Anti-corrosion conductive coating, battery connecting piece and preparation method

Abstract

The invention discloses an anti-corrosion conductive coating, a battery connecting piece and a preparation method, the coating comprises a film coating layer, the film coating layer comprises a bottom layer, a functional layer and a surface layer which are sequentially arranged along the surface far away from a base material, the bottom layer, the functional layer and the surface layer respectively comprise conductors, and the bottom layer and the functional layer respectively comprise insulators; the conductors of the base layer and the conductors of the functional layer are distributed in the insulators of the base layer and the insulators of the functional layer respectively to form planar conductive networks, and the planar conductive network of the base layer and the planar conductive network of the functional layer are connected at the layer interface to form a three-dimensional conductive network. The three-dimensional conductive network is in contact with the substrate and the conductor in the surface layer at a layer interface. The anti-corrosion conductive coating is arranged on the battery connecting piece, so that an obvious anti-corrosion effect can be achieved, good conductive performance of the battery connecting piece can be effectively ensured, a clean and pollution-free production process can be realized, the cost is saved, and the efficiency is high.

Description

Technical Field

[0001] The present invention relates to the technical field of material surface treatment, and particularly to an anti-corrosion conductive coating for a material surface, a battery connector having an anti-corrosion conductive coating on its surface, and a preparation method of the anti-corrosion conductive coating. Background Art

[0002] With the development of the new energy vehicle industry, the demand for on-vehicle lithium batteries, fuel cells, etc. is becoming increasingly strong. As a conductive connection component used in battery cells, the battery connector plays a very important role.

[0003] The battery connector is generally made of metal aluminum. Aluminum is rich in reserves in the earth's crust and has the advantages of good ductility, low density, high conductivity, etc. However, due to the active chemical properties of aluminum, it is difficult to resist the corrosion of the normal environment only by the oxide film generated on its own surface, especially in the case of severe electrochemical corrosion. Therefore, it is necessary to coat the aluminum material surface of the battery connector to improve its anti-corrosion performance while maintaining its original advantages and ensuring its conductivity.

[0004] The main methods for coating and anti-corrosion treatment of the aluminum material surface include anodic oxidation, chemical oxidation, micro-arc oxidation, chemical conversion film, thermal spraying, electroless plating, electroplating, etc., but each has certain disadvantages. In particular, the focus of the existing treatment methods is usually on improving the anti-corrosion performance of the material surface, but it is impossible to make the coating have good conductivity at the same time, so it is difficult to be applied to scenarios such as the above-mentioned battery connectors that require ensuring conductivity. Summary of the Invention

[0005] The purpose of the present invention is to overcome the above-mentioned defects existing in the prior art, and provide an anti-corrosion conductive coating, a battery connector and a preparation method.

[0006] To achieve the above purpose, the technical solution of the present invention is as follows:

[0007] The present invention provides an anti-corrosion conductive coating, comprising:

[0008] A coating layer provided on the surface of a substrate;

[0009] The coating layer includes a primer layer, a functional layer and a surface layer sequentially arranged away from the substrate surface. Conductors are respectively included in the primer layer, the functional layer and the surface layer, and insulators are also respectively included in the primer layer and the functional layer. The conductors of the primer layer and the conductors of the functional layer are respectively distributed in the insulators of the primer layer and the insulators of the functional layer to form a planar conductive network respectively. And the planar conductive network of the primer layer is connected to the planar conductive network of the functional layer at the layer interface to form a three-dimensional conductive network, and the three-dimensional conductive network is connected to the conductors in the substrate and the surface layer at the layer interface.

[0010] Further, the conductor of the underlayer forms an adhesion sublayer without an insulator at the layer interface with the substrate, and the three-dimensional conductive network is connected to the substrate at the layer interface through the adhesion sublayer.

[0011] Further, the conductor of the underlayer and the conductor of the functional layer contain at least one of a simple substance of a metal element and an alloy of a metal element, and at least one of a nitride, a silicide, and a carbide of the metal element; the insulator of the underlayer and the insulator of the functional layer contain a simple substance of a non-metal element, and at least one of a nitride, an oxide, a carbide of the non-metal element, and an oxide of the metal element.

[0012] Further, the metal element includes at least one of Al, Cu, Ni, Cr, Zr, and Nb; the non-metal element includes Si.

[0013] Further, at least one of the metal element and the non-metal element in each of the underlayer and the functional layer has a gradually changing content in the direction away from the surface of the substrate, and has a consistent content at the layer interface between the underlayer and the functional layer.

[0014] Further, the functional layer includes multiple functional sublayers, and at least one of the metal element and the non-metal element contained in each functional sublayer has a gradually changing content in the direction away from the surface of the substrate, and has a consistent content at the layer interface between the functional sublayers.

