Automatic feeding and discharging equipment for photovoltaic cell processing

Abstract

The invention relates to an automatic feeding and discharging device for photovoltaic cell processing, which comprises a silicon wafer feeding machine and a silicon wafer discharging machine, and is characterized in that the silicon wafer feeding machine comprises a feeding machine rack, a feeding machine upper layer conveying mechanism, a feeding machine lower layer conveying mechanism, a first material rack lifting module and a first silicon wafer inserting tongue module; the feeding machine upper layer conveying mechanism comprises a first silicon wafer conveying line, a furnace ash visual detection module, a subfissure detection assembly and an NG carrying mechanical arm. The silicon wafer conveying device has the beneficial effects that the silicon wafers can be automatically transferred and fed and discharged on a production line and a silicon wafer rack, the production efficiency of the silicon wafers is improved, the silicon wafers are not prone to being damaged, and the silicon wafers can be automatically detected and subjected to NG removal in the conveying process.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic cell production and processing equipment, and particularly to an automatic loading and unloading device for processing photovoltaic cells. Background Art

[0002] Photovoltaic cells, also known as solar cells, are the core components that directly convert sunlight into electrical energy. The etching process of photovoltaic cells is one of the key steps in solar cell manufacturing, mainly used to remove doping layers, passivation layers or metallization layers on the surface or specific areas of silicon wafers to achieve optimized electrical performance and structural design requirements.

[0003] Currently, in the automated production section of photovoltaic cells (silicon wafers), for the transfer loading and unloading of silicon wafers and the loading and unloading of silicon wafer racks during the etching process, manual picking and collecting of silicon wafers are required, resulting in low efficiency. Moreover, abnormal silicon wafers such as cracked, fragmented, and dirty products need to be removed before etching processing. Due to the large number of silicon wafers, the efficiency of workers in loading and unloading, detecting, and sorting silicon wafers is low, and manual transfer and sorting are prone to damaging products. Summary of the Invention

[0004] The purpose of the present invention is to provide an automatic loading and unloading device for processing photovoltaic cells, which can automatically transfer and load and unload silicon wafers on the production line and silicon wafer racks, improve the production efficiency of silicon wafers, are not easily damaged to silicon wafers, and can automatically detect and reject NG silicon wafers during the conveying process.

[0005] To achieve the above purpose, the present invention provides the following technical solution: An automatic loading and unloading device for processing photovoltaic cells, including a silicon wafer loading machine and a silicon wafer unloading machine. The silicon wafer loading machine includes a loading machine frame, an upper-layer conveying mechanism of the loading machine, a lower-layer conveying mechanism of the loading machine, a first rack lifting module, and a first silicon wafer inserting tongue module. The upper-layer conveying mechanism of the loading machine includes a first silicon wafer conveying line, a furnace ash vision detection module, a crack detection component, and an NG handling manipulator. The structure of the lower-layer conveying mechanism of the loading machine is the same as that of the upper-layer conveying mechanism of the loading machine. The silicon wafer unloading machine includes an unloading machine frame, an upper-layer conveying mechanism of the unloading machine, a lower-layer conveying mechanism of the unloading machine, an NG recycling module, a second rack lifting module, and a second silicon wafer inserting tongue module. The upper-layer conveying mechanism of the unloading machine includes a second silicon wafer conveying line and a lane-changing handling module. The structure of the lower-layer conveying mechanism of the unloading machine is the same as that of the upper-layer conveying mechanism of the unloading machine. The structure of the second rack lifting module is the same as that of the first rack lifting module. The structure of the second silicon wafer inserting tongue module is the same as that of the first silicon wafer inserting tongue module.

[0006] Further, the first rack lifting module includes a first linear lifting module, a lifting table, and a rack flow line. The first linear lifting module is fixedly connected to the machine frame. The lifting table is fixedly connected to the moving table of the first linear lifting module. The rack flow line is fixedly connected to the lifting table.

[0007] Further, the first silicon wafer tongue inserting module includes a dislocation flow line and a dislocation cylinder. The dislocation flow line is fixedly connected to the piston rod of the dislocation cylinder.

[0008] Further, the furnace ash visual inspection module includes a bracket and a CCD camera. The CCD camera is fixedly connected to the bracket.

[0009] Further, a vacuum suction cup is fixedly connected to the moving table of the NG handling manipulator.

[0010] Further, the lane-changing handling module includes a translational linear module, a transfer flow line, and a transfer manipulator. The translational linear module and the transfer manipulator are both fixedly connected to the blanking machine frame. The transfer flow line is fixedly connected to the moving table of the translational linear module.

