Display module and display device

Abstract

The invention discloses a display module and a display device, and belongs to the technical field of display. The display module comprises a display panel, a driving chip and a flexible circuit board. According to the display panel, the flexible circuit board is provided with the first connecting part and the second connecting part which are connected with each other, and the first connecting part which is longer in the second direction is in binding connection with the display panel in the second binding area, so that the first connecting part can provide larger pulling force for the display panel. Therefore, in the bending process of the non-display area, the flexible circuit board can provide effective traction, and the problems of warping, binding fracture or circuit fracture after the display panel is bent are avoided.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display module and a display device. Background Art

[0002] Against the backdrop of the rapid development of Organic Light-Emitting Diode (OLED) display technologies, a flexible OLED display panel includes a display area and a non-display area. A driving chip and a flexible circuit board are bonded to a bonding area in the non-display area. Under the requirement of narrow bezels, a bending area in the non-display area can be bent, such that the bonding area in the non-display area can be bent to the back of the display area.

[0003] For medium and large-sized products, multiple driving chips are bonded to the bonding area. To reduce costs, multiplexing technologies are currently adopted to reduce the number of driving chips, and the corresponding number of flexible circuit boards is also reduced, resulting in warping or bonding breakage problems in parts of the non-display area that are not pulled by the flexible circuit boards. Summary of the Invention

[0004] Embodiments of this application provide a display module and a display device. The problems of warping or bonding breakage in a bent medium and large-sized display panel in the prior art can be solved. The technical solutions are as follows:

[0005] On the one hand, a display module is provided, including: a display panel, a driving chip, and a flexible circuit board;

[0006] The display panel has a display area and a non-display area surrounding the display area; the non-display area includes: a first bonding area and a second bonding area arranged in a first direction, and the first bonding area is closer to the display area than the second bonding area;

[0007] The driving chip is bonded and connected to the display panel in the first bonding area;

[0008] The flexible circuit board includes: a first connection part and a second connection part connected to each other, and the first connection part and the second connection part are arranged in the first direction; the first connection part is bonded and connected to the display panel in the second bonding area, and the second connection part extends out of the display panel;

[0009] Wherein, the length of the first connection part in a second direction is greater than the length of the second connection part in the second direction; the second direction intersects with the first direction.

[0010] Optionally, the first connection part includes: a first sub-part and a second sub-part, and the second sub-part is connected to at least one side of the first sub-part in the second direction;

[0011] Wherein, the length of the first branch portion in the second direction is equal to the length of the second connecting portion in the second direction.

[0012] Optionally, the first connecting portion includes two second branch portions, and the two second branch portions are respectively connected to opposite sides of the first branch portion in the second direction.

[0013] Optionally, the two second branch portions have the same length in the second direction.

[0014] Optionally, the portion of the display panel distributed in the first bonding area has a plurality of first pins, and the portion of the display panel distributed in the second bonding area has a plurality of second pins; the driving chip is bonded and connected to the plurality of first pins; the first connecting portion is bonded and connected to the plurality of second pins at least through the first branch portion.

[0015] Optionally, the first connecting portion has a plurality of third pins, and a part of the third pins among the plurality of third pins are distributed in the first branch portion, and the other part of the third pins are distributed in the second branch portion.

[0016] Optionally, the area of the orthographic projection of the third pins distributed in the second branch portion on the display panel is larger than the area of the orthographic projection of the third pins distributed in the first branch portion on the display panel.

[0017] Optionally, in the second direction, the length of the third pins distributed in the second branch portion is greater than the length of the third pins distributed in the first branch portion;

[0018] And / or, in the first direction, the width of the third pins distributed in the second branch portion is greater than the width of the third pins distributed in the first branch portion.

[0019] Optionally, the plurality of second pins include: a plurality of first-type second pins and a plurality of second-type second pins; the plurality of first-type second pins are bonded to the third pins distributed in the first branch portion, and the plurality of second-type second pins are bonded to the third pins distributed in the second branch portion;

[0020] Wherein, the plurality of first-type second pins are electrically connected to at least part of the first pins.

[0021] Optionally, the display panel further includes: a power signal line, and the power signal line is electrically connected to at least part of the second-type second pins.

