Performance evaluation device and method for immersed liquid cooling system

Abstract

The invention relates to the field of immersed liquid cooling systems, and discloses a performance evaluation device and method for an immersed liquid cooling system, and the performance evaluation device for the immersed liquid cooling system comprises a plate heat exchanger; the cooling liquid circulating unit comprises a liquid cooling case and a cooling liquid pump, the liquid cooling case, the cooling liquid pump and the plate heat exchanger are connected through pipelines, and the pipelines are provided with flow regulating valves, pressure gauges and temperature sensors; by means of the testing device and method, various influence factors such as the chip size, the power density, the cooling liquid flow speed and internal disturbance can be tested, the performance of the immersed liquid cooling system can be comprehensively evaluated, and a scientific basis is provided for system design and optimization. And comprehensive monitoring and intelligent diagnosis of the immersed liquid cooling system can be realized by combining a deep fault diagnosis and health monitoring system, potential problems in the system can be found in time, fault occurrence can be predicted, and maintenance suggestions can be provided.

Description

Technical Field

[0001] The present invention relates to the field of immersion liquid cooling systems, and particularly to a performance evaluation device and method for an immersion liquid cooling system. Background Art

[0002] With the growth of power consumption and heat load of electronic devices, especially high-performance computers, servers, and data centers, traditional air cooling systems are difficult to meet the requirements of efficient heat dissipation. Liquid cooling technology has attracted much attention due to its superior performance. In particular, immersion liquid cooling systems can significantly improve the heat dissipation efficiency by directly immersing electronic components in the coolant. However, most of the current testing devices for immersion liquid cooling systems on the market only test single parameters, such as heat dissipation performance evaluation or medium flow characteristics analysis. These devices usually lack the ability to simulate multiple operating conditions and are difficult to comprehensively evaluate the overall performance of the system. At the same time, the data acquisition of existing devices is mostly limited to basic parameters and fails to effectively cover the dynamic response data under complex operating conditions, such as the impact of load changes on the heat dissipation efficiency and reliability of the system. These deficiencies lead to a lack of sufficient data support in the design and optimization of immersion liquid cooling systems, restricting the further improvement of system performance. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is: the lack of sufficient data support restricts the further improvement of system performance.

[0004] The above technical problem is solved by the following technical solutions: The present invention provides a performance evaluation device for an immersion liquid cooling system, which includes

[0005] A plate heat exchanger;

[0006] A coolant circulation unit, which includes a liquid cooling chassis and a coolant pump. The liquid cooling chassis, the coolant pump, and the plate heat exchanger are connected by pipelines, and a flow regulating valve, a pressure gauge, and a temperature sensor are arranged on the pipelines;

[0007] A cooling water circulation unit, which includes a cooling tower and a cooling water pump. The cooling tower, the cooling water pump, and the plate heat exchanger are connected by pipelines, and a flow regulating valve, a pressure gauge, and a temperature sensor are arranged on the pipelines;

[0008] A voltage regulator;

[0009] A data collector;

[0010] A computer.

[0011] In a preferred embodiment of the performance evaluation device for an immersion liquid cooling system according to the present invention: The liquid cooling chassis includes a box body, a simulation circuit board installed inside the box body, a connector for installing the simulation circuit board, and a flow equalizing plate installed inside the box body.

[0012] In a preferred embodiment of the performance evaluation device for an immersion liquid cooling system according to the present invention: Glass is installed on the positive outside of the box body, a liquid inlet pipe and a liquid outlet pipe are respectively installed on both sides of the box body, and a slide rail is fixedly connected to the inside of the box body.

[0013] In a preferred embodiment of the performance evaluation device for an immersion liquid cooling system according to the present invention: The liquid inlet pipe is located at the lower end of one side of the box body, the liquid outlet pipe is located at the upper end of the other side of the box body, and the liquid inlet pipe and the liquid outlet pipe are designed with a dislocation.

