Burn-in board and burn-in test method using burn-in board

Abstract

Various example embodiments relate to a burn-in board and / or a burn-in test method using the burn-in board. A burn-in board according to various example embodiments includes a substrate having a first surface and a second surface opposite each other, and a slot configured to receive a semiconductor device on or at the first surface of the substrate. The first surface of the substrate defines an extension portion extending in a first direction and having an interior space on or at the first surface of the substrate.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2024 - 0003490, filed on January 9, 2024, with the Korean Intellectual Property Office, the entire content of which is incorporated herein by reference. Technical field

[0003] Various exemplary embodiments relate to an aging board and / or an aging test method using the aging board. Background art

[0004] Semiconductor devices can have small sizes while performing various functions, and thus semiconductor devices are widely used in various fields of the electronics industry. To test the reliability of semiconductor devices, an aging test is used in which various signals and / or voltages, etc., are applied to the semiconductor device at high temperature.

[0005] In the aging test, hot air is supplied to the aging board. However, due to the structure of the aging board and the structure of the chamber in which the aging test is performed, it may be difficult to maintain a uniform temperature of the aging board during the aging test. For example, the temperature of a region adjacent to the inlet through which the high - temperature air flows in may be higher than that of another region far from the inlet. Summary of the invention

[0006] Various exemplary embodiments seek to provide an aging board and / or an aging test method using the aging board that can improve temperature uniformity in an aging test.

[0007] An aging board according to some exemplary embodiments includes a substrate having a first surface and a second surface opposite to each other, and a slot configured to receive a semiconductor device on or at the first surface of the substrate. The aging board defines a guiding portion including an extending portion extending in a first direction to have an internal space on or at the first surface of the substrate.

[0008] Alternatively or additionally, an aging board according to various exemplary embodiments includes a substrate having a first surface and a second surface opposite to each other, a slot configured to receive a semiconductor device on or at the first surface of the substrate, and a heating plate located on the first surface of the substrate and spaced apart from the first surface of the substrate.

[0009] Alternatively or additionally, an aging test method according to some example embodiments includes placing a heating plate and an aging plate including a substrate on which a semiconductor device is mounted in an aging test apparatus, and performing an aging test of the semiconductor device in a state where air for the aging test is supplied. The method includes, during the aging test, detecting a temperature of the substrate, and operating the heating plate in response to the temperature of the substrate being lower than a reference temperature, such that the temperature of the substrate is increased by operating the heating plate.

[0010] According to various embodiments, by including a guiding portion that can control an air flow for the aging test, temperature uniformity of the aging plate (e.g., the substrate included in the aging plate) can be improved during the aging test process. In this example, the socket connector is positioned so as not to block the flow of air for the aging test, thereby further improving the temperature uniformity of the aging plate (e.g., the substrate included in the aging plate). Additionally or alternatively, the aging plate (e.g., the substrate included in the aging plate) can be maintained at a desired temperature during the aging test process by the heating plate and the temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a perspective view schematically showing an example of an aging test apparatus including an aging plate according to various example embodiments.

[0012] Figure 2 is a partial cross-sectional view taken along Figure 1 line A-A'.

[0013] Figure 3 is a perspective view showing an aging plate according to various example embodiments.

[0014] Figure 4 is a cross-sectional view taken along Figure 3 line B-B', showing a state where a semiconductor device is mounted on the aging plate.

[0015] Figure 5 is an exploded perspective view showing a heating plate, a hinge member, and a fastening member included in the aging plate shown in Figure 3 FIG.

[0016] Figure 6 is a schematic plan view showing Figure 3 the aging plate shown in FIG.

[0017] Figure 7 is a schematic plan view showing Figure 3 the heating plate and the hinge member included in FIG.

[0018] Figure 8 is a schematic plan view showing a heating plate and a hinge member included in an aging plate according to an improved embodiment.

[0019] Figure 9 is a flowchart showing an aging test method according to various exemplary embodiments.

[0020] Figure 10 is a plan view schematically showing an aging board according to various exemplary embodiments.

[0021] Figure 11 is a plan view schematically showing a heating plate and a hinge member included in an aging board according to various exemplary embodiments.

[0022] Figure 12 is a plan view schematically showing a heating plate and a hinge member included in an aging board according to an improved embodiment.

[0023] Figure 13 is a flowchart showing an aging test method according to various exemplary embodiments.

[0024] Figure 14 is a cross-sectional view showing a state in which a semiconductor device is mounted on an aging board according to various exemplary embodiments.

[0025] Figure 15 is a cross-sectional view showing a state in which a semiconductor device is mounted on an aging board according to a modified embodiment.

[0026] Figure 16 is a cross-sectional view showing a state in which a semiconductor device is mounted on an aging board according to a modified embodiment. Detailed Description

[0027] Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, so that those of ordinary skill in the art to which the present disclosure pertains can easily practice the inventive concept. The inventive concept may be implemented in various different forms and is not limited to the embodiments provided herein.

[0028] To clearly describe the present disclosure, parts irrelevant to the description are omitted, and throughout this specification, the same or similar components are denoted by the same reference numerals.

[0029] In addition, since the dimensions and thicknesses of parts, regions, components, units, layers, films, etc. shown in the drawings are arbitrarily shown for better understanding and easy explanation, the present disclosure is not limited to the shown dimensions and thicknesses. In the drawings, the thicknesses of parts, regions, components, units, layers, films, etc. may be enlarged or exaggerated for easy explanation and / or simple illustration.

[0030] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, no intervening elements are present. Further, when an element is referred to as being “on” or “above” a reference element, the element can be located on or below the reference element and need not be oriented in the opposite direction of gravity “on” or “above” the reference element.

[0031] In addition, unless expressly stated to the contrary, the words “comprise,” “comprising,” or “include” and their variants will be understood to imply the inclusion of other elements rather than the exclusion of any other elements.

[0032] In addition, throughout the specification, the phrases “in a plane,” “in the plane,” “on a plan view,” or “in a plan view” may represent a situation of observing a part from above or from the top, and the phrases “in a cross-section” or “in a cross-sectional view” may represent a vertical cross-section observed from the side.

[0033] Hereinafter, reference will be made to Figure 1 and Figure 2 to describe examples of an aging test apparatus for an aging board including various exemplary embodiments, and reference will be made to Figures 3 to 9 to describe in detail the aging board and an aging test method using the aging board.

[0034] Figure 1 is a perspective view schematically showing an example of an aging test apparatus including an aging board according to various exemplary embodiments. Figure 2 is Figure 1 a partial cross-sectional view taken along line A-A' of

[0035] Referring to Figure 1 and Figure 2 , according to various exemplary embodiments, an aging test apparatus 10 includes an aging board 100, a chamber 200 in which an aging test is performed or can be performed, a system support 300 in the chamber 200, and a controller 400 that controls one or more operations of the chamber 200 and / or the aging board 100. The aging board 100 can be fixed to the system support 300.

[0036] The chamber 200 can have a space portion in which the aging board 100 and / or the system support 300 is located. In various exemplary embodiments, the chamber 200 can include a slot 210 for electrically connecting to the aging board 100 and a fixing member 220 for fixing the aging board 100 to the inner surface of the chamber 200. When the aging board 100 and the system support 300 are installed in the chamber 200, the space portion of the chamber 200 can be closed by a baffle member. The number of slots 210 is not limited to the number shown in the figure and can be more or less than the number shown in the figure.

[0037] The system support 300 may include a plurality of support portions 310 that support a plurality of aging boards 100 on the inner surface of the system support 300. The number of the support portions 310 is not limited to the number shown in the figure and may be more or less than the number shown in the figure. The semiconductor device 20 (refer to Figure 4 ) may be mounted on the slot 120 of the aging board 100 (refer to Figure 3 ), and the aging board 100 on which the semiconductor device 20 is mounted may be inserted into the system support 300 through the support portions 310. The aging board 100 will be described in more detail with reference to Figures 3 to 8 .

