A high-speed test socket and method for producing radio frequency LTCC filters

Abstract

The present invention discloses a high-speed test socket and method for producing radio frequency LTCC filters, comprising a test fixture, a test PCB board, and a test socket body. The test fixture comprises a DUT fixing assembly and a clamping plate, wherein the DUT fixing assembly and the clamping plate are detachably connected, the test PCB board is fixed between the clamping plate and the test socket body, a through hole is provided on the DUT fixing assembly, and the clamping plate is provided with a mounting hole at a position corresponding to the through hole. The through hole and the mounting hole are interpenetrating, and a conductive member for connecting the DUT to the test PCB board is provided. By utilizing other conductive members, such as probes, and adopting a radio frequency probe method for testing, the accuracy and stability of radio frequency index testing are improved while also extending the service life of the test fixture, thereby improving test efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of radio frequency component production and testing, and in particular to a high-speed test socket and method for producing radio frequency LTCC filters. Background Art

[0002] LTCC, or low-temperature co-fired ceramic, is a technology that enables the packaging of three major passive components—resistors, capacitors, and inductors—as well as various other passive components like filters and transformers, within a multi-layer wiring substrate. LTCC technology has been widely adopted in various products, including mobile phones, Bluetooth, GPS modules, WLAN modules, and Wi-Fi modules. Due to its exceptional reliability, its application in automotive electronics, communications, aerospace and military, microelectromechanical systems, and sensor technology is steadily increasing. With the advent of the 5G era, the advantages of LTCC technology are becoming increasingly prominent. It boasts high conductivity, low dielectric Q, and low processing temperatures, while also excelling in high-frequency characteristics, sealing, and heat dissipation.

[0003] LTCC RF filters are primarily used in consumer electronics and networking applications (such as smartphones and base stations). During LTCC RF filter production, electrical performance testing is the most time-consuming step in the entire production process and a bottleneck limiting production capacity. Currently, conductive adhesive testing is commonly used in LTCC filter production. This testing method typically achieves a test speed (UPH: Units Per Hour) of 18-20k, presenting the following challenges:

[0004] 1) In the initial stage, the electrical performance test indicators are acceptable. As the number of tests increases, the electrical performance test indicators drop sharply. According to empirical statistics, assuming a UPH of 20k, the test indicators will generally drop significantly after 2 hours (i.e., testing 40k DUTs). The conductive cloth needs to be replaced and debugged to ensure the test effect.

[0005] 2) The time required to replace the conductive cloth and debug after replacement is relatively long, usually about 1 hour;

[0006] 3) High-quality conductive fabrics are expensive. Based on the estimated consumables, the testing cost of the LTCC filter will become higher. In addition, the S parameters of the conductive fabric cannot be extracted, so the test errors cannot be eliminated through calibration technology. Summary of the Invention

[0007] The purpose of the present invention is to provide a high-speed test socket and method for the production of radio frequency LTCC filters. By utilizing other conductive parts such as probes and adopting radio frequency probes for testing, the accuracy and stability of radio frequency index testing are improved while also extending the service life of the test fixture, thereby improving test efficiency.

[0008] In order to achieve the above objectives, this application provides the following solutions:

[0009] On the one hand, the present invention provides a high-speed test socket for the production of radio frequency LTCC filters, comprising a test fixture, a test PCB board and a test socket body, wherein the test fixture comprises a DUT fixing assembly and a clamping plate, wherein the DUT fixing assembly and the clamping plate are detachably connected, the test PCB board is fixed between the clamping plate and the test socket body, a through hole is provided on the DUT fixing assembly, and a mounting hole is opened on the clamping plate at a position corresponding to the through hole, the through hole and the mounting hole penetrate each other, and a conductive member is provided for connecting the DUT with the test PCB board.

[0010] In some optional implementation schemes, the test piece fixing assembly includes a fixture cover, and clamping assemblies are symmetrically provided on two opposite sides of the fixture cover. One end of the clamping assembly extends to the top of the fixture cover, and the other end of the clamping assembly extends to the bottom of the fixture cover and is clamped to the clamp plate, so that the test piece is fixed between the fixture cover and the clamp plate.

[0011] In some optional embodiments, the clamp cover is provided with a groove for placing the clamping assembly, the clamping assembly includes an abutment block, an elastic member and a clamping claw, the abutment block is fixed inside the groove, one end of the elastic member is fixed on the abutment block, and the other end is fixed on the upper end of the clamping claw, and the lower end of the clamping claw is clamped with the splint, and the clamping claw can move in the groove through the elastic action of the elastic member to realize the fixation and disassembly of the lower end of the clamping claw and the splint.

