A chip package wire bonding apparatus

Abstract

The application relates to the chip manufacturing technical field and discloses a chip packaging wire bonding device, mainly including an auxiliary mechanism, the auxiliary mechanism is movably arranged on a workpiece, the auxiliary mechanism is spliced by two long auxiliary assemblies and two short auxiliary assemblies, and the two short auxiliary assemblies are movably arranged between the two long auxiliary assemblies. When the device is used, the auxiliary mechanism is arranged at the top end of the workpiece and located between the chip and the pin, the supporting assembly is rotated to the vertical state under the action of the long push plate and the short push plate, the long top film and the short top film are expanded into semicircular rings, so that the lead wire being welded is effectively fully supported, the shape formed by the lead wire is ensured to be a stable arc, the lead wire "collapse" phenomenon is prevented when two welding points are connected, the height and shape of the welding point after solidification meet the requirements, the electrical performance and mechanical strength of the workpiece are effectively enhanced, and the product quality is improved.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing technology, and in particular to a chip packaging wire bonding apparatus. Background Technology

[0002] Wire bonding in chip packaging refers to the process of connecting semiconductor chips to external connection pins (such as metal lead frames or substrates) through welding during the manufacturing of microelectronic devices. This welding method not only provides mechanical fixation but also ensures the stability and reliability of the electrical connection. Existing wire bonding equipment is the main equipment for chip packaging. It uses a limiting mechanism to limit and fix the workpiece to be processed, and then uses a welding assembly to weld the leads to the solder points on the workpiece, thus connecting the chip to the pins.

[0003] However, existing chip packaging wire bonding devices still have some defects in use: During operation, the welding assembly guides the lead wire to move down, and then the welding head welds the end of the lead wire to the first solder point of the workpiece. Then the welding assembly controls the movement of the lead wire, and then the welding head pulls the lead wire off and welds the other end to the second solder point of the workpiece. To ensure the quality of the wire bonding, the lead wire connecting the two solder points is in an arc shape. However, in actual operation, the welding assembly cannot control the state of the lead wire, and the lead wire may "collapse" when connecting the two solder points. This makes the height and shape of the solder point unable to meet the requirements, resulting in damage to the electrical performance and weakening of the mechanical strength of the chip, thus affecting the product quality. Summary of the Invention

[0004] This application proposes a chip packaging wire bonding device, which has the advantage of using an auxiliary mechanism to support and limit the lead during welding, effectively improving the stability of the connection between the lead and the solder joint, thereby solving the problem of lead "collapse" during welding and affecting the quality of wire bonding.

[0005] To achieve the above objectives, this application adopts the following technical solution: a chip packaging wire bonding device, comprising:

[0006] The workpiece to be processed includes a substrate, a chip, and pins. The chip is disposed on the top of the substrate, and an equal number of pins are disposed on the top of the substrate on all four sides of the chip.

[0007] A workbench, on top of which the workpiece is placed to provide processing space;

[0008] A limiting mechanism is provided above the worktable to limit and fix the workpiece to be processed;

[0009] An auxiliary mechanism is movably mounted on the workpiece and is composed of two long auxiliary components and two short auxiliary components joined together. The two long auxiliary components are parallel to each other, and the two short auxiliary components are also parallel to each other. The length of each short auxiliary component is shorter than that of the long auxiliary components, and the two short auxiliary components are movably mounted between the two long auxiliary components. When no wire bonding is being performed, the long and short auxiliary components are in a flat, contracted state. When wire bonding is being performed, the long and short auxiliary components are in a convex, expanded state. The cross-sectional shape of the long and short auxiliary components is semi-cylindrical, which helps to achieve stable wire bonding on the workpiece.

[0010] Furthermore, the limiting mechanism includes:

[0011] A limiting plate has a limiting cavity in the middle, and the limiting plate is movably engaged with the workpiece through the limiting cavity. The front and rear walls of the limiting cavity have limiting grooves, and the limiting plate is movably engaged with the long auxiliary component through the limiting grooves.

[0012] A lifting assembly, one end of which is fixedly sleeved inside the worktable, and the other end of which is fixedly sleeved inside the limiting plate. The number of lifting assemblies is four, and the lifting assemblies are distributed at the four corners of the limiting plate.

[0013] An exhaust pipe is fixedly sleeved inside the limiting plate, and the number of exhaust pipes is equal to the number of limiting grooves of the limiting plate. One end of the exhaust pipe is fixedly connected to the limiting groove of the limiting plate, and the other end of the exhaust pipe is fixedly connected to the air supply box.

[0014] Furthermore, the long auxiliary component includes:

[0015] A long base plate, the middle of which is movably placed on the substrate, and the middle of the long base plate is located between the chip and the pin. The two ends of the long base plate are movably engaged with the limiting grooves of the limiting plate. The length of the long base plate is equal to the length between the two limiting grooves that are set opposite to each other. The cross-sectional shape of the long base plate is "U" shaped, and the long base plate is made of rigid material.

[0016] The long top film is fixedly connected to both ends of the long bottom plate located above the substrate, and the long top film is made of a flexible material.

[0017] A long push plate is movably engaged at the top center of the long base plate. The length of the long push plate is shorter than that of the long base plate and longer than that of the long top film. The long push plate consists of a movable plate and two movable blocks. The movable blocks are fixedly connected to the bottom surfaces of both ends of the movable plate, and the bottom surfaces of the movable blocks are in contact with the inner bottom surfaces of the long base plate. The width of the movable plate is shorter than the inner width of the long base plate, and the width of the movable blocks is adapted to the inner width of the long base plate.