[0022] Optionally, the display module further includes: a multiplexer, which is located in the non-display area, and in the first direction, the multiplexer is located on the side of the first bonding area away from the second bonding area;

[0023] The display panel further has a plurality of data signal lines distributed in the display area;

[0024] Wherein, one side of the multiplexer facing the display area has a plurality of first ports, and the side of the multiplexer away from the display area has a plurality of second ports; the plurality of first ports are correspondingly electrically connected to at least part of the data signal lines, and the plurality of second ports are correspondingly electrically connected to at least part of the first pins; the number of the second ports is less than the number of the first ports.

[0025] Optionally, the number of the driving chips is multiple, and the number of the flexible circuit boards is multiple; the multiple driving chips and the multiple flexible circuit boards are both arranged along the second direction, and the multiple flexible circuit boards are correspondingly electrically connected to the multiple driving chips.

[0026] Optionally, the display module further includes: a circuit board, and a plurality of second connection parts among the plurality of flexible circuit boards are electrically connected to the circuit board.

[0027] Optionally, the display panel includes: a first panel part and a second panel part which are oppositely arranged, and a panel bending part for connecting the first panel part and the second panel part; the first panel part has the display area, and the second panel part has the first bonding area and the second bonding area;

[0028] Wherein, the multiple driving chips and the multiple flexible circuit boards are both located on the side of the second panel part away from the first panel part, and the circuit board is located on the back of the first panel part.

[0029] On the other hand, a display device is further provided, including: a housing, and a display module connected to the housing, and the display module is any one of the above-mentioned display modules.

[0030] The beneficial effects brought by the technical solution provided by the embodiments of the present application are:

[0031] By setting the flexible circuit board as the connected first connection part and second connection part, and using the longer first connection part in the second direction to be bonded and connected with the display panel in the second bonding area, in this way, the first connection part can provide a greater pulling force to the display panel. Therefore, during the bending process in the non-display area, the flexible circuit board can provide effective traction to avoid problems such as warping, bonding breakage or line breakage of the display panel after bending. Description of the Drawings

[0032] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0033] Figure 1 It is a schematic structural diagram of a large-size display module;

[0034] Figure 2 is Figure 1 The schematic structural diagram of the display module shown after adopting multiplexing technology;

[0035] Figure 3 It is a schematic structural diagram of the display module provided by the embodiment of the present application;

[0036] Figure 4 It is a schematic structural diagram of the display panel provided by the embodiment of the present application;

[0037] Figure 5 It is a schematic structural diagram of another display module provided by the embodiment of the present application;

[0038] Figure 6 It is a schematic structural diagram of the flexible circuit board provided by the embodiment of the present application;

[0039] Figure 7 It is a schematic structural diagram of yet another display module provided by the embodiment of the present application;

[0040] Figure 8 It is a schematic structural diagram of the non-display area of the display panel provided by the embodiment of the present application;

[0041] Figure 9 It is a schematic structural diagram of the non-display area of another display module provided by the embodiment of the present application;

[0042] Figure 10 It is a schematic structural diagram of the display module after being bent provided by the embodiment of the present application. Detailed implementation manners

[0043] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0044] Please refer to Figure 1 and Figure 2 , Figure 1 It is a schematic structural diagram of a large-size display module, Figure 2 is Figure 1The structure diagram of the display module after multiplexing technology is shown. In the related art, the display panel 10 is connected to the circuit board 40 through the flexible circuit board 30, and the large-sized display module 00 generally has multiple driver chips 20 and multiple flexible circuit boards 30. By setting a multiplexer (not shown) on the display panel 10, for example, using a 1:2 multiplexing technology, Figure 1 The four driving chips 20 and the four flexible circuit boards 30 in the display panel 10 are reduced to Figure 2 Two driving chips 20 and two flexible circuit boards 30 are shown.

[0045] like Figure 2 As shown, after the multiplexing technology is adopted, the two driving chips 20 also need to be relatively centered and cannot be placed in the non-display area 12. Figure 2 In this way, the two flexible circuit boards 30 cannot effectively pull / tug the edges and middle areas of the non-display area 12. After the display panel 10 is bent, the areas that are not effectively pulled by the flexible circuit boards 30, such as Figure 2 The edge A in the middle will be warped. At this time, the stress caused by the warping will be concentrated on the edge B where the flexible circuit board 30 contacts the display panel 10, and the binding breakage problem will occur at this location. In addition, the warping of the non-display area 12 will cause the non-display area 12 to not bend in the preset direction, and the bending axis of the non-display area 12 is not perpendicular to the extension direction of the circuit inside the non-display area 12, and the circuit is also at risk of breaking.