[0015] Further, the surface layer is a conductive layer formed by a composition conductor containing a simple substance of a metal element or a composition conductor containing an alloy of a metal element.

[0016] Further, the metal element includes Ni or Sn.

[0017] The present invention also provides a battery connection member, including a metal body, and the above-mentioned anti-corrosion conductive coating provided on at least one surface of the body as the substrate.

[0018] Further, the body is provided with a first connection portion and a second connection portion connected at a certain angle. The first connection portion is used to be connected to the internal components of the battery cell, the second connection portion is used to be connected to the external conductor of the battery cell, a through hole for passing through the battery cell electrode is provided on the surface of the second connection portion, and the anti-corrosion conductive coating is PVD coated on the surface of the second connection portion.

[0019] The present invention also provides a method for preparing an anti-corrosion conductive coating, including:

[0020] Providing a substrate;

[0021] Multiple PVD coatings are adopted to sequentially form a coating layer including a base layer, a functional layer, and a surface layer on the surface of the substrate;

[0022] Among them, by controlling the power of different element targets during coating and the flow rate of the process gas introduced, the content of each film layer element in the base layer, the functional layer, and the surface layer is controlled to form conductors in the base layer, the functional layer, and the surface layer respectively, and insulators in the base layer and the functional layer respectively, and the conductors in the base layer and the conductors in the functional layer are respectively distributed in the insulators in the base layer and the insulators in the functional layer to form a planar conductive network respectively, and the planar conductive network in the base layer is connected to the planar conductive network in the functional layer at the layer interface to form a three-dimensional conductive network, and the three-dimensional conductive network is connected to the conductors in the substrate and the surface layer at the layer interface.

[0023] Further, when forming the base layer, first, by turning on the power of the metal element target, turning off the power of the non-metal element target, and stopping the process gas, an adhesion sub-layer formed by a conductor without an insulator is formed on the surface of the substrate. Then, by turning on the power of the metal element target and the non-metal element target and opening the process gas, a planar conductive network distributed in the insulator of the base layer and connected to the adhesion sub-layer is further formed on the adhesion sub-layer; when forming the functional layer, by turning on the power of the metal element target and the non-metal element target and opening the process gas, a planar conductive network distributed in the insulator of the functional layer is continuously formed on the base layer, and by controlling the power of different targets and the flow rate of the process gas introduced, the planar conductive network in the functional layer is connected to the planar conductive network in the base layer at the layer interface to form a three-dimensional conductive network; when forming the surface layer, by turning on the power of the metal element target, turning off the power of the non-metal element target, and stopping the process gas, a conductive layer composed of conductors is formed, and the conductive layer is connected to the three-dimensional conductive network.

[0024] Further, by turning on the power of the metal element target and the non-metal element target and opening the process gas, the conductors in the base layer and the functional layer contain at least one of the simple substance of the metal element, the alloy of the metal element, and at least one of the nitride, silicide, and carbide of the metal element, and the insulators in the base layer and the functional layer contain the simple substance of the non-metal element and at least one of the nitride, oxide, carbide of the non-metal element, and the oxide of the metal element.

[0025] Further, the metal element includes at least one of Al, Cu, Ni, Cr, Zr, and Nb; the non-metal element includes Si, and the process gas includes at least one of nitrogen and oxygen.

[0026] Further, when forming the three-dimensional conductive network, by changing the power of the metal element target and the non-metal element target, and the process gas flow rate, at least one of the metal element and the non-metal element contained in each of the underlayer and the functional layer has a gradually changing content in the direction away from the surface of the substrate, and has a content that tends to be consistent at the layer interface between the underlayer and the functional layer, so that the conductor skeleton of the formed three-dimensional conductive network correspondingly has a gradually changing radial dimension.

[0027] Further, when forming the functional layer, multiple PVD coatings are used to make the formed functional layer include multiple functional sub-layers, and by changing the power of the metal element target and the non-metal element target, and the process gas flow rate, at least one of the metal element and the non-metal element contained in each functional sub-layer has a gradually changing content in the direction away from the surface of the substrate, and has a content that tends to be consistent at the layer interface of each functional sub-layer, so that the conductor skeleton of the three-dimensional conductive network correspondingly has a gradually changing radial dimension in each functional sub-layer.