[0038] The system support 300 may include a penetrating portion 320 in which the connection terminal 114 of the aging board 100 and the fixing member 220 of the chamber 200 are located. The connection terminal 114 of the aging board 100 may be inserted into the slot 210 of the chamber 200 through the penetrating portion 320, and the aging board 100 and the chamber 200 may be electrically connected to each other. The fixing member 220 of the chamber 200 may be engaged with the fixing groove 100a defined in the aging board 100 through the penetrating portion 320, and the connection terminal 114 of the aging board 100 and the slot 210 of the chamber 200 may be stably fixed. In this instance, the position of the fixing member 220 may be adjusted in the vertical direction and / or the horizontal direction. For example, a position adjusting member (e.g., a cylinder) for adjusting the position of the fixing member 220 may be controlled by the controller 400. Above, the electrical connection structure and the fixing structure of the aging board 100 and the chamber 200 have been described as an example, but the electrical connection structure and the fixing structure of the aging board 100 and the chamber 200 may be modified in various ways.

[0039] In Figure 1 , as an example, a plurality of system supports 300 are shown provided in the chamber 200. However, the exemplary embodiments are not limited thereto. In some embodiments, one system support 300 may be provided in the chamber 200, and / or the aging board 100 may be mounted in the chamber 200.

[0040] The controller 400 may control some or all of the operations of the aging test. For example, the controller 400 may generally control the operation of testing the state of the aging board 100 by sending an electrical signal for the aging test to the aging board 100 and / or receiving an output signal of the electrical signal for the aging test from the aging board 100. The controller 400 may generally control the operation of adjusting the temperature in the chamber 200 (e.g., the temperature of the substrate 110). Alternatively or additionally, the controller 400 may control the operation for electrically connecting or fixing the aging board 100 and the chamber 200.

[0041] With reference to Figure 3 and Figure 4 andFigure 1 and Figure 2 A detailed description is given of the aging board 100 according to various exemplary embodiments.

[0042] Figure 3 is a perspective view showing the aging board 100 according to various exemplary embodiments. Figure 4 is along Figure 3 sectional view taken along line B - B' showing the state in which the semiconductor device 20 is mounted on the aging board 100.

[0043] Referring to Figures 1 to 4 , in various exemplary embodiments, the aging board 100 may include a substrate 110 having a first surface 111 and a second surface 112 opposite to each other, and a slot 120 on or at the first surface 111 of the substrate 110. The aging board 100 may further include a heating plate 140 and a temperature sensor 170 on or in the substrate 110. The heating plate 140 includes a heating portion 140a (refer to Figure 5 ) and is spaced apart from the first surface 111 of the substrate 110 on the first surface 111 of the substrate 110.

[0044] The substrate 110 may be a connection substrate, a connection board, a circuit board, or a wiring board, or may include (or be included in) a connection substrate, a connection board, a circuit board, or a wiring board. The substrate 110 may support the slot 120 and may include wirings 116 (refer to Figure 6 ) electrically connected to the slot 120 (e.g., a slot connector 122), a temperature sensor 170, and a hinge member 150. For example, the substrate 110 may be a printed circuit board (PCB). However, the exemplary embodiments are not limited thereto, and the substrate 110 may have any one of various structures and / or materials, etc.

[0045] The substrate 110 may include a handle 130 at a first side 110a of the substrate 110, and connection terminals 114 at a second side 110b of the substrate 110 opposite to the first side 110a of the substrate 110. When the aging board 100 is fixed to the chamber 200, the first side 110a of the substrate 110 may be the outer side or the inlet side of the aging board 100, through which air (e.g., high - temperature air) for the aging test flows in, and the second side 110b of the substrate 110 may be the inner side or the opposite side of the aging board 100 opposite to the inlet side.

[0046] In a plan view, the first side 110a and the second side 110b may be in a first direction ( Figure 2On both sides of the substrate 110 in the Y-axis direction (in the figure). In this example, the first direction corresponds to the direction from the entrance side to the opposite side, and may correspond to the main axis direction of the air for the aging test, which is the direction in which a relatively large amount of the air for the aging test flows among the directions of the air flow for the aging test. In the plan view, the second direction (the X-axis direction in the figure) may be a direction transverse to (e.g., perpendicular to) the first direction. The thickness direction (the Z-axis direction in the figure) may intersect the plane in which the first direction and the second direction lie (e.g., perpendicular to the plane in which the first direction and the second direction lie).

[0047] The handle 130 located at the first side 110a of the substrate 110 can be used to move the aging plate 100. For example, the handle 130 can be used when an operator and / or an automated guided vehicle (AGV) inserts the aging plate 100 into the system bracket 300 and / or takes the aging plate 100 out of the system bracket 300. However, the exemplary embodiments are not limited thereto. In some embodiments, the handle 130 may not be provided.

[0048] The connection terminal 114 at the second side 110b of the substrate 110 may have a connection pattern electrically connected to the wiring 116 of the substrate 110. The connection terminal 114 may have any of various structures that can be inserted into the slot 210 of the chamber 200 and electrically connected to the chamber 200. In this example, the connection terminal 114 (e.g., the connection pattern) may be electrically connected to the socket connector 122, the heating plate 140 (more specifically, the heating portion 140a), and the temperature sensor 170 through the wiring 116 of the substrate 110. In this example, the heating plate 140 may be electrically connected to the wiring 116 of the substrate 110 through the hinge member 150 (more specifically, the wiring pattern 152 (refer to Figure 5 ). This will be explained in more detail later.

[0049] The semiconductor device 20 can be mounted on the socket 120. The socket 120 can be at one side of the first surface 111 of the substrate 110 and can be fixed to the first surface 111 in various ways. For example, the semiconductor device 20 can be inserted and mounted on the socket 120, but the exemplary embodiments are not limited thereto.

[0050] In the plan view, a plurality of sockets 120 can be provided in each of the first direction and the second direction. For example, a plurality of sockets 120 can form a matrix having a plurality of rows spaced apart from each other in the first direction and a plurality of columns spaced apart from each other in one row in the second direction. The number of rows can be the same as, less than, or greater than the number of columns.

[0051] The socket 120 can include a socket connector 122 electrically connected to the lead 22 of the semiconductor device 20 and the wiring 116 of the substrate 110. As Figure 4As shown, when the semiconductor device 20 is mounted on the slot 120, the leads 22 of the semiconductor device 20 can be electrically connected to (e.g., in contact with) the slot connector 122.

[0052] For a clear understanding and simplified description, Figure 4 the structure of the slot 120, and the connection structure of the leads 22 of the semiconductor device 20 and the slot connector 122 are schematically shown. The exemplary embodiments are not limited thereto. Thus, the slot 120 can have any one of various structures on which the semiconductor device 20 is mounted, and the connection structure of the leads 22 of the semiconductor device 20 and the slot connector 122 can be modified in various ways.

[0053] One or more burn-in test signals sent from the controller 400 can be sent to the semiconductor device 20 mounted on the slot 120 through the connection terminal 114, the wiring 116 of the substrate 10, and the slot connector 122. One or more output signals of the burn-in test signals can be sent to the controller 400 through the slot connector 122, the wiring 116, and the connection terminal 114. In addition, the temperature measured by the temperature sensor 170 can be sent to the controller 400 through the wiring 116 and the connection terminal 114, and a signal for controlling the operation of the heating plate 140 can be sent to the heating plate 140 through the connection terminal 114, the wiring 116, and the hinge member 150 (more specifically, the wiring pattern 152). This will be explained in more detail later.