[0018] A support assembly is movably snapped onto a long base plate located inside the long top membrane, and the support assembly corresponds one-to-one with the pins to support the long top membrane.

[0019] The long push plate has snap-fit ​​components at both ends, and the snap-fit ​​components pass through the long base plate to stably fix the long push plate on the long base plate.

[0020] Furthermore, the short auxiliary component includes:

[0021] A short base plate is placed on a substrate and located between the chip and the pins. The two ends of the short base plate are attached to the outer wall of the long base plate, and the length of the short base plate is shorter than that of the long base plate. The cross-sectional shape of the short base plate is "U" shaped, and the short base plate is made of a rigid material.

[0022] The short top membrane has two fixed connections at the top two sides of the short bottom plate to both ends of the short top membrane, and the short top membrane is made of flexible material. The side wall of the long top membrane has connection holes, and the long top membrane communicates with the short top membrane through the connection holes.

[0023] A short push plate is movably engaged at the top center of the short base plate. The length of the short push plate is longer than that of the short base plate, and the width of the short push plate is shorter than that of the short base plate. Both ends of the short push plate pass through the connecting holes and fit against the long push plate. The bottom surface of the short push plate fits against the top surface of the long base plate.

[0024] A support assembly is movably snapped onto a short bottom plate located inside the short top membrane, and the support assembly corresponds one-to-one with the pins to support the short top membrane.

[0025] Furthermore, both the long top film and the short top film have arc holes in their middle sections, and the two ends of the arc holes are connected by connecting rods. Each arc hole corresponds to a set of connecting rods, and each connecting rod corresponds to a pin. There are several sets of connecting rods, and these connecting rods are evenly arranged around the arc holes. The total diameter of a set of connecting rods is shorter than the internal width of the long bottom plate and the short bottom plate.

[0026] Therefore, by opening arc holes in the long and short top films and connecting the two ends of the arc holes with connecting rods, the lead wire is located at the top of the connecting rod. When the inert gas is discharged into the long and short auxiliary components, some of the inert gas is discharged through the arc holes. This not only effectively prevents the metal from oxidizing during wire bonding, but also cools down the workpiece that has just been bonded to the lead wire, speeds up the forming efficiency of the solder joint, and improves the forming quality of the solder joint.

[0027] Furthermore, the support component includes:

[0028] Two straight rods are provided, and the straight rods are respectively set on both sides of the long base plate or the short base plate. One end of the straight rod is movably engaged with the long base plate or the short base plate, and the other end of the straight rod is fixedly connected to a half-circle gear. The bottom ends of the long push plate and the short push plate are provided with tooth grooves, and the long push plate or the short push plate meshes with the half-circle gear of the straight rod through the tooth grooves.

[0029] An arc rod, the arc rod being semi-circular in shape, with its two ends fixedly connected to the middle of two straight rods respectively.

[0030] Furthermore, the snap-fit ​​component includes:

[0031] A top plate, which is movably mounted on the top of the long push plate;

[0032] The bottom of the top plate is fixedly connected to two bottom rods. The long push plate has a first fixing hole at both ends, the long bottom plate has a second fixing hole at both ends, and the top of the workbench has a third fixing hole. The bottom rods pass through the first fixing hole and the second fixing hole and are movably engaged with the third fixing hole.

[0033] Therefore, by using a snap-fit ​​assembly to stably set the long base plate and the short base plate at the top of the worktable, the auxiliary mechanism can further limit and fix the workpiece to be processed, effectively improving the stability of the workpiece during processing and preventing the workpiece from moving when the lead wire breaks, which would cause the position of the lead wire to deviate and affect product quality.

[0034] Furthermore, it also includes a moving mechanism, which is provided above the worktable and located behind the limiting mechanism, for realizing the welding wires on the workpiece to be processed. The moving mechanism includes:

[0035] Two fixed columns are provided, and the two fixed columns are fixedly installed on both sides of the top of the workbench.

[0036] A fixed frame is provided between the two fixed columns, and the fixed frame is fixedly connected to the top of the fixed columns;

[0037] A spiral assembly is movably connected inside the fixed frame;

[0038] A fixing rod is fixedly connected inside the fixing frame located above and below the spiral assembly;

[0039] The horizontal component has its rear side wall fitted against the inner wall of the fixed frame, and its middle part threadedly connected to the spiral component. The upper and lower parts of the horizontal component are movably connected to the fixed rod.

[0040] The longitudinal component has its front wall surface movably connected to the rear wall surface of the transverse component.

[0041] A vertical component, wherein the front wall of the longitudinal component is movably connected to the rear wall of the vertical component;

[0042] A welding assembly is movably latched to the front of the vertical assembly. The welding assembly consists of an inlet rod, an outlet rod, and a welding head. The outer wall of the inlet rod is fixedly sleeved on the upper half of the vertical assembly, and the outer wall of the outlet rod is movably sleeved on the lower half of the vertical assembly. The bottom end of the inlet rod is movably sleeved with the top end of the outlet rod, and the lead wire enters from the top of the inlet rod and exits from the bottom of the outlet rod. The bottom end of the outlet rod is fixedly connected to a welding head.

[0043] A rotating assembly is fixedly connected to a vertical assembly, and the outer wall of the rotating assembly engages with the outer wall of the lead rod.

