A uniform temperature controlled dry etching machine

By designing the combined structure of the scraping device, the problem of incomplete cleaning of the photoresist on the edge of the circular crystal is solved, the photoresist is completely removed, the stability of the etching process and the uniformity of the photolithography machine are ensured, and the service life of the scraper is extended.

CN120300028BActive Publication Date: 2025-09-26XINLI SEMI CO LTD
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Patent Information

Application Number
CN202510503541.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-22
Publication Date
2025-09-26
Estimated Expiration
2045-04-22

AI Technical Summary

Technical Problem

When etching round crystals, the existing uniform temperature-controlled dry etcher does not completely clean the photoresist at the edge of the round crystal, causing the photoresist to crack and fall off during etching, affecting the focal plane setting and exposure uniformity of the photoetcher.

Method used

A scraping device was designed, which included an L-shaped rod, a limiting circular block, a scraper, a U-shaped block, a triangular block and other components. The scraper was moved along the edge of the circular crystal by the control of a robotic arm to clean the photoresist. The scraper was replaced and supported and guided by bolts to ensure the complete removal of the photoresist.

Benefits of technology

It effectively avoids the cracking and falling off of the photoresist during etching, ensures that the photoresist on the edge of the round crystal is thoroughly cleaned, avoids the problem of uneven focal plane setting of the photolithography machine, and at the same time extends the service life of the scraper and prevents sticking.

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Abstract

The present invention discloses a uniform temperature-controlled dry etching machine, which relates to the field of semiconductor etching technology. The present invention comprises a workbench, the inner wall of the workbench is fixedly connected to a hydraulic rod, the telescopic end of the hydraulic rod is fixedly connected to a placement block, the top of the workbench is fixedly connected to a fixed frame, the inner wall of the fixed frame is fixedly connected to a protective cover, the top of the inner wall of the protective cover is fixedly connected to a plasma manufacturing module, and the outer wall of the protective cover is provided with a temperature control device for uniform temperature control. The present invention cooperates with an L-shaped rod, a limiting circular block, a spring, an interference circular block, a scraper, a U-shaped block, and a triangular block to move the scraper along the edge of a circular crystal. The movement of the scraper will clean up the photoresist at the edge of the circular crystal, thereby preventing the photoresist from cracking during etching and then falling off, which will affect the focal plane setting of the photolithography machine and cause uneven exposure of the area near the edge of the circular crystal.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor etching, in particular to a uniform temperature-controlled dry etcher. Background Art

[0002] A uniform temperature-controlled dry etcher is a device used in semiconductor manufacturing. It performs dry etching by precisely controlling temperature and atmosphere. It etches the material surface using reactive gases in a high vacuum environment while maintaining temperature uniformity, ensuring high precision and stability during the etching process. This equipment is commonly used in the manufacture of microelectronics and integrated circuits, effectively improving etching quality and production efficiency.

[0003] The Chinese patent with patent announcement number CN118448315B discloses a uniform temperature-controlled dry etcher, including a workbench, a mirror-imaged fixed frame fixed on the upper side of the workbench, a connecting frame fixed on the upper side of the mirror-imaged fixed frame, a fixed cover fixed on the inner side of the fixed cover is provided with a plasma manufacturing module, the mirror-imaged fixed frames are all slidably connected to electric sliders, a slide is fixed between the mirror-imaged electric sliders, the upper side of the slide is slidably and rotatably connected to a first sliding rod, the first sliding rod is used to provide support for the silicon wafer, the patent shortens the distance between the silicon wafer and the plasma manufacturing module in time according to the changes in the exhaust gas in the etching chamber, so that the silicon wafer is in a temperature range required for work in time, changes the temperature around the silicon wafer in a passive manner, and keeps the silicon wafer stable when being etched, thereby achieving temperature control of the silicon wafer.

