Capacitor with auxiliary heat dissipation structure

Abstract

The invention provides a capacitor with an auxiliary heat dissipation structure, and relates to the technical field of capacitors. The heat dissipation base body is arranged around the capacitor core body, the inner wall of the heat dissipation base body is attached to the outer wall of the capacitor core body, and the heat dissipation base body is used for absorbing heat generated by the capacitor core body; the primary heat dissipation layer is laid along the outer wall of the heat dissipation base body and used for absorbing heat on the heat dissipation base body; and the secondary heat dissipation layer is matched with the primary heat dissipation layer and is used for absorbing the heat on the primary heat dissipation layer and increasing the speed of transferring the heat on the primary heat dissipation layer to the external environment. By means of the design, the problems that an existing capacitor is prone to thermal aging, so that the service life of the capacitor is greatly shortened, and electronic equipment breaks down can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and particularly to a capacitor with an auxiliary heat dissipation structure. Background Art

[0002] A capacitor is a basic electronic component, and its main function is to store and release electrical energy. It consists of two conductors separated by an insulating material. When the capacitor is connected to a power source, it charges; after the power source is removed, it can retain the stored charge and release it when needed. Depending on the industry, capacitors mainly play roles such as energy storage, filtering, coupling and decoupling, timing and oscillation, and energy conversion. During operation, due to its physical characteristics, a large amount of heat is often generated. When in a high-temperature state for a long time, the capacitor is prone to thermal aging, which greatly reduces the service life of the capacitor and causes failures in electronic devices. To solve this problem, some improvements have been made to existing conventional capacitors.

[0003] For example, the prior art with the publication number CN221977763U discloses a heat dissipation capacitor. The heat dissipation capacitor includes a capacitor body. At both ends of the capacitor body, a top plate and a bottom plate are respectively provided through a first connecting arm and a second connecting arm. The first connecting arm and the second connecting arm are inserted and matched with each other and are connected and fixed by a locking bolt. A heat dissipation cover is provided on one side of the top plate. A heat dissipation fan is provided in the air-cooling cavity inside the heat dissipation cover. One end of the air-cooling cavity is provided with an air-cooling port through an air-cooling channel. This heat dissipation capacitor enables all-round air supply treatment to the outside of the capacitor body through the heat dissipation cover on one side of the top plate, a heat dissipation fan provided in the air-cooling cavity, and an air-cooling port provided at one end of the air-cooling cavity, thereby achieving a cooling effect.

[0004] However, this prior art still has defects. It mainly strengthens the air flow inside and outside the capacitor by introducing a heat dissipation fan to more quickly remove the heat, thereby achieving the cooling of the capacitor. However, due to the relatively limited outer surface area of the capacitor body, the heat carried away by the air flow is also relatively limited, and the overall cooling effect is not ideal, resulting in excessive heat accumulation during long-term operation of the capacitor, and ultimately still unable to prevent the capacitor from undergoing thermal aging and causing failures in electronic devices. Summary of the Invention

[0005] Based on this, in view of the problem that existing capacitors are prone to thermal aging, which greatly reduces the service life of the capacitors and causes failures in electronic devices, it is necessary to provide a capacitor with an auxiliary heat dissipation structure.

[0006] The present invention provides a capacitor with an auxiliary heat dissipation structure, which includes: A capacitor core; A heat dissipation base body is arranged around the capacitor core body, and the inner wall of the heat dissipation base body is attached to the outer wall of the capacitor core body for absorbing the heat generated by the capacitor core body; A primary heat dissipation layer is laid along the outer wall of the heat dissipation base body for absorbing the heat on the heat dissipation base body; A secondary heat dissipation layer is arranged in cooperation with the primary heat dissipation layer for absorbing the heat on the primary heat dissipation layer and enhancing the heat transfer rate from the primary heat dissipation layer to the external environment.

[0007] Among them, the primary heat dissipation layer includes: Solid heat conduction units are fixedly connected to the heat dissipation base body and are evenly distributed radially around the capacitor core body; a liquid heat conduction groove system is further arranged in the solid heat conduction units; Liquid heat conduction units include a liquid heat conduction agent and a liquid cooling component; the liquid heat conduction agent is filled in the liquid heat conduction groove system, and two ends of the liquid cooling component are respectively connected to a liquid injection port and a liquid output port of the liquid heat conduction groove system; Among them, the shape of the liquid heat conduction groove system matches the shape of the solid heat conduction unit.

[0008] Among them, the solid heat conduction unit includes a first heat conduction component, the first heat conduction component includes a plurality of first heat dissipation fins, the first heat dissipation fins include a first fin base and a first fin body connected to each other, and the first fin base is connected to the heat dissipation base body; Among them, the first fin bases are evenly distributed radially around the capacitor core body, and the cross-section of the first fin base in the axial direction of the capacitor core body is rod-shaped; The first fin body is enlarged relative to the first fin base, and the first fin body is configured to have a shape adapted to the outer wall contour of the capacitor core body; The liquid heat conduction groove system includes a plurality of liquid heat conduction groove units, and adjacent liquid heat conduction groove units are connected end to end with each other; Among them, liquid heat conduction grooves are arranged in both the first fin base and the first fin body and are communicated with each other to jointly form the liquid heat conduction groove unit.

