Gas supply device and coating equipment
By setting up a gas generator module, a gas control module and a controller in the gas supply device, dynamic control of gas temperature and pressure is achieved, the problem of mismatch in the gas supply volume is solved, and the gas supply stability and coating uniformity are improved.
Patent Information
- Application Number
- CN202510532554.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2025-07-11
AI Technical Summary
In the vacuum coating process, the gas supply volume of the existing gas supply devices is difficult to match the process requirements, resulting in fluctuations in the gas flow rate and unstable gas supply, affecting the uniformity and stability of the coating.
The combination of gas generation module, gas control module, gas transmission pipeline and controller is adopted to control the gas temperature and pressure to achieve gas buffering and dynamic balance to ensure that gas is transmitted within a constant pressure range.
The stability of the gas supply device and the uniformity of the vacuum coating process are improved, and the stability of the gas flow rate and coating effect are ensured.
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Figure CN120291060A_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to the technical field of vacuum coating, and in particular, to a gas supply device and a coating equipment. Background Art
[0002] Vacuum coating technology is a process of depositing materials on the surface of a substrate to form a thin film in a vacuum environment, which is widely used in the fields of optics, electronics, decoration, and protection. In recent years, liquid raw materials such as Hexamethyldisiloxane (HMDSO) are often used in the vacuum coating process. The HMDSO is vaporized into a gas and transported to the coating chamber to generate a functional coating.
[0003] In the prior art, a commonly used gas supply device usually includes a liquid storage tank and a gas transmission pipeline. When performing a vacuum coating process, the liquid stored inside is vaporized into a gas by heating the liquid storage tank, so that the gas can be transported to the coating chamber through the gas transmission pipeline.
[0004] However, the gas supply device in the prior art has technical defects in practical applications. First, it is difficult for the liquid storage tank to supply gas volume to match the process requirements. When the gas consumption in the coating chamber is too large, the liquid in the liquid storage tank may be entrained by the gas flow and flow into the gas transmission pipeline, resulting in fluctuations in the gas flow rate flowing into the coating chamber. Second, the change in the liquid level height of the liquid in the liquid storage tank will affect the gas accommodation space in the liquid storage tank. When the liquid filling amount in the liquid storage tank is relatively large, the gas accommodation space in the liquid storage tank decreases, lacking sufficient buffer capacity, resulting in unstable vaporization rate, and further affecting the uniformity of gas supply and the stability of the process. Summary of the Invention
[0005] The present invention provides a gas supply device and a coating equipment to achieve the dynamic balance between the gas supply volume of the gas supply device and the demand volume of the vacuum coating process, thereby improving the gas supply stability and the uniformity of the vacuum coating process.
[0006] The first aspect of the present invention provides a gas supply device, which includes: a gas generation module, a gas control module, a gas transmission pipeline, and a controller;
[0007] The gas generation module is used to store a liquid raw material and convert the liquid raw material into a target gas;
[0008] The intake port of the gas control module is communicated with the outlet port of the gas generation module; the outlet port of the gas control module is communicated with the intake end of the gas transmission pipeline;
[0009] The controller is at least connected to the gas control module; the controller is configured to control the temperature and / or pressure of the target gas in the gas control module so as to control the gas volume of the target gas transmitted into the gas transmission pipeline.
[0010] Optionally, the gas control module includes a gas buffer pipeline, a first temperature control unit, and a first pressure detection unit;
[0011] The inlet end of the gas buffer pipeline is communicated with the outlet of the gas generation module; the outlet end of the gas buffer pipeline is communicated with the inlet end of the gas transmission pipeline;
[0012] The first temperature control unit is at least partially disposed around the gas buffer pipeline; the first temperature control unit is configured to heat the target gas in the gas buffer pipeline;
[0013] The first pressure detection unit is configured to obtain the pressure of the target gas in the gas buffer pipeline;
[0014] The controller is respectively connected to the first temperature control unit and the first pressure detection unit; the controller is configured to control the heating power of the first temperature control unit when heating the target gas in the gas buffer pipeline according to the pressure of the target gas obtained by the first pressure detection unit.
[0015] Optionally, the gas control module further includes a first temperature detection unit;
[0016] The first temperature detection unit is configured to obtain the temperature of the target gas in the gas buffer pipeline;
[0017] The controller is further connected to the first temperature detection unit; the controller is further configured to control the heating power of the first temperature control unit when heating the target gas in the gas buffer pipeline according to the temperature of the target gas obtained by the first temperature detection unit.
[0018] Optionally, the gas buffer pipeline includes a spiral pipeline.
[0019] Optionally, the gas supply device further includes a throttle valve and a filter;
[0020] The throttle valve is disposed at the inlet of the gas control module;
[0021] The filter is disposed between the inlet of the gas control module and the outlet of the gas generation module.
[0022] Optionally, the gas generation module includes a liquid storage tank and a second temperature control unit;
[0023] The liquid storage tank is used to store the liquid raw material;
[0024] The second temperature control unit is disposed at least partially around the liquid storage tank; the second temperature control unit is used to heat the liquid raw material.