[0046] The present application embodiment provides a display module, please refer to Figures 3 to 4 , Figure 3 A schematic diagram of the structure of a display module provided in an embodiment of the present application, Figure 4 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present application. The display module 000 may include: a display panel 100 , a driving chip 200 and a flexible circuit board 300 .

[0047] The display panel 100 has a display area 110 and a non-display area 120 surrounding the display area 110; the non-display area 120 may include: a first binding area 121 and a second binding area 122 arranged in a first direction X, and the first binding area 121 is closer to the display area 110 than the second binding area 122.

[0048] The driving chip 200 is bonded and connected to the display panel 100 in the first bonding area 121 .

[0049] The flexible circuit board 300 may include: a first connection portion 310 and a second connection portion 320 connected to each other, with the first connection portion 310 and the second connection portion 320 arranged in the first direction X; the first connection portion 310 is bonded and connected to the display panel 100 within the second bonding region 122, and the second connection portion 320 extends outside the display panel 100.

[0050] Wherein, the length of the first connection portion 310 in the second direction Y is greater than the length of the second connection portion 320 in the second direction Y; the second direction Y intersects the first direction X. For example, the second direction Y is perpendicular to the first direction X.

[0051] Such as Figure 3 As shown, the first connection portion 310 is longer than the second connection portion 320. Therefore, the first connection portion 310 can provide a larger bonding area compared to the second connection portion 320. During the bending process of the display panel 100, on the one hand, the first connection portion 310 enhances the adhesion between the flexible circuit board 300 and the display panel 100, and on the other hand, it increases the traction area of the flexible circuit board 300 on the display panel 100. In this way, the display panel 100 will not warp after bending, and it can overcome the warping problem in the related art and other problems brought by the warping problem.

[0052] In summary, in the embodiment of the present application, by setting the flexible circuit board 300 as the connected first connection portion 310 and second connection portion 320, and using the first connection portion 310 that is longer in the second direction Y to be bonded and connected to the display panel 100 within the second bonding region 122, in this way, the wider first connection portion 310 can provide a greater pulling force to the display panel 100. Therefore, during the bending process of the non-display area 120, the flexible circuit board 300 can provide effective traction to avoid problems such as warping, bonding breakage, or circuit breakage of the display panel 100 after bending.

[0053] In some possible implementation manners, please refer to Figures 5 to 6 , Figure 5 which is a schematic structural diagram of another display module provided by the embodiment of the present application, Figure 6 which is a schematic structural diagram of the flexible circuit board provided by the embodiment of the present application. The first connection portion 310 may include: a first sub-portion 311 and a second sub-portion 312, and the second sub-portion 312 is connected to at least one side of the first sub-portion 311 in the second direction Y.

[0054] Wherein, the length of the first sub-portion 311 in the second direction Y is equal to the length of the second connection portion 320 in the second direction Y.

[0055] Exemplarily, when the number of driving chips 200 is multiple, the number of flexible circuit boards 300 corresponds to multiple, such asFigure 5 As shown, the outer shapes of the three flexible circuit boards 300 may not be exactly the same. For example, the number of second sub-parts 312 of the first connection part 310 of the middle flexible circuit board 300 is two, and the number of second sub-parts 312 of the first connection parts 310 on the left and right sides is one. When the first connection part 310 includes two second sub-parts 312, the lengths of the two second sub-parts 312 in the first direction X may also be different.

[0056] In some possible implementation manners, such as Figure 6 As shown, for one flexible circuit board 300, the first connection part 310 may include two second sub-parts 312, and the two second sub-parts 312 are respectively connected to two opposite sides of the first sub-part 311 in the second direction Y.

[0057] Exemplarily, please refer to Figure 7 , Figure 7 which is a schematic structural diagram of another display module provided by an embodiment of the present application. Since multiplexing technology can achieve line multiplexing in ratios such as 1:2 and 1:4, in this way, the display module 000 may only include one driving chip 200 and one flexible circuit board 300. When there is only one flexible circuit board 300, by setting two second sub-parts 312, the two edge regions of the display panel 100 in the second direction Y are effectively pulled, avoiding the above-mentioned warping problem.

