Projection equipment and projection system
By setting up a avoidance groove on the heating element to be hiding the avoidance parts, combined with the use of heat pipes and heat conducting blocks, the problem of insufficient contact area between the heat dissipation components and the heating element is solved, the heat dissipation efficiency is improved, and the normal operation of the projection equipment is ensured.
Patent Information
- Application Number
- CN202410033323.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-09
- Publication Date
- 2025-07-11
AI Technical Summary
The heat dissipation components in the prior art have low heat dissipation efficiency of the projection equipment heating parts, making it difficult to ensure the normal operation of the projection equipment.
A avoiding groove is provided on the heating element to hide the avoiding element, so that the cooling part of the heat dissipation assembly can be fully fitted with the first side of the heating element, increase the contact area, and use heat pipes and heat conducting blocks to improve the heat dissipation efficiency.
By hiding the parts to be avoided, the contact area between the heat dissipation assembly and the heating element is increased, the heat dissipation efficiency is improved, and the normal operation of the projection equipment is ensured.
Smart Images
Figure CN120295045A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of projection technology, and particularly to a projection device and a projection system. Background Art
[0002] Projection devices are increasingly applied in people's work and life. Among them, laser projection gradually occupies the market due to its advantages such as a wide color gamut, high brightness, and long lifespan. A laser projection device usually includes devices such as a laser, a lens, and a circuit board; the laser is the source of generating laser beams. At the same time, the laser is also a heat-generating component. When the temperature of the laser is too high, it will affect the projection effect, reliability, and service life of the projection device.
[0003] In the prior art, in order to dissipate heat from the heat-generating components in the projection device, a heat dissipation component is generally used to absorb the heat of the heat-generating components, thereby reducing the temperature of the heat-generating components.
[0004] However, when the heat dissipation component in the prior art dissipates heat from the heat-generating component, the heat dissipation efficiency is low, and it is difficult to ensure the normal operation of the projection device. Summary of the Invention
[0005] In view of the above problems, the present application provides a projection device and a projection system, which can improve the heat dissipation efficiency of the heat dissipation component for the heat-generating component and better ensure the normal operation of the projection device and the projection system.
[0006] To achieve the above object, the present application provides the following technical solutions:
[0007] A first aspect of the present application provides a projection device, including:
[0008] A heat-generating component having a first surface and a second surface disposed opposite to each other. A component to be avoided and an avoidance groove are provided on the heat-generating component. The notch of the avoidance groove is located on the first surface, at least part of the component to be avoided is located in the avoidance groove, and the end of the component to be avoided facing away from the second surface does not protrude from the notch;
[0009] A heat dissipation component having a cooling part. The cooling part is attached to the first surface, and the attachment surface of the cooling part to the first surface covers at least part of the orthographic projection of the component to be avoided on the first surface;
[0010] The heat generated by the heat-generating component is configured to be transferred to the cooling part through the first surface.
[0011] The beneficial effects of the present application are as follows: The avoidance groove can function to hide the component to be avoided, such that the component to be avoided does not protrude from the first surface of the heat-generating component; when the cooling part is in contact with the first surface, the component to be avoided on the heat-generating component will not affect the contact between the cooling part and the first surface, and the heat dissipation component and the heat-generating component can be fully in contact, thereby enhancing the contact area between the two; consequently, the heat dissipation efficiency of the heat dissipation component for the heat-generating component can be improved, better ensuring the normal operation of the projection device.
[0012] In a possible implementation, the heat-generating component includes a substrate, and the avoidance groove is provided on the substrate; along the thickness direction of the substrate, the first surface and the second surface are two opposite surfaces on the substrate.
[0013] In this way, the substrate can play a role in heat conduction, facilitating the transfer of the heat generated by the heat-generating component to the cooling part to achieve the cooling of the heat-generating component.
[0014] In a possible implementation, the avoidance groove is provided near the edge of the substrate, and the groove wall of the avoidance groove is connected to the side surface of the substrate, and the side surface connects the first surface and the second surface.