[0012] In some optional implementation schemes, a gripping portion integrally formed with the clamping jaw is provided at the upper end portion of the clamping jaw, and an anti-slip protrusion is provided on a side of the gripping portion facing away from the abutment block.

[0013] In some optional embodiments, the conductive member includes a plurality of parallel RF probes, each of which has one end extending through a mounting hole of the clamping plate to conduct electricity with a microstrip line on the PCB, and the other end conducting electricity with the device under test positioned between the clamping plate and the fixture cover. The RF probes connect the microstrip line between the device under test and the PCB.

[0014] In some optional embodiments, the radio frequency probes use three minimum radio frequency probes with claw-shaped probe heads and a diameter of 0.08 mm, and a hard gold coating is used on the probe heads.

[0015] In some optional implementation schemes, the mounting hole of the splint includes a rectangular mounting hole, and a limit block is provided in the rectangular mounting hole for limiting the three radio frequency probes respectively. The limit block is T-shaped as a whole, and a probe limit hole is provided at the center of the T-shaped limit block. The T-shaped limit block is clamped in the rectangular mounting hole, and the gap between the T-shaped limit block and the inner wall of the rectangular mounting hole forms two limit holes, and the three radio frequency probes are placed in the three limit holes respectively.

[0016] In some optional embodiments, the clamp includes a first clamp and a second clamp, the lower end surface of the first clamp is provided with a mounting groove for clamping the second clamp, the first clamp is clamped to the fixed assembly of the test piece, and both the first clamp and the second clamp are provided with through mounting holes.

[0017] In a second aspect, the present application provides a high-speed testing method for RF LTCC filter production, wherein the high-speed test socket of the first aspect is used to fix the DUT on a test machine. The testing process is as follows:

[0018] S1. Calibrate to the test cable end face and save the calibrated file as the first calibration file;

[0019] S2. Call the first calibration file, calibrate to the test PCB end surface, and save the calibrated file as the second calibration file;

[0020] S3, calling the second calibration file, calibrating to the tip of the radio frequency probe, and saving the calibrated file as a third calibration file;

[0021] S4. Place the DUT into the high-speed test socket described in the first aspect, connect the test instrument to the test PCB using a test cable, and perform a pre-test on the DUT.

[0022] S5. If the pre-test passes, various parameter tests are performed on the device under test until all tests are completed and the test results of the device under test are obtained.

[0023] In some optional implementation schemes, the specific process of calibrating the tip of the radio frequency probe in step S3 is:

[0024] S31. Connect the radio frequency probe to the vector network analyzer through the probe fixture, obtain the S parameters of the radio frequency probe, and store the S parameters of the radio frequency probe as a probe SNP file;

[0025] S32, importing the probe SNP file into the vector network analyzer;

[0026] S33. Call the second calibration file, and use the port extension method to extend the test end face to the needle tip of the probe to obtain a third calibration file.

[0027] The present invention has the beneficial effects:

[0028] This application provides a test socket suitable for automatic test machines. It uses a radio frequency probe for testing. While improving the accuracy and stability of radio frequency index testing, it also extends the service life of the test fixture, thereby improving test efficiency. Furthermore, the smallest radio frequency probe with a diameter of 0.08mm is selected, covering a frequency of 25GHz, which is four times higher than the maximum test frequency. This ensures that the test frequency used is in the middle of the probe frequency index and meets future test needs.

[0029] In addition, to optimize the test process, a probe calibration action was added before the pre-test. Combined with the de-embedding calibration technology, the test end face was moved further forward from the microstrip line of the PCB board to the end face of the device under test, thereby improving the accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 An exploded diagram of a high-speed test socket for producing radio frequency LTCC filters provided by an embodiment of the present invention;

[0031] Figure 2 A schematic diagram of a state where a fixing assembly of a piece to be tested and a clamping plate are engaged with each other according to an embodiment of the present invention;

[0032] Figure 3 A schematic diagram of the structure of a limit block provided in an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of a test PCB board provided in an embodiment of the present invention;

[0034] Figure 5 A flow chart of a high-speed testing method for producing radio frequency LTCC filters provided by an embodiment of the present invention;

[0035] Figure 6 This is the S parameter test result when using conductive fabric;

[0036] Figure 7 The following are the S parameter test results of the test socket of this application.