[0028] As can be seen from the above technical solutions, in the present invention, a coating layer having a primer layer, a functional layer, and a surface layer is formed in sequence on the surface of a substrate, and a three-dimensional conductive network formed by conductors distributed in an insulator is formed in the primer layer and the functional layer, so that the three-dimensional conductive network is connected to the conductors in the substrate and the surface layer at the layer interface, thereby forming an anti-corrosion conductive coating on the surface of the substrate that is both corrosion-resistant and has good conductivity. Moreover, through the PVD coating technology, by adjusting the power of different element targets and the flow rate of the process gas introduced during coating, an adhesion sub-layer formed by conductors without an insulator is formed at the layer interface between the primer layer and the substrate to improve the adhesion to the substrate, while improving the conductivity of the film layer, and a conductive layer formed by a composition of conductors is formed on the surface layer to further reduce the contact resistance and further increase the corrosion-resistant time without affecting the conductivity, and the conductor skeleton of the three-dimensional conductive network has a gradually changing radial dimension to improve the film layer strength. At the same time, the hardness and adhesion of the film layer can also be adjusted by gradually controlling the flow rate of the process gas introduced, so that the film layer is not easily damaged. The anti-corrosion conductive coating of the present invention is prepared by the PVD coating technology, which can realize a clean and pollution-free production process, and by controlling the power of different element targets, conductive film layers with different proportions of conductors can be obtained, which can not only improve the process stability, but also save costs, improve production efficiency, and make the ionization rate of the film layer higher and the film layer more stable, thereby improving the production capacity. By providing the anti-corrosion conductive coating of the present invention on the battery connector, not only can an obvious anti-corrosion effect be achieved, but also the good electrical conductivity of the battery connector can be effectively ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. is a schematic structural diagram of an anti-corrosion conductive coating according to a preferred embodiment of the present invention;

[0030] Figure 2 FIG. is a schematic structural diagram of a battery connector according to a preferred embodiment of the present invention;

[0031] Figure 3 is Figure 2 a schematic plan view of the first connection portion in;

[0032] Figure 4 is Figure 2 a schematic plan view of the second connection portion in. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely below. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings as understood by those of ordinary skill in the art to which the present invention pertains. The words such as "including" used herein mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items.

[0034] The following further describes in detail the specific implementation manners of the present invention with reference to the accompanying drawings.

[0035] Reference Figure 1 , Figure 1 is a schematic structural diagram of an anti-corrosion conductive coating according to a preferred embodiment of the present invention. As Figure 1 shown, an anti-corrosion conductive coating of the present invention is provided on a substrate 10 and includes: a coating layer provided on the surface of the substrate 10 and having a plurality of laminated film layer structures.

[0036] Among them, the coating layer includes a primer layer 11, a functional layer 13, and a surface layer 12 sequentially stacked in a direction away from the surface of the substrate 10. The primer layer 11, the functional layer 13, and the surface layer 12 respectively contain conductors, and the primer layer 11 and the functional layer 13 also respectively contain insulators. The conductors in the primer layer 11 are distributed in the insulator of the primer layer 11 to form a planar conductive network, and the conductors in the functional layer 13 are distributed in the insulator of the functional layer 13 to also form a planar conductive network. Moreover, the planar conductive network of the primer layer 11 is connected to the planar conductive network of the functional layer 13 at the layer interface between the primer layer 11 and the functional layer 13 to form a three-dimensional conductive network. The conductors form the framework of the three-dimensional conductive network, and the insulators are filled in the gaps of the conductor framework to form a dense film layer. The first end of the three-dimensional conductive network close to the substrate 10 is connected to the surface of the substrate 10 at the layer interface between the primer layer 11 and the substrate 10, and the second end of the three-dimensional conductive network away from the substrate 10 is connected to the conductors in the surface layer 12 at the layer interface between the functional layer 13 and the surface layer 12. Thus, the primer layer 11, the functional layer 13, and the surface layer 12 become conductive layers.

[0037] In some embodiments, the conductor in the underlayer 11 forms an adhesion sublayer without an insulator at the layer interface between the underlayer 11 and the substrate 10 (i.e., the insulator in the underlayer 11 is not distributed at the layer interface between the underlayer 11 and the substrate 10), and the first end of the three-dimensional conductive network is connected to the substrate 10 at the layer interface through the adhesion sublayer. In this way, the bonding strength between the underlayer 11 and the substrate 10 can be improved, and at the same time, the conductivity of the film layer is enhanced.

[0038] In some embodiments, the conductor in the underlayer 11 and the conductor in the functional layer 13 contain at least one of a simple substance of a metal element, an alloy of a metal element, and at least one of a nitride, a silicide, and a carbide of a metal element. The insulator in the underlayer 11 and the insulator in the functional layer 13 contain a simple substance of a non-metal element and at least one of a nitride, an oxide, a carbide, and an oxide of a metal element of the non-metal element. Among them, the metal element includes at least one of Al, Cu, Ni, Cr, Zr, and Nb; the non-metal element includes Si. By using non-metals such as Si and the formed nitrides, oxides, and carbides, the corrosion resistance, hardness, and wear resistance of the film layer can be improved. For example, the film layer materials of the underlayer 11 and the functional layer 13 are preferably NiSiAl, NiSiAlN, or NiCrSiN.