[0015] In this way, the influence of the avoidance groove and the component to be avoided in the avoidance groove on the internal electronic components of the heat-generating component can be reduced; when the groove wall of the avoidance groove is connected to the side surface of the substrate, it is convenient to process the avoidance groove at the edge of the substrate.
[0016] In a possible implementation, the projection device further includes a support member, and the heat-generating component is mounted on the support member through the component to be avoided, and the second surface faces the support member.
[0017] In this way, the component to be avoided can play a connecting role, facilitating the connection of the heat-generating component to the support member; and the support member can provide support for the heat-generating component.
[0018] In a possible implementation, the heat-generating component is further provided with a through hole, one end orifice of the through hole is located on the second surface, and the other end orifice of the through hole is located on the bottom surface of the avoidance groove;
[0019] The component to be avoided is inserted through the through hole, and the first end of the component to be avoided extends out of the second surface and is connected to the support member.
[0020] In this way, the through hole can function to accommodate the component to be avoided, further making it difficult for the component to be avoided to protrude from the first surface, and at the same time, it is also convenient for the component to be avoided to be connected to the support member.
[0021] In a possible implementation, the second end of the component to be avoided has an abutting portion, and at least part of the abutting portion is located in the avoidance groove; the abutting portion abuts against the bottom surface of the groove to limit the movement of the component to be avoided in the direction towards the second surface.
[0022] In this way, the bottom surface of the avoidance groove can also play a role in limiting, and the bottom surface of the groove and the abutting portion are abutted and cooperated with each other, which is convenient for the installation of the component to be avoided.
[0023] In a possible implementation manner, the heat dissipation component includes a radiator and a heat pipe. Along the extending direction of the heat pipe, both ends of the heat pipe respectively have an evaporation section for absorbing heat and a condensation section for releasing heat; the condensation section is in thermal conduction with the radiator, and the evaporation section is in thermal conduction with the heat generating component.
[0024] In this way, the heat pipe can continuously and efficiently transfer the heat of the heat generating component to the radiator, so as to ensure the heat dissipation and cooling effect on the heat generating component.
[0025] In a possible implementation manner, the outer tube surface of the heat pipe located at the evaporation section abuts against the first surface, and the evaporation section forms a cooling part; alternatively, the heat dissipation component further includes a heat conducting block, the heat conducting block is connected to the evaporation section to form a cooling part, the heat conducting block abuts against the first surface, and the heat conducting block is used to transfer the heat of the heat generating component to the evaporation section.
[0026] In this way, the thermal resistance between the heat generating component and the heat pipe can be effectively reduced, thereby improving the heat transfer efficiency.
[0027] The second aspect of the present application provides a projection device, including:
[0028] A heat generating component having a first surface and a second surface arranged oppositely, and an avoidance groove located on the first surface of the heat generating component is used to accommodate at least part of the component to be avoided on the heat generating component, so that the end of the component to be avoided facing away from the second surface does not protrude from the notch of the groove;
[0029] A heat dissipation component, the cooling part of the heat dissipation component is used to fit against the first surface to absorb the heat generated by the heat generating component; the fitting surface of the cooling part and the first surface is used to cover at least part of the orthographic projection of the component to be avoided on the first surface.
[0030] The third aspect of the present application provides a projection system, including a projection screen and the projection device in any one of the above implementation manners, and the projection device is used to project a projection image onto the projection screen.
[0031] The present application provides a projection device and a projection system. The projection system includes a projection screen and a projection device, and the projection device is used to project a projection image onto the projection screen. Among them, the projection device includes: a heat generating component having a first surface and a second surface arranged oppositely, a component to be avoided and an avoidance groove are arranged on the heat generating component, the notch of the avoidance groove is located on the first surface, at least part of the component to be avoided is located in the avoidance groove, and the end of the component to be avoided facing away from the second surface does not protrude from the notch of the groove; a heat dissipation component, the heat dissipation component has a cooling part, the cooling part fits against the first surface, the fitting surface of the cooling part and the first surface covers at least part of the orthographic projection of the component to be avoided on the first surface; the heat generated by the heat generating component is configured to be transferred to the cooling part through the first surface.