[0009] Among them, a plurality of the first heat dissipation fins are configured such that there are installation gaps between two adjacent enlarged first fin bodies; The solid heat conduction unit further includes a second heat conduction component, the second heat conduction component includes a plurality of second heat dissipation fins, the second heat dissipation fins include a second fin base and a second fin body connected to each other, and at least part of the second heat dissipation fins are installed in the installation gaps.

[0010] Among them, the second fin bases are evenly distributed radially around the capacitor core, and the cross-section of the second fin bases in the axial direction of the capacitor core is rod-shaped; The second fin body is in a bulging shape relative to the second fin base, and the second fin body is configured to have a shape adapted to the outer wall contour of the capacitor core; The second fin base is connected to the heat dissipation base or the adjacent first fin base.

[0011] Among them, both ends of the second fin base are respectively connected to two adjacent first fin bases; One end of the second fin body is connected to the middle section of the second fin base, and the other end extends in a direction away from the capacitor core, passes through the installation gap, and is arranged together with the secondary heat dissipation layer.

[0012] Among them, the secondary heat dissipation layer includes a secondary heat dissipation body, the secondary heat dissipation body is arranged around the primary heat dissipation layer, and the heat dissipation base and the capacitor core are wrapped therein, and a plurality of heat dissipation holes are formed in the secondary heat dissipation body.

[0013] Among them, a plurality of fin assembly holes are formed in the secondary heat dissipation body, and the positions, sizes and numbers of the fin assembly holes are all matched with the second fin body, so that while allowing the second fin body to be tightly connected to the fin assembly holes, the end thereof can also extend to the outside of the secondary heat dissipation body.

[0014] Among them, a connecting part mounting hole is formed in the first fin body; the secondary heat dissipation layer further includes a heat dissipation connecting part, the heat dissipation connecting part passes through the connecting part mounting hole and is connected to the secondary heat dissipation body; the outer wall of the heat dissipation connecting part is attached to the inner wall of the connecting part mounting hole.

[0015] Among them, the secondary heat dissipation layer further includes a heat dissipation fan, and the fan surface of the heat dissipation fan is configured to be perpendicular to the axial direction of the capacitor core, so that the direction of the air flow generated by the heat dissipation fan is consistent with the axial direction of the capacitor core.

[0016] The above technical solution has the following advantages or beneficial effects: In the present invention, when the capacitor core works and generates heat, the heat dissipation base body disposed around the capacitor core and attached to the outer wall of the capacitor core will quickly absorb the heat generated by the capacitor core and directly transfer the heat to the primary heat dissipation layer laid on the outer wall of the heat dissipation base body. While absorbing heat, the primary heat dissipation layer will transfer the heat it accumulates to the secondary heat dissipation layer disposed in cooperation with it. In addition to directly contacting the primary heat dissipation layer to absorb the heat accumulated thereon and then transferring the absorbed heat to the external environment, the secondary heat dissipation layer will also assist the primary heat dissipation layer in dissipating heat, helping it transfer the heat to the external environment more quickly, thereby achieving efficient heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. is a schematic cross-sectional view of the structure of the capacitor with an auxiliary heat dissipation structure according to the present invention in one embodiment; Figure 2 FIG. is a schematic partial cross-sectional view of the structure of the capacitor with an auxiliary heat dissipation structure according to the present invention; Figure 3 The capacitor with an auxiliary heat dissipation structure according to the present invention is in Figure 2 Local enlarged view of area A; Figure 4 The capacitor with an auxiliary heat dissipation structure according to the present invention is in Figure 2 Schematic view of the structure in the B-B direction; Figure 5 FIG. is a schematic view of the liquid cooling system structure of the capacitor with an auxiliary heat dissipation structure according to the present invention in one embodiment; Figure 6 FIG. is a schematic cross-sectional view of the structure of the capacitor with an auxiliary heat dissipation structure according to the present invention in another embodiment; Figure 7 FIG. is a schematic cross-sectional view of the structure of the capacitor with an auxiliary heat dissipation structure according to the present invention in another embodiment; Figure 8 FIG. is a schematic cross-sectional view of the structure of the capacitor with an auxiliary heat dissipation structure according to the present invention in another embodiment; Figure 9 FIG. is a schematic cross-sectional view of the structure of the capacitor with an auxiliary heat dissipation structure according to the present invention in another embodiment; Figure 10 The capacitor with an auxiliary heat dissipation structure according to the present invention is in Figure 9 Schematic view of the structure in the C-C direction.

