Conveying mechanism, semiconductor failure detection apparatus, and detection method

Abstract

The application discloses a conveying mechanism, a semiconductor fault detection device and a detection method, and belongs to the technical field of semiconductor chip packaging and testing, wherein the conveying mechanism comprises a first driving element, a rotating disc and a plurality of bearing seats, the rotating disc is installed at the output end of the first driving element, and the plurality of bearing seats are distributed on the circumference of the rotating disc; each bearing seat comprises a seat body, a second driving element and at least one moving conveying element, the seat body is internally provided with a containing groove, the moving conveying element is arranged in the containing groove, a heating cavity is formed between the moving conveying element and the inner wall of the seat body, the seat body is provided with a feeding opening above the heating cavity, and the feeding opening is communicated with the heating cavity; the moving conveying element is provided with a guide roller shaft, the second driving element is movably connected with the guide roller shaft, the outer wall of the guide roller shaft forms a guide surface, and the guide surface is arranged at the feeding opening; the first driving element drives the rotating disc to rotate, the bearing seat and the second driving element move, the second driving element drives the guide roller shaft to rotate, and the semiconductor chip is driven to enter the heating cavity.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor chip packaging and testing, and in particular to a conveying mechanism, semiconductor fault detection equipment, and detection method. Background Technology

[0002] Semiconductor packaging and testing, the process of testing and packaging manufactured chips, is a crucial back-end manufacturing stage in the semiconductor industry chain. The primary function of packaging is to protect the chip and facilitate its use. After packaging, the chip must undergo comprehensive structural and electrical functional testing to ensure its quality and reliability. These tests include functional testing, electrical performance testing, timing testing, temperature testing, and reliability testing.

[0003] Typically, a series of semiconductor packaging and testing processes utilize multiple detection modules to perform multimodal testing through different sensing methods. During the testing process, semiconductor components need to be frequently transferred and flipped. Furthermore, to test the stability of components at high temperatures, semiconductor components usually need to be heated to specific temperatures when entering different detection modules for testing.

[0004] For example, existing technology CN217577135U discloses a material flipping and positioning mechanism for packaging and testing equipment. This mechanism includes a turntable, a test holder, a test port, and a cover plate, which can flip semiconductor chips during heating testing, thereby facilitating the testing of both sides of the chip. However, such testing equipment still faces some problems in practical use. For example, when heating semiconductor components, usually only one side of the component can be heated flat, which leads to low heating efficiency and affects the heating effect. At the same time, during the station transfer and flipping process, a large number of driving components need to work together, which not only makes the driving equipment complex, but also limits the open space required by the upper structure for the testing module, which is not conducive to flexible testing. Summary of the Invention

[0005] The purpose of this invention is to improve the problems of existing conveying mechanisms being unable to automatically transport semiconductor chips to the heating chamber for heating and the semiconductor chips not being heated evenly enough, and to provide a conveying mechanism, a semiconductor fault detection device, and a detection method.

[0006] The technical solutions for achieving the above objectives include the following:

[0007] The conveying mechanism includes: a first driving member, a turntable, and multiple carrier seats, wherein the turntable is installed at the output end of the first driving member, and the multiple carrier seats are distributed around the circumference of the turntable;

[0008] Each of the aforementioned support seats includes a seat body, a second driving member, and at least one movable conveying member. The seat body has a receiving groove, and the movable conveying member is disposed in the receiving groove. The seat body has a heating chamber, and the seat body has a feeding port located above the heating chamber. The feeding port is connected to the heating chamber.

[0009] The moving conveyor has a guide roller shaft, and the second drive component is movably engaged with the guide roller shaft; the outer wall of the guide roller shaft forms a guide surface, and the guide surface is located at the feed inlet.

[0010] In one embodiment, the moving conveyor has a first guide groove, the second driving member has a transmission rod and a driving rod, the first end of the transmission rod is mounted on the first end of the driving rod, the second end of the transmission rod is disposed in the first guide groove, the end of the guide roller shaft has a gear, and the second end of the transmission rod has a rack that meshes with the gear.

[0011] The second end of the drive rod is disposed inside the heating cavity and has a first moving position and a second moving position inside the heating cavity. In the first moving position, the second end of the drive rod is located at the top of the heating cavity, and in the second moving position, the second end of the drive rod is located at the bottom of the heating cavity.

