Multispectral chip assembly, electronic equipment and spectral calculation method

Abstract

The invention provides a multispectral chip assembly, electronic equipment and a spectrum calculation method. The multispectral chip assembly comprises a photosensitive chip and a filter layer, the photosensitive chip is used for acquiring light rays of different wavebands to obtain spectral information of each channel, different channels correspond to the spectral information of different wavebands, the filter layer is arranged outside the photosensitive chip, the filter layer is located on a photosensitive path of the photosensitive chip, and the filter layer is located on the photosensitive path of the photosensitive chip. Therefore, the filter layer can filter the light entering the photosensitive chip. According to the multispectral chip assembly, the manufacturing process of the light filtering layer is simplified, the manufacturing difficulty of the light filtering layer is reduced, the manufacturing cost of the light filtering layer is reduced, the manufacturing process difficulty of the multispectral chip assembly is further reduced, and the cost of the multispectral chip assembly is reduced.

Description

Technical Field

[0001] This application relates to the field of multispectral technology, and particularly to a multispectral chip component, an electronic device, and a spectral calculation method. Background Art

[0002] Multispectral chips have the advantages of small size, light weight, low power consumption, and rapid analysis, and thus have a wide range of applications in the field of spectral analysis. It can be used in fields such as spectral imaging, spectral sensing, chemical analysis, biomedical detection, etc., providing a new solution for real-time monitoring and rapid analysis.

[0003] The process of multispectral chips in related technologies is relatively complex, resulting in high costs. Summary of the Invention

[0004] Embodiments of this application provide a multispectral chip component, an electronic device, and a spectral calculation method.

[0005] In a first aspect, embodiments of this application provide a multispectral chip component, including:

[0006] A photosensitive chip, configured to obtain light of different bands to obtain spectral information of each channel, where different channels correspond to spectral information of different bands;

[0007] A filter layer, disposed outside the photosensitive chip, and the filter layer is located on the light sensing path of the photosensitive chip, so that the filter layer can filter the light entering the photosensitive chip.

[0008] In one embodiment, the filter layer is spaced apart from the photosensitive chip, or the filter layer is disposed on the outer surface of the photosensitive chip.

[0009] In one embodiment, the filter layer is detachably connected to the photosensitive chip.

[0010] In one embodiment, the photosensitive chip includes photosensitive units, and the multispectral chip component further includes a protective layer, the protective layer is disposed between the filter layer and the photosensitive units, and the orthographic projection of the photosensitive units on the protective layer is located within the orthographic projection of the filter layer on the protective layer; and / or,

[0011] The filter layer includes filter units, and the size of the filter units is larger than the size of the photosensitive units; and / or,

[0012] The filter layer includes filter units, the photosensitive chip includes a plurality of photosensitive units, and the plurality of photosensitive units are disposed opposite to the filter units, and the filter units are configured to filter the light entering the plurality of photosensitive units.

[0013] In one embodiment, the photosensitive chip includes photosensitive units, the filter layer includes filter units, the filter units and the photosensitive units correspond to each other one by one, the filter units are located on the photosensitive path of the photosensitive units, wherein the filter units filter the light entering the photosensitive units and allow light of at least two different wavelength bands to pass through.

[0014] In a second aspect, an embodiment of the present application provides an electronic device, including the above-mentioned multispectral chip assembly.

[0015] In one embodiment, the electronic device further includes a Fresnel lens, the Fresnel lens is disposed on one side of the photosensitive chip, and the Fresnel lens is located on the photosensitive path of the photosensitive chip.

[0016] In one embodiment, the filter layer is located between the Fresnel lens and the photosensitive chip; or,

[0017] The Fresnel lens is located between the photosensitive chip and the filter layer.

[0018] In one embodiment, the electronic device includes a housing, the photosensitive chip is installed in the housing, the photosensitive chip includes photosensitive units, and the filter layer is detachably connected to the housing so that the filter layer can be switched between a first position and a second position. Wherein, in the first position, the filter layer is located on the photosensitive path of the photosensitive units, and in the second position, the filter layer is disposed at an interval from the photosensitive path of the photosensitive units.

[0019] In a second aspect, an embodiment of the present application provides a spectral calculation method based on the above-mentioned multispectral chip assembly. The multispectral chip assembly includes corresponding photosensitive units and filter units one by one. The photosensitive units are used to obtain light of different wavelength bands to obtain spectral information of each channel. Wherein, different channels correspond to spectral information of different wavelength bands. The filter units filter the light entering the photosensitive units, and the filter units can transmit light of a wavelength band set. The wavelength band set includes at least two different wavelength bands. The method includes:

[0020] Obtain the actual distance between the photosensitive unit and the object to be measured;

[0021] Based on the actual distance and the database, determine the proportion of light of different wavelength bands in the wavelength band set;

[0022] Wherein, the database includes the proportion of light of different wavelength bands in the wavelength band set when the photosensitive unit and the object to be measured are at different distances.

[0023] The beneficial effects of the embodiments of the present application:

[0024] In an embodiment of the present application, the photosensitive chip can acquire spectral information of different bands corresponding to different channels for spectral imaging. The filter layer can then filter the light entering the photosensitive chip, allowing light of a specific band to enter the photosensitive chip.

[0025] The filter layer is arranged outside the photosensitive chip, that is, the filter layer does not need to be encapsulated within the photosensitive chip and is independently arranged relative to the photosensitive chip. Further, when manufacturing a multispectral chip component, the filter layer can be manufactured separately, and its size is not limited by the photosensitive chip, which is conducive to simplifying the manufacturing process of the filter layer, reducing the manufacturing difficulty of the filter layer, reducing the manufacturing cost of the filter layer, thereby reducing the manufacturing process difficulty of the multispectral chip component, reducing the cost of the multispectral chip component, accelerating the iteration speed of the multispectral chip, and shortening the R & D cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0027] Figure 1 is one of the schematic structural diagrams of the multispectral chip component provided by the embodiment of the present application;

[0028] Figure 2 is another schematic structural diagram of the multispectral chip component provided by the embodiment of the present application;

[0029] Figure 3 is the schematic structural diagram of the filter unit provided by the embodiment of the present application;

[0030] Figure 4 is the schematic structural diagram of the first pixel structure provided by the embodiment of the present application;

[0031] Figure 5 is the schematic structural diagram of the second pixel structure provided by the embodiment of the present application;

[0032] Figure 6 is the schematic exploded view of the structure of the multispectral chip component provided by the embodiment of the present application;

[0033] Figure 7 is the schematic diagram of the light band arrangement of a twelve-channel multispectral chip of the related art provided by the embodiment of the present application;

[0034] Figure 8 is the schematic diagram of the pixel arrangement provided by the embodiment of the present application;

[0035] Figure 9It is a flowchart of the spectral calculation method provided by the embodiments of the present application.

