Indoor drawer type low-voltage switch cabinet
Through the coordinated work of intelligent temperature control and dust-proof components, the problems of low heat dissipation efficiency and easy dust accumulation of switch cabinets are solved, precise temperature regulation and effective dust barrier are achieved, and the reliability and service life of the equipment are improved.
Patent Information
- Application Number
- CN202510575325.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-06
- Publication Date
- 2025-07-11
AI Technical Summary
Traditional switch cabinets have low heat dissipation efficiency, easy dust accumulation and high energy consumption, making it difficult to achieve accurate temperature adjustment, affecting the reliability and service life of the equipment.
It adopts intelligent temperature control components, dustproof components and mobile switching components, and the coordinated work of semiconductor temperature control modules, servo motor-driven sealing plates and electronic control valves, accurate temperature regulation and effective dust barrier are achieved.
It realizes precise control of the temperature in the switch cabinet, reduces dust intrusion, improves heat dissipation efficiency, reduces energy consumption, and extends the service life of the equipment.
Smart Images

Figure CN120300633A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of switch cabinets, and more specifically, to a drawer-type low-voltage switch cabinet for indoor use. Background Art
[0002] In the power distribution system, as a key device, the internal temperature control and dust-proof performance of the switch cabinet directly affect the reliability and service life of the equipment operation. Traditional switch cabinets mainly adopt passive heat dissipation methods, such as natural ventilation or adding cooling fans, but there are the following technical defects: Conventional heat dissipation schemes are difficult to achieve precise temperature regulation, the temperature inside the cabinet fluctuates greatly, and local overheating or condensation is likely to occur under extreme climate conditions, affecting the performance of electrical components; The open heat dissipation structure is prone to dust accumulation. Especially in a dusty industrial environment, dust adhesion will cause the heat dissipation efficiency to drop by more than 30%, and may trigger safety hazards such as short circuits. Existing dust removal schemes mostly rely on manual cleaning at regular intervals, with high maintenance costs and poor timeliness; The continuously operating cooling fan or heater has high energy consumption and lacks an intelligent adjustment mechanism. It still works continuously when the temperature reaches the standard, resulting in energy waste. Summary of the Invention
[0003] Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a drawer-type low-voltage switch cabinet for indoor use to solve the problems in the background art.
[0004] To achieve the above purpose, the present invention adopts the following technical solutions; A drawer-type low-voltage switch cabinet for indoor use, including a switch cabinet body. The front of the switch cabinet body is provided with drawer slots arranged at equal distances. An extraction unit is slidably installed inside the drawer slots. Bus ducts are provided on both the left and right sides of the switch cabinet body. Uniformly distributed wire holes are provided on the inner wall of the bus ducts. The wire holes are communicated with the inside of the drawer slots. Two electric control valves I are installed on the inner wall of the drawer slots. The electric control valve I is communicated with the bus duct. Two air intake slots are provided at the bottom of the switch cabinet body. An installation box is installed on the inner wall of the bus duct. The bottom of the installation box is located inside the air intake slot. A temperature control component and a dust-proof component are provided inside the air intake slot. Two cooling fans are fixedly installed on the top of the switch cabinet body. A mobile switching component is provided on the top of the switch cabinet body. The cooling fans are located on the top of the bus duct. A processor is integrated inside the switch cabinet body. The cooling fans, the mobile switching component, the electric control valve I, the temperature control component and the dust-proof component are all signal-connected to the processor.
[0005] The temperature control component includes a partition board, which is installed on the inner wall of the installation box. A semiconductor temperature control module is installed on the partition board. Two electric control valves II are fixedly installed on the top of the installation box, and the two electric control valves II are respectively located on the left and right sides of the partition board. A sealing plate is slidably installed on the inner wall of the installation box, and the sealing plate is located at the bottom of the partition board. A servo motor is fixedly installed on the outside of the installation box, and the output shaft of the servo motor penetrates the installation box and meshes with the bottom of the sealing plate through a gear. The semiconductor temperature control module, the electric control valve II and the servo motor are all signal-connected to the processor. An auxiliary component is arranged on the top of the partition board.
[0006] The dust-proof component includes a dust-proof board, which is slidably connected to the inner wall of the installation box. The dust-proof board is located at the bottom of the sealing plate. A uniformly distributed spring is fixedly connected to the top of the dust-proof board, and the top end of the spring is connected to the inner wall of the installation box. An electromagnet is installed on the inner wall of the installation box, and a metal plate is magnetically connected to the bottom of the electromagnet. The metal plate is installed on the top of the dust-proof board.