[0039] In some embodiments, the underlayer 11 and the functional layer 13 contain at least one same metal element and at least one same non-metal element to improve the bonding strength between different film layers.

[0040] In some embodiments, at least one of the metal elements and non-metal elements in the underlayer 11 and the functional layer 13 has a gradually changing content in the direction away from the surface of the substrate 10, and has a consistent content at the layer interface between the underlayer 11 and the functional layer 13, so that the conductor skeleton of the three-dimensional conductive network correspondingly has a gradually changing radial dimension. By forming a gentle change in the element content at the layer interface, a decrease in conductivity caused by a sudden change in content can be avoided.

[0041] Furthermore, the functional layer 13 includes multiple functional sub-layers, and at least one of the metal elements and non-metal elements contained in each functional sub-layer has a gradually changing content in the direction away from the surface of the substrate 10, and has a consistent content at the layer interface of each functional sub-layer. For example, Figure 1 Exemplarily, it is shown that the functional layer 13 includes two functional sub-layers, which are the first functional sub-layer 15 and the second functional sub-layer 14 arranged in the direction away from the substrate 10.

[0042] In some embodiments, the surface layer 12 is a conductive layer formed by a conductor made of a composition containing elemental metal elements or a conductor made of an alloy composition containing metal elements, which can further reduce its contact resistance. Among them, the metal elements in the surface layer 12 include Ni or Sn. For example, the surface layer 12 can be a conductive layer formed by a conductor made of a composition containing Ni or Sn. The surface layer 12 can also be a conductive layer formed by a conductor made of a composition containing NiCr alloy.

[0043] In some embodiments, the substrate 10 is made of metal. For example, the substrate 10 can be made of copper, aluminum or steel.

[0044] In some embodiments, the substrate 10 can have a flat surface, a curved surface or a turning surface, etc., which are used to form the above-mentioned anti-corrosion conductive coating. Further, the surface of the substrate 10 for coating the anti-corrosion conductive coating can have blind holes or through holes, and the anti-corrosion conductive coating can be coated on the hole walls of the blind holes or through holes.

[0045] Reference Figure 2 , Figure 2 is a schematic structural diagram of a battery connector according to a preferred embodiment of the present invention. As Figure 2 shown, a battery connector of the present invention includes a metal body 20, for example, a body 20 made of copper or aluminum, and the anti-corrosion conductive coating of the present invention provided on at least one surface of the body 20 serving as the substrate 10.

[0046] In some embodiments, the body 20 is provided with a first connecting portion 22 and a second connecting portion 21 connected at a certain angle. For example, the first connecting portion 22 and the second connecting portion 21 can be connected at a right angle, as Figure 2 shown. Figure 3 shows the planar structure of the first connecting portion 22, Figure 4 shows the planar structure of the second connecting portion 21.

[0047] Among them, the first connecting portion 22 and the second connecting portion 21 can be rectangular sheets, and the length of the first connecting portion 22 is greater than the length of the second connecting portion 21. The first connecting portion 22 is used to connect with the internal components of the battery cell, and the second connecting portion 21 is used to connect with the external conductor of the battery cell. A through hole 23 for passing through the battery cell electrode is provided on the surface of the second connecting portion 21, and the anti-corrosion conductive coating is at least PVD coated on the surface of the second connecting portion 21, including coating on the side wall of the through hole 23 and the inner wall of the annular groove 24 around the through hole 23. By providing an anti-corrosion conductive coating on the battery connector, not only can an obvious anti-corrosion effect be achieved, but also the good electrical conductivity of the battery connector can be effectively guaranteed.

[0048] The following further details a method for preparing an anti-corrosion conductive coating of the present invention through specific embodiments and in combination with the drawings.

[0049] For example, when coating the surface of a battery connector as shown in Figure 2 with a coating layer as shown in Figure 1 the preparation method of an anti-corrosion conductive coating according to the present invention is as follows:

[0050] First, hang the battery connector (product to be coated), which is used as the coating substrate 10, on the fixture of the coating turntable, and install the turntable loaded with the battery connector in the process chamber of the PVD coating equipment. The available methods of the PVD coating equipment include but are not limited to magnetron sputtering, multi-arc ion plating, evaporation, filtered cathodic vacuum arc, PECVD and other methods.

[0051] The coating process is as follows: incoming material inspection - cleaning - hanging - PVD - unhanging - inspection and shipment.

[0052] In the process chamber, first perform ion cleaning on the battery connector with a gas containing argon, oxygen, hydrogen, etc.