[0018] In the drawings, the list of components represented by each reference numeral is as follows: 100, capacitor core; 200, heat dissipation base; 300, primary heat dissipation layer; 310, solid heat conduction unit; 320, liquid heat conduction groove system; 321, liquid heat conduction groove unit; 330, liquid heat conduction unit; 331, liquid heat conduction agent; 332, liquid cooling component; 340, first heat dissipation fin; 341, first fin base; 342, first fin body; 343, connecting part mounting hole; 350, second heat dissipation fin; 351, second fin base; 352, second fin body; 360, mounting gap; 400, secondary heat dissipation layer; 410, secondary heat dissipation body; 411, heat dissipation hole; 412, fin assembly hole; 420, heat dissipation connecting piece; 430, heat dissipation fan. Detailed implementation manners

[0019] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following clearly and completely describes the specific implementation manners of the present invention with reference to the accompanying drawings. Obviously, the specific details described below are only some embodiments of the present invention, and the present invention can also be implemented in many other embodiments different from those described herein. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the protection scope of the present invention.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manner.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0022] The present invention provides a capacitor with an auxiliary heat dissipation structure. Please refer to Figure 1 and Figure 4 , which includes: Capacitor core 100; Heat dissipation base 200, arranged around the capacitor core 100, and the inner wall of the heat dissipation base 200 is in contact with the outer wall of the capacitor core 100, for absorbing the heat generated by the capacitor core 100; Primary heat dissipation layer 300, laid along the outer wall of the heat dissipation base 200, for absorbing the heat on the heat dissipation base 200; The secondary heat dissipation layer 400 is arranged in cooperation with the primary heat dissipation layer 300, and is used to absorb the heat on the primary heat dissipation layer 300 and enhance the speed of heat transfer from the primary heat dissipation layer 300 to the external environment.

[0023] In practical applications, usually, the capacitor core 100 is the core component of a capacitor and is responsible for storing electric charges. Its composition includes the following key parts: 1. Electrodes: The two electrodes of a capacitor are made of conductive materials, and the most common ones are metal sheets or foils. These electrodes can be made of materials such as aluminum, tantalum, silver, etc., depending on the type and application requirements of the capacitor. For thin film capacitors, the electrodes may be thin layers deposited on an insulating substrate through sputtering or vacuum evaporation techniques.

[0024] 2. Dielectric: The insulating material located between the two electrodes is called the dielectric. The selection of the dielectric is crucial for the performance of the capacitor because it determines characteristics such as the maximum working voltage, insulation resistance, dielectric constant, and temperature coefficient of the capacitor. Common dielectric materials include ceramics, plastic films (such as polypropylene, polyester), paper, mica, glass, and electrolyte solutions (for electrolytic capacitors). Different types of dielectrics endow the capacitor with different characteristics and application scenarios.

[0025] 3. Leads or terminals: In order to connect the capacitor to the circuit, leads or terminals are required. These leads are usually welded or mechanically fixed to the electrodes and extend out of the capacitor housing for connection to the external circuit. For surface mount devices, pads are used as connection points.

[0026] 4. Encapsulation: The capacitor core 100 is generally encapsulated in a protective shell, which not only provides physical protection but may also offer additional functions, such as sealing to prevent moisture intrusion, heat dissipation management, or aesthetic design. The encapsulation material can be selected according to the application environment of the capacitor, such as plastic encapsulation, metal cans, ceramic encapsulation, etc.

[0027] 5. Auxiliary structures: In some cases, some auxiliary structures may be added to the capacitor core 100 to improve its performance. For example, in high-capacity multilayer ceramic capacitors, multiple electrode-dielectric layers are stacked together; while in electrolytic capacitors, there may be a diaphragm soaked in electrolyte to increase the capacitance and help self-repair defects.

[0028] In practical applications, the capacitor core 100 generates more heat in many cases, and the reasons are roughly as follows: 1. Equivalent Series Resistance: Any real capacitor is not ideal, and there is a certain resistance component inside it, called equivalent series resistance (ESR). When current passes through a capacitor, ESR causes energy loss and is converted into heat. Especially in high-frequency AC circuits or pulse circuits, the power loss P caused by ESR can be expressed as, where I is the current flowing through the capacitor. Therefore, the lower the ESR, the less heat the capacitor generates.

[0029] 2. Dielectric Loss: The dielectric of a capacitor is not completely insulating, and polarization occurs when a voltage is applied, which consumes a part of the energy. This energy loss mainly comes from the molecular friction of the dielectric material and the hysteresis effect during the rearrangement process, that is, dielectric relaxation. For some types of dielectrics, such as ceramics or multi-layer plastic films, the tangent of the dielectric loss angle increases at high frequencies, resulting in more energy being dissipated in the form of heat.

[0030] 3. Leakage Current: Although a capacitor is designed to block DC current from passing through, there is always a tiny leakage current in practical applications. This part of the current will also generate Joule heat inside the capacitor. Although the leakage current is usually very small, it may become more significant in high-voltage and high-temperature environments and contribute to heat generation.

[0031] 4. Self-inductance Effect: For some large-capacity or special-structured capacitors (such as electrolytic capacitors), their leads and internal structures may introduce non-negligible self-inductance. When the capacitor operates under high-frequency conditions, self-inductance will cause additional energy loss and thus cause heat generation.

