Nickel plating equipment capable of eliminating burrs on surface of nickel-plated product

Abstract

The invention discloses nickel plating equipment capable of eliminating burrs on the surface of a nickel plating product, the nickel plating equipment comprises an electroplating bath, a power supply, an electrode bar arranged in the electroplating bath and communicated with the power supply, and a hanger arranged on the electrode bar, the side part of the electroplating bath is provided with an overflow tank, the overflow tank is connected with the lower part of the electroplating bath through a pump, the bottom of the electroplating bath is provided with a filter screen, and the filter screen is connected with the electroplating bath through a pump. An adsorption tank communicated with the filter screen is arranged below the electroplating tank, and a magnet is arranged in the adsorption tank. The magnet in the adsorption tank can timely clean nickel flowers in a plating solution in the electroplating tank, burrs on the surface of a nickel-plated product are eliminated, the production quality of the nickel-plated product is improved, manpower and material resources can be saved, and the electroplating cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of electroplating, and particularly to a nickel plating device capable of eliminating burrs on the surface of nickel-plated products. Background Art

[0002] Electroplating refers to a surface processing method in which, in a salt solution containing the metal to be plated, the substrate metal to be plated is used as the cathode, and through the electroplating action, cations of the metal to be plated in the plating solution are deposited on the surface of the substrate metal to form a coating. Electroplating equipment is required in the electroplating process. Generally, electroplating equipment includes an electroplating tank, a power supply, electrode rods disposed in the electroplating tank and connected to the power supply, and hangers disposed on the electrode rods. When the power supply is energized, electroplating is performed on the products to be electroplated suspended on the hangers. Currently, during the nickel plating process, many fine nickel particles are generated in the plating solution in the electroplating tank. Usually, in order to make the nickel plating uniform, the plating solution is kept in a flowing state, thus forming nickel flowers. The nickel flowers will impact the electroplated products on the hangers, causing burrs on the surface of the electroplated products, which greatly affects the production quality of the electroplated products. Subsequently, the nickel particles become more and more numerous and larger, and normal electroplating cannot be carried out. Only the entire plating solution needs to be replaced, which greatly wastes manpower and material resources and increases the electroplating cost. Summary of the Invention

[0003] In order to solve the technical problems existing in the prior art, the purpose of the present application is to provide a nickel plating device capable of eliminating burrs on the surface of nickel-plated products, which can timely clean the nickel flowers in the plating solution, eliminate burrs on the surface of nickel-plated products, improve the production quality of nickel-plated products, and can save manpower and material resources and reduce the electroplating cost.

[0004] To solve the above-mentioned existing technical problems, the purpose of the present application is achieved by adopting the following technical solutions: A nickel plating device capable of eliminating burrs on the surface of nickel-plated products, including an electroplating tank, a power supply, electrode rods disposed in the electroplating tank and connected to the power supply, and hangers disposed on the electrode rods. An overflow tank is provided on the side of the electroplating tank. The overflow tank is connected to the lower part of the electroplating tank through a pump. A filter screen is provided at the bottom of the electroplating tank. An adsorption tank communicated with the filter screen is provided below the electroplating tank. A magnet is provided in the adsorption tank.

[0005] Preferably, the adsorption tank includes a horizontal tank disposed at the bottom of the electroplating tank and the overflow tank, and a vertical tank disposed on the side of the electroplating tank or the overflow tank. The horizontal tank and the vertical tank are communicated to form an L-shaped structure. The top of the vertical tank is open. A first lifting wire is provided on one side of the magnet located in the vertical tank. The first lifting wire is pulled to pull the magnet out from the top opening of the vertical tank.

[0006] Preferably, a second lifting wire is provided on the other side of the magnet. The second lifting wire is pulled to pull the magnet into the vertical tank from the top opening.

[0007] Preferably, the second lifting wire is made of a spring rope.

[0008] Preferably, the structure between the adsorption tank and the electroplating tank is detachable, and a plug board is arranged above the filter screen in the electroplating tank.

[0009] Preferably, a handle is arranged on the outer side of the plug board.

[0010] Preferably, a confluence tank is arranged below the electroplating tank, and the adsorption tank is inserted into the confluence tank.

[0011] Preferably, a handle is arranged on the outer side of the adsorption tank.

