Thermotechnical automation instrument testing device

Abstract

The invention relates to the technical field of instrument inspection, in particular to a thermotechnical automation instrument testing device, which comprises a main body component, a tester, a display arranged on the tester, a controller arranged on the tester, an inner base plate arranged in the tester and a regulator arranged in the tester; the positioning part comprises a bottom assembly arranged on the inner base plate, a supporting assembly arranged on the bottom assembly, a positioning assembly arranged on the supporting assembly, an adsorption assembly arranged on one side of the bottom assembly and a rotating assembly arranged on one side of the adsorption assembly; automatic adjustment can be carried out according to instruments of different shapes and sizes, the stability of the assembled instruments is improved, the first connecting plate and the second connecting plate can be in butt joint, the butt joint effect of lines is guaranteed, and the situation of detection errors caused by gaps or dislocation is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of instrument inspection, and particularly to a thermal automation instrument test device. Background Art

[0002] Thermal instruments mainly include: pressure gauges, pressure transmitters, differential pressure transmitters, pressure calibrators, thermal signal calibrators, in-situ thermometers, thermal resistors, thermocouples, liquid level transmitters, temperature transmitters, pressure sensors, liquid level transmitters, liquid level gauges, intelligent digital display meters, flashing alarm devices, paperless recorders, flow calculators, pressure calibration devices, temperature calibration devices, etc. After leaving the factory or after maintenance, thermal instruments need to be automatically tested and calibrated using an automatic inspection tester.

[0003] Currently, due to the large variety of thermal instruments, they are usually installed using a simple fixing method and then connected through wires. However, existing test devices require selecting different plug-in wires for different thermal instruments, and the simple installation method cannot fix instruments with different shapes and sizes. If a targeted installation method is adopted, the process will be complex, making the connection of wires and the fixing method of instruments cumbersome, and it is easy to cause short circuits due to unstable assembly of the instruments. Summary of the Invention

[0004] In view of the problem in the above-mentioned prior art that a simple installation method cannot fix instruments with different shapes and sizes, and a targeted installation method will lead to a complex process, making the connection of wires and the fixing method of instruments cumbersome, the present invention is proposed.

[0005] Therefore, the purpose of the present invention is to provide a thermal automation instrument test device.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: including a main body component, which includes a tester, a display disposed on the tester, a controller disposed on the tester, an inner cushion plate disposed in the tester, and a regulator disposed in the tester; a positioning component, which includes a bottom component disposed on the inner cushion plate, a support component disposed on the bottom component, a positioning component disposed on the support component, an adsorption component disposed on one side of the bottom component, and a rotating component disposed on one side of the adsorption component; a connection component, which includes a connection component disposed under the regulator, an upward movement component disposed under the connection component, a fixing component disposed on the inner cushion plate, and an adjustment component disposed on the fixing component.

[0007] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the bottom assembly includes a base disposed on an inner backing plate, a chassis is fixedly connected to the upper side of the base, and a limiting chute is formed on the upper side of the chassis; wherein, the limiting chute is annularly arranged.

[0008] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the support assembly includes a bushing clamped on the upper side of the chassis, a limiting block is fixedly connected to the inner side wall of the bushing, an inner cylinder is sleeved inside the bushing, a limiting groove is formed on the outer surface of the inner cylinder, connection holes are formed on both the upper side and the lower side of the outer surface of the inner cylinder, a guiding groove is formed on the outer surface of the inner cylinder, and a connecting head is fixedly connected to the outer surface of the bushing; wherein, the connection hole communicates with the inner cylinder, and the limiting block is slidably connected with the limiting groove.

[0009] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the positioning assembly includes an adsorption shell disposed on the guiding groove, a through hole is formed on the side wall of the adsorption shell, and an elastic telescopic rod is fixedly connected to the side wall of the adsorption shell; wherein, the adsorption shell communicates with the adsorption shell, and the adsorption shell is slidably connected with the guiding groove.

[0010] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the adsorption assembly includes a sealing cylinder disposed on the side wall of the base, a piston plate is slidably connected inside the sealing cylinder, and a sleeve is clamped on the side wall of the piston plate; wherein, one end of the sealing cylinder is connected to the connecting head through a pipeline.