[0044] The beneficial effects of this invention are as follows:

[0045] This application provides a chip packaging wire bonding device. An auxiliary mechanism, composed of two long and two short auxiliary components, is installed at the top of the workpiece between the chip and its pins. The supporting components rotate to a vertical position under the action of the long and short push plates, causing the long and short top films to expand into semi-circular rings. This effectively supports the wires being bonded, ensuring a stable arc shape and preventing wire "collapse" when connecting two solder joints. The resulting solder joints achieve the required height and shape after solidification, effectively enhancing the electrical performance and mechanical strength of the workpiece and improving product quality.

[0046] By opening a limiting cavity and a limiting groove on the limiting plate, the workpiece and auxiliary mechanism are stably set inside the limiting plate. By setting an exhaust pipe inside the limiting plate and aligning the exhaust pipe with the end of the long auxiliary component, when the exhaust pipe discharges inert gas, the inert gas continuously moves inside the long and short auxiliary components, thereby inflating the long and short auxiliary components and providing thrust for the expansion of the long and short top films, thus ensuring sufficient support for the lead wire. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort:

[0048] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0049] Figure 2This is a three-dimensional structural diagram of the moving mechanism in this invention;

[0050] Figure 3 This is a three-dimensional structural diagram of the welding assembly and the rotating assembly located in the vertical component section of the present invention;

[0051] Figure 4 This is a three-dimensional structural diagram of the worktable, limiting mechanism, workpiece to be processed, and auxiliary mechanism in this invention;

[0052] Figure 5 This is a cross-sectional three-dimensional structural view of the worktable and limiting mechanism in this invention;

[0053] Figure 6 This is a three-dimensional structural diagram of the workpiece to be processed and the auxiliary mechanism in this invention;

[0054] Figure 7 This is a cross-sectional three-dimensional structural view of the workpiece to be processed and the auxiliary mechanism in this invention;

[0055] Figure 8 In this invention Figure 7 Enlarged structural diagram at point A;

[0056] Figure 9 This is a three-dimensional structural diagram of the part to be processed in this invention;

[0057] Figure 10 This is a three-dimensional structural diagram of the auxiliary mechanism in this invention;

[0058] Figure 11 This is a three-dimensional structural diagram of a long auxiliary component in this invention;

[0059] Figure 12 This is a three-dimensional structural diagram of a short auxiliary component in this invention;

[0060] Figure 13 This is a bottom-view three-dimensional structural diagram of the long top membrane and the short top membrane in this invention;

[0061] Figure 14 This is a three-dimensional structural diagram of the auxiliary mechanism in this invention that does not have a long top membrane and a short top membrane;

[0062] Figure 15 This is a three-dimensional structural diagram of the long base plate, short base plate, and support components in this invention;

[0063] Figure 16 In this invention Figure 15 Enlarged structural diagram at point B;

[0064] Figure 17 This is a bottom-view perspective view of the long push plate, short push plate, and support assembly in this invention.

[0065] Figure 18 In this invention Figure 17 Enlarged structural diagram at point C;

[0066] Figure 19 In this invention Figure 17 Enlarged structural diagram at point D.

[0067] In the diagram: 1. Workbench; 2. Moving mechanism; 21. Fixed column; 22. Fixed frame; 23. Spiral assembly; 24. Fixed rod; 25. Horizontal assembly; 26. Vertical assembly; 27. Vertical component; 28. Welding assembly; 280. Lead wire; 281. Inlet rod; 282. Outlet rod; 283. Welding head; 29. ​​Rotating assembly; 3. Limiting mechanism; 31. Limiting plate; 32. Lifting assembly; 33. Exhaust pipe ; 4. Workpiece to be processed; 41. Substrate; 42. Chip; 43. Pin; 5. Long auxiliary component; 51. Long base plate; 52. Long top film; 53. Long push plate; 531. Movable plate; 532. Movable block; 6. Short auxiliary component; 61. Short base plate; 62. Short top film; 63. Short push plate; 7. Support component; 71. Straight rod; 72. Arc rod; 8. Snap-fit ​​component; 81. Top plate; 82. Bottom rod; 9. Connecting rod. Detailed Implementation

[0068] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0069] Example 1: A chip packaging wire bonding apparatus, including a worktable 1, such as... Figure 1 , Figure 4 The workpiece 4 to be processed is placed on the top of the worktable 1. The workpiece 4 includes a substrate 41, such as... Figure 9 A chip 42 is disposed on the top of the substrate 41, and an equal number of pins 43 are disposed on the top of the substrate 41 on all four sides of the chip 42. After the workpiece 4 is wire bonded, one end of the lead 280 is soldered to the pin 43, and the other end of the lead 280 is soldered to the corresponding chip 42, thereby realizing the mechanical and electrical connection between the chip 42 and the pin 43. Thus, the workpiece 4 can be wire bonded on the worktable 1.

