A material unloading device and method for wafer processing

Abstract

The present invention discloses a material unloading device and method for wafer processing, comprising a lifting assembly and a material picking assembly; the lifting assembly comprises a base plate, an output end of a driving motor arranged at the bottom is connected to the ball screw transmission, a slider arranged on the ball screw is connected to a movable plate that moves synchronously, a guide transmission rod is fixedly provided on both sides of the movable plate, one end of an unlocking plate is sleeved on the guide transmission rod, and is elastically connected to the movable plate by a spring, and can release the lock of the wafer under the push of the driving motor; the material picking assembly comprises a rotating rod, and a clamping mechanism is respectively provided at both end portions of the rotating rod; a plurality of clamping claws are provided on the outer edge of the clamping mechanism, and a clamping cylinder is installed at the middle position of the upper base plate, and the piston rod of the clamping cylinder is connected to a synchronous connecting piece, and the synchronous connecting piece is movably connected to a clamping claw through a synchronous plate, and the clamping claw can switch the clamping or releasing state under the drive of the clamping cylinder.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to a material unloading device and method for wafer processing. Background Art

[0002] Wafers, a core material in semiconductor manufacturing, are thin, circular sheets made of high-purity single-crystal silicon or other semiconductor materials. They are primarily used in the manufacture of integrated circuits, sensors, optoelectronic devices, and other semiconductor products. An ion implanter is used to implant ions into the wafer surface to alter its electrical properties. This process is typically performed in a vacuum environment. The wafer is placed on a target disk, which secures the wafer and ensures its precise position during the implantation process.

[0003] To prevent wafer displacement during high-speed rotation of the target, existing targets are typically equipped with electrostatic adsorption structures or mechanical stoppers. However, after wafer processing is complete, targets with mechanical stoppers cannot be unlocked or lifted due to the limited space between the target and the base. Therefore, targets with mechanical stoppers are often manually removed.

[0004] Therefore, it is necessary for us to improve such a structure to overcome the above-mentioned defects. Summary of the Invention

[0005] The object of the present invention is to provide a material unloading device and method for wafer processing to solve the problems existing in the prior art.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions:

[0007] A material unloading device for wafer processing, comprising a lifting component and a material taking component;

[0008] The lifting assembly includes a base plate, an output end of a driving motor arranged below the base plate is transmission-connected to a ball screw arranged above the base plate, a slider arranged on the ball screw is connected to a movable plate that moves synchronously, a guide transmission rod is fixedly provided on both sides of the movable plate, one end of an unlocking plate is sleeved on the guide transmission rod and elastically connected to the movable plate by a spring, the other end of the unlocking plate extends to the wafer processing position, and can release the lock of the wafer under the push of the driving motor;

[0009] The material taking assembly includes a rotating rod, a material taking motor for driving the rotating rod to rotate and a material taking cylinder for driving the rotating rod to move up and down are provided below the middle position of the rotating rod, and a clamping mechanism is provided at each end of the rotating rod;

[0010] The clamping mechanism includes an upper base plate, which is fixedly connected to the rotating rod through a fixed shaft, and a plurality of clamping claws are provided along the outer edge of the upper base plate. A clamping cylinder is installed in the middle position of the upper base plate, and the piston rod of the clamping cylinder is connected to a synchronous connecting piece, which is movably connected to a clamping claw through a synchronous plate, and the clamping claw can switch to a clamping or loosening state under the drive of the clamping cylinder.

[0011] A movable base is provided at the bottom of the unlocking plate, and a through hole is provided on both sides of the movable base, and the movable base is sleeved on the guide shaft through the through hole. The two ends of the guide shaft are respectively installed through a positioning seat, and the positioning seat is fixedly set on the top surface of the movable base plate. A sliding block is provided on the bottom surface of the movable base plate, and the sliding block cooperates with a slide rail arranged parallel to the side of the ball screw.

[0012] The guide transmission rods are respectively located on both sides of the unlocking plate, and the end portions of the guide transmission rods are connected to one end of the first connecting rod, and the other end of the first connecting rod is inclined downward and movably connected to one end of the second connecting rod through the first rotating member. A second rotating member is provided at the other end of the second connecting rod, and a lifting block is respectively provided at the inner side ends of the first rotating member and the second rotating member. The lifting block can be rotated to lift the base plate under the push of the guide transmission rod, and the two lifting blocks located on opposite sides are connected by a synchronous rotating shaft, and a torsion spring for resetting the lifting block is provided on the synchronous rotating shaft.

[0013] The output end of the material taking motor is connected to the first rotating shaft through a gear set, the material taking cylinder is fixedly installed on the top of the first rotating shaft, and the piston rod of the material taking cylinder is connected to the rotating rod.