[0007] The mobile switching component includes a double-shaft motor, which is fixedly installed on the top of the switch cabinet body. A lead screw is fixedly installed on the output shaft of the double-shaft motor. Two synchronous seats are threadedly connected to the lead screw. The synchronous seats are slidably installed on the top of the switch cabinet body. A shielding plate is fixedly connected to the top of the synchronous seat, and a dust-proof net is connected to the shielding plate. Two cleaning motors are fixedly installed on the top of the switch cabinet body, and a cleaning brush disc is fixedly installed at the output end of the cleaning motor. The cleaning brush disc is located at the bottom of the dust-proof net.
[0008] As a further description of the above technical solution: The auxiliary component includes two exhaust pipes, and the two exhaust pipes are respectively installed on the left and right sides of the semiconductor temperature control module. The other ends of the exhaust pipes penetrate and extend to the outside of the switch cabinet body. Electric control valves III are installed on both exhaust pipes, and the electric control valves III are signal-connected to the processor.
[0009] As a further description of the above technical solution: Air intake grilles are installed on both the front and back of the switch cabinet body, and the air intake grilles shield the air intake slots.
[0010] As a further description of the above technical solution: An elastic sealing sleeve is connected to the inner wall of the wire hole, and the elastic sealing sleeve wraps the wire harness.
[0011] As a further description of the above technical solution: Guide plates are evenly connected to both the left and right sides of the partition board, and the evenly distributed guide plates are arranged in a staggered manner.
[0012] As a further description of the above technical solution: A rubber ring is connected to the inner wall of the installation box, and the rubber ring is located at the bottom of the dust-proof plate and contacts the dust-proof plate.
[0013] As a further description of the above technical solution: Temperature sensors are installed on the inner walls of both the drawer slot and the busbar duct, and the temperature sensors are signal-connected to the processor.
[0014] As a further description of the above technical solution: A buzzer is installed on the side of the switch cabinet body, and the buzzer is signal-connected to the processor.
[0015] Compared with the prior art, the advantages of the present invention are as follows: 1. In the present invention, first of all, in terms of dust-proof performance, when the shielding plate of the mobile switching component is completely closed, it forms a double protection barrier with the dust-proof component, which can effectively block most of the external dust from invading. At the same time, the top cleaning motor drives the cleaning brush disc to periodically clean the dust-proof net, and cooperates with the inertial dust-removing mechanism of the bottom dust-proof plate to ensure that the system maintains excellent dust-proof effect for a long time.
[0016] 2. Secondly, in terms of heat preservation and heat dissipation, through the intelligent control of the processor, when the temperature sensor detects abnormal temperature inside the cabinet, the system can quickly switch the working mode. In the heat preservation state, the sealing inside the switch cabinet can prevent heat dissipation, so as to keep the temperature constant and avoid the inability to operate inside the low-temperature switch cabinet. When there is a heat dissipation requirement, the cooperative work of the semiconductor temperature control module and the heat dissipation fan can improve the cooling efficiency.
[0017] 3. Finally, in the application of the semiconductor temperature control module, its unique double-sided temperature control characteristics cooperate with the precise positioning of the sealing plate driven by the servo motor to realize the intelligent switching of the hot and cold surfaces, which not only shortens the temperature adjustment response time, but also can accurately control the temperature fluctuation inside the cabinet within the range. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a three-dimensional structural schematic diagram of the present invention; Figure 2 is a front sectional structural schematic diagram of the present invention; Figure 3 is a front sectional structural schematic diagram of the installation box of the present invention; Figure 4 is a partial three-dimensional structural schematic diagram of the dust-proof component of the present invention; Figure 5 is a partial staircase structural schematic diagram of the mobile switching component of the present invention; Figure 6 is a principle schematic diagram of the present invention.