[0032] 5. Charge and Discharge Cycles: During rapid charge and discharge processes, especially repeated operations with large currents, transient temperature changes will occur inside the capacitor. These frequent changes may lead to the formation of local hot spots, especially at the electrode-dielectric interface, thereby increasing the overall heat generation.

[0033] 6. Influence of Ambient Temperature: An increase in ambient temperature will affect the operating temperature of the capacitor. If the heat dissipation is poor, the heat generated by the capacitor itself plus the external ambient heat will cause the temperature of the capacitor to rise, further exacerbating the heat generation problem.

[0034] 7. Harmonic Currents: In non-sinusoidal waveform power systems, such as switch-mode power supplies or motor drives, there are rich harmonic components. These harmonic currents will cause additional power losses in the capacitor because they not only increase the effective value of the current but also increase the frequency, making the ESR and dielectric loss more obvious.

[0035] Due to physical limitations, many of the above factors that cause the capacitor core 100 to generate a large amount of heat cannot be completely avoided. Therefore, the problem of excessive heat accumulation can only be solved through the external design of the capacitor core 100.

[0036] Specifically in the embodiment, please refer to Figure 1 and Figure 4 When the capacitor core 100 operates and generates heat, the heat dissipation matrix 200 arranged around the capacitor core 100 and attached to the outer wall of the capacitor core 100 will quickly absorb the heat generated by the capacitor core 100 and directly transfer the heat to the primary heat dissipation layer 300 laid on the outer wall of the heat dissipation matrix 200. While absorbing heat, the primary heat dissipation layer 300 will transfer the accumulated heat to the secondary heat dissipation layer 400 arranged in cooperation with it. In addition to directly contacting the primary heat dissipation layer 300 to absorb the accumulated heat thereon and then transferring the absorbed heat to the external environment, the secondary heat dissipation layer 400 will also assist the primary heat dissipation layer 300 in dissipating heat, helping it transfer the heat to the external environment more quickly, so as to achieve efficient heat dissipation and solve the problem that the existing capacitors are prone to thermal aging, greatly reducing the service life of the capacitors and causing failures of electronic devices.

[0037] Among them, the main structures of the above heat dissipation matrix 200, primary heat dissipation layer 300, and secondary heat dissipation layer 400 are mainly made of metals with high thermal conductivity (such as copper). When the metal with high thermal conductivity is in direct contact with the capacitor core 100, it can quickly absorb heat, that is, quickly transfer the heat on the capacitor core 100 into the metal with high thermal conductivity.

[0038] In one embodiment, please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The above primary heat dissipation layer 300 may include: Solid heat conduction units 310, fixedly connected to the heat dissipation matrix 200 and evenly distributed radially with the capacitor core 100 as the center; a liquid heat conduction groove system 320 is also provided in the solid heat conduction units 310; Liquid heat conduction units 330, including a liquid heat conduction agent 331 and a liquid cooling component 332; the liquid heat conduction agent 331 is filled in the liquid heat conduction groove system 320, and both ends of the liquid cooling component 332 are respectively connected to the liquid injection port and the liquid output port of the liquid heat conduction groove system 320; Among them, the shape of the liquid heat conduction groove system 320 matches the shape of the solid heat conduction units 310.

[0039] Specifically in the embodiment, when the capacitor core 100 works and generates heat, the heat dissipation substrate 200 arranged around the capacitor core 100 and in contact with the outer wall of the capacitor core 100 will quickly absorb the heat generated by the capacitor core 100, and directly transfer the heat to the primary heat dissipation layer 300 laid on the outer wall of the heat dissipation substrate 200. Specifically, the heat accumulated on the heat dissipation substrate 200 will be directly transferred to the solid heat conduction unit 310 arranged on its outer wall. Externally, the heat conducted from the heat dissipation substrate 200 to the solid heat conduction unit 310 will be directly transferred from the solid heat conduction unit 310 to the surrounding external environment. Internally, the heat conducted from the heat dissipation substrate 200 to the solid heat conduction unit 310 will be transferred to the liquid heat conductive agent 331 in the liquid heat conduction groove system 320 in the solid heat conduction unit 310, and the liquid heat conductive agent 331 will flow under the action of the liquid cooling component 332 and take away the heat accumulated on the solid heat conduction unit 310, further accelerating the dissipation of heat.

[0040] Among them, see Figure 2 The solid heat conducting units 310 are configured to be evenly distributed radially with the capacitor core 100 as the center in order to minimize the space occupied by the heat dissipation structure while ensuring the uniformity of heat dissipation as much as possible to avoid local accumulation of large amounts of heat and affect the overall heat dissipation effect.

[0041] Also, see Figure 5 The above-mentioned liquid cooling component 332 may include at least a pump body and a cooling unit; the pump body, the cooling unit and the liquid heat conduction groove system 320 are connected in sequence to form a complete liquid cooling circuit. The liquid heat conductor 331 with high heat in the liquid heat conduction groove system 320 flows under the drive of the pump body, and finally enters the cooling unit through the liquid outlet of the liquid heat conduction groove system 320 for cooling to obtain a liquid heat conductor 331 with a relatively low temperature. The liquid heat conductor 331 with a relatively low temperature flows through the liquid injection port of the liquid heat conduction groove system 320 under the drive of the pump body, and finally is input into the solid heat conduction unit 310 to absorb the heat accumulated in the solid heat conduction unit 310.