[0036] Description of the reference numerals in the drawings:

[0037] 1. Photosensitive chip; 2. Filter layer; 3. Protective layer; 4. First pixel structure; 5. Second pixel structure; 6. Fresnel lens; 7. Lens; 8. Ranging unit; 11. Photosensitive unit; 21. Filter unit; 211. First filter film; 212. Second filter film. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used to explain and illustrate the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the orientation words such as "upper" and "lower" usually refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the drawings; and "inner" and "outer" refer to the outline of the device.

[0039] Next, in conjunction with Figures 1 to 8 Describe the multi-spectral chip component, electronic device and spectral calculation method of the present application. Figure 2 、 Figure 4 and Figure 5 The letters in Figure 2 represent different bands. For example, in

[0040] According to the embodiments of the first aspect of the present application, as Figure 1 , the multi-spectral chip component includes:

[0041] A photosensitive chip 1, configured to obtain light of different bands to obtain spectral information of each channel, where different channels correspond to spectral information of different bands;

[0042] A filter layer 2, disposed outside the photosensitive chip 1, and the filter layer 2 is located on the light-sensitive path of the photosensitive chip 1, so that the filter layer 2 can filter the light entering the photosensitive chip 1.

[0043] For the multi-spectral chip component according to the embodiments of the present application, the photosensitive chip 1 can obtain spectral information of different bands corresponding to different channels to facilitate spectral imaging, and the filter layer 2 can filter the light entering the photosensitive chip 1, so that light of a specific band enters the photosensitive chip 1.

[0044] The filter layer 2 is arranged outside the photosensitive chip 1, that is, the filter layer 2 does not need to be encapsulated in the photosensitive chip 1, and the filter layer 2 is arranged independently of the photosensitive chip 1. Further, when manufacturing the multispectral chip component, the filter layer 2 can be manufactured separately, and the size of the filter layer 2 is not limited by the photosensitive chip 1, which is beneficial to simplifying the manufacturing process of the filter layer 2, reducing the manufacturing difficulty of the filter layer 2, reducing the manufacturing cost of the filter layer 2, and further reducing the manufacturing process difficulty of the multispectral chip component, reducing the cost of the multispectral chip component, accelerating the iteration speed of the multispectral chip, and shortening the R & D cycle.

[0045] It can be understood that in the multispectral chip in the related art, generally, the photosensitive unit 11 and the filter unit 21 are concentrated inside the chip together, so that the photosensitive unit 11 and the filter unit 21 correspond one by one, and the size of the filter unit 21 is greatly limited, resulting in higher requirements for the processing accuracy of the filter unit 21, greater processing difficulty, complex process, and higher cost. In this application, the filter layer 2 is independent of the photosensitive chip 1, and the size of the filter layer 2 in this application can be larger than the size of the filter layer 2 in the related art, that is, the filter unit 21 in this application can be larger than the filter unit 21 of the multispectral chip in the related art, effectively reducing the requirements for the processing accuracy of the filter unit 21 and the filter layer 2, reducing the processing difficulty, and being beneficial to the process simplification and cost reduction of the multispectral chip component.

[0046] It can be understood that in the multispectral chip in the related art, generally, the photosensitive unit 11 and the filter unit 21 are concentrated inside the chip together, so it is difficult to replace the filter unit 21. In this application, the filter layer 2 is arranged outside the photosensitive chip 1, which is convenient for replacing the filter unit 21 and the filter layer 2. By replacing the filter layer 2 that transmits different wavelengths of light and quantities, multispectral imaging with different quantities and wavelengths can be realized, which is beneficial to quickly realizing product iteration and expansion.

[0047] In some embodiments, the filter layer 2 and the photosensitive chip 1 are arranged at intervals.

[0048] It can be understood that arranging the filter layer 2 and the photosensitive chip 1 at intervals makes the filter layer 2 independent of the photosensitive chip 1, so that the size of the filter layer 2 is not limited by the photosensitive chip 1, which is beneficial to simplifying the manufacturing process of the filter layer 2, reducing the manufacturing difficulty of the filter layer 2, reducing the manufacturing cost of the filter layer 2, and further reducing the manufacturing process difficulty of the multispectral chip component and the cost of the multispectral chip component.

[0049] In some embodiments, the filter layer 2 is arranged on the outer surface of the photosensitive chip 1.

[0050] It can be understood that connecting the filter layer 2 to the outer surface of the photosensitive chip 1 enables the filter layer 2 to be independent of the photosensitive chip 1 while also allowing the filter layer 2 and the photosensitive chip 1 to be connected together, ensuring the integration and structural compactness of the multi-spectral chip assembly.

[0051] In some embodiments, the filter layer 2 is detachably connected to the photosensitive chip 1.

[0052] It can be understood that if the filter layer 2 is detachably connected to the photosensitive chip 1, it is convenient for the disassembly and assembly of the filter layer 2, and thus convenient for replacing the filter layer 2. By replacing the filter layer 2 that transmits different wavelengths and amounts of light, multi-spectral imaging with different numbers and wavelengths can be achieved, which is beneficial for quickly realizing product iteration and expansion.

[0053] In some embodiments, the photosensitive chip 1 includes photosensitive units 11, and the multi-spectral chip assembly further includes a protective layer. The protective layer is disposed between the filter layer and the photosensitive units, and the orthographic projection of the photosensitive units 11 on the protective layer is located within the orthographic projection of the filter layer 2 on the protective layer.

[0054] It can be understood that if the orthographic projection of the photosensitive units 11 on the protective layer is located within the orthographic projection of the filter layer 2 on the protective layer, it ensures that the light entering the photosensitive units 11 will first pass through the filter layer 2, guaranteeing the filtering effect of the filter layer 2.

[0055] In some embodiments, such as Figure 2 , the filter layer 2 includes filter units 21, and the size of the filter units 21 is larger than the size of the photosensitive units 11.

[0056] It can be understood that since the filter layer 2 is disposed outside the photosensitive chip 1 and is not restricted by the photosensitive chip 1, the size of the filter units 21 of the filter layer 2 can be larger than the size of the photosensitive units 11. On the one hand, it ensures the filtering effect of the filter units 21, and on the other hand, it can reduce the processing difficulty and cost of the filter units 21.

[0057] It should be noted that the size of the filter units can also be smaller than the size of the photosensitive units, as long as it is ensured that only the filtered wavelength band is transmitted to the photosensitive units. That is to say, light-shielding design needs to be carried out for the photosensitive channels to ensure that only the light passing through the filter units is incident on the photosensitive units and the light after the filter layer is not contaminated.