[0011] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the rotating assembly includes a lead screw disposed on the side wall of the sealing cylinder, one end of the lead screw passes through a nut and is fixedly connected to a handle, and mounting blocks are fixedly connected to both sides of the nut; wherein, the lead screw penetrates through the nut and is threadedly connected with the nut.

[0012] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the connecting assembly includes a first connecting plate disposed under the regulator, and a docking cylinder is fixedly connected to the side wall of the first connecting plate.

[0013] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the upward movement assembly includes a second connecting plate disposed under the first connecting plate, metal sheets are fixedly connected to both the side walls of the second connecting plate and the first connecting plate, and a movable groove is formed on the side wall of the second connecting plate.

[0014] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the fixing component includes a support arranged on the upper side of the inner backing plate, a bracket is fixedly connected to the upper side of the support, a first mounting frame is fixedly connected to the side wall of the first connecting plate, a connecting piece is placed in the movable groove, and a second mounting frame is fixedly connected to the side wall of the connecting piece.

[0015] As a preferred embodiment of the thermal automation instrument test device of the present invention, wherein: the adjusting component includes a rotating shaft arranged on the side wall of the bracket, a gear is fixedly connected to the side wall of the rotating shaft, a first toothed plate is fixedly connected to the side wall of the second mounting frame, and a second toothed plate is fixedly connected to the side wall of the first mounting frame; wherein, the first toothed plate is meshed with the gear, and the second toothed plate is meshed with the gear.

[0016] The beneficial effects of the thermal automation instrument test device of the present invention: By setting the positioning component, it can be automatically adjusted according to instruments of different shapes and sizes, and by setting the connecting component, the first connecting plate and the second connecting plate can be docked to ensure the docking effect of the circuit, solving the problem that a simple installation method cannot meet the fixation of instruments of different shapes and sizes, and a targeted installation method will lead to complex processes, making the connection of the circuit and the fixation method of the instrument more cumbersome, achieving the effect of avoiding instability when assembling instruments of different sizes and shapes, improving the stability after assembly, and avoiding detection errors due to gaps or misalignments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic diagram of the overall thermal automation instrument test device.

[0019] Figure 2 It is a schematic diagram of the overall thermal automation instrument test device.

[0020] Figure 3 It is a schematic diagram of the positioning component of the thermal automation instrument test device.

[0021] Figure 4 It is a schematic cross-sectional structure diagram of the thermal automation instrument test device.

[0022] Figure 5 For Figure 4 The enlarged view at A in

[0023] Figure 6 It is a schematic diagram of the overall connection components of a thermal automation instrument test device.

[0024] Figure 7 It is a schematic diagram of the overall connection components of a thermal automation instrument test device.

[0025] In the figure: 100, main body component; 101, tester; 102, display; 103, controller; 104, inner backing plate; 105, regulator; 200, positioning component; 201, bottom component; 201a, base; 201b, chassis; 201c, limit sliding groove; 202, support component; 202a, bushing; 202b, limit block; 202c, inner cylinder; 202d, limit groove; 202e, connection hole; 202f, guiding groove; 202g, connection head; 203, positioning component; 203a, adsorption shell; 203b, through hole; 203c, elastic telescopic rod; 204, adsorption component; 204a, sealing cylinder; 204b, piston plate; 204c, sleeve; 205, rotating component; 205a, lead screw; 205b, mounting block; 205c, nut; 300, connection component; 301, connection assembly; 301a, first connecting plate; 301b, docking cylinder; 302, upward movement component; 302a, second connecting plate; 302b, metal sheet; 302c, movable groove; 303, fixing component; 303a, support; 303b, bracket; 303c, first mounting frame; 303d, connecting piece; 303e, second mounting frame; 304, adjusting component; 304a, rotating shaft; 304b, gear; 304c, first toothed plate; 304d, second toothed plate. Detailed implementation manners

[0026] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention in conjunction with the accompanying drawings of the specification.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0028] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation manner of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it an embodiment that is separate from or mutually exclusive of other embodiments.

