Heat dissipation structure of power integrated circuit and production method of heat dissipation structure

Abstract

The invention discloses a heat dissipation structure of a power integrated circuit and a production method thereof, the heat dissipation structure comprises at least two layers of circuit boards which are sequentially stacked from top to bottom, an insulating layer is arranged between two adjacent circuit boards, and each circuit board or each insulating layer is provided with a hollow heat dissipation channel. Compared with the prior art, the hollow heat dissipation flow channels are arranged in the circuit board and the insulating layer, and the hollow heat dissipation flow channels can allow fluid media such as air or special cooling liquid to pass through, so that circulating heat dissipation is realized, heat dissipation is effectively performed on the integrated circuit, and the problem that heat dissipation of the medium-high frequency transformer is difficult is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures, and in particular to a heat dissipation structure for a power integrated circuit and a production method thereof. Background Art

[0002] With the development of technology, existing integrated circuits are mainly developing towards smaller volume, more functions, and higher integration. Facing such small-sized chips, they need to face usage environments with high working frequencies and fast computing speeds. Undoubtedly, this will cause the chips of the integrated circuit to heat up during operation. If the integrated circuit approaches the working limit temperature, it will affect its electrical performance and working performance. Therefore, it is necessary to dissipate heat from the integrated current in a timely manner.

[0003] In the application of medium and high-frequency transformers of power supplies, especially planar transformers, which have multiple printed circuit boards, insulation is required between each layer of the circuit board, and the entire printed circuit board is equivalent to an integrated circuit, generating a large amount of heat in a high-frequency working environment and requiring timely heat dissipation. For example, the patent document with the application number 202280045860X discloses a multi-layer printed circuit board that lacks a heat dissipation structure and has problems with difficult heat dissipation. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a heat dissipation structure for a power integrated circuit and a production method thereof, which can solve the problem of difficult heat dissipation in the past by adding a heat dissipation structure in the integrated circuit.

[0005] To solve the above technical problem, the present invention discloses a heat dissipation structure for a power integrated circuit, which includes at least two layers of circuit boards stacked on top of each other from top to bottom, an insulating layer is formed between adjacent two circuit boards, and each circuit board and / or the insulating layer is provided with a cavity heat dissipation channel.

[0006] Among them, the insulating layer includes an insulating outer cover encapsulated on the outer peripheral side of the circuit board, and the insulating outer cover is provided with heat dissipation grooves for forming cavity heat dissipation channels.

[0007] Among them, the insulating layer is one or a combination of two or more of epoxy resin, FR-4 material, PI material, and ceramic material.

[0008] Among them, the circuit board includes a first copper plate and a second copper plate, the first copper plate and the second copper plate are aligned in the height direction, the end face of the first copper plate facing the second copper plate is provided with a first heat dissipation groove, and the end face of the second copper plate facing the first copper plate is provided with a second heat dissipation groove; in the assembled state, the first heat dissipation groove and the second heat dissipation groove are aligned in the vertical direction so that a cavity heat dissipation channel is formed between the two.

[0009] Among them, the heat dissipation grooves of two adjacent circuit boards are arranged oppositely, so that the two heat dissipation grooves enclose a hollow heat dissipation channel.

[0010] The present application also provides a production method of a heat dissipation structure for a power integrated circuit, including the following steps. Step a: Pre-fabricate a hollow heat dissipation channel. Take two copper plates. First, open a first heat dissipation groove on the bottom surface of one of the copper plates, and then open a second heat dissipation groove on the top surface of the other copper plate. Step b: Etch the circuit. Etch the corresponding circuit on each copper plate in step a. Step c: Prepare a single circuit board. Stack the etched copper plates, and align the first heat dissipation groove and the second heat dissipation groove in the height direction, so that the first heat dissipation groove and the second heat dissipation groove form a hollow heat dissipation flow channel. Finally, fix the two copper plates by pressing, and encapsulate them with an insulating material to prepare a single circuit board with a hollow heat dissipation channel. Step d: Press multiple circuit boards. Stack and press at least two circuit boards with hollow heat dissipation flow channels prepared in step c to form a four-layer copper double-sided circuit. Step e: Process the shape of the product prepared in step d.

[0011] The present application also provides another production method of a heat dissipation structure for a power integrated circuit, including the following steps. Step S1: Pre-fabricate a circuit board. Process a circuit on one side or both sides of a single copper plate, and encapsulate it with an insulating material to prepare a circuit board with an insulating outer cover. Step S2: Pre-fabricate a hollow heat dissipation channel. Open a heat dissipation groove on the insulating outer cover of the circuit board in step S1. Stack two circuit boards with heat dissipation grooves opened, and arrange the heat dissipation grooves of two adjacent circuit boards oppositely, so that the two heat dissipation grooves enclose a hollow heat dissipation channel. Then press them, so that the insulating layer between two adjacent circuit boards forms a hollow heat dissipation channel. Step S3: Process the shape of the product prepared in step S2.