[0058] In some examples, an optical amplification device is provided between the filter units and the photosensitive units to amplify the optical signal passing through the filter units.

[0059] In some examples, a solar panel can also be used as the photosensitive chip.

[0060] In some embodiments, the filter layer 2 includes filter units 21, and the photosensitive chip 1 includes a plurality of photosensitive units 11. The plurality of photosensitive units 11 are disposed opposite to the filter units 21, and the filter units 21 are configured to filter the light entering the plurality of photosensitive units 11.

[0061] It can be understood that one filter unit 21 can simultaneously filter the light for a plurality of photosensitive units 11, that is, the plurality of photosensitive units 11 share one filter unit 21, and there is no need to separately provide a corresponding filter unit 21 for each photosensitive unit 11. Moreover, the size of the filter unit 21 is enlarged, thereby reducing the processing difficulty and cost of the multispectral chip component.

[0062] In some embodiments, such as Figure 2 , the multispectral chip component includes a pixel structure. The pixel structure includes a photosensitive chip and a filter layer. The photosensitive chip includes photosensitive units, and the filter layer 2 includes filter units 21. The filter units 21 and the photosensitive units 11 can be in one-to-one correspondence, or one filter unit 21 can correspond to a plurality of photosensitive units 11. The filter units 21 are located on the light-sensitive paths of the photosensitive units 11. Among them, the filter units 21 filter the light entering the photosensitive units 11 and allow at least two different wavelength bands of light to pass through.

[0063] It can be understood that the photosensitive units 11 can obtain spectral information of different wavelength bands corresponding to different channels for spectral imaging. The filter units 21 can filter the light entering the photosensitive units 11, so that light of more than two specific wavelength bands can pass through the filter units 21 and enter the photosensitive units 11, enabling the photosensitive units 11 corresponding to one pixel to obtain spectral information of more than two different wavelength bands. That is to say, in the present application, by setting the filter units 21 to be able to transmit light of at least two different wavelength bands, one pixel structure can simultaneously obtain spectral information of at least two different wavelength bands, reducing the physical interval between the two wavelength bands, improving the resolution, and not easily losing spectral information, which is beneficial to improving the later imaging effect.

[0064] It can be understood that in the related art, in the implementation structure of a traditional RGB sensor, each PD photosensitive unit 11 is added with 1 corresponding filter unit 21 to form 1 pixel. To obtain spectral information of the red, yellow, and blue wavelength bands, at least 3 pixel units are required. Due to the sensitivity of the human eye to green, every 4 pixels are distributed with two green filter units 21. If more wavelength bands are to be obtained, such as 12 optical wavelength band information, at least 12 pixels are required. No matter what arrangement is used, it will cause too large a physical interval between pixels of the same wavelength band or adjacent wavelength bands, resulting in too low a resolution and loss of spectral information.

[0065] For example Figure 7A 12-band spectral arrangement. The 12 different optical bands are arranged in a 4x3 format. Then, two adjacent identical channels (such as B12) are horizontally spaced by 3 other band pixel units and vertically spaced by 2 pixel units of other bands. This easily causes excessive loss of spectral information in the same band and poor imaging effect in the later stage.

[0066] For example Figure 8 , in this application, the filter unit 21 is set to be able to transmit light of at least two different bands, and a pixel unit can simultaneously obtain spectral information of multiple bands. For example, the filter unit 21 can transmit 12 bands, that is, a pixel unit can obtain 12-band information. Furthermore, there is no pixel unit spacing between two adjacent identical channels horizontally and vertically, effectively reducing the physical spacing between two bands, improving the resolution, and not easily losing spectral information, which is beneficial to improving the imaging effect in the later stage.

[0067] It can be understood that in the related art, 12 channels need to correspond to 12 pixels. That is, to implement the minimum photosensitive unit 11 of n bands, n pixel points are required. When the value of n is too large, it is easy to cause a decrease in spatial resolution. In this application, multiple channels (such as 12 channels) are integrated into one pixel. That is, when implementing the minimum photosensitive unit 11 of multiple bands, only 1 pixel point may be required, which is beneficial to improving the spatial resolution.

[0068] In some embodiments, for example Figure 3 , the filter unit 21 includes at least one first filter film 211 and at least one second filter film 212. The refractive index of the first filter film 211 is greater than that of the second filter film 212, and the first filter film 211 and the second filter film 212 are alternately arranged.

[0069] It can be understood that by alternately stacking the first filter film 211 and the second filter film 212 with different refractive indexes to form the filter unit 21, the filter unit 21 can transmit light of at least two different bands, realizing obtaining light of multiple different bands using the same filter unit 21. That is, the spectral splitting structures of multiple bands are the same. Furthermore, the filter unit 21 of this application does not require repeated etching, cleaning and other steps during preparation, the process is simple, and the cost is low.

[0070] In some examples, the present application adopts a multi-layer film technology, which is composed of alternately stacked high-refractive-index filter films (such as titanium oxides, specifically titanium oxide or titanium dioxide) and low-refractive-index filter films (such as SiO2). By combining different thicknesses of the two, the light wavebands of at least one narrow-band transmission peak can pass through the filter unit 21, so that a single filter unit 21 can transmit the light wavebands of multiple independent narrow-band transmission peaks, such as 2, 4, 7, etc. For example, 4 independent narrow-band transmission peak wavebands with central wavelengths of 450nm, 550nm, 650nm, and 750nm are realized through one filter unit 21.

[0071] It should be noted that according to the functional requirements and index parameter requirements, by adjusting the materials used for the first filter film 211 and the second filter film 212, the arrangement mode of alternately stacking high and low refractive index materials, and the thickness combination mode, the wavelength range of the transmitted narrow-band transmission peak can be made to be the central wavelength ±(1nm - 100nm), and the full width at half maximum FWHM ≤(1nm - 100nm). For example, if the central wavelength of the transmitted light is 550nm, the actual wavelength range of the transmitted narrow-band transmission peak is 550nm ±(1nm - 100nm); if the central wavelength is 450nm, the wavelength range of the narrow-band transmission peak is 450nm ±(1nm - 100nm). The crosstalk suppression between multiple narrow-band transmission peaks transmitted by the same filter unit 21 is low enough, such as the adjacent band isolation degree ≥30dB, so that the optical channel data after corresponding quantum response has sufficient independence.