[0042] The above is a simplified liquid cooling solution. To facilitate understanding and explanation, the more specific structure and principle of the liquid cooling system are further explained below.

[0043] The liquid cooling system is an efficient heat dissipation solution. Its basic structure and working principle are as follows: 1. Coolant: Coolant is the medium in the liquid cooling system, used to absorb and transfer heat. Common coolants include water, ethylene glycol water solution and special non-conductive liquid (such as mineral oil or fluorinated liquid). When choosing a suitable coolant, factors such as heat capacity, viscosity, chemical stability, corrosiveness and conductivity should be considered.

[0044] 2. Cold Plate: The cold plate is directly mounted on the heat-generating components and is usually made of metals such as copper or aluminum. It is internally designed with microchannels or pipes for the coolant to flow through. The design of the cold plate aims to maximize the contact area and minimize the thermal resistance, thereby effectively extracting heat from the heat source.

[0045] 3. Pump: The pump is responsible for driving the coolant to circulate throughout the system. Depending on the application, centrifugal pumps, diaphragm pumps, or other types of pumps can be used. The selection of the pump depends on the flow rate requirements, pressure requirements, and whether low-noise operation is needed.

[0046] 4. Radiator: The function of the radiator is to dissipate the heat absorbed from the heat-generating components into the surrounding environment. It can be air-cooled, where a fan forces air to flow through the heat dissipation fins, or water-cooled, using an external cooling tower or ambient water source for cooling. In some cases, the radiator may contain phase change materials to enhance the heat dissipation effect.

[0047] 5. Expansion Tank: The expansion tank is used to compensate for the change in coolant volume due to temperature changes and can also serve as a place to replenish the coolant. It also helps maintain the proper pressure within the system and prevents the occurrence of cavitation.

[0048] 6. Filter: To keep the coolant clean and prevent impurities from clogging the pipes or damaging the pump and other components, filters are usually installed in the system to remove particulate matter and sediments.

[0049] 7. Control Unit: The control unit monitors system parameters such as temperature, flow rate, and pressure, and adjusts operations such as pump speed and fan speed according to the set values to ensure optimal heat dissipation performance while saving energy.

[0050] 8. Connecting Pipelines: Efficient connecting pipelines and joints ensure that the coolant can be smoothly transferred between components and are well-sealed to avoid leakage. In this technical solution, the main part of the connecting pipeline is the above-mentioned liquid heat conduction groove system 320.

[0051] The principle of the liquid cooling system during operation is roughly as follows: 1. Heat Absorption Stage: When the heat-generating components (such as the capacitor core 100 in this technical solution) are working, the generated heat is absorbed by the cold plate. Since the cold plate is flowing with low-temperature coolant, the heat is quickly transferred to the coolant, causing the coolant temperature to rise.

[0052] 2. Circulation and Heat Dissipation: The pump drives the coolant to flow out of the cold plate and into the radiator. In the radiator, the coolant is cooled through heat exchange with the outside air or another cooling medium. For air-cooled radiators, a fan forces air to flow through the heat dissipation fins to accelerate heat dissipation; for water-cooled radiators, cooling may be achieved through a cooling tower or ambient water source.

[0053] 3. Recirculation and Recycling: The coolant that has been cooled by the radiator is pumped back into the cold plate again, forming a closed circulation system. During this process, the coolant continuously removes new heat and discharges it into the environment.

[0054] 4. Automatic Regulation: The control unit in the system monitors key parameters in real time and dynamically adjusts settings such as pump speed and fan speed according to actual needs to optimize the heat dissipation efficiency and reduce energy consumption.

[0055] In summary, through the good heat conduction characteristics and large specific heat capacity of the liquid, the liquid cooling system achieves more efficient heat transfer than traditional air cooling, and is particularly suitable for application scenarios with high power density. In addition, liquid cooling can also reduce the noise level because it does not rely on a large number of high-speed rotating fans for heat dissipation.

[0056] Further, please refer to Figure 2 , Figure 3 and Figure 6 , the solid heat conduction unit 310 includes a first heat conduction component, the first heat conduction component includes a plurality of first heat dissipation fins 340, the first heat dissipation fins 340 include a first fin base 341 and a first fin body 342 connected to each other, and the first fin base 341 is connected to the heat dissipation base 200; Wherein, the first fin bases 341 are radially and uniformly distributed around the capacitor core 100, and the cross-section of the first fin bases 341 in the axial direction of the capacitor core 100 is rod-shaped; The first fin body 342 is enlarged relative to the first fin base 341, and the first fin body 342 is configured to have a shape adapted to the outer wall contour of the capacitor core 100; The liquid heat conduction groove system 320 includes a plurality of liquid heat conduction groove units 321, and adjacent liquid heat conduction groove units 321 are connected end to end with each other; Wherein, liquid heat conduction grooves are provided in both the first fin base 341 and the first fin body 342 and are connected to each other to jointly form the liquid heat conduction groove unit 321.