[0012] In one embodiment, the width of the receiving groove is greater than the width of the mobile conveyor, and the mobile conveyor is movably disposed within the receiving groove; the first guide groove is inclined, and the first end of the first guide groove is close to the top of the mobile conveyor, while the other end extends through the bottom of the mobile conveyor.

[0013] In one embodiment, the second driving member further includes a movable wheel and a movable block, and the first ends of the transmission rod and the driving rod are both mounted on the movable block;

[0014] The movable block has a second guide groove, the movable wheel has a drive shaft, the drive shaft is offset from the axis of the movable wheel, and the drive shaft is slidably engaged with the second guide groove.

[0015] In one embodiment, the movable conveyor further includes a guide plate and a connecting rod, a first end of the connecting rod being mounted on a guide roller shaft, a second end of the connecting rod being mounted on the guide plate, and the guide plate having a guiding end that is connected to the guiding surface of the guide roller shaft.

[0016] The guide plate is at least partially located inside the heating chamber.

[0017] In one embodiment, there are two movable conveyors, both of which are disposed in a receiving groove. The width of the receiving groove is greater than the sum of the widths of the two movable conveyors, and there is a gap between the two movable conveyors, which is a heating chamber.

[0018] The second driving component is in movable engagement with the two guide roller shafts.

[0019] In one embodiment, two movable conveyors are movably disposed within a receiving groove. Each movable conveyor has a first guide groove. The second driving member has a driving rod and two transmission rods. The first end of each transmission rod is mounted on the driving rod, and the driving rod is disposed between the two transmission rods. The second end of each transmission rod is disposed within the first guide groove. The end of each guide roller shaft has a gear, which is disposed along the length direction of the first guide groove. The second end of each transmission rod has a rack that meshes with the gear.

[0020] The first guide groove is inclined, and the two first guide grooves are symmetrically arranged with the heating cavity as the center. The first ends of the two first guide grooves are close to the bottom of the heating cavity and penetrate through the bottom of the moving conveyor. The second ends of the two first guide grooves are far away from the top of the heating cavity.

[0021] In one embodiment, the conveying mechanism further includes a baffle, which is circular in structure, sleeved around the turntable, and the inner wall of the baffle abuts against the support seat.

[0022] The present invention also proposes a semiconductor packaging fault detection device, including a heating element, a detection stage, a detector, and a conveying mechanism as described above. The heating element is disposed on both side walls of the heating cavity, and the conveying mechanism and the detector are both mounted on the detection stage.

[0023] The detector has an arc-shaped structure and an opening.

[0024] This invention also proposes a detection method for a semiconductor packaging fault detection device, comprising the following steps:

[0025] Step 1: Place the semiconductor chip in the inlet and start the first drive unit. The first drive unit drives the turntable to rotate.

[0026] Step 2: The first driving component drives the second driving component to move, the second driving component drives the guide roller shaft to rotate, and the guide roller shaft drives the semiconductor chip in the feed port to move into the heating chamber;

[0027] Step 3: The semiconductor chip is heated by the heating element in the heating chamber. The turntable moves the semiconductor chip to the bottom of the detector, and the detector performs packaging test on the semiconductor chip in the heating chamber.

[0028] The technical solution provided by this invention has the following advantages and effects:

[0029] On one hand, the first driving component drives the turntable to rotate, which in turn drives the carrier and the second driving component to move. This, in turn, causes the second driving component to rotate the guide roller shaft, automatically driving the semiconductor chip into the heating chamber. This conveying mechanism is simple in power and easy to operate. While the semiconductor chip is being transferred to its workstation, it falls into the heating chamber through the inlet for heating. Heating the semiconductor chip from all directions within a relatively enclosed space effectively solves the problem that existing testing equipment typically only heats one side of the semiconductor chip, thus improving heating efficiency and testing accuracy.

[0030] On the other hand, during transportation, the semiconductor chip enters the heating chamber and is also moved to the bottom of the detector by a turntable mounted on a carrier. The semiconductor chip is transported from different dimensions, and the same power source is used to realize the secondary transportation of the semiconductor chip. Attached Figure Description

[0031] The accompanying drawings illustrate specific examples of the technical solutions described in this invention and, together with the detailed embodiments, form part of the specification, serving to explain the technical solutions, principles, and effects of this invention.