[0058] For example, the lengths of the two second sub-parts 312 in the second direction Y are the same. In this way, as Figure 3 shown in Figure 6 , the flexible circuit board 300 is symmetrically arranged in the second direction Y, and multiple flexible circuit boards 300 can provide effective pulling force to each region of the display panel 100 in the second direction Y, avoiding insufficient local pulling force. In addition, when the lengths of the two second sub-parts 312 in the second direction Y are the same, multiple flexible circuit boards 300 may have the same outer shape, that is to say, the multiple flexible circuit boards 300 in the display module 000 are the same kind of flexible circuit board. In this way, only one kind of flexible circuit board 300 needs to be processed, and there is only one kind of patterning process for the second bonding regions 122 in the non-display region 120, which can reduce the processing cost.

[0059] In some possible implementation manners, please refer to Figure 8 , Figure 8Schematic diagram of the structure of the non-display area of the display panel provided by the embodiment of the present application. In the display panel 100, the part distributed in the first bonding area 121 has a plurality of first pins 121a, and the part distributed in the second bonding area 122 has a plurality of second pins 122a; the driving chip 200 is bonded and connected to the plurality of first pins 121a; the first connecting portion 310 is bonded and connected to the plurality of second pins 122a at least through the first branch 311.

[0060] In the embodiment of the present application, the driving chip 200 is electrically connected to the flexible circuit board 300 through the connected first pins 121a and the second pins 122a corresponding to the first pins 121a. Among them, the second pins 122a and the first pins 121a are not necessarily electrically connected one-to-one. The number of the first pins 121a for transmitting input signals to the driving chip 200 in the first pins 121a can be less than the number of the second pins 122a. That is to say, the flexible circuit board 300 can be electrically connected to the driving chip 200 through the first branch 311, and the second branch 312 of the flexible circuit board 300 can be not provided with pins. In this way, the size or shape of the second branch 312 is not limited, that is, a larger bonding area can be set, which can provide effective traction for the display panel 100.

[0061] The display panel has a high brightness requirement. Therefore, the flexible circuit board needs to provide a larger power supply current / power signal (or called luminous current) to the display panel. For a display module using multiplexing technology, the number of flexible circuit boards is reduced, resulting in that the pins for transmitting the power supply current in the flexible circuit board need to bear a larger current, and there is a risk of burning out the pins due to large current. In the related art, without changing the size of the flexible circuit board in the second direction Y, by increasing the number of pins and reducing the pin pitch to provide more pins for transmitting the power supply current, for example, it is necessary to increase the number of pins by 10%-20%. In this way, since the pitch of the pins in the flexible circuit board is reduced, the number of pins in the bonding area of the display panel for bonding the pins in the flexible circuit board also needs to be increased, and the pin pitch also needs to be reduced, which increases the bonding difficulty between the flexible circuit board and the display panel, and the bonding yield will also be reduced.

[0062] In some possible implementation manners, please refer to Figure 6 , the first connecting portion 310 has a plurality of third pins 301, and a part of the third pins 301 among the plurality of third pins 301 are distributed in the first branch 311, and the other part of the third pins 301 are distributed in the second branch 312.

[0063] Exemplarily, such as Figure 6As shown in the figure, the third pins 301 distributed in the first sub - section 311 can be defined as the first - type third pins 301a, and the third pins 301 distributed in the second sub - section 312 can be defined as the second - type third pins 301b. In this way, the second - type third pins 301b can also be electrically connected to the second pins 122a in the second bonding area 122. That is to say, the second - type third pins 301b can be electrically connected not to the driving chip 200, but to other signal lines in the display panel 100, for example, to the power signal line 100b, so as to provide a power current / power signal. Based on this, the pitch of the first - type third pins 301a distributed in the first sub - section 311 does not need to be reduced, that is, the pitch of the second pins 122a electrically connected to the first - type third pins 301a in the second bonding area 122 does not need to be reduced. That is to say, it can meet the requirements of a high - brightness and high - current display panel, and does not increase the difficulty of the bonding process, ensuring the bonding yield.

[0064] In some possible implementation manners, as Figure 6 shown, the area of the orthographic projection of the third pins 301 distributed in the second sub - section 312 on the display panel 100 is larger than the area of the orthographic projection of the third pins 301 distributed in the first sub - section 311 on the display panel 100.

[0065] That is to say, the area of the second - type third pins 301b is larger than the area of the first - type third pins 301a. In this way, the second - type third pins 301b can carry a larger current. Since the length of the second sub - section 312 in the second direction Y can be unrestricted by the second connection part 320, the length of the second - type third pins 301b in the second sub - section 312 in at least the second direction Y is greater than the length of the first - type third pins 301a in the first sub - section 311. That is to say, it can make the area of the second - type third pins 301b larger than the area of the first - type third pins 301a.