[0070] like Figure 1 , Figures 4-5 A limit mechanism 3 is provided above the workbench 1. The limit mechanism 3 includes a limit plate 31, such as... Figures 4-5A limiting cavity is provided in the middle of the limiting plate 31, and the limiting plate 31 is movably engaged with the workpiece 4 to be processed through the limiting cavity, which can limit and fix the workpiece 4 to be processed, ensuring the stability of the workpiece 4 to be processed during the wire bonding process. Limiting grooves are provided on the front and rear walls of the limiting cavity, and the limiting plate 31 is movably engaged with the long auxiliary component 5 through the limiting groove, which can limit and fix the long auxiliary component 5, and then limit and fix the short auxiliary component 6, ensuring the overall stability of the auxiliary mechanism during the wire bonding process. One end of the lifting component 32 is fixedly sleeved inside the worktable 1, and the other end of the lifting component 32 is fixedly sleeved inside the limiting plate 31. There are four lifting components 32, and the lifting components 32 are distributed at the four corners of the limiting plate 31. Thus, the lifting components 32 can realize the lifting and lowering of the limiting plate 31. That is, when the lifting components 32 are activated to raise the limiting plate 31, the workpiece 4 to be processed can be easily installed or removed. When the lifting components 32 are activated to lower the limiting plate 31, the workpiece 4 to be processed can be limited and fixed.

[0071] like Figures 1-3 A moving mechanism 2 is provided above the workbench 1, and the moving mechanism 2 is located behind the limiting mechanism 3. It is used to realize the welding wire of the workpiece 4 to be processed. The moving mechanism 2 includes a fixed column 21, such as Figure 2 There are two fixed posts 21, which are fixedly installed on both sides of the top of the workbench 1. A fixed frame 22 is provided between the two fixed posts 21 and is fixedly connected to the top of the fixed posts 21. A spiral assembly 23 is movably connected inside the fixed frame 22. A fixed rod 24 is fixedly connected inside the fixed frame 22 located above and below the spiral assembly 23. The rear side wall of the transverse assembly 25 is in contact with the inner wall of the fixed frame 22, and the middle part of the transverse assembly 25 is threadedly connected to the spiral assembly 23. The upper and lower parts of the transverse assembly 25 are movably connected to the fixed rod 24. When the spiral assembly 23 is activated, the rotation of the spiral assembly 23 can drive the transverse assembly 25 to move horizontally along the fixed frame 22. The fixed rod 24 can improve the stability of the transverse assembly 25 during movement. Figure 3The front wall of the transverse component 25 is movably connected to the rear wall of the longitudinal component 26. A longitudinal telescopic device is provided inside the transverse component 25 to push the longitudinal component 26 to move longitudinally along the transverse component 25. The front wall of the longitudinal component 26 is movably connected to the rear wall of the vertical component 27. A vertical telescopic device is provided inside the longitudinal component 26 to push the vertical component 27 to move vertically along the longitudinal component 26. A welding component 28 is movably engaged on the front side of the vertical component 27. The welding component 28 consists of an inlet rod 281, an outlet rod 282, and a welding head 283. The outer wall of the inlet rod 281 is fixedly sleeved on the upper half of the vertical component 27, and the outer wall of the outlet rod 282 is movably sleeved on the lower half of the vertical component 27. The bottom end of the inlet rod 281 is connected to the outlet rod 282. The top of the rod is movably connected, and the lead wire 280 passes through the top of the inlet rod 281 and exits through the bottom of the outlet rod 282. The welding assembly 28 can push the lead wire 280 to move continuously downward, so as to continuously provide the lead wire 280 for connecting the pin 43 and the chip 42. The bottom end of the outlet rod 282 is fixedly connected to the welding head 283. When the lead wire 280 moves to the solder point position, the welding head 283 can melt and cut the lead wire 280 and weld the lead wire 280 at that position. The rotating assembly 29 is fixedly connected to the vertical assembly 27, and the outer wall of the rotating assembly 29 meshes with the outer wall of the outlet rod 282. When the rotating assembly 29 is started and rotated, it can drive the outlet rod 282 to rotate, thereby rotating the welding head 283, so as to achieve precise welding of the lead wire 280 by the welding assembly 28.

[0072] like Figure 4 , Figure 6 , Figure 10 An auxiliary mechanism is movably mounted on the workpiece 4. The auxiliary mechanism is composed of two long auxiliary components 5 and two short auxiliary components 6. The two long auxiliary components 5 and the two short auxiliary components 6 are parallel to each other. The length of the short auxiliary components 6 is shorter than that of the long auxiliary components 5. The two short auxiliary components 6 are movably mounted between the two long auxiliary components 5. When no wire is being bonded, the long auxiliary components 5 and the short auxiliary components 6 are in a flat, contracted state. When wire is being bonded, the long auxiliary components 5 and the short auxiliary components 6 are in a convex, expanded state. The cross-sectional shape of the long auxiliary components 5 and the short auxiliary components 6 is semi-cylindrical, which can provide support for the arc-shaped movement of the lead wire 280 and effectively limit the welding shape of the lead wire 280, thereby achieving stable wire bonding to the workpiece 4.