[0014] In a preferred embodiment of the performance evaluation device for an immersion liquid cooling system according to the present invention: A simulation chip is installed on one side of the simulation circuit board, a threaded rod is installed on the side of the simulation circuit board where the simulation chip is installed, and a nut is threadedly connected to the outside of the threaded rod.

[0015] In a preferred embodiment of the performance evaluation device for an immersion liquid cooling system according to the present invention: The simulation chips are set to four groups, and the overall sizes of the four groups of simulation chips are different. A thermocouple is surface-mounted on the surface of each group of simulation chips.

[0016] In a preferred embodiment of the performance evaluation device for an immersion liquid cooling system according to the present invention: The connector includes an L-shaped plate, a support rod fixedly connected to one side of the L-shaped plate, an inlaid block fixedly connected to one end of the support rod, and an anti-detachment block fixedly connected to the other end of the support rod;

[0017] Wherein, the inlaid block is located inside the slide rail and slides along the inside of the slide rail.

[0018] In a preferred embodiment of the performance evaluation device for an immersion liquid cooling system according to the present invention: The flow equalizing plate is composed of a square plate and round holes opened on the outside of the square plate, and the flow equalizing plate is located above the liquid inlet pipe.

[0019] The present invention also provides a performance evaluation method for an immersion liquid cooling system, including the performance evaluation device for an immersion liquid cooling system, and further includes the following steps.

[0020] Assemble the experimental platform, correctly install and connect all components, and then fill with coolant and remove air bubbles to ensure the normal operation of the system;

[0021] A series of tests are conducted to evaluate the performance of the liquid cooling system under different conditions;

[0022] A data acquisition instrument is used to record key parameters, and the data is analyzed to calculate the thermal resistance;

[0023] Based on the test results, an evaluation is carried out and optimization suggestions for the system design are proposed to improve the heat dissipation efficiency and system stability.

[0024] In a preferred embodiment of the performance evaluation method for the immersion liquid cooling system described in the present invention: The test experiments include the effects of chip thermal power, coolant flow rate, chip size on the heat dissipation performance, and the performance comparison of composite thermal loads and different coolants.

[0025] The beneficial effects of the present invention are as follows: Through the test device and method, various influencing factors such as chip size, power density, coolant flow rate, and internal disturbance can be tested, and the performance of the immersion liquid cooling system can be comprehensively evaluated, providing a scientific basis for system design and optimization. And by combining a deep fault diagnosis and health monitoring system, comprehensive monitoring and intelligent diagnosis of the immersion liquid cooling system can be achieved, timely discovering potential problems in the system, predicting the occurrence of faults, and providing maintenance suggestions, thereby ensuring the stability and reliability of the system during long-term operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below only relate to some embodiments of the present invention and do not limit the present invention.

[0027] Figure 1 Shows the overall structural schematic diagram of the present invention.

[0028] Figure 2 Shows the overall system schematic diagram of the present invention.

[0029] Figure 3 Shows the overall schematic diagram of the liquid cooling chassis of the present invention.

[0030] Figure 4 Shows the internal schematic diagram of the liquid cooling chassis of the present invention.

[0031] Figure 5 Shows the enlarged structural schematic diagram of part A of the present invention.

[0032] Figure 6 Shows the overall schematic diagram of the flow equalizing plate of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0033] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below in conjunction with the specific embodiments and the drawings.

[0034] The terms used in the present invention are those general terms that are currently widely used in the art in consideration of the functions of the present invention. However, these terms may vary according to the intentions of those of ordinary skill in the art, precedents, or new technologies in the art. In addition, specific terms may be selected by the applicant, and in such cases, their detailed meanings will be described in the detailed description of the present invention. Therefore, the terms used in the specification should not be construed as simple names, but rather based on the meanings of the terms and the overall description of the present invention.