[0072] In some examples, the materials of the first filter film 211 and the second filter film 212 can be any one of aluminum (Al), chromium (Cr), gold (Au), silver (Ag), silicon (Si), germanium (Ge), aluminum oxide (Al2O3), cerium oxide (CeO2), hafnium dioxide (HfO2), indium tin oxide (ITO), magnesium oxide (MgO), niobium pentoxide (Nb2O5), silicon monoxide (SiO), silicon dioxide (SiO2), titanium dioxide (TiO2), titanium trioxide (Ti3O5), tantalum pentoxide (Ta2O5), yttrium oxide (Y2O3), zinc oxide (ZnO), zirconium dioxide (ZrO2), aluminum fluoride (AlF3), magnesium fluoride (MgF2), calcium fluoride (CaF2), ytterbium fluoride (YbF3), yttrium fluoride (YF3), zinc sulfide (ZnS), and zinc selenide (ZnSe).

[0073] Specifically, the thicknesses of different first filter films 211 are different.

[0074] It can be understood that when the number of the first filter films 211 is at least two, by adjusting the thicknesses of different first filter films 211 to make the thicknesses of different first filter films 211 different, the number of light bands that can be transmitted by the filter unit 21 composed of the first filter films 211 can be changed, or the band range of the light rays that the filter unit 21 can transmit can be changed.

[0075] Specifically, the thicknesses of different second filter films 212 are different.

[0076] It can be understood that when the number of the second filter films 212 is at least two, by adjusting the thicknesses of different second filter films 212 to make the thicknesses of different second filter films 212 different, the number of light bands that can be transmitted by the filter unit 21 composed of the second filter films 212 can be changed, or the band range of the light rays that the filter unit 21 can transmit can be changed.

[0077] Specifically, the thicknesses of the first filter film 211 and the second filter film 212 are different.

[0078] It can be understood that by adjusting the thicknesses of the first filter film 211 and the second filter film 212 to make the thicknesses of the first filter film 211 and the second filter film 212 different, the number of light bands that can be transmitted by the filter unit 21 composed of the first filter film 211 and the second filter film 212 can be changed, or the band range of the light rays that the filter unit 21 can transmit can be changed.

[0079] In some examples, the thicknesses of the first filter film 211 and the second filter film 212 may also be the same.

[0080] In some embodiments, the filter unit 21 includes at least two filter regions, and different filter regions can allow light of different bands to pass through.

[0081] It can be understood that different filter regions can transmit light rays of different bands, so that the filter unit 21 can transmit at least two light rays of different bands simultaneously.

[0082] Specifically, the thicknesses of different filter regions are different.

[0083] It can be understood that by making the thicknesses of the filter media at different filter regions different, different filter regions can transmit light rays of different bands.

[0084] Specifically, the materials of different filter regions are different.

[0085] It can be understood that by making the materials of the filter media at different filter regions different, different filter regions can transmit light rays of different bands.

[0086] In some embodiments, the multispectral chip component further includes a protective layer 3 disposed between the filter unit 21 and the photosensitive unit 11.

[0087] It can be understood that the protective layer 3 can protect the photosensitive unit 11 and prevent damage to the photosensitive unit 11.

[0088] Specifically, the material of the protective layer 3 is yttrium oxide or yttrium oxide or diamond or ytterbium oxide.

[0089] It can be understood that the protective layer 3 made of yttrium oxide or yttrium oxide or diamond or ytterbium oxide material has a stable structure and can resist multiple ion beam bombardments, ensuring that the protective layer 3 can effectively and stably protect the photosensitive unit 11.

[0090] In some embodiments, such as Figure 4 and Figure 5 , the multispectral chip component includes at least two pixel structures, and the at least two pixel structures include a first pixel structure 4 and a second pixel structure 5.

[0091] In some embodiments, the filter unit 21 of the first pixel structure 4 can transmit light in the first band set, and the filter unit 21 of the second pixel structure 5 can transmit light in the second band set, and the first band set and the second band set partially overlap.

[0092] It can be understood that the filter units 21 of different pixel structures can transmit light in multiple bands, that is, different pixel structures have multiple channels. And the bands of light that the filter units 21 of different pixel structures can transmit partially overlap, indicating that different pixel structures have at least one same channel. Furthermore, different pixel structures can be connected together through the same channel. That is, when the proportional relationship of light in different bands in one pixel structure is calculated, the proportional relationship of light in different bands in different pixel structures can be further calculated, establishing a linear relationship between multiple pixels and establishing a linear relationship between spectral data in all different bands, so as to quickly achieve multi-band expansion, which is conducive to reducing the algorithm complexity of the multispectral chip.

[0093] Specifically, in the bands that the first pixel structure 4 can transmit, at least one band is the same as the bands that the second pixel structure 5 can transmit. When the component ratio of light in different bands in the first pixel structure 4 is calculated and the imaging of the first pixel structure 4 is achieved, through the common bands of the first pixel structure 4 and the second pixel structure 5, the proportional relationship between multiple bands in the first pixel structure 4 and multiple bands in the second pixel structure 5 can be known, which is conducive to the imaging of the second pixel structure 5 without separately calculating the component ratio of light in different bands in the second pixel structure 5, and is conducive to reducing the algorithm complexity of the multispectral chip.

[0094] In some examples, at each pixel point, through different thickness combinations of high and low refractive index materials, different pixel points transmit narrowband transmission peaks of different numbers and different wavelengths. For example, Figure 5 as shown, the light filtering unit 21 of the first pixel structure 4 transmits light in the bands of A1, A2, A3,......, a, and the light filtering unit 21 of the second pixel structure 5 transmits light in the bands of B1, A2, A3,......, a, where a represents a band with the same wavelength. The purpose is to establish a relationship between the gray values of pixels A and B. Figure 5 In [description], the number of light bands passed by the first pixel structure 4 and the second pixel structure 5 is not necessarily the same. For example, the first pixel structure 4 can pass through 3 bands of 430nm, 450nm, and 480nm, and the second pixel structure 5 can pass through 5 bands of 430nm, 510nm, 540nm, 590nm, and 650nm, where 430nm is the common wavelength band between the two.

[0095] In some embodiments, the first pixel structure 4 and the second pixel structure 5 are of the same structure.

[0096] It can be understood that when one pixel structure can meet the number of channels required by the multispectral chip, the first pixel structure 4 and the second pixel structure 5 can be designed to be of the same structure.

[0097] It can be understood that when the multispectral chip needs to implement An + Bn + 1 channels, the first pixel structure can implement An + 1 channels, and the second pixel structure can implement Bn + 1 channels, and the first pixel structure and the second pixel structure are associated together using the common channels. When the multispectral chip needs An + 1 or Bn + 1 channels, it means that one pixel structure can meet the requirements. Therefore, the first pixel structure 4 and the second pixel structure 5 can be directly designed to be of the same structure, which is beneficial to reducing the production difficulty and improving the production efficiency.

[0098] Exemplarily, An = Bn.