[0054] In various exemplary embodiments, a guiding portion 118 including an extending portion extending in a first direction (the Y-axis direction in the figure) can be defined on or at the first surface 111 of the substrate 110. More specifically, the guiding portion 118 or the extending portion can have an internal space and / or can form an internal space.

[0055] Thus, the extending portion of the guiding portion 118 can extend in the first direction, which is the main axis direction of the air for the burn-in test, and the air for the burn-in test can flow along the extending direction of the guiding portion 118, e.g., can flow laminarly and / or turbulently. As a reference, the first surface 111 of the substrate 110 can refer to the surface of the substrate 110 in the portion where the slot 120 is located and the guiding portion 118 is not provided.

[0056] More specifically, the guiding portion 118 may extend in a first direction (the Y-axis direction in the figure). For example, the guiding portion 118 may longitudinally extend from a first side 110a of the substrate 110 to a second side 110b of the substrate 110. In this example, the guiding portion 118 may extend to a portion of the second side 110b of the substrate 110 where the connection terminal 114 is not provided. In this way, the entire portion of the guiding portion 118 may include an extension portion extending in the first direction or be formed by an extension portion extending in the first direction. Therefore, the entire portion of the guiding portion 118 may extend in the main axis direction of the air for the aging test.

[0057] In various exemplary embodiments, a plurality of guiding portions 118 are provided in a second direction (the X-axis direction in the figure) transverse to (e.g., perpendicular to) the first direction, and the plurality of guiding portions 118 may extend in the first direction to be parallel to each other.

[0058] For example, the guiding portion 118 may include an inner guiding portion extending in a first direction (the Y-axis direction in the figure) between two adjacent slots 120 adjacent to each other in a second direction (the X-axis direction in the figure) among the plurality of slots 120. For example, a plurality of inner guiding portions may be included, each inner guiding portion extending in a first direction (the Y-axis direction in the figure) between two adjacent slots 120 adjacent to each other in a second direction (the X-axis direction in the figure) among the plurality of slots 120. For example, the guiding portion 118 may include an outer guiding portion extending in a first direction (the Y-axis direction in the figure) between an edge of the substrate 110 (e.g., the third side 110c or the fourth side 110d) and a slot 120 adjacent to the edge of the substrate 110 in a second direction (the X-axis direction in the figure). For example, it may include an outer guiding portion extending in a first direction (the Y-axis direction in the figure) between the third side 110c and a slot 120 adjacent to the third side 110c in a second direction (the X-axis direction in the figure), and another guiding portion extending in a first direction between the fourth side 110d and another slot 120 adjacent to the fourth side 110d in a second direction.

[0059] The guiding part 118 can control the flow of air for the aging test to keep the entire area of the aging board 100 at a uniform temperature. More specifically, the air for the aging test can be laminarly and / or turbulently transported from the first side 110a of the substrate 110 to the second side 110b of the substrate 110 through the internal space of the guiding part 118. In some example embodiments, the internal space of the guiding part 118 can form a channel for directly transferring the air for the aging test from the first side 110a of the substrate 110 to the second side 110b of the substrate 110. In this instance, when the air for the aging test moves, the air for the aging test flowing from the first side 110a of the substrate 110 to the second side 110b through the internal space of the guiding part 118 can diffuse to both sides of the internal space of the guiding part 118. As a result, the air for the aging test can be evenly supplied to the areas where the slots 120 are located on both sides of the guiding part 118.

[0060] The guiding part 118 is located at the edge part of the slot 120 and / or between two adjacent slots 120, and thus, no separate space is required for the guiding part 118. Alternatively or additionally, the guiding part 118 is adjacent to the slot 120, and thus, the air for the aging test can be stably supplied to the slot 120 on which the semiconductor device 20 is mounted. As described above, when a plurality of guiding parts 118 extending in the first direction are provided, the temperature uniformity of the substrate 110 can be further improved.

[0061] In various example embodiments, the width of the internal space of the guiding part 118 can be greater than the depth of the internal space of the guiding part 118. The width of the internal space of the guiding part 118 can refer to the width in a direction transverse to (e.g., perpendicular to) the first direction (the Y-axis direction in the figure), or refer to the width in the second direction (the X-axis direction in the figure), where the first direction is the extending direction of the extending part. For example, the width of the internal space of the guiding part 118 can refer to the maximum width or the average width. The depth of the internal space of the guiding part 118 can refer to the depth in the thickness direction (the Z-axis direction in the figure). For example, the depth of the internal space of the guiding part 118 can refer to the maximum depth and / or the average depth (such as the mean depth).

[0062] When the width of the internal space of the guiding part 118 is greater than the depth of the internal space of the guiding part 118, the air for the aging test can move along the internal space of the guiding part 118 and can widely diffuse to both sides of the guiding part 118. As a result, the temperature of the substrate 110 can be evenly maintained during the aging test. However, the example embodiments are not limited thereto. In some example embodiments, the width of the internal space of the guiding part 118 can be equal to or less than the depth of the internal space of the guiding part 118.

[0063] In various exemplary embodiments, the guiding part 118 may include, be formed by, or be at a groove 118a on the first surface 111 of the substrate 110. The space within the groove 118a may constitute the internal space of the guiding part 118. The groove 118a may be referred to as a concave surface, a passage through which air for aging test flows, an air guiding groove, an air groove, etc.

[0064] In the drawings, by way of example, it is shown that the internal space of the guiding part 118 or the groove 118a has a rectangular cross-sectional shape. Accordingly, the internal space may have a relatively large volume, and the groove 118a may have a stable structure. However, the exemplary embodiments are not limited thereto, and the shape of the internal space of the guiding part 118 or the groove 118a may be modified in various ways. For example, the cross-sectional shape of the internal space of the guiding part 118 or the groove 118a may have a circular portion and / or may have a polygonal shape other than a rectangular shape.

[0065] When the guiding part 118 includes, is formed by, or is at a groove 118a on or at the first surface 111, the volume of the air for aging test and the area of the first surface 111 of the substrate 110 in contact with the air for aging test may increase. Accordingly, the temperature uniformity of the substrate 110 may be further improved through the guiding part 118. In addition, the guiding part 118 having an internal space may be formed by a simple process. For example, the groove 118a may be formed by any of various methods such as grinding, etching, etc.; alternatively or additionally, certain features may be 3D printed. However, the exemplary embodiments are not limited thereto, and the groove 118a constituting the guiding part 118 may be formed by any of various methods.

[0066] In the drawings, by way of example, it is shown that the entire part of the guiding part 118 includes, or is formed by, an extension part extending in the first direction (the Y-axis direction in the figure), and does not include a part in a direction transverse to the first direction. However, the exemplary embodiments are not limited thereto. In some exemplary embodiments, the guiding part 118 may include a part formed in a direction transverse to the first direction.

[0067] In various example embodiments, the socket connector 122 may be positioned so as not to interfere with the air for the aging test. For example, the socket connector 122 is not provided at the edges (e.g., the first side and the second side) of the socket 120 that are transverse to the first direction (the Y-axis direction in the figure). The socket connector 122 may be provided at the edges (i.e., the third side and the fourth side) of the socket 120 that are parallel to the first direction (the Y-axis direction in the figure). Since the socket connector 122 is not provided at the edges of the socket 120 that are transverse to the first direction (e.g., the first side and / or the second side of the socket 120), the air for the aging test can flow without being disturbed by the socket connector 122, and this first direction is the main axis direction of the air for the aging test. In some example embodiments, the temperature difference of the substrate 110 can be improved by preventing or suppressing or reducing the air viscosity phenomenon caused by the socket connector 122.