[0035] Referring to Figures 1 to 4 , this embodiment provides a performance evaluation device for an immersion liquid cooling system, including,

[0036] Plate heat exchanger 1;

[0037] Coolant circulation unit 2, the coolant circulation unit 2 includes a liquid cooling chassis 21 and a coolant pump 22. The liquid cooling chassis 21, the coolant pump 22, and the plate heat exchanger 1 are connected by pipelines, and a flow regulating valve, a pressure gauge, and a temperature sensor are provided on the pipelines;

[0038] Cooling water circulation unit 3, the cooling water circulation unit 3 includes a cooling tower 31 and a cooling water pump 32. The cooling tower 31, the cooling water pump 32, and the plate heat exchanger 1 are connected by pipelines, and a flow regulating valve, a pressure gauge, and a temperature sensor are provided on the pipelines;

[0039] Voltage regulator 4;

[0040] Data collector 5;

[0041] Computer 6.

[0042] The liquid cooling chassis 21 includes a box body 211, a simulation circuit board 212 installed inside the box body 211, a connector 213 for installing the simulation circuit board 212, and a flow equalizing plate 214 installed inside the box body 211.

[0043] Glass 2111 is installed on the positive outer side of the box body 211. An inlet pipe 2112 and an outlet pipe 2113 are respectively installed on both sides of the box body 211. A slide rail 2114 is fixedly connected to the inner side of the box body 211.

[0044] After starting the coolant circulation unit 2 and the cooling water circulation unit 3, the coolant pump 22 drives the immersion coolant to circulate, and the cooling water pump 32 drives the cooling water to circulate. Cooperating with the plate heat exchanger 1 can realize the heat exchange and cooling of the cooling water to the immersion coolant.

[0045] Through the data collector 5, data can be collected from the voltage regulator 4, the flow regulating valve, the pressure gauge, and the temperature sensor on the pipeline, and uploaded to the computer 6.

[0046] By providing the glass 2111, the immersion coolant flowing inside the box body 211 can be observed.

[0047] As an embodiment provided in the present application, as Figure 3 , Figure 4 , the liquid inlet pipe 2112 is located at the lower end of one side of the box body 211, the liquid outlet pipe 2113 is located at the upper end of the other side of the box body 211, and the liquid inlet pipe 2112 and the liquid outlet pipe 2113 are designed with dislocation.

[0048] By the design that the liquid inlet pipe 2112 and the liquid outlet pipe 2113 are respectively arranged on both sides of the box body 211 and are dislocated from each other, it can ensure that the immersion coolant circulates more uniformly inside the box body 211 and guarantee the standardization of the experimental test.

[0049] As an embodiment provided in the present application, as Figures 3 to 5 , a simulation chip 2121 is installed on one side of the simulation circuit board 212, a threaded rod 2122 is installed on the side of the simulation circuit board 212 where the simulation chip 2121 is installed, and a nut 2123 is threadedly connected to the outside of the threaded rod 2122.

[0050] The simulation chips 2121 are set in four groups, and the overall sizes of the four groups of simulation chips 2121 are different. Thermocouples are mounted on the surfaces of each group of simulation chips 2121.

[0051] The connecting member 213 includes an L-shaped plate 2131, a support rod 2132 fixedly connected to one side of the L-shaped plate 2131, an inlaid block 2133 fixedly connected to one end of the support rod 2132, and an anti-detachment block 2134 fixedly connected to the other end of the support rod 2132;

[0052] Among them, the inlaid block 2133 is located inside the slide rail 2114 and slides along the inside of the slide rail 2114.

[0053] The different size designs of the simulation chips 2121 can flexibly adjust the power and temperature according to the experimental requirements, adapt to different experimental conditions and chip configurations, and at the same time improve the repeatability and standardization of the experiment.

[0054] Through the voltage regulator 4, the heating power of the four groups of simulation chips 2121 can be independently adjusted, and the data is transmitted to the data collector 5 through the thermocouples mounted on the surfaces of the simulation chips 2121.