[0066] Exemplarily, as Figure 6 shown, in the second direction Y, the length of the third pins 301 distributed in the second sub - section 312 is greater than the length of the third pins 301 distributed in the first sub - section 311; and / or, in the first direction X, the width of the third pins 301 distributed in the second sub - section 312 is greater than the width of the third pins 301 distributed in the first sub - section 311.

[0067] As Figure 6As shown, the widths of the first sub - part 311 and the second sub - part 312 of the first connection part 310 in the first direction X can be the same. At this time, the above - mentioned area condition can be satisfied at least by setting the length of the second - type third pin 301b in the second direction Y to be greater than the length of the first - type third pin 301a in the first sub - part 311. Without affecting the bonding quality, the width of the second - type third pin 301b in the first direction X can also be increased; or, when the width of the second sub - part 312 in the first direction X is greater than the width of the first sub - part 311, set the width of the second - type third pin 301b in the first direction X to be greater than the width of the first - type third pin 301a.

[0068] In some possible implementation manners, as Figure 8 shown, the multiple second pins 122a can include: multiple first - type second pins 1221 and multiple second - type second pins 1222; the multiple first - type second pins 1221 are bonded to the third pins 301 distributed in the first sub - part 311, and the multiple second - type second pins 1222 are bonded to the third pins 301 distributed in the second sub - part 312.

[0069] Among them, the multiple first - type second pins 1221 are electrically connected to at least part of the first pins 121a.

[0070] That is to say, part of the second pins 122a is electrically connected to the driving chip 200 through the first pins 121a, so as to realize the electrical connection between the flexible circuit board 300 and the driving chip 200.

[0071] Exemplarily, corresponding to the case where the multiple third pins 301 can include multiple first - type third pins 301a and second - type third pins 301b, the multiple second pins 122a can include: multiple first - type second pins 1221 and multiple second - type second pins 1222, where the first - type second pins 1221 can be bonded to the first - type third pins 301a one - to - one, and the second - type second pins 1222 can be bonded to the second - type third pins 301b one - to - one. In this way, the second - type third pins 301b are electrically connected to the signal lines of the display panel 100 through the second - type second pins 1222.

[0072] In some possible implementation manners, as Figure 8 shown, the display panel 100 can further include: a power signal line 100b, and the power signal line 100b is electrically connected to at least part of the second - type second pins 1222.

[0073] Exemplarily, the area of the orthographic projection of the second type of second pin 1222 on the display panel 100 may be equal to the area of the orthographic projection of the second type of third pin 301b on the display panel 100; and the area of the orthographic projection of the first type of second pin 1221 on the display panel 100 may be equal to the area of the orthographic projection of the first type of third pin 301a on the display panel 100. In this way, the second type of second pin 1222 electrically connected to the power signal line 100b can carry a larger current. Among them, the power signal line 100b may be one or more. For example, Figure 8 the single power signal line 100b shown is only an example and does not limit the specific number of the power signal lines 100b.

[0074] It should be noted that the second type of second pin 1222 can also be used for electrical connection with other signal lines, and it is not limited that the second type of second pin 1222 can only be used for transmitting power current.

[0075] In some possible implementation manners, please refer to Figure 9 , Figure 9 which is a schematic structural diagram of a non-display area of another display module provided by an embodiment of the present application; the display module 000 may further include: a multiplexer 500. The multiplexer 500 is located in the non-display area 120, and in the first direction X, the multiplexer 500 is located on a side of the first bonding area 121 away from the second bonding area 122.

[0076] The display panel 100 also has a plurality of data signal lines 100a distributed in the display area 110.

[0077] Among them, one side of the multiplexer 500 facing the display area 110 has a plurality of first ports 501, and one side of the multiplexer 500 away from the display area 110 has a plurality of second ports 502; the plurality of first ports 501 are correspondingly electrically connected to at least part of the data signal lines 100a, and the plurality of second ports 502 are correspondingly electrically connected to at least part of the first pins 121a; the number of the second ports 502 is less than the number of the first ports 501.