[0019] Description of the reference numerals in the drawings: 1. Switch cabinet body; 2. Drawer slot; 3. Withdrawal unit; 4. Bus duct; 5. Wire hole; 6. Electric control valve I; 7. Air intake slot; 8. Installation box; 9. Temperature control component; 901. Partition board; 902. Semiconductor temperature control module; 903. Electric control valve II; 904. Sealing plate; 905. Servo motor; 10. Dust prevention component; 1001. Dust prevention board; 1002. Spring; 1003. Electromagnet; 1004. Metal plate; 11. Heat dissipation fan; 12. Mobile switching component; 1201. Biaxial motor; 1202. Synchronous seat; 1203. Baffle plate; 1204. Dustproof net; 1205. Cleaning motor; 1206. Cleaning brush disc; 13. Processor; 14. Auxiliary component; 1401. Exhaust pipe; 1402. Electric control valve III; 15. Air intake grille; 16. Elastic sealing sleeve; 17. Guide plate; 18. Rubber ring; 19. Temperature sensor; 20. Buzzer. Detailed implementation manner
[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention; Please refer to Figures 1 to 6 , in the present invention, a drawer-type low-voltage switch cabinet for indoor use includes a switch cabinet body 1. Drawer slots 2 arranged at equal distances are opened on the front surface of the switch cabinet body 1. A withdrawal unit 3 is slidably installed inside the drawer slot 2. Bus ducts 4 are opened on both the left and right sides of the switch cabinet body 1. Uniformly distributed wire holes 5 are opened on the inner wall of the bus duct 4. The wire holes 5 communicate with the inside of the drawer slot 2. Two electric control valves I 6 are installed on the inner wall of the drawer slot 2. The electric control valve I 6 communicates with the bus duct 4. Two air intake slots 7 are opened at the bottom of the switch cabinet body 1. An installation box 8 is installed on the inner wall of the bus duct 4. The bottom of the installation box 8 is located inside the air intake slot 7. A temperature control component 9 and a dust prevention component 10 are arranged inside the air intake slot 7. Two heat dissipation fans 11 are fixedly installed on the top of the switch cabinet body 1. A mobile switching component 12 is arranged on the top of the switch cabinet body 1. The heat dissipation fans 11 are located on the top of the bus duct 4. A processor 13 is integrated inside the switch cabinet body 1. The heat dissipation fans 11, the mobile switching component 12, the electric control valve I 6, the temperature control component 9, and the dust prevention component 10 are all signal-connected to the processor 13.
[0021] The temperature control component 9 includes a partition plate 901 which is installed on the inner wall of the installation box 8. A semiconductor temperature control module 902 is installed on the partition plate 901. Two second electric control valves 903 are fixedly installed on the top of the installation box 8, and the two second electric control valves 903 are respectively located on the left and right sides of the partition plate 901. A sealing plate 904 is slidably installed on the inner wall of the installation box 8, and the sealing plate 904 is located at the bottom of the partition plate 901. A servo motor 905 is fixedly installed on the outside of the installation box 8. The output shaft of the servo motor 905 penetrates through the installation box 8 and is engaged with the bottom of the sealing plate 904 through a gear. The semiconductor temperature control module 902, the second electric control valve 903 and the servo motor 905 are all signal-connected to the processor 13. An auxiliary component 14 is arranged on the top of the partition plate 901.
[0022] The dust-proof component 10 includes a dust-proof plate 1001 which is slidably connected to the inner wall of the installation box 8. The dust-proof plate 1001 is located at the bottom of the sealing plate 904. A uniformly distributed spring 1002 is fixedly connected to the top of the dust-proof plate 1001, and the top end of the spring 1002 is connected to the inner wall of the installation box 8. An electromagnet 1003 is installed on the inner wall of the installation box 8, and a metal plate 1004 is magnetically connected to the bottom of the electromagnet 1003. The metal plate 1004 is installed on the top of the dust-proof plate 1001.
[0023] The mobile switching component 12 includes a double-shaft motor 1201 which is fixedly installed on the top of the switch cabinet body 1. A lead screw is fixedly installed on the output shaft of the double-shaft motor 1201. Two synchronous seats 1202 are threadedly connected to the lead screw. The synchronous seats 1202 are slidably installed on the top of the switch cabinet body 1. A shielding plate 1203 is fixedly connected to the top of the synchronous seat 1202. A dust-proof net 1204 is connected to the shielding plate 1203. Two cleaning motors 1205 are fixedly installed on the top of the switch cabinet body 1. A cleaning brush disc 1206 is fixedly installed at the output end of the cleaning motor 1205, and the cleaning brush disc 1206 is located at the bottom of the dust-proof net 1204.