[0029] Embodiment 1

[0030] Refer toFigures 1 to 5 , which is the first embodiment of the present invention. This embodiment provides a thermal automation instrument test device, which includes a main body component 100, comprising a tester 101, a display 102 arranged on the tester 101, a controller 103 arranged on the tester 101, an inner backing plate 104 arranged inside the tester 101, and a regulator 105 arranged inside the tester 101; a positioning component 200, comprising a bottom component 201 arranged on the inner backing plate 104, a support component 202 arranged on the bottom component 201, a positioning component 203 arranged on the support component 202, an adsorption component 204 arranged on one side of the bottom component 201, and a rotation component 205 arranged on one side of the adsorption component 204; a connection component 300, comprising a connection component 301 arranged under the regulator 105, an upward movement component 302 arranged under the connection component 301, a fixing component 303 arranged on the inner backing plate 104, and an adjustment component 304 arranged on the fixing component 303.

[0031] Specifically, the tester 101 is fixedly connected to the display 102, the inner wall of the tester 101 is fixedly connected to the inner backing plate 104, and the tester 101 is fixedly connected to the controller 103.

[0032] Further, the bottom component 201 includes a base 201a disposed on the inner backing plate 104. A chassis 201b is fixedly connected to the upper side of the base 201a, and a limiting chute 201c is formed on the upper side of the chassis 201b. Among them, the limiting chute 201c is annularly arranged. The support component 202 includes a bushing 202a clamped on the upper side of the chassis 201b. A limiting block 202b is fixedly connected to the inner side wall of the bushing 202a. An inner cylinder 202c is sleeved inside the bushing 202a. A limiting groove 202d is formed on the outer surface of the inner cylinder 202c. Connecting holes 202e are formed on both the upper side and the lower side of the outer surface of the inner cylinder 202c. A guiding groove 202f is formed on the outer surface of the inner cylinder 202c. A connecting head 202g is fixedly connected to the outer surface of the bushing 202a. Among them, the connecting hole 202e communicates with the inner cylinder 202c, and the limiting block 202b is slidably connected to the limiting groove 202d. The positioning component 203 includes an adsorption shell 203a disposed on the guiding groove 202f. A through hole 203b is formed on the side wall of the adsorption shell 203a. An elastic telescopic rod 203c is fixedly connected to the side wall of the adsorption shell 203a. Among them, the adsorption shell 203a communicates with the adsorption shell 203a, and the adsorption shell 203a is slidably connected to the guiding groove 202f. The adsorption component 204 includes a sealing cylinder 204a disposed on the side wall of the base 201a. A piston plate 204b is slidably connected inside the sealing cylinder 204a. A sleeve 204c is clamped on the side wall of the piston plate 204b. Among them, one end of the sealing cylinder 204a is connected to the connecting head 202g through a pipeline. The rotating component 205 includes a lead screw 205a disposed on the side wall of the sealing cylinder 204a. One end of the lead screw 205a passes through a nut 205c and is fixedly connected to a grip. Installation blocks 205b are fixedly connected to both sides of the nut 205c. Among them, the lead screw 205a passes through the nut 205c and is threadedly connected to the nut 205c.

[0033] It should be noted that the base 201a is fixedly connected to the inner backing plate 104. The bottom end of the elastic telescopic rod 203c is slidably connected inside the limiting chute 201c. The adsorption shell 203a communicates with the upper connecting hole 202e through the through hole 203b. A plurality of positioning components 203 are provided, and the plurality of positioning components 203 are annularly arrayed. A plurality of connecting holes 202e are provided, and the plurality of connecting holes 202e are annularly arrayed. The inner cylinder 202c communicates with the bushing 202a and the connecting head 202g through the lower connecting hole 202e. The nut 205c is fixedly connected to one side of the inner wall of the tester 101 through the installation block 205b.

[0034] In use, place the instrument on the adsorption housing 203a, then rotate the grip to drive the screw rod 205a to rotate. When the screw rod 205a rotates within the nut 205c, it extracts the gas in the sealing cylinder 204a by means of threaded movement, so that the part of the instrument in contact with the adsorption housing 203a will be adsorbed and fixed above the inner cylinder 202c and the adsorption housing 203a. And for the adsorption housing 203a that does not move down due to the shape of the instrument, its through hole 203b will be located above the connection hole 202e. After fixation, the inner cylinder 202c can be rotated, so that the inner cylinder 202c rotates within the bushing 202a, enabling the device to adsorb and fix the instrument by rotating the screw rod 205a during use, allowing for automatic adjustment according to instruments of different shapes and sizes, avoiding instability during the assembly of instruments of different sizes and shapes, and improving the stability of the device after assembly.