[0099] According to the embodiments of the second aspect of the present application, as Figure 6 , the electronic device includes the above multispectral chip assembly.

[0100] In some embodiments, as Figure 6 , the electronic device further includes a Fresnel lens 6. The Fresnel lens 6 is disposed on one side of the photosensitive chip 1, and the Fresnel lens 6 is located on the photosensitive path of the photosensitive chip.

[0101] It can be understood that the Fresnel lens 6 is arranged on the light-sensing path of the light-sensing chip. Since the Fresnel lens 6 has functions such as light concentration, collimation, and beam expansion, it can increase the light intensity, which is beneficial to improving indexes such as the signal-to-noise ratio, light transmittance, and channel ratio of the multi-spectral chip assembly.

[0102] Specifically, the filter layer 2 is located between the Fresnel lens 6 and the light-sensing chip 1.

[0103] It can be understood that after the light is concentrated by the Fresnel lens 6 and then transmitted to the filter layer 2, after being filtered by the filter layer 2, the light of a specific wavelength band can be transmitted to the light-sensing chip 1.

[0104] Specifically, the Fresnel lens 6 is located between the light-sensing chip 1 and the filter layer 2.

[0105] It can be understood that after the light is filtered by the filter layer 2, the light of a specific wavelength band is transmitted to the Fresnel lens 6, and then under the collimation effect of the Fresnel lens 6, the light is transmitted to the light-sensing chip 1.

[0106] In some embodiments, such as Figure 6 , the electronic device further includes a lens 7, and the lens 7 is located on the light-sensing path of the light-sensing unit 11.

[0107] Specifically, the shape of the filter layer 2 is adapted to the shape of the Fresnel lens 6.

[0108] It can be understood that the shape of the filter layer 2 is adapted to the shape of the Fresnel lens, so that the filter layer 2 and the Fresnel lens 6 can be stacked together, which is beneficial to improving the structural compactness of the electronic device.

[0109] Specifically, the shape of the filter layer 2 is adapted to the shape of the lens 7.

[0110] It can be understood that the shape of the filter layer 2 is adapted to the shape of the lens 7, so that the filter layer 2 and the lens 7 can be stacked together, which is beneficial to improving the structural compactness of the electronic device.

[0111] Specifically, the shape of the Fresnel lens 6 is adapted to the shape of the lens 7.

[0112] It can be understood that the shape of the lens 7 is adapted to the shape of the Fresnel lens, so that the lens 7 and the Fresnel lens 6 can be stacked together, which is beneficial to improving the structural compactness of the electronic device.

[0113] In some embodiments, the electronic device includes a housing, a photosensitive chip 1 is installed in the housing, the photosensitive chip includes photosensitive units, and the filter layer 2 is detachably connected to the housing so that the filter layer 2 can be switched between a first position and a second position. Wherein, in the first position, the filter layer 2 is located on the light sensing path of the photosensitive unit 11, and in the second position, the filter layer 2 is arranged at an interval from the light sensing path of the photosensitive unit 11.

[0114] It can be understood that the detachable connection of the filter layer 2 to the housing facilitates the disassembly and assembly of the filter layer 2 and the replacement of the filter layer 2. When the electronic device is in use, the filter layer 2 is installed on the housing so that the filter layer 2 is in the first position, enabling the filter layer 2 to filter the light entering the photosensitive unit 11. When the filter layer 2 needs to be replaced, the current filter layer 2 is placed in the second position, and then the new filter layer 2 is installed on the housing and placed in the first position.

[0115] According to the embodiments of the third aspect of the present application, as Figure 1 、 Figure 2 and Figure 9 , the spectral calculation method is applied to a multispectral chip component. The multispectral chip component includes corresponding photosensitive units and filter units. The photosensitive units are used to obtain light of different bands to obtain spectral information of each channel. Among them, different channels correspond to spectral information of different bands. The filter units filter the light entering the photosensitive units, and the filter units can transmit light of a band set. The band set includes at least two different bands; the method includes:

[0116] Step 101, obtain the actual distance between the photosensitive unit and the object to be measured;

[0117] It can be understood that after the light irradiates the object to be measured and is reflected by the object to be measured, the light will be transmitted to the photosensitive unit. By obtaining the actual distance between the photosensitive unit and the object to be measured, the distance of the light transmitted from the object to be measured to the photosensitive unit can be determined.

[0118] In some examples, the distance between the photosensitive unit and the object to be measured can be detected by a ranging unit 8, such as an ultrasonic ranging unit 8 or other ranging components.

[0119] Step 102, based on the actual distance and the database, determine the proportion of light of different bands in the band set;

[0120] Wherein, the database includes the proportion of light of different bands in the band set when the photosensitive unit and the object to be measured are at different distances.

[0121] It can be understood that after obtaining the actual distance between the object to be measured and the photosensitive unit, since the database stores the proportions of light in different bands in the band set when the photosensitive unit and the object to be measured are at different distances, by comparing the actual distance with the data in the database, it is possible to know the proportions of light in different bands in the band set at the current distance between the photosensitive unit and the object to be measured. Furthermore, the light in the band set can be analyzed to obtain the weights of different monochromatic light components in the mixed light, thereby realizing the decomposition of the mixed spectrum corresponding to the band set.

[0122] According to the spectral calculation method of the embodiments of the present application, the filter unit can filter the light reflected by the object to be measured. The filter unit can transmit light of at least two different bands, so that the photosensitive unit can receive light of at least two different bands. When the photosensitive unit receives light of different bands, the actual distance between the photosensitive unit and the object to be measured can be obtained, and the actual distance is compared with the database. Furthermore, the light in the band set that can be transmitted by the filter unit can be determined, that is, the proportions of light in different bands in the mixed light received by the photosensitive unit, and the decomposition of the mixed spectrum can be realized, and the proportions of the components of light in different bands in the mixed light can be determined. That is to say, the present application can enable the filter unit to transmit different lights simultaneously, so that the photosensitive unit can receive light of different bands simultaneously, and the photosensitive unit can be sensitive to light of different bands simultaneously, which is beneficial to the optimization of the multi-spectral chip.

[0123] It should be noted that when the photosensitive unit and the object to be measured are at different distances, it means that the distance between the photosensitive unit and the object to be measured is at different values. That is to say, the database includes the proportions of light in different bands in the band set when the distance between the photosensitive unit and the object to be measured is the first distance, the proportions of light in different bands in the band set when the distance between the photosensitive unit and the object to be measured is the second distance, and so on. The specific number of distances can be determined according to the actual situation.