[0011] Further, centering and clamping modules and silicon wafer buffer modules are provided on the first silicon wafer conveying line and the second silicon wafer conveying line in the silicon wafer loader and the silicon wafer unloader.

[0012] Further, the centering and clamping module includes a two-way slide and a positioning frame. There are specifically two positioning frames, and the two positioning frames are respectively fixedly connected to the two moving tables of the two-way slide. A plurality of rollers are rotatably connected to the positioning frame.

[0013] Further, the silicon wafer buffer module includes a second linear lifting module and a buffer rack. A plurality of positioning rods are fixedly connected to the buffer rack.

[0014] Further, the NG recycling module includes a recycling box, a flipping flow line, a hinge seat, and a flipping cylinder. The hinge seat and the recycling box are both fixedly connected to the blanking machine frame. The flipping cylinder and the flipping flow line are both hinged to the hinge seat. The piston rod of the flipping cylinder is hinged to the other end of the flipping flow line.

[0015] The beneficial effects of the present invention are as follows: The upper conveyor mechanism of the loader, the lower conveyor mechanism of the loader, the upper conveyor mechanism of the unloader, and the lower conveyor mechanism of the unloader can automatically transfer and load and unload silicon wafers between the production line and the silicon wafer rack, improving the production efficiency of the silicon wafers and not easily damaging the silicon wafers.

[0016] At the same time, a furnace ash visual inspection module, an NG handling manipulator, a crack detection component, an NG recycling module, and a silicon wafer buffer module are provided on the production line and used in cooperation, and the silicon wafers can be automatically inspected and NG wafers can be removed during the conveying process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a layout schematic diagram of the upper-layer conveying mechanism of the loading machine and the upper-layer conveying mechanism of the unloading machine of the present invention.

[0018] Figure 2 This is a layout schematic diagram of the lower-layer conveying mechanism of the loading machine and the lower-layer conveying mechanism of the unloading machine of the present invention.

[0019] Figure 3 This is a schematic diagram of the internal structure of the loading machine of the present invention.

[0020] Figure 4 This is a schematic diagram of the internal structure of the unloading machine of the present invention.

[0021] Figure 5 This is a schematic diagram of the lane-changing handling module of the present invention.

[0022] Figure 6 This is a schematic diagram of the first rack lifting module of the present invention.

[0023] Figure 7 This is a schematic diagram of the NG recycling module of the present invention.

[0024] Figure 8 This is a schematic diagram of the centering and clamping module of the present invention.

[0025] Figure 9 This is a schematic diagram of the silicon wafer buffer module of the present invention.

[0026] In the figure: 101, the first silicon wafer conveying line; 102, the furnace ash vision detection module; 103, the crack detection component; 104, the NG handling manipulator; 201, the second silicon wafer conveying line; 202, the lane-changing handling module; 3, the first rack lifting module; 301, the first lifting linear module; 302, the lifting table; 303, the rack flow line; 4, the first silicon wafer tongue inserting module; 401, the misaligned flow line; 402, the misaligned cylinder; 5, the NG recycling module; 501, the recycling box; 502, the flipping flow line; 503, the hinge seat; 504, the flipping cylinder; 6, the second rack lifting module; 7, the second silicon wafer tongue inserting module; 8, the centering and clamping module; 801, the bidirectional sliding table; 802, the positioning frame; 803, the roller; 9, the silicon wafer buffer module; 901, the second lifting linear module; 902, the buffer rack; 903, the positioning rod; 10, the silicon wafer rack. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0028] Embodiment:

[0029] Reference Figures 1-9 An automatic loading and unloading device for processing photovoltaic cells is shown, which includes a silicon wafer loading machine and a silicon wafer unloading machine. The silicon wafer loading machine includes a loading machine frame, an upper-layer conveying mechanism of the loading machine, a lower-layer conveying mechanism of the loading machine, a first rack lifting module 3 and a first silicon wafer tongue inserting module 4. The upper-layer conveying mechanism of the loading machine includes a first silicon wafer conveying line 101, a furnace ash visual inspection module 102, a crack detection component 103 and an NG handling manipulator 104. The structure of the lower-layer conveying mechanism of the loading machine is the same as that of the upper-layer conveying mechanism of the loading machine. The silicon wafer unloading machine includes an unloading machine frame, an upper-layer conveying mechanism of the unloading machine, a lower-layer conveying mechanism of the unloading machine, an NG recycling module 5, a second rack lifting module 6, and a second silicon wafer tongue inserting module 7. The upper-layer conveying mechanism of the unloading machine includes a second silicon wafer conveying line 201 and a lane-changing handling module 202. The structure of the lower-layer conveying mechanism of the unloading machine is the same as that of the upper-layer conveying mechanism of the unloading machine. The second rack lifting module 6 has the same structure as the first rack lifting module 3, and the second silicon wafer tongue inserting module 7 has the same structure as the first silicon wafer tongue inserting module 4.