[0055] After sleeving the L-shaped plate 2131 outside the threaded rod 2122, the L-shaped plate 2131 is fixedly connected to the analog circuit board 212 by cooperating with the connection between the nut 2123 and the threaded rod 2122. Then, the analog circuit board 212 is installed by inserting the embedded block 2133 into the inside of the slide rail 2114. This method can not only be used for the installation of the analog circuit board 212, but also flexibly adjust the gap, and partitions can be added to increase the disturbance of the internal fluid, so as to realize the simulation experimental research on the cooling performance of the coolant under different flow states, and collect real-time data, providing a large amount of diverse data support for the performance research of the liquid cooling system.

[0056] Since the four groups of analog chips 2121 provided on the analog circuit board 212 have different sizes, by flexibly installing the analog circuit board 212 in four different directions of upside down and left and right flipping in the box body 211, a diverse layout of the analog chips 2121 in the box body can be realized. This method not only improves the flexibility of the experimental design, but also when the analog circuit board 212 is installed with the opposite side, the analog chips 2121 on the two groups of analog circuit boards 212 can be designed relatively, thereby further improving the adaptability and diversity of the experiment.

[0057] As an embodiment provided in the present application, as Figure 6 , the flow equalizing plate 214 is composed of a square plate 2141 and circular holes 2142 opened on the outside of the square plate 2141, and the flow equalizing plate 214 is located above the liquid inlet pipe 2112.

[0058] When the immersion coolant enters the inside of the box body 211 through the liquid inlet pipe 2112, under the design of the circular holes 2142 on the flow equalizing plate 214, the uniformity of the flow of the immersion coolant inside the box body 211 can be realized.

[0059] As an embodiment provided in the present application, as Figure 1 、 Figure 2 , a performance evaluation method for an immersion liquid cooling system, including a performance evaluation device for the immersion liquid cooling system, further comprises the following steps

[0060] Assemble the experimental platform, correctly install and connect all components, and then fill the coolant and remove air bubbles to ensure the normal operation of the system;

[0061] Conduct a series of tests to evaluate the performance of the liquid cooling system under different conditions;

[0062] Use a data acquisition instrument to record key parameters and analyze the data to calculate the thermal resistance;

[0063] Evaluate according to the test results and put forward optimization suggestions for the system design to improve the heat dissipation efficiency and system stability.

[0064] The test experiments include the effects of chip thermal power, coolant flow rate, and chip size on the heat dissipation performance, as well as the performance comparison of composite thermal loads and different coolants.

[0065] First, install and fix all the devices, fill the immersion coolant into the experimental platform, and discharge the air bubbles in the liquid to ensure normal flow. Then the experiment can be started.

[0066] The test experiments are as follows:

[0067] 1. Test on the influence of chip thermal power

[0068] Start the liquid cooling system and set the coolant inlet temperature. Activate the simulated chips 2121 of the same size, and set the heating power of the simulated chips 2121 through the voltage regulator 4. Record the stable temperature on the surface of different simulated chips 2121, the temperature difference between the coolant inlet and outlet, and the pressure drop of the liquid cooling system.

[0069] 2. Test on the influence of coolant flow rate

[0070] At the same power, such as 20 W, gradually increase the coolant flow rate, such as from 0.1 m / s to 1 m / s. Monitor the temperature change on the surface of the simulated chip 2121 according to the thermocouple and observe the liquid flow state in the box 211. Record the temperature of the simulated chip 2121, the coolant temperature rise, and the system pressure loss at different flow rates.

[0071] 3. Test on the influence of chip size

[0072] At the same power, the same coolant flow rate, and inlet temperature, activate the simulated chips 2121 of different sizes. Record the surface temperature of the simulated chips 2121, the coolant outlet temperature, and the flow pressure drop, and analyze the heat dissipation performance of the simulated chips 2121 of different sizes in the liquid cooling system.

[0073] 4. Test on the composite chip thermal load

[0074] Activate the simulated chips 2121 of different sizes simultaneously, and set different powers for each simulated chip 2121: such as 50 W for small chips, 30 W for medium chips, and 20 W for large chips. Record the temperature on the surface of each simulated chip 2121, and analyze the heat dissipation capacity and uniformity of the liquid cooling system under the composite thermal load.