[0057] Liquid heat conduction grooves are also provided on the heat dissipation base 200, which are connected to the liquid heat conduction grooves on the first heat dissipation fins 340 to jointly form a part of the liquid cooling loop.

[0058] Specifically in the embodiments, when the capacitor core 100 operates and generates heat, the heat dissipation base 200 disposed around the capacitor core 100 and attached to the outer wall of the capacitor core 100 will quickly absorb the heat generated by the capacitor core 100 and directly transfer the heat to the primary heat dissipation layer 300 laid on the outer wall of the heat dissipation base 200. Specifically, the heat accumulated on the heat dissipation base 200 will be directly transferred to the first heat conduction component disposed on its outer wall, and to the multiple first heat dissipation fins 340 disposed on the outer wall of the heat dissipation base 200. A more specific heat conduction path is: the heat is transferred from the heat dissipation base 200 to the first fin base 341 directly connected thereto. After that, the heat on the first fin base 341 is gradually transferred to the first fin body 342 at the end of the first fin base 341. The first fin body 342 in a swollen shape will accelerate the heat transfer due to its larger contact area with the external environment (air), thus achieving better heat dissipation effect.

[0059] Please refer to Figure 3 and Figure 5 , liquid heat conduction grooves are provided in the first fin base 341 and the first fin body 342 and together form a connected liquid heat conduction groove unit 321, in order to utilize the shape of the first heat dissipation fin 340 to spread out the liquid cooling circuit as much as possible and more fully absorb and transfer the heat accumulated on the first heat dissipation fin 340.

[0060] Among them, the above-mentioned first fin body 342 is configured to have a shape adapted to the outer wall contour of the capacitor core 100 in order to save space as much as possible while ensuring the swelling of the first fin body 342 to enhance heat dissipation, so that the entire capacitor can be reduced in volume as much as possible while having a good heat dissipation effect.

[0061] In addition, please refer to Figure 1 and Figure 6 , the secondary heat dissipation layer 400 in the above text can be cooperatively arranged with the primary heat dissipation layer 300 by directly connecting it to the first fin body 342 through an intermediate (such as a spring). Or, the secondary heat dissipation layer 400 is directly fixedly connected to multiple first fin bodies 342 to achieve the cooperative arrangement of the secondary heat dissipation layer and the primary heat dissipation layer 300.

[0062] Furthermore, please refer to Figure 6 and Figure 7 , multiple first heat dissipation fins 340 are configured such that there is an installation gap 360 between two adjacent first fin bodies 342 in a swollen shape; The solid heat conduction unit 310 further includes a second heat conduction component. The second heat conduction component includes a plurality of second heat dissipation fins 350. The second heat dissipation fins 350 include a second fin base 351 and a second fin body 352 connected to each other. At least a part of the second heat dissipation fins 350 is installed within the installation gap 360.

[0063] Specifically in the embodiment, when the capacitor core 100 operates and generates heat, the heat dissipation base 200 disposed around the capacitor core 100 and attached to the outer wall of the capacitor core 100 will quickly absorb the heat generated by the capacitor core 100, and directly transfer the heat to the first heat conduction component laid on the outer wall of the heat dissipation base 200. In addition, the heat accumulated on the heat dissipation base 200 will also be transferred to the second heat conduction component disposed in the installation gap 360, and the heat will be transferred to the external environment through the second heat conduction component. The specific heat conduction path is: the heat is transferred from the heat dissipation base 200 or the first heat dissipation fin 340 to the second fin base 351 directly connected thereto. After that, the heat on the second fin base 351 is gradually transferred to the second fin body 352 at the end of the second fin base 351. The second fin base 351 and the second fin body 352 are in contact with the external environment (air) to transfer away the heat.

[0064] The reason for setting the second heat conduction component is to make full use of the space of the heat dissipation base 200 as much as possible without changing the volume of the capacitor, further increasing the heat dissipation area, and maximizing the heat dissipation efficiency within the allowable range.

[0065] Further, please refer to Figure 6 and Figure 7 , the second fin bases 351 are evenly distributed radially around the capacitor core 100, and the cross-section of the second fin bases 351 in the axial direction of the capacitor core 100 is rod-shaped; The second fin body 352 is enlarged relative to the second fin base 351, and the second fin body 352 is configured to have a shape adapted to the outer wall contour of the capacitor core 100; The second fin base 351 is connected to the heat dissipation base 200 or an adjacent first fin base 341.

[0066] The reason for the structural setting of the second fin body 352 is the same as that of the first fin body 342, that is, the enlarged structure makes the contact area with the external environment (air) larger, which will accelerate the heat transfer, thereby making the heat dissipation effect better.

[0067] As for the above-mentioned second fin base 351, it can be set to be directly connected to the heat dissipation base 200, or can also be set to be connected to the first fin base 341.

