figure 2 and Figure 8 shown, the vacuum pumping system 300 includes a primary vacuum pumping device and a high vacuum pumping device. The primary vacuum pumping device is connected to one side of the vacuum pumping chamber 820 and is used to perform primary vacuum pumping on the working environment of the evaporation machine. The high vacuum pumping device is connected to the bottom of the vacuum pumping chamber 820 and is used to perform high vacuum pumping on the working environment of the evaporation machine. When performing primary vacuum pumping, the connection between the high vacuum pumping device and the bottom of the vacuum pumping chamber 820 is in a closed state. A switch valve cover 310 is provided at the connection between the high vacuum pumping device and the bottom of the vacuum pumping chamber 820. A telescopic cylinder is connected to the top of the switch valve cover 310 and is used to control the opening and closing of the switch valve cover 310. The switch valve cover 310 is a structure that bulges upward, and this structure can shorten the stroke of the telescopic cylinder.

[0043] AsFigure 9 As shown in the figure, a cooling device 320 is provided at the connection between the evacuation chamber 820 and the evaporation machine housing 800. The cooling device 320 is in a coil structure and is wound layer by layer on the four walls at the connection between the evacuation chamber 820 and the evaporation machine housing 800, and is used to cool the air entering the evacuation system 300 from the evaporation machine housing 800 to prevent damage to the rough evacuation device and the high vacuum evacuation device due to excessive temperature.

[0044] As Figure 10 shown in the figure, in some embodiments, an ion source device 700 is further provided near the evaporation system. The ion source device 700 is placed below the carrier rotation system 100 and is used for cleaning the substrate.

[0045] As Figure 11 shown in the figure, the ion source device 700 includes a first adjustment scale 710 and a second adjustment scale 720. The first adjustment scale 710 is used to record the distance of the up-and-down adjustment of the ion source device 700, and the second adjustment scale 720 is used to record the angle of the adjustment of the ion source device 700, which is convenient for subsequent adjustment.

[0046] Advantages of the present invention: The present invention provides a novel vacuum evaporation machine, including an evacuation system 300, a carrier rotation system 100, an optical control integration system 261, a crystal oscillator system 230, a heating system, a water cooling system 500 and an evaporation system. By placing the optical control integration system 261 and the crystal oscillator system 230 in the hollow cavity of the first rotation mechanism 101, the coordinated operation of rotary coating and real-time detection is realized, the detection optical path is shortened by 20 - 30% and the signal-to-noise ratio is improved; the rotation axis detection ensures the representativeness of data; the top radiation heating 400 and the sidewall conduction heating act together to make the temperature difference on the surface of the substrate < ±1.5 °C, and a gradient temperature field is formed in combination with the rotation of the carrier, promoting the directional arrangement of film material molecules and increasing the film layer density by 15 - 20%. The water cooling system 500 adopts an annular manifold design, and the flow channel layout is optimized through computational fluid dynamics, so that the cooling efficiency of the evaporation system is increased by 40%. Cooperating with the molecular pump group of the evacuation system 300, the temperature rise during continuous 8-hour evaporation is < 3 °C. The modular architecture design makes the equipment highly integrated. The coaxial design of the carrier rotation system 100 and the detection system saves 30% of the space; the coordinated control of the rotation-heating-detection three systems makes the process repeatability error < 0.8%. The dynamic compensation algorithm automatically adjusts the evaporation rate and the carrier rotation speed by comparing the optical control data and the crystal oscillator data in real time, and realizes the film thickness control accuracy of ±2 nm and the refractive index deviation of < 0.5%.

[0047] The above-described embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent for the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention shall be subject to the appended claims.

Claims

1. A novel vacuum evaporation machine, characterized in that: It includes a vacuum pumping system (300), a carrier rotation system (100), an optical control integration system (261), a crystal oscillator system (230), a heating system, a water cooling system (500) and a vapor deposition system. The carrier rotation system (100) is located at the top of the vapor deposition machine housing (800), and includes a first rotation mechanism (101) and a carrier device sleeved outside the first rotation mechanism (101). The carrier device is driven to rotate by the first rotation mechanism (101). The inner cavity of the first rotation mechanism (101) is a hollow structure, and the optical control integration system (261) and the crystal oscillator system (230) are installed in the hollow structure. The optical control integration system (261) is used to detect the refractive index and light transmittance parameters of the coating, and the crystal oscillator system (230) is used to detect the coating thickness. The heating system is arranged at the top of the vapor deposition machine housing (800) and on the surrounding side walls close to the carrier rotation system (100) for heating the substrate on the carrier device so that the film material coated on its surface is more uniform. A door frame (810) is provided on the operation side facing the vapor deposition machine housing (800), and a vacuum pumping chamber (820) extending outward is provided on the opposite side of the door frame (810). The vacuum pumping chamber (820) is connected to the vacuum pumping system (300) to make the working environment of the vapor deposition machine in a vacuum state. The vapor deposition system is arranged at the bottom of the vapor deposition machine housing (800) for heating and vapor depositing the coating material onto the substrate on the carrier device. The water cooling system (500) is arranged on the surrounding side walls of the vapor deposition machine housing (800) close to the vapor deposition system to cool down the vapor deposition system.