[0075] 5. Test on the comparison of coolant performance

[0076] Under the same coolant flow rate, inlet temperature, and power load, test the heat dissipation performance of different coolants respectively. Record the temperature rise during the circulation of each coolant, the surface temperature of the simulated chip 2121, and the pressure change of the liquid cooling system. Compare the cooling effects of different coolants under the same conditions and evaluate their contributions to the system heat dissipation efficiency.

[0077] 6. Internal Disturbance Performance Test

[0078] By arranging partitions with different shapes at different positions on the slide rail 2114, record the temperature rise, chip surface temperature, and system pressure changes in each state. Analyze the impact of internal disturbances on the liquid cooling system and seek an efficient internal layout to improve system performance.

[0079] 7. Stability and Long-term Performance Test

[0080] Operate for a period of time under the set power condition, record the changing trends of parameters such as the temperature, pressure, and flow rate of the overall operation of the liquid cooling system, and evaluate the reliability of the long-term operation of the liquid cooling system. Observe the deposits, foam, bubbles in the coolant in the liquid cooling system and their effects on the heat transfer surface.

[0081] 8. Multi-directional Installation Test of Circuit Boards

[0082] By installing the simulated circuit board 212 upside down and flipped left and right, different layouts of the simulated chips are achieved. Record the performance of the simulated chip 2121 and the reaction of the liquid cooling system under different installation methods, analyze its impact on the experimental results, and verify the potential impact of the installation direction on system performance.

[0083] Data Acquisition and Processing

[0084] 1. Real-time Monitoring and Data Recording

[0085] Use a data acquisition instrument to record the stable temperature of each chip surface, the temperature rise of the coolant, the flow rate, and the pressure at the inlet and outlet of the coolant. The sampling interval for each group of experiments is set to 5 seconds, and the total experimental time is 10 minutes or until the temperature stabilizes.

[0086] 2. Data Analysis

[0087] Calculate the thermal resistance of each chip

[0088] where T1 is the chip surface temperature, T2 is the coolant inlet temperature, and P is the chip power measured by the power meter. Analyze the influence of the coolant flow rate on the chip temperature rise and the pressure drop of the liquid cooling system. Compare the differences in the heat dissipation performance of chips of different sizes and the temperature distribution uniformity under composite loads.

[0089] Test Result Evaluation

[0090] 1. Heat Dissipation Performance Evaluation

[0091] Evaluate whether the heat dissipation ability of the liquid cooling system for chips of different sizes meets the requirements.

[0092] Compare the chip temperature changes under different flow rates, power densities, and composite loads.

[0093] 2. System Pressure Drop Analysis

[0094] Measure the influence of coolant flow rate on the pressure drop of the liquid cooling system and evaluate the energy efficiency ratio of the liquid cooling system.

[0095] 3. Uniformity verification

[0096] Analyze the temperature distribution on the chip surface during the composite load experiment and verify the uniform cooling ability of the liquid cooling system for different heat sources.

[0097] Experimental conclusions and optimization suggestions

[0098] 1. Determine the optimal coolant flow rate, inlet temperature, and power density range.

[0099] 2. Propose optimization suggestions for the design of the liquid cooling system.

[0100] 3. Provide reference data for the design of actual equipment and verify the applicability and reliability of the immersion liquid cooling system for different heat loads.

[0101] Deep fault diagnosis and health monitoring

[0102] 1. The deep fault diagnosis and health monitoring system includes the following key modules:

[0103] Data acquisition module: Used to obtain various operation data in the system in real time, such as temperature, pressure, flow rate, coolant temperature rise, flow velocity, power, etc.

[0104] Data preprocessing module: Process the collected data, such as denoising, normalization, filling missing values, etc., to ensure data quality.

[0105] Fault diagnosis module: Use machine learning algorithms to analyze the preprocessed data and detect possible faults in the system, such as abnormal coolant flow rate, excessive pressure, pump failure, heat exchanger blockage, etc.