[0078] For a large-sized display module 000, the number of driving chips 200 can be reduced through the multiplexer 500, thereby saving costs. Among them, as Figure 9 shown, one multiplexer 500 can be electrically connected to one driving chip 200. Of course, one multiplexer 500 can also be electrically connected to a plurality of driving chips 200, which can be specifically set according to actual requirements. The driving chip 200 can be electrically connected to the data signal line 100a through the corresponding multiplexer 500, so as to transmit data signals to the light-emitting units in the display area 110.

[0079] In some possible implementation manners, such asFigure 3 As shown in Figure 5 , the number of driving chips 200 can be multiple, and the number of flexible circuit boards 300 can be multiple; the multiple driving chips 200 and the multiple flexible circuit boards 300 are both arranged along the second direction Y, and the multiple flexible circuit boards 300 are electrically connected to the multiple driving chips 200 correspondingly.

[0080] Exemplarily, as shown in Figure 3 , the number of driving chips 200 can be two, and the number of flexible circuit boards 300 is correspondingly two. The two flexible circuit boards 300 are the same kind of flexible circuit board, and the first connecting portion 310 of the flexible circuit board 300 has two symmetrically arranged second connecting portions 320. In this way, effective traction can be provided for the edge area and the middle area of the non-display area 120 of the display panel 100, thereby avoiding the warping problem after the display panel 100 is bent. As shown in Figure 5 , the number of flexible circuit boards 300 can be three or more. At this time, the two flexible circuit boards 300 at both ends in the second direction Y can be mirror-symmetrical, and these two flexible circuit boards 300 have second connecting portions 320 at least on one side facing the edge of the display panel 100 in the second direction Y, so as to ensure effective traction for the edge area of the display panel 100 and avoid the warping problem of the edge area.

[0081] In some possible implementation manners, please refer to Figure 3 , Figure 5 and Figure 7 , the display module 000 may further include: a circuit board 400, and the multiple second connecting portions 320 in the multiple flexible circuit boards 300 are electrically connected to the circuit board 400.

[0082] For example, the circuit board 400 can be the main board of the display device, or can be not the main board. In the case where the circuit board 400 is not the main board, the circuit board 400 is electrically connected to the main board of the display device. In this way, the main board of the display device can control the display of the display panel 100 through the circuit board 400.

[0083] In some possible implementation manners, please refer to Figure 10 , Figure 10 is a schematic structural diagram of the display module provided by the embodiment of the present application after being bent. The display panel 100 may include: a first panel portion 101 and a second panel portion 102 which are oppositely arranged, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102; the first panel portion 101 has a display area 110, and the second panel portion 102 has a first bonding area 121 and a second bonding area 122.

[0084] Among them, a plurality of driving chips 200 and a plurality of flexible circuit boards 300 are both located on the side of the second panel portion 102 away from the first panel portion 101, and the circuit board 400 is located on the back surface of the first panel portion 101.

[0085] Exemplarily, as Figure 10 shown, a plurality of functional layers 600 may be provided between the first panel portion 101 and the second panel portion 102. The plurality of functional layers 600 may include a support layer 601, a buffer layer 602, a spacer 604, and may further include an adhesive layer 603 located between the circuit board 400 and the buffer layer 602.

[0086] In summary, the display module provided by the embodiment of the present application may include a display panel, a driving chip, and a flexible circuit board. By setting the flexible circuit board as a first connecting portion and a second connecting portion that are connected to each other, and using the first connecting portion that is longer in the second direction to be bound and connected to the display panel in the second binding area, in this way, the first connecting portion can provide a greater pulling force to the display panel. Therefore, during the bending process in the non-display area, the flexible circuit board can provide effective traction to avoid problems such as warping, binding fracture, or line fracture of the display panel after bending.

[0087] The embodiment of the present application further provides a display device, which may include: a frame body, and a display module connected to the frame body, and the display module is the display module 000 described in any of the above embodiments. The display device may correspondingly have the technical effects of the above display module 000, which will not be described repeatedly here.

[0088] The display device provided by the embodiment of the present application may be a large-size display device such as a notebook computer, a tablet computer, and a monitor, or may also be other types of display devices.

[0089] It should be noted that in the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. Moreover, it can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be an intermediate layer. Additionally, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intermediate layer or element. Additionally, it can also be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Like reference numerals throughout the specification indicate like elements.

[0090] In the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. The term "plurality" means two or more, unless otherwise clearly defined.