[0032] In the projection device provided by the present application, since the heat generating component is provided with an avoidance groove, the avoidance groove can play a role in hiding the component to be avoided, so that the component to be avoided does not protrude from the first surface of the heat generating component; thus, when the cooling part is attached to the first surface, the component to be avoided on the heat generating component will not affect the attachment between the cooling part and the first surface, and the cooling part does not need to specifically bypass the component to be avoided. Therefore, the shape and size of the cooling part can be set larger, and the cooling part can be fully attached to the first surface to increase the contact area between the heat dissipation component and the heat generating component; thus, the projection device provided by the present application can improve the heat dissipation efficiency of the heat dissipation component for the heat generating component and better ensure the normal operation of the projection device. In addition, after the component to be avoided is installed in a hidden manner, the arrangement quantity of the heat pipes and the attachment area between the heat conducting block and the heat generating component can also be increased, thereby further improving the heat dissipation performance of the cooling part.
[0033] The structure of the present application and its other invention purposes and beneficial effects will become more obvious and understandable through the description of the specific embodiments in conjunction with the drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0035] Figure 1 The front view of the projection device provided by the embodiment of the present application;
[0036] Figure 2 For Figure 1 The view after removing the support member;
[0037] Figure 3 For Figure 2 The perspective view;
[0038] Figure 4 For Figure 3 The perspective view of some components in;
[0039] Figure 5 For Figure 4 The exploded view;
[0040] Figure 6 The perspective view of the heat generating component with the component to be avoided installed from the first perspective;
[0041] Figure 7 The partial cross-sectional view of the heat generating component with the component to be avoided installed;
[0042] Figure 8It is a three-dimensional view of the heating element from the second perspective;
[0043] Figure 9 It is a three-dimensional view of the heating element mounted on the support;
[0044] Figure 10 It is Figure 9 an enlarged view of part A in
[0045] Description of the reference numerals:
[0046] 100 - Heating element; 110 - Substrate;
[0047] 111 - First side; 112 - Second side;
[0048] 113 - Side surface; 120 - Avoidance groove;
[0049] 121 - Bottom surface of the groove; 130 - Through hole;
[0050] 140 - Housing; 200 - Component to be avoided;
[0051] 210 - Connecting part; 220 - Abutting part;
[0052] 300 - Support; 310 - Fixed seat;
[0053] 400 - Heat dissipation component; 410 - Radiator;
[0054] 420 - Heat pipe; 421 - Evaporation section;
[0055] 422 - Condensation section; 430 - Heat conducting block;
[0056] 431 - Jack; 432 - Protrusion;
[0057] 433 - Heat conducting surface; 440 - Cooling part. Detailed implementation manners
[0058] To make the objectives, implementation manners and advantages of this application clearer, the following will clearly and completely describe the exemplary implementation manners of this application with reference to the accompanying drawings in the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only a part of the embodiments of this application, rather than all of the embodiments.
[0059] It should be noted that the brief description of the terms in this application is only for facilitating the understanding of the subsequent described implementation manners, rather than intending to limit the implementation manners of this application. Unless otherwise specified, these terms should be understood according to their ordinary and common meanings.
[0060] Furthermore, the terms "comprise" and "include" and any variations thereof are intended to cover a non-exclusive inclusion. For example, a product or device that comprises a series of components does not have to be limited to those components clearly listed, but may include other components not clearly listed or inherent to such product or device.
[0061] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.
[0062] The terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.
[0063] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "mount", "connect", and "couple" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0064] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.