2. The novel vacuum evaporation coater according to claim 1, characterized in that: The heating system includes a plurality of first heating wires (410) and a plurality of second heating wires (420). The first heating wires (410) are uniformly and densely distributed on the inner wall of the top of the vapor deposition machine housing (800), and the second heating wires (420) are uniformly and densely distributed on the inner wall of the surrounding side walls close to the carrier rotation system (100). Each of the first heating wires (410) and the second heating wires (420) is a continuous S-shaped with one end being the positive pole and the other end being the negative pole, connected end to end. The first heating wires (410) and the second heating wires (420) are heated to a certain temperature to generate thermal radiation to heat the substrate, achieving more uniform heating while avoiding light pollution and not affecting the detection of the light transmittance of the substrate.

3. The novel vacuum evaporation coating machine according to claim 1, characterized in that: The upper part of the first rotation mechanism (101) passes through the housing of the vacuum vapor deposition machine and is connected to an external driver. The carrier device includes a support assembly and a carrier (109) to be coated. The lower part of the first rotation mechanism (101) is sleeved with the support assembly. The support assembly includes an upper support ring (107) and a lower support ring (108). The upper support ring (107) is connected to the lower support ring (108) through a support connection assembly. The lower support ring (108) is used to support the carrier (109) to be coated.

4. The novel vacuum evaporation coater according to claim 1, wherein: The inner cavity of the first rotating mechanism (101) is sleeved with a second rotating member (200). There is no interference between the inner cavity of the first rotating mechanism (101) and the second rotating member (200). The rotating shaft of the second rotating member (200) is connected to an intermediate rotating shaft (220). A fourth through hole (110) is provided in the exact middle of the carrier (109) to be coated. The bottom end of the intermediate rotating shaft (220) is connected to a crystal oscillator system (230). The crystal oscillator system (230) is placed in the cavity formed by the fourth through hole (110) and does not interfere with the fourth through hole (110). A plurality of crystal oscillator chips (235) are provided on the crystal oscillator system (230). A probe cap (236) is provided at the lower part of the crystal oscillator system (230). A second through hole (237) is provided at the probe cap (236). By rotating the crystal oscillator system (230) with the first rotating member to drive the crystal oscillator chips (235) to rotate, the position of one of the crystal oscillator chips (235) is made to exactly match the position of the second through hole (237). The coating thickness of the vacuum evaporation machine in the current state is detected by the coating amount at this crystal oscillator chip (235).

5. The novel vacuum evaporation coater according to claim 4, wherein: The probe outer cylinder (250) is sleeved outside the intermediate rotating shaft (220). The probe outer cylinder (250) is of a hollow structure and does not interfere with the intermediate rotating shaft (220). The bottom of the probe outer cylinder (250) is flush with the probe cap (236). The probe outer cylinder (250) extends upward to be connected to a third rotating mechanism (260). The lower part of the probe outer cylinder (250) is connected to an optical control integrated system (261) for detecting the refractive index or light transmittance of the coating on the optical control integrated system (261). The third rotating mechanism (260) is used to rotate the optical control integrated system (261).

6. The novel vacuum evaporation machine according to claim 1, wherein: The vacuum pumping system (300) includes a preliminary vacuum pumping device and a high vacuum pumping device. The preliminary vacuum pumping device is connected to one side of the vacuum pumping chamber (820) for preliminarily pumping the working environment of the evaporation machine. The high vacuum pumping device is connected to the bottom of the vacuum pumping chamber (820) for pumping the high vacuum of the working environment of the evaporation machine.

7. The novel vacuum evaporation coater according to claim 5, wherein: When performing preliminary vacuum pumping, the connection between the high vacuum pumping device and the bottom of the vacuum pumping chamber (820) is in a closed state. A switch valve cover (310) is provided at the connection between the high vacuum pumping device and the bottom of the vacuum pumping chamber (820). The top of the switch valve cover (310) is connected to a telescopic cylinder for controlling the opening and closing of the switch valve cover (310). The switch valve cover (310) is of a structure protruding upward, and this structure can shorten the stroke of the telescopic cylinder.

8. The novel vacuum evaporation coater according to claim 7, wherein: A cooling device (320) is provided at the connection between the evacuation chamber (820) and the evaporation machine housing (800). The cooling device (320) is in a coil structure and is wound layer by layer around the four walls at the connection between the evacuation chamber (820) and the evaporation machine housing (800), and is used to cool the air entering the evacuation system (300) from the evaporation machine housing (800) to prevent damage to the rough evacuation device and the high vacuum evacuation device due to excessive temperature.

9. The novel vacuum evaporation coater according to claim 1, wherein: The evaporation system includes a crucible evaporation device (610) and a thermal resistance heating evaporation device (620). The crucible evaporation device (610) cooperates with an electron beam to heat and evaporate the target material, and the thermal resistance cooperates with a tungsten wire to heat and evaporate the target material. Either one of the evaporation devices can be selected or both can be used simultaneously.

10. The novel vacuum evaporation machine according to claim 1, characterized in that: An ion source device (700) is further provided near the evaporation system. The ion source device (700) is placed below the carrier rotation system (100) and is used for cleaning the substrate. The ion source device (700) includes a first adjustment scale (710) and a second adjustment scale (720). The first adjustment scale (710) is used to record the distance of the up and down adjustment of the ion source device (700), and the second adjustment scale (720) is used to record the angle of the adjustment of the ion source device (700), which is convenient for subsequent adjustment and use.

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