[0012] Preferably, the aperture of the filter screen gradually increases from the middle to both sides.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] The nickel plating equipment adopting the above technical scheme can eliminate burrs on the surface of nickel-plated products. The magnet in the adsorption tank can timely clean nickel flakes in the plating solution in the electroplating tank, eliminate burrs on the surface of nickel-plated products, improve the production quality of nickel-plated products, and can save manpower and material resources and reduce electroplating costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of Embodiment 1 of the present invention;

[0016] Figure 2 is a use state diagram of Embodiment 1 of the present invention;

[0017] Figure 3 is a schematic structural diagram of the electroplating tank in Embodiment 1 of the present invention;

[0018] Figure 4 is a top view of the electroplating tank in Embodiment 1 of the present invention;

[0019] Figure 5 is a schematic structural diagram of Embodiment 2 of the present invention;

[0020] Figure 6 is a use state diagram of Embodiment 2 of the present invention;

[0021] Figure 7 is a schematic structural diagram of Embodiment 3 of the present invention;

[0022] Figure 8 is a use state diagram of Embodiment 3 of the present invention;

[0023] Figure 9 is a schematic structural diagram of the electroplating tank in Embodiment 3 of the present invention;

[0024] Figure 10The top view of the electroplating bath in the third embodiment of the present invention;

[0025] Figure 11 The structural schematic diagram of the fourth embodiment of the present invention;

[0026] Figure 12 The usage state diagram of the fourth embodiment of the present invention;

[0027] Figure 13 The structural schematic diagram of the electroplating bath in the fourth embodiment of the present invention;

[0028] Figure 14 The top view of the electroplating bath in the fourth embodiment of the present invention;

[0029] Figure 15 The cross-sectional view of the filter screen in the sixth embodiment of the present invention;

[0030] In the figure: 1, electroplating bath; 2, power supply; 3, electrode rod; 4, hanging tool; 5, overflow tank; 6, pump; 7, filter screen; 8, adsorption tank; 81, horizontal tank; 82, vertical tank; 9, magnet; 91, first lifting wire; 92, second lifting wire; 10, plug board; 11, handle; 12, collecting tank; 13, handle. Specific embodiments

[0031] Next, in combination with the accompanying drawings and specific embodiments, the present application will be further described. It should be noted that on the premise of no conflict, the following described embodiments or technical features can be combined arbitrarily to form new embodiments.

[0032] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0033] Embodiment 1:

[0034] As Figures 1 to 4 shown, a nickel plating device capable of eliminating burrs on the surface of nickel-plated products includes an electroplating bath 1, a power supply 2, an electrode rod 3 arranged in the electroplating bath 1 and connected to the power supply 2, a hanging tool 4 arranged on the electrode rod 3. An overflow tank 5 is provided on the side of the electroplating bath 1, and the overflow tank 5 is connected to the lower part of the electroplating bath 1 through a pump 6. A filter screen 7 is provided at the bottom of the electroplating bath 1, and an adsorption tank 8 communicated with the filter screen 7 is provided below the electroplating bath 1, and a magnet 9 is arranged in the adsorption tank 8.

[0035] The overflow tank 5 and the pump 6 are adopted to enable the plating solution to be recycled and flow from bottom to top. The pump 6 controls the slow flow of the plating solution, ensuring the uniformity of nickel plating. During the slow upward flow of the plating solution, fine nickel particles sink downward and enter the adsorption tank 8 through the filter screen 7. The magnet 9 in the adsorption tank 8 can timely adsorb the nickel particles, so that the plating solution no longer contains nickel flakes, which can eliminate the burrs on the surface of the nickel-plated products and improve the production quality of the nickel-plated products. And as long as the plating solution concentration is maintained by normal liquid addition, normal nickel plating can be carried out without the need to replace the entire plating solution after shutdown, which can save manpower and material resources and reduce the electroplating cost. The nickel particles adsorbed on the magnet 9 can also be recycled to reduce resource waste.

[0036] The adsorption tank 8 includes a horizontal tank 81 provided at the bottoms of the electroplating tank 1 and the overflow tank 5, and a vertical tank 82 provided at the side of the electroplating tank 1 or the overflow tank 5. The horizontal tank 81 and the vertical tank 82 are connected to form an L-shaped structure. The top of the vertical tank 82 is open. A first lifting wire 91 is provided on one side of the magnet 9 located in the vertical tank 82. The first lifting wire 91 is pulled to pull the magnet 9 out from the top opening of the vertical tank 82. Since the adsorption tank 8 is connected to the electroplating tank 1, and the adsorption tank 8 is formed by connecting the horizontal tank 81 and the vertical tank 82 to form an L-shaped structure to keep the plating solution in the adsorption tank 8 at the same level as that in the electroplating tank 1, the top of the vertical tank 82 is open, and the first lifting wire 91 pulls the magnet 9 out from the opening for recycling the nickel particles adsorbed on the magnet 9, which is convenient for cleaning. After cleaning, the magnet 9 can be put back.