[0024] The auxiliary component 14 includes two exhaust pipes 1401 which are respectively installed on the left and right sides of the semiconductor temperature control module 902. The other ends of the exhaust pipes 1401 penetrate through and extend to the outside of the switch cabinet body 1. Electric control valves three 1402 are installed on both of the exhaust pipes 1401, and the electric control valves three 1402 are signal-connected to the processor 13; Temperature sensors 19 are installed on the inner walls of both the inner wall of the drawer slot 2 and the bus bar groove 4, and the temperature sensors 19 are signal-connected to the processor 13.
[0025] When the switch cabinet body 1 is put into operation, the processor 13 continuously monitors the internal environment temperature of the switch cabinet body 1 through the temperature sensors 19, and dynamically adjusts the working states of each component according to the real-time data. Under normal conditions, all the heat dissipation valves are in an open state to achieve convective heat dissipation.
[0026] In a low-temperature environment, when the detected temperature is lower than the set threshold, the processor 13 immediately activates the heating mode, controls the servo motor 905 to drive the sealing plate 904 to move down to the bottom of the cooling surface of the semiconductor temperature control module 902, and simultaneously opens the corresponding second electric control valve 903. At this time, the external cold air enters the installation box 8 through the bottom air intake groove 7. Under the guidance of the sealing plate 904 and the partition plate 901, the air flow is forced to flow through the heating surface of the semiconductor temperature control module 902 for temperature increase treatment. The heated warm air enters the inside of the busbar groove 4 through the opened second electric control valve 903, realizing uniform heating of the switch cabinet body 1.
[0027] As the temperature rises to the set range, the system automatically switches to the heat preservation mode. The processor 13 first closes the second electric control valve 903 to block the air flow channel, and at the same time controls the operation of the mobile switching component 12. The double-shaft motor 1201 drives the baffle plate 1203 to completely cover the air outlet of the heat dissipation fan 11, forming a sealed space to maintain the temperature stability. During this process, the top cleaning motor 1205 is started synchronously, driving the cleaning brush disc 1206 to rotate and clean the dust-proof net 1204 to ensure the subsequent heat dissipation efficiency; Meanwhile, the electromagnet 1003 in the bottom dust-proof component 10 is energized to adsorb the metal plate 1004, so that the dust-proof plate 1001 compresses the spring 1002 and moves down. After a short hold, the electromagnet 1003 is de-energized, and the inertial force generated by the rapid rebound of the spring 1002 shakes off the dust attached to the dust-proof plate 1001 completely, completing the self-cleaning process.
[0028] During the above process, the exhaust pipe 1401 at the top of the sealing plate 904 and the corresponding third electric control valve 1402 are opened correspondingly, so that the heat generated by the heat dissipation surface is discharged in time. In the actual operation process, a heat exchanger can be connected at the position of the exhaust pipe 1401 of the switch cabinet body 1 to realize heat energy recovery.
[0029] When the ambient temperature rises or the internal temperature of the switch cabinet body 1 exceeds the upper limit due to equipment operation, the system immediately switches to the refrigeration mode. The processor 13 controls the servo motor 905 to adjust the position of the sealing plate 904 so that it covers the heating surface and exposes the cooling surface, and at the same time re-opens the second electric control valve 903. After the external hot air flows through the cooling surface of the semiconductor temperature control module 902 and is cooled, the cold air flow enters the inside of the switch cabinet body 1 through the conveying pipeline. The mobile switching component 12 synchronously withdraws the baffle plate 1203, and the heat dissipation fan 11 resumes operation to accelerate heat exchange, forming a complete temperature adjustment cycle. During the whole process, the temperature sensor 19 continuously feeds back data, and the processor 13 dynamically adjusts the power output of the semiconductor temperature control module 902 and the opening degrees of each valve accordingly, ensuring that the temperature is always maintained in the optimal working range, and at the same time maintaining the long-term stable operation of the system through a periodic self-cleaning mechanism.
[0030] In the present invention, first in terms of dust-proof performance, when the shutter 1203 of the mobile switching component 12 is fully closed, it forms a double protection barrier with the dust-proof component 10, which can effectively block most of the external dust from invading. At the same time, the top cleaning motor 1205 drives the cleaning brush disc 1206 to periodically clean the dust-proof net 1204, and cooperates with the inertial dust-removing mechanism of the bottom dust-proof plate 1001 to ensure that the system maintains excellent dust-proof effect for a long time.