[0014] A blanking method for wafer processing, the specific steps of which are as follows:

[0015] S1. Unlock

[0016] After the wafer processing is completed, it enters the unloading stage. The drive motor is started to drive the ball screw, so that the slider and movable plate set on the ball screw move forward, and then push the unlocking plate to release the lock on the wafer.

[0017] Furthermore, after the execution of S1 is completed, the following steps are executed:

[0018] S2. Lifting

[0019] After the wafer is unlocked, the unlocking plate will continue to move until the movable base connected to the bottom of the unlocking plate reaches the position of the positioning seat. Due to the obstruction of the positioning seat, the unlocking plate cannot move forward any further.

[0020] Then, the movable plate will compress the spring and continue to move forward under the action of the ball screw and the slider. Since the unlocking plate is blocked, the guide transmission rod fixedly connected to the movable plate will move forward along the shaft hole at the end of the unlocking plate.

[0021] The first connecting rod and the second connecting rod arranged at the end of the guide transmission rod will rotate under the transmission of the guide transmission rod, thereby driving the lifting blocks arranged at the inner ends of the first rotating member and the second rotating member to rotate, thereby completing the lifting of the wafer.

[0022] Furthermore, after the execution of S2 is completed, the following steps are executed:

[0023] S3. Reclaiming

[0024] After the wafer is lifted, the pick-up motor starts, which drives the rotating rod to rotate above the wafer. Then the pick-up cylinder starts, which drives the rotating rod downward, so that the wafer is within the clamping range of the clamping mechanism.

[0025] Then the clamping cylinder is started, and the piston rod of the clamping cylinder drives the clamping claw to retract through the synchronous connection piece and the synchronous plate to complete the clamping of the wafer;

[0026] Finally, the material picking motor and the material picking cylinder are started in reverse to store the processed wafers; during the above S3 process, the clamping mechanism located at the other end of the rotating rod will place the wafer to be processed on the wafer processing position.

[0027] In summary, the present invention has the following beneficial effects:

[0028] By setting up a driving motor, the unlocking plate can be driven to complete linear movement and the lifting movement of the jacking block set on the side of the unlocking plate, thereby realizing the unlocking and lifting action of the target plate assembly, thereby greatly reducing the installation space of the unlocking and lifting assembly.

[0029] By setting the lifting component and the material-retrieving component as an integrated structure, it saves installation space and also facilitates the unlocking, lifting, unloading and connection of the unloading processes during the wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the unloading device for wafer processing described in the present invention.

[0031] Figure 2 It is a schematic diagram of the material taking component described in the present invention.

[0032] Figure 3 Schematic diagram of the clamping mechanism of the present invention.

[0033] Figure 4 Schematic diagram of the lifting assembly of the present invention.

[0034] Figure 5 It is a top view of the lifting assembly described in the present invention. DETAILED DESCRIPTION

[0035] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below with reference to diagrams and specific embodiments.

[0036] like Figures 1 to 5 As shown, the present invention proposes a material unloading device for wafer processing, comprising a lifting component 1 and a material taking component 2;

[0037] The lifting assembly 1 includes a base plate 11, an output end of a drive motor 12 disposed below the base plate 11 is transmission-connected to a ball screw 13 disposed above the base plate 11, a slider 14 disposed on the ball screw 13 is connected to a movable plate 15 that moves synchronously, a guide transmission rod 16 is fixedly disposed on both sides of the movable plate 15, one end of an unlocking plate 17 is sleeved on the guide transmission rod 16, and is elastically connected to the movable plate 15 by a spring 18, the other end of the unlocking plate 17 extends to the wafer processing position, and can unlock the wafer under the push of the drive motor 12;

[0038] The material taking assembly 2 includes a rotating rod 21, a material taking motor 22 for driving the rotating rod 21 to rotate and a material taking cylinder 23 for driving the rotating rod 21 to move up and down are provided below the middle position of the rotating rod 21, and a clamping mechanism 3 is provided at each end of the rotating rod 21;

[0039] The clamping mechanism 3 includes an upper base plate 31, which is fixedly connected to the rotating rod 21 through a fixed axis. A plurality of clamping claws 32 are provided along the outer edge of the upper base plate 31. A clamping cylinder 33 is installed in the middle position of the upper base plate 31. The piston rod of the clamping cylinder 33 is connected to a synchronous connecting piece 34. The synchronous connecting piece 34 is movably connected to a clamping claw 32 through a synchronous plate 35, and the clamping claw 32 can switch to a clamping or loosening state under the drive of the clamping cylinder 33.