[0037] For pulling the first lifting wire 91, an electric motor can be used for winding to realize the automated operation of pulling.

[0038] Embodiment 2:

[0039] As Figure 5 and Figure 6 shown, based on Embodiment 1, a second lifting wire 92 is provided on the other side of the magnet 9. The second lifting wire 92 is pulled to pull the magnet 9 into the top opening of the vertical tank 82. Compared with Embodiment 1, after the first lifting wire 91 pulls out the magnet 9 for cleaning, the second lifting wire 92 directly pulls the magnet 9 back into place, which is convenient and practical. In this structure, the first lifting wire 91 is threaded through the end of the horizontal tank 81, and the end of the horizontal tank 81 is in a sealed state. There may be liquid leakage when pulling the first lifting wire 91. An elastic sealing ring can be provided at the threaded interface to avoid liquid leakage.

[0040] Furthermore, the second lifting wire 92 is made of a spring rope. The spring rope is directly connected to the inner side of the end of the horizontal tank 81. There is no need to pull the first lifting wire 91 anymore. Relying on the elastic force of the spring rope, the magnet 9 is returned to its position. There is no threaded interface and no need to add a sealing ring, so the manufacturing cost is low.

[0041] For pulling the second lifting wire 92, a motor can be used for winding to achieve automated pulling operation.

[0042] Embodiment 3:

[0043] As Figures 7 to 10 shown, a nickel plating device capable of removing burrs on the surface of nickel-plated products includes an electroplating tank 1, a power supply 2, an electrode rod 3 disposed in the electroplating tank 1 and connected to the power supply 2, and a hanger 4 disposed on the electrode rod 3. An overflow tank 5 is provided on the side of the electroplating tank 1. The overflow tank 5 is connected to the lower part of the electroplating tank 1 through a pump 6. A filter screen 7 is provided at the bottom of the electroplating tank 1. An adsorption tank 8 communicated with the filter screen 7 is provided below the electroplating tank 1. A magnet 9 is provided in the adsorption tank 8. The adsorption tank 8 and the electroplating tank 1 are of a detachable structure. An insertion plate 10 is provided above the filter screen 7 in the electroplating tank 1.

[0044] In actual work, fine nickel particles in the plating solution sink downward and enter the adsorption tank 8 through the filter screen 7. The magnet 9 in the adsorption tank 8 can timely adsorb the nickel particles. When it is necessary to clean the magnet 9, first push the insertion plate 10 in to seal the bottom of the electroplating tank 1, and then detach the adsorption tank 8 from the electroplating tank 1 to clean the magnet 9 in the adsorption tank 8. After cleaning, assemble the adsorption tank 8 and the electroplating tank 1 and pull out the insertion plate 10. During the whole process, there is no need to stop production, which can ensure the normal progress of electroplating. A small amount of plating solution will leak out from the bottom of the electroplating tank 1 during this process, which has little impact.

[0045] Further, a handle 11 is provided on the outer side of the insertion plate 10. Pull the insertion plate 10 through the handle 11 to realize the opening and closing of the bottom of the electroplating tank 1, which is convenient to use. An elastic sealing ring can be provided at the socket of the insertion plate 10 and the electroplating tank 1 to avoid liquid leakage. For the movement of the insertion plate 10, a cylinder can be used to push the handle 11 to achieve automated pushing operation, reduce manual operation, and eliminate potential safety hazards.

[0046] Embodiment 4:

[0047] As Figures 11 to 14 shown, based on Embodiment 3, a confluence tank 12 is provided below the electroplating tank 1, and the adsorption tank 8 is inserted into the confluence tank 12. The adsorption tank 8 is inserted into the confluence tank 12, and the confluence tank 12 plays a supporting role for the adsorption tank 8. When it is necessary to clean the magnet 9 in the adsorption tank 8, close the insertion plate 10, and then the adsorption tank 8 can be pulled out from the confluence tank 12 to clean the magnet 9. At this time, part of the leaked liquid at the bottom of the electroplating tank 1 will flow into the confluence tank 12, and the leaked liquid can be recycled. Compared with Embodiment 3, it is more environmentally friendly and energy-saving.