[0025] Optionally, the gas generation module further includes a second temperature detection unit;
[0026] The second temperature detection unit is used to obtain the temperature of the liquid raw material in the liquid storage tank;
[0027] The controller is also respectively connected to the second temperature control unit and the second temperature detection unit; the controller is further used to control the heating power when the second temperature control unit heats the liquid raw material according to the temperature of the liquid raw material obtained by the second temperature detection unit, so that the temperature of the target gas in the gas buffer pipeline is greater than the temperature of the liquid raw material in the liquid storage tank.
[0028] Optionally, the gas transmission pipeline includes a main transmission pipeline and at least one branch transmission pipeline;
[0029] The inlet end of the main transmission pipeline is communicated with the outlet of the gas control module, and the outlet end of the main transmission pipeline is respectively communicated with each branch transmission pipeline;
[0030] The gas supply device further includes a gas flow control module corresponding to each branch transmission pipeline;
[0031] The gas flow control module is correspondingly disposed in the branch transmission pipeline, and the gas flow control module is used to control the gas flow of the target gas transported through the branch transmission pipeline.
[0032] Optionally, the gas flow control module includes a mass flow controller and / or a gas valve.
[0033] A second aspect of the present invention provides a coating device, which includes: the gas supply device as described above and a coating chamber;
[0034] The coating chamber is communicated with the outlet end of the gas transmission pipeline of the gas supply device.
[0035] According to the technical solution of the present invention, a gas generation module, a gas control module, a gas transmission pipeline and a controller are provided in the gas supply device, so that the gas generation module converts the stored liquid raw material into a target gas, and the target gas generated by the gas generation module can be transported from the gas outlet of the gas generation module to the gas inlet of the gas control module, and can further be transported from the gas outlet of the gas control module to the gas inlet end of the gas transmission pipeline, so as to transport the target gas to the coating chamber through the gas transmission pipeline, thereby meeting the gas requirements of the vacuum coating process. At the same time, by providing a gas control module, a buffer is provided for the transportation of the target gas, avoiding unstable gas supply caused by insufficient gas accommodation space in the gas generation device, and improving the gas supply stability of the gas supply device. In addition, by providing that the controller is at least connected to the gas control module, the controller can control the temperature and pressure of the target gas in the gas control module to control the gas volume of the target gas transmitted to the gas transmission pipeline, realizing that the target gas in the gas buffer pipeline can be transmitted within a constant pressure range, thereby realizing the dynamic balance between the gas supply volume of the gas supply device and the demand of the vacuum coating process, and improving the gas supply stability and the uniformity of the vacuum coating process.
[0036] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0038] Figure 1 is a schematic structural diagram of a gas supply device provided by an embodiment of the present invention;
[0039] Figure 2 is a schematic structural diagram of another gas supply device provided by an embodiment of the present invention;
[0040] Figure 3 is a schematic structural diagram of another gas supply device provided by an embodiment of the present invention;
[0041] Figure 4 is a schematic structural diagram of a coating device provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0042] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.
[0043] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned accompanying drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order different from those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.
[0044] Figure 1 is a schematic structural diagram of a gas supply device provided by an embodiment of the present invention, as Figure 1 shown, the gas supply device includes a gas generation module 1, a gas control module 2, a gas transmission pipeline 3, and a controller 4; the gas generation module 1 is used to store liquid raw materials and convert the liquid raw materials into target gases; the inlet 201 of the gas control module 2 is communicated with the outlet 101 of the gas generation module 1; the outlet 202 of the gas control module 2 is communicated with the inlet end 31 of the gas transmission pipeline 3; the controller 4 is at least connected to the gas control module 2; the controller 4 is used to control the temperature and / or pressure of the target gas in the gas control module 2 to control the gas volume of the target gas transmitted to the gas transmission pipeline 3.
[0045] Among them, the gas generation module 1 can be specifically understood as a module for generating the target gas. The liquid raw material is stored in the gas generation module 1, and the gas generation module 1 can vaporize the liquid raw material into the target gas. The target gas can be transported to the inlet 201 of the gas control module 2 through the outlet 101 of the gas generation module 1, and can further be transported to the inlet end 31 of the gas transmission pipeline 3 through the outlet 202 of the gas control module 2, so as to transport the target gas to the coating chamber through the gas transmission pipeline 3, thereby meeting the gas requirements of the vacuum coating process. After the target gas is transported to the coating chamber, it can be decomposed by plasma excitation, so that the target gas is deposited on the substrate surface to form a functional film. Exemplarily, the target gas can be HMDSO gas. The HMDSO gas can generate a silicon-containing film, such as silicon dioxide or diamond-like carbon coating, through the Plasma-Enhanced Chemical Vapor Deposition (PECVD) process.
[0046] It can be understood that the volatility of HMDSO liquid is relatively high, and it can slowly evaporate into the target gas at room temperature. The gasification rate and transmission rate of the target gas increase significantly with the increase of temperature. At the same time, the target gas formed after the gasification of HMDSO liquid is easy to condense back into the liquid state when the temperature decreases or the pressure increases. The condensed droplets may be entrained by the gas flow and flow into the gas transmission pipeline 3, resulting in fluctuations in the gas flow rate flowing into the coating chamber, thereby affecting the uniformity of the vacuum coating process. The uniformity of the vacuum coating process includes the stability of the vacuum coating process over time. Therefore, it is necessary to dynamically adjust the temperature and / or pressure of the gas control module 2 through the controller 4 connected to at least the gas control module 2, so as to avoid the condensation of the target gas and control the gas volume of the target gas transported to the gas transmission pipeline 3, ensuring the gas supply stability of the gas supply device. Exemplarily, the controller 4 can include a Programmable Logic Controller (PLC) or a Microcontroller Unit (MCU).