[0065] At present, in order to dissipate the heat of the laser in the projection equipment, a heat dissipation component is generally used to absorb the heat of the laser, thereby reducing the temperature of the heating element. Specifically, the heat dissipation component can abut against the outer surface of the laser and continuously cool the laser by air cooling or water cooling; however, due to the presence of a protrusion on the outer surface of the laser, the protrusion protrudes from the outer surface of the laser, so that the heat dissipation component and the laser cannot be fully contacted, limiting the contact area between the heat dissipation component and the laser, thereby reducing the heat dissipation efficiency of the heat dissipation component, making it difficult to ensure the normal operation of the projection equipment.
[0066] Based on the above problems, the present application provides a projection device and a projection system, which dissipates heat from a heating element through a heat dissipation component, wherein the heating element has a first surface and a second surface arranged opposite to each other, and a to-be-avoided component and an avoidance groove are arranged on the heating element, and the avoidance groove is used to accommodate at least part of the to-be-avoided component, so that the end of the to-be-avoided component facing away from the second surface does not protrude from the groove; in addition, the cooling part of the heat dissipation component is used to fit the first surface to absorb the heat generated by the heating element; the fitting surface of the cooling part and the first surface is used to cover at least part of the positive projection of the to-be-avoided component on the first surface. The avoidance groove can play a role in hiding the to-be-avoided component, so that the to-be-avoided component does not protrude from the first surface of the heating element; thus, the to-be-avoided component on the heating element will not affect the fitting between the cooling part and the first surface, and after the cooling part and the first surface are fully fitted, the contact area between the heat dissipation component and the heating element can be improved, and the heat dissipation area of the heating element can be improved; thus, the projection device and projection system provided by the present application can improve the heat dissipation efficiency of the heat dissipation component to the heating element, and better ensure the normal operation of the projection device and the projection system.
[0067] The following combination Figures 1 to 10 , the structure of the projection device provided in the embodiment of the present application is described in detail.
[0068] The projection device provided in the embodiment of the present application includes:
[0069] The heating element 100, such as Figures 6 to 8 As shown, the heating element 100 has a first surface 111 and a second surface 112 that are arranged opposite to each other, and a piece to be avoided 200 and a avoiding groove 120 are arranged on the heating element 100, the notch of the avoiding groove 120 is located on the first surface 111, at least part of the piece to be avoided 200 is located in the avoiding groove 120, and the end of the piece to be avoided 200 that is away from the second surface 112 does not protrude from the notch; thus, the avoiding groove 120 can play a role in hiding the piece to be avoided 200, and make the piece to be avoided 200 not protrude from the first surface 111 of the heating element 100. Specifically, the heating element 100 can be a laser of a projection device, or other heat-generating electronic components.
[0070] Heat dissipation assembly 400, such as Figures 2 to 6As shown, the heat dissipation component 400 has a cooling part 440. The cooling part 440 is attached to the first surface 111, and the attachment surface of the cooling part 440 and the first surface 111 covers at least part of the orthographic projection of the component 200 to be avoided on the first surface 111. Thus, the heat generated by the heat generating component 100 can be transferred to the cooling part 440 through the first surface 111, and the cooling part 440 can cool the heat generating component 100 after absorbing the heat. Since the component 200 to be avoided does not protrude from the first surface 111 of the heat generating component 100, the cooling part 440 is not hindered by the component 200 to be avoided, and the cooling part 440 can be attached to more of the first surface 111 of the heat generating component 100. Moreover, when the cooling part 440 is attached to the first surface 111, the attachment surface can cover at least part of the notch of the avoidance groove 120. When the attachment surface covers all the notches of the avoidance groove 120, the attachment surface also covers the entire orthographic projection of the component 200 to be avoided on the first surface 111.
[0071] It should be noted that the component 200 to be avoided can be a block on the heat generating component 100, and these blocks are likely to protrude from the outer surface of the heat generating component 100. After the avoidance groove 120 is provided on the heat generating component 100, the component 200 to be avoided can be partially located in the avoidance groove 120, or the component 200 to be avoided can be entirely located in the avoidance groove 120. The attachment surface of the cooling part 440 and the first surface 111 can cover part of the orthographic projection of the component 200 to be avoided on the first surface 111, or can cover the entire orthographic projection of the component 200 to be avoided on the first surface 111.