[0012] The present application also provides a production method for a heat dissipation structure of a power integrated circuit, including the following steps. Step A: Pre-fabricate a circuit board with a hollow heat dissipation channel. Take two copper plates. First, open a first heat dissipation groove on the bottom surface of one of the copper plates, and then open a second heat dissipation groove on the top surface of the other copper plate. Etch corresponding circuits on each copper plate. The etched copper plates are stacked, and the first heat dissipation groove and the second heat dissipation groove are aligned in the height direction so that the first heat dissipation groove and the second heat dissipation groove form a hollow heat dissipation flow channel. Finally, fix the two copper plates by pressing. After encapsulating with an insulating material, a circuit board with a hollow heat dissipation channel is prepared, and an insulating outer cover is formed on the outer peripheral side of the circuit board. Step B: Open heat dissipation slots on the insulating outer cover of the circuit board in Step A. Stack the two circuit boards with heat dissipation slots opened, and set the heat dissipation slots of adjacent two circuit boards opposite to each other so that the two heat dissipation slots enclose a hollow heat dissipation channel. Then press and fix so that the insulating layer between adjacent two circuit boards forms a hollow heat dissipation channel. Step C: Perform shape processing on the product prepared in Step S2.

[0013] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0014] By providing a hollow heat dissipation flow channel in the circuit board and the insulating layer, the hollow heat dissipation flow channel can allow fluid media such as air or a special coolant to pass through, realizing circulating heat dissipation, effectively dissipating heat from the integrated circuit, solving the problem of difficult heat dissipation of medium and high frequency transformers. The overall structure is simple and compact, and the structure is stable, capable of dissipating heat in time and reducing losses when high-frequency current passes through the power circuit.

[0015] The production method of the heat dissipation structure of the power integrated circuit of the present application has reasonable process design, simple overall process, and good economic benefits. The integrated circuit produced by this method has good heat dissipation performance. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 It is a cross-sectional view of the heat dissipation structure of the power integrated circuit in Embodiment 1;

[0018] Figure 2 It is a cross-sectional view of the heat dissipation structure of the power integrated circuit in Embodiment 2;

[0019] Figure 3 It is a cross-sectional view of the heat dissipation structure of the power integrated circuit in Embodiment 3. Detailed implementation manners

[0020] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] The terms "first", "second", etc. in the specification and claims of the present invention and the above accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, device, product or terminal including a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or terminals.

[0022] Referring to "embodiment" herein means that a specific feature, structure or characteristic described in connection with the embodiment may be included in at least one embodiment of the present invention. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0023] Embodiment 1

[0024] One of the specific implementation manners of a heat dissipation structure of a power integrated circuit disclosed by the present invention is as follows. Please refer to Figure 1 , the heat dissipation structure includes a plurality of circuit boards 1 stacked layer by layer from top to bottom, an insulating layer 2 is formed between adjacent two circuit boards 1, and each insulating layer 2 is provided with a cavity heat dissipation channel.

[0025] As a preferred solution, the insulating layer 2 includes an insulating outer cover encapsulated on the outer peripheral side of the circuit board 1. It can be understood that the insulating outer cover is formed by curing an insulating material during the insulation encapsulation process of the circuit board 1. The insulating outer covers of two adjacent circuit boards 1 are pressed together to form the overall insulating layer 2. The insulating outer cover is provided with at least one heat dissipation groove 33 for forming a hollow heat dissipation channel. The heat dissipation grooves 33 of two adjacent circuit boards 1 are arranged opposite to each other so that the two heat dissipation grooves 33 enclose the hollow heat dissipation channel. Specifically, when the number of circuit boards 1 is two, a heat dissipation groove 33 is provided on the bottom surface of the insulating outer cover of the upper circuit board 1, and a heat dissipation groove 33 is provided on the top surface of the insulating outer cover of the lower circuit board 1. In the assembled state, the two heat dissipation grooves 33 are arranged opposite to each other so that the two heat dissipation grooves 33 enclose the hollow heat dissipation channel. When the number of circuit boards 1 is three, for the middle circuit board 1, heat dissipation grooves 33 are provided on both the top surface and the bottom surface of its insulating outer cover, which are mainly used to cooperate with the heat dissipation grooves 33 of the upper and lower two circuit boards 1 to form the hollow heat dissipation channel.

[0026] It should be noted that the depth or width of the heat dissipation groove 33 can be set according to actual needs. The depth or width of the heat dissipation groove 33 can directly affect the volume of the hollow heat dissipation channel, and the height of the hollow heat dissipation channel can be defined according to the actual required heat dissipation effect to meet the overcurrent during the operation of the high-frequency transformer and the skin effect of the high-frequency copper wire.

[0027] As a preferred solution, the insulating layer (insulating outer jacket) is one or a combination of two or more of epoxy resin, FR-4 material, PI material, and ceramic material, which can meet the insulation requirements.

[0028] Compared with the prior art, the heat dissipation structure of this embodiment realizes cyclic heat dissipation by providing a hollow heat dissipation channel in the insulating layer 2. The hollow heat dissipation channel can