[0047] It can also be understood that in order to ensure that the gas amount of the target gas in the gas transmission pipeline 3 meets the preset flow range, the controller 4 can preferentially adjust the temperature of the target gas based on the pressure of the target gas in the gas control module 2 to ensure that the pressure of the target gas in the gas control module 2 is maintained within the preset pressure range, thereby achieving the gas supply stability of the gas supply device. In addition, the controller 4 can be connected to the gas control module 2 in a direct or indirect manner, and the present invention does not specifically limit this. For example, in addition to being directly connected to the gas control module 2, the controller 4 can also be indirectly connected to the gas control module 2 by connecting to the gas transmission pipeline 3. When the controller 4 is connected to the gas transmission pipeline 3, if the controller 4 detects that the gas amount of the target gas in the gas transmission pipeline 3 meets the preset flow range, the controller 4 can suspend the adjustment of the temperature and / or pressure of the target gas in the gas control module 2 to maintain the gas supply stability of the gas supply device.
[0048] The gas control module 2 is located between the gas generation module 1 and the gas transmission pipeline 3, and is used to optimize the delivery process of the target gas. Figure 2 is a schematic diagram of the structure of another gas supply device provided by an embodiment of the present invention. Figure 2 As shown, the gas control module 2 may include a gas buffer pipeline 21, and the gas inlet end 211 of the gas buffer pipeline 21 is connected to the gas outlet 101 of the gas generating module 1; the gas outlet end 212 of the gas buffer pipeline 21 is connected to the gas inlet end 31 of the gas transmission pipeline 3, so that the gas buffer pipeline 21 can extend the transmission path of the target gas. Exemplarily, the gas buffer pipeline 21 can adopt a serpentine structure, a folded spiral structure, a can-shaped structure or a multi-channel parallel structure, etc. In an optional embodiment, continue to refer to Figure 2 The gas buffer pipeline 21 includes a spiral pipeline to increase the gas volume of the gas control module 2, thereby providing a buffer for the delivery of the target gas, avoiding unstable gas supply caused by insufficient gas storage space in the gas generating module 1, and improving the gas supply stability of the gas supply device. It can be understood that the gas volume of the gas control module 2 can be determined according to the maximum gas demand of the vacuum coating process. Exemplarily, the diameter of the gas buffer pipeline 21 can have a value range greater than 8mm to ensure that the gas volume of the gas control module 2 is greater than the maximum gas demand of the vacuum coating process, so as to ensure that the gas control module 2 can provide sufficient buffer space for the target gas when the gas demand of the vacuum coating process changes, thereby improving the gas supply stability.
[0049] Meanwhile, continue to refer to Figure 2, the gas control module 2 may further include a first temperature control unit 22 and a first pressure detection unit 23, and the controller 4 is respectively connected to the first temperature control unit 22 and the first pressure detection unit 23. The first pressure detection unit 23 is configured to obtain the pressure of the target gas in the gas buffer pipeline 21. Exemplarily, the first pressure detection unit 23 may be a pressure sensor, and the first pressure detection unit 23 may be disposed in the gas buffer pipeline 21. The first temperature control unit 22 is at least partially disposed around the gas buffer pipeline 21, and the first temperature control unit 22 is configured to heat the target gas in the gas buffer pipeline 21. Exemplarily, the first temperature control unit 22 may be a heating tape, and the heating tape may be disposed around the gas buffer pipeline 21 to achieve uniform heating of the target gas in the gas buffer pipeline 21. The controller 4 is configured to control the heating power when the first temperature control unit 22 heats the target gas in the gas buffer pipeline 21 according to the pressure of the target gas obtained by the first pressure detection unit 23. Specifically, the controller 4 can generate a control signal through proportional-integral-derivative (PID) calculation according to the pressure of the target gas obtained by the first pressure detection unit 23, and control the solid-state relay through pulse width modulation (PWM), so as to adjust the duty cycle of the energization time of the heating tape, so as to adjust the heating power when the heating tape heats the target gas in the gas buffer pipeline 21, thereby realizing the adjustment of the temperature of the target gas in the gas buffer pipeline 21. In addition, the outside of the gas control module 2 may be wrapped with heat-insulating cotton to reduce heat dissipation and maintain the temperature stability of the target gas in the gas buffer pipeline 21.