[0072] Thus, in the projection device provided by the present application, since the avoidance groove 120 is provided on the heat generating component 100, the existence of the avoidance groove 120 can hide the component 200 to be avoided, so that the component 200 to be avoided does not protrude from the first surface 111 of the heat generating component 100. Thus, when the cooling part 440 is attached to the first surface 111, the component 200 to be avoided on the heat generating component 100 does not affect the attachment between the cooling part 440 and the first surface 111, and the cooling part 440 does not need to specifically bypass the component 200 to be avoided. Thus, the shape and size of the cooling part 440 can be set larger, and the cooling part 440 and the first surface 111 can be fully attached to increase the contact area between the heat dissipation component 400 and the heat generating component 100. Thus, the projection device provided by the present application can improve the heat dissipation efficiency of the heat dissipation component 400 for the heat generating component 100 and better ensure the normal operation of the projection device.
[0073] In the embodiment of the present application, as Figures 6 to 8As shown in the figure, the heating element 100 includes a substrate 110, and an avoidance groove 120 is provided on the substrate 110; along the thickness direction of the substrate 110, a first surface 111 and a second surface 112 are two opposite surfaces on the substrate 110; when the cooling part 440 is attached to the first surface 111 of the substrate 110, the heat of the substrate 110 can be transferred to the cooling part 440, and the cooling part 440 can continuously cool the substrate 110. With such a setting, the substrate 110 can play a role in heat conduction, facilitating the transfer of the heat generated by the heating element 100 to the cooling part 440 to achieve the cooling of the heating element 100. In addition, there can be multiple substrates 110, the multiple substrates 110 are arranged in parallel and connected to each other, and the first surfaces 111 on each substrate 110 are flush, and the first surfaces 111 on each substrate 110 are in contact with the same cooling part 440.
[0074] Specifically, as Figure 6 shown in the figure, the avoidance groove 120 is provided near the board edge of the substrate 110, and the groove wall of the avoidance groove 120 is connected to the side surface 113 of the substrate 110, and the side surface 113 connects the first surface 111 and the second surface 112. With such a setting, the avoidance groove 120 is provided at the board edge of the substrate 110, which can reduce the influence of the avoidance groove 120 and the component 200 to be avoided in the avoidance groove 120 on the internal electronic components of the heating element 100. It should be noted that in a projection device, there are often electronic components inside the heating element 100. If the avoidance groove 120 is provided in the central area of the substrate 110, it will affect the normal operation of the electronic components. In addition, when the groove wall of the avoidance groove 120 is connected to the side surface 113 of the substrate 110, it is convenient to process the avoidance groove 120 at the board edge of the substrate 110.
[0075] Specifically, the heating element 100 is a laser, and the heating element 100 further includes a housing 140 and a light-emitting chip, and the light-emitting chip can emit laser light; both the housing 140 and the light-emitting chip are provided on the substrate 110, a cavity is provided inside the housing 140, and the light-emitting chip is placed in the cavity; during the process of the light-emitting chip emitting laser light, heat is also generated, and the heat can be transferred to the substrate 110, and the substrate 110 then transfers the heat to the cooling part 440. Among them, the housing 140 can be a ceramic part, the substrate 110 can be a printed circuit board, and the housing 140 and the substrate 110 are integrally welded, which is convenient to realize the integration and miniaturization of the laser. In addition, multiple housings 140 and light-emitting chips can be provided on a single substrate 110.
[0076] Furthermore, the material of the housing 140 can be selected from Al2O3 or AlN ceramic materials. Considering cost, Al2O3 ceramic materials can be used in this application; while the substrate 110 is made of a metal material. To improve the heat dissipation or heat conduction performance of the substrate 110, the substrate 110 can be selected from metal materials such as oxygen-free copper, pure copper, and tungsten copper.