[0124] It is understandable that in the related art, the core principle of separating different spectra from mixed light is to decompose the mixed light into monochromatic light of its component wavelengths through dispersion or filtering techniques. Common methods include prism dispersion method, diffraction grating method, interference method, fiber optic spectroscopy method, and filtering method. The prism dispersion method utilizes the different refractive indices of light with different wavelengths by a prism, causing the mixed light to disperse after passing through the prism and separating spectra of different wavelengths. This method is simple and intuitive to implement, but is only applicable to the visible light range and has poor separation effects on ultraviolet and infrared light. The diffraction grating method uses the diffraction characteristics of the grating to decompose the mixed light into spectra of different wavelengths. This method has high separation accuracy and is also applicable to a wide wavelength range, but the equipment cost is high and precise calibration is required. The interference method uses an interferometer to divide the mixed light into two beams and separates light of different wavelengths through interference fringes. This method has extremely high resolution and is applicable to complex spectral analysis, but the equipment is complex and the operation difficulty is high. The fiber optic spectroscopy method uses the combination of optical fibers and spectrometers to transmit the mixed light into the spectrometer for separation and analysis. This method is flexible and portable and is applicable to on-site detection, but is limited by the optical fiber transmission loss and has limited separation effects.

[0125] The filtering method uses an optical filter to selectively transmit light of a specific wavelength and filter out other wavelengths, and is widely applied to multispectral imaging, fluorescence detection, and optical communication. This method has strong flexibility and can also select specific wavelengths according to requirements, and is the preferred method for spectral channel separation in multispectral imaging. Therefore, based on multispectral filtering imaging, this application proposes a method for inferring the contribution ratio of single-wavelength light from mixed light, which further enriches the multispectral imaging channels while retaining the advantages of multispectral filtering imaging, realizes high-precision spectral imaging at low cost, and can be iteratively upgraded quickly and at low cost.

[0126] That is to say, in the related art, the mixed spectral decomposition technology mainly focuses on two aspects. On the one hand, based on the characteristics of light, spectral splitting is achieved through specific devices, such as light dispersion, light diffraction, light interference, etc. Such technologies have high requirements for the accuracy of the devices, and the device costs are high, making it impossible to achieve low-cost and efficient promotion and application. On the other hand, the separation of the mixed spectrum is achieved through computational methods. Common methods include the mixed spectral decomposition method based on deep learning and the mixed light decomposition system based on sparse representation. The method based on deep learning has a certain data dependence and requires a large amount of labeled data for training. The data acquisition cost is high. At the same time, the deep learning model has a large amount of computation and relatively high requirements for hardware. The mixed light decomposition method based on sparse representation does not rely on a large model, but this method is sensitive to noise, and the decomposition accuracy is easily limited, with low applicability. This application considers the advantages and disadvantages of the deep learning method and the sparse representation method, and proposes a method for inferring the contribution ratio of single wavelengths from mixed light at the algorithm level. This method is based on imaging monochromatic light and mixed light respectively. Through the imaging results of monochromatic light and mixed light, the weights of different monochromatic light components in the mixed light are calculated, thereby realizing the decomposition of the mixed spectrum. It is also possible to combine different distances and different angles as variable conditions to simulate multi-spectral imaging under different environments, extract the proportion distribution of each monochromatic light component in the mixed light under this condition, establish a mixed light decomposition model, and realize high-precision multi-spectral imaging under adaptive mixed light decomposition.

[0127] In some embodiments, after the step of determining the proportion of light of different bands in the band set, the following steps are further included:

[0128] Based on the proportion of light of different bands in the band set and the photosensitive data of the photosensitive unit, determine the photosensitive data of the light of different bands in the band set;

[0129] According to the photosensitive data of the light of different bands in the band set, determine the image result.

[0130] It can be understood that the photosensitive data of the photosensitive unit is the photosensitive data of the light of all bands in the band set. After determining the proportion of the light of different bands in the band set, the photosensitive data of the light of different bands in the band set can be determined based on the proportion of the light of different bands in the band set and the photosensitive data of the photosensitive unit. Furthermore, the image result can be determined according to the photosensitive data of the light of different bands, so that a photosensitive unit can simultaneously sense the light of different bands.

[0131] It can be understood that in the related art, a photosensitive unit can only sense light of a single band to obtain photosensitive data corresponding to the light of the single band. When the photosensitive unit receives light of two or more bands simultaneously, the photosensitive data of different bands are mixed together, making it difficult to distinguish the photosensitive data of different bands, and it will be difficult to determine the image result based on the photosensitive data of the photosensitive unit. In this application, the contribution ratio of light of different bands in the band set can be determined first, and then, based on the photosensitive data of the mixed light corresponding to the band set, the photosensitive data corresponding to the light of different bands can be determined. Furthermore, the image result can be determined based on the photosensitive data. That is to say, this application can achieve the effects of multiple photosensitive units in the related art through one photosensitive unit.

[0132] In some embodiments, the step of determining the ratio of light of different bands in the band set based on the actual distance and the database includes:

[0133] Obtain the actual incident angle of the light at the photosensitive unit;

[0134] Based on the actual distance, the actual incident angle, and the database, determine the ratio of light of different bands in the band set;

[0135] Wherein, the database includes: the ratio of light of different bands in the band set when the photosensitive unit and the object to be measured are at different distances, and the light at the photosensitive unit has different incident angles.

[0136] It can be understood that in addition to the distance between the photosensitive unit and the object to be measured having an impact on the ratio of light of different bands in the band set, the incident angle when the light reflected by the object to be measured irradiates the photosensitive unit may also have an impact on the ratio of light of different bands.

[0137] Therefore, when this application determines the ratio of light of different bands in the band set based on the actual distance and the database, it will also obtain the actual incident angle of the light at the photosensitive unit. Since the database stores the ratio of light of different bands in the band set when the photosensitive unit and the object to be measured are at different distances and the light at the photosensitive unit has different incident angles, by comparing the actual distance and the actual incident angle with the database, it is possible to know the ratio of light of different bands in the band set under the current distance between the photosensitive unit and the object to be measured and the current incident angle of the light at the photosensitive unit. Furthermore, the light in the band set can be analyzed to obtain the weights of different monochromatic light components in the mixed light, thereby realizing the decomposition of the mixed spectrum corresponding to the band set.

[0138] In some embodiments, before the step of obtaining the actual distance between the photosensitive unit and the object to be measured, it includes:

[0139] Successively obtain the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, where the mixed light includes the light of all bands in the band set;

[0140] Based on the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, determine the proportion of the light of different bands in the band set;

[0141] Store the proportion of the light of different bands in the band set and the distance between the object to be measured and the photosensitive unit in the database;

[0142] Determine that the distance between the object to be measured and the photosensitive unit has changed, and repeat the steps from successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light to the step of storing in the database.