[0050] Exemplarily, when the controller 4 determines that the pressure of the target gas in the gas buffer pipeline 21 obtained by the first pressure detection unit 23 is lower than the preset pressure range, it indicates that the gas supply volume of the gas supply device is insufficient. The controller 4 can increase the duty cycle of the energization time of the heating tape to increase the heating power of the heating tape, thereby increasing the temperature of the target gas in the gas buffer pipeline 21, accelerating the evaporation of the droplets remaining in the gas buffer pipeline 21, and increasing the transmission rate of the target gas in the gas buffer pipeline 21, so that the pressure of the target gas in the gas buffer pipeline 21 can be increased to the preset pressure range; when the controller 4 determines that the pressure of the target gas in the gas buffer pipeline 21 obtained by the first pressure detection unit 23 is higher than the preset pressure range, it indicates that the gas supply volume of the gas supply device is excessive. The controller 4 can reduce the duty cycle of the energization time of the heating tape to reduce the heating power of the heating tape, thereby reducing the temperature of the target gas in the gas buffer pipeline 21, slowing down the transmission rate of the target gas in the gas buffer pipeline 21, so that the pressure of the target gas in the gas buffer pipeline 21 can be reduced to the preset pressure range, realizing the transmission of the target gas in the gas buffer pipeline 21 within a constant pressure range, thereby realizing the dynamic balance between the gas supply volume of the gas supply device and the demand of the vacuum coating process, and improving the stability of gas supply and the uniformity of the vacuum coating process. Exemplarily, the preset pressure range of the target gas can be between 700 Pa and 1000 Pa.
[0051] In this embodiment, by providing a gas generation module, a gas control module, a gas transmission pipeline and a controller in the gas supply device, the gas generation module converts the stored liquid raw material into the target gas, and the target gas generated by the gas generation module can be transported from the gas outlet of the gas generation module to the gas inlet of the gas control module, and can further be transported from the gas outlet of the gas control module to the gas inlet end of the gas transmission pipeline, so as to transport the target gas to the coating chamber through the gas transmission pipeline, thereby meeting the gas demand of the vacuum coating process. At the same time, by providing the gas control module, a buffer is provided for the transportation of the target gas, avoiding unstable gas supply caused by insufficient gas accommodation space in the gas generation device, and improving the gas supply stability of the gas supply device. In addition, by providing that the controller is at least connected to the gas control module, the controller can control the temperature and pressure of the target gas in the gas control module to control the gas volume of the target gas transmitted to the gas transmission pipeline, realizing that the target gas in the gas buffer pipeline can be transmitted within a constant pressure range, thereby realizing the dynamic balance between the gas supply volume of the gas supply device and the demand of the vacuum coating process, and improving the stability of gas supply and the uniformity of the vacuum coating process.
[0052] Optionally, continue to refer to Figure 2, the gas control module 2 further includes a first temperature detection unit 24; the first temperature detection unit 24 is used to obtain the temperature of the target gas in the gas buffer pipeline 21; the controller 4 is also connected to the first temperature detection unit 24; the controller 4 is further used to control the heating power when the first temperature control unit heats the target gas in the gas buffer pipeline 21 according to the temperature of the target gas obtained by the first temperature detection unit 24.
[0053] Among them, the first temperature detection unit 24 is used to obtain the temperature of the target gas in the gas buffer pipeline 21. Exemplarily, the first temperature detection unit 24 can be a thermocouple and the first temperature detection unit 24 can be arranged inside the gas buffer pipeline 21. At the same time, by setting the controller 4 to be connected to the first temperature detection unit 24, the controller 4 can also control the heating power when the first temperature control unit heats the target gas in the gas buffer pipeline 21 according to the temperature of the target gas obtained by the first temperature detection unit 24. Exemplarily, when the controller 4 determines that the temperature of the target gas is lower than the preset gas temperature range according to the temperature of the target gas obtained by the first temperature detection unit 24, the controller 4 can increase the heating power when the first temperature control unit 22 heats the target gas in the gas buffer pipeline 21, so that the temperature of the target gas rises to the preset gas temperature range to prevent the target gas from condensing; when the controller 4 determines that the temperature of the target gas is higher than the preset gas temperature range according to the temperature of the target gas obtained by the first temperature detection unit 24, the controller 4 can reduce the heating power when the first temperature control unit 22 heats the target gas in the gas buffer pipeline 21, so that the temperature of the target gas drops to the preset gas temperature range, thereby realizing that the target gas in the gas buffer pipeline 21 is maintained within a constant temperature range during transmission, improving the gas supply stability of the gas supply device and the uniformity of the vacuum coating process. Exemplarily, the preset gas temperature range of the target gas can be between 45°C and 50°C.
[0054] Optionally, continue to refer to Figure 2 , the gas supply device further includes: a throttle valve 25 and a filter 26; the throttle valve 25 is arranged at the air inlet 201 of the gas control module 2; the filter 26 is arranged between the air inlet 201 of the gas control module 2 and the air outlet 101 of the gas generation module 1.