[0068] On the other hand, when the socket connector is provided at the edges of the socket that are transverse to the first direction (e.g., the first side or the second side of the socket), during the flow of the air for the aging test, an air viscosity phenomenon may occur where the air for the aging test is blocked by the socket connector, and this first direction is the main axis direction of the air for the aging test. If multiple sockets are positioned in the first direction, when the air for the aging test moves from the inlet side to the opposite side, the air viscosity phenomenon may become more serious. Therefore, the temperature of one region (the region adjacent to the opposite side) is lower than the temperature of another region (e.g., the region adjacent to the inlet side), and thus, the temperature difference of the aging plate may be large.

[0069] In some example embodiments, the aerodynamic structure of the aging plate 100 can be improved by including the guiding part 118 and adjusting the position of the socket connector 122. As a result, during the aging test, it is possible to make the temperature of the substrate 110 more likely to be kept uniform.

[0070] In various example embodiments, the substrate 110 may include a first connection member for electrically connecting the wiring 116 of the substrate 110 and the articulated member 150. The first connection member will be described in more detail after the description of the articulated member 150.

[0071] In various example embodiments, the heating plate 140 may be fixed to the first surface 111 of the substrate 110 through the articulated member 150 and the support member 160. Reference will be made to Figure 5 and Figure 3 to describe the heating plate 140, the articulated member 150, the support member 160, and the fastening member 180 in more detail.

[0072] Figure 5 is a perspective exploded view showing the heating plate 140, the articulated member 150, and the fastening member 180 included in the Figure 3 shown aging plate 100.

[0073] Referring to Figure 3 and Figure 5 In some exemplary embodiments, the heating plate 140 may be spaced apart from the first surface 111 of the substrate 110 and the slot 120 in the thickness direction (the Z-axis direction of the drawing) by the hinge member 150 and the support member 160. The heating plate 140 may be separated from the substrate 110 to uniformly transfer heat to the substrate 110.

[0074] The heating plate 140 may be fixed to the substrate 110 so as to be openable. More specifically, the aging plate 100 may have a closed state and an open state. In the closed state, the aging plate 100 may have a relatively small thickness. In the open state, at least a portion of the heating plate 140 may be farther from the substrate 110 than in the closed state. For example, the relative distance between at least a portion of the substrate 110 and the heating plate 140 may change. For example, the first side of the heating plate 140 may be rotatably fixed to the hinge member 150, and the second side of the heating plate 140 opposite to the first side of the heating plate 140 may be movable on the substrate 110 such that the distance between the heating plate 140 and the substrate 110 changes.

[0075] When the aging plate 100 is in the system bracket 300, the heating plate 140 may have a closed state. In the closed state, the first side of the heating plate 140 is fixed to or supported by the hinge member 150, and other portions of the heating plate 140 (e.g., the second side of the heating plate 140) may be supported by the support member 160 on the substrate 110. Therefore, in the closed state, the aging plate 100 including the substrate 110 and the heating plate 140 may have a relatively small thickness or a constant thickness.

[0076] When the semiconductor device 20 is mounted on the slot 120 or when the semiconductor device 20 is separated from the slot 120, the heating plate 140 may have an open state. In the open state, the heating plate 140 may be spaced apart from the support member 160 of the substrate 110, and the heating plate 140 may be away from the substrate 110.

[0077] For example, the heating plate 140 may be opened and closed by an operator or an automated guided vehicle. For example, the heating plate 140 may further include a structure that can automatically open and close the heating plate 140.

[0078] The heating plate 140 may have any one of various structures capable of heating the substrate 110. For example, the heating plate 140 may include a first portion 1410 in which a heating portion 140a is located, and a second portion 1420 covering the first portion 1410. In Figure 5In this case, as an example, a groove portion is shown on or at the surface of the first part 1410 facing the second part 1420, and the heating portion 140a is located in the groove portion. As a result, the heating plate 140 including the heating portion 140a can have a simple and stable structure. However, the exemplary embodiments are not limited thereto, and the structure of the heating plate 140 including the heating portion 140a can be modified in various ways. For example, the heating portion 140a can be physically fixed to the first part 1410 and may not include the second part 1420. Various other modifications are possible.

[0079] In various exemplary embodiments, the first part 1410 may include a second connection member 1412 electrically connected to the heating portion 140a. For example, the connection wire 146 connected to the heating portion 140a may be connected to the second connection member 1412.

[0080] The first part 1410 and the second part 1420 may include or be formed of a material that does not deform or form contaminants at the temperature of the aging test process. For example, the first part 1410 or the second part 1420 may include any of various materials such as ceramics or metals. The heating portion 140a can have any one of various structures capable of heating the substrate 110. For example, the heating portion 140a may include a heating wire, a heat pipe, etc.

[0081] In various exemplary embodiments, the hinge member 150 can physically fix the substrate 110 and the heating plate 140 and electrically connect the wiring 116 of the substrate 110 and the heating plate 140.

[0082] In this example, the substrate 110 can be fixed to the hinge member 150 in a fixed state, and the heating plate 140 can be rotatably fixed to the hinge member 150. In Figure 5 In this case, as an example, the side surface of the hinge member 150 is fixed to the side surface of the substrate 110, and the heating plate 140 is located between two hinge members 150 on both sides. However, the exemplary embodiments are not limited thereto, and the arrangements of the hinge member 150, the substrate 110, and the heating plate 140 can be modified in various ways.

[0083] The articulated member 150 may include a wiring pattern 152. For example, the articulated member 150 may include a main body portion 154 and the wiring pattern 152 in the main body portion 154. In this example, the articulated member 150 including the wiring pattern 152 may be formed by any one of various methods. In some embodiments, the wiring pattern 152 having a wire shape may be in the main body portion 154 having blank spaces and be welded to form the articulated member having the wiring pattern 152 in the main body portion 154. In some embodiments, the articulated member 150 including the wiring pattern 152 may include or be formed by a printed circuit board. For example, the wiring pattern 152 may include a conductive material (e.g., metal).

[0084] The fastening member 180 may include a fastening substrate 110 and a first fastening member 181 of the articulated member 150, and a second fastening member 182 for fastening the heating plate 140 and the articulated member 150.

[0085] The wiring pattern 152 may be electrically connected to the substrate 110 (e.g., the wiring 116) and electrically connected to the heating plate 140 (e.g., the heating portion 140a or the connection wiring 146). In various exemplary embodiments, the articulated member 150 may be electrically connected to the substrate 110 through the first fastening member 181 and may be electrically connected to the heating plate 140 through the second fastening member 182.

[0086] By fastening the first fastening member 181 to a first connection member provided on the substrate 110, the wiring pattern 152 of the articulated member 150 and the wiring 116 of the substrate 110 may be electrically connected to each other. For example, the first connection member may be at one side of the third side 110c and / or the fourth side 110d of the substrate 110, and the first connection member may have the same or similar structure or shape as the second connection member 1412. As Figure 5 shown, when a plurality of first fastening members 181 are provided, at least one of the plurality of first fastening members 181 may electrically connect the wiring pattern 152 and the wiring 116.

[0087] By fastening the second fastening member 182 to the heating plate 140 (e.g., the second connection member 1412 electrically connected to the connection wiring 146), the wiring pattern 152 of the articulated member 150 and the heating portion 140a of the heating plate 140 may be electrically connected to each other.

[0088] For example, the first fastening member 181 or the second fastening member 182 has a screw shape, and the first connecting member or the second connecting member 1412 disposed on the substrate 110 may have a nut shape that can be fastened to the first fastening member 181 or the second fastening member 182. An internal thread may be provided on an inner surface of the first connecting member or the second connecting member 1412, and the internal thread is coupled to an external thread on an external surface of the first fastening member 181 or the second fastening member 182. Accordingly, the hinge member 150 and the substrate 110, and the hinge member 150 and the heating plate 140 can be physically and electrically connected with a simple structure.