[0048] Further, a handle 13 is provided outside the adsorption tank 8. This facilitates pulling the adsorption tank 8 out of the confluence tank 12, which is convenient and practical. For pulling the adsorption tank 8, a cylinder can be used to push the handle 13 to achieve automated pushing operation, reducing manual operation and eliminating potential safety hazards.

[0049] Embodiment Five:

[0050] Reference Figures 11 to 14 , based on Embodiment Four, in order to prevent the adsorption tank 8 from leaking liquid, a detachable structure is provided between the confluence tank 12 and the electroplating tank 1. After closing the plug plate 10 and disassembling the confluence tank 12, the adsorption tank 8 is then pulled out of the confluence tank 12. The overflowing plating solution on the adsorption tank 8 enters the confluence tank 12, which can effectively collect the leaked liquid and avoid contamination.

[0051] Embodiment Six:

[0052] As Figure 15 shown, based on all the above embodiments, the aperture of the filter screen 7 gradually increases from the middle to both sides. Due to the flow action of the plating solution, larger nickel particles will be pushed towards the edge of the electroplating tank 1, increasing the aperture on both sides of the filter screen 7 to facilitate the larger nickel particles to fall into the adsorption tank 8. Otherwise, the nickel particles on both sides will accumulate more and more and cannot pass through the filter screen and enter the adsorption tank 8 downward.

[0053] The above embodiments are only the preferred embodiments of the present application and cannot be used to limit the scope of protection of the present application. Any non-substantial changes and substitutions made by those skilled in the art based on the present application belong to the scope of protection required by the present application.

Claims

1. A nickel plating device capable of removing burrs on the surface of nickel-plated products, comprising an electroplating tank (1), a power supply (2), an electrode rod (3) disposed in the electroplating tank (1) and connected to the power supply (2), and a hanger (4) disposed on the electrode rod (3), characterized in that: An overflow tank (5) is provided on the side of the electroplating tank (1). The overflow tank (5) is connected to the lower part of the electroplating tank (1) by a pump (6). A filter screen (7) is provided at the bottom of the electroplating tank (1). An adsorption tank (8) communicating with the filter screen (7) is provided below the electroplating tank (1). A magnet (9) is provided in the adsorption tank (8).

2. The nickel plating equipment capable of removing burrs on the surface of nickel-plated products according to claim 1, wherein: The adsorption tank (8) includes a horizontal tank (81) provided at the bottom of the electroplating tank (1) and the overflow tank (5), and a vertical tank (82) provided on the side of the electroplating tank (1) or the overflow tank (5). The horizontal tank (81) and the vertical tank (82) communicate to form an L-shaped structure. The top of the vertical tank (82) is open. A first lifting wire (91) is provided on one side of the magnet (9) located in the vertical tank (82). The magnet (9) is pulled out through the top opening of the vertical tank (82) by pulling the first lifting wire (91).

3. The nickel plating equipment capable of eliminating burrs on the surface of nickel-plated products according to claim 2, characterized in that: A second lifting wire (92) is provided on the other side of the magnet (9). The magnet (9) is pulled into the vertical tank (82) through the top opening by pulling the second lifting wire (92).

4. The nickel plating equipment capable of eliminating burrs on the surface of nickel-plated products according to claim 3, characterized in that: The second lifting wire (92) is made of a spring rope.

5. The nickel plating equipment capable of removing burrs on the surface of nickel-plated products according to claim 1, characterized in that: The structure between the adsorption tank (8) and the electroplating tank (1) is detachable. A plug board (10) is provided above the filter screen (7) in the electroplating tank (1).

6. The nickel plating equipment capable of removing burrs on the surface of nickel-plated products according to claim 5, characterized in that: A handle (11) is provided on the outside of the plug board (10).

7. The nickel plating equipment capable of eliminating burrs on the surface of nickel-plated products according to claim 5, characterized in that: A confluence tank (12) is provided below the electroplating tank (1). The adsorption tank (8) is inserted into the confluence tank (12).

8. The nickel plating equipment capable of eliminating burrs on the surface of nickel-plated products according to claim 7, characterized in that: A handle (13) is provided on the outside of the adsorption tank (8).

9. The nickel plating equipment capable of removing burrs on the surface of nickel-plated products according to claim 1, wherein: The aperture of the filter screen (7) gradually increases from the middle to both sides.

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