[0055] Among them, the throttle valve 25 can be specifically understood as a valve for regulating the flow rate of the target gas. The throttle valve 25 is arranged at the air inlet 201 of the gas control module 2, so as to control the flow rate of the target gas flowing from the gas generation module 1 into the gas control module 2 by adjusting the opening degree of the throttle valve 25, thereby being able to assist in regulating the pressure of the target gas in the gas buffer pipeline 21. Exemplarily, when it is determined according to the pressure of the target gas in the gas buffer pipeline 21 obtained by the first pressure detection unit 23 that the pressure of the target gas is lower than the preset pressure range, it indicates that the gas supply volume of the gas supply device is insufficient, and the opening degree of the throttle valve 25 can be increased to increase the flow rate of the target gas flowing from the gas generation module 1 into the gas control module 2, so that the pressure of the target gas in the gas buffer pipeline 21 can be increased to the preset pressure range; when it is determined according to the pressure of the target gas in the gas buffer pipeline 21 obtained by the first pressure detection unit 23 that the pressure of the target gas is higher than the preset pressure range, it indicates that the gas supply volume of the gas supply device is excessive, and the opening degree of the throttle valve 25 can be reduced to reduce the flow rate of the target gas flowing from the gas generation module 1 into the gas control module 2, so that the pressure of the target gas in the gas buffer pipeline 21 can be reduced to the preset pressure range. By adjusting the opening degree of the throttle valve 25, the first temperature control unit 22 is assisted to realize the transmission of the target gas in the gas buffer pipeline 21 within a constant pressure range, thereby realizing the dynamic balance between the gas supply volume of the gas supply device and the demand of the vacuum coating process, and improving the stability of the gas supply and the uniformity of the vacuum coating process.
[0056] The filter 26 can be specifically understood as a device for removing impurities or droplets in the target gas. Exemplarily, the filter 26 can be a nano filter element, and the pore diameter of the nano filter element can be 2μm, so that the filter 26 can effectively capture tiny droplets and solid particles. The filter 26 is arranged between the air inlet 202 of the gas control module 2 and the air outlet 101 of the gas generation module 1, so that the filter 26 can remove the droplets and impurities in the target gas conveyed from the gas generation module 1 to the gas control module 2. Among them, the droplets can be, for example, the target gas that is not completely vaporized and impurities, and the impurities can be, for example, the fine particles in the gas generation module 1, so as to prevent the droplets and impurities from entering the gas control module 2, thereby avoiding the gas flow rate fluctuation of the gas flowing into the coating chamber and the coating defects caused by the impurities, and improving the stability of the gas supply and the uniformity of the vacuum coating process. It can also be understood that the filter 26 can be arranged in the gas control module 2, so that the first temperature control unit 22 can also heat the filter 26, so that the droplets captured by the filter 26 can be heated and evaporated into the target gas and continue to be transported along with the air flow, thereby more effectively reducing the droplet residue, ensuring the stability of the gas supply, and at the same time being able to prevent the filter 26 from being blocked due to droplet condensation, and prolonging the service life of the filter 26.
[0057] Optionally, Figure 3 is a schematic structural diagram of another gas supply device provided by an embodiment of the present invention. As Figure 3 shown, the gas generation module 1 includes: a liquid storage tank 11 and a second temperature control unit 12; the liquid storage tank 11 is used for storing liquid raw materials; the second temperature control unit 12 is at least partially disposed around the liquid storage tank 11; the second temperature control unit 12 is used for heating the liquid raw materials.
[0058] Among them, the liquid storage tank 11 is used for storing liquid raw materials, and the second temperature control unit 12 is used for controlling the heating of the liquid raw materials stored in the liquid storage tank 11, so that the liquid raw materials stored in the liquid storage tank 11 can be vaporized into a target gas, so that the target gas can be transported to the inlet 201 of the gas control module 2 through the outlet 101 of the gas generation module 1, and can further be transported to the inlet end 31 of the gas transmission pipeline 3 through the outlet 202 of the gas control module 2, so as to transport the target gas to the coating chamber through the gas transmission pipeline 3, so as to meet the gas requirements of the vacuum coating process. Exemplarily, the second temperature control unit 12 can be a heating tape, and the heating tape can be at least partially disposed around the liquid storage tank 11 to realize uniform heating of the liquid raw materials stored in the liquid storage tank 11. In addition, the outside of the gas generation module 1 can also be wrapped with heat insulation cotton to reduce heat dissipation and maintain the temperature stability of the liquid raw materials stored in the liquid storage tank 11.
[0059] Optionally, the gas generation module 1 further includes a second temperature detection unit 13; the second temperature detection unit 13 is used for obtaining the temperature of the liquid raw materials in the liquid storage tank 11; the controller 4 is further respectively connected to the second temperature control unit 12 and the second temperature detection unit 13; the controller 4 is further used for controlling the heating power when the second temperature control unit 12 heats the liquid raw materials according to the temperature of the liquid raw materials obtained by the second temperature detection unit 13, so that the temperature of the target gas in the gas buffer pipeline 21 is greater than the temperature of the liquid raw materials in the liquid storage tank 11.
[0060] Among them, the second temperature detection unit 13 is used for detecting the temperature of the liquid raw materials stored in the liquid storage tank 11. Exemplarily, the second temperature detection unit 13 can be a thermocouple, and the second temperature detection unit 13 can be disposed in the liquid storage tank 11. At the same time, the controller 4 is further respectively connected to the second temperature control unit 12 and the second temperature detection unit 13, so that the controller 4 can also generate a control signal through PID calculation according to the temperature of the liquid raw materials obtained by the second temperature detection unit 13, and control the solid state relay through pulse width modulation, so as to adjust the duty cycle of the energization time of the second temperature control unit 12, so as to adjust the heating power when the second temperature control unit 12 heats the liquid raw materials stored in the liquid storage tank 11, so as to realize the adjustment of the heating temperature of the liquid raw materials.