[0089] However, the exemplary embodiments are not limited thereto, and the structure for physically and electrically connecting the hinge member 150 and the substrate 110 and / or the structure for physically and electrically connecting the hinge member 150 and the heating plate 140 can be modified in various ways. In some embodiments, the structure for physically connecting the hinge member 150 and the substrate 110 may be provided separately from the structure for electrically connecting the hinge member 150 and the substrate 110, and / or the structure for physically connecting the hinge member 150 and the heating plate 140 may be provided separately from the structure for electrically connecting the hinge member 150 and the heating plate 140. In various exemplary embodiments, the wiring pattern 152 of the hinge member 150 may be connected to the wiring 116 of the heating portion 140a and / or the substrate 110 through additional wiring, or the wiring pattern 152 of the hinge member 150 may be directly connected to the wiring 116 of the heating portion 140a and / or the substrate 110. Various other modifications are possible.

[0090] In the drawings, as an example, one second fastening member 182 is shown provided to rotatably fix the heating plate 140 to the hinge member 150, and a plurality of first fastening members 181 are provided to fixedly fix the substrate 110 and the hinge member 150 in a fixed state. However, the exemplary embodiments are not limited thereto. Accordingly, any one of various structures that can rotatably fix the heating plate 140 to the hinge member 150 can be applied, and any one of various structures that can fixedly fix the substrate 110 and the hinge member 150 in a fixed state can be applied.

[0091] The support member 160 may support the heating plate 140 such that the heating plate 140 is spaced apart from the first surface 111 of the substrate 110 and the slot 120. For example, the support member 160 may be in a corner region on the first surface 111 of the substrate 110, thereby minimizing interference with the slot 120 on or at the substrate 110 and the guiding portion 118 on or at the substrate 110. In the drawings, as an example, a plurality of support members 160 are shown in each corner region adjacent to the edge opposite to the hinge member 150, but the exemplary embodiments are not limited thereto. The support member 160 may be located at any of various positions to support the heating plate 140 in the closed state. In some embodiments, the plurality of support members 160 may be spaced apart at regular intervals along one edge. Various other modifications are possible.

[0092] In various exemplary embodiments, the temperature sensor 170 may be on or in the substrate 110. For example, the temperature sensor 170 may detect the temperature of the aging plate 100 or the substrate 110 in real time. The temperature sensor 170 may have any or various structures, types, kinds, etc. for detecting (e.g., detecting in real time) the temperature. The temperature sensor 170 may be electrically connected to the wiring 116 of the substrate 110.

[0093] The temperature sensor 170 may be located between a plurality of slots 120 in the first direction (the Y-axis direction in the figure). This is because there is no guiding portion 118 provided between the plurality of slots 120 adjacent to each other in the first direction (the Y-axis direction in the figure), and thus, sufficient space for the temperature sensor 170 can be ensured. However, the exemplary embodiments are not limited thereto, and the temperature sensor 170 may be at any of various positions. The temperature sensor 170 may be mounted on the first surface 111 of the substrate 110 or may be in the substrate 110.

[0094] In the drawings, as an example, a plurality of temperature sensors 170 are shown arranged one-to-one with a plurality of slots 120. Accordingly, the temperature distribution of the aging plate 100 or the substrate 110 may be accurately measured by the temperature sensors 170. However, the exemplary embodiments are not limited thereto, and one temperature sensor 170 may be provided in a region corresponding to the plurality of slots 120.

[0095] The temperature sensor 170 may be electrically connected to the connection terminal 114 through the wiring 116 of the substrate 110. Thus, the temperature measured by the temperature sensor 170 may be sent to the controller 400.

[0096] In an embodiment, the temperature in the aging test process may be appropriately controlled or maintained by the heating portion 140a. In this instance, the temperature in the aging test process may be detected in real time by the temperature sensor 170 and appropriately used to control or maintain the temperature of the substrate 110.

[0097] Reference will be made to Figure 6 and Figure 7 as well as Figure 3 and Figure 5 to describe in detail the electrical connection structure of the aging board 100 and the arrangement of the heating board 140 or the heating part 140a with respect to the substrate 110 according to various exemplary embodiments.

[0098] Figure 6 Schematically shows Figure 3 A plan view of the aging board 100 shown. Figure 7 Schematically shows Figure 3 A plan view of the heating board 140 and the hinge member 150 included therein. For clear understanding and simplified description, in Figure 6 The first fastening member 181, the second fastening member 182, the first connecting member, and the second connecting member 1412 are omitted, and mainly the part for describing the wiring of the substrate 110 is shown. For clear understanding and simplified description, in Figure 7 The position of the heating part 140a is mainly shown, and the second fastening member 182 and the second connecting member 1412 are omitted.

[0099] Reference is made to Figure 6 and Figure 7 , in some exemplary embodiments, the wiring 116 of the substrate 110 may include a first wiring 116a and a second wiring 116b. The first wiring 116a may electrically connect the wiring pattern 152 of the hinge member 150 and the connection terminal 114. The second wiring 116b may electrically connect the temperature sensor 170 and the connection terminal 114.

[0100] Therefore, the wiring pattern 152 of the hinge member 150 electrically connected to the heating board 140 may be connected to the connection terminal 114 through the first wiring 116a, and the temperature sensor 170 may be connected to the connection terminal 114 through the second wiring 116b. When the connection terminal 114 of the aging board 100 is inserted into the slot 210 (reference Figure 1 ) of the chamber 200 (reference Figure 2 ), the heating board 140 and the temperature sensor 170 may be connected to the chamber 200. Therefore, the operations of the heating board 140 and the temperature sensor 170 may be controlled by the controller 400.

[0101] In various exemplary embodiments, one heating board 140 may be provided to cover the entire area of the substrate 110.

[0102] In Figure 6In this case, as an example, the hinge member 150 is shown adjacent to the second side 110b of the substrate 110, and the support member 160 is adjacent to the first side 110a of the substrate 110. More specifically, the hinge member 150 may be located on the side surfaces of the third side 110c and the fourth side 110d adjacent to the second side 110b. Therefore, the opening and closing operations of the heating plate 140 performed by an operator or the like can be easily carried out. However, the exemplary embodiments are not limited thereto, and the hinge member 150 may be adjacent to the first side 110a of the substrate 110, and the support member 160 may be adjacent to the second side 110b of the substrate 110. In some exemplary embodiments, the hinge member 150 may be adjacent to the third side 110c or the fourth side 110d of the substrate 110, and the support member 160 may be adjacent to the fourth side 110d or the third side 110c of the substrate 110.

[0103] In Figure 7 this case, as an example, the heating portion 140a of the heating plate 140 is shown to be uniformly bent and / or zigzagged around the entire area of the substrate 110.

[0104] In some exemplary embodiments, as Figure 8 shown, the heating portion 140a of the heating plate 140 may be bent and / or zigzagged in a partial area of the substrate 110 or may be only around that partial area. Figure 8 Shows the portion corresponding to Figure 7 this. For example, the heating portion 140a of the heating plate 140 may be partially located in the portion adjacent to the second side 110b. Therefore, the temperature of the portion adjacent to the second side 110b, which is the opposite side of the inlet side, can be increased, and in this portion, the temperature may be relatively low during the aging test. For example, the temperature sensor 170 can detect the temperature of the portion adjacent to the first side 110a and the temperature of the portion adjacent to the second side 110b in real time, and when the temperature of the portion adjacent to the second side 110b is lower than the temperature of the portion adjacent to the first side 110a, the heating portion 140a can be operated to increase the temperature of the portion adjacent to the second side 110b. Thus, the temperature difference of the substrate 110 can be reduced.