[0032] Unless otherwise specified or defined, the same reference numerals in different figures represent the same or similar technical features, and different reference numerals may be used to represent the same or similar technical features.

[0033] Figure 1 This is a schematic diagram of a conveying mechanism in one embodiment of the present invention;

[0034] Figure 2 This is a cross-sectional view of the support base in one embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of the state of the support seat in one embodiment of the present invention. Figure 1 ;

[0036] Figure 4 This is one embodiment of the present invention. Figure 3 Enlarged view of point A;

[0037] Figure 5 This is a schematic diagram of the state of the support seat in one embodiment of the present invention. Figure 2 ;

[0038] Figure 6 This is one embodiment of the present invention. Figure 5 Enlarged view of point B;

[0039] Figure 7 This is a schematic diagram of the cooperation between the guide plate and the guide roller shaft in one embodiment of the present invention;

[0040] Figure 8This is a schematic diagram of a semiconductor packaging fault detection device according to an embodiment of the present invention;

[0041] Explanation of reference numerals in the attached figures:

[0042] 100. Conveying mechanism; 1. First driving component; 2. Turntable; 21. Slot; 3. Bearing seat; 31. Seat body; 311. Inlet; 312. Receiving groove; 32. Moving conveyor; 321. Guide roller; 3211. Guide surface; 322. Guide plate; 323. Gear; 324. Connecting rod; 325. First guide groove; 33. Second driving component; 331. Transmission rod; 3311. Rack; 332. Drive rod; 333. Moving block; 3331. Second guide groove; 334. Moving wheel; 335. Drive shaft; 34. Heating chamber; 4. Semiconductor chip; 5. Baffle; 6. Heating component; 200. Semiconductor packaging fault detection equipment; 201. Detector; 202. Detection table. Detailed Implementation

[0043] To facilitate understanding of the present invention, specific embodiments of the present invention will be described in more detail below with reference to the accompanying drawings.

[0044] Unless otherwise specified or defined, the terms "first," "second," etc., used in this document are for distinguishing names only and do not represent a specific number or order.

[0045] Unless otherwise stated or defined, the term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0046] It should be noted that when a component is considered "fixed" to another component, it can be directly fixed to the other component or there can be an intervening component; when a component is considered "connected" to another component, it can be directly connected to the other component or there can be an intervening component; when a component is considered "mounted" on another component, it can be directly mounted on the other component or there can be an intervening component; when a component is considered "placed" on another component, it can be directly placed on the other component or there can be an intervening component.

[0047] This invention proposes a conveying mechanism 100, such as... Figures 1 to 7As shown, it includes: a first driving component 1, a turntable 2, and multiple carrier seats 3. The turntable 2 is installed at the output end of the first driving component 1. The turntable 2 has multiple slots 21 distributed around the circumference of the turntable 2. Each carrier seat 3 is installed in each slot 21. Each carrier seat 3 includes a seat body 31, a second driving component 33, and at least one movable conveyor 32. The seat body 31 has a receiving groove 312, and the movable conveyor 32 is disposed in the receiving groove 312. The seat body 31 has a heating chamber 34, and the seat body 31 has an inlet 311 located above the heating chamber 34, which communicates with the heating chamber 34. The movable conveyor 32 has a guide roller shaft 321, which has a guide surface 3211. A portion of the guide surface 3211 is disposed in the inlet 311, and the other portion is disposed in the heating chamber 34. The second driving component 33 is movably engaged with the guide roller shaft 321.

[0048] In other embodiments, the support base 3 can be fixedly installed on the turntable 2, which is not particularly limited here.

[0049] Specifically, the first driving component 1 drives the turntable 2 to move. The turntable 2 houses multiple carrier seats 3. When the turntable 2 rotates, it can transport the carrier seats 3 to a designated position and inspect the semiconductor chip 4 on the carrier seats 3. When the carrier seats 3 transport the semiconductor chip 4, they place the semiconductor chip 4 at the inlet 311, and the semiconductor chip 4 contacts the guide surface 3211. The second driving component 33 drives the guide roller shaft 321 to rotate clockwise, and the guide surface 3211 on the outer wall of the guide roller shaft 321 moves. The friction between the guide surface 3211 and the semiconductor chip 4 causes the semiconductor chip 4 to move, and the semiconductor chip 4 enters the heating chamber 34 from the inlet 311. At the same time, when the guide roller shaft 321 rotates counterclockwise, the guide surface 3211 can also move the semiconductor chip 4 out of the heating chamber 34. In addition, when the semiconductor chip 4 cannot enter through the feed port 311 or deviates from the feed port 311, the semiconductor chip 4 can be manually aligned so that it contacts the guide surface 3211 of the guide roller 321.