[0061] Exemplarily, when the controller 4 determines that the temperature of the liquid raw material stored in the liquid storage tank 11 obtained by the second temperature detection unit 13 is lower than the preset liquid temperature range, it indicates that the gas supply volume of the gas supply device is insufficient. The controller 4 can increase the heating power of the heating tape by increasing the duty cycle of the energization time of the heating tape, thereby increasing the temperature of the liquid raw material stored in the liquid storage tank 11, increasing the saturated vapor pressure of the liquid raw material, and thus improving the gasification efficiency of the liquid raw material, avoiding the condensation of the target gas into droplets, and increasing the gas supply volume of the target gas; when the controller 4 determines that the temperature of the liquid raw material stored in the liquid storage tank 11 obtained by the second temperature detection unit 13 is higher than the preset liquid temperature range, it indicates that the gas supply volume of the gas supply device is excessive. The controller 4 can reduce the heating power of the heating tape by reducing the duty cycle of the energization time of the heating tape, thereby reducing the temperature of the liquid raw material stored in the liquid storage tank 11, reducing the saturated vapor pressure of the liquid raw material, and thus slowing down the gasification efficiency of the liquid raw material, reducing the gas supply volume of the target gas, and avoiding excessive gas supply. By dynamically adjusting the temperature of the liquid raw material stored in the liquid storage tank 11, the dynamic balance between the gas supply volume of the gas supply device and the requirements of the vacuum coating process is achieved, improving the stability of the gas supply and the uniformity of the vacuum coating process. Exemplarily, the preset liquid temperature range of the liquid raw material stored in the liquid storage tank 11 can be between 35°C and 45°C.
[0062] In addition, the controller 4 can also control the heating power when the first temperature control unit 22 heats the target gas in the gas buffer pipeline 21 and the heating power when the second temperature control unit 12 heats the liquid raw material respectively, so that the temperature of the target gas in the gas buffer pipeline 21 is higher than the temperature of the liquid raw material stored in the liquid storage tank 11. Exemplarily, when the controller 4 adjusts the temperature of the liquid raw material to 40°C within the preset liquid temperature range by controlling the heating power when the second temperature control unit 12 heats the liquid raw material, the controller 4 can also control the heating power when the first temperature control unit 22 heats the target gas in the gas buffer pipeline 21 to adjust the temperature of the target gas to 45°C within the preset gas temperature range. By controlling the temperature of the target gas in the gas buffer pipeline 21 to be higher than the temperature of the liquid raw material stored in the liquid storage tank 11, it is ensured that the temperature of the target gas is always higher than its gasification temperature. Since a higher temperature corresponds to a higher saturated vapor pressure, it can effectively prevent the target gas from condensing into droplets, and at the same time can further gasify the droplets that have not been completely evaporated in the target gas, effectively reducing the droplets entrained in the target gas, thereby improving the gas supply stability of the gas supply device and the uniformity of the vacuum coating process.
[0063] Optionally, continue to refer to Figure 3, the gas transmission pipeline 3 includes a main transmission pipeline 301 and at least one branch transmission pipeline 302; the intake end 3011 of the main transmission pipeline 301 is communicated with the outlet 202 of the gas control module 2, and the outlet end 3012 of the main transmission pipeline 301 is respectively communicated with each branch transmission pipeline 302; the gas supply device further includes a gas flow control module 5 corresponding to each branch transmission pipeline 302 one by one; the gas flow control module 5 is correspondingly arranged in the branch transmission pipeline 302, and the gas flow control module 5 is used to control the gas flow of the target gas transported through the branch transmission pipeline 302.
[0064] Specifically, the gas transmission pipeline 3 includes a main transmission pipeline 301 and one or more branch transmission pipelines 302, and the intake end 3011 of the main transmission pipeline 301 is communicated with the outlet 202 of the gas control module 2, and the outlet end 3012 of the main transmission pipeline 301 is respectively communicated with each branch transmission pipeline 302, so that the target gas can be transported from the outlet 202 of the gas control module 2 to the intake end 3011 of the main transmission pipeline 301, and further transported from the outlet end 3012 of the main transmission pipeline 301 to each branch transmission pipeline 302, so as to transport the target gas to the coating chamber through each branch transmission pipeline 302, thereby meeting the gas requirements of the vacuum coating process. By setting a plurality of branch transmission pipelines 302, the target gas can be transported simultaneously through each branch transmission pipeline 302, avoiding the pressure and flow fluctuations of the target gas during single-path gas supply, thereby improving the gas supply stability and the uniformity of the vacuum coating process. It can be understood that a third temperature detection unit and a third temperature control unit can be arranged in the gas transmission pipeline 3 according to actual needs to detect and adjust the temperature of the target gas in the gas transmission pipeline 3 to ensure the gas supply stability. The outside of the gas transmission pipeline 3 can be wrapped with heat-insulating cotton to maintain the temperature stability of the target gas in the gas transmission pipeline 3. It can also be understood that the controller 4 can further control the heating power when heating the target gas in the gas transmission pipeline 3 by controlling the third temperature control unit, so that the temperature of the target gas in the gas transmission pipeline 3 is higher than the temperature of the target gas in the gas control module 2, so as to further prevent the target gas from condensing into droplets, effectively reducing the droplets entrained in the target gas transported to the gas flow control module 5, and improving the gas supply stability of the gas supply device and the uniformity of the vacuum coating process.