[0035] In summary, through the cooperation of the bottom assembly 201, the support assembly 202, the positioning assembly 203, the adsorption assembly 204 and the rotating assembly 205, it is possible to automatically adjust according to instruments of different shapes and sizes, achieving the effect of improved stability after assembly.

[0036] Embodiment 2

[0037] Refer to Figures 2 to 7 , which is the second embodiment of the present invention. Different from the previous embodiment, this embodiment provides a thermal automation instrument test device, which includes a connection component 301 including a first connection plate 301a disposed on the lower side of the regulator 105, and a docking cylinder 301b fixedly connected to the side wall of the first connection plate 301a; a lifting component 302 including a second connection plate 302a disposed on the lower side of the first connection plate 301a, metal sheets 302b fixedly connected to the side walls of both the second connection plate 302a and the first connection plate 301a, and a movable groove 302c opened on the side wall of the second connection plate 302a.

[0038] Specifically, the first connection plate 301a is fixedly connected to the regulator 105, the second connection plate 302a is fixedly connected to the support 303a, there are multiple metal sheets 302b, and the second connection plate 302a is located directly below the first connection plate 301a.

[0039] Further, the fixing component 303 includes a support 303a disposed on the upper side of the inner backing plate 104. A bracket 303b is fixedly connected to the upper side of the support 303a. A first mounting bracket 303c is fixedly connected to the side wall of the first connecting plate 301a. A connecting piece 303d is placed in the movable groove 302c. A second mounting bracket 303e is fixedly connected to the side wall of the connecting piece 303d. The adjusting component 304 includes a rotating shaft 304a disposed on the side wall of the bracket 303b. A gear 304b is fixedly connected to the side wall of the rotating shaft 304a. A first toothed plate 304c is fixedly connected to the side wall of the second mounting bracket 303e. A second toothed plate 304d is fixedly connected to the side wall of the first mounting bracket 303c. Among them, the first toothed plate 304c is meshed and connected with the gear 304b, and the second toothed plate 304d is meshed and connected with the gear 304b.

[0040] Specifically, the support 303a is fixedly connected to the inner backing plate 104. Through the first toothed plate 304c, the second toothed plate 304d and the gear 304b, when the first connecting plate 301a moves downward, the connecting piece 303d can push the circuit upward under the action of the first toothed plate 304c, the second toothed plate 304d and the gear 304b.

[0041] During use, in cooperation with Embodiment 1, after the instrument is adsorbed and fixed, the circuit of the instrument needs to be placed above the second connecting plate 302a. At this time, the length of the circuit needs to be adjusted to ensure that the metal exposed part of the circuit is located in the connecting piece 303d and the movable groove 302c on the second connecting plate 302a. Then, the controller 103 is used to start the regulator 105, so that while the regulator 105 moves downward, it pushes the first connecting plate 301a downward. When the first connecting plate 301a moves downward, the first mounting bracket 303c will drive the first toothed plate 304c downward. Since the first toothed plate 304c is meshed and connected with the gear 304b, when the first toothed plate 304c moves downward, it will push the gear 304b to rotate under the action of the rotating shaft 304a. And because the second toothed plate 304d is meshed and connected with the gear 304b, when the gear 304b rotates, it will drive the second toothed plate 304d upward to lift the circuit located in the movable groove 302c. When the first connecting plate 301a and the second connecting plate 302a are completely combined, the connecting piece 303d will push the circuit to complete the docking with the first connecting plate 301a and the second connecting plate 302a, ensuring that when the instrument is powered on and detected through the connection on one side of the first connecting plate 301a, short circuits are not likely to occur, so that the device can ensure the docking effect of the circuit and avoid detection errors caused by gaps or misalignments.

[0042] In summary, through the cooperation of the connecting component 301, the upward moving component 302, the fixing component 303 and the adjusting component 304, the first connecting plate 301a and the second connecting plate 302a can be docked, ensuring the docking effect of the circuit and achieving the effect of avoiding detection errors caused by gaps or misalignments.

