Rotating speed control method and device of heat dissipation equipment and storage medium

Abstract

The invention discloses a rotating speed control method and device of heat dissipation equipment and a storage medium, and relates to the technical field of communication and electronics. According to the implementation scheme, the current operation temperature of target equipment in a set environment is obtained; a heat dissipation balance relation corresponding to the set environment is obtained, and the heat dissipation balance relation is the corresponding relation between the operation temperature of the target equipment and the rotating speed of heat dissipation equipment needed for maintaining the operation temperature; based on the heat dissipation balance relationship, determining a target rotating speed corresponding to the current operating temperature; and performing rotating speed control on the heat dissipation equipment based on the target rotating speed, so as to maintain the current operating temperature of the target equipment by using the heat dissipation equipment. Therefore, heat dissipation equipment such as a fan in the base station can maintain the current operating temperature of target equipment such as a board card in the base station in the set environment at the appropriate rotating speed, and the problem that the rotating speed of the heat dissipation equipment is adjusted to be too high or too low or the rotating speed is suddenly high or suddenly low and is difficult to reach a steady state is solved.

Description

Technical Field

[0001] This application relates to the fields of communication and electronic technologies, and particularly to a method, device, and storage medium for controlling the rotation speed of a heat dissipation device. Background Art

[0002] In many scenarios, it is necessary to dissipate heat from a certain device through a heat dissipation device. Taking the base station system as an example, during the operation of the base station system, as the service load of the base station system changes, the heat generation of each board in the base station will change, resulting in changes in the temperature of each board. In addition, as the ambient temperature of the base station changes, the temperature of each board in the base station will also change, and it is necessary to dissipate heat from the boards through the fans in the base station. For example, when the service load of the base station system is high, the CPU (Central Processing Unit) occupancy rate is high, the CPU core temperature of the board will increase, and the temperature of the board will also increase. Or, when the base station is located in an outdoor integrated cabinet, factors such as the temperature changes in the morning, noon, and evening, whether there is sunlight, cloudy or rainy and snowy weather, etc., will all cause changes in the temperature of the boards in the base station. Therefore, it is necessary to adjust the rotation speed of the fans in the base station to dissipate heat from the boards.

[0003] How to control the rotation speed of heat dissipation devices such as fans in the base station so that the heat dissipation devices such as fans in the base station operate at an appropriate rotation speed is a problem that needs to be solved. Summary of the Invention

[0004] This application provides a method, device, and storage medium for controlling the rotation speed of a heat dissipation device.

[0005] According to one aspect of this application, a method for controlling the rotation speed of a heat dissipation device is provided. The method includes: obtaining the current operating temperature of a target device in a set environment; obtaining the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotation speed of the heat dissipation device required to maintain the operating temperature; determining the target rotation speed corresponding to the current operating temperature based on the heat dissipation balance relationship; and controlling the rotation speed of the heat dissipation device based on the target rotation speed to use the heat dissipation device to maintain the current operating temperature of the target device.

[0006] As a possible implementation, before obtaining the heat dissipation balance relationship corresponding to the set environment, it further includes: obtaining a plurality of heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in the set environment and the rotation speed of the heat dissipation device required to maintain the target operating temperature; and performing curve fitting based on the plurality of heat dissipation balance data groups to obtain the heat dissipation balance relationship.

[0007] As a possible implementation, obtain multiple heat dissipation balance data groups, including: obtain the rotation speeds at which the target device maintains the same constant temperature at multiple test ambient temperatures within the set environment of the heat dissipation device, where the rotation speeds are obtained through actual tests; for each test ambient temperature, obtain the temperature difference between the constant temperature and the test ambient temperature, and determine the rotation speed at which the target device maintains the constant temperature at the test ambient temperature as the rotation speed corresponding to the temperature difference; for each temperature difference, determine the target data group corresponding to the temperature difference from multiple temperature data groups, where each temperature data group includes the historical operating temperature of the target device within the set environment and the corresponding historical ambient temperature, and the target data group is the temperature data group in which the difference between the included historical operating temperature and historical ambient temperature is the temperature difference; based on the historical operating temperatures in the target data groups corresponding to multiple temperature differences and the rotation speeds corresponding to multiple temperature differences, determine multiple heat dissipation balance data groups, where each heat dissipation balance data group is determined based on the historical operating temperature and the corresponding rotation speed in the target data group corresponding to the same temperature difference.

[0008] As a possible implementation, perform curve fitting based on multiple heat dissipation balance data groups to obtain the heat dissipation balance relationship, including: generate a scatter plot based on multiple heat dissipation balance data groups; use polynomial fitting to perform curve fitting based on the scatter plot to obtain a curve representing the heat dissipation balance relationship; determine the heat dissipation balance relationship based on the polynomial of the curve.

[0009] As a possible implementation, before controlling the rotation speed of the heat dissipation device based on the target rotation speed, it further includes: in the case where it is determined that the target rotation speed is greater than the first rotation speed, adjust the target rotation speed to the first rotation speed; in the case where it is determined that the target rotation speed is less than the second rotation speed, adjust the target rotation speed to the second rotation speed, where the first rotation speed is greater than the second rotation speed.

[0010] As a possible implementation, before controlling the rotation speed of the heat dissipation device based on the target rotation speed, it further includes: in the case where it is determined that the current operating temperature is less than the first temperature, adjust the target rotation speed to the third rotation speed; in the case where it is determined that the current operating temperature is greater than the second temperature, adjust the target rotation speed to the fourth rotation speed, where the third rotation speed is less than the fourth rotation speed and the first temperature is less than the second temperature.

[0011] As a possible implementation, after controlling the rotation speed of the heat dissipation device based on the target rotation speed, it further includes: obtain the post-heat dissipation temperature of the target device collected at preset time intervals within a preset time period; obtain the average value of the post-heat dissipation temperature; in the case where the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference, adjust the target rotation speed; based on the adjusted target rotation speed, control the rotation speed of the heat dissipation device.

[0012] As a possible implementation, when the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference, the target speed is adjusted, including: when the absolute value of the difference is greater than the preset difference and the average value is greater than the current operating temperature, the target speed is increased; when the absolute value of the difference is greater than the preset difference and the average value is less than the current operating temperature, the target speed is decreased.

[0013] According to another aspect of the present application, a speed control device for a heat dissipation device is provided, including a memory, a transceiver, and a processor; the memory is used for storing a computer program; the transceiver is used for transmitting and receiving data under the control of the processor; the processor is used for reading the computer program in the memory and performing the following operations: obtaining the current operating temperature of a target device in a set environment; obtaining the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the speed of the heat dissipation device required to maintain the operating temperature; determining the target speed corresponding to the current operating temperature based on the heat dissipation balance relationship; controlling the speed of the heat dissipation device based on the target speed to maintain the current operating temperature of the target device by using the heat dissipation device.

[0014] As a possible implementation, the processor is further used for performing the following operations: obtaining a plurality of heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in the set environment and the corresponding speed of the heat dissipation device required to maintain the target operating temperature; performing curve fitting based on the plurality of heat dissipation balance data groups to obtain the heat dissipation balance relationship.

[0015] As a possible implementation, when the processor obtains a plurality of heat dissipation balance data groups, specifically: obtaining the speeds at which the target device maintains the same constant temperature at a plurality of test ambient temperatures of the heat dissipation device in the set environment, where the speeds are obtained through actual tests; for each test ambient temperature, obtaining the temperature difference between the constant temperature and the test ambient temperature, and determining the speed at which the target device maintains the constant temperature at the test ambient temperature as the speed corresponding to the temperature difference; for each temperature difference, determining the target data group corresponding to the temperature difference from a plurality of temperature data groups, where each temperature data group includes the historical operating temperature of the target device in the set environment and the corresponding historical ambient temperature, and the target data group is the temperature data group in which the difference between the historical operating temperature and the historical ambient temperature included therein is the temperature difference; determining a plurality of heat dissipation balance data groups based on the historical operating temperatures in the target data groups corresponding to the plurality of temperature differences and the speeds corresponding to the plurality of temperature differences, where each heat dissipation balance data group is determined based on the historical operating temperature and the corresponding speed in the target data group corresponding to the same temperature difference.

[0016] As a possible implementation, the processor performs curve fitting based on multiple heat dissipation balance data sets to obtain a heat dissipation balance relationship, specifically: based on multiple heat dissipation balance data sets, a scatter plot is generated; in a polynomial fitting manner, curve fitting is performed based on the scatter plot to obtain a curve representing the heat dissipation balance relationship; based on the polynomial of the curve, the heat dissipation balance relationship is determined.

[0017] As a possible implementation, the processor is further configured to perform the following operations: when it is determined that the target speed is greater than the first speed, adjust the target speed to the first speed; when it is determined that the target speed is less than the second speed, adjust the target speed to the second speed, where the first speed is greater than the second speed.

[0018] As a possible implementation, the processor is further configured to perform the following operations: when it is determined that the current operating temperature is less than the first temperature, adjust the target speed to the third speed; when it is determined that the current operating temperature is greater than the second temperature, adjust the target speed to the fourth speed, where the third speed is less than the fourth speed and the first temperature is less than the second temperature.

[0019] As a possible implementation, the processor is further configured to perform the following operations: obtain the post-heat dissipation temperature of the target device collected at preset time intervals within a preset time period; obtain the average value of the post-heat dissipation temperature; when the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference, adjust the target speed; based on the adjusted target speed, perform speed control on the heat dissipation device.