[0105] In some example embodiments, the heating portion 140a of the heating plate 140 may include portions having different integration levels or different densities. For example, the heating portion 140a of the heating plate 140 may be more dense in the portion adjacent to the second side 110b than in the portion adjacent to the first side 110a. Accordingly, the temperature of the portion adjacent to the second side 110b, in which the temperature may be relatively low during the aging test, may be increased. The second side is the opposite side of the inlet side. For example, the temperature sensor 170 may detect in real time the temperature of the portion adjacent to the first side 110a and the temperature of the portion adjacent to the second side 110b, and when the temperature of the portion adjacent to the second side 110b is lower than the temperature of the portion adjacent to the first side 110a, the heating portion 140a may be operated to increase the temperature of the portion adjacent to the second side 110b. Accordingly, the temperature difference of the substrate 110 may be reduced.

[0106] According to various example embodiments, by including the guiding portion 118 capable of controlling the flow of air for the aging test, the temperature uniformity of the substrate 110 may be improved in the aging test process. In this instance, the socket connector 122 is positioned so as not to block the flow of air for the aging test, thereby further improving the temperature uniformity of the substrate 110. In addition, the aging plate 100 may be maintained at a desired temperature through the heating plate 140 and the temperature sensor 170 in the aging test process. In this instance, when the guiding portion 118, the heating portion 140a, and the temperature sensor 170 are included together, the temperature uniformity of the substrate 110 may be effectively improved in the aging test process.

[0107] The semiconductor device 20 mounted on the aging plate 100 and subjected to the aging test may be or may include (or be included in) a memory chip, a non-memory chip, or a combined semiconductor in which a memory portion and a non-memory portion are incorporated. In this instance, the memory chip may be or may include one or more of a volatile memory (such as a dynamic random access memory (DRAM), a static random access memory (SRAM), etc.) and a non-volatile memory (such as a NAND flash memory system, etc.). In some example embodiments, the semiconductor device 20 may be any one of various semiconductor devices 20 subjected to the aging test.

[0108] will be described with reference to Figure 9 together with Figures 1 to 8 a detailed description of an aging test method according to various example embodiments.

[0109] Figure 9 is a flowchart illustrating an aging test method according to various example embodiments.

[0110] The semiconductor device 20 may be mounted on the aging test apparatus 10 (S10).

[0111] More specifically, an aging board 100 can be prepared. The aging board 100 can include a substrate 110, a slot 120 on or at a first surface 111 of the substrate 110, and a heating plate 140 spaced apart from the surface 111 of the substrate 110 on the first surface 111 of the substrate 110.

[0112] Subsequently, the semiconductor device 20 can be mounted on the slot 120 of the aging board 100. In an open state where the heating plate 140 is turned on, the semiconductor device 20 can be mounted on the slot 120 of the aging board 100 such that the lead 22 of the semiconductor device 20 is electrically connected to the slot connector 122. The heating plate 140 can be closed to prepare the aging board 100 in a closed state.

[0113] Subsequently, the aging board 100 on which the semiconductor device 20 is mounted can be inserted into the rack system 300, and the connection terminal 114 of the aging board 100 can be inserted into the slot 210 of the chamber 200.

[0114] When the above aging board 100 is physically and electrically fixed to the chamber 200, the semiconductor device 20 can be mounted on the aging test device 10. At least a part of the process of mounting the semiconductor device 20 can be performed by an operator or by an automated guided vehicle under the control of the controller 400.

[0115] Air for aging test can be supplied into the chamber 200 (S12). The space part of the chamber 200 can be in a closed state closed by a baffle member.

[0116] Subsequently, it can be determined whether the temperature of the space part of the chamber 200 or the temperature of the substrate 110 has reached a set temperature for performing the aging test (S14). The determination of whether the set temperature has been reached can be performed by using a temperature sensor 170 of the aging board 100 or a separate temperature sensor in the chamber 200.

[0117] If the temperature of the space part of the chamber 200 or the temperature of the substrate 110 has not reached the set temperature for performing the aging test, the process of supplying air for aging test can be continued to increase the temperature.

[0118] When the temperature of the space part of the chamber 200 or the temperature of the substrate 110 reaches the set temperature for performing the aging test, the aging test device 10 can change to or enter the aging test mode (S20).

[0119] In the aging test mode, the temperature sensor 170 may periodically detect the temperature of the aging board 100 (e.g., the substrate 110) (S30). For example, the controller 400 may send a periodic temperature detection command to the temperature sensor 170, and the temperature sensor 170 may receive the periodic temperature detection command and periodically detect the temperature of the substrate 110. The temperature of the substrate 110 periodically detected by the temperature sensor 170 may be sent to the controller 400.

[0120] The controller 400 may determine whether the temperature of the substrate 110 periodically detected by the temperature sensor 170 is lower than a reference temperature (S32). The reference temperature may refer to the minimum temperature of the substrate 110 to be maintained during the aging test.

[0121] If the temperature of the substrate 110 periodically detected by the temperature sensor 170 is at or above the reference temperature, the aging test may be performed. For example, an aging test signal may be sent (S34), the aging test signal (e.g., an output signal of the aging test signal) may be received (S36), and it may be determined whether the semiconductor device 20 has a defect (S38). If it is determined in the aging test that the semiconductor device 20 has no defect, the aging test may continue. If it is determined that the semiconductor device 20 has one or more defects in the aging test, it may be determined that the semiconductor device 20 has at least one defect (S40).

[0122] When the temperature of the substrate 110 periodically detected by the temperature sensor 170 is lower than the reference temperature, the controller 400 may operate the heating part 140a of the heating plate 140 (S50). As a result, the temperature of the substrate 110 may be increased, and the temperature of the substrate 110 may be controlled.

[0123] During the operation of the heating part 140a, the aging test performed on the semiconductor device 20 may be continuously executed. In some example embodiments, during the operation of the heating part 140a, the aging test performed on the semiconductor device 20 may be temporarily stopped. The controller 400 may determine whether the temperature of the substrate 110 periodically detected by the temperature sensor 170 is lower than the reference temperature (S32) when operating the heating part 140a, and continue with subsequent processing. When the temperature of the substrate 110 is at a specific level (e.g., at or above the reference temperature), the controller 400 may stop the operation of the heating part 140a.

[0124] When the aging test is completed, the aging board 100 on which the semiconductor device 20 is mounted is taken out of the chamber 200, the heating plate 140 is opened, and the semiconductor device 20 is separated from the slot 120. At least a part of the process of separating the semiconductor device 20 may be performed by an operator and / or by an automated guided vehicle under the control of the controller 400.

[0125] Hereinafter, with reference toFigures 10 to 16 More specifically, an aging board according to various exemplary embodiments or modified embodiments different from the above-described embodiments and an aging test method using the aging board will be described. In cases where components are not described in detail below, it can be understood that the component is at least similar to the corresponding component described elsewhere in the present disclosure.

[0126] Figure 10 is a plan view schematically showing an aging board according to various exemplary embodiments. Figure 11 is a plan view schematically showing a heating board and a hinge member included in the aging board according to an embodiment.

[0127] Referring to Figure 10 and Figure 11 , in various exemplary embodiments, the heating board 140 or the heating part 140a may include a plurality of heating boards 141 and 142 or a plurality of heating parts 141a and 142a to respectively correspond to a plurality of regions A1 and A2 of the substrate 110. Hereinafter, as an example, it is described that the heating board 140 or the heating part 140a may include a first heating board 141 and a second heating board 142 or a first heating part 141a and a second heating part 142a to respectively correspond to the first region A1 and the second region A2 of the substrate 110.