[0073] The long auxiliary component 5 includes a long base plate 51, such as Figures 6-8 The middle portion of the long base plate 51 is movably placed on the substrate 41, and the middle portion of the long base plate 51 is located between the chip 42 and the pin 43, which helps to stably connect the lead 280 to the solder joints on the chip 42 and the pin 43. Figure 4The two ends of the long base plate 51 are movably engaged with the limiting grooves of the limiting plate 31, and the length of the long base plate 51 is equal to the length between the two oppositely positioned limiting grooves, which can stably set the long base plate 51. Figure 11 , Figures 14-16 The long base plate 51 has a concave cross-sectional shape and is made of a rigid material, which facilitates its subsequent removal from between the chip 42 and the pin 43. Figure 11 , Figure 13 The top two sides of the long base plate 51 located above the substrate 41 are fixedly connected to the two ends of the long top film 52. The long top film 52 is a flexible material, which allows it to change its state as needed. When the long top film 52 is supported and expands, it forms an arc-shaped semi-circular ring, providing support for the movement and placement of the lead 280. This makes the arc shape formed by the lead 280 more stable and the shape of the solder joint more complete when it solidifies, thereby effectively enhancing the electrical performance and mechanical strength of the workpiece 4 and improving product quality. When the long top film 52 is unsupported and contracts, it flattens and lies flat on the long base plate 51, so that the long top film 52 no longer contacts the lead 280. This facilitates the subsequent removal of the long top film 52 from between the chip 42 and the pin 43 by the long base plate 51. Figure 11 , Figure 14 A long push plate 53 is movably engaged at the top center of the long base plate 51. The length of the long push plate 53 is shorter than that of the long base plate 51, but longer than that of the long top membrane 52. This allows the long push plate 53 to move freely on the long base plate 51 and also enables it to control and influence the long top membrane 52 at all times. Figure 17 The long push plate 53 consists of a movable plate 531 and two movable blocks 532. The movable blocks 532 are fixedly connected to the bottom surfaces of both ends of the movable plate 531, and the bottom surfaces of the movable blocks 532 contact the inner bottom surface of the long base plate 51. The movable blocks 532 effectively lift the movable plate 531, thus facilitating subsequent connection with the support assembly 7. The width of the movable plate 531 is shorter than the inner width of the long base plate 51, and the width of the movable blocks 532 is adapted to the inner width of the long base plate 51. This ensures that the long push plate 53 is stably positioned on the long base plate 51 using the movable blocks 532, while also allowing the long push plate 53 to move flexibly on the long base plate 51. Figure 11 , Figures 14-18 A support component 7 is movably engaged on the long bottom plate 51 located inside the long top membrane 52, and the support component 7 corresponds one-to-one with the pin 43 to support the long top membrane 52, so that the long top membrane 52 expands into a semi-circular ring.

[0074] The short auxiliary component 6 includes a short base plate 61, such as Figures 6-8A short base plate 61 is placed on the substrate 41 and is located between the chip 42 and the pin 43. This short base plate 61 helps to stably connect the lead 280 to the solder joints on the chip 42 and the pin 43. Figure 10 The two ends of the short base plate 61 are fitted against the outer wall of the long base plate 51, and the length of the short base plate 61 is shorter than that of the long base plate 51, so that the two long base plates 51 can clamp and fix the short base plate 61, thereby ensuring the stability of the short base plate 61. Figure 12 , Figures 14-16 The short base plate 61 has a concave cross-sectional shape and is made of a rigid material, which facilitates its subsequent removal from between the chip 42 and the pin 43. Figures 12-13 The top two sides of the short base plate 61 are fixedly connected to both ends of the short top membrane 62. The short top membrane 62 is made of flexible material, allowing it to change its state as needed. Its function is the same as that of the long top membrane 52. The side wall of the long top membrane 52 has connecting holes, and the long top membrane 52 communicates with the short top membrane 62 through the connecting holes. This allows the inert gas in the long auxiliary component 5 to be transferred to the short auxiliary component 6, achieving synchronous operation of the long auxiliary component 5 and the short auxiliary component 6 on the workpiece 4 to be processed. Figure 12 , Figure 14 , Figure 17 A short pusher plate 63 is movably engaged at the top center of the short base plate 61. The length of the short pusher plate 63 is longer than that of the short base plate 61, while the width of the short pusher plate 63 is shorter than that of the short base plate 61. This allows the short pusher plate 63 to move freely on the short base plate 61 and also enables the short pusher plate 63 to control and influence the short top membrane 62 at all times. Figure 8 Both ends of the short push plate 63 pass through the connecting holes and are fitted with the long push plate 53, and the bottom surface of the short push plate 63 is fitted with the top surface of the long base plate 51. Therefore, when the long auxiliary component 5 and the short auxiliary component 6 are spliced, the long base plate 51 and the long push plate 53 can be used to limit and fix the short push plate 63, ensuring that the short push plate 63 is stably set on the short base plate 61. Figure 12 , Figures 14-18 A support component 7 is movably snapped onto a short bottom plate 61 located inside the short top membrane 62, and the support component 7 corresponds one-to-one with the pin 43 to support the short top membrane 62, so that the short top membrane 62 expands into a semi-circular ring.

[0075] Support component 7 includes a straight rod 71, such as Figure 8 , Figures 14-18There are two straight rods 71, which are respectively set on both sides of the long base plate 51 or the short base plate 61. One end of the straight rod 71 is movably engaged with the long base plate 51 or the short base plate 61, and the other end of the straight rod 71 is fixedly connected to a half-circle gear. The bottom ends of the long push plate 53 and the short push plate 63 are both provided with tooth grooves, and the long push plate 53 or the short push plate 63 meshes with the half-circle gear of the straight rod 71 through the tooth grooves. The arc rod 72 is semi-circular in shape, and the two ends of the arc rod 72 are respectively connected to the middle of the two straight rods 71. The connection is fixed. The long push plate 53 and the short push plate 63 can drive the straight rod 71 to rotate, thereby rotating the arc rod 72 to different states. The arc rod 72 is turned into a vertical state to support the connecting rod 9, thereby driving the long top film 52 and the short top film 62 to be supported and expanded, so as to help the lead wire 280 to be welded. It should be noted that the condition for the arc rod 72 to be in a vertical state can be set to the end of the half-circle gear of the straight rod 71 meshing with the end of the tooth groove, so that the operator can easily control the state of the arc rod 72.