[0037] Reference numerals:

[0038] 1-DUT fixing assembly, 11-fixture cover, 12-groove, 13-abutment block, 14-elastic member, 15-clamping claw, 16-anti-slip protrusion, 17-through hole, 2-clamping plate, 21-first clamping plate, 22-second clamping plate, 23-mounting hole, 3-test PCB board, 31-microstrip line, 4-test seat body, 5-RF probe, 6-limiting block, 61-limiting hole. DETAILED DESCRIPTION

[0039] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] Unless otherwise specifically stated, the relative arrangement of components and steps, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0041] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0042] Additionally, descriptions of well-known structures, functions, and configurations may be omitted for clarity and conciseness. Those skilled in the art will recognize that various changes and modifications can be made to the examples described herein without departing from the spirit and scope of the present disclosure.

[0043] Technologies, methods and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods and equipment should be considered part of the authorization specification.

[0044] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0045] Example 1

[0046] like Figure 1 As shown, this embodiment provides a high-speed test socket for the production of radio frequency LTCC filters, including a test fixture, a test PCB board 3 and a test socket body 4. The test fixture includes a DUT fixing component 1 and a clamping plate 2, wherein the DUT fixing component 1 and the clamping plate 2 are detachably connected, and the test PCB board 3 is fixed between the clamping plate 2 and the test socket body 4. A through hole 17 is provided on the DUT fixing component 1, and a mounting hole 23 is opened on the clamping plate 2 at a position corresponding to the through hole 17. The through hole 17 and the mounting hole 23 are penetrated, and a conductive member is provided for connecting the DUT and the test PCB board 3.

[0047] like Figure 2 As shown, the test piece fixing assembly 1 includes a fixture cover 11 for placing the test piece, and clamping assemblies are symmetrically provided on opposite sides of the fixture cover 11. One end of the clamping assembly extends to the top of the fixture cover 11 to place the test piece above the through hole 17, and the other end of the clamping assembly extends to the bottom of the fixture cover 11 and is clamped to the clamping plate 2. It can be seen that the fixture cover 11 is provided with a groove 12 for placing the clamping assembly. The clamping assembly includes an abutment block 13, an elastic member 14 and a clamping claw 15. The abutment block 13 is fixed inside the groove 12. One end of the elastic member 14 is fixed to the abutment block 13, and the other end is fixed to the upper end of the clamping claw 15. The lower end of the clamping claw 15 is clamped to the clamping plate 2. Through the elastic action of the elastic member 14, the clamping claw 15 can move in the groove 12 to achieve the fixing and removal of the lower end of the clamping claw 15 and the clamping plate 2. The elastic member 14 can use a device such as a spring.

[0048] When the clamp cover 11 and the clamp plate 2 need to be fixed, the clamping claw 15 is pressed by applying a squeezing force on the gripping portion to compress the spring, so that the clamping claw 15 is tilted up, and then the tilted portion is clamped into the clamping groove in the clamp plate 2, so that the clamp cover 11 and the clamp plate 2 are fixed (the state at this time is as shown in FIG. Figure 2 When disassembling, similarly, the spring is pressed to disengage the clamping jaw 15 from the clamping groove, and then the clamp cover 11 is moved upward to separate the clamp cover 11 and the clamp plate 2. In order to increase the friction of the gripping portion, a gripping portion is provided at the upper end of the clamping jaw 15 and is integrally formed with the clamping jaw 15. The gripping portion is provided with an anti-slip protrusion 16 on the side facing away from the abutment block 13.

[0049] Specifically, if Figure 4 As shown, the conductive member includes several parallel RF probes 5. One end of each RF probe 5 passes through the mounting hole 23 of the clamping plate 2 to connect to the microstrip line 31 on the PCB, and the other end passes through the through hole 17 of the fixture cover 11 to connect to the device under test. Through the through hole 17, the device under test and the microstrip line 31 on the PCB are connected.