[0143] It can be understood that when obtaining the actual distance between the photosensitive unit and the object to be measured, first construct the database. Specifically, first successively obtain the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light. According to the photosensitive data of the light of each band and the photosensitive data of the mixed light, the proportion of the light of different bands in the band set can be determined. Then store the distance between the current object to be measured and the photosensitive unit and the proportion of the light of different bands in the database. Then adjust the distance between the photosensitive unit and the object to be measured, and repeat the steps from successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light to the step of storing in the database, so as to obtain the proportion of the light of different bands corresponding to when the photosensitive unit and the object to be measured are at different distances, and store them in the database. Furthermore, the construction of the database can be realized, so as to subsequently determine the proportion of the light of different bands corresponding to the actual distance between the photosensitive unit and the object to be measured.

[0144] Exemplarily, the band set includes the light of three different bands, namely the first band, the second band, and the third band.

[0145] It can be understood that successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light means that first, the light of the first band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the light of the first band is obtained. Then, the light of the second band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the light of the second band is obtained. Then, the light of the third band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the light of the third band is obtained. Finally, the mixed light of the first band, the second band, and the third band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the mixed light is obtained. It should be noted that here is only an example to illustrate that the band set includes the light of the first band, the second band, and the third band. The band set may also include the light of two different bands, or may include the light of more than three different bands, without special limitation.

[0146] In some embodiments, the band set includes n different bands; the steps of successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light include:

[0147] Successively obtaining the photosensitive data I 11 、I 21 、......I m1 of the first band under m different light intensities, successively obtaining the photosensitive data I 12 、I 22 、......I m2 of the second band under m different light intensities,...... successively obtaining the photosensitive data I 1n 、I 2n 、......I mn of the nth band under m different light intensities;

[0148] Successively obtaining the photosensitive data I1, I2......I m of the mixed light under m different light intensities;

[0149] Based on the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, the steps of determining the proportion of the light of different bands in the band set include:

[0150] Based on formula (1) I1 = a1I 11 +a2I 12 +......+a n I 1n , formula (2) I2 = a1I 21 +a2I 22 +......+a n I 2n,...... formula (m) I2 = a1I m1 + a2I m2 +...... + a n I mn , determine the proportion of light of different bands in the band collection, where a1, a2,... a n are coefficients to be solved.

[0151] It can be understood that when sequentially obtaining the photosensitive data of the light of each band in the band collection and the photosensitive data of the mixed light, the photosensitive data of the light of the first band, the second band....., the nth band and the mixed light can be obtained first, and then the light intensity is adjusted, and the photosensitive data of the light of the first band, the second band....., the nth band and the mixed light are obtained again, and so on, until the photosensitive data of the light of the first band, the second band....., the nth band and the mixed light under m different light intensities are obtained.

[0152] It should be noted that it is also possible to first sequentially obtain the photosensitive data of the light of the first band under m different light intensities, then sequentially obtain the photosensitive data of the light of the second band under m different light intensities, and so on, until the photosensitive data of the light of the nth band under m different light intensities are obtained, and then sequentially obtain the photosensitive data of the mixed light under m different light intensities. It should be noted that the m different light intensities corresponding to the first band, the second band,..... the first n bands and the mixed light are the same.

[0153] Therefore, when determining the proportion of the light of different bands in the band collection based on the photosensitive data of the light of each band in the band collection and the photosensitive data of the mixed light, according to formula (1) I1 = a1I 11 + a2I 12 +...... + a n I 1n , formula (2) I2 = a1I 21 + a2I 22 +...... + a n I 2n ,...... formula (m) I2 = a1I m1 + a2I m2 +...... + a n I mn , determine the values of a1, a2,... a n , and then the proportion of the light of different bands in the band collection can be determined.

[0154] Exemplarily, m = n.

[0155] In some examples, the band set includes three different bands, namely the first band, the second band, and the third band, and the m different light intensities include three different light intensities, namely the first light intensity, the second light intensity, and the third light intensity.

[0156] When successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, the light intensity is maintained at the first light intensity, and then the photosensitive data of the light of the first band, the photosensitive data of the light of the second band, the photosensitive data of the light of the third band, and the photosensitive data of the mixed light are successively obtained. Then, the light intensity is adjusted to the second light intensity, and the photosensitive data of the light of the first band, the photosensitive data of the light of the second band, the photosensitive data of the light of the third band, and the photosensitive data of the mixed light are obtained again. Then, the light intensity is adjusted to the third light intensity, and the photosensitive data of the light of the first band, the photosensitive data of the light of the second band, the photosensitive data of the light of the third band, and the photosensitive data of the mixed light are obtained.

[0157] And at the first light intensity, the photosensitive data of the mixed light is composed of the photosensitive data I 11 of the light of the first band, the photosensitive data I 12 of the light of the second band, and the photosensitive data I 13 of the light of the third band. Then, the photosensitive data I1 of the mixed light = a1I 11 + a2I 12 +...... + a n I 13 ;

[0158] At the second light intensity, the photosensitive data of the mixed light is composed of the photosensitive data I 21 of the light of the first band, the photosensitive data I 22 of the light of the second band, and the photosensitive data I 23 of the light of the third band. Then, the photosensitive data I2 of the mixed light = a1I 21 + a2I 22 +...... + a n I 23 ;

[0159] At the third light intensity, the photosensitive data of the mixed light is composed of the photosensitive data I 31 of the light of the first band, the photosensitive data I 32 of the light of the second band, and the photosensitive data I 33 of the light of the third band. Then, the photosensitive data I3 of the mixed light = a1I 31 + a2I 32 +...... + a n I 33 ;

[0160] The above three formulas include three unknowns, a1, a2, and a3. By combining the three formulas, the specific values of a1, a2, and a3 can be solved, and further, the contribution ratios of the light of different bands in the band set can be determined.

[0161] In some embodiments, before the step of obtaining the actual distance between the photosensitive unit and the object to be measured, it includes:

[0162] Sequentially obtain the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, where the mixed light includes the light of all bands in the band set;

[0163] Based on the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, determine the ratio of the light of different bands in the band set;

[0164] Store the ratio of the light of different bands in the band set and the incident angle of the light at the photosensitive unit in the database;

[0165] Determine that the incident angle of the light at the photosensitive unit has changed, and repeat the steps of sequentially obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light to the step of storing in the database.