[0020] As a possible implementation, when the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference, the processor performs an adjustment on the target speed, specifically: when the absolute value of the difference is greater than the preset difference and the average value is greater than the current operating temperature, perform a higher adjustment on the target speed; when the absolute value of the difference is greater than the preset difference and the average value is less than the current operating temperature, perform a lower adjustment on the target speed.

[0021] According to another aspect of the present application, there is provided a speed control device for a heat dissipation device, the device includes: a first temperature acquisition unit for acquiring the current operating temperature of the target device in a set environment; a relationship acquisition unit for acquiring the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the speed of the heat dissipation device required to maintain the operating temperature; a determination unit for determining the target speed corresponding to the current operating temperature based on the heat dissipation balance relationship; a control unit for performing speed control on the heat dissipation device based on the target speed to maintain the current operating temperature of the target device by using the heat dissipation device.

[0022] As a possible implementation, the rotation speed control device of the heat dissipation device further includes: a data acquisition unit, configured to acquire a plurality of heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in a set environment and the rotation speed of the heat dissipation device required to maintain the target operating temperature; and a curve fitting unit, configured to perform curve fitting based on the plurality of heat dissipation balance data groups to obtain a heat dissipation balance relationship.

[0023] As a possible implementation, the data acquisition unit is specifically configured to: acquire the rotation speed at which the target device maintains the same constant temperature at a plurality of test ambient temperatures of the heat dissipation device in a set environment, where the rotation speed is obtained through actual testing; for each test ambient temperature, acquire the temperature difference between the constant temperature and the test ambient temperature, and determine the rotation speed at which the target device maintains the constant temperature at the test ambient temperature as the rotation speed corresponding to the temperature difference; for each temperature difference, determine the target data group corresponding to the temperature difference from a plurality of temperature data groups, where each temperature data group includes the historical operating temperature of the target device in a set environment and the corresponding historical ambient temperature, and the target data group is the temperature data group in which the difference between the included historical operating temperature and historical ambient temperature is the temperature difference; based on the historical operating temperatures in the target data groups corresponding to the plurality of temperature differences and the rotation speeds corresponding to the plurality of temperature differences, determine a plurality of heat dissipation balance data groups, where each heat dissipation balance data group is determined based on the historical operating temperature and the corresponding rotation speed in the target data group corresponding to the same temperature difference.

[0024] As a possible implementation, the curve fitting unit is specifically configured to: generate a scatter plot based on the plurality of heat dissipation balance data groups; perform curve fitting based on the scatter plot by using polynomial fitting to obtain a curve representing the heat dissipation balance relationship; and determine the heat dissipation balance relationship based on the polynomial of the curve.

[0025] As a possible implementation, the rotation speed control device of the heat dissipation device further includes: a first adjustment unit, configured to adjust the target rotation speed to the first rotation speed when it is determined that the target rotation speed is greater than the first rotation speed; and configured to adjust the target rotation speed to the second rotation speed when it is determined that the target rotation speed is less than the second rotation speed, where the first rotation speed is greater than the second rotation speed.

[0026] As a possible implementation, the rotation speed control device of the heat dissipation device further includes: a second adjustment unit, configured to adjust the target rotation speed to the third rotation speed when it is determined that the current operating temperature is less than the first temperature; and configured to adjust the target rotation speed to the fourth rotation speed when it is determined that the current operating temperature is greater than the second temperature, where the third rotation speed is less than the fourth rotation speed and the first temperature is less than the second temperature.

[0027] As a possible implementation, the rotation speed control device of the heat dissipation device further includes: a second temperature acquisition unit configured to acquire the post-cooling temperature of the target device collected at preset time intervals within a preset time period, and to acquire the average value of the post-cooling temperature; a third adjustment unit configured to adjust the target rotation speed when the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference; and a control unit configured to perform rotation speed control on the heat dissipation device based on the adjusted target rotation speed.

[0028] As a possible implementation, the third adjustment unit is specifically configured to: increase the target rotation speed when the absolute value of the difference is greater than the preset difference and the average value is greater than the current operating temperature; and decrease the target rotation speed when the absolute value of the difference is greater than the preset difference and the average value is less than the current operating temperature.

[0029] According to another aspect of the present application, there is provided a processor-readable storage medium storing a computer program for causing a processor to execute any one of the foregoing rotation speed control methods of the heat dissipation device.

[0030] According to another aspect of the present application, there is provided a computer program product which, when the instructions in the computer program product are executed by a processor, executes any one of the foregoing rotation speed control methods of the heat dissipation device.

[0031] The present application has the following technical effects: By acquiring the current operating temperature of the target device in a set environment, and acquiring the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotation speed of the heat dissipation device required to maintain the operating temperature, based on the heat dissipation balance relationship, determining the target rotation speed corresponding to the current operating temperature, and performing rotation speed control on the heat dissipation device based on the target rotation speed to use the heat dissipation device to maintain the current operating temperature of the target device, so that heat dissipation devices such as fans in the base station can maintain the current operating temperature of target devices such as boards in the base station at a suitable rotation speed, avoiding problems such as too high or too low adjustment of the rotation speed of the heat dissipation device or the rotation speed being too high or too low and difficult to reach a steady state.

[0032] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present application, nor is it used to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The drawings are used to better understand the solution and do not limit the present application. Among them:

[0034] Figure 1 is a flowchart of a method for controlling the rotation speed of a heat dissipation device provided by an embodiment of the present application;

[0035] Figure 2 It is a flowchart showing another method for controlling the rotation speed of a heat dissipation device provided by an embodiment of the present application;

[0036] Figure 3 It is an example diagram of the heat dissipation balance relationship corresponding to a non-closed environment provided by an embodiment of the present application;

[0037] Figure 4 It is an example diagram of the heat dissipation balance relationship corresponding to a closed environment provided by an embodiment of the present application;

[0038] Figure 5 It is a flowchart showing another method for controlling the rotation speed of a heat dissipation device provided by an embodiment of the present application;

[0039] Figure 6 It is a flowchart showing another method for controlling the rotation speed of a heat dissipation device provided by an embodiment of the present application;

[0040] Figure 7 It is a flowchart showing another method for controlling the rotation speed of a heat dissipation device provided by an embodiment of the present application;

[0041] Figure 8 It is a structural diagram of a device for controlling the rotation speed of a heat dissipation device according to an embodiment of the present application;

[0042] Figure 9 It is a structural diagram of a device for controlling the rotation speed of a heat dissipation device provided by an embodiment of the present application. Detailed implementation manners

[0043] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0044] That is, in the embodiments of the present application, the term "and / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0045] In the embodiments of the present application, the term "a plurality of" means two or more, and other quantifiers are similar.

[0046] In many scenarios, it is necessary to dissipate heat from a certain device through a heat dissipation device. Taking the example of using a fan in a base station to dissipate heat from a board in the base station, in related technologies, the rotation speed of the fan is usually adjusted in the following ways to achieve heat dissipation of the board.

[0047] I. Manual method

[0048] The manual method means that the operation and maintenance personnel set the fan rotation speed to a certain fixed speed. This method brings a large amount of operation and maintenance work. The operation and maintenance personnel need to set a reasonable speed according to different computer room environments and the business load of the base station to ensure that the board does not malfunction due to high heat and does not use an excessive rotation speed. However, it is difficult to ensure this effect with the manual method, and it is difficult to cope with the changing environment.

[0049] II. Step control method

[0050] The step control method divides the board temperature and the fan rotation speed into multiple steps respectively. Different steps of board temperatures are preset to correspond to different steps of fan rotation speeds, and the program automatically adjusts the rotation speed according to this correspondence and the current temperature of the board. For example, referring to Table 1, the board temperature is set to 10 steps from the lowest temperature to the highest temperature, and the fan rotation speed is set to 10 steps from the lowest rotation speed to the highest rotation speed. According to the current temperature of the board, the fan rotation speed corresponding to this current temperature in Table 1 is adopted. Among them, pwm in Table 1 represents the pwm duty cycle (Pulse With Modulatin duty ratio), and the size of pwm can represent the size of the rotation speed. Among them, the board temperature refers to the operating temperature of the board.

[0051] Table 1 Board temperature and corresponding fan rotation speed

[0052]

[0053] In the step control method, when the gradient is relatively large, the error of the determined fan rotation speed is relatively large, and there are problems such as it being difficult to be stable when jumping back and forth between two steps, or being stable at a high rotation speed resulting in excessive noise. When the gradient is relatively small, for example, the board temperature is set to 100 gradients from 0 to 100 degrees, and a corresponding fan rotation speed is set for each gradient, then the operation and maintenance workload is too large and it is difficult to operate.

[0054] III. Temperature stabilization control method

[0055] The temperature stabilization control method means setting the optimal temperature range of the board. The fan rotation speed is not adjusted within the optimal temperature range. When it is lower than the lowest temperature of the optimal temperature range, the fan rotation speed is reduced, specifically, a certain fixed value such as 3pwm can be reduced. When it is higher than the highest temperature of the optimal temperature range, the fan rotation speed is increased, specifically, a certain fixed value such as 3pwm can be increased.

[0056] In this method, in order to reduce the problem of the fan speed adjusting back and forth, an optimal temperature range is set. Within the optimal temperature range, the speed is not adjusted. However, the problem is that the board cannot dissipate heat in time within the optimal temperature range and only increases the fan speed to dissipate heat until it exceeds the optimal temperature range. There is a problem of untimely speed adjustment, and the increased speed is insufficient, resulting in a large noise when the fan runs at full speed in the end.