[0053] Then, control the temperature in the process chamber within the range of 50 - 300 °C, and control the target power within 3 - 50 kw (preferably 10 - 25 kw). Adopt multiple PVD coatings to sequentially form a coating layer including a primer layer 11, a functional layer 13 (a first-layer functional sub-layer 15 and a second-layer functional sub-layer 14), and a surface layer 12 on the surface of the battery connector that needs to be coated (for example, the surface of the second connection portion 21).

[0054] Among them, by controlling the power of different element targets during coating and the flow rate of the process gas introduced, control the content of each film layer element in the primer layer 11, the functional layer 13, and the surface layer 12, so as to form conductors in the primer layer 11, the functional layer 13, and insulators in the primer layer 11 and the functional layer 13 respectively, and make the conductors of the primer layer 11 and the functional layer 13 be distributed in the insulators of the primer layer 11 and the functional layer 13 respectively to form planar conductive networks, and make the planar conductive network of the primer layer 11 and the planar conductive network of the functional layer 13 be connected at the layer interface to form a three-dimensional conductive network, and make the three-dimensional conductive network be connected to the battery connector at the layer interface, and make the three-dimensional conductive network be connected to the conductors in the surface layer 12 at the layer interface.

[0055] In some embodiments, when forming the underlayer 11, first, by turning on the power of the metal element target, turning off the power of the non-metal element target, and stopping the process gas, an adhesion sub-layer formed of a conductor without an insulator is formed on the surface of the battery connection member. Then, by turning on the power of the metal element target and the non-metal element target and introducing the process gas, a planar conductive network distributed in the insulator of the underlayer 11 and connected to the adhesion sub-layer is further formed on the adhesion sub-layer. When forming the functional layer 13, by turning on the power of the metal element target and the non-metal element target and introducing the process gas, a planar conductive network distributed in the insulator of the functional layer 13 is continuously formed on the underlayer 11. By controlling the power of different targets and the flow rate of the introduced process gas, the planar conductive network of the functional layer 13 is connected to the planar conductive network of the underlayer 11 at the layer interface to form a three-dimensional conductive network. When forming the surface layer 12, by turning on the power of the metal element target, turning off the power of the non-metal element target, and stopping the process gas, a conductive layer composed of a conductor is formed, and the conductive layer is connected to the three-dimensional conductive network.

[0056] In some embodiments, by turning on the power of the metal element target and the non-metal element target and introducing the process gas, the conductors of the underlayer 11 and the functional layer 13 contain at least one of a simple substance of a metal element, an alloy of a metal element, and at least one of a nitride, a silicide, and a carbide of a metal element, and the insulators of the underlayer 11 and the functional layer 13 contain a simple substance of a non-metal element and at least one of a nitride, an oxide, a carbide, and an oxide of a metal element of the non-metal element.

[0057] In some embodiments, the metal elements contained in the conductors of the underlayer 11 and the functional layer 13 include at least one of Al, Cu, Ni, Cr, Zr, and Nb; the non-metal element includes Si, and the process gas includes at least one of nitrogen and oxygen.

[0058] In some embodiments, when forming the three-dimensional conductive network, by changing the power of the metal element target and the non-metal element target and the flow rate of the process gas, at least one of the metal elements and non-metal elements contained in the underlayer 11 and the functional layer 13 has a gradually changing content in the direction away from the surface of the battery connection member, and has a consistent content at the layer interface of the underlayer 11 and the functional layer 13, so that the conductor skeleton of the formed three-dimensional conductive network correspondingly has a gradually changing radial dimension.

[0059] In some embodiments, when forming the functional layer 13, PVD coating is performed twice, so that the formed functional layer 13 includes a first-layer functional sub-layer 15 and a second-layer functional sub-layer 14. By changing the power of the metal element target and the non-metal element target, as well as the process gas flow rate, at least one of the metal elements and non-metal elements contained in each functional sub-layer has a gradually changing content in the direction away from the surface of the battery connector, and has a consistent content at the layer interface between the first-layer functional sub-layer 15 and the second-layer functional sub-layer 14, so that the conductor skeleton of the three-dimensional conductive network correspondingly has a gradually changing radial dimension in the first-layer functional sub-layer 15 and the second-layer functional sub-layer 14.

[0060] In some embodiments, during the PVD process, the temperature of the process chamber is controlled within the range of 50 to 300 °C, the target power is 3 to 50 kw (preferably 10 to 25 kw), and the underlayer 11, the first-layer functional sub-layer 15, the second-layer functional sub-layer 14, and the surface layer 12 are respectively deposited on the surface of the battery connector. Among them, the underlayer 11, the first-layer functional sub-layer 15, and the second-layer functional sub-layer 14 may contain elemental materials such as Ni, Cr, Al, Cu, Zr, Nb, Si, or a mixture (alloy) thereof, or nitrides of these elemental materials / material mixtures, preferably NiSiAl, NiSiAlN, NiCrSiN; the main component of the surface layer 12 is a composition of Ni or Sn, which serves as a conductive layer to further reduce the overall resistance.