[0050] In this embodiment, when the first driving member 1 moves the turntable 2, the turntable 2 can drive the second driving member 33 to move. The second driving member 33 is used to roll in cooperation with the ground. When the second driving member 33 moves, it drives the guide roller shaft 321 to rotate. Therefore, the clockwise or counterclockwise rotation of the turntable 2 can drive the semiconductor chip 4 into or out of the heating chamber 34. By setting the heating member 6 in the heating chamber 34, the semiconductor chip 4 in the heating chamber 34 is heated, so that the semiconductor chip 4 is heated evenly, preparing it for detection. The first driving member 1 can drive the semiconductor chip 4 that has been heated on the turntable 2 to move to the detection area. The movement and heating are carried out simultaneously, realizing the automatic transportation of the semiconductor chip 4 to the heating chamber 34 for heating and solving the problem of uneven heating of the semiconductor chip 4.

[0051] Furthermore, the first driving component 1 drives the turntable 2 to rotate, and the turntable 2 drives the carrier 3 and the second driving component 33 to move. This enables the second driving component 33 to drive the guide roller 321 to rotate and automatically drive the semiconductor chip 4 into the heating chamber 34. This conveying mechanism 100, with its simple power source, only requires a single power source to complete the transportation, heating, and testing of the semiconductor chip 4, making it easy to operate. Moreover, during transportation, the semiconductor chip 4 enters the heating chamber 34 and is moved by the carrier 3, mounted on the turntable 2, to a position below the detector 201, transporting the semiconductor chip 4 from different dimensions. Simultaneously with the transfer of the semiconductor chip 4 to its workstation, it falls into the heating chamber 34 through the inlet 311 for heating. Heating the semiconductor chip 4 in a relatively enclosed space from all directions effectively solves the problem that existing testing equipment typically only heats one side of the semiconductor chip 4, improving heating efficiency and testing accuracy.

[0052] In some embodiments, the moving conveyor 32 has a first guide groove 325, and the second driving member 33 has a transmission rod 331 and a driving rod 332. The first end of the transmission rod 331 is fixed to the first end of the driving rod 332, and the second end of the transmission rod 331 is disposed in the first guide groove 325. The end of the guide roller shaft 321 has a gear 323, which is disposed in the length direction of the first guide groove 325. The second end of the transmission rod 331 has a rack 3311 that meshes with the gear 323. The second end of the driving rod 332 is disposed in the heating cavity 34 and has a first moving position and a second moving position in the heating cavity 34. In the first moving position, the second end of the driving rod 332 is located at the top of the heating cavity 34, and in the second moving position, the second end of the driving rod 332 is located at the bottom of the heating cavity 34.

[0053] Specifically, by utilizing the meshing of the rack 3311 on the transmission rod 331 with the gear 323, the drive rod 332 moves, causing the rack 3311 on the transmission rod 331 to move. The rack 3311 of the transmission rod 331 moves up and down, driving the gear 323 to rotate clockwise or counterclockwise. When the gear 323 rotates, it drives the guide roller shaft 321 to rotate. The drive rod 332 is at least partially located inside the heating chamber 34. When the drive rod 332 moves downward, the gear 323 rotates clockwise, and the guide roller shaft 321 carries the semiconductor chip 4 from the feed port 311 into the heating chamber 34. At this time, the drive rod 332 moves to the bottom of the heating chamber 34. When the drive rod 332 moves upward, it drags the semiconductor chip 4 upward, and at the same time, the drive rod 332 drives the transmission rod 331 to move. The transmission rod 331 drives the gear 323 to rotate counterclockwise, and the guide roller shaft 321 carries the semiconductor chip 4 from the heating chamber 34 to the feed port 311. In this embodiment, the drive rod 332 and the guide roller 321 drive the semiconductor chip 4 to move in the heating chamber 34 in different ways, thereby improving the stability of the semiconductor chip 4 moving in the support 3 and ensuring that the semiconductor chip 4 falls vertically into the heating chamber 34, thus further achieving sealed heating of the semiconductor chip 4.