[0043] Embodiment 3

[0044] Refer to Figures 1 to 7 , which is the third embodiment of the present invention. Different from the previous embodiment, this embodiment provides a thermal automation instrument test device, which includes the following test steps:

[0045] Step 1: When in use, the chemical instrument to be detected needs to be placed above the positioning component 203. Rotate the screw rod 205a through the rotating handle to adsorb and fix the instrument. Subsequently, rotate the instrument so that the exposed position of its circuit faces left, and then place the circuit in the upward moving component 302. At this time, the height of the regulator 105 can be adjusted through the controller 103, so as to connect and detect the circuit of the instrument after docking.

[0046] Step 2: When placing the instrument on the positioning component 203, the grip can be rotated. When the screw rod 205a rotates in the nut 205c, the gas in the sealing cylinder 204a is extracted by means of screw movement, so that the connector 202g connected to the sealing cylinder 204a synchronously extracts the gas in the inner cylinder 202c. At this time, the adsorption shell 203a pressed down by the weight of the instrument will move downward accordingly. The downward moving adsorption shell 203a will be connected to the connection hole 202e through the through hole 203b, so that the part of the instrument in contact with the adsorption shell 203a will be adsorbed and fixed above the inner cylinder 202c and the adsorption shell 203a. For the adsorption shell 203a that does not move downward due to the shape of the instrument, its through hole 203b will be located above the connection hole 202e, and the upper connection hole 202e will also be blocked by the adsorption shell 203a, being in a relatively sealed state. After fixation, the inner cylinder 202c can be rotated so that the inner cylinder 202c rotates in the bushing 202a.

[0047] Step 3: After the instrument is assembled with the positioning component 203, the wires of the instrument need to be placed above the second connecting plate 302a. At this time, the length of the wires needs to be adjusted to ensure that the metal-exposed parts of the wires are located within the connecting piece 303d and the movable slot 302c on the second connecting plate 302a. Subsequently, the regulator 105 can be activated through the controller 103, causing the regulator 105 to move downward while pushing the first connecting plate 301a downward. When the first connecting plate 301a moves downward, the first toothed plate 304c will move downward synchronously, causing the gear 304b to rotate. The second toothed plate 304d3 will move upward driven by the gear 304b, thereby lifting the wires located within the movable slot 302c. When the first connecting plate 301a and the second connecting plate 302a are completely merged, the connecting piece 303d will push the wires to complete the docking with the first connecting plate 301a and the second connecting plate 302a.

[0048] It is important to note that the construction and arrangement of the present application shown in multiple different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who refer to this disclosure should easily understand that many modifications are possible without substantially departing from the novel teachings and advantages of the subject matter described in this application (for example, the dimensions, scales, structures, shapes, and proportions of various components, as well as parameter values (such as temperature, pressure, etc.), installation arrangements, use of materials, color, orientation changes, etc.). For example, an element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature, number, or position of discrete elements can be changed or altered. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "means-plus-function" clause is intended to cover the structure that performs the recited function herein, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present invention. Therefore, the present invention is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.

[0049] In addition, to provide a concise description of the exemplary embodiments, not all features of the actual embodiments may be described (i.e., those features that are not relevant to the currently considered best mode of implementing the present invention or those features that are not relevant to implementing the present invention).

[0050] It should be understood that, during the development of any actual implementation, such as in any engineering or design project, numerous specific implementation decisions can be made. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, without undue experimentation, the development efforts will be routine work of design, fabrication, and production.

[0051] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A thermal automation instrument test device, characterized in that: including, a main body component (100), including a tester (101), a display (102) disposed on the tester (101), a controller (103) disposed on the tester (101), an inner backing plate (104) disposed inside the tester (101), and a regulator (105) disposed inside the tester (101); a positioning component (200), including a bottom assembly (201) disposed on the inner backing plate (104), a support assembly (202) disposed on the bottom assembly (201), a positioning assembly (203) disposed on the support assembly (202), a suction assembly (204) disposed on one side of the bottom assembly (201), and a rotating assembly (205) disposed on one side of the suction assembly (204); a connecting component (300), including a connecting assembly (301) disposed on the lower side of the regulator (105), an upward movement assembly (302) disposed on the lower side of the connecting assembly (301), a fixing assembly (303) disposed on the inner backing plate (104), and an adjusting assembly (304) disposed on the fixing assembly (303).