[0076] In Embodiment 2, based on Embodiment 1, the long auxiliary component 5 further includes a snap-fit ​​component 8, such as... Figure 11 Both ends of the long push plate 53 are movably engaged with snap-fit ​​components 8, and the snap-fit ​​components 8 pass through the long base plate 51 to stably fix the long push plate 53 onto the long base plate 51. The snap-fit ​​components 8 include a top plate 81, such as... Figure 17 , Figure 19 The top plate 81 is movably mounted on the top of the long push plate 53. Two bottom rods 82 are fixedly connected to the bottom of the top plate 81. The long push plate 53 has a first fixing hole at both ends, the long bottom plate 51 has a second fixing hole at both ends, and the worktable 1 has a third fixing hole at the top. The bottom rods 82 pass through the first fixing hole, the second fixing hole, and are movably engaged with the third fixing hole. This not only allows the long push plate 53 to be fixed on the long bottom plate 51 using the engaging component 8, ensuring the limiting and fixing effect of the long push plate 53 and the short push plate 63 on the support component 7, but also allows the engaging component 8 to simultaneously fix the long push plate 53 and the long bottom plate 51 on the worktable 1, ensuring the stability of the long auxiliary component 5 and the short auxiliary component 6 on the worktable 1. This improves the stability of the workpiece 4 during processing and prevents the workpiece 4 from moving when the lead wire 280 breaks, thus preventing deviation in the position of the lead wire 280 and affecting product quality.

[0077] In embodiment three, based on embodiment one, the limiting mechanism 3 further includes an exhaust pipe 33, such as... Figure 5An exhaust pipe 33 is fixedly sleeved inside the limiting plate 31, and the number of exhaust pipes 33 is equal to the number of limiting grooves of the limiting plate 31. One end of the exhaust pipe 33 is fixedly connected to the limiting groove of the limiting plate 31, and the other end of the exhaust pipe 33 is fixedly connected to the air supply box (not shown). Inert gas can be sprayed into the limiting groove through the exhaust pipe 33, which can not only provide inert protection for the workpiece 4 that is undergoing wire bonding operation to prevent metal oxidation, but also cool down the workpiece 4 that has just been welded to the lead wire 280, accelerate the forming efficiency of the weld point, and improve the forming quality of the weld point.

[0078] The long auxiliary component 5 and the short auxiliary component 6 also include a connecting rod 9, such as Figure 13 Both the long top film 52 and the short top film 62 have arc holes in their middle sections, and the two ends of the arc holes are connected by connecting rods 9. Each arc hole corresponds to a set of connecting rods 9, and each connecting rod 9 corresponds one-to-one with the pin 43, so that a set of connecting rods 9 can act on a lead wire 280, ensuring the stability of the lead wire 280 during welding. There are several sets of connecting rods 9, and several connecting rods 9 are evenly arranged around the arc holes. The total diameter of a set of connecting rods 9 is shorter than the internal width of the long base plate 51 and the short base plate 61. When the long top film 52 is unsupported, the connecting rods 9 can drive the long top film 52 to fall and lay flat on the top of the long base plate 51, so that the long top film 52 is as flat as possible, making it convenient for the subsequent auxiliary mechanism to pull it out from the workpiece 4. Therefore, due to the arc holes and connecting rods 9 set on the long auxiliary component 5 and the short auxiliary component 6, the inert gas can be accurately vented, thereby quickly shaping the solder joint formed by the lead wire 280, further accelerating the forming efficiency of the solder joint and improving the forming quality of the solder joint.

[0079] The working principle of the method of using this invention is as follows:

[0080] When preparing for wire bonding, the workpiece 4 is first placed on the top of the worktable 1. Then, two long auxiliary components 5 and two short auxiliary components 6 are placed on the workpiece 4, with the two long base plates 51 and the two short base plates 61 arranged in parallel, and the two short base plates 61 are locked between the two long base plates 51. Then, the short push plate 63 is pushed, causing the short push plate 63 to control the support component 7 to rotate into a vertical state, thereby allowing the support component 7 to support the connecting rod 9 and making the short top film 62 into a semi-circular ring. Then, the long push plate 53 is pushed, causing the long push plate 53 to control the support component 7 to rotate into a vertical state, thereby allowing the support component 7 to support the connecting rod 9 and making the long top film 52 into a semi-circular ring. Next, the locking component 8 is used to fix the long base plate 51 and the long push plate 53 on the worktable 1. Finally, the lifting component 32 is activated to control the limit plate 31 to descend, thereby limiting and fixing the workpiece 4. In summary, the auxiliary mechanism changes shape and is set in a semi-cylindrical shape between the chip 42 and the pin 43, which helps to stabilize the wire bonding.