[0004] However, the current etcher has the following problems: when the etcher etches the circular crystal, the photoresist at the edge of the circular crystal is not cleaned up, which will cause the photoresist to crack during etching and then fall off, thereby affecting the focal plane setting of the photolithography machine and causing uneven exposure of the area near the edge of the circular crystal. Therefore, we proposed a uniform temperature-controlled dry etcher. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention provides a uniform temperature-controlled dry etching machine, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a uniform temperature-controlled dry etching machine, comprising a workbench, the inner wall of the workbench is fixedly connected to a hydraulic rod, the telescopic end of the hydraulic rod is fixedly connected to a placement block, the top of the workbench is fixedly connected to a fixing frame, the inner wall of the fixing frame is fixedly connected to a protective cover, the top of the inner wall of the protective cover is fixedly connected to a plasma manufacturing module, the outer wall of the protective cover is provided with a temperature control device for uniform temperature control, the side of the workbench is fixedly connected to a control panel, and the side of the workbench is provided with a There is a mechanical arm, a scraping device is provided on the side of the workbench, the scraping device includes a fixed block, the side of the fixed block is fixedly connected to the side of the workbench, the side of the fixed block passes through and slides with an L-shaped rod, one end of the L-shaped rod is fixedly connected to a limited circular block, a spring is provided between the limited circular block and the fixed block, the top of the L-shaped rod is fixedly connected to a resisting circular block, the outer wall of the L-shaped rod is slidably connected to a scraper, the outer wall of the rotating shaft of the mechanical arm is fixedly connected to a connecting long plate, the bottom of the connecting long plate is fixedly connected to a triangular block, through the control panel The adsorption ring of the driving robot arm places the round crystal on the placement block, and then drives the hydraulic rod through the control panel. The hydraulic rod pushes the placement block into the protective cover, and then starts the temperature control device through the control panel. The temperature control device can control the temperature inside the protective cover to ensure the stability of the temperature inside the protective cover. When the adsorption ring drives the round crystal to move in the direction of the placement block, the movement of the adsorption ring will drive the rotating shaft of the robot arm to move, and the movement of the rotating shaft drives the connecting long plate to move, and the movement of the connecting long plate drives the triangle block to move, and the triangle block During the movement, the sharp corner will first collide with the two conflicting round blocks, and at the same time, the scraper will collide with the edge of the circular crystal. When the triangular block continues to move, the two conflicting round blocks will be moved along the two sides of the triangular block to the two sides of the robotic arm adsorption ring. The movement of the two conflicting round blocks will push the L-shaped rod to move along the inner wall of the fixed block. The movement of the L-shaped rod will drive the limit round block to move. The movement of the limit round block will stretch the spring. The movement of the limit round block will drive the U-shaped block to move. The movement of the U-shaped block will drive the bolt to move, so the bolt and the L-shaped rod will cooperate.

[0007] According to the above technical solution, the scraping device further comprises a U-shaped block, the outer wall of which is threadedly connected to two bolts, which can be screwed at the same time so that the bolts no longer press tightly against the scraper.

[0008] According to the above technical solution, the inner wall of the U-shaped block is fixedly connected to the track block, and the inner wall of the track groove of the track block is in contact with the bottom of the scraper. When the scraper moves through the U-shaped block to the high-risk L-shaped rod, the track block will form a supporting and guiding effect on the scraper.

[0009] According to the above technical solution, the abutting circular block is located on the displacement track of the triangular block, and both of the two bolts are in contact with the scraper.

[0010] The top of the said frictional block is provided with an anti-secondary pollution device, and the said anti-secondary pollution device comprises a vertical rod, the bottom of the said vertical rod is fixedly connected to the top of the said frictional block, the top of the said frictional block is fixedly connected to the support frame, the top of the said vertical rod is fixedly connected to the bottom of the inner wall of the support frame, the outer wall of the said vertical rod is slidably connected to a convex plate, a spring 2 is provided between the said convex plate and the support frame, the bottom of the said convex plate is fixedly connected to the frictional arc block, the side of the said frictional arc block is fixedly connected to a connecting rod, the bottom of the said connecting rod is fixedly connected to a J-shaped push block, the outer wall of the rotating shaft of the said robot arm is fixedly connected to a cross rod, the end of the said cross rod away from the robot arm is fixedly connected to a limiting block, the outer wall of the said cross rod is slidably connected to a long plate, and a spring is provided between the said long plate and the limiting block. When the long plate no longer contacts the resistance arc block, spring two drives the convex plate to reset through its own elastic force, and the resetting of the convex plate drives the resistance arc block, the connecting rod and the J-shaped push block to move downward.