2. The thermal automation instrument test device according to claim 1, characterized in that: The bottom assembly (201) includes a base (201a) disposed on the inner backing plate (104), a chassis (201b) fixedly connected to the upper side of the base (201a), and a limit sliding groove (201c) opened on the upper side of the chassis (201b); wherein, the limit sliding groove (201c) is annularly arranged.

3. The thermal automation instrument test device according to claim 2, characterized in that: The support assembly (202) includes a bushing (202a) clamped on the upper side of the chassis (201b), a limit block (202b) fixedly connected to the inner side wall of the bushing (202a), an inner cylinder (202c) sleeved inside the bushing (202a), a limit groove (202d) opened on the outer surface of the inner cylinder (202c), connecting holes (202e) opened on both the upper side and the lower side of the outer surface of the inner cylinder (202c), a guiding groove (202f) opened on the outer surface of the inner cylinder (202c), and a connecting head (202g) fixedly connected to the outer surface of the bushing (202a); wherein, the connecting hole (202e) communicates with the inner cylinder (202c), and the limit block (202b) is slidably connected with the limit groove (202d).

4. The thermal automation instrument test device according to claim 3, characterized in that: The positioning assembly (203) includes a suction shell (203a) disposed on the guiding groove (202f), a through hole (203b) opened on the side wall of the suction shell (203a), and an elastic telescopic rod (203c) fixedly connected to the side wall of the suction shell (203a); wherein, the suction shell (203a) communicates with the suction shell (203a), and the suction shell (203a) is slidably connected with the guiding groove (202f).

5. The thermal automation instrument test device according to claim 4, characterized in that: The suction assembly (204) includes a sealing cylinder (204a) disposed on the side wall of the base (201a), a piston plate (204b) slidably connected inside the sealing cylinder (204a), and a sleeve (204c) clamped on the side wall of the piston plate (204b); One end of the sealing cylinder (204a) is connected to the connector (202g) through a pipeline.

6. The thermal automation instrument test device according to claim 5, characterized in that: The rotating assembly (205) includes a lead screw (205a) arranged on the side wall of the sealing cylinder (204a). One end of the lead screw (205a) passes through a nut (205c) and is fixedly connected to a grip. Installation blocks (205b) are fixedly connected to both sides of the nut (205c). The lead screw (205a) passes through the nut (205c) and is in threaded connection with the nut (205c).

7. The thermal automation instrument test device according to claim 6, characterized in that: The connection assembly (301) includes a first connecting plate (301a) arranged on the lower side of the regulator (105). A docking cylinder (301b) is fixedly connected to the side wall of the first connecting plate (301a).

8. The thermal automation instrument test device according to claim 7, characterized in that: The upward movement assembly (302) includes a second connecting plate (302a) arranged on the lower side of the first connecting plate (301a). Metal sheets (302b) are fixedly connected to the side walls of the second connecting plate (302a) and the first connecting plate (301a). An activity groove (302c) is formed in the side wall of the second connecting plate (302a).

9. The thermal automation instrument test device according to claim 8, wherein: The fixing assembly (303) includes a support (303a) arranged on the upper side of the inner backing plate (104). A bracket (303b) is fixedly connected to the upper side of the support (303a). A first mounting bracket (303c) is fixedly connected to the side wall of the first connecting plate (301a). A connecting piece (303d) is placed in the activity groove (302c). A second mounting bracket (303e) is fixedly connected to the side wall of the connecting piece (303d).

10. The thermal automation instrument test device according to claim 9, wherein: The adjusting assembly (304) includes a rotating shaft (304a) arranged on the side wall of the bracket (303b). A gear (304b) is fixedly connected to the side wall of the rotating shaft (304a). A first toothed plate (304c) is fixedly connected to the side wall of the second mounting bracket (303e). A second toothed plate (304d) is fixedly connected to the side wall of the first mounting bracket (303c). The first toothed plate (304c) is in meshing connection with the gear (304b), and the second toothed plate (304d) is in meshing connection with the gear (304b).

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