[0081] During wire bonding, the spiral assembly 23 is activated to control the lateral movement of the transverse assembly 25, the transverse assembly 25 is activated to control the longitudinal movement of the longitudinal assembly 26, the longitudinal assembly 26 is activated to control the vertical movement of the vertical assembly 27, and the rotation assembly 29 is activated to control the rotation of the bonding assembly 28. This allows the bonding assembly 28 to move the lead 280 in all directions. During this process, the bonding assembly 28 moves the lead 280 above the pin 43, then presses the end of the lead 280 onto the pin 43, bonding one end of the lead 280 to the pin 43, forming the first solder joint. Afterward, the bonding assembly 28 moves the lead 280 above the chip 42, then disconnects the lead 280 and presses it onto the chip 42, bonding the other end of the lead 280 to the chip 42. On chip 42, a second solder joint is formed. During this process, lead 280 moves along the top of connecting rod 9, thereby providing sufficient support for lead 280 being soldered by connecting rod 9. This ensures that the shape formed by lead 280 is a stable arc, preventing lead "collapse" when connecting two solder joints. This ensures that the height and shape of the solder joint after solidification meet the requirements, effectively enhancing the electrical performance and mechanical strength of the workpiece 4 and improving product quality. At the same time, exhaust pipe 33 continuously supplies inert gas into long auxiliary component 5 and short auxiliary component 6, and the slowly moving inert gas is discharged outward through the arc hole. This not only effectively prevents metal oxidation during wire bonding but also cools down the workpiece 4 that has just been soldered to lead 280, accelerating the solder joint forming efficiency and improving the solder joint forming quality.

[0082] When the wire bonding is finished, the lifting assembly 32 is activated to control the limit plate 31 to rise, and then the snap-fit ​​assembly 8 is removed from the long base plate 51 and the long push plate 53. Then, the long push plate 53 is pulled to deflect the support assembly 7, and the long top film 52 becomes flat without support. At this time, the long auxiliary assembly 5 can be pulled out from between the chip 42 and the pin 43. Then, the short push plate 63 is pulled to deflect the support assembly 7, and the short top film 62 becomes flat without support. At this time, the short auxiliary assembly 6 can be pulled out from between the chip 42 and the pin 43. Thus, the workpiece 4 to be processed completes the wire bonding operation.

[0083] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip packaging wire bonding device, characterized in that, include: The workpiece to be processed (4) includes a substrate (41), a chip (42) and pins (43). The top of the substrate (41) is provided with a chip (42), and the top of the substrate (41) on all four sides of the chip (42) is provided with an equal number of pins (43). The workbench (1) is placed on top of the workbench (1) to provide processing space for the workpiece (4); A limiting mechanism (3) is provided above the worktable (1) to limit and fix the workpiece (4); An auxiliary mechanism is movably mounted on the workpiece (4) to be processed. The auxiliary mechanism is composed of two long auxiliary components (5) and two short auxiliary components (6). The two long auxiliary components (5) are parallel to each other, and the two short auxiliary components (6) are parallel to each other. The length of the short auxiliary components (6) is shorter than the length of the long auxiliary components (5). The two short auxiliary components (6) are movably mounted between the two long auxiliary components (5). When no wire bonding is performed, the long auxiliary components (5) and the short auxiliary components (6) are in a flat, contracted state. When wire bonding is performed, the long auxiliary components (5) and the short auxiliary components (6) are in a convex, expanded state. The cross-sectional shape of the long auxiliary components (5) and the short auxiliary components (6) is semi-cylindrical, which helps to achieve stable wire bonding of the workpiece (4). The long auxiliary component (5) includes: A long base plate (51) is movably placed on a substrate (41) at its center, and the center of the long base plate (51) is located between the chip (42) and the pin (43). The long top film (52) is fixedly connected to the two ends of the long bottom plate (51) above the substrate (41), and the long top film (52) is made of flexible material. The long push plate (53) is movably connected to the middle of the top of the long bottom plate (51). The support component (7) is movably snapped onto the long bottom plate (51) inside the long top membrane (52), and the support component (7) corresponds one-to-one with the pin (43) to support the long top membrane (52). The short auxiliary component (6) includes: A short base plate (61) is placed on a substrate (41) and is located between a chip (42) and a pin (43). The two ends of the short base plate (61) are attached to the outer wall of a long base plate (51). The short top membrane (62) has its top two sides fixedly connected to the two ends of the short bottom plate (61), and the short top membrane (62) is made of flexible material. The side wall of the long top membrane (52) is provided with a connecting hole, and the long top membrane (52) is connected to the short top membrane (62) through the connecting hole. A short push plate (63) is movably attached to the top center of the short base plate (61). The two ends of the short push plate (63) pass through the connecting holes and are attached to the long push plate (53). The bottom surface of the short push plate (63) is attached to the top surface of the long base plate (51). The support component (7) is movably snapped onto the short bottom plate (61) inside the short top membrane (62), and the support component (7) corresponds one-to-one with the pin (43) to support the short top membrane (62). The support component (7) includes: Two straight rods (71) are provided, and the straight rods (71) are respectively set on both sides of the long base plate (51) or the short base plate (61). One end of the straight rod (71) is movably engaged with the long base plate (51) or the short base plate (61), and the other end of the straight rod (71) is fixedly connected to a half-circle gear. The bottom ends of the long push plate (53) and the short push plate (63) are provided with tooth grooves, and the long push plate (53) or the short push plate (63) meshes with the half-circle gear of the straight rod (71) through the tooth grooves. The arc rod (72) is semi-circular in shape, and the two ends of the arc rod (72) are fixedly connected to the middle of the two straight rods (71).