[0031] Secondly, in terms of heat preservation and heat dissipation, through the intelligent regulation of the processor 13, when the temperature sensor 19 detects abnormal temperature inside the cabinet, the system can quickly switch the working mode. In the heat preservation state, the sealed shell inside the switch cabinet 1 prevents heat dissipation, so as to keep the temperature constant and avoid the inability to operate inside the low-temperature switch cabinet. When heat dissipation is required, the collaborative work of the semiconductor temperature control module 902 and the heat dissipation fan 11 can improve the cooling efficiency.
[0032] Finally, in the application of the semiconductor temperature control module 902, its unique double-sided temperature control characteristic, combined with the precise positioning of the sealing plate 904 driven by the servo motor 905, realizes the intelligent switching of the hot and cold surfaces, not only shortening the temperature adjustment response time, but also accurately controlling the temperature fluctuation inside the cabinet within a range.
[0033] Please refer to Figure 1 and 2 , in which: intake grilles 15 are installed on both the front and back of the switch cabinet 1, and the intake grilles 15 shield the intake slots 7.
[0034] In the present invention, the intake grilles 15 can effectively block large particle debris from entering the intake slots 7. At the same time, its reasonable hole design ensures smooth air flow through. The grille structure is convenient for disassembly and cleaning, and the maintenance cycle can be extended, significantly reducing the operation and maintenance costs.
[0035] Please refer to Figure 2 , in which: an elastic sealing sleeve 16 is connected to the inner wall of the wire hole 5, and the elastic sealing sleeve 16 wraps the wire harness.
[0036] In the present invention, the elastic sealing sleeve 16 is made of weather-resistant silicone material, which not only realizes protection and effectively prevents dust and moisture from invading, but also its elastic structure can adapt to wire harnesses of different diameters, improving the installation convenience. At the same time, this sealing sleeve can reduce the friction loss of the wire harness and extend the service life of the cable.
[0037] Please refer to Figure 2 and 3 , in which: guide plates 17 are evenly connected to both the left and right sides of the partition 901, and the evenly distributed guide plates 17 are arranged in a staggered manner.
[0038] In the present invention, the staggered guide plate 17 forms a turbulent flow channel, which improves the exchange efficiency when the air flow passes through the semiconductor temperature control module 902 and avoids local overheating and overcooling phenomena.
[0039] Please refer to Figures 1 to 4 , wherein: a rubber ring 18 is connected to the inner wall of the installation box 8. The rubber ring 18 is located at the bottom of the dust-proof plate 1001 and contacts the dust-proof plate 1001.
[0040] In the present invention, the rubber ring 18 is made of oil-resistant and high-temperature-resistant material, which plays a role in buffering and shock absorption when the dust-proof plate 1001 moves, reduces noise and limits the movement range of the dust-proof plate 1001.
[0041] Please refer to Figure 6 , wherein: a buzzer 20 is installed on the side of the switch cabinet body 1. The buzzer 20 is signal-connected to the processor 13.
[0042] In the present invention, when the processor 13 detects an abnormal temperature or a device failure, the buzzer 20 can issue a differentiated alarm to quickly locate the fault, and at the same time supports a remote silencing function, which is convenient for use in noise-sensitive environments.
[0043] The above is only a preferred specific embodiment of the present invention; however, the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and its improved concept of the present invention, makes an equivalent substitution or change, and should be covered by the protection scope of the present invention.