[0057] IV. Central control method

[0058] The central control method is to set the optimal temperature of the board. If the temperature is lower than the optimal temperature, the fan speed is reduced. Specifically, the fan speed can be reduced according to the percentage of the current temperature of the board from the optimal temperature. If the temperature is higher than the optimal temperature, the fan speed is increased. Specifically, the fan speed can be increased according to the percentage of the current temperature of the board from the optimal temperature.

[0059] The central control method is essentially a linear adjustment method. The fan speed is reduced or increased according to the linear relationship between the temperature change and the speed change. Since in fact, the relationship between the temperature change and the fan speed that needs to be reduced or increased is not a linear relationship, there is a problem that the speed is reduced too much or the increased speed is insufficient in this method.

[0060] In view of at least one of the above problems, the present application provides a speed control method, device and storage medium for a heat dissipation device.

[0061] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0062] First, the speed control method of the heat dissipation device in this embodiment will be described with reference to the accompanying drawings.

[0063] Figure 1 It is a schematic flow chart of a speed control method for a heat dissipation device provided by an embodiment of the present application.

[0064] It should be noted that the speed control method of the heat dissipation device in the embodiment of the present application can be applied to a speed control device for a heat dissipation device. Among them, the speed control device for the heat dissipation device in this embodiment is implemented by software and / or hardware, and the speed control device for the heat dissipation device in this embodiment can be configured in an electronic device. Among them, the electronic device can be any device capable of controlling the speed of the heat dissipation device.

[0065] The base station in the technical solution provided by the embodiments of the present application can be various systems, especially the base station in the 5G system. The system can be a Global System of Mobile communication (GSM) system, a Code Division Multiple Access (CDMA) system, a Wideband Code Division Multiple Access (WCDMA) General Packet Radio Service (GPRS) system, a Long Term Evolution (LTE) system, an LTE Frequency Division Duplex (FDD) system, an LTE Time Division Duplex (TDD) system, a Long Term Evolution Advanced (LTE-A) system, a Universal Mobile Telecommunication System (UMTS), a Worldwide Interoperability for Microwave Access (WiMAX) system, a 5G New Radio (NR) system, etc. All of these various systems include terminal devices and network devices. The system may also include a core network part, such as an Evolved Packet System (EPS), a 5G System (5GS), etc.

[0066] As Figure 1 shown, the method for controlling the rotation speed of the heat dissipation device may include the following steps 101-104.

[0067] Step 101, obtain the current operating temperature of the target device in the set environment.

[0068] Among them, the target device is the device that needs to be cooled, such as a board in the base station or other devices that need to be cooled.

[0069] The set environment is the current working environment of the target device. For example, taking the target device as a board in the base station, since the board can work in a non-closed environment or a closed environment, the set environment can be a non-closed environment or a closed environment. Among them, the closed environment can be understood as the board is set in an outdoor integrated cabinet.

[0070] Step 102: Obtain the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotational speed of the heat dissipation device required to maintain the operating temperature.

[0071] Among them, the heat dissipation device is a device with heat dissipation function, such as the fan in the base station. By rotating the fan, heat dissipation of the circuit board in the base station can be achieved.

[0072] In some embodiments, the heat dissipation balance relationships corresponding to different environments can be pre-generated. The heat dissipation balance relationship corresponding to a certain environment is the corresponding relationship between the operating temperature of the target device and the rotational speed of the heat dissipation device required to maintain the operating temperature in this environment. Thus, the heat dissipation balance relationship corresponding to the set environment can be obtained from the heat dissipation balance relationships corresponding to different environments.

[0073] In some embodiments, multiple heat dissipation balance data groups corresponding to the set environment can be obtained. Each heat dissipation balance data group includes the target operating temperature of the target device in the set environment and the rotational speed of the heat dissipation device required to maintain the target operating temperature. Then, curve fitting is performed based on the multiple heat dissipation balance data groups to obtain the heat dissipation balance relationship corresponding to the set environment.

[0074] It should be noted that the heat dissipation device can work in the same environment as the target device. For example, if the target device is a circuit board in the base station and the heat dissipation device is a fan in the base station, the circuit board and the fan can be jointly arranged in an outdoor integrated cabinet.

[0075] Step 103: Based on the heat dissipation balance relationship, determine the target rotational speed corresponding to the current operating temperature.

[0076] In some embodiments, the current operating temperature of the target device can be substituted into the heat dissipation balance relationship corresponding to the set environment to obtain the target rotational speed corresponding to the current operating temperature. Among them, the target rotational speed is the rotational speed of the heat dissipation device required to maintain the current operating temperature of the target device in the set environment.

[0077] Step 104: Control the rotational speed of the heat dissipation device based on the target rotational speed to use the heat dissipation device to maintain the current operating temperature of the target device.

[0078] In some embodiments, the current rotational speed of the heat dissipation device can be adjusted to the target rotational speed to use the heat dissipation device to maintain the current operating temperature of the target device.

[0079] It can be understood that in the manual method in the related art, the operation and maintenance workload is relatively large. However, for the rotational speed control method of the heat dissipation device in this application, it can automatically determine the target rotational speed corresponding to the current operating temperature of the target device in the set environment, and automatically control the rotational speed of the heat dissipation device according to the target rotational speed, reducing the operation and maintenance workload and being able to cope with the changing environment. In addition, in the related art, the correspondence between the operating temperature of the target device and the rotational speed of the heat dissipation device is that a certain temperature in the step control method corresponds to a certain rotational speed in a certain step, or in the constant temperature control method, the optimal temperature range corresponds to a certain rotational speed, and the rotational speed is reduced when the temperature is lower than the lowest temperature in the optimal temperature range, and the rotational speed is increased when the temperature is higher than the highest temperature in the optimal temperature range, or it is a linear relationship in the central control method. When using these correspondences for rotational speed adjustment, there are problems such as the rotational speed of the heat dissipation device being adjusted too high or too low, or the rotational speed fluctuating suddenly and being difficult to reach a steady state. However, in the embodiment of this application, the correspondence between the operating temperature of the target device and the rotational speed of the heat dissipation device is the correspondence between the operating temperature of the target device in the set environment and the rotational speed of the heat dissipation device required to maintain this operating temperature. Based on this correspondence, the target rotational speed of the heat dissipation device is determined, and then the rotational speed of the heat dissipation device is controlled, so that heat dissipation devices such as fans in the base station can maintain the current operating temperature of target devices such as boards in the base station at an appropriate rotational speed, avoiding problems such as the rotational speed of the heat dissipation device being adjusted too high or too low, or the rotational speed fluctuating suddenly and being difficult to reach a steady state.

[0080] In summary, for the rotational speed control method of the heat dissipation device in the embodiment of this application, by obtaining the current operating temperature of the target device in the set environment, obtaining the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the correspondence between the operating temperature of the target device and the rotational speed of the heat dissipation device required to maintain the operating temperature, based on the heat dissipation balance relationship, determining the target rotational speed corresponding to the current operating temperature, and controlling the rotational speed of the heat dissipation device based on the target rotational speed to use the heat dissipation device to maintain the current operating temperature of the target device, so that heat dissipation devices such as fans in the base station can maintain the current operating temperature of target devices such as boards in the base station at an appropriate rotational speed, avoiding problems such as the rotational speed of the heat dissipation device being adjusted too high or too low, or the rotational speed fluctuating suddenly and being difficult to reach a steady state.

[0081] To clearly illustrate how to obtain the heat dissipation balance relationship corresponding to the set environment in the above embodiments of this application, this application also proposes a rotational speed control method for a heat dissipation device.

[0082] Figure 2 It is a schematic flowchart of another rotational speed control method provided by the embodiment of this application.

[0083] As Figure 2 shown, this rotational speed control method for the heat dissipation device is in Figure 1Based on the method shown above, the following steps may further be included:

[0084] Step 201, obtain multiple heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in a set environment and the rotational speed of the heat dissipation device required to maintain the target operating temperature.

[0085] The rotational speed of the heat dissipation device required to maintain the target operating temperature is the rotational speed of the heat dissipation device required to just dissipate the heat generated by the target device with an operating temperature of the target operating temperature in the set environment.

[0086] In some embodiments, each heat dissipation balance data group can be obtained through actual testing. For example, the target device and the heat dissipation device can be placed in a set environment, and by adjusting the environmental temperature of the set environment and the service load of the target device, the operating temperature of the target device in the set environment is adjusted to T1, and by adjusting the rotational speed of the heat dissipation device, the rotational speed for maintaining the operating temperature of the target device at T1 is tested, so as to obtain a heat dissipation balance data group based on T1 and the rotational speed for maintaining the operating temperature of the target device at T1.

[0087] In some embodiments, multiple heat dissipation balance data groups can be obtained in the manner shown in the following steps 201a - 201d.

[0088] 201a, obtain the rotational speed at which the target device maintains the same constant temperature at multiple test environmental temperatures of the heat dissipation device in the set environment, and this rotational speed is obtained through actual testing.

[0089] The test environmental temperature is the environmental temperature of the set environment in the test scenario.

[0090] The constant temperature can be set as needed.

[0091] Taking the target device and the heat dissipation device as the board card and the fan in the base station respectively, through actual testing, the rotational speed at which the fan maintains the same constant operating temperature of the board card at multiple test environmental temperatures in the set environment can be obtained. Among them, the rotational speed at which the fan maintains the same constant temperature of the board card at multiple test environmental temperatures in a non - enclosed environment, for example, can be as shown in Table 2.