[0061] In some embodiments, the thickness of the underlayer 11 is 100 to 400 nm, preferably 100 to 300 nm; the thickness of the first-layer functional sub-layer 15 is 300 to 3000 nm, preferably 500 to 1000 nm; the thickness of the second-layer functional sub-layer 14 is 100 to 500 nm, preferably 100 to 300 nm. The ratio of each element (elemental materials such as Ni, Cr, Al, Cu, Zr, Nb, Si, etc.) in each of the above layers will gradually change. If the element is a material mixture, the proportion of each element in the overall composition is between 5% and 95% (mass fraction, the same below). If it is in a nitrided form, the gas flow rate of nitrogen introduced is 20 to 500 sccm, preferably 50 to 200 sccm, and the proportion is between 5% and 60%, preferably 20% to 40%. Designing such a gradually changing pattern can increase the adhesion of the film layer and make the film layer not easily fail. The surface layer 12, as the outermost layer, has a thickness of 50 to 1000 nm, preferably 100 to 500 nm. The main component of the surface layer 12 is a conductive layer of a thin composition containing Ni or Sn, which can further reduce its contact resistance. The proportion of Ni or Sn in the surface layer 12 is 50% to 95%, preferably 70% to 90%.

[0062] The surface layer 12 can also be formed by other conductive metals and their metal alloys mentioned above. It can also be an alloy of non-metals such as Si. Generally, the element proportion of Si in the alloy is between 5% and 40%. If it is less, it will be difficult to achieve stable process doping. If it exceeds, it will affect the conductivity of the entire film layer.

[0063] When preparing the alloy film layer, either a commonly used alloy target with a fixed ratio can be selected for preparation. At the same time, single-element targets can also be used, and by controlling the power of different element targets, alloy film layers with different ratios can be obtained. The advantage of doing this is that when preparing alloy film layers with the same ratio, the element ratio (proportion) is more stable, and there is no need to strictly control the consistency of the component ratios of each part of the alloy target. When preparing alloy film layers with different ratios, there is no need to replace the new alloy target, and the power of each target can be directly adjusted. The film layer prepared in this way has a higher ionization rate and the film layer is more stable. Among them, the power range of each target is 3 - 50 kw (preferably 10 - 25 kw), the voltage is 300 - 1000 v, preferably 500 - 800 v, and the current is 1 - 50 A, preferably 5 - 20 A.

[0064] Examples

[0065] PVD process 1: The first-layer battery connector substrate 10 is 1-series Al, the second layer (the underlayer 11) is NiSiAlN, the film thickness is 100 nm, the gas flow rate of nitrogen is 100 sccm, Ni:Si:Al:N = 6:2:2:3, the third layer (the first functional sublayer 15) is NiSiAlN, the film thickness is 1000 nm, the gas flow rate of nitrogen is 120 sccm, Ni:Si:Al:N = 4:2:1:5, the fourth layer (the second functional sublayer 14) is SiAlN, the film thickness is 100 nm, the gas flow rate of nitrogen is 110 sccm, Si:Al:N = 4:2:4, and the fifth layer (the surface layer 12) is a Ni-containing composition, the film thickness is 300 nm.

[0066] PVD process 2: The first-layer substrate 10 is 2-series Al, the second layer is NiAlN, the film thickness is 100 nm, Ni:Al = 3:2, the gradual gas flow rate of nitrogen is 50 - 100 sccm, the gradual range of N element is 20% - 30% (mass fraction), the third layer is NiSiAlN, the film thickness is 1000 nm, Ni:Al = 3:2, the gradual gas flow rate of nitrogen is 70 - 150 sccm, the gradual range of N element is 30% - 50%, the fourth layer is SiAlN, the film thickness is 100 nm, Si:Al = 3:2, the gradual gas flow rate of nitrogen is 50 - 120 sccm, the gradual range of N element is 30% - 40%. When the gas flow rate of each layer gradually increases, the adhesion of the film layer and the hardness can be improved at the same time. The fifth layer is a NiCr-containing composition, Ni:Cr = 8:2, and the film thickness is 300 nm.