[0011] According to the above technical solution, the upper side of the long plate is set as an arc surface, and the arc surface of the arc block is located on the displacement track of the arc surface of the long plate.

[0012] According to the above technical solution, a long placement groove is provided at the bottom of the abutting circular block, and the long placement groove is located on the displacement track of the J-shaped push block.

[0013] According to the above technical solution, the J-shaped push block is in contact with the scraper, and the long plate is in contact with the adsorption ring of the robot arm.

[0014] The present invention provides a uniform temperature-controlled dry etching machine, which has the following beneficial effects:

[0015] (1) The present invention enables the scraper to move along the edge of the round crystal through the cooperation of the L-shaped rod, the limiting circular block, the spring, the resisting circular block, the scraper, the U-shaped block, and the triangular block. The movement of the scraper will clean the photoresist on the edge of the round crystal, thereby preventing the photoresist from cracking during etching and then falling off, which will affect the focal plane setting of the photolithography machine and cause uneven exposure of the area near the edge of the round crystal; at the same time, through the cooperation of the scraper, the U-shaped block, and the bolt, the bolt is turned so that the bolt no longer presses the scraper tightly, and then the scraper can be replaced, thereby avoiding the problem of the scraper surface becoming sticky due to long-term use; at the same time, through the cooperation of the mechanical arm and the scraper, when the scraper moves on the edge of the round crystal, the adsorption ring of the mechanical arm will be controlled by the control panel to rotate, and the rotation of the adsorption ring will drive the round crystal to rotate, so that the edge of the round crystal is completely scraped by the scraper, thereby ensuring that the edge of the round crystal will not be missed.

[0016] (2) The present invention cooperates with the track block scraper, U-shaped block and triangular block so that when the scraper moves through the U-shaped block to the L-shaped rod at a high risk, the track block will form a support and guiding effect on the scraper, thereby ensuring that the scraper can be accurately moved to a fixed position.

[0017] (3) The present invention cooperates with the convex plate, spring 2, the resistance arc block, the connecting rod, the J-shaped push block, the cross bar, the limiting block, the long plate, spring 3, and the placement length, so that the spring 2 can drive the convex plate to reset by its own elastic force, and the reset of the convex plate will drive the resistance arc block, the connecting rod and the J-shaped push block to move downward. The downward movement of the J-shaped push block will push off the photoresist adhered to the scraper surface, thereby preventing the photoresist on the scraper surface from adhering to the edge of the next round crystal; at the same time, through the cooperation of the J-shaped push block and the scraper, the sharp hook of the J-shaped push block limits the scraper, thereby ensuring that the scraper can be completely fitted with the J-shaped push block. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the present invention as a whole;

[0019] Figure 2 This is a structural diagram of the plasma manufacturing module of the present invention;

[0020] Figure 3 This is a structural diagram of the mechanical arm of the present invention;

[0021] Figure 4 This is a structural diagram of the fixing block of the present invention;

[0022] Figure 5 This is a schematic structural diagram of the scraper of the present invention;

[0023] Figure 6 This is a schematic diagram of the structure of the L-shaped rod of the present invention;

[0024] Figure 7 This is a schematic diagram of the structure of the convex plate of the present invention;

[0025] Figure 8 It is a structural schematic diagram of the cross bar of the present invention.