[0092] Among them, taking the set environment as a non-hermetic environment and the constant temperature as 67 degrees in Table 2 as an example, Boardtemp represents the operating temperature of the board, Fantemp represents the fan temperature, that is, the inlet temperature of the fan, which can be regarded as the test environment temperature, and Pwm1 represents the rotational speed of the fan. Taking Boardtemp as 67, Fantemp as 33, and Pwm1 as 90 as an example, this set of data indicates that when the test environment temperature of the fan in the non-hermetic environment is 33 degrees, the rotational speed for maintaining the board at 67 degrees is 90pwm. That is, when the test environment temperature in the non-hermetic environment is 33 degrees, the rotational speed of the fan required for the heat generated by the 67-degree board to be just dissipated is 90pwm.

[0093] Table 2 Rotational speed of the fan corresponding to the constant temperature, test environment temperature in the non-hermetic environment

[0094] Boardtemp Fantemp Pwm1 67 33 90 67 38 130 67 40 170 67 43 210 67 44 255

[0095] 201b. For each test environment temperature, obtain the temperature difference between the constant temperature and the test environment temperature, and determine the rotational speed at which the target device maintains the constant temperature at the test environment temperature as the rotational speed corresponding to the temperature difference.

[0096] Among them, the rotational speed at which the target device maintains the constant temperature at the test environment temperature is the rotational speed at which the heat dissipation device in the set environment maintains the target device at the constant temperature at the test environment temperature obtained in step 201a.

[0097] In some embodiments, based on the rotational speeds at which the heat dissipation device maintains the target device at the same constant temperature at multiple test environment temperatures in the set environment, the relationships among the constant temperature, test environment temperature, temperature difference, and rotational speed of the heat dissipation device can be obtained.

[0098] For example, continuing with the data shown in Table 2, the relationships among the constant temperature, test environment temperature, temperature difference Delta1, and rotational speed of the heat dissipation device in the non-hermetic environment shown in Table 3 can be obtained. Among them, taking Boardtemp as 67, Fantemp as 33, and Pwm1 as 90 as an example, the temperature difference of 34 degrees between the constant temperature of 67 degrees and the test environment temperature of 33 degrees can be obtained, and the rotational speed of 90pwm at which the board is maintained at 67 degrees at the test environment temperature of 33 degrees is determined as the rotational speed corresponding to the temperature difference of 34 degrees, thereby obtaining the rotational speed of 90pwm corresponding to the constant temperature of 37 degrees, test environment temperature of 33 degrees, and temperature difference of 34 degrees.

[0099] Table 3 Rotational speed of the fan corresponding to the constant temperature, test environment temperature, temperature difference in the non-hermetic environment

[0100] Boardtemp Fantemp Delta1 Pwm1 67 33 34 90 67 38 29 130 67 40 27 170 67 43 24 210 67 44 23 225

[0101] Referring to Table 3, when the operating temperature of the board remains unchanged and the test environment temperature increases, the corresponding fan speed also increases. This is because when the temperature difference between the operating temperature of the board and the test environment temperature becomes smaller, a greater fan speed is required to dissipate the heat generated by the board.

[0102] 201c. For each temperature difference, determine the target data set corresponding to the temperature difference from multiple temperature data sets, where each temperature data set includes the historical operating temperature of the target device in the set environment and the corresponding historical environment temperature, and the target data set is the temperature data set in which the difference between the included historical operating temperature and historical environment temperature is the temperature difference.

[0103] Among them, the historical environment temperature is the environmental temperature of the set environment in the past period of time. The historical operating temperature is the operating temperature of the target device in the set environment in the past period of time. A certain historical operating temperature of the target device in the set environment and the corresponding historical environment temperature can be understood as that, in the past period of time, when the environmental temperature of the set environment is the historical environment temperature, the operating temperature of the target device is the historical operating temperature.

[0104] In some embodiments, multiple temperature data sets can be collected during the actual operation of the target device in the set environment in the past period of time, where each temperature data set includes the historical operating temperature of the target device in the set environment and the corresponding historical environment temperature. Then, for each temperature difference obtained in step 201b, the target data set corresponding to the temperature difference can be determined from the multiple temperature data sets, where the target data set is the temperature data set in which the difference between the included historical operating temperature and historical environment temperature is the temperature difference.

[0105] For example, continuing with the data shown in Table 3, the target data sets corresponding to each temperature difference in the non-hermetic environment shown in Table 4 can be obtained. Among them, Boardtemp1 represents the historical operating temperature in the target data set in the non-hermetic environment, and Fantemp1 represents the historical environment temperature in the target data set in the non-hermetic environment.

[0106] Table 4 Temperature difference and corresponding target data sets in the non-hermetic environment

[0107] Boardtemp1 Fantemp1 Delta1 67 33 34 72 43 29 74 47 27 77 53 24 78 55 23

[0108] 201d. Based on the historical operating temperatures in the target data sets corresponding to multiple temperature differences and the speeds corresponding to multiple temperature differences, determine multiple heat dissipation balance data sets, where each heat dissipation balance data set is determined based on the historical operating temperature and the corresponding speed in the target data set corresponding to the same temperature difference.

[0109] It can be understood that according to the physical principle, for the same temperature difference and the same rotation speed of the heat dissipation device, the amount of heat taken away by the heat dissipation device remains unchanged, that is, when the temperature difference Δ1 remains unchanged, the rotation speed of the heat dissipation device remains unchanged. According to this principle, it can be known that assuming that the temperature difference between a certain historical operating temperature of the target device in a set environment and a corresponding historical ambient temperature is ΔA, and the temperature difference between a certain constant temperature and a certain test ambient temperature is ΔB, then when ΔA is equal to ΔB, the amount of heat taken away by the same rotation speed of the heat dissipation device remains unchanged. Then, at the test ambient temperature in the set environment, the rotation speed that enables the target device to maintain this constant temperature can also enable the target device to maintain this historical operating temperature when the set environment is this historical ambient temperature. Therefore, for each temperature difference, based on the historical operating temperature in the target data group corresponding to this temperature difference and the rotation speed corresponding to this temperature difference, a corresponding heat dissipation balance data group can be determined. The rotation speed of the heat dissipation device in this heat dissipation balance data group can, in the set environment, just dissipate the heat generated by the target device with the operating temperature being this historical operating temperature, so as to maintain the operating temperature of the target device at this historical operating temperature.

[0110] For example, continuing to use the data shown in Tables 1 - 4, the data shown in Table 5 can be obtained. Among them, Boardtemp1 and Pwm1 in each row of Table 5 form a heat dissipation balance data group.

[0111] Table 5 Heat dissipation balance data groups corresponding to the target data group, constant temperature, test ambient temperature, temperature difference, and corresponding fan rotation speed in a non-hermetic environment

[0112] Boardtemp1 Fantemp1 Boardtemp Fantemp Delta Pwm1 67 33 67 33 34 90 72 43 67 38 29 130 74 47 67 40 27 170 77 53 67 43 24 210 78 55 67 44 23 225

[0113] By adopting the method shown in steps 201a - 201d, multiple heat dissipation balance data groups are obtained, avoiding repeatedly adjusting the ambient temperature of the set environment, the operating temperature of the target device in the set environment, and the rotation speed of the heat dissipation device in the test environment, and reducing the workload of obtaining multiple heat dissipation balance data groups.

[0114] It should be noted that, under normal circumstances, the number of target data groups corresponding to each temperature difference obtained from the actual scenario is one. In the case where the number of target data groups corresponding to a certain temperature difference obtained from the actual scenario is multiple, the relationship between the change trend of the operating temperature of the target device and the change trend of the rotation speed of the heat dissipation device can be determined based on experience. According to this relationship, the final target data group is determined from multiple target data groups. For example, the relationship between the change trend of the operating temperature of the board in the base station and the change trend of the rotation speed of the fan is that the higher the operating temperature of the board, the higher the rotation speed of the fan. Then, for a certain temperature difference, the final target data group can be determined from multiple target data groups according to this relationship, so that after the target data group corresponding to this temperature difference is combined with the target data groups corresponding to other temperature differences, this relationship can be satisfied.

[0115] Step 202: Perform curve fitting based on multiple heat dissipation balance data groups to obtain the heat dissipation balance relationship corresponding to the set environment.

[0116] In some embodiments, Step 202 can be implemented in the following manner: Generate a scatter plot based on multiple heat dissipation balance data groups; use polynomial fitting to perform curve fitting based on the scatter plot to obtain a curve representing the heat dissipation balance relationship; determine the heat dissipation balance relationship based on the polynomial of the curve.

[0117] Among them, based on each heat dissipation balance data group, a point in the scatter plot can be obtained.

[0118] In some embodiments, continuing to use the data shown in Table 5, the generated scatter plot and the obtained curve representing the heat dissipation balance relationship can be as Figure 3 shown. The polynomial of this curve can be y = 0.0059x 3 - 0.8468x 2 + 41.625x - 685.25. Among them, Figure 3 the abscissa in represents the operating temperature of the board, and the ordinate represents the rotation speed of the fan. Figure 3 Line 1 in represents the scatter plot. Figure 3 Line 2 in represents the linear relationship between the operating temperature of the board and the fan rotation speed in the related art. The polynomial corresponding to this linear relationship is y = 10.394x - 597.32. Figure 3 Line 3 in represents the curve representing the heat dissipation balance relationship in the embodiment of the present application. According to Figure 3 it can be seen that compared with Line 2 in the related art, Line 3 in the embodiment of the present application fits the actual test data better.