[0067] PVD Process 3: The first-layer substrate 10 is Cu, the second layer is NiCrSiN with a film thickness of 100 nm, Ni:Cr:Si = 3:3:7, the gradual gas flow rate of nitrogen is 50 - 150 sccm, the gradual range of N element is 10% - 50%, the third layer is NiCrSiN with a film thickness of 1000 nm, Ni:Cr:Si = 3:3:7, the gradual gas flow rate of nitrogen is 20 - 130 sccm, the gradual range of N element is 10% - 40%, the fourth layer is NiCrSiN with a film thickness of 100 nm, Ni:Cr:Si = 3:3:7, the gradual gas flow rate of nitrogen is 20 - 100 sccm, the gradual range of N element is 10% - 30%, and the fifth layer is a Sn-containing composition with a film thickness of 300 nm.

[0068] PVD Process 4: The first-layer substrate 10 is Cu, the second layer is CuZrN with a film thickness of 100 nm, Cu:Zr = 3:7, the gradual gas flow rate of nitrogen is 50 - 150 sccm, the gradual range of N element is 10% - 50%, the third layer is CuZrNbN with a film thickness of 1000 nm, Cu:Zr:Nb = 3:3:7, the gradual gas flow rate of nitrogen is 20 - 130 sccm, the gradual range of N element is 10% - 40%, the fourth layer is ZrNbN with a film thickness of 100 nm, Zi:Nb = 3:7, the gradual gas flow rate of nitrogen is 20 - 100 sccm, the gradual range of N element is 10% - 30%, and the fifth layer is NiSi with Ni:Si = 8:2 and a film thickness of 300 nm.

[0069] The specific performance indicators that the prepared film layer can achieve include but are not limited to: neutral salt spray at 35°C, continuous salt spray for up to 168 hours without corrosion, color change, etc., and the anti-corrosion grade reaches above level 9; the product resistance tested by a micro-ohmmeter is less than 100 μΩ, and the product contact resistance R ≤ 20 μΩ / cm 2 @DC200A, 10 N.m, with good conductivity; the hardness is above 1000 HV; after bending (first bend 60 degrees to the right, then bend 30 degrees to the left, and bend 5 times), there are no phenomena such as deposition layer peeling, debris peeling, and flake peeling; in the cross-cut test, the tape does not adhere to the film layer, and the adhesion grade ≤ level 1.

[0070] Through the PVD process, a clean and pollution-free production process can be achieved, the cycle can be shortened, and the production capacity can be improved. The parts plated with the anti-corrosion and conductive coating of the present invention have good corrosion resistance, high conductivity, high hardness, strong bonding force with the substrate 10, and the total film thickness is only at the nanometer level. Among them, the metal particles with good conductivity are evenly distributed in the corrosion-resistant non-metal particles to form a three-dimensional conductive network, forming a thin film with both good corrosion resistance and conductivity.

[0071] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are all within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. An anti-corrosion conductive coating, characterized in that, Including: A coating layer provided on the surface of a substrate; The coating layer includes a primer layer, a functional layer, and a surface layer sequentially arranged away from the substrate surface. The primer layer, the functional layer, and the surface layer respectively contain conductors, and the primer layer and the functional layer also respectively contain insulators. The conductors of the primer layer and the conductors of the functional layer are respectively distributed in the insulators of the primer layer and the insulators of the functional layer to respectively form planar conductive networks, and the planar conductive network of the primer layer is connected to the planar conductive network of the functional layer at the layer interface to form a three-dimensional conductive network, and the three-dimensional conductive network is connected to the conductors in the substrate and the surface layer at the layer interface.

2. The anti-corrosion conductive coating according to claim 1, wherein The conductors of the primer layer form an adhesion sublayer without an insulator at the layer interface with the substrate, and the three-dimensional conductive network is connected to the substrate at the layer interface through the adhesion sublayer.

3. The anti-corrosion conductive coating according to claim 1, characterized in that, The conductors of the primer layer and the conductors of the functional layer contain at least one of a single substance of a metal element and an alloy of a metal element, and at least one of a nitride, a silicide, and a carbide of the metal element; the insulators of the primer layer and the insulators of the functional layer contain a single substance of a non-metal element, and at least one of a nitride, an oxide, a carbide of the non-metal element, and an oxide of the metal element.

4. The anti-corrosion conductive coating according to claim 3, wherein The metal element includes at least one of Al, Cu, Ni, Cr, Zr, and Nb; the non-metal element includes Si.

5. The anti-corrosion conductive coating according to claim 3, wherein At least one of the metal element and the non-metal element in each of the primer layer and the functional layer has a gradually changing content in the direction away from the substrate surface, and has a consistent content at the layer interface between the primer layer and the functional layer.

6. The anti-corrosion conductive coating according to claim 5, wherein The functional layer includes multiple functional sub-layers, and at least one of the metal element and the non-metal element contained in each functional sub-layer has a gradually changing content in the direction away from the substrate surface, and has a consistent content at the layer interface between the functional sub-layers.