[0026] In the figure: 1. Workbench; 2. Hydraulic rod; 3. Placement block; 4. Fixed frame; 5. Protective cover; 6. Temperature control device; 7. Control panel; 8. Scraping device; 81. Fixed block; 82. L-shaped rod; 83. Limiting round block; 84. Spring 1; 85. Interference round block; 86. Scraper; 87. U-shaped block; 88. Bolt; 89. Triangular block; 891. Connecting long plate; 810. Track block; 9. Anti-secondary pollution device; 91. Vertical rod; 92. Support frame; 93. Convex plate; 94. Spring 2; 95. Interference arc block; 96. Connecting rod; 97. J-shaped push block; 98. Cross bar; 99. Limiting block; 910. Long plate; 911. Spring 3; 912. Placement long slot; 10. Plasma manufacturing module; 11. Robotic arm DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] See also Figure 1 - Figure 8, one embodiment of the present invention is: a uniform temperature controlled dry etching machine, comprising a workbench 1, the inner wall of the workbench 1 is fixedly connected to a hydraulic rod 2, the telescopic end of the hydraulic rod 2 is fixedly connected to a placement block 3, the top of the workbench 1 is fixedly connected to a fixing frame 4, the inner wall of the fixing frame 4 is fixedly connected to a protective cover 5, the top of the inner wall of the protective cover 5 is fixedly connected to a plasma manufacturing module 10, the outer wall of the protective cover 5 is provided with a temperature control device 6 for uniform temperature control, the side of the workbench 1 is fixedly connected to a control panel 7, the side of the workbench 1 is provided with a robotic arm 11, the robotic arm 11 is a prior art, and the adsorption ring of the robotic arm 11 can perform additional rotational movement through the control of the control panel 7, the side of the workbench 1 is provided with a scraping device 8, the scraping device 8 includes a fixed block 81, the side of the fixed block 81 is fixedly connected to the side of the workbench 1, and the side of the fixed block 81 penetrates and slides There is an L-shaped rod 82, one end of the L-shaped rod 82 is fixedly connected to a limiting circular block 83, a spring 84 is arranged between the limiting circular block 83 and the fixed block 81, the top of the L-shaped rod 82 is fixedly connected to a resistance circular block 85, the outer wall of the L-shaped rod 82 is slidably connected to a scraper 86, the outer wall of the rotating shaft of the robotic arm 11 is fixedly connected to a connecting long plate 891, the bottom of the connecting long plate 891 is fixedly connected to a triangular block 89, the resistance circular block 85 is located on the displacement track of the triangular block 89, through the setting of the above structure, the movement of the U-shaped block 87 drives the bolt 88 to move, so with the cooperation of the bolt 88 and the L-shaped rod 82, the scraper 86 will move along the edge of the circular crystal, the movement of the scraper 86 will clean up the photoresist on the edge of the circular crystal, thereby preventing the photoresist from cracking during etching and then falling off, which will affect the focal plane setting of the lithography machine and cause uneven exposure of the area near the edge of the circular crystal.

[0029] The scraping device 8 also includes a U-shaped block 87, and the outer wall of the U-shaped block 87 is threadedly connected to two bolts 88. Both bolts 88 are in contact with the scraper 86. Through the setting of the above structure, the bolts 88 no longer press tightly against the scraper 86, and then the scraper 86 can be replaced, thereby avoiding the problem of the scraper 86 becoming sticky due to long-term use.

[0030] The inner wall of the U-shaped block 87 is fixedly connected to the track block 810, and the inner wall of the track groove of the track block 810 is in contact with the bottom of the scraper 86. Through the setting of the above structure, the track block 810 will form a supporting and guiding effect on the scraper 86, thereby ensuring that the scraper 86 can be accurately moved to a fixed position.

[0031] When in use, the control panel 7 drives the mechanical arm 11 to place the round crystal on the placement block 3 through the adsorption ring, and then drives the hydraulic rod 2 through the control panel 7. The hydraulic rod 2 pushes the placement block 3 into the protective cover 5, and then starts the temperature control device 6 through the control panel 7. The temperature control device 6 can control the temperature inside the protective cover 5, thereby ensuring the stability of the temperature inside the protective cover 5. When the adsorption ring drives the round crystal to move in the direction of the placement block 3, the movement of the adsorption ring will drive the rotating shaft of the mechanical arm 11 to move, and the movement of the rotating shaft drives the connecting long plate 891 to move. The movement of the connecting long plate 891 drives the triangular block 89 to move. The sharp corner of the triangular block 89 will first contact between the two conflicting round blocks 85 during the movement, and at the same time, the scraper 86 will contact the edge of the round crystal. When the triangular block 89 continues to move, the two conflicting round blocks 85 will move along the two sides of the triangular block 89 to the two sides of the adsorption ring of the robot arm 11. The movement of the two conflicting round blocks 85 will push the L-shaped rod 82 to move along the inner wall of the fixed block 81. The movement of the L-shaped rod 82 drives the limiting round block 83 to move. The movement of the limiting round block 83 will press the spring. 84 is stretched, the movement of the limiting circular block 83 drives the U-shaped block 87 to move, and the movement of the U-shaped block 87 drives the bolt 88 to move. Therefore, under the cooperation of the bolt 88 and the L-shaped rod 82, the scraper 86 will move along the edge of the round crystal. The movement of the scraper 86 will clean up the photoresist on the edge of the round crystal, thereby preventing the photoresist from cracking during etching and then falling off, which will affect the focal plane setting of the photolithography machine and cause uneven exposure of the area near the edge of the round crystal; at the same time, the bolt 88 can be turned so that the bolt 88 is no longer pressed against the scraper 86, and then the scraper 86 can be adjusted. 6 for replacement, thereby avoiding the problem of the scraper 86 becoming sticky due to long-term use; when the scraper 86 moves to the L-shaped rod 82 through the U-shaped block 87 at a high risk, the track block 810 will form a support and guiding effect on the scraper 86, thereby ensuring that the scraper 86 can be accurately moved to a fixed position; at the same time, the adsorption ring of the robot arm 11 will be controlled by the control panel 7 to rotate, and the rotation of the adsorption ring will drive the round crystal to rotate, so that the edge of the round crystal is completely scraped by the scraper 86, thereby ensuring that the edge of the round crystal will not be missed.