[0040] A movable base 171 is provided at the bottom of the unlocking plate 17, and a through hole is provided on each side of the movable base 171, and the movable base 171 is sleeved on the guide shaft 172 through the through hole. The two ends of the guide shaft 172 are respectively installed through a positioning seat 173, and the positioning seat 173 is fixedly set on the top surface of the movable base plate 174. A sliding block 175 is provided on the bottom surface of the movable base plate 174, and the sliding block 175 cooperates with a slide rail 176 arranged parallel to the side of the ball screw 13.

[0041] The guide transmission rod 16 is respectively located on both sides of the unlocking plate 17, and the end of the guide transmission rod 16 is connected to one end of the first connecting rod 161. The other end of the first connecting rod 161 is tilted downward and is movably connected to one end of the second connecting rod 163 through the first rotating member 162. A second rotating member 164 is provided at the other end of the second connecting rod 163, and a lifting block 165 is provided at the inner end of the first rotating member 162 and the second rotating member 164 respectively. The lifting block 165 can be rotated to lift the wafer under the push of the guide transmission rod 16. The two lifting blocks 165 on opposite sides are connected by a synchronous rotating shaft 166, and a torsion spring 167 for resetting the lifting block 165 is provided on the synchronous rotating shaft 166.

[0042] The output end of the feeding motor 22 is connected to the first rotating shaft 24 through a gear set. The feeding cylinder 23 is fixedly installed on the top of the first rotating shaft 24 , and the piston rod of the feeding cylinder 23 is connected to the rotating rod 21 .

[0043] A blanking method for wafer processing, the specific steps of which are as follows:

[0044] S1. Unlock

[0045] After the wafer processing is completed, the unloading stage begins. The drive motor 12 is started to drive the ball screw 13, so that the slider 14 and the movable plate 15 provided on the ball screw 13 move forward, thereby pushing the unlocking plate 17 to release the lock on the wafer.

[0046] S2. Lifting

[0047] After the wafer is unlocked, the unlocking plate 17 will continue to move until the movable base 171 connected to the bottom of the unlocking plate 17 reaches the position of the positioning seat 173. Due to the obstruction of the positioning seat 173, the unlocking plate 17 cannot move forward any further.

[0048] Then, the movable plate 15 will compress the spring 18 and continue to move forward under the action of the ball screw 13 and the slider 14. Since the unlocking plate 17 is blocked, the guide transmission rod 16 fixedly connected to the movable plate 15 will move forward along the shaft hole at the end of the unlocking plate 17.

[0049] The first connecting rod 161 and the second connecting rod 163 provided at the end of the guide transmission rod 16 will rotate under the drive of the guide transmission rod 16, thereby driving the lifting block 165 provided at the inner end of the first rotating member 162 and the second rotating member 164 to rotate, thereby completing the lifting of the wafer;

[0050] S3. Reclaiming

[0051] After the wafer is lifted, the pick-up motor 22 is started, and the pick-up motor 22 drives the rotating rod 21 to rotate above the wafer. Then the pick-up cylinder 23 is started, and the pick-up cylinder 23 drives the rotating rod 21 to move downward, so that the wafer is located within the clamping range of the clamping mechanism 3;

[0052] Then the clamping cylinder 33 is started, and the piston rod of the clamping cylinder 33 drives the clamping claw 32 to retract through the synchronous connection 34 and the synchronous plate 35, completing the clamping of the wafer;

[0053] Finally, the material picking motor 22 and the material picking cylinder 23 are started in reverse to store the processed wafers; in the above process, the clamping mechanism 3 located at the other end of the rotating rod 21 will place the wafer to be processed on the wafer processing position.

[0054] In this document, the directions or positional relationships indicated by terms such as "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "vertical", and "horizontal" are based on the directions or positional relationships shown in the accompanying drawings and are only for the clarity of the technical solution and the convenience of description, and therefore should not be understood as limiting the present invention.

[0055] As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion of elements other than the listed elements and may also include additional elements not specifically listed.