7. The anti-corrosion conductive coating according to claim 1, characterized in that The surface layer is a conductive layer formed by a composition conductor containing a single substance of a metal element or a composition conductor containing an alloy of a metal element.

8. The anti-corrosion conductive coating according to claim 7, wherein The metal element includes Ni or Sn.

9. A battery connector, characterized in that, Including a metal body, and an anti-corrosion conductive coating according to any one of claims 1-8 provided on at least one surface of the body as the substrate.

10. The battery connection member according to claim 9, characterized in that, The body is provided with a first connecting portion and a second connecting portion connected at a certain angle. The first connecting portion is used to be connected to the internal components of the battery cell, the second connecting portion is used to be connected to the external conductor of the battery cell, and a through hole for passing through the battery cell electrode is provided on the surface of the second connecting portion. The anti-corrosion conductive coating is PVD-coated on the surface of the second connecting portion.

11. A method for preparing an anti-corrosion conductive coating, characterized in that, Including: Providing a substrate; Using multiple PVD coatings to sequentially form a coating layer including a primer layer, a functional layer, and a surface layer on the surface of the substrate; Among them, by controlling the power of different element targets during film coating and the flow rate of the process gas introduced, the content of each film layer element in the underlayer, the functional layer, and the surface layer is controlled, so as to form conductors in the underlayer, the functional layer, and the surface layer respectively, and form insulators in the underlayer and the functional layer respectively, and make the conductors in the underlayer and the conductors in the functional layer be distributed in the insulators in the underlayer and the insulators in the functional layer respectively to form a planar conductive network, and make the planar conductive network in the underlayer connect with the planar conductive network in the functional layer at the layer interface to form a three-dimensional conductive network, and make the three-dimensional conductive network connect with the conductors in the substrate and the surface layer at the layer interface.

12. The method for preparing an anti-corrosion conductive coating according to claim 11, wherein, When forming the underlayer, first, by turning on the power of the metal element target, turning off the power of the non-metal element target, and stopping the flow of the process gas, an adhesion sub-layer formed by a conductor without an insulator is formed on the surface of the substrate. Then, by turning on the power of the metal element target and the non-metal element target and turning on the process gas, a planar conductive network that is distributed in the insulator of the underlayer and connects with the adhesion sub-layer is further formed on the adhesion sub-layer; when forming the functional layer, by turning on the power of the metal element target and the non-metal element target and turning on the process gas, a planar conductive network that is distributed in the insulator of the functional layer is continuously formed on the underlayer, and by controlling the power of different targets and the flow rate of the process gas introduced, the planar conductive network in the functional layer is made to connect with the planar conductive network in the underlayer at the layer interface to form a three-dimensional conductive network; when forming the surface layer, by turning on the power of the metal element target, turning off the power of the non-metal element target, and stopping the flow of the process gas, a conductive layer composed of conductors is formed, and the conductive layer is made to connect with the three-dimensional conductive network.

13. The method for preparing an anti-corrosion conductive coating according to claim 11, wherein By turning on the power of the metal element target and the non-metal element target and turning on the process gas, the conductors in the underlayer and the functional layer contain at least one of the simple substance of the metal element, the alloy of the metal element, and at least one of the nitride, silicide, and carbide of the metal element, and the insulators in the underlayer and the functional layer contain the simple substance of the non-metal element and at least one of the nitride, oxide, carbide of the non-metal element, and the oxide of the metal element.

14. The method for preparing an anti-corrosion conductive coating according to claim 13, wherein, The metal element includes at least one of Al, Cu, Ni, Cr, Zr, and Nb; the non-metal element includes Si, and the process gas includes at least one of nitrogen and oxygen.

15. The method for preparing a battery connector according to claim 11, wherein When forming the three-dimensional conductive network, by changing the power of the metal element target and the non-metal element target and the flow rate of the process gas, at least one of the metal element and the non-metal element contained in the underlayer and the functional layer respectively has a gradually changing content in the direction away from the surface of the substrate, and has a content that tends to be consistent at the layer interface between the underlayer and the functional layer, so that the conductor skeleton of the formed three-dimensional conductive network correspondingly has a gradually changing radial dimension.

16. The method for preparing a battery connection member according to claim 15, characterized in that, When forming the functional layer, multiple PVD coatings are used to make the formed functional layer include multiple functional sub-layers. By changing the power of the metal element target and the non-metal element target, as well as the process gas flow rate, at least one of the metal elements and non-metal elements contained in each functional sub-layer has a gradually changing content in the direction away from the surface of the substrate, and has a consistent content at the layer interfaces of the respective functional sub-layers, so that the conductor skeletons of the three-dimensional conductive network correspondingly have gradually changing radial dimensions in each functional sub-layer.

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