[0050] The RF probes use three claw-shaped probes with a diameter of 0.08mm, the smallest RF probes, coated with hard gold. Increasing the number of grounding points and probes reduces high-frequency parasitic parameters, making the test results closer to the true value. The probes in this embodiment are specially customized. The dimensions of the customized probes are: 0.08mm diameter RF probes. Other characteristics of the customized probes are:

[0051] Mechanical properties

[0052] Spring force: 19 grams @0.40 mm

[0053] This means that when the probe is compressed to a stroke of 0.40 mm, the contact pressure generated by the spring is 19 g-force;

[0054] Total length: 0.50mm

[0055] Indicates the maximum movable distance of the probe from the free state to the fully compressed state;

[0056] Recommended stroke: 0.40 mm

[0057] Recommended optimal compression stroke to ensure long-term stability and mechanical life;

[0058] Mechanical life: 200,000 cycles

[0059] The number of compression and rebound times the probe can withstand under the recommended working stroke;

[0060] Operating temperature: -40°C ~125°C

[0061] Material properties

[0062] Probe-head: Palladium alloy

[0063] Probe - Bottom: Beryllium copper with gold plating (nickel bottom)

[0064] Outer sleeve: Phosphor bronze - inner wall gold plated (nickel base)

[0065] Spring: Musical steel wire gold plated (nickel base)

[0066] Electrical characteristics

[0067] Bandwidth: 25GHz@-0.3dB

[0068] Supports high-frequency signal testing, suitable for RF circuit testing;

[0069] Current capacity: 1.2A continuous

[0070] Maximum sustainable carrying current

[0071] Self-inductance: 0.51nH, mutual inductance: 0.24nH

[0072] Low inductance design reduces signal delay and crosstalk;

[0073] Capacitance: 0.35pF

[0074] Tiny parasitic capacitance to avoid high-frequency signal distortion;

[0075] DC resistance: <80 mΩ (average value)

[0076] Low contact resistance to ensure signal integrity;

[0077] The performance of the customized RF probe has been tested and its coverage frequency is 25GHz, which is four times higher than the maximum test frequency. This ensures that the test frequency is in the middle of the probe frequency specification and meets future test requirements. The return loss of the selected probe is 6dB higher than the DUT requirement, ensuring test margin and reducing test uncertainty.

[0078] The probe selected for this application has good conductivity and has been hardened, combining the advantages of brass and steel: ensuring stable contact and good durability without scratching the measured object; and the probe coating is made of hard gold to ensure that the probe has good chemical resistance and provides good protection against dirt and corrosion at the production site.

[0079] like Figure 3As shown, the mounting hole is not only used to place the T-shaped limit block, but also to place the test piece, and the through hole 17 is used to place the pressure block that tightly fits the test piece to the RF probe; wherein, the mounting hole 23 provided on the splint 2 is a rectangular mounting hole 23, and the rectangular mounting hole 23 is also provided with a limit block 6 for limiting the three RF probes 5 respectively. The limit block 6 is T-shaped as a whole, and a probe limit hole 61 is provided at the center of the T-shaped limit block 6. The T-shaped limit block 6 is clamped in the rectangular mounting hole 23, and the gap between the T-shaped limit block 6 and the rectangular mounting hole 23 forms two limit holes 61. The three RF probes 5 are respectively placed in the three limit holes 61.

[0080] The clamping plate 2 includes a first clamping plate 21 and a second clamping plate 22. The lower end surface of the first clamping plate 21 is provided with a mounting groove for clamping the second clamping plate 22. The first clamping plate 21 is clamped to the DUT fixing assembly 1. The first clamping plate 21 and the second clamping plate 22 are both provided with a through-hole 23. The first clamping plate and the second clamping plate cooperate with each other to stabilize the RF probe. At the same time, the two clamping plates have pin holes that penetrate the test PCB and the test base. The PCB is placed between the second clamping plate and the test base. The clamping plate, the test PCB, and the test base are connected by pins to form a complete test device.

[0081] In this embodiment, the operation process of fixing the DUT on the test machine using the test socket is as follows:

[0082] In actual use, first place the RF probe 5 into the limiting hole in the limiting block 6, and then place the limiting block 6 between the test PCB board and the clamping plate 2, so that the limiting block is embedded in the first clamping plate 21 and the second clamping plate 22 to form the lower half of the test fixture, then stack the test PCB board 3 and the above-assembled test fixture lower half on the test seat body 4 in sequence, connect and fix the test fixture, test PCB board and test seat body 4 by pins, then place the piece to be tested in the mounting hole 23 on the clamping plate, and then press the gripping parts on both sides of the clamp cover at the same time to compress the spring of the gripping part, so that the clamping claw 15 is tilted, and the clamping claw 15 is stuck in the clamping groove in the clamping plate 2, fixing the clamping plate 2 and the clamp cover 11, at this time, a pressure block of similar size to the piece to be tested is placed in the through hole 17 at the center position of the clamp cover 11 to press the piece to be tested, to ensure that the piece to be tested is firmly connected to the RF probe. In this way, the two ends of the RF probe 5 contact the microstrip line 31 on the device under test and the PCB board respectively. After completing the relevant calibration, the device under test and the PCB board are turned on, and the test instrument and the RF connectors at both ends of the test PCB board are connected through the test cable, waiting for testing.