[0032] See also Figure 1 - Figure 8On the basis of the above embodiment, in another embodiment of the present invention, an anti-secondary pollution device 9 is provided at the top of the interference round block 85, and the anti-secondary pollution device 9 includes a vertical rod 91, the bottom of the vertical rod 91 is fixedly connected to the top of the interference round block 85, and the top of the interference round block 85 is fixedly connected to a support frame 92, the top of the vertical rod 91 is fixedly connected to the bottom of the inner wall of the support frame 92, and the outer wall of the vertical rod 91 is slidably connected to a convex plate 93, and a spring 2 94 is provided between the convex plate 93 and the support frame 92, and the bottom of the convex plate 93 is fixedly connected to a interference arc block 95, and the side of the interference arc block 95 is fixedly connected to a connecting rod 96, and the bottom of the connecting rod 96 is fixedly connected to a J-shaped push block 97, and the outer wall of the rotating shaft of the robot arm 11 is fixedly connected to a cross bar 98, and the end of the cross bar 98 away from the robot arm 11 is fixedly connected to a limiting block 99. The outer wall of the cross bar 98 is slidably connected with a long plate 910. A spring three 911 is provided between the long plate 910 and the limiting block 99. The upper side of the long plate 910 is set as an arc surface. The arc surface of the resistance arc block 95 is located on the displacement trajectory of the arc surface of the long plate 910. The bottom of the resistance circular block 85 is provided with a placement long groove 912. The placement long groove 912 is located on the displacement trajectory of the J-shaped push block 97. The J-shaped push block 97 is in contact with the scraper 86, and the long plate 910 is in contact with the adsorption ring of the robot arm 11. Through the arrangement of the above structure, the resetting of the convex plate 93 will drive the resistance arc block 95, the connecting rod 96 and the J-shaped push block 97 to move downward. The downward movement of the J-shaped push block 97 will push off the photoresist adhered to the surface of the scraper 86, thereby preventing the photoresist on the surface of the scraper 86 from adhering to the edge of the next circular crystal.

[0033] When in use, the robotic arm 11 drives the crossbar 98 to move when driving the circular crystal, and the movement of the crossbar 98 drives the long plate 910 to move. In the process of the long plate 910 moving, the arc surface of the long plate 910 will preferentially contact the arc surface of the resistance arc block 95, thereby causing the resistance arc block 95 to move upward, and the resistance arc block 95 moves upward to drive the convex plate 93 to move upward along the outer wall of the vertical rod 91. The upward movement of the convex plate 93 will squeeze the spring 2 94, and at the same time, the upward movement of the resistance arc block 95 drives the connecting rod 96 upward. The J-shaped push block 97 moves downwards, and the J-shaped push block 97 moves upwards, and moves the J-shaped push block 97 to the inside of the long groove 912. When the long plate 910 no longer contacts the arc block 95, the spring 2 94 drives the convex plate 93 to reset by its own elastic force. The reset of the convex plate 93 drives the arc block 95, the connecting rod 96 and the J-shaped push block 97 to move downwards. The downward movement of the J-shaped push block 97 pushes away the photoresist adhered to the surface of the scraper 86, thereby preventing the photoresist on the surface of the scraper 86 from adhering to the edge of the next round crystal.