[0068] When the second fin base 351 is directly connected to the heat dissipation base 200, the specific heat conduction path of the second heat conduction component is as follows: Heat is transferred from the heat dissipation base 200 to the second fin base 351 directly connected thereto. After that, the heat on the second fin base 351 is gradually transferred to the second fin body 352 at the end of the second fin base 351. The bulged parts of the second fin base 351 and the second fin body 352 are in direct contact with the external environment (air), and the heat is quickly transferred to the external environment.

[0069] When the second fin base 351 is directly connected to the first fin base 341, the specific heat conduction path of the second heat conduction component is as follows: Heat is transferred from the heat dissipation base 200 to the first fin base 341. In addition to being transferred to the first fin body 342 and the liquid heat conductive agent 331 inside it, part of the heat accumulated on the first fin base 341 is also transferred to the second fin base 351 directly connected thereto. After that, the heat on the second fin base 351 is gradually transferred to the second fin body 352 at the end of the second fin base 351. The bulged parts of the second fin base 351 and the second fin body 352 are in direct contact with the external environment (air), and the heat is quickly transferred to the external environment.

[0070] Further, please refer to Figure 6 and Figure 7 , the two ends of the second fin base 351 are respectively connected to two adjacent first fin bases 341; One end of the second fin body 352 is connected to the middle section of the second fin base 351, and the other end extends in a direction away from the capacitor core 100, passes through the installation gap 360, and is arranged together with the secondary heat dissipation layer 400.

[0071] The specific way in which the end of the second fin body 352 is arranged together with the secondary heat dissipation layer 400 can be: A plurality of fin assembly holes 412 are formed on the secondary heat dissipation body 410. The positions, sizes, and quantities of the fin assembly holes 412 match those of the second fin body 352, so that while allowing the second fin body 352 to be tightly connected to the fin assembly holes 412, its end can also extend outside the secondary heat dissipation body 410.

[0072] Specifically, one end of the second fin body 352 is connected to the middle section of the second fin base 351, and the other end extends in a direction away from the capacitor core 100, passes through the installation gap 360, and enters the fin assembly holes 412 on the secondary heat dissipation layer 400, and is tightly assembled together with the secondary heat dissipation layer 400.

[0073] Alternatively, one end of the second fin body 352 is connected to the middle section of the second fin base 351, and the other end thereof extends away from the capacitor core 100, sequentially passes through the installation gap 360 and the fin assembly holes 412 in the secondary heat dissipation layer 400, and finally extends to the outside of the secondary heat dissipation layer 400.

[0074] In this embodiment, in addition to being transferred by direct contact with the external environment (air), the heat on the second fin body 352 can also be transferred to the secondary heat dissipation layer 400 disposed together therewith, and the overall heat dissipation area is further increased through the secondary heat dissipation layer 400, further enhancing the heat dissipation effect of the capacitor.

[0075] Meanwhile, if the end of the second fin body 352 extends to the outside of the secondary heat dissipation body 410, the contact area with the external environment (air) can be further increased, thereby further increasing the heat exchange area.

[0076] Further, please refer to Figure 9 and Figure 10 , the secondary heat dissipation layer 400 includes a secondary heat dissipation body 410. The secondary heat dissipation body 410 is disposed around the primary heat dissipation layer 300 and wraps the heat dissipation base 200 and the capacitor core 100 therein. A plurality of heat dissipation holes 411 are formed in the secondary heat dissipation body 410.

[0077] Through the plurality of heat dissipation holes 411 formed in the secondary heat dissipation body 410, the interaction of the air between the secondary heat dissipation body 410 and the primary heat dissipation layer 300 can be strengthened, thereby accelerating the heat dissipation speed.

[0078] Further, please refer to Figure 9 , a connecting member mounting hole 343 is formed in the first fin body 342; the secondary heat dissipation layer 400 further includes a heat dissipation connecting member 420. The heat dissipation connecting member 420 passes through the connecting member mounting hole 343 and is connected to the secondary heat dissipation body 410; the outer wall of the heat dissipation connecting member 420 is fitted with the inner wall of the connecting member mounting hole 343.

[0079] Specifically in the embodiment, in addition to being transferred to the external environment and the internal liquid heat conducting agent 331, part of the heat accumulated on the first fin body 342 will also transfer the heat to the secondary heat dissipation body 410 through the heat dissipation connecting member 420 assembled therewith, further accelerating the dissipation of the heat on the primary heat dissipation layer 300.

[0080] Further, please refer to Figure 10 , the secondary heat dissipation layer 400 further includes a heat dissipation fan 430. The fan surface of the heat dissipation fan 430 is configured to be perpendicular to the axial direction of the capacitor core 100, so that the direction of the airflow generated by the heat dissipation fan 430 is consistent with the axial direction of the capacitor core 100.

[0081] With the above settings, the air flow between the primary heat dissipation layer 300 and the secondary heat dissipation layer 400 will be accelerated, thereby accelerating the heat exchange between the air and the primary heat dissipation layer 300 and the secondary heat dissipation layer 400, and further enhancing the heat dissipation speed.

[0082] The components that need to be powered in the above text, such as the liquid cooling component 332 and the cooling fan 430, can obtain electrical energy by being connected to the pins of the capacitor core 100.