[0077] In the embodiments of the present application, as Figure 1 , Figure 9 and Figure 10 shown, the projection device further includes a support member 300. The heating member 100 is mounted on the support member 300 through the member to be avoided 200, and the second surface 112 faces the support member 300. Thus, the support member 300 can provide support for the heating member 100. With such a setting, the member to be avoided 200 can play a connecting role, facilitating the connection of the heating member 100 to the support member 300. When the second surface 112 faces the support member 300, the heating member 100 is located between the support member 300 and the cooling part 440; when the heating member 100 is a laser, the support member 300 can be the main light source housing. Since the main light source housing is easy to form and has higher machining accuracy, thus, the position accuracy during the installation of the laser is also higher, ensuring the reliability of the laser during operation.
[0078] Furthermore, as Figure 7 and Figure 8 shown, the heating member 100 is further provided with a through hole 130. One end orifice of the through hole 130 is located on the second surface 112, and the other end orifice of the through hole 130 is located on the bottom surface 121 of the avoidance groove 120; thus, after the through hole 130 is connected to the avoidance groove 120, it can penetrate through the heating member 100. At the same time, the member to be avoided 200 is inserted into the through hole 130, and the first end of the member to be avoided 200 extends out of the second surface 112 and is connected to the support member 300. With such a setting, the through hole 130 can play a role in accommodating the member to be avoided 200, further making it difficult for the member to be avoided 200 to protrude from the first surface 111. At the same time, it also facilitates the connection between the member to be avoided 200 and the support member 300. Exemplarily, the number of through holes 130 and avoidance grooves 120 on the heating member 100 is the same. As Figure 6 and Figure 8 shown, two through holes 130 and two avoidance grooves 120 can be provided on each substrate 110.
[0079] Specifically, as Figure 6 and Figure 7 shown, the second end of the member to be avoided 200 has an abutting portion 220, and at least part of the abutting portion 220 is located in the avoidance groove 120; the abutting portion 220 abuts against the bottom surface 121 to limit the movement of the member to be avoided 200 in the direction towards the second surface 112. With such a setting, the bottom surface 121 of the avoidance groove 120 can also play a limiting role, and the bottom surface 121 and the abutting portion 220 abut and cooperate with each other, facilitating the installation of the member to be avoided 200. In addition, the member to be avoided 200 further includes a connecting portion 210 connected to the support member 300, and the connecting portion 210 is located at the first end of the member to be avoided 200. Among them, the member to be avoided 200 can be a screw, the screw head is the abutting portion 220, the screw head can abut against the bottom surface 121 of the avoidance groove 120, and the avoidance groove 120 can be used to hide the screw head to prevent the screw head from protruding from the first surface 111.
[0080] In the embodiments of the present application, as Figure 1 and Figure 2 shown, the heat dissipation component 400 includes a radiator 410 and a heat pipe 420. Along the extending direction of the heat pipe 420, both ends of the heat pipe 420 respectively have an evaporation section 421 for absorbing heat and a condensation section 422 for releasing heat; the condensation section 422 is in thermal communication with the radiator 410, and the evaporation section 421 is in thermal communication with the heat generating component 100. During the operation of the heat pipe 420, the liquid located inside the heat pipe 420 evaporates to form a gas after absorbing the heat of the heat generating component 100 at the evaporation section 421; when the gas is transmitted inside the pipe to the condensation section 422, it releases heat and condenses to form a liquid in the condensation section 422, and the heat released by the gas can be transferred to the radiator 410; and the condensed liquid can flow back to the evaporation section 421, so as to continuously reciprocate and cycle, continuously absorbing the heat of the heat generating component 100. With such a setting, the heat pipe 420 can continuously and efficiently transfer the heat of the heat generating component 100 to the radiator 410, thereby ensuring the heat dissipation and cooling effect on the heat generating component 100. Specifically, multiple heat pipes 420 can be arranged in parallel, as Figure 1 shown, four heat pipes 420 are arranged in parallel. Specifically, the radiator 410 can include a plurality of heat dissipation fins arranged in parallel, and the heat pipe 420 is in contact with the tube wall of the condensation section 422 and passes through the heat dissipation fins.