[0119] In some embodiments, taking the set environment as a closed environment and the constant temperature as 67 degrees as an example, the target data set, constant temperature, test environment temperature, temperature difference, and corresponding fan speed shown in Table 6 can also be obtained. Among them, Boardtemp3 represents the historical operating temperature in the target data set in the closed environment, Fantemp3 represents the historical ambient temperature in the target data set in the closed environment, Boardtemp2 represents the constant temperature of the board in the closed environment, Fantemp2 represents the test environment temperature in the closed environment, Delta2 represents the temperature difference between the constant temperature and the test environment temperature in the closed environment, and Pwm2 represents the speed of the fan in the closed environment.

[0120] Table 6 Target data set, constant temperature, test environment temperature, temperature difference, and corresponding fan speed in a closed environment

[0121] Boardtemp3 Fantemp3 Boardtemp2 Fantemp2 Delta2 Pwm2 78 53 67 42 25 225 77 52 67 42 25 215 76 49 67 40 27 200 75 48 67 40 27 185 74 46 67 39 28 170 72 44 67 39 28 155 70 40 67 37 30 140 68 37 67 36 31 125 66 34 67 35 32 110 64 29 67 32 35 95 62 24 67 29 38 80 61 26 67 32 35 65

[0122] In some embodiments, continuing to use the data shown in Table 6, the curve representing the heat dissipation balance relationship can be as Figure 4 shown. The polynomial of this curve can be y = 0.0319x 3 - 6.4931x 2 + 446.93x - 10284. Among them, Figure 4 the abscissa in represents the operating temperature of the board, and the ordinate represents the speed of the fan. Figure 4 Line 4 in represents the linear relationship between the operating temperature of the board and the fan speed in the related art. The polynomial corresponding to this linear relationship is y = 8.8618x - 475.46. Figure 4 Line 5 in is the curve representing the heat dissipation balance relationship in the embodiments of the present application. According to Figure 4 it can be seen that compared with Line 4 in the related art, Line 5 in the embodiments of the present application fits the actual test data better.

[0123] It should be noted that steps 201 to 202 can be executed before step 101, or be the specific implementation manner of step 102. The present application does not limit this.

[0124] The speed control method of the heat dissipation device according to the embodiment of the present application obtains multiple heat dissipation balance data groups. Each heat dissipation balance data group includes the target operating temperature of the target device in the set environment and the corresponding speed of the heat dissipation device required to maintain the target operating temperature. Curve fitting is performed based on the multiple heat dissipation balance data groups to obtain the heat dissipation balance relationship corresponding to the set environment. It can realize obtaining the heat dissipation balance relationship corresponding to the set environment according to the multiple heat dissipation balance data groups. The obtained heat dissipation balance relationship fits the actual test data, which can further improve the accuracy of the speed control of the heat dissipation device. Moreover, for the corresponding relationship between the operating temperature of the target device and the speed of the heat dissipation device in the related art, regardless of the control granularity, the speed of the heat dissipation device corresponding to each operating temperature needs to be obtained through multiple tests. However, in the present application, the heat dissipation balance relationship obtained through curve fitting can be used to quickly calculate the speed of the heat dissipation device corresponding to each operating temperature, improving the efficiency of the speed control of the heat dissipation device and reducing the workload required for speed control. In addition, in the present application, according to the actual situation, the corresponding temperature nodes can be freely and quickly selected from the heat dissipation balance relationship corresponding to the set environment, making the application more flexible.

[0125] To clearly illustrate how to control the speed of the heat dissipation device based on the target speed in any of the above embodiments of the present application, the present application also proposes a speed control method for the heat dissipation device.

[0126] Figure 5 It is a schematic flowchart of another speed control method for the heat dissipation device provided by the embodiment of the present application.

[0127] Such as Figure 5 The speed control method of the heat dissipation device may include the following steps 501-506.

[0128] Step 501, obtain the current operating temperature of the target device in the set environment.

[0129] Step 502, obtain the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the speed of the heat dissipation device required to maintain the operating temperature.

[0130] Step 503, determine the target speed corresponding to the current operating temperature based on the heat dissipation balance relationship.

[0131] Step 504, when it is determined that the target speed is greater than the first speed, adjust the target speed to the first speed.

[0132] Step 505, when it is determined that the target speed is less than the second speed, adjust the target speed to the second speed, where the first speed is greater than the second speed.

[0133] Among them, the first rotation speed and the second rotation speed can be set as needed. For example, when the heat dissipation device operates at too high a rotation speed, it is prone to failure. When the heat dissipation device operates at too low a rotation speed, the current required for the heat dissipation device to maintain the low rotation speed is actually relatively high. Therefore, in order to prevent the heat dissipation device from operating at too high a rotation speed and avoid failures of the heat dissipation device, and in order to prevent the heat dissipation device from operating at too low a rotation speed and avoid consuming a large amount of current, the first rotation speed can be set as the highest rotation speed at which the heat dissipation device can operate safely, and the second rotation speed can be set as the lowest rotation speed at which the heat dissipation device can operate normally with a lower current.

[0134] Step 506, perform speed control on the heat dissipation device based on the adjusted target rotation speed, so as to use the heat dissipation device to maintain the current operating temperature of the target device.

[0135] Among them, the specific implementation processes and principles of steps 501 - 503 and 506 can refer to the descriptions of other embodiments, and will not be elaborated here.

[0136] In the rotation speed control method of the heat dissipation device according to the embodiment of the present application, by adjusting the target rotation speed to the first rotation speed when it is determined that the target rotation speed is greater than the first rotation speed, and performing rotation speed control on the heat dissipation device based on the adjusted target rotation speed to use the heat dissipation device to maintain the current operating temperature of the target device, it is possible to prevent the heat dissipation device from operating at too high a rotation speed and avoid failures of the heat dissipation device. By adjusting the target rotation speed to the second rotation speed when it is determined that the target rotation speed is less than the second rotation speed, and performing rotation speed control on the heat dissipation device based on the adjusted target rotation speed to use the heat dissipation device to maintain the current operating temperature of the target device, it is possible to prevent the heat dissipation device from operating at too low a rotation speed and avoid consuming a large amount of current.

[0137] To clearly illustrate how to perform rotation speed control on the heat dissipation device based on the target rotation speed in any of the above embodiments of the present application, the present application also proposes a rotation speed control method for the heat dissipation device.

[0138] Figure 6 It is a schematic flowchart of another rotation speed control method for the heat dissipation device provided by the embodiment of the present application.

[0139] Such as Figure 6 , the rotation speed control method for the heat dissipation device may include the following steps 601 - 606.

[0140] Step 601, obtain the current operating temperature of the target device in the set environment.

[0141] Step 602, obtain the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotation speed of the heat dissipation device required to maintain the operating temperature.

[0142] Step 603: Determine the target speed corresponding to the current operating temperature based on the heat dissipation balance relationship.

[0143] Step 604: When it is determined that the current operating temperature is lower than the first temperature, adjust the target speed to the third speed.

[0144] Step 605: When it is determined that the current operating temperature is higher than the second temperature, adjust the target speed to the fourth speed, where the third speed is lower than the fourth speed, and the first temperature is lower than the second temperature.

[0145] Among them, the first temperature, the second temperature, the third speed, and the fourth speed can be set as needed. For example, when the heat dissipation device operates at too high a speed, it is prone to failure. When the heat dissipation device operates at too low a speed, the current required for the heat dissipation device to maintain too low a speed is actually relatively high. Then, in order to prevent the heat dissipation device from operating at too high a speed and avoid failures of the heat dissipation device, and in order to prevent the heat dissipation device from operating at too low a speed and avoid consuming a large amount of current, the fourth speed can be set as the highest speed at which the heat dissipation device can operate safely, the third speed can be set as the lowest speed at which the heat dissipation device can operate normally with a lower current, the first temperature can be set as the temperature corresponding to the third speed obtained according to the heat dissipation balance relationship corresponding to the set environment, and the second temperature can be set as the temperature corresponding to the fourth speed obtained according to the heat dissipation balance relationship corresponding to the set environment. Thus, when the current operating temperature is higher than the second temperature, the heat dissipation device operates at the highest speed at which it can operate safely, and when the current operating temperature is lower than the first temperature, the heat dissipation device operates at the above-mentioned lowest speed.

[0146] Step 606: Perform speed control on the heat dissipation device based on the adjusted target speed to use the heat dissipation device to maintain the current operating temperature of the target device.

[0147] Among them, for the specific implementation processes and principles of Steps 601 - 603 and 606, reference can be made to the descriptions of other embodiments, which will not be elaborated here.

[0148] The rotational speed control method of the heat dissipation device according to the embodiment of the present application adjusts the target rotational speed to the third rotational speed when it is determined that the current operating temperature is lower than the first temperature, and controls the rotational speed of the heat dissipation device based on the adjusted target rotational speed to maintain the current operating temperature of the target device by using the heat dissipation device, which can avoid the heat dissipation device operating at too low a rotational speed and avoid consuming a large amount of current. When it is determined that the current operating temperature is higher than the second temperature, the target rotational speed is adjusted to the fourth rotational speed, and the rotational speed of the heat dissipation device is controlled based on the adjusted target rotational speed to maintain the current operating temperature of the target device by using the heat dissipation device, which can avoid the heat dissipation device operating at too high a rotational speed and avoid the heat dissipation device from malfunctioning. Moreover, through the above method, unnecessary rotational speed adjustment can be avoided when the current operating temperature of the target device is lower than the first temperature or higher than the second temperature.