Claims
1. A drawer-type low-voltage switchgear for indoor use, comprising a switch cabinet body (1), characterized in that: The front of the switch cabinet body (1) is provided with drawer slots (2) arranged at equal distances. An extraction unit (3) is slidably installed inside the drawer slots (2). Bus ducts (4) are provided on both the left and right sides of the switch cabinet body (1). Uniformly distributed wire holes (5) are provided on the inner wall of the bus ducts (4). The wire holes (5) communicate with the inside of the drawer slots (2). Two first electric control valves (6) are installed on the inner wall of the drawer slots (2). The first electric control valves (6) communicate with the bus ducts (4). Two air intake slots (7) are provided at the bottom of the switch cabinet body (1). An installation box (8) is installed on the inner wall of the bus duct (4). The bottom of the installation box (8) is located inside the air intake slot (7). A temperature control component (9) and a dust prevention component (10) are arranged inside the air intake slot (7). Two heat dissipation fans (11) are fixedly installed at the top of the switch cabinet body (1). A mobile switching component (12) is arranged at the top of the switch cabinet body (1). The heat dissipation fans (11) are located on the top of the bus ducts (4). A processor (13) is integrated inside the switch cabinet body (1). The heat dissipation fans (11), the mobile switching component (12), the first electric control valves (6), the temperature control component (9) and the dust prevention component (10) are all connected to the processor (13) by signals; The temperature control component (9) includes a partition board (901). The partition board (901) is installed on the inner wall of the installation box (8). A semiconductor temperature control module (902) is installed on the partition board (901). Two second electric control valves (903) are fixedly installed at the top of the installation box (8). The two second electric control valves (903) are respectively located on the left and right sides of the partition board (901). A sealing plate (904) is slidably installed on the inner wall of the installation box (8). The sealing plate (904) is located at the bottom of the partition board (901). A servo motor (905) is fixedly installed on the outside of the installation box (8). The output shaft of the servo motor (905) penetrates the installation box (8) and meshes with the bottom of the sealing plate (904) through a gear. The semiconductor temperature control module (902), the second electric control valves (903) and the servo motor (905) are all connected to the processor (13) by signals. An auxiliary component (14) is arranged on the top of the partition board (901); The dust prevention component (10) includes a dust prevention plate (1001). The dust prevention plate (1001) is slidably connected to the inner wall of the installation box (8). The dust prevention plate (1001) is located at the bottom of the sealing plate (904). Uniformly distributed springs (1002) are fixedly connected to the top of the dust prevention plate (1001). The top ends of the springs (1002) are connected to the inner wall of the installation box (8). An electromagnet (1003) is installed on the inner wall of the installation box (8). A metal plate (1004) is magnetically connected to the bottom of the electromagnet (1003). The metal plate (1004) is installed on the top of the dust prevention plate (1001); The mobile switching component (12) includes a biaxial motor (1201). The biaxial motor (1201) is fixedly installed on the top of the switch cabinet body (1). A lead screw is fixedly installed on the output shaft of the biaxial motor (1201). Two synchronous seats (1202) are threadedly connected to the lead screw. The synchronous seats (1202) are slidably installed on the top of the switch cabinet body (1). A shielding plate (1203) is fixedly connected to the top of the synchronous seat (1202). A dust-proof net (1204) is connected to the shielding plate (1203). Two cleaning motors (1205) are fixedly installed on the top of the switch cabinet body (1). A cleaning brush disc (1206) is fixedly installed at the output end of the cleaning motor (1205). The cleaning brush disc (1206) is located at the bottom of the dust-proof net (1204).
2. The drawer-type low-voltage switchgear for indoor use according to claim 1, wherein: The auxiliary component (14) includes two exhaust pipes (1401). The two exhaust pipes (1401) are respectively installed on the left and right sides of the semiconductor temperature control module (902). The other ends of the exhaust pipes (1401) penetrate and extend to the outside of the switch cabinet body (1). An electric control valve III (1402) is installed on each of the two exhaust pipes (1401). The electric control valve III (1402) is signal-connected to the processor (13).
3. A drawer-type low-voltage switchgear for indoor use according to claim 1, characterized in that: Air intake grilles (15) are installed on both the front and back of the switch cabinet body (1). The air intake grilles (15) shield the air intake slots (7).
4. A drawer-type low-voltage switchgear for indoor use according to claim 1, characterized in that: An elastic sealing sleeve (16) is connected to the inner wall of the wire hole (5). The elastic sealing sleeve (16) wraps the wire harness.
5. A drawer - type low - voltage switchgear for indoor use according to claim 1, characterized in that: Guide plates (17) evenly distributed are connected to both the left and right sides of the partition plate (901). The evenly distributed guide plates (17) are arranged in a staggered manner.
6. A drawer-type low-voltage switchgear for indoor use according to claim 1, characterized in that: A rubber ring (18) is connected to the inner wall of the installation box (8). The rubber ring (18) is located at the bottom of the dust-proof plate (1001) and contacts the dust-proof plate (1001).
7. A drawer-type low-voltage switchgear for indoor use according to claim 1, characterized in that: Temperature sensors (19) are installed on the inner walls of both the drawer slot (2) and the busbar groove (4). The temperature sensors (19) are signal-connected to the processor (13).
8. A drawer-type low-voltage switchgear for indoor use according to claim 1, characterized in that: A buzzer (20) is installed on the side of the switch cabinet body (1). The buzzer (20) is signal-connected to the processor (13).