[0054] In some embodiments, the width of the receiving groove 312 is greater than the width of the movable conveyor 32, and the movable conveyor 32 is movably disposed within the receiving groove 312; the first guide groove 325 is inclined, and the first end of the first guide groove 325 is close to the top of the movable conveyor 32, and the other end extends through the bottom of the movable conveyor 32.

[0055] Specifically, the movable conveyor 32 moves within the receiving groove 312, and the transmission rod 331 slides in engagement with the first guide groove 325. Since the first guide groove 325 is inclined, its first end is close to the top of the movable conveyor 32, and its other end extends through the bottom of the movable conveyor 32. When the first guide groove 325 slides in engagement with the transmission rod 331, and the movable conveyor 32 moves away from the transmission rod 331, the movable conveyor 32 moves away from the heating chamber 34 within the receiving groove 312, increasing the volume of the heating chamber 34 to facilitate easier sliding of the semiconductor chip 4 from the inlet 311 into the heating chamber 34. When the movable conveyor 32 moves closer to the transmission rod 331, the movable conveyor 32 moves closer to the heating chamber 34 within the receiving groove 312, the rack 3311 contacts the gear 323, and the guide roller 321 rotates counterclockwise, causing the semiconductor chip 4 to be moved out of the heating chamber 34.

[0056] In some embodiments, the second driving member 33 further includes a movable wheel 334 and a movable block 333. The first ends of the transmission rod 331 and the driving rod 332 are both mounted on the movable block 333. The movable block 333 is located on one side of the driving rod 332 or the transmission rod 331. The movable block 333 has a second guide groove 3331. The length direction of the second guide groove 3331 intersects the length direction of the first guide groove 325. The end of the movable wheel 334 has a driving shaft 335. The driving shaft 335 is offset from the axis of the movable wheel 334 and slides with the second guide groove 3331.

[0057] Specifically, the transmission rod 331, drive rod 332, and moving block 333 are fixed, and the moving block 333 is located on one side of the drive rod 332. When the turntable 2 drives the support seat 3 to move, the moving wheel 334 rolls with the upper surface of the detection table 202. During the rotation of the moving wheel 334, the drive shaft 335 moves in the second guide groove 3331 of the moving block 333, and the drive shaft 335 drives the moving block 333 to move up and down. The moving block 333 drives the drive rod 332 and the transmission rod 331 to move up and down, so as to realize the synchronous movement of the transmission rod 331 and the drive rod 332. During the movement, the semiconductor chip 4 of the heating cavity 34 is driven to move, further realizing the engagement of the drive rack 3311 with the gear 323, and the movement of the drive rod 332 in the heating cavity 34.

[0058] Furthermore, the moving wheel 334, moving block 333, and drive rod 332 form an eccentric reciprocating transmission structure for ejecting the semiconductor chip 4. While the turntable 2 rotates and moves to a different position, the moving wheel 334 rotates synchronously with the turntable 2, and the eccentric reciprocating transmission structure drives the drive rod 332 and transmission rod 331 to move up and down synchronously. This design eliminates the need for a separate power source to eject the semiconductor chip 4, thereby reducing energy consumption and improving the stability of equipment operation.

[0059] In some embodiments, such as Figure 7 As shown, the moving conveyor 32 also includes a guide plate 322 and a connecting rod 324. The first end of the connecting rod 324 is fixed to the end of the guide roller shaft 321, and the second end of the connecting rod 324 is fixed to the end of the guide plate 322. The guide plate 322 has a guiding end, which is connected to the guiding surface 3211 of the guide roller shaft 321. The guide plate 322 is located inside the heating chamber 34. Specifically, the guide plate 322 is fixed to the guide roller shaft 321 via the connecting rod 324. When the guide roller shaft 321 rotates, the guide plate 322 moves within the heating chamber 34. The guiding end of the guide plate 322 is connected to the guiding surface 3211. When the guiding surface 3211 moves, it will drive the semiconductor chip 4 to move onto the guide plate 322. The guide plate 322 further guides the semiconductor chip 4 into or out of the heating chamber 34, improving the practicality of the conveying mechanism 100.