[0149] In some embodiments, taking the fan in the base station as an example of the heat dissipation device, since the base station may experience changes in wind resistance caused by changes in the wind deflector and damping plate of the base station chassis or changes in the fan capacity such as fan aging during long-term use, etc., the heat dissipation balance relationship of the determined set environment may deviate from the actual situation, resulting in a decrease in the accuracy of the target rotational speed determined according to the heat dissipation balance relationship. To improve the accuracy of the rotational speed control of the heat dissipation device, the present application also proposes a rotational speed control method for the heat dissipation device.

[0150] Figure 7 It is a schematic flowchart of another rotational speed control method for the heat dissipation device provided by the embodiment of the present application.

[0151] Such as Figure 7 The rotational speed control method of the heat dissipation device may include the following steps 701-708.

[0152] Step 701, obtain the current operating temperature of the target device in the set environment.

[0153] Step 702, obtain the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotational speed of the heat dissipation device required to maintain the operating temperature.

[0154] Step 703, determine the target rotational speed corresponding to the current operating temperature based on the heat dissipation balance relationship.

[0155] Step 704, control the rotational speed of the heat dissipation device based on the target rotational speed to maintain the current operating temperature of the target device by using the heat dissipation device.

[0156] Among them, the specific implementation process and principle of steps 701-704 can refer to the description of other embodiments and will not be elaborated here.

[0157] Step 705: Obtain the temperature of the target device after heat dissipation collected at a preset time interval within a preset time period.

[0158] Among them, the preset time period and the preset time interval can be set as needed. For example, they can be set according to factors such as the workload of temperature collection.

[0159] Step 706: Obtain the average value of the temperature after heat dissipation.

[0160] For example, the preset time period can be set to 1 minute and the preset time interval can be set to 10 seconds. Thus, after adjusting the rotation speed of the heat dissipation device to the target rotation speed, the temperature of the target device after heat dissipation within 1 minute can be collected at an interval of 10 seconds, obtaining 6 temperatures after heat dissipation, and then the average value of these 6 temperatures after heat dissipation can be obtained.

[0161] By obtaining the average value of the temperature after heat dissipation, the error existing in single - time temperature collection can be eliminated.

[0162] Step 707: Adjust the target rotation speed when the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference.

[0163] Among them, the preset difference can be set as needed.

[0164] In some embodiments, when the absolute value of the difference between the average value and the current operating temperature is not greater than the preset difference, it indicates that the speed regulation of the heat dissipation device is balanced, and the determined heat dissipation balance relationship corresponding to the set environment has not deviated from the actual situation. The target rotation speed determined according to this heat dissipation balance relationship is relatively accurate, so the heat dissipation device can continue to operate at this target rotation speed.

[0165] In some embodiments, when the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference, it indicates that the speed regulation of the heat dissipation device is insufficient or excessive, and the determined heat dissipation balance relationship corresponding to the set environment has deviated from the actual situation. The accuracy of the target rotation speed determined according to this heat dissipation balance relationship becomes poor, so the target rotation speed can be adjusted.

[0166] In some embodiments, when the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference and the average value is greater than the current operating temperature, it indicates that the speed regulation of the heat dissipation device is insufficient, and the target rotation speed can be increased.

[0167] In some embodiments, the process of increasing the target speed may include: based on the first speed step, increasing the target speed at the first time interval until a speed regulation balance state is reached. The first speed step and the first time interval can be set as needed. For example, the preset time period can be set to 1 minute, the preset time interval to 10 seconds, the first speed step to 1 pwm, and the first time interval to 8 seconds. After adjusting the speed of the heat dissipation device to the target speed, the post-cooling temperature of the target device can be collected within 1 minute at 10-second intervals, resulting in 6 post-cooling temperatures. Then, the average value of these 6 post-cooling temperatures can be obtained. When the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference and the average value is greater than the current operating temperature, the speed of the heat dissipation device can be increased by 1 pwm every 8 seconds and fine-tuned continuously for 1 minute. Again, the post-cooling temperature of the target device can be collected within 1 minute at 10-second intervals, resulting in 6 post-cooling temperatures. The average value of these 6 post-cooling temperatures can be obtained again. When the absolute value of the difference between the average value and the current operating temperature is still greater than the preset difference and the average value is greater than the current operating temperature, the first speed step is doubled, that is, the speed of the heat dissipation device is increased by 2 pwm every 8 seconds until the speed regulation balance state is reached. The speed regulation balance state means that after adjusting the speed of the heat dissipation device, the absolute value of the difference between the average value of the post-cooling temperature of the target device collected at the preset time interval within the preset time period and the operating temperature before speed regulation is not greater than the preset difference.

[0168] In some embodiments, when the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference and the average value is less than the current operating temperature, it indicates that the speed regulation of the heat dissipation device is excessive, and the target speed can be decreased.

[0169] In some embodiments, the process of reducing the target speed may include: based on the second speed step, reducing the target speed at the second time interval until a speed regulation balance state is reached. The second speed step and the second time interval can be set as needed. For example, a preset time period can be set to 1 minute, the preset time interval to 10 seconds, the second speed step to 1 pwm, and the second time interval to 8 seconds. After adjusting the speed of the heat dissipation device to the target speed, the post-cooling temperature of the target device can be collected within 1 minute at 10-second intervals, obtaining 6 post-cooling temperatures. Then, the average value of these 6 post-cooling temperatures can be obtained. When the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference and the average value is less than the current operating temperature, the speed of the heat dissipation device can be reduced by 1 pwm every 8 seconds and continuously fine-tuned for 1 minute. Then, again, the post-cooling temperature of the target device is collected within 1 minute at 10-second intervals, obtaining 6 post-cooling temperatures, and the average value of these 6 post-cooling temperatures is obtained again. When the absolute value of the difference between the average value and the current operating temperature is still greater than the preset difference and the average value is less than the current operating temperature, the second speed step is doubled, that is, the speed of the heat dissipation device is reduced by 2 pwm every 8 seconds until the speed regulation balance state is reached.

[0170] Step 708, based on the adjusted target speed, perform speed control on the heat dissipation device.

[0171] The speed control method for the heat dissipation device provided by the embodiments of the present application determines the target speed corresponding to the current operating temperature based on the heat dissipation balance relationship, performs speed control on the heat dissipation device based on the target speed to maintain the current operating temperature of the target device using the heat dissipation device, obtains the post-cooling temperature of the target device collected at preset time intervals within a preset time period, obtains the average value of the post-cooling temperature, and adjusts the target speed when the absolute value of the difference between the average value and the current operating temperature is greater than the preset difference. Based on the adjusted target speed, perform speed control on the heat dissipation device, which can improve the accuracy of the speed control of the heat dissipation device when the heat dissipation balance relationship in the determined set environment deviates from the actual situation, resulting in a decrease in the accuracy of the target speed determined according to the heat dissipation balance relationship.

[0172] To implement the above embodiments, the present application also provides a speed control device for a heat dissipation device.

[0173] Figure 8 It is a schematic structural diagram of a speed control device for a heat dissipation device provided by the embodiments of the present application.

[0174] As Figure 8 shown, the speed control device for the heat dissipation device may include a transceiver 800, a processor 810, and a memory 820, where:

[0175] A transceiver 800 is used to receive and send data under the control of a processor 810.

[0176] Among them, in Figure 8 , the bus architecture may include any number of interconnected buses and bridges, specifically linking together various circuits of one or more processors represented by the processor 810 and the memory represented by the memory 820. The bus architecture can also link together various other circuits such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art, and thus will not be further described herein. The bus interface provides an interface. The transceiver 800 can be multiple components, that is, including a transmitter and a receiver, providing a unit for communicating with various other devices on a transmission medium, and these transmission mediums include wireless channels, wired channels, optical fiber cables, and other transmission mediums. The processor 810 is responsible for managing the bus architecture and general processing, and the memory 820 can store data used by the processor 810 when performing operations.

[0177] The processor 810 can be a Central Processing Unit (CPU), an Application Specific Integrated Circuit (ASIC), a Field - Programmable Gate Array (FPGA), or a Complex Programmable Logic Device (CPLD). The processor can also adopt a multi - core architecture. The processor and the memory can also be physically separated.

[0178] The processor 810 calls a computer program stored in the memory and performs the following operations: obtaining the current operating temperature of a target device in a set environment; obtaining the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotation speed of the heat dissipation device required to maintain the operating temperature; determining the target rotation speed corresponding to the current operating temperature based on the heat dissipation balance relationship; and controlling the rotation speed of the heat dissipation device based on the target rotation speed to use the heat dissipation device to maintain the current operating temperature of the target device.

[0179] As a possible implementation, the processor 810 is further used to perform the following operations: obtaining multiple heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in the set environment and the rotation speed of the heat dissipation device required to maintain the target operating temperature; and performing curve fitting based on the multiple heat dissipation balance data groups to obtain the heat dissipation balance relationship.