[0128] In various exemplary embodiments, a first hinge member 150a for rotatably fixing the first heating board 141 may be adjacent to a first side 110a of the substrate 110, and a first support member 161 for supporting the first heating board 141 may be adjacent to the central portion. A second hinge member 150b for rotatably fixing the second heating board 142 may be adjacent to a second side 110b of the substrate 110, and a second support member 162 for supporting the second heating board 142 may be adjacent to the central portion.

[0129] A first heating part 141a of the first heating board 141 may be electrically connected to a wiring 116 (e.g., a first wiring 116a) or a connection terminal 114 of the substrate 110 through the first hinge member 150a. A second heating part 142a of the second heating board 142 may be electrically connected to a wiring 116 (e.g., a first wiring 116a) or a connection terminal 114 of the substrate 110 through the second hinge member 150b. Accordingly, the first heating board 141 (e.g., the first heating part 141a) and the second heating board 142 (e.g., the second heating part 142a) may be individually controlled by a controller 400.

[0130] The temperature sensor 170 may include a plurality of temperature sensors 171 and 172 that are separately positioned to correspond to a plurality of regions A1 and A2 of the substrate 110. For example, the temperature sensor 170 may include a first temperature sensor 171 in the first region A1 and a second temperature sensor 172 in the second region A2. The first temperature sensor 171 and the second temperature sensor 172 may be electrically connected to the connection terminal 114 through wirings 116 (e.g., the second wiring 116b) of the substrate 110, respectively.

[0131] Accordingly, the plurality of temperature sensors 171 and 172 may detect the temperatures of the plurality of regions A1 and A2 of the substrate 110 in real time. The controller 400 may separately control the temperatures of the plurality of regions A1 and A2 of the substrate 110 through a feedback circuit between the plurality of heating portions 141a and 142a and the plurality of temperature sensors 170.

[0132] In this example, the aging test temperatures of the plurality of regions A1 and A2 may be set or controlled by a user through the controller 400 (e.g., the aging software in the controller 400). The controller 400 may perform temperature detection in real time through the temperature sensor 170, perform feedback between the temperature sensor 170 and the plurality of heating portions 140a, and perform temperature maintenance through the heating portions 140a through the aging software.

[0133] For example, by setting the aging test temperatures in the plurality of regions A1 and A2 to be different, aging tests at different temperatures may be performed through a single aging test. For example, in the aging test, the aging test temperatures of the plurality of regions A1 and A2 may be maintained to have a temperature difference of 25 degrees Celsius to 150 degrees Celsius. Accordingly, by performing aging tests at various aging test temperatures in a single aging test, the aging test process may be simplified. In this example, if there are non-compliant regions in the plurality of regions A1 and A2 of the substrate 110 where the temperature is lower than the reference temperature, the corresponding heating portions among the plurality of heating portions 141a and 142a corresponding to the non-compliant regions are operated to raise the temperature of the non-compliant regions.

[0134] In some example embodiments, the aging test may be performed throughout the entire region of the substrate 110 at the same temperature. In this example, if there are non-compliant regions in the plurality of regions A1 and A2 of the substrate 110 where the temperature is lower than the reference temperature, the corresponding heating portions among the plurality of heating portions 141a and 142b corresponding to the non-compliant regions are operated to raise the temperature of the non-compliant regions. As a result, the aging test may be performed at a uniform temperature throughout the entire region of the substrate 110.

[0135] In Figure 10 and Figure 11Among them, as an example, it is shown that the heating plate 140 includes a plurality of heating plates 141 and 142. Accordingly, a plurality of heating portions 140a separately provided on the plurality of heating plates 140 can be positioned so as not to interfere with each other. However, the exemplary embodiments are not limited thereto.

[0136] In some exemplary embodiments, as Figure 12 shown, the heating plate 140 includes one heating plate, and a plurality of heating portions 140a whose operations can be individually controlled can be included in one heating plate. Accordingly, one heating plate is provided, and thus, the opening and closing operations of the heating plate 140 can be easily performed. In Figure 12 Among them, as an example, it is shown that a plurality of first hinge members 150a electrically connected to the first heating portion 141a are located on the third side, and a plurality of second hinge members 150b electrically connected to the second heating portion 142a are located on the fourth side. In this instance, the heating plate 140 can be rotatably fixed to one of the plurality of first hinge members 150a among the plurality of first hinge members 150a and one of the plurality of second hinge members 150b among the plurality of second hinge members 150b. The arrangements of the first hinge members 150a, the second hinge members 150b, and the plurality of heating portions 141a and 142a can be modified in various ways.

[0137] Reference will be made to Figure 13 together with Figures 10 to 12 describe an example of an aging test method in the case of including a plurality of heating portions 140a or a plurality of heating plates 140 that can be individually controlled as described above.

[0138] Figure 13 is a flowchart showing an aging test method according to various exemplary embodiments.

[0139] A semiconductor device 20 can be installed on the aging test apparatus 10 (S10), and air for the aging test can be supplied into the chamber 200 (S12). Subsequently, it can be determined whether the temperature of the space portion of the chamber 200 or the temperature of the substrate 110 has reached the set temperature for performing the aging test (S14).

[0140] If the temperature of the space portion of the chamber 200 or the temperature of the substrate 110 has not reached the set temperature for performing the aging test, the process of supplying air for the aging test can be continued to raise the temperature. In this instance, when the aging test temperatures of the plurality of regions A1 and A2 of the substrate 110 are different from each other, at least a part of the plurality of heating portions 141a and 142a can be operated together to control the temperature of the substrate 110 such that the temperatures of the plurality of regions A1 and A2 correspond to the aging test temperature.

[0141] When the temperature of the space portion of the chamber 200 and / or the temperature of the substrate 110 reaches the set temperature for performing the aging test, the aging test apparatus 10 may change to or enter the aging test mode (S20).

[0142] In the aging test mode, the temperature sensor 170 may periodically detect the temperature of the aging board 100 (e.g., the substrate 110) (S30). For example, the controller 400 may send a periodic temperature detection command to the plurality of temperature sensors 171 and 172, and the plurality of temperature sensors 171 and 172 may receive the periodic temperature detection command and periodically detect the temperature of the substrate 110. The temperature of the substrate 110 periodically detected by the plurality of temperature sensors 171 and 172 may be sent to the controller 400.

[0143] The controller 400 may determine whether there is a non-compliant area where the temperature of the substrate 110 is lower than the reference temperature (S62).

[0144] If the temperature of the substrate 110 periodically detected by the temperature sensor 170 is the reference temperature or higher, the aging test may be performed. For example, an aging test signal may be sent (S34), the aging test signal (e.g., the output signal of the aging test signal) may be received (S36), and it may be determined whether there is a defect in the semiconductor device 20 (S38). If it is determined in the aging test that the semiconductor device 20 has no defect, the aging test may continue. If it is determined in the aging test that the semiconductor device 20 has a defect, it may be determined that the semiconductor device 20 is defective (S40).

[0145] When there is a non-compliant area in the substrate 110, the controller 400 may selectively heat the non-compliant area by operating the corresponding heating portion 140a corresponding to the non-compliant area (S70). As a result, the temperature of the non-compliant area may be raised, and the temperature of the substrate 110 may be controlled.

[0146] During the operation of the heating portion 140a, the aging test performed on the semiconductor device 20 in the non-compliant area may be continuously performed. In some exemplary embodiments, during the operation of the heating portion 140a, the aging test performed on the semiconductor device 20 in the non-compliant area may be temporarily stopped. The controller 400 may continuously determine the temperature of the non-compliant area and the temperature of the other part(s) through the plurality of temperature sensors 171 and 172 while operating the corresponding heating portion 140a. When the temperature of the non-compliant area reaches a specific level (e.g., the reference temperature or higher), the controller 400 may stop the operation of the corresponding heating portion 140a.