[0030] The first lifting linear module 301 is used to drive the lifting table 302 to perform lifting actions. The rack flow line 303 is used to convey the silicon wafer rack 10. A plurality of positioning grooves are provided on the columns of the silicon wafer rack 10 from top to bottom. Silicon wafers can be stored in the positioning grooves and are separately placed on the silicon wafer rack 10.

[0031] The first silicon wafer tongue inserting module 4 cooperates with the first rack lifting module 3 to pick up wafers from the silicon wafer rack 10 full of wafers and transfer them to the first silicon wafer conveying line 101. By extending the piston rod of the misalignment cylinder 402, the misalignment flow line 401 slides to the lower part of the lowermost wafer on the silicon wafer rack 10. After the silicon wafer rack 10 is driven to descend by the first rack lifting module 3 so that the silicon wafer falls on the misalignment flow line 401, the piston rod of the misalignment cylinder 402 retracts, and the misalignment flow line 401 conveys the silicon wafer to the first silicon wafer conveying line 101.

[0032] The furnace ash visual inspection module 102 includes a bracket and a CCD camera. During the transfer and conveying of the silicon wafer, the CCD camera is used to detect whether there is furnace ash on the surface of the silicon wafer. If there is furnace ash, it is regarded as an NG product. A vacuum chuck is fixedly connected to the moving table of the NG handling manipulator 104. When the silicon wafer fails any one of the furnace ash visual inspection and crack detection, it is unloaded from the first silicon wafer conveying line 101 by the NG handling manipulator 104.

[0033] The translation linear module is used to drive the transfer streamline to translate. The transfer streamline is used to transfer and load wafers. The translation of the transfer streamline realizes the lane change of wafers on different conveyor belts. The transfer manipulator can be used for emergency lane change of wafers. The centering and clamping module 8 is used to center and position the wafers to ensure that the wafers do not shift during the conveying and detection process. The wafer buffer module 9 is used to buffer the wafers to prevent the wafers from piling up in the production line.

[0034] The bidirectional slide 801 is used to drive the positioning frames 802 to approach each other to realize the centering and positioning process of the wafers. During the conveying process of the wafers, the rollers 803 can reduce the contact friction.

[0035] The second lifting linear module 901 of the wafer buffer module 9 is used to drive the buffer rack 902 to perform lifting actions. The buffer rack 902 is arranged on both sides of the first wafer conveying line 101 and the second wafer conveying line 201. The positioning rods 903 on the buffer rack 902 are used to position and support the placed wafers.

[0036] The NG recovery module 5 is used to recover NG wafers. The telescopic movement of the flipping cylinder 504 can drive the flipping streamline 502 to flip around the hinge seat 503. After the NG wafers are flipped downward on the flipping streamline 502, the NG wafers fall into the recovery box 501 for recovery.

[0037] The working principle of the present invention is as follows: When the present invention is in use, the wafer loader and the wafer unloader are respectively arranged at the feeding end and the discharging end of the etching machine for use. After the wafer rack 10 is loaded at the first rack lifting module 3 of the wafer loader, the first wafer tongue module 4 takes and transfers the wafers on the wafer rack 10 to the first wafer conveying line 101. The wafers are sequentially detected at the furnace ash vision detection module and the crack detection component 103 to detect whether there is furnace ash attached to the surface of the wafers and whether there are cracks. If any of the detections is unqualified, it is an NG product. The NG handling manipulator 104 takes the NG product off the first wafer conveying line 101, and the qualified products flow into the etching machine for processing; after the wafers are processed and detected by the etching machine, the NG products flow out of the etching machine and are recovered by the NG recovery module 5. The qualified products are conveyed through the second wafer conveying line 201 and transferred to the second wafer tongue module 7. The second wafer tongue module 7 sequentially places the wafers into the positioning slots on the wafer rack 10 to complete the loading. Finally, after the finished products after etching are filled with the wafer rack 10, they are conveyed and unloaded through the second rack lifting module 6.