[0056] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A blanking device for wafer processing, characterized in that: It comprises a lifting component (1) and a material taking component (2); The lifting assembly (1) includes a base plate (11), an output end of a driving motor (12) arranged below the base plate (11) is transmission-connected to a ball screw (13) arranged above the base plate (11), a slider (14) arranged on the ball screw (13) is connected to a movable plate (15) that moves synchronously, a guide transmission rod (16) is fixedly arranged on both sides of the movable plate (15), one end of an unlocking plate (17) is sleeved on the guide transmission rod (16), and is elastically connected to the movable plate (15) through a spring (18), and the other end of the unlocking plate (17) extends to the wafer processing position and can release the lock on the wafer under the push of the driving motor (12); The material taking assembly (2) includes a rotating rod (21), a material taking motor (22) for driving the rotating rod (21) to rotate and a material taking cylinder (23) for driving the rotating rod (21) to move up and down are provided below the middle position of the rotating rod (21), and a clamping mechanism (3) is provided at each end of the rotating rod (21); The clamping mechanism (3) includes an upper base plate (31), which is fixedly connected to the rotating rod (21) via a fixed shaft, and a plurality of clamping claws (32) are provided along the outer edge of the upper base plate (31). A clamping cylinder (33) is installed in the middle position of the upper base plate (31), and the piston rod of the clamping cylinder (33) is connected to a synchronous connecting piece (34). The synchronous connecting piece (34) is movably connected to a clamping claw (32) via a synchronous plate (35), and the clamping claw (32) can switch between a clamping state and a loose state under the drive of the clamping cylinder (33); The bottom of the unlocking plate (17) is provided with a movable base (171), and a through hole is respectively provided on both sides of the movable base (171), and the movable base (171) is sleeved on the guide shaft (172) through the through hole. The two ends of the guide shaft (172) are respectively installed through a positioning seat (173), and the positioning seat (173) is fixedly provided on the top surface of the movable base plate (174). A sliding block (175) is provided on the bottom surface of the movable base plate (174), and the sliding block (175) cooperates with a slide rail (176) provided parallel to the side of the ball screw (13); The guide transmission rod (16) is respectively located on both sides of the unlocking plate (17), and the end of the guide transmission rod (16) is connected to one end of the first connecting rod (161). The other end of the first connecting rod (161) is tilted downward and is movably connected to one end of the second connecting rod (163) through the first rotating member (162). A second rotating member (164) is provided at the other end of the second connecting rod (163). A lifting block (165) is respectively provided at the inner end of the first rotating member (162) and the second rotating member (164). The lifting block (165) can be rotated to lift the wafer under the push of the guide transmission rod (16). The two lifting blocks (165) on the opposite sides are connected by a synchronous rotating shaft (166). A torsion spring (167) for resetting the lifting block (165) is provided on the synchronous rotating shaft (166).

2. The unloading device for wafer processing according to claim 1, characterized in that: The output end of the feeding motor (22) is connected to the first rotating shaft (24) through a gear set. The feeding cylinder (23) is fixedly mounted on the top of the first rotating shaft (24). The piston rod of the feeding cylinder (23) is connected to the rotating rod (21).

3. A blanking method for wafer processing, characterized in that: The blanking device according to any one of claims 1 to 2 is provided, and the specific steps are as follows: S1. Unlock After the wafer processing is completed, the unloading stage begins, and the drive motor (12) is started to drive the ball screw (13), so that the slider (14) and the movable plate (15) arranged on the ball screw (13) move forward, and then push the unlocking plate (17) to release the lock on the wafer.

4. The blanking method for wafer processing according to claim 3, characterized in that: After S1 is completed, the following steps are performed: S2. Lifting After the wafer is unlocked, the unlocking plate (17) will continue to move until the movable base (171) connected to the bottom of the unlocking plate (17) reaches the position of the positioning seat (173). Due to the obstruction of the positioning seat (173), the unlocking plate (17) cannot continue to move forward; Then, the movable plate (15) will continue to move forward under the action of the ball screw (13) and the slider (14) by compressing the spring (18). Since the unlocking plate (17) is blocked, the guide transmission rod (16) fixedly connected to the movable plate (15) will move forward along the shaft hole at the end of the unlocking plate (17); The first connecting rod (161) and the second connecting rod (163) arranged at the end of the guide transmission rod (16) will rotate under the transmission of the guide transmission rod (16), thereby driving the lifting block (165) arranged at the inner end of the first rotating member (162) and the second rotating member (164) to rotate, thereby completing the lifting of the wafer.

5. The blanking method for wafer processing according to claim 4, characterized in that: After the execution of S2 is completed, the following steps are performed: S3. Reclaiming After the wafer is lifted, the material taking motor (22) is started, and the material taking motor (22) drives the rotating rod (21) to rotate to the top of the wafer, and then the material taking cylinder (23) is started, and the material taking cylinder (23) drives the rotating rod (21) to move downward, so that the wafer is located within the clamping range of the clamping mechanism (3); Then the clamping cylinder (33) is started, and the piston rod of the clamping cylinder (33) drives the clamping claw (32) to contract through the synchronous connecting piece (34) and the synchronous plate (35), thereby completing the clamping of the wafer; Finally, the material taking motor (22) and the material taking cylinder (23) are started in reverse to store the processed wafers; in the above-mentioned S3 process, the clamping mechanism (3) located at the other end of the rotating rod (21) will place the wafer to be processed on the wafer processing position.

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