[0180] As a possible implementation, the processor 810 executes to obtain multiple heat dissipation balance data groups, specifically: obtaining the rotation speeds at which the target device maintains the same constant temperature at multiple test ambient temperatures of the heat dissipation device in a set environment, where the rotation speeds are obtained through actual tests; for each test ambient temperature, obtaining the temperature difference between the constant temperature and the test ambient temperature, and determining the rotation speed at which the target device maintains the constant temperature at the test ambient temperature as the rotation speed corresponding to the temperature difference; for each temperature difference, determining the target data group corresponding to the temperature difference from multiple temperature data groups, where each temperature data group includes the historical operating temperature of the target device in the set environment and the corresponding historical ambient temperature, and the target data group is the temperature data group in which the difference between the historical operating temperature and the historical ambient temperature included therein is the temperature difference; based on the historical operating temperatures in the target data groups corresponding to multiple temperature differences and the rotation speeds corresponding to multiple temperature differences, determining multiple heat dissipation balance data groups, where each heat dissipation balance data group is determined based on the historical operating temperature and the corresponding rotation speed in the target data group corresponding to the same temperature difference.

[0181] As a possible implementation, the processor 810 executes to perform curve fitting based on multiple heat dissipation balance data groups to obtain a heat dissipation balance relationship, specifically: generating a scatter plot based on multiple heat dissipation balance data groups; using polynomial fitting to perform curve fitting based on the scatter plot to obtain a curve representing the heat dissipation balance relationship; determining the heat dissipation balance relationship based on the polynomial of the curve.

[0182] As a possible implementation, the processor 810 is further configured to perform the following operations: in the case where it is determined that the target rotation speed is greater than the first rotation speed, adjusting the target rotation speed to the first rotation speed; in the case where it is determined that the target rotation speed is less than the second rotation speed, adjusting the target rotation speed to the second rotation speed, where the first rotation speed is greater than the second rotation speed.

[0183] As a possible implementation, the processor 810 is further configured to perform the following operations: in the case where it is determined that the current operating temperature is less than the first temperature, adjusting the target rotation speed to the third rotation speed; in the case where it is determined that the current operating temperature is greater than the second temperature, adjusting the target rotation speed to the fourth rotation speed, where the third rotation speed is less than the fourth rotation speed and the first temperature is less than the second temperature.

[0184] As a possible implementation, the processor 810 is further configured to perform the following operations: obtaining the post - heat - dissipation temperature of the target device collected at preset time intervals within a preset time period; obtaining the average value of the post - heat - dissipation temperatures; in the case where the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference, adjusting the target rotation speed; and performing speed control on the heat dissipation device based on the adjusted target rotation speed.

[0185] As a possible implementation, the processor 810 adjusts the target rotational speed when the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference. Specifically, when the absolute value of the difference is greater than the preset difference and the average value is greater than the current operating temperature, the target rotational speed is increased; when the absolute value of the difference is greater than the preset difference and the average value is less than the current operating temperature, the target rotational speed is decreased.

[0186] It should be noted here that the rotational speed control device of the heat dissipation device provided in the embodiment of the present application can implement all the method steps implemented in the above method embodiment and can achieve the same technical effect. Therefore, the same parts and beneficial effects as those in the method embodiment will not be specifically described in this embodiment.

[0187] Corresponding to Figures 1 to 7 the rotational speed control method of the heat dissipation device provided in the above Figures 1 to 7 embodiment, the present application also provides a rotational speed control device of a heat dissipation device. Since the rotational speed control device of the heat dissipation device provided in the embodiment of the present application corresponds to the rotational speed control method of the heat dissipation device provided in the above

[0188] Figure 9 is a schematic structural diagram of a rotational speed control device of a heat dissipation device provided in an embodiment of the present application.

[0189] As Figure 9 shown, the rotational speed control device 900 of the heat dissipation device can be applied to an electronic device and includes: a first temperature acquisition unit 910, a relationship acquisition unit 920, a determination unit 930, and a control unit 940.

[0190] Among them, the first temperature acquisition unit 910 is configured to acquire the current operating temperature of the target device in the set environment; the relationship acquisition unit 920 is configured to acquire the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotational speed of the heat dissipation device required to maintain the operating temperature; the determination unit 930 is configured to determine the target rotational speed corresponding to the current operating temperature based on the heat dissipation balance relationship; the control unit 940 is configured to perform rotational speed control on the heat dissipation device based on the target rotational speed to maintain the current operating temperature of the target device by using the heat dissipation device.

[0191] As a possible implementation, the rotational speed control device 900 of the heat dissipation device further includes:

[0192] A data acquisition unit for acquiring a plurality of heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in a set environment and the rotation speed of the heat dissipation device required to maintain the target operating temperature.

[0193] A curve fitting unit for performing curve fitting based on a plurality of heat dissipation balance data groups to obtain a heat dissipation balance relationship.

[0194] As a possible implementation, the data acquisition unit is specifically configured to: acquire the rotation speed at which the target device maintains the same constant temperature at a plurality of test ambient temperatures of the heat dissipation device in a set environment, and the rotation speed is obtained through actual testing; for each test ambient temperature, acquire the temperature difference between the constant temperature and the test ambient temperature, and determine the rotation speed at which the target device maintains the constant temperature at the test ambient temperature as the rotation speed corresponding to the temperature difference; for each temperature difference, determine the target data group corresponding to the temperature difference from a plurality of temperature data groups, where each temperature data group includes the historical operating temperature of the target device in a set environment and the corresponding historical ambient temperature, and the target data group is the temperature data group in which the difference between the historical operating temperature and the historical ambient temperature included is the temperature difference; based on the historical operating temperatures in the target data groups corresponding to a plurality of temperature differences and the rotation speeds corresponding to a plurality of temperature differences, determine a plurality of heat dissipation balance data groups, where each heat dissipation balance data group is determined based on the historical operating temperature and the corresponding rotation speed in the target data group corresponding to the same temperature difference.

[0195] As a possible implementation, the curve fitting unit is specifically configured to: generate a scatter plot based on a plurality of heat dissipation balance data groups; perform curve fitting based on the scatter plot in a polynomial fitting manner to obtain a curve representing the heat dissipation balance relationship; determine the heat dissipation balance relationship based on the polynomial of the curve.

[0196] As a possible implementation, the rotation speed control device 900 of the heat dissipation device further includes:

[0197] A first adjustment unit for adjusting the target rotation speed to the first rotation speed when it is determined that the target rotation speed is greater than the first rotation speed; and for adjusting the target rotation speed to the second rotation speed when it is determined that the target rotation speed is less than the second rotation speed, where the first rotation speed is greater than the second rotation speed.

[0198] As a possible implementation, the rotation speed control device 900 of the heat dissipation device further includes:

[0199] A second adjustment unit for adjusting the target rotation speed to the third rotation speed when it is determined that the current operating temperature is less than the first temperature; and for adjusting the target rotation speed to the fourth rotation speed when it is determined that the current operating temperature is greater than the second temperature, where the third rotation speed is less than the fourth rotation speed and the first temperature is less than the second temperature.

[0200] As a possible implementation, the rotation speed control device 900 of the heat dissipation device further includes:

[0201] A second temperature acquisition unit, configured to acquire the post-cooling temperature of the target device collected at a preset time interval within a preset time period, and to acquire the average value of the post-cooling temperature;

[0202] A third adjustment unit, configured to adjust the target rotation speed when the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference;

[0203] A control unit 940, configured to perform rotation speed control on the heat dissipation device based on the adjusted target rotation speed.

[0204] As a possible implementation, the third adjustment unit is specifically configured to: perform an upward adjustment on the target rotation speed when the absolute value of the difference is greater than the preset difference and the average value is greater than the current operating temperature; perform a downward adjustment on the target rotation speed when the absolute value of the difference is greater than the preset difference and the average value is less than the current operating temperature.

[0205] It should be noted here that the rotation speed control device of the heat dissipation device provided in the embodiments of the present application can implement all the method steps implemented in the above method embodiments, and can achieve the same technical effects. The same parts and beneficial effects as those in the method embodiments in this embodiment will not be specifically described herein again.

[0206] It should be noted that the division of the units in the embodiments of the present application is illustrative, merely a logical function division, and there may be other division methods in actual implementation. In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated units can be implemented in the form of hardware or in the form of software functional units.

[0207] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a processor-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network-side device, etc.) or a processor to execute all or part of the steps of the methods in various embodiments of this application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks, or optical discs.

[0208] It should be noted here that the above-mentioned device provided in the embodiments of the present invention can implement all the method steps implemented in the above-mentioned method embodiments and can achieve the same technical effects. Therefore, the same parts and beneficial effects as those in the method embodiments will not be specifically described in this embodiment.

[0209] On the other hand, the embodiments of this application also provide a processor-readable storage medium. The processor-readable storage medium stores a computer program, and the computer program is used to cause the processor to execute this application Figures 1 to 7 any method shown in an embodiment.

[0210] Among them, the above-mentioned processor-readable storage medium can be any available medium or data storage device that the processor can access, including but not limited to magnetic memories (such as floppy disks, hard disks, magnetic tapes, magneto-optical discs (MO), etc.), optical memories (such as CDs, DVDs, BDs, HVDs, etc.), and semiconductor memories (such as ROM, EPROM, EEPROM, non-volatile memories (NANDFLASH), solid-state drives (SSD)).

[0211] To implement the above embodiments, this application also proposes a computer program product.

[0212] Among them, this computer program product includes a computer program, and when the computer program is executed by a processor, it implements this application Figures 1 to 7 any method shown in an embodiment.

[0213] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage and optical storage, etc.) that contain computer-usable program code.