[0081] In a specific embodiment, the outer tube surface of the heat pipe 420 at the evaporation section 421 abuts against the first surface 111, and the evaporation section 421 forms a cooling part 440. With such a setting, when the outer tube surface of the heat pipe 420 at the evaporation section 421 abuts against the first surface 111, the thermal resistance between the heat generating component 100 and the heat pipe 420 can be effectively reduced, thereby improving the heat transfer efficiency.
[0082] In another specific embodiment, as Figure 3 and Figure 4 shown, the heat dissipation component 400 further includes a heat conducting block 430. The heat conducting block 430 is connected to the evaporation section 421 to form a cooling part 440; the heat conducting block 430 abuts against the first surface 111, and the heat conducting block 430 is used to transfer the heat of the heat generating component 100 to the evaporation section 421. Thus, the heat conducting block 430 can play a role in transferring heat, facilitating the transfer of the heat of the heat generating component 100 to the heat pipe 420. Specifically, the heat conducting block 430 can be a copper block or an aluminum block. Specifically, the heat conducting block 430 is provided with a convex block 432, and the heat conducting surface 433 on the convex block 432 can be attached to the first surface 111 of the heat generating component 100.
[0083] Furthermore, as Figure 3 and Figure 4As shown, the heat conduction block 430 is provided with insertion holes 431 penetrating through the heat conduction block 430, and the evaporation section 421 of the heat pipe 420 is inserted into the insertion holes 431. The number of the insertion holes 431 is the same as the number of the heat pipes 420. In addition, the support member 300 is provided with a fixing seat 310. When the heat conduction block 430 abuts against the first surface 111, the heat conduction block 430 can be fixedly connected to the fixing seat 310.
[0084] It should be noted that when the part to be avoided 200 is a screw, if the screw protrudes from the first surface 111 of the heat generating component 100, in order to improve the reliability of the heat pipe 420, the heat pipe 420 needs to bypass the screw, resulting in a reduction in the number of heat pipes 420 that can be inserted in the heat conduction block 430, thus affecting the arrangement number of the heat pipes 420 and reducing the heat dissipation efficiency. After the screw is installed in a hidden manner by using the avoidance groove 120, the arrangement number of the heat pipes 420 and the fitting area between the heat conduction block 430 and the heat generating component 100 can be increased, thereby improving the heat dissipation performance of the cooling part 440.
[0085] After experimental simulation, it is found that when the heat generating component 100 is a laser, the part to be avoided 200 is a screw, there is no avoidance groove 120 provided on the substrate 110, the screw protrudes from the first surface 111 of the heat generating component 100, and the thermal power of the laser is 45W, the presence of the part to be avoided 200 will increase the heat flux density of the laser by 5.7%; in addition, when the evaporation section 421 of the heat pipe 420 directly contacts the first surface 111 of the substrate 110, the temperature of the laser can be reduced by about 14°C.
[0086] In addition, the present application also provides a projection device, including: a heat generating component 100 having a first surface 111 and a second surface 112 arranged opposite to each other. The avoidance groove 120 located on the first surface 111 of the heat generating component 100 is used to accommodate at least part of the part to be avoided 200 on the heat generating component 100, so that the end of the part to be avoided 200 facing away from the second surface 112 does not protrude from the notch; a heat dissipation assembly 400, and the cooling part 440 of the heat dissipation assembly 400 is used to fit against the first surface 111 to absorb the heat generated by the heat generating component 100; the fitting surface between the cooling part 440 and the first surface 111 is used to cover at least part of the orthographic projection of the part to be avoided 200 on the first surface 111. Thus, the avoidance groove 120 can play a role in hiding the part to be avoided 200, so that the part to be avoided 200 does not protrude from the first surface 111 of the heat generating component 100; thus, when the cooling part 440 is in contact with the first surface 111, the part to be avoided 200 on the heat generating component 100 will not affect the contact between the cooling part 440 and the first surface 111, and the cooling part 440 does not need to specifically bypass the part to be avoided 200, so that the shape and size of the cooling part 440 can be set larger, and the cooling part 440 and the first surface 111 can be fully fitted to increase the contact area between the heat dissipation assembly 400 and the heat generating component 100.