[0106] Health assessment module: Evaluate the current health status of the system through the analysis of historical data and predict the possible fault locations and remaining service life of the system.

[0107] User interface module: Provide a real-time monitoring interface for users, including the health status of the system, fault diagnosis results, maintenance suggestions, etc.

[0108] 2. Fault diagnosis algorithms

[0109] Intelligently diagnose faults through the following algorithms:

[0110] Threshold-based fault detection: When a certain parameter (such as coolant flow rate, temperature, pressure) exceeds the predetermined safe range, the system will automatically alarm to prompt the user that there may be a fault.

[0111] Machine Learning-based Fault Diagnosis: Machine learning algorithms (such as support vector machines, decision trees, random forests, etc.) are used to train models from a large amount of historical data to identify feature patterns related to faults. The system compares real-time data with the trained model for fault detection and location.

[0112] Classification Model: Classify system faults (such as liquid cooling pump faults, heat exchanger blockages, abnormal coolant flow, etc.), and use algorithms to determine in real time whether such faults exist in the current system.

[0113] Anomaly Detection Model: By analyzing the historical data of the system, construct the feature distribution under normal operating conditions, and monitor behaviors that deviate from the normal pattern in real time (such as flow rate fluctuations, abnormal temperature increases, etc.) to determine whether there are potential fault risks.

[0114] 3. Health Assessment and Life Prediction

[0115] The health assessment module can not only analyze the health status of the system in real time, but also predict the remaining life of the liquid cooling system through the combination of historical data and real-time data. The specific implementation methods are as follows:

[0116] Health Assessment Model: Based on the historical operation data (such as operation time, temperature, pressure, etc.) of each component (such as liquid cooling pump, heat exchanger, etc.) in the system, combined with machine learning or deep learning algorithms, evaluate the current health status of each component and conduct a comprehensive assessment of the entire system.

[0117] Health Index: The system calculates the health index (such as health score) of the system based on the change trends of various parameters and displays it through the user interface. The higher the health index, the better the current state of the system.

[0118] Remaining Life Prediction: By establishing a mathematical model related to the system life, predict the remaining service life of the system or key components. Regression analysis can be performed based on historical data or a deep learning-based life prediction model can be used to obtain more accurate prediction results.

[0119] 4. Real-time Alarm and Maintenance Suggestions

[0120] Real-time Alarm Function: When the system detects that a certain key parameter is abnormal (such as too low flow rate, too high temperature, abnormal pressure, etc.), the system will trigger an alarm and notify the operator in a timely manner through the user interface or mobile phone notification, etc.

[0121] Maintenance Suggestions: Based on the fault diagnosis results and health assessment reports, the system will generate maintenance suggestions. For example, if it is detected that the coolant pump flow rate has decreased, the system will suggest checking the working status of the pump; if the temperature is too high, it may be necessary to clean the surface of the heat exchanger or check the coolant flow status.

[0122] 5. User Interface and Data Display

[0123] Real-time Monitoring Interface: The system provides an intuitive user interface that displays the operating parameters of the system (such as temperature, flow rate, pressure, etc.) and the health status of each component in real time. Users can view the working conditions and health indices of the liquid cooling system at any time.

[0124] This method covers various influencing factors such as chip size, power density, coolant flow rate, internal disturbances, etc., and can comprehensively evaluate the performance of the immersion liquid cooling system, providing a scientific basis for system design and optimization. Moreover, by combining a deep fault diagnosis and health monitoring system, it is possible to achieve comprehensive monitoring and intelligent diagnosis of the immersion liquid cooling system, timely detect potential problems in the system, predict the occurrence of faults, and provide maintenance suggestions, thus ensuring the stability and reliability of the system during long-term operation.

[0125] Finally, it should be noted that the methods and devices described in detail above are only examples, and those skilled in the art can modify these examples in different ways as long as they do not depart from the scope of the present invention.