[0083] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0084] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations, substitutions, and improvements can still be made, and these should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the claims.

Claims

1. A capacitor with an auxiliary heat dissipation structure, characterized in that Comprising: A capacitor core; A heat dissipation base body, arranged around the capacitor core, and the inner wall of the heat dissipation base body is in contact with the outer wall of the capacitor core, for absorbing the heat generated by the capacitor core; A primary heat dissipation layer, laid along the outer wall of the heat dissipation base body, for absorbing the heat on the heat dissipation base body; A secondary heat dissipation layer, arranged in cooperation with the primary heat dissipation layer, for absorbing the heat on the primary heat dissipation layer and enhancing the heat transfer rate from the primary heat dissipation layer to the external environment.

2. The capacitor with an auxiliary heat dissipation structure according to claim 1, wherein, The primary heat dissipation layer includes: A solid heat conduction unit, fixedly connected to the heat dissipation base body and radially and evenly distributed around the capacitor core; a liquid heat conduction groove system is also arranged in the solid heat conduction unit; A liquid heat conduction unit, including a liquid heat conduction agent and a liquid cooling component; the liquid heat conduction agent is filled in the liquid heat conduction groove system, and both ends of the liquid cooling component are respectively connected to the liquid injection port and the liquid output port of the liquid heat conduction groove system; Wherein, the shape of the liquid heat conduction groove system matches the shape of the solid heat conduction unit.

3. The capacitor with an auxiliary heat dissipation structure according to claim 2, wherein, The solid heat conduction unit includes a first heat conduction component, the first heat conduction component includes a plurality of first heat dissipation fins, the first heat dissipation fins include a first fin base and a first fin body connected to each other, and the first fin base is connected to the heat dissipation base body; Wherein, the first fin base is radially and evenly distributed around the capacitor core, and the cross-section of the first fin base in the axial direction of the capacitor core is rod-shaped; The first fin body is enlarged relative to the first fin base, and the first fin body is configured to have a shape adapted to the outer wall contour of the capacitor core; The liquid heat conduction groove system includes a plurality of liquid heat conduction groove units, and adjacent liquid heat conduction groove units are connected end to end with each other; Wherein, liquid heat conduction grooves are arranged in both the first fin base and the first fin body and are connected to each other to jointly form the liquid heat conduction groove unit.

4. The capacitor with an auxiliary heat dissipation structure according to claim 3, characterized in that, A plurality of the first heat dissipation fins are configured such that there are installation gaps between adjacent enlarged first fin bodies; The solid heat conduction unit further includes a second heat conduction component, the second heat conduction component includes a plurality of second heat dissipation fins, the second heat dissipation fins include a second fin base and a second fin body connected to each other, and at least part of the second heat dissipation fins are installed in the installation gaps; 5. The capacitor with an auxiliary heat dissipation structure according to claim 4, wherein The second fin base is radially and evenly distributed around the capacitor core, and the cross-section of the second fin base in the axial direction of the capacitor core is rod-shaped; The second fin body is enlarged relative to the second fin base, and the second fin body is configured to have a shape adapted to the outer wall contour of the capacitor core; The second fin base is connected to the heat dissipation base body or an adjacent first fin base.

6. The capacitor with an auxiliary heat dissipation structure according to claim 4, wherein, Both ends of the second fin base are respectively connected to two adjacent first fin bases; One end of the second fin body is connected to the middle section of the second fin base, and the other end extends away from the capacitor core and passes through the installation gap and is arranged together with the secondary heat dissipation layer.

7. The capacitor with an auxiliary heat dissipation structure according to claim 6, characterized in that, The secondary heat dissipation layer includes a secondary heat dissipation body, the secondary heat dissipation body is disposed around the primary heat dissipation layer, and wraps the heat dissipation base body and the capacitor core body therein, and a plurality of heat dissipation holes are formed in the secondary heat dissipation body.

8. The capacitor with an auxiliary heat dissipation structure according to claim 7, characterized in that, A plurality of fin assembly holes are formed in the secondary heat dissipation body, and the positions, sizes, and numbers of the fin assembly holes are all matched with the second fin body, so that while allowing the second fin body to be closely connected to the fin assembly holes, its end portion can also extend to the outside of the secondary heat dissipation body.

9. The capacitor with an auxiliary heat dissipation structure according to claim 7, wherein, A connecting member mounting hole is formed in the first fin body; the secondary heat dissipation layer further includes a heat dissipation connecting member, the heat dissipation connecting member penetrates through the connecting member mounting hole and is connected to the secondary heat dissipation body; the outer wall of the heat dissipation connecting member is attached to the inner wall of the connecting member mounting hole.

10. The capacitor with an auxiliary heat dissipation structure according to any one of claims 1 to 9, characterized in that The secondary heat dissipation layer further includes a heat dissipation fan, and the fan blade surface of the heat dissipation fan is configured to be perpendicular to the axial direction of the capacitor core body, so that the direction of the air flow generated by the heat dissipation fan is consistent with the axial direction of the capacitor core body.

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