[0147] In some example embodiments, the controller 400 may separately control a plurality of heating portions 141a and 142a corresponding to a plurality of regions A1 and A2 of the aging board 100 such that the aging test temperatures of the plurality of regions A1 and A2 can be kept different. In some embodiments, the controller 400 may maintain the same aging test temperature in the plurality of regions A1 and A2 of the aging board 100 by controlling the plurality of heating portions 141a and 142a.

[0148] When the aging test is completed, the aging board 100 on which the semiconductor device 20 is mounted is taken out of the chamber 200, the heating plate 140 is opened, and the semiconductor device 20 is separated from the slot 120. At least a part of the process of separating the semiconductor device 20 may be performed by an operator or by an automated guided vehicle under the control of the controller 400.

[0149] In the drawings and the above description, as an example, the number of the heating plates 140 or the heating portions 140a corresponding to one substrate 110 is two. However, the example embodiments are not limited thereto. Three or more heating plates 140 may be included.

[0150] Figure 14 is a cross-sectional view showing a state in which a semiconductor device is mounted on an aging board according to various example embodiments.

[0151] Referring to Figure 14 , the guiding portion 118 according to various example embodiments may include or be formed by a guiding structure 118b provided on the first surface 111 of the substrate 110. For example, the guiding portion 118 may be formed by attaching the guiding structure 118b to the first surface 111 of the substrate 110 such that an internal space through which air for aging test flows is provided on the first surface 111 of the substrate 110.

[0152] The guiding structure 118b may include an extending portion extending in a first direction (the Y-axis direction in the figure), such as the groove 118a described with reference to Figures 1 to 8 , and a plurality of guiding structures 118b may be provided in a second direction (the X-axis direction in the figure). Unless otherwise described, the description of the guiding portion 118 or the groove 118a may be applied to the guiding portion 118 or the guiding structure 118b described with reference to Figures 1 to 8 . Figures 14 to 16 The description of the guiding portion 118 or the guiding structure 118b described with reference to

[0153] In Figure 14 , as an example, it is shown that the guiding structure 118b has two side surfaces and a bottom surface to have an internal space formed by the two side surfaces and the bottom surface. Accordingly, by attaching the guiding structure 118b to the substrate 110, the guiding portion 118 can be easily formed between the plurality of slots 120.

[0154] In some example embodiments, as Figure 15 shown, the guiding structure 118b may include a plurality of protrusions (e.g., two protrusions) attached to the first surface 111 of the substrate 110. The guiding structure 118b may have Figure 14 a shape of two side surfaces of the guiding structure 118b shown in

[0155] In some example embodiments, as Figure 16 shown, the guiding structure 118b may include one protrusion attached to the first surface 111 of the substrate 110. In this example, the internal space may be located between the guiding structures 118b on both sides of a slot 120 in the second direction (the X-axis direction in the figure). For example, the portion where the slot 120 is located may correspond to the internal space of the guiding structure 118b or the guiding portion 118. Accordingly, air (e.g., high-temperature air) for the aging test can be effectively provided to the portion where the slot 120 is located. As a result, the temperature of the portion where the slot 120 is located can be effectively increased.

[0156] Although some examples have been described in connection with what are considered various example embodiments, it will be understood that the inventive concept is not limited thereto, and the inventive concept is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. In addition, the example embodiments are not necessarily mutually exclusive. For example, some example embodiments may include one or more features described with reference to one or more of the drawings and may also include one or more other features described with reference to one or more other drawings.

Claims

1. An aging board, comprising: A substrate having a first surface and a second surface opposite to each other; And A slot configured to receive a semiconductor device on or at the first surface of the substrate, Wherein the aging board defines a guiding portion, the guiding portion includes an extending portion extending in a first direction and has an internal space on or at the first surface of the substrate.

2. The aging board according to claim 1, wherein, The guiding portion or the extending portion extends from an inlet side to an opposite side opposite to the inlet side, and the inlet side is configured to have air inflow during an aging test.

3. The aging board according to claim 1, wherein, The slot includes a plurality of slots, and in a plan view, the plurality of slots are arranged in a second direction transverse to the first direction, and The guiding portion is located between two slots adjacent to each other in the second direction among the plurality of slots, or is located between one slot among the plurality of slots and an edge of the substrate.

4. The aging board according to claim 1, wherein The guiding portion includes a groove having an internal space on or at the first surface of the substrate.

5. The aging board according to claim 1, wherein, The guiding portion includes a guiding structure on the first surface of the substrate.

6. The aging board according to claim 1, wherein, The width of the internal space is greater than the depth of the internal space.

7. The aging board according to claim 1, further comprising: A heating plate located on the first surface of the substrate and spaced apart from the first surface of the substrate.

8. The aging board according to claim 7, further comprising: A hinge member fixed to a side surface of the substrate and a side surface of the heating plate, wherein the heating plate is rotatably mounted to the hinge member; and A support member configured to support the heating plate on the first surface of the substrate.

9. The aging board according to claim 8, wherein, The heating plate is electrically connected to the wiring of the substrate through the hinge member.

10. The aging board according to claim 1, further comprising: A temperature sensor located on or in the substrate, Wherein the temperature sensor is electrically connected to the wiring of the substrate.

11. The aging board according to claim 1, further comprising: A heating plate located on the first surface of the substrate and spaced apart from the first surface of the substrate, Wherein the heating plate includes a plurality of heating portions corresponding to a plurality of regions of the substrate respectively.

12. The aging board according to claim 11, further comprising: A temperature sensor located on or in the substrate, Wherein the temperature sensor includes a plurality of temperature sensors corresponding to the plurality of regions of the substrate respectively.

13. The aging board according to claim 1, wherein, The slot includes a slot connector, and The slot connector is located at an edge of the slot parallel to the first direction.

14. An aging board, comprising: A substrate having a first surface and a second surface opposite to each other; A slot configured to receive a semiconductor device on or at the first surface of the substrate; And A heating plate located on the first surface of the substrate and spaced apart from the first surface of the substrate.

15. The aging board according to claim 14 further comprises: a hinge member fixed to a side surface of the substrate and a side surface of the heating plate, wherein the heating plate is rotatably mounted to the hinge member; and a support member configured to support the heating plate on the first surface of the substrate.

16. The aging board according to claim 14 further comprises: a temperature sensor located on or in the substrate, wherein the temperature sensor is electrically connected to a wiring of the substrate.

17. The aging board according to claim 16, wherein the heating plate includes a plurality of heating portions respectively corresponding to a plurality of regions of the substrate, and the temperature sensor includes a plurality of temperature sensors respectively corresponding to the plurality of regions of the substrate.

18. An aging test method, comprising: placing an aging board including a heating plate and a substrate on which a semiconductor device is mounted in an aging test apparatus; and performing the aging test of the semiconductor device in a state where air for the aging test is supplied, wherein, in the aging test, the method includes detecting a temperature of the substrate and operating the heating plate in response to the temperature of the substrate being lower than a reference temperature, and the heating plate raises the temperature of the substrate.

19. The aging test method according to claim 18, wherein the heating plate includes a plurality of heating portions respectively corresponding to a plurality of regions of the substrate, and in the aging test, in response to a non-compliant region having a temperature lower than the reference temperature among the plurality of regions, the method includes operating a corresponding heating portion corresponding to the non-compliant region among the plurality of heating portions to selectively raise the temperature of the non-compliant region.

20. The aging test method according to claim 18, wherein the heating plate includes a plurality of heating portions respectively corresponding to a plurality of regions of the substrate, and in the aging test, the method includes separately operating at least two heating portions among the plurality of heating portions to keep the aging test temperatures of at least two regions among the plurality of regions different.

Images