[0083] Example 2

[0084] like Figure 5As shown, this embodiment provides a high-speed testing method for RF LTCC filter production. Before machining the fixture, strict RF simulation is performed to minimize the impact of the test fixture on the test results. Then, the high-speed test socket of Example 1 is used to fix the DUT on the test machine for testing. The specific testing process is as follows:

[0085] S1. Calibrate to the test cable end face and save the calibrated file as the first calibration file:

[0086] S11. Connect the test instrument (here the test instrument is the network analyzer VNA5000A) and the test cable;

[0087] S12. Use the VNA5000A-K03-S high-performance calibration kit that comes with the VNA5000A to calibrate the test cable, eliminating the test loss caused by the test cable and calibrating the test to the cable end face.

[0088] S13, saving the calibration file as the first calibration file CAL-1;

[0089] S2. Calibrate to the PCB end surface and save the calibrated file as the second calibration file:

[0090] S21. Calculate the S parameters of the PCB based on the thickness, width, and material of the microstrip line on the PCB and the characteristics of the PCB board, and save them as the SNP file of the PCB. Use test cables to connect both ends of the test PCB to the test instrument, and import the SNP file of the PCB into the VNA5000A.

[0091] S22, calling the first calibration file CAL-1, and using the de-embedding calibration method on this basis to calibrate the test PCB board;

[0092] S23, saving the calibration file as the second calibration file CAL-2;

[0093] S3. Calibrate to the RF probe tip and save the third calibration file:

[0094] S31. Connect the radio frequency probe to the vector network analyzer through the probe fixture, obtain the S parameters of the radio frequency probe, and store the S parameters of the radio frequency probe as a probe SNP file;

[0095] S32, import the probe SNP file into VNA5000A;

[0096] S33, calling the second calibration file CAL-2, and based on this, using the port extension method to further extend the test end face to the probe tip;

[0097] S34, saving the calibration file as the third calibration file CAL-3, and the entire calibration process is now completed;

[0098] S4, Pre-test: Place the gold sample of the test piece (Golden Sample) into the test socket in Example 1 for pre-test. When the pre-test result is consistent with the theoretical value, the calibration is considered valid; if the test result does not match the theoretical value, it is necessary to return to S1 and re-calibrate.

[0099] S5. Formal test: After the pre-test is completed, you can enter the formal test;

[0100] The test process was optimized, sequentially calibrating the cable end face, the microstrip line on the test PCB, and the RF probe tip, ultimately completing the calibration of the device connected to the DUT. Probe calibration was added before pre-testing, and de-embedding calibration technology was used to move the test end face closer to the DUT end face, moving it from the microstrip line on the PCB. This improved test accuracy.

[0101] like Figure 6 As shown in the figure, the S parameter test results when conductive cloth is used are given, where the light-colored curve represents the theoretical value of the return loss of the device under test, and the dark-colored curve represents the measured value of the return loss. Figure 7 The figure shows the S-parameter test results when using the test socket of this application. It can be seen that the actual measurement results using the RF probe are more consistent with the theoretical curve, and the overall test results are better than the conductive cloth test results. In actual use, after the number of tests exceeds 200k, the electrical performance indicators begin to deteriorate, and new RF probes need to be replaced. The replacement frequency is 1 / 3 of that of the conductive cloth solution, and the replacement time is reduced by 1 / 4. If the UPH is 2k and the production task is 20 hours per day, the original conductive cloth solution has a daily production capacity of approximately 133.4k / day, while the RF probe socket solution has a daily production capacity of approximately 400k / day, an increase of approximately 3 times. The cost of a single test socket is approximately 2000 yuan, and the batch production cost is approximately 1000 yuan. The test cost of a single DUT is reduced to 1-2 minutes per piece, a test cost reduction of 5-10 times.