[0060] In some embodiments, there are two movable conveyors 32, both of which are disposed in a receiving groove 312. The width of the receiving groove 312 is greater than the sum of the widths of the two movable conveyors 32, and there is a gap between the two movable conveyors 32, which is a heating chamber 34.

[0061] Specifically, the second driving member 33 simultaneously drives the two guide rollers 321 to rotate. When the second driving member 33 moves, one of the guide rollers 321 rotates clockwise and the other guide roller 321 rotates counterclockwise. The two guide rollers 321 are arranged opposite to each other, which can increase the frictional force of the semiconductor chip 4, making it easier for the semiconductor chip 4 to enter the heating chamber 34 from the feed port 311 and to move out of the heating chamber 34.

[0062] By employing two guide rollers 321 acting on the lower end face of the semiconductor chip 4 respectively, the guide surfaces 3211 of the two guide rollers 321 transport the semiconductor chip 4 into the heating chamber 34 from opposite directions, thereby increasing the area of ​​the guide surfaces 3211, improving the conveying efficiency, and increasing the stability of the conveying.

[0063] In some embodiments, two movable conveyors 32 are movably disposed within the receiving groove 312. Each movable conveyor 32 has a first guide groove 325. The second drive member 33 has a drive rod 332 and two transmission rods 331. The first end of each transmission rod 331 is fixed to the first end of the drive rod 332, and the drive rod 332 is disposed between the two transmission rods 331. The second end of the transmission rod 331 is disposed within the first guide groove 325. The end of each guide roller shaft 321 has a gear 323, which is disposed along the length of the first guide groove 325. The second end of each transmission rod 331 has a rack 3311 that meshes with the gear 323. The first guide groove 325 is inclined. The two first guide grooves 325 are symmetrically arranged with the heating cavity 34 as the center. The first ends of the two first guide grooves 325 are close to the bottom of the heating cavity 34 and penetrate through the bottom of the movable conveyor 32. The second ends of the two first guide grooves 325 are far away from the top of the heating cavity 34.

[0064] Specifically, by setting two transmission rods 331 on both sides of the drive rod 332, when the moving wheel 334 rotates, it drives the drive rod 332 and the two transmission rods 331 to move up and down through the moving block 333. The two transmission rods 331 are symmetrically arranged with the drive rod 332 as the center. When the racks 3311 of each transmission rod 331 are engaged with the corresponding gears 323, the two guide roller shafts 321 rotate in opposite directions, and the two moving conveyors 32 are guided by the transmission rods 331 and the inner wall of the seat 31, so that the two moving conveyors 32 have a moving path that moves closer to each other or further away from each other. When the drive rod 332 moves upward, the two moving conveyors 32 move closer to each other, and the drive rod 332 pushes out the semiconductor chip 4, and the heating cavity 34 shrinks. When the drive rod 332 moves downward, the two moving conveyors 32 move further away from each other, and the drive rod 332 moves to the bottom of the heating cavity 34, the heating cavity 34 opens, and the semiconductor chip 4 moves into the heating cavity 34.

[0065] Furthermore, such as Figure 3 and Figure 5 As shown, when the conveying mechanism 100 is not conveying the semiconductor chip 4 to the heating cavity 34, the width of the heating cavity 34 is H1. After the conveying mechanism 100 conveys the semiconductor chip 4 to the heating cavity 34, the width of the heating cavity 34 is H2, and the value of H1 is less than the value of H2. Therefore, the heating cavity 34 has different widths when the conveying mechanism 100 is in different states.

[0066] Preferably, the conveying mechanism 100 further includes a baffle 5, which forms a circular structure. The baffle 5 is sleeved on the outside of the turntable 2, and the inner wall of the baffle 5 abuts against the support seat 3. Specifically, the baffle 5 is used to block the side opening of the slot 21. When the support seat 3 is inside the slot 21, the turntable 2 moves, causing the support seat 3 to move. The support seat 3 generates centrifugal force in the circumference of the turntable 2, and the baffle 5 can abut against the support seat 3 to prevent the support seat 3 from coming out of the slot 21.