[0038] In the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] The above embodiments are used to further illustrate the present invention, but do not limit the present invention to these specific embodiments. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be understood to be within the protection scope of the present invention.

Claims

1. An automatic loading and unloading device for processing photovoltaic cells, characterized in that: It includes a silicon wafer loader and a silicon wafer unloader. The silicon wafer loader includes a loader frame, an upper-layer conveying mechanism of the loader, a lower-layer conveying mechanism of the loader, a first rack lifting module (3), and a first silicon wafer tongue inserting module (4). The upper-layer conveying mechanism of the loader includes a first silicon wafer conveying line (101), a furnace ash visual inspection module (102), a crack detection component (103), and an NG handling manipulator (104). The structure of the lower-layer conveying mechanism of the loader is the same as that of the upper-layer conveying mechanism of the loader. The silicon wafer unloader includes an unloader frame, an upper-layer conveying mechanism of the unloader, a lower-layer conveying mechanism of the unloader, an NG recycling module (5), a second rack lifting module (6), and a second silicon wafer tongue inserting module (7). The upper-layer conveying mechanism of the unloader includes a second silicon wafer conveying line (201) and a lane-changing handling module (202). The structure of the lower-layer conveying mechanism of the unloader is the same as that of the upper-layer conveying mechanism of the unloader. The second rack lifting module (6) has the same structure as the first rack lifting module (3), and the second silicon wafer tongue inserting module (7) has the same structure as the first silicon wafer tongue inserting module (4).

2. An automatic loading and unloading device for processing photovoltaic cells according to claim 1, characterized in that: The first rack lifting module (3) includes a first lifting linear module (301), a lifting table (302), and a rack streamline (303). The first lifting linear module (301) is fixedly connected to the frame. The lifting table (302) is fixedly connected to the moving table of the first lifting linear module (301). The rack streamline (303) is fixedly connected to the lifting table (302).

3. An automatic loading and unloading device for processing photovoltaic cells according to claim 1, characterized in that: The first silicon wafer tongue inserting module (4) includes a dislocation streamline (401) and a dislocation cylinder (402). The dislocation streamline (401) is fixedly connected to the piston rod of the dislocation cylinder (402).

4. An automatic loading and unloading device for processing photovoltaic cells according to claim 1, characterized in that: The furnace ash visual inspection module (102) includes a bracket and a CCD camera. The CCD camera is fixedly connected to the bracket.

5. The automatic loading and unloading equipment for processing photovoltaic cells according to claim 1, wherein: A vacuum suction cup is fixedly connected to the moving table of the NG handling manipulator (104).

6. An automatic loading and unloading device for processing photovoltaic cells according to claim 1, characterized in that: The lane-changing handling module (202) includes a translation linear module, a transfer streamline, and a transfer manipulator. The translation linear module and the transfer manipulator are both fixedly connected to the unloader frame. The transfer streamline is fixedly connected to the moving table of the translation linear module.

7. An automatic loading and unloading device for processing photovoltaic cells according to claim 1, characterized in that: Centering and clamping modules (8) and silicon wafer buffer modules (9) are provided on the first silicon wafer conveying line (101) and the second silicon wafer conveying line (201) in the silicon wafer loader and the silicon wafer unloader respectively.

8. An automatic loading and unloading device for processing photovoltaic cells according to claim 7, characterized in that: The centering and clamping module (8) includes a bidirectional slide (801) and a positioning frame (802). There are specifically two positioning frames (802), and the two positioning frames (802) are respectively fixedly connected to the two moving tables of the bidirectional slide (801). A plurality of rollers (803) are rotatably connected to the positioning frame (802).

9. An automatic loading and unloading device for processing photovoltaic cells according to claim 7, characterized in that: The silicon wafer buffer module (9) includes a second lifting linear module (901) and a buffer rack (902). A plurality of positioning rods (903) are fixedly connected to the buffer rack (902).

10. The automatic loading and unloading equipment for processing photovoltaic cells according to claim 1, characterized in that: The NG recovery module (5) includes a recovery bin (501), a turning streamline (502), a hinge seat (503), and a turning cylinder (504). The hinge seat (503) and the recovery bin (501) are both fixedly connected to the frame of the blanking machine. The turning cylinder (504) and the turning streamline (502) are both hinged to the hinge seat (503), and the piston rod of the turning cylinder (504) is hinged to the other end of the turning streamline (502).

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