[0087] Based on the above embodiments, the present application further provides a projection system, including a projection screen and the projection device in any one of the above embodiments, and the projection device is configured to project a projection image onto the projection screen. Among them, the specific structure, working principle and function of the projection device have been described in detail in the foregoing Embodiment 1, and will not be elaborated here.
[0088] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
[0089] For the sake of convenience of explanation, the above description has been made in combination with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. According to the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are for the purpose of better explaining the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.
Claims
1. A projection device, characterized in that, Comprising: A heating element having a first surface and a second surface disposed opposite to each other. A component to be avoided and an avoidance groove are provided on the heating element. The notch of the avoidance groove is located on the first surface, and at least a part of the component to be avoided is located in the avoidance groove. The end of the component to be avoided facing away from the second surface does not protrude beyond the notch. A heat dissipation assembly having a cooling portion. The cooling portion is attached to the first surface, and the attachment surface of the cooling portion to the first surface covers at least a part of the orthographic projection of the component to be avoided on the first surface. The heat generated by the heating element is configured to be transferred to the cooling portion through the first surface.
2. The projection device according to claim 1, characterized in that The heating element includes a substrate, and the avoidance groove is provided on the substrate. Along the thickness direction of the substrate, the first surface and the second surface are two opposite plate surfaces on the substrate.
3. The projection device according to claim 2, characterized in that, The avoidance groove is provided near the plate edge of the substrate, and the groove wall of the avoidance groove is connected to the side surface of the substrate. The side surface connects the first surface and the second surface.
4. The projection device according to any one of claims 1-3, characterized in that, It further includes a support member. The heating element is mounted on the support member through the component to be avoided, and the second surface faces the support member.
5. The projection device according to claim 4, characterized in that, A through hole is further provided on the heating element. One end orifice of the through hole is located on the second surface, and the other end orifice of the through hole is located on the bottom surface of the avoidance groove. The component to be avoided is inserted through the through hole, and the first end of the component to be avoided extends out of the second surface and is connected to the support member.
6. The projection device according to claim 5, wherein, The second end of the component to be avoided has an abutting portion, and at least a part of the abutting portion is located in the avoidance groove. The abutting portion abuts against the bottom surface of the groove to limit the movement of the component to be avoided in the direction towards the second surface.
7. The projection device according to any one of claims 1-3, characterized in that, The heat dissipation assembly includes a radiator and a heat pipe. Along the extending direction of the heat pipe, the two ends of the heat pipe respectively have an evaporation section for absorbing heat and a condensation section for releasing heat. The condensation section is in thermal communication with the radiator, and the evaporation section is in thermal communication with the heating element.
8. The projection device according to claim 7, characterized in that The outer pipe surface of the heat pipe at the evaporation section abuts against the first surface, and the evaporation section forms the cooling portion. Alternatively, the heat dissipation assembly further includes a heat conducting block. The heat conducting block is connected to the evaporation section to form the cooling portion. The heat conducting block abuts against the first surface, and the heat conducting block is used to transfer the heat of the heating element to the evaporation section.
9. A projection device, characterized in that, Comprising: A heating element having a first surface and a second surface disposed opposite to each other. The avoidance groove on the first surface of the heating element is used to accommodate at least a part of the component to be avoided on the heating element, so that the end of the component to be avoided facing away from the second surface does not protrude beyond the notch. A heat dissipation assembly. The cooling portion of the heat dissipation assembly is used to be attached to the first surface to absorb the heat generated by the heating element. The attachment surface of the cooling portion to the first surface is used to cover at least a part of the orthographic projection of the component to be avoided on the first surface.
10. A projection system, characterized in that, Including a projection screen and the projection device according to any one of claims 1-9, wherein the projection device is used to project a projection image onto the projection screen.