[0067] The working principle of the conveying mechanism 100 is as follows: Figure 3 and Figure 5 As shown, the semiconductor chip 4 is placed flat at the inlet 311. The turntable 2 moves, driving the moving wheel 334 to move. The drive shaft 335 on the moving wheel 334 drives the moving block 333 to move. The drive rod 332 and transmission rod 331 are carried downward by the moving block 333. The drive rod 332 moves to the bottom of the heating chamber 34. The two transmission rods 331 drive the two guide rollers 321 to move, and the two moving conveyors 32 move away from each other, increasing the space in the heating chamber 34. The two guide rollers 321 simultaneously drive the semiconductor chip 4, and the semiconductor chip 4 falls into the heating chamber 34. The moving wheel 334 moves half a circle, and the conveying mechanism 100 completes the conveying of the semiconductor chip 4. The moving wheel 334 moves one circle, and the conveying mechanism 100 completes the conveying and output of the semiconductor chip 4.

[0068] The present invention also proposes a semiconductor packaging fault detection device 200, such as... Figure 8 As shown, the device includes a heating element 6, a detection platform 202, a detector 201, and a conveying mechanism 100 as described above. The heating element 6 is disposed on both side walls of the heating chamber 34. The conveying mechanism 100 and the detector 201 are both mounted on the detection platform 202. The detector 201 has an arc-shaped structure and an opening. One of the support seats 3 is located below the detector 201, and the other of the support seats 3 is located below the opening.

[0069] Specifically, the turntable 2 is located below the detector 201, which has an arc-shaped structure. During detection, the semiconductor chip 4 can be placed at the inlet 311. The turntable 2 rotates, and the semiconductor chip 4 enters the heating chamber 34 from the inlet 311. The heating element 6 heats the semiconductor chip 4 in the heating chamber 34. At the same time, the turntable 2 also moves below the detector 201. After the heating element 6 has finished heating, the detector 201 is activated to detect the semiconductor chip 4 below it. After the detection is completed, the turntable 2 rotates again to remove the semiconductor chip 4 from the heating chamber 34. The turntable 2 also moves the semiconductor chip 4 to the opening of the detector 201, where a mechanical gripper picks up the semiconductor chip 4 from the opening.

[0070] The present invention also proposes a detection method for a semiconductor packaging fault detection device 200, characterized by comprising the following steps:

[0071] Step 1: Place the semiconductor chip 4 in the feed port 311, start the first driving component 1, and drive the turntable 2 to rotate.

[0072] Step 2: The first driving component 1 drives the second driving component 33 to move, the second driving component 33 drives the guide roller shaft 321 to rotate, and the guide roller shaft 321 drives the semiconductor chip 4 in the feed port 311 to move into the heating chamber 34.

[0073] Step 3: The semiconductor chip 4 is heated by the heating element 6 in the heating chamber 34. The turntable 2 moves the semiconductor chip 4 to below the detector 201. The detector 201 performs packaging test on the semiconductor chip 4 in the heating chamber 34.

[0074] Using the above method, the first driving component 1 is activated, and the turntable 2 drives the semiconductor chip 4 into the heating chamber 34 for heating, thus completing the preparation work before the semiconductor chip 4 is tested. This operation method is simple; it only requires controlling the rotation direction of the turntable 2 to achieve the preparation and collection work before the semiconductor chip 4 is tested.

[0075] When referencing drawings, new features are explained. To avoid redundant references to drawings that would make the description less concise, features already described will not be referenced again on the drawings if the description is clear.

[0076] The purpose of the above embodiments is to reproduce and derive the technical solution of the present invention by way of example, and to fully describe the technical solution, purpose and effect of the present invention. The purpose is to enable the public to have a more thorough and comprehensive understanding of the disclosure of the present invention, and not to limit the scope of protection of the present invention.

[0077] The above embodiments are not an exhaustive list based on the present invention, and there may be many other embodiments not listed. Any substitutions and improvements made without departing from the concept of the present invention are within the protection scope of the present invention.