[0214] The present application is described with reference to the flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each flow and / or block in the flowchart and / or block diagram, as well as the combination of flows and / or blocks in the flowchart and / or block diagram, can be implemented by computer-executable instructions. These computer-executable instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate a device for realizing the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0215] These processor-executable instructions can also be stored in a processor-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the processor-readable memory generate a manufactured article including an instruction device, and the instruction device realizes the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0216] These processor-executable instructions can also be loaded onto a computer or other programmable data processing device, so that a series of operation steps are executed on the computer or other programmable device to generate a computer-implemented process, and thus the instructions executed on the computer or other programmable device provide steps for realizing the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0217] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these changes and modifications.

Claims

1. A method for controlling the rotation speed of a heat dissipation device, characterized in that, Including: Obtain the current operating temperature of the target device in the set environment; Obtain the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotational speed of the heat dissipation device required to maintain the operating temperature; Based on the heat dissipation balance relationship, determine the target rotational speed corresponding to the current operating temperature; Control the rotational speed of the heat dissipation device based on the target rotational speed, so as to use the heat dissipation device to maintain the current operating temperature of the target device.

2. The method according to claim 1, characterized in that, Before obtaining the heat dissipation balance relationship corresponding to the set environment, it further includes: Obtain a plurality of heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in the set environment and the rotational speed of the heat dissipation device required to maintain the target operating temperature; Perform curve fitting based on the plurality of heat dissipation balance data groups to obtain the heat dissipation balance relationship.

3. The method according to claim 2, wherein The obtaining of the plurality of heat dissipation balance data groups includes: Obtain the rotational speeds at which the target device maintains the same constant temperature at a plurality of test ambient temperatures in the set environment, and the rotational speeds are obtained through actual tests; For each test ambient temperature, obtain the temperature difference between the constant temperature and the test ambient temperature, and determine the rotational speed at which the target device maintains the constant temperature at the test ambient temperature as the rotational speed corresponding to the temperature difference; For each temperature difference, determine the target data group corresponding to the temperature difference from a plurality of temperature data groups, where each temperature data group includes the historical operating temperature of the target device in the set environment and the corresponding historical ambient temperature, and the target data group is the temperature data group in which the difference between the historical operating temperature and the historical ambient temperature included is the temperature difference; Based on the historical operating temperatures in the target data groups corresponding to a plurality of the temperature differences and the rotational speeds corresponding to a plurality of the temperature differences, determine the plurality of heat dissipation balance data groups, where each heat dissipation balance data group is determined based on the historical operating temperature and the corresponding rotational speed in the target data group corresponding to the same temperature difference.

4. The method according to claim 2, characterized in that, The performing of curve fitting based on the plurality of heat dissipation balance data groups to obtain the heat dissipation balance relationship includes: Generate a scatter plot based on the plurality of heat dissipation balance data groups; Adopt the method of polynomial fitting to perform curve fitting based on the scatter plot to obtain a curve representing the heat dissipation balance relationship; Based on the polynomial of the curve, determine the heat dissipation balance relationship.

5. The method according to any one of claims 1-4, characterized in that, Before controlling the rotational speed of the heat dissipation device based on the target rotational speed, it further includes: In the case where it is determined that the target rotational speed is greater than the first rotational speed, adjust the target rotational speed to the first rotational speed; In the case where it is determined that the target rotational speed is less than the second rotational speed, adjust the target rotational speed to the second rotational speed, where the first rotational speed is greater than the second rotational speed.

6. The method according to any one of claims 1-4, characterized in that Before controlling the rotational speed of the heat dissipation device based on the target rotational speed, it further includes: In the case where it is determined that the current operating temperature is less than the first temperature, adjust the target rotational speed to the third rotational speed; When it is determined that the current operating temperature is greater than the second temperature, adjust the target speed to the fourth speed, where the third speed is less than the fourth speed, and the first temperature is less than the second temperature.

7. The method according to any one of claims 1 to 4, characterized in that, After controlling the speed of the heat dissipation device based on the target speed, it further includes: Obtain the temperature after heat dissipation of the target device collected at preset time intervals within a preset time period; Obtain the average value of the temperature after heat dissipation; When the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference, adjust the target speed; Based on the adjusted target speed, control the speed of the heat dissipation device.

8. The method according to claim 7, wherein The adjusting the target speed when the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference includes: When the absolute value of the difference is greater than the preset difference and the average value is greater than the current operating temperature, perform a higher adjustment on the target speed; When the absolute value of the difference is greater than the preset difference and the average value is less than the current operating temperature, perform a lower adjustment on the target speed.

9. A rotational speed control device for a heat dissipation device, characterized in that, It includes a memory, a transceiver, and a processor; The memory is used to store a computer program; the transceiver is used to send and receive data under the control of the processor; the processor is used to read the computer program in the memory and perform the following operations: Obtain the current operating temperature of the target device in the set environment; Obtain the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the speed of the heat dissipation device required to maintain the operating temperature; Based on the heat dissipation balance relationship, determine the target speed corresponding to the current operating temperature; Based on the target speed, control the speed of the heat dissipation device to use the heat dissipation device to maintain the current operating temperature of the target device.

10. The device according to claim 9, characterized in that The processor is further used to perform the following operations: Obtain a plurality of heat dissipation balance data groups, where each heat dissipation balance data group includes the target operating temperature of the target device in the set environment and the speed of the heat dissipation device required to maintain the target operating temperature; Perform curve fitting based on the plurality of heat dissipation balance data groups to obtain the heat dissipation balance relationship.

11. The device according to claim 10, wherein When the processor executes to obtain a plurality of heat dissipation balance data groups, specifically: Obtain the speeds at which the target device maintains the same constant temperature at a plurality of test environment temperatures in the set environment of the heat dissipation device, and the speeds are obtained through actual tests; For each test environment temperature, obtain the temperature difference between the constant temperature and the test environment temperature, and determine the speed at which the target device maintains the constant temperature at the test environment temperature as the speed corresponding to the temperature difference; For each of the temperature differences, determine a target data set corresponding to the temperature difference from a plurality of temperature data sets, where each of the temperature data sets includes the historical operating temperature of the target device in the set environment and the corresponding historical ambient temperature, and the target data set is the temperature data set in which the difference between the historical operating temperature and the historical ambient temperature included therein is the temperature difference; Based on the historical operating temperatures in the target data sets corresponding to a plurality of the temperature differences and the rotational speeds corresponding to the plurality of temperature differences, determine the plurality of heat dissipation balance data sets, where each of the heat dissipation balance data sets is determined based on the historical operating temperature and the corresponding rotational speed in the target data set corresponding to the same temperature difference.

12. The device according to claim 10, characterized in that, The processor performs curve fitting based on the plurality of heat dissipation balance data sets to obtain the heat dissipation balance relationship, specifically: Generate a scatter plot based on the plurality of heat dissipation balance data sets; Adopt the method of polynomial fitting to perform curve fitting based on the scatter plot to obtain a curve representing the heat dissipation balance relationship; Determine the heat dissipation balance relationship based on the polynomial of the curve.

13. The device according to any one of claims 9-12, characterized in that, The processor is further configured to perform the following operations: In the case where it is determined that the target rotational speed is greater than the first rotational speed, adjust the target rotational speed to the first rotational speed; In the case where it is determined that the target rotational speed is less than the second rotational speed, adjust the target rotational speed to the second rotational speed, where the first rotational speed is greater than the second rotational speed.

14. The device according to any one of claims 9 - 12, characterized in that, The processor is further configured to perform the following operations: In the case where it is determined that the current operating temperature is less than the first temperature, adjust the target rotational speed to the third rotational speed; In the case where it is determined that the current operating temperature is greater than the second temperature, adjust the target rotational speed to the fourth rotational speed, where the third rotational speed is less than the fourth rotational speed, and the first temperature is less than the second temperature.

15. The device according to any one of claims 9-12, characterized in that, The processor is further configured to perform the following operations: Obtain the temperature after heat dissipation of the target device collected at preset time intervals within a preset time period; Obtain the average value of the temperature after heat dissipation; In the case where the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference, adjust the target rotational speed; Based on the adjusted target rotational speed, perform rotational speed control on the heat dissipation device.

16. The device according to claim 15, characterized in that, The processor performs adjusting the target rotational speed in the case where the absolute value of the difference between the average value and the current operating temperature is greater than a preset difference, specifically: In the case where the absolute value of the difference is greater than the preset difference and the average value is greater than the current operating temperature, perform a raising process on the target rotational speed; In the case where the absolute value of the difference is greater than the preset difference and the average value is less than the current operating temperature, perform a lowering process on the target rotational speed.

17. A rotational speed control device for a heat dissipation device, characterized in that, Includes: A first temperature acquisition unit for acquiring the current operating temperature of the target device in the set environment; A relationship acquisition unit for acquiring the heat dissipation balance relationship corresponding to the set environment, where the heat dissipation balance relationship is the corresponding relationship between the operating temperature of the target device and the rotational speed of the heat dissipation device required to maintain the operating temperature; A determining unit, configured to determine a target rotation speed corresponding to the current operating temperature based on the heat dissipation balance relationship; A control unit, configured to perform speed control on the heat dissipation device based on the target rotation speed, so as to maintain the current operating temperature of the target device by using the heat dissipation device.

18. A processor-readable storage medium, characterized in that, The processor-readable storage medium stores a computer program, and the computer program is used to cause the processor to execute the method according to any one of claims 1 to 8.

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