[0102] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Based on the technical essence of the present invention and within the spirit and principles of the present invention, any simple modification, equivalent replacement and improvement of the above embodiment shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A high-speed test socket for RF LTCC filter production, characterized in that: The invention comprises a test fixture, a test PCB board (3) and a test seat body (4), wherein the test fixture comprises a test piece fixing assembly (1) and a clamping plate (2), wherein the test piece fixing assembly (1) and the clamping plate (2) are detachably connected, the test PCB board (3) is fixed between the clamping plate (2) and the test seat body (4), a through hole (17) is provided on the test piece fixing assembly (1), and a mounting hole (23) is provided on the clamping plate (2) at a position corresponding to the through hole (17), the through hole (17) and the mounting hole (23) are penetrated, and a conductive member for connecting the test piece to the test PCB board (3) is provided; The test piece fixing assembly (1) includes a fixture cover (11), and clamping assemblies are symmetrically provided on opposite sides of the fixture cover (11), one end of the clamping assembly extends above the fixture cover (11), and the other end of the clamping assembly extends below the fixture cover (11) and is clamped with the clamping plate (2), so that the test piece is fixed between the fixture cover (11) and the clamping plate (2); The clamp cover (11) is provided with a groove (12) for placing the clamping assembly, and the clamping assembly includes an abutment block (13), an elastic member (14) and a clamping claw (15), wherein the abutment block (13) is fixed inside the groove (12), one end of the elastic member (14) is fixed to the abutment block (13), and the other end is fixed to the upper end of the clamping claw (15), and the lower end of the clamping claw (15) is clamped with the clamping plate (2), and the clamping claw (15) can move in the groove (12) through the elastic action of the elastic member (14) to achieve the fixing and removal of the lower end of the clamping claw (15) and the clamping plate (2); The conductive member includes a plurality of radio frequency probes (5) arranged in parallel, one end of each radio frequency probe (5) passing through a mounting hole (23) of the clamping plate (2) and conducting with a microstrip line (31) on a test PCB board (3), and the other end conducting with a test piece.

2. The high-speed test socket for producing radio frequency LTCC filters according to claim 1, characterized in that: A gripping portion integrally formed with the clamping jaw (15) is provided at the upper end portion of the clamping jaw (15), and an anti-slip protrusion (16) is provided on a side of the gripping portion facing away from the abutting block (13).

3. The high-speed test socket for producing radio frequency LTCC filters according to claim 1, characterized in that: The radio frequency probe (5) uses three minimum radio frequency probes with claw-shaped probe heads and a diameter of 0.08 mm, and a hard gold coating is used on the probe heads.

4. The high-speed test socket for producing radio frequency LTCC filters according to claim 1, characterized in that: The mounting hole (23) of the clamping plate (2) includes a rectangular mounting hole. A limiting block (6) for limiting the three radio frequency probes (5) is further provided in the rectangular mounting hole. The limiting block (6) is T-shaped as a whole. A probe limiting hole is provided at the center of the T-shaped limiting block. The T-shaped limiting block is clamped in the rectangular mounting hole. The gap between the T-shaped limiting block and the rectangular mounting hole forms two limiting holes (61). The three radio frequency probes (5) are respectively placed in the three limiting holes (61).

5. The high-speed test socket for producing radio frequency LTCC filters according to claim 1, characterized in that: The clamping plate (2) includes a first clamping plate (21) and a second clamping plate (22). The lower end surface of the first clamping plate (21) is provided with a mounting groove for clamping the second clamping plate (22). The first clamping plate (21) is clamped with the to-be-tested piece fixing assembly (1). The first clamping plate (21) and the second clamping plate (22) are both provided with a penetrating mounting hole (23).

6. A high-speed testing method for RF LTCC filter production, characterized in that: The testing process is: S1. Calibrate to the test cable end face and save the calibrated file as the first calibration file; S2. Call the first calibration file, calibrate to the test PCB end surface, and save the calibrated file as the second calibration file; S3, calling the second calibration file, calibrating to the tip of the radio frequency probe, and saving the calibrated file as a third calibration file; S4, placing the device under test into the high-speed test socket as claimed in claim 1, connecting the test instrument to the test PCB board using a test cable, and performing a pre-test on the device under test; S5. If the pre-test passes, various parameter tests are performed on the device under test until all tests are completed and the test results of the device under test are obtained.

7. A high-speed testing method for radio frequency LTCC filter production according to claim 6, characterized in that: The specific process of calibrating the tip of the radio frequency probe in step S3 is as follows: S31. Connect the radio frequency probe to the vector network analyzer through the probe fixture, obtain the S parameters of the radio frequency probe, and store the S parameters of the radio frequency probe as a probe SNP file; S32, importing the probe SNP file into the vector network analyzer; S33. Call the second calibration file, and use the port extension method to extend the test end face to the needle tip of the probe to obtain a third calibration file.

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