Claims

1. A performance evaluation device for an immersion liquid cooling system, characterized in that: including, a plate heat exchanger (1); a coolant circulation unit (2), the coolant circulation unit (2) includes a liquid cooling chassis (21) and a coolant pump (22), the liquid cooling chassis (21), the coolant pump (22) and the plate heat exchanger (1) are connected by pipes, and a flow regulating valve, a pressure gauge and a temperature sensor are arranged on the pipes; a cooling water circulation unit (3), the cooling water circulation unit (3) includes a cooling tower (31) and a cooling water pump (32), the cooling tower (31), the cooling water pump (32) and the plate heat exchanger (1) are connected by pipes, and a flow regulating valve, a pressure gauge and a temperature sensor are arranged on the pipes; a voltage regulator (4); a data collector (5); a computer (6).

2. The performance evaluation device for an immersion liquid cooling system according to claim 1, wherein: The liquid cooling chassis (21) includes a box body (211), a simulation circuit board (212) installed inside the box body (211), a connecting piece (213) for installing the simulation circuit board (212), and a flow equalizing plate (214) installed inside the box body (211).

3. The performance evaluation device for an immersion liquid cooling system according to claim 2, wherein: A glass (2111) is installed on the positive outer side of the box body (211), a liquid inlet pipe (2112) and a liquid outlet pipe (2113) are respectively installed on both sides of the box body (211), and a slide rail (2114) is fixedly connected to the inner side of the box body (211).

4. The performance evaluation device for an immersion liquid cooling system according to claim 3, characterized in that: The liquid inlet pipe (2112) is located at the lower end of one side of the box body (211), the liquid outlet pipe (2113) is located at the upper end of the other side of the box body (211), and the liquid inlet pipe (2112) and the liquid outlet pipe (2113) are designed with a dislocation.

5. The performance evaluation device for an immersion liquid cooling system according to claim 4, characterized in that: A simulation chip (2121) is installed on one side of the simulation circuit board (212), a threaded rod (2122) is installed on the side of the simulation circuit board (212) where the simulation chip (2121) is installed, and a nut (2123) is threadedly connected to the outer side of the threaded rod (2122).

6. The performance evaluation device for an immersion liquid cooling system according to claim 5, characterized in that: The simulation chips (2121) are arranged in four groups, and the overall sizes of the four groups of simulation chips (2121) are different. A thermocouple is mounted on the surface of each group of simulation chips (2121).

7. The performance evaluation device for an immersion liquid cooling system according to claim 6, characterized in that: The connecting piece (213) includes an L-shaped plate (2131), a support rod (2132) fixedly connected to one side of the L-shaped plate (2131), an inlaid block (2133) fixedly connected to one end of the support rod (2132), and an anti-detachment block (2134) fixedly connected to the other end of the support rod (2132); wherein, the inlaid block (2133) is located inside the slide rail (2114) and slides along the inside of the slide rail (2114).

8. The performance evaluation device for an immersion liquid cooling system according to claim 7, characterized in that: The flow equalizing plate (214) is composed of a square plate (2141) and round holes (2142) opened on the outer side of the square plate (2141), and the flow equalizing plate (214) is located above the liquid inlet pipe (2112).

9. A performance evaluation method for an immersion liquid cooling system, characterized in that: including the performance evaluation device for an immersion liquid cooling system according to any one of claims 1 to 8, and further comprising the following steps assembling an experimental platform, correctly installing and connecting all components, and then filling with coolant and removing air bubbles to ensure the normal operation of the system; A series of tests are carried out to evaluate the performance of the liquid cooling system under different conditions; A data acquisition instrument is used to record key parameters, and the data is analyzed to calculate the thermal resistance; Based on the test results, an evaluation is conducted and optimization suggestions for the system design are put forward to improve the heat dissipation efficiency and system stability.

10. The performance evaluation method for an immersion liquid cooling system according to claim 9, wherein: The test experiments include the effects of chip thermal power, coolant flow rate, and chip size on the heat dissipation performance, as well as the performance comparison of composite thermal loads and different coolants.

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