[0034] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A uniform temperature-controlled dry etching machine, comprising a workbench (1), wherein the inner wall of the workbench (1) is fixedly connected to a hydraulic rod (2), the telescopic end of the hydraulic rod (2) is fixedly connected to a placement block (3), the top of the workbench (1) is fixedly connected to a fixing frame (4), the inner wall of the fixing frame (4) is fixedly connected to a protective cover (5), the top of the inner wall of the protective cover (5) is fixedly connected to a plasma manufacturing module (10), the outer wall of the protective cover (5) is provided with a temperature control device (6) for uniform temperature control, the side of the workbench (1) is fixedly connected to a control panel (7), and the side of the workbench (1) is provided with a robotic arm (11), characterized in that: A scraping device (8) is provided on the side of the workbench (1), and the scraping device (8) includes a fixed block (81), the side of the fixed block (81) is fixedly connected to the side of the workbench (1), an L-shaped rod (82) is passed through and slidably provided on the side of the fixed block (81), one end of the L-shaped rod (82) is fixedly connected to a limiting circular block (83), a spring (84) is provided between the limiting circular block (83) and the fixed block (81), the top of the L-shaped rod (82) is fixedly connected to a resisting circular block (85), the outer wall of the L-shaped rod (82) is slidably connected to a scraper (86), the outer wall of the rotating shaft of the mechanical arm (11) is fixedly connected to a connecting long plate (891), and the bottom of the connecting long plate (891) is fixedly connected to a triangular block (89).

2. The uniform temperature controlled dry etching machine according to claim 1, characterized in that: The scraping device (8) further comprises a U-shaped block (87), the outer wall of the U-shaped block (87) being threadedly connected to two bolts (88).

3. The uniform temperature controlled dry etching machine according to claim 2, characterized in that: The inner wall of the U-shaped block (87) is fixedly connected to a track block (810), and the inner wall of the track groove of the track block (810) is in contact with the bottom of the scraper (86).

4. The uniform temperature controlled dry etching machine according to claim 2, characterized in that: The abutting circular block (85) is located on the displacement track of the triangular block (89), and both of the two bolts (88) are in contact with the scraper (86).

5. The uniform temperature controlled dry etching machine according to claim 1, characterized in that: The top of the said resisting circular block (85) is provided with an anti-secondary pollution device (9), and the said anti-secondary pollution device (9) comprises a vertical rod (91), the bottom of the said vertical rod (91) is fixedly connected to the top of the resisting circular block (85), the top of the said resisting circular block (85) is fixedly connected to a support frame (92), the top of the said vertical rod (91) is fixedly connected to the bottom of the inner wall of the support frame (92), the outer wall of the said vertical rod (91) is slidably connected to a convex plate (93), a spring 2 (94) is provided between the said convex plate (93) and the support frame (92), and the said convex plate (93) is provided with a spring 2 (94). The bottom of the shaped plate (93) is fixedly connected to a resisting arc block (95), the side of the resisting arc block (95) is fixedly connected to a connecting rod (96), the bottom of the connecting rod (96) is fixedly connected to a J-shaped push block (97), the outer wall of the rotating shaft of the mechanical arm (11) is fixedly connected to a cross bar (98), the end of the cross bar (98) away from the mechanical arm (11) is fixedly connected to a limiting block (99), the outer wall of the cross bar (98) is slidably connected to a long plate (910), and a spring three (911) is provided between the long plate (910) and the limiting block (99).

6. The uniform temperature controlled dry etching machine according to claim 5, characterized in that: The upper side of the long plate (910) is provided with an arc surface, and the arc surface of the resisting arc block (95) is located on the displacement track of the arc surface of the long plate (910).

7. The uniform temperature controlled dry etching machine according to claim 5, characterized in that: A placement slot (912) is provided at the bottom of the resisting circular block (85), and the placement slot (912) is located on the displacement track of the J-shaped push block (97).

8. The uniform temperature controlled dry etching machine according to claim 5, characterized in that: The J-shaped push block (97) is in contact with the scraper (86), and the long plate (910) is in contact with the adsorption ring of the robot arm (11).

Citation Information

Patent Citations

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    CN118448315B

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    CN101303537A

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