[0065] In addition, the gas supply device further includes a gas flow control module 5 corresponding to each branch transmission pipeline 302 one by one, and the gas flow control module 5 is correspondingly arranged in the branch transmission pipeline 302, that is, the number of gas flow control modules 5 is the same as the number of branch transmission pipelines 302, so that the gas flow control module 5 can respectively control the gas flow of the target gas conveyed through each branch transmission pipeline 302, thereby being able to adjust the gas flow of the target gas conveyed through each branch transmission pipeline 302 in real time according to the requirements of the vacuum coating process, so that the gas supply device can adapt to a variety of process scenarios, and the flexibility and stability of the gas supply device are improved.
[0066] Optionally, continuing to refer to Figure 3 , the gas flow control module 5 includes a mass flow controller 51 and / or a gas valve 52.
[0067] Specifically, the gas flow control module 5 may include a mass flow controller 51 and / or a gas valve 52. When the gas flow control module 5 includes both a mass flow controller 51 and a gas valve 52 at the same time, the mass flow controller 51 may be arranged on the side of the gas valve 52 close to the gas control module 3, or the mass flow controller 51 may be arranged on the side of the gas valve 52 close to the coating chamber. The position setting method of the mass flow controller 51 and the gas valve 52 can be determined according to actual needs, and the present invention does not make specific limitations on this.
[0068] Among them, the mass flow controller 51 is used to control the mass flow of the target gas in the gas transmission pipeline 3 to ensure that the target gas can be conveyed to the coating chamber at a preset mass flow. Exemplarily, the mass flow controller 51 may include a mass flow sensor, a proportional valve, and a control circuit inside, so that the mass flow controller 51 can adjust the opening of the proportional valve according to the preset mass flow of the target gas conveyance and the real-time mass flow of the target gas detected by the flow sensor, and precisely control the mass flow of the target gas conveyed to the coating chamber to ensure that the mass flow of the target gas conveyed to the coating chamber is not affected by temperature and pressure fluctuations, ensuring the stability of the vacuum coating process. It can also be understood that the temperature and pressure of the target gas in the gas control module 2 are controlled by the controller 4, so that the target gas can be conveyed to the mass flow controller 51 within a constant pressure range, ensuring the flow stability of the target gas conveyed to the mass flow controller 51, and at the same time avoiding the failure shutdown caused by the target gas entraining droplets into the mass flow controller 51, extending the service life of the mass flow controller 51 and the stability of the gas supply device.
[0069] The gas valve 52 is used to control the on / off state of the branch transmission pipeline 302, so that the gas valve 52 can control the on / off state of the branch transmission pipeline 302 in real time according to the temperature of the liquid raw material stored in the liquid storage tank 11, the pressure of the target gas in the gas buffer pipeline 21, and the temperature of the target gas in the gas buffer pipeline 21. Exemplarily, when the controller 4 determines that the pressure of the target gas is within the preset pressure range according to the pressure of the target gas obtained by the first pressure detection unit 23, determines that the temperature of the target gas is within the preset gas temperature range according to the temperature of the target gas obtained by the first temperature detection unit 24, and determines that the temperature of the liquid raw material stored in the liquid storage tank 11 is within the preset liquid temperature range according to the temperature of the liquid raw material stored in the liquid storage tank 11 obtained by the second temperature detection unit 13, the controller 4 can control the gas valve 52 to open, so that the target gas can be transported to the coating chamber through the gas transmission pipeline 3, realizing that the target gas can be transported within a constant pressure range and temperature range, thereby realizing the dynamic balance between the gas supply volume of the gas supply device and the demand of the vacuum coating process, and improving the stability of the gas supply and the uniformity of the vacuum coating process.
[0070] In addition, when the pressure of the target gas is not within the preset pressure range, the temperature of the target gas is not within the preset gas temperature range, or the temperature of the liquid raw material is not within the preset liquid temperature range, the controller 4 can control the gas valve 52 to close, and adjust the pressure of the target gas, the temperature of the target gas, or the temperature of the liquid raw material by controlling the heating power of the first temperature control unit 22 when heating the target gas and the heating power of the second temperature control unit 12 when heating the liquid raw material respectively. After the pressure of the target gas is adjusted to within the preset pressure range, the temperature of the target gas is adjusted to within the preset gas temperature range, and the temperature of the liquid raw material is adjusted to within the preset liquid temperature range, the controller 4 controls the gas valve 52 to open again, thereby ensuring the flow stability of the target gas transported to the coating chamber, avoiding the target gas from carrying liquid droplets into the coating chamber, and improving the stability and reliability of the gas supply device.
[0071] Based on the same inventive concept, the embodiment of the present invention also provides a coating device, as Figure 4 shown, the coating device includes the gas supply device in the above embodiment and a coating chamber 6; the coating chamber 6 is communicated with the outlet end 32 of the gas transmission pipeline 3 of the gas supply device.