[0091] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A display module, characterized in that, Comprising: A display panel, a driving chip, and a flexible circuit board; The display panel has a display area and a non-display area surrounding the display area; The non-display area includes a first bonding area and a second bonding area arranged in a first direction, and the first bonding area is closer to the display area than the second bonding area; The driving chip is bonded and connected to the display panel in the first bonding area; The flexible circuit board includes a first connection portion and a second connection portion connected to each other, and the first connection portion and the second connection portion are arranged in the first direction; the first connection portion is bonded and connected to the display panel in the second bonding area, and the second connection portion extends out of the display panel; Wherein, the length of the first connection portion in a second direction is greater than the length of the second connection portion in the second direction; the second direction intersects with the first direction.

2. The display module according to claim 1, wherein The first connection portion includes a first sub-portion and a second sub-portion, and the second sub-portion is connected to at least one side of the first sub-portion in the second direction; Wherein, the length of the first sub-portion in the second direction is equal to the length of the second connection portion in the second direction.

3. The display module according to claim 2, wherein The first connection portion includes two of the second sub-portions, and the two second sub-portions are respectively connected to opposite sides of the first sub-portion in the second direction.

4. The display module according to claim 3, wherein The two second sub-portions have the same length in the second direction.

5. The display module according to any one of claims 2-4, characterized in that, The portion of the display panel distributed in the first bonding area has a plurality of first pins, and the portion of the display panel distributed in the second bonding area has a plurality of second pins; the driving chip is bonded and connected to the plurality of first pins; the first connection portion is bonded and connected to the plurality of second pins at least through the first sub-portion.

6. The display module according to claim 5, wherein The first connection portion has a plurality of third pins, and a part of the third pins among the plurality of third pins are distributed in the first sub-portion, and the other part of the third pins are distributed in the second sub-portion.

7. The display module according to claim 6, wherein The area of the orthographic projection of the third pins distributed in the second sub-portion on the display panel is greater than the area of the orthographic projection of the third pins distributed in the first sub-portion on the display panel.

8. The display module according to claim 7, wherein In the second direction, the length of the third pins distributed in the second sub-portion is greater than the length of the third pins distributed in the first sub-portion; And / or, in the first direction, the width of the third pins distributed in the second sub-portion is greater than the width of the third pins distributed in the first sub-portion.

9. The display module according to claim 7, wherein The plurality of second pins include a plurality of first-type second pins and a plurality of second-type second pins; the plurality of first-type second pins are bonded to the third pins distributed in the first sub-portion, and the plurality of second-type second pins are bonded to the third pins distributed in the second sub-portion; Wherein, the plurality of first-type second pins are electrically connected to at least part of the first pins.

10. The display module according to claim 9, wherein The display panel further includes: a power signal line, and the power signal line is electrically connected to at least part of the second-type second pins.

11. The display module according to any one of claims 6-10, characterized in that, The display module further includes: a multiplexer, which is located in the non-display area, and in the first direction, the multiplexer is located on a side of the first bonding area away from the second bonding area; The display panel further has a plurality of data signal lines distributed in the display area; Wherein, one side of the multiplexer facing the display area has a plurality of first ports, and the side of the multiplexer away from the display area has a plurality of second ports; the plurality of first ports are correspondingly electrically connected to at least part of the data signal lines, and the plurality of second ports are correspondingly electrically connected to at least part of the first pins; the number of the second ports is less than the number of the first ports.

12. The display module according to any one of claims 1-4, 6-10, characterized in that, The number of the driving chips is multiple, and the number of the flexible circuit boards is multiple; the multiple driving chips and the multiple flexible circuit boards are both arranged along the second direction, and the multiple flexible circuit boards are correspondingly electrically connected to the multiple driving chips.

13. The display module according to claim 12, characterized in that, The display module further includes: a circuit board, and a plurality of second connection parts among the plurality of flexible circuit boards are all electrically connected to the circuit board.

14. The display module according to claim 13, wherein The display panel includes: a first panel portion and a second panel portion which are oppositely arranged, and a panel bending portion for connecting the first panel portion and the second panel portion; the first panel portion has the display area, and the second panel portion has the first bonding area and the second bonding area; Wherein, the multiple driving chips and the multiple flexible circuit boards are both located on a side of the second panel portion away from the first panel portion, and the circuit board is located on the back surface of the first panel portion.

15. A display device, characterized in that, Including: a housing, and a display module connected to the housing, and the display module is the display module according to any one of claims 1-14.

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