Claims

1. A conveying mechanism, characterized in that, include: A first driving component, a turntable, and multiple support seats, wherein the turntable is installed at the output end of the first driving component, and the multiple support seats are distributed around the circumference of the turntable; Each of the aforementioned support seats includes a seat body, a second driving member, and at least one movable conveying member. The seat body has a receiving groove, and the movable conveying member is disposed in the receiving groove. The seat body has a heating chamber, and the seat body has a feeding port located above the heating chamber. The feeding port is connected to the heating chamber. The moving conveyor has a guide roller shaft, and the second drive component is movably engaged with the guide roller shaft; the outer wall of the guide roller shaft forms a guide surface, and the guide surface is disposed at the feed inlet; The mobile conveyor has a first guide groove, the second drive has a transmission rod and a drive rod, the first end of the transmission rod is mounted on the first end of the drive rod, the second end of the transmission rod is disposed in the first guide groove, the end of the guide roller has a gear, and the second end of the transmission rod has a rack that meshes with the gear. The second end of the drive rod is disposed inside the heating cavity and has a first moving position and a second moving position inside the heating cavity. In the first moving position, the second end of the drive rod is located at the top of the heating cavity, and in the second moving position, the second end of the drive rod is located at the bottom of the heating cavity.

2. The conveying mechanism as described in claim 1, characterized in that... The width of the receiving groove is greater than the width of the mobile conveyor, and the mobile conveyor is movably disposed in the receiving groove; the first guide groove is inclined, and the first end of the first guide groove is close to the top of the mobile conveyor, and the other end of the first guide groove passes through the bottom of the mobile conveyor.

3. The conveying mechanism as described in claim 1, characterized in that... The second driving component also includes a movable wheel and a movable block, and the first ends of the transmission rod and the driving rod are both mounted on the movable block; The movable block has a second guide groove, the movable wheel has a drive shaft, the drive shaft is offset from the axis of the movable wheel, and the drive shaft is slidably engaged with the second guide groove.

4. The conveying mechanism as described in claim 1, characterized in that, The mobile conveyor also includes a guide plate and a connecting rod. The first end of the connecting rod is mounted on the guide roller shaft, and the second end of the connecting rod is mounted on the guide plate. The guide plate has a guiding end, which is connected to the guiding surface of the guide roller shaft. The guide plate is at least partially located inside the heating chamber.

5. The conveying mechanism as described in claim 1, characterized in that, The number of the movable conveyor is two, and both movable conveyors are disposed in the receiving groove. The width of the receiving groove is greater than the sum of the widths of the two movable conveyors. There is a gap between the two movable conveyors, and the gap is a heating chamber. The second driving component is in movable engagement with the two guide roller shafts.

6. The conveying mechanism as described in claim 5, characterized in that, Two movable conveyors are movably disposed within a receiving groove. Each movable conveyor has a first guide groove. The second driving member has a driving rod and two transmission rods. The first end of each transmission rod is mounted on the driving rod, and the driving rod is disposed between the two transmission rods. The second end of each transmission rod is disposed within the first guide groove. The end of each guide roller shaft has a gear, which is disposed along the length direction of the first guide groove. The second end of each transmission rod has a rack that meshes with the gear. The first guide groove is inclined, and the two first guide grooves are symmetrically arranged with the heating cavity as the center. The first ends of the two first guide grooves are close to the bottom of the heating cavity and penetrate through the bottom of the moving conveyor. The second ends of the two first guide grooves are far away from the top of the heating cavity.

7. The conveying mechanism as described in any one of claims 1 to 6, characterized in that, It also includes a baffle, which is a circular structure. The baffle is sleeved outside the turntable, and the inner wall of the baffle abuts against the support seat.

8. A semiconductor packaging fault detection device, characterized in that, It includes a heating element, a detection table, a detector, and a conveying mechanism as described in any one of claims 1 to 7, wherein the heating element is disposed on both side walls of the heating chamber, and the conveying mechanism and the detector are both mounted on the detection table; The detector has an arc-shaped structure and an opening.

9. The detection method based on the semiconductor packaging fault detection equipment according to claim 8, characterized in that, Includes the following steps: The semiconductor chip is placed in the inlet, and the first drive unit is activated, which drives the turntable to rotate. The first driving component drives the second driving component to move, the second driving component drives the guide roller shaft to rotate, and the guide roller shaft drives the semiconductor chip at the feed port to move into the heating chamber. The semiconductor chip is heated by a heating element inside the heating chamber. A turntable moves the semiconductor chip to the area below the detector, where the detector performs packaging testing on the semiconductor chip in the heating chamber.

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