[0072] Among them, the coating chamber 6 can be specifically understood as a relatively sealed vacuum chamber, which is used to deposit target gas on the surface of the substrate in a vacuum environment to form a functional thin film. Specifically, the coating chamber 6 is communicated with the outlet end 32 of the gas transmission pipeline 3 of the gas supply device. The vacuum environment in the coating chamber 6 makes the air pressure in the coating chamber 6 relatively low, and the pressure in the gas control module 2 is higher than that in the coating chamber 6. This pressure difference drives the target gas to flow from the gas control module 2 through the gas transmission pipeline 3 to the coating chamber 6, so that the target gas can pass through the gas generation module 1, the gas control module 2 and the gas transmission pipeline 3 in sequence and be transmitted to the coating chamber 6 to meet the gas requirements of the vacuum coating process in the coating chamber 6.
[0073] The above-mentioned coating equipment can be supplied with gas by using the gas supply device provided in any embodiment of the present invention, and has the corresponding structure and beneficial effects of the gas supply device. For technical details not described in detail in this embodiment, reference can be made to the gas supply device provided in any embodiment of the present invention.
[0074] Since the above-mentioned coating equipment can be supplied with gas by using the gas supply device provided in any embodiment of the present invention, based on the gas supply device described in the embodiment of the present invention, those skilled in the art can understand the specific implementation manner and various variations of the coating equipment in this embodiment. Therefore, the details of how the coating equipment uses the gas supply device provided in any embodiment of the present invention to supply gas will not be described in detail here. As long as those skilled in the art implement a coating equipment that uses the gas supply device provided in any embodiment of the present invention to supply gas, it falls within the scope of protection of this application.
[0075] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in the present invention can be achieved. No limitations are imposed herein.
[0076] The above specific implementation manners do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.
Claims
1. A gas supply device, characterized in that, Comprising: A gas generation module, a gas control module, a gas transmission pipeline, and a controller; The gas generation module is used to store a liquid raw material and convert the liquid raw material into a target gas; The inlet of the gas control module is communicated with the outlet of the gas generation module; the outlet of the gas control module is communicated with the inlet end of the gas transmission pipeline; The controller is at least connected to the gas control module; the controller is used to control the temperature and / or pressure of the target gas in the gas control module to control the gas volume of the target gas transmitted into the gas transmission pipeline.
2. The gas supply device according to claim 1, characterized in that, The gas control module includes a gas buffer pipeline, a first temperature control unit, and a first pressure detection unit; The inlet end of the gas buffer pipeline is communicated with the outlet of the gas generation module; the outlet end of the gas buffer pipeline is communicated with the inlet end of the gas transmission pipeline; The first temperature control unit is at least partially arranged around the gas buffer pipeline; the first temperature control unit is used to heat the target gas in the gas buffer pipeline; The first pressure detection unit is used to obtain the pressure of the target gas in the gas buffer pipeline; The controller is respectively connected to the first temperature control unit and the first pressure detection unit; the controller is used to control the heating power when the first temperature control unit heats the target gas in the gas buffer pipeline according to the pressure of the target gas obtained by the first pressure detection unit.
3. The air supply device according to claim 2, characterized in that, The gas control module further includes a first temperature detection unit; The first temperature detection unit is used to obtain the temperature of the target gas in the gas buffer pipeline; The controller is also connected to the first temperature detection unit; the controller is also used to control the heating power when the first temperature control unit heats the target gas in the gas buffer pipeline according to the temperature of the target gas obtained by the first temperature detection unit.
4. The air supply device according to claim 2, characterized in that The gas buffer pipeline includes a spiral pipeline.
5. The air supply device according to claim 1, characterized in that, Further comprising: A throttle valve and a filter; The throttle valve is arranged at the inlet of the gas control module; The filter is arranged between the inlet of the gas control module and the outlet of the gas generation module.
6. The air supply device according to claim 1, characterized in that, The gas generation module includes a liquid storage tank and a second temperature control unit; The liquid storage tank is used to store the liquid raw material; The second temperature control unit is at least partially arranged around the liquid storage tank; the second temperature control unit is used to heat the liquid raw material.
7. The air supply device according to claim 6, wherein The gas generation module further includes a second temperature detection unit; The second temperature detection unit is used to obtain the temperature of the liquid raw material in the liquid storage tank; The controller is also respectively connected to the second temperature control unit and the second temperature detection unit; the controller is also used to control the heating power when the second temperature control unit heats the liquid raw material according to the temperature of the liquid raw material obtained by the second temperature detection unit, so that the temperature of the target gas in the gas buffer pipeline is higher than the temperature of the liquid raw material in the liquid storage tank.
8. The gas supply device according to claim 1, characterized in that Further comprising: The gas transmission pipeline includes a main transmission pipeline and at least one branch transmission pipeline; The air inlet end of the main transmission pipeline is communicated with the air outlet of the gas control module, and the air outlet end of the main transmission pipeline is respectively communicated with each branch transmission pipeline; The gas supply device further includes a gas flow control module corresponding to each branch transmission pipeline; The gas flow control module is correspondingly arranged in the branch transmission pipeline, and the gas flow control module is used to control the gas flow of the target gas transported through the branch transmission pipeline.
9. The gas supply device according to claim 8, characterized in that The gas flow control module includes a mass flow controller and / or a gas valve.
10. A coating device, characterized in that, Comprising: The gas supply device as described in any one of claims 1-9 and a coating chamber; The coating chamber is communicated with the air outlet end of the gas transmission pipeline of the gas supply device.