[0166] It can be understood that when obtaining the actual distance between the photosensitive unit and the object to be measured, a database is first constructed. Specifically, first sequentially obtain the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light. According to the photosensitive data of the light of each band and the photosensitive data of the mixed light, the ratio of the light of different bands in the band set can be determined. Then store the incident angle of the light at the current photosensitive unit and the ratio of the light of different bands in the database. Then adjust the incident angle of the light at the photosensitive unit, and repeat the steps of sequentially obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light to the step of storing in the database, so as to obtain the ratio of the light of different bands corresponding to different incident angles of the light at the photosensitive unit and store them in the database. Furthermore, the construction of the database can be realized, so as to facilitate subsequent determination of the ratio of the light of different bands according to the actual distance between the photosensitive unit and the object to be measured.

[0167] Exemplarily, the band set includes the light of three different bands, namely the first band, the second band, and the third band.

[0168] It can be understood that successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light means that first, the light of the first band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the light of the first band is obtained. Then, the light of the second band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the light of the second band is obtained. Then, the light of the third band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the light of the third band is obtained. Finally, the mixed light of the first band, the second band, and the third band is irradiated from the object to be measured through the filter unit to the photosensitive unit, and the photosensitive data corresponding to the mixed light is obtained. It should be noted that here is only an example to illustrate that the band set includes the light of the first band, the second band, and the third band. The band set can also include the light of two different bands, or can include the light of more than three different bands, without special limitation.

[0169] Specifically, before the step of obtaining the actual distance between the photosensitive unit and the object to be measured, it includes:

[0170] When the incident angle of the light at the photosensitive unit is the first angle,

[0171] Successively obtain the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, where the mixed light includes the light of all bands in the band set;

[0172] Based on the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, determine the proportion of the light of different bands in the band set;

[0173] Store the proportion of the light of different bands in the band set and the incident angle of the light at the photosensitive unit in the database;

[0174] Determine that the distance between the object to be measured and the photosensitive unit has changed, and repeat the steps from successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light to the steps of storing in the database;

[0175] When the incident angle of the light at the photosensitive unit changes to the second angle,

[0176] Successively obtain the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, where the mixed light includes the light of all bands in the band set;

[0177] Based on the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light, determine the proportion of the light of different bands in the band set;

[0178] Store the proportion of the light of different bands in the band set and the incident angle of the light at the photosensitive unit in the database;

[0179] It is determined that the distance between the object to be measured and the photosensitive unit changes, and the steps of successively obtaining the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light are repeated until the step of storing in the database.

[0180] And so on, until the photosensitive data of the light of each band in the band set and the photosensitive data of the mixed light at different distances and different incident angles are obtained.

[0181] In some embodiments, the multispectral chip component further includes a ranging unit 8 for measuring the distance between the object to be measured and the photosensitive unit.

[0182] It can be understood that the distance between the object to be measured and the photosensitive unit can be detected by the ranging unit 8 to determine the distance between the object to be measured and the photosensitive unit, and then the proportion of the light of different bands in the band set can be determined according to the distance between the object to be measured and the photosensitive unit and the database.

[0183] In some embodiments, the multispectral chip component further includes an angle detection unit for detecting the incident angle of the light at the photosensitive unit.

[0184] It can be understood that the incident angle of the light at the photosensitive unit can be detected by the angle detection unit to determine the incident angle of the light at the photosensitive unit, and then the proportion of the light of different bands in the band set can be determined according to the incident angle of the light at the photosensitive unit and the database.

[0185] In some examples, the angle detection unit is, for example, a quadrant photodetector or a position sensitive detector or any other suitable component with the function of detecting the incident angle of light.

[0186] The embodiments of the present application have been introduced in detail above. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A multispectral chip component, characterized in that, Comprising: A photosensitive chip, configured to acquire light of different wavelength bands to obtain spectral information of each channel, wherein different ones of the channels correspond to spectral information of different wavelength bands; A filter layer, disposed outside the photosensitive chip, and located on the light sensing path of the photosensitive chip, so that the filter layer can filter the light entering the photosensitive chip.

2. The multispectral chip component according to claim 1, wherein The filter layer is disposed at an interval from the photosensitive chip, or the filter layer is disposed on the outer surface of the photosensitive chip.

3. The multispectral chip component according to claim 1 or 2, characterized in that The filter layer is detachably connected to the photosensitive chip.

4. The multispectral chip component according to claim 1 or 2, characterized in that, The photosensitive chip includes photosensitive units, and the multispectral chip assembly further includes a protective layer, the protective layer is disposed between the filter layer and the photosensitive units, and the orthographic projection of the photosensitive units on the protective layer is located within the orthographic projection of the filter layer on the protective layer; and / or, The filter layer includes filter units, and the size of the filter units is larger than the size of the photosensitive units; and / or, The filter layer includes filter units, the photosensitive chip includes a plurality of photosensitive units, and the plurality of photosensitive units are disposed opposite to the filter units, and the filter units are configured to filter the light entering the plurality of photosensitive units.

5. The multispectral chip component according to claim 1 or 2, characterized in that The photosensitive chip includes photosensitive units, the filter layer includes filter units, the filter units and the photosensitive units are in one-to-one correspondence, and the filter units are located on the light sensing paths of the photosensitive units, wherein the filter units filter the light entering the photosensitive units and allow light of at least two different wavelength bands to pass through.

6. An electronic device, characterized in that, Comprising the multispectral chip assembly according to any one of claims 1 to 5.

7. The electronic device according to claim 6, wherein The electronic device further includes a Fresnel lens, the Fresnel lens is disposed on one side of the photosensitive chip, and the Fresnel lens is located on the light sensing path of the photosensitive chip.

8. The electronic device according to claim 7, wherein The filter layer is located between the Fresnel lens and the photosensitive chip; or, The Fresnel lens is located between the photosensitive chip and the filter layer.

9. The electronic device according to any one of claims 6 to 8, characterized in that, The electronic device includes a housing, the photosensitive chip is installed in the housing, the photosensitive chip includes photosensitive units, and the filter layer is detachably connected to the housing, so that the filter layer can be switched between a first position and a second position, wherein, in the first position, the filter layer is located on the light sensing path of the photosensitive units, and in the second position, the filter layer is disposed at an interval from the light sensing path of the photosensitive units.

10. A spectral calculation method based on the multispectral chip component according to any one of claims 1 to 5, characterized in that The multispectral chip assembly includes corresponding photosensitive units and filter units, the photosensitive units are configured to acquire light of different wavelength bands to obtain spectral information of each channel, wherein different ones of the channels correspond to spectral information of different wavelength bands, the filter units filter the light entering the photosensitive units, and the filter units can transmit light of a wavelength band set, and the wavelength band set includes at least two different wavelength bands; the method includes: Obtaining the actual distance between the photosensitive units and the object to be measured; Determining the proportion of light of different wavelength bands in the wavelength band set based on the actual distance and a database; Wherein, the database includes the proportion of light of different wavelength bands in the wavelength band set when the photosensitive units and the object to be measured are at different distances.

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