2. The chip packaging wire bonding apparatus according to claim 1, characterized in that, The limiting mechanism (3) includes: A limiting plate (31) is provided in the middle of the limiting plate (31), and the limiting plate (31) is movably engaged with the workpiece (4) through the limiting cavity. The front and rear walls of the limiting cavity are provided with limiting grooves, and the limiting plate (31) is movably engaged with the long auxiliary component (5) through the limiting grooves. The lifting assembly (32) has one end fixedly connected to the inside of the worktable (1) and the other end fixedly connected to the inside of the limiting plate (31). The number of the lifting assemblies (32) is four, and the lifting assemblies (32) are distributed at the four corners of the limiting plate (31). The exhaust pipe (33) is fixedly sleeved inside the limiting plate (31), and the number of exhaust pipes (33) is equal to the number of limiting grooves of the limiting plate (31). One end of the exhaust pipe (33) is fixedly connected to the limiting groove of the limiting plate (31), and the other end of the exhaust pipe (33) is fixedly connected to the air supply box.

3. The chip packaging wire bonding apparatus according to claim 2, characterized in that, The long auxiliary component (5) also includes: The two ends of the long base plate (51) are movably engaged with the limiting groove of the limiting plate (31), and the length of the long base plate (51) is equal to the length between the two limiting grooves that are set opposite to each other. The cross-sectional shape of the long base plate (51) is "U" shaped, and the long base plate (51) is made of hard material. The length of the long push plate (53) is shorter than that of the long bottom plate (51), and the length of the long push plate (53) is longer than that of the long top film (52). The long push plate (53) is composed of a movable plate (531) and a movable block (532). There are two movable blocks (532), and the movable blocks (532) are fixedly connected to the bottom surfaces of both ends of the movable plate (531). The bottom surface of the movable block (532) is in contact with the inner bottom surface of the long bottom plate (51). The width of the movable plate (531) is shorter than the inner width of the long bottom plate (51), and the width of the movable block (532) is adapted to the inner width of the long bottom plate (51). The snap-fit ​​assembly (8) is movably snapped onto both ends of the long push plate (53), and the snap-fit ​​assembly (8) passes through the long base plate (51) to stably fix the long push plate (53) onto the long base plate (51).

4. The chip packaging wire bonding apparatus according to claim 3, characterized in that, The short auxiliary component (6) also includes: The short base plate (61) is shorter than the long base plate (51), the cross-sectional shape of the short base plate (61) is "U" shaped, and the short base plate (61) is made of hard material; The length of the short push plate (63) is longer than that of the short bottom plate (61), and the width of the short push plate (63) is shorter than that of the short bottom plate (61).

5. The chip packaging wire bonding apparatus according to claim 4, characterized in that, Both the long top membrane (52) and the short top membrane (62) have arc holes in their middle parts, and the two ends of the arc holes are connected by connecting rods (9). One arc hole corresponds to a set of connecting rods (9), and the connecting rods (9) correspond one-to-one with the pins (43). There are several sets of connecting rods (9), and several connecting rods (9) are evenly arranged around the arc holes. The total diameter of a set of connecting rods (9) is shorter than the internal width of the long bottom plate (51) and the short bottom plate (61).

6. The chip packaging wire bonding apparatus according to claim 5, characterized in that, The snap-fit ​​assembly (8) includes: Top plate (81), which is movably disposed at the top of the long push plate (53); The bottom rod (82) is fixedly connected to the bottom end of the top plate (81). The long push plate (53) has a first fixing hole at both ends, the long bottom plate (51) has a second fixing hole at both ends, and the top of the workbench (1) has a third fixing hole. The bottom rod (82) passes through the first fixing hole and the second fixing hole and is movably engaged with the third fixing hole.

7. The chip packaging wire bonding apparatus according to claim 1, characterized in that, It also includes a moving mechanism (2), which is provided above the worktable (1) and is located behind the limiting mechanism (3) to realize the welding wire of the workpiece (4). The moving mechanism (2) includes: Fixed column (21), the number of fixed columns (21) is two, and the two fixed columns (21) are fixedly installed on both sides of the top of the workbench (1); A fixed frame (22) is provided between the two fixed posts (21), and the fixed frame (22) is fixedly connected to the top of the fixed post (21); The spiral assembly (23) is movably connected inside the fixed frame (22); The fixing rod (24) is fixedly connected inside the fixing frame (22) located above and below the spiral assembly (23); The rear side wall of the horizontal component (25) is fitted with the inner wall of the fixed frame (22), and the middle part of the horizontal component (25) is threadedly connected to the spiral component (23). The upper and lower parts of the horizontal component (25) are movably connected to the fixed rod (24). The longitudinal component (26) has its front wall surface movably connected to the rear wall surface of the transverse component (25); The vertical component (27) is movably connected to the rear wall of the longitudinal component (26); Welding assembly (28) is movably snapped onto the front side of the vertical assembly (27). The welding assembly (28) consists of an inlet rod (281), an outlet rod (282), and a welding head (283). The outer wall of the inlet rod (281) is fixedly sleeved on the upper half of the vertical assembly (27), and the outer wall of the outlet rod (282) is movably sleeved on the lower half of the vertical assembly (27). The bottom end of the inlet rod (281) is movably sleeved with the top end of the outlet rod (282). The lead wire (280) passes through the top of the inlet rod (281) and exits through the bottom of the outlet rod (282). The bottom end of the outlet rod (282) is fixedly connected to the welding head (283). Rotating component (29) is fixedly connected to vertical component (27), and the outer wall of rotating component (29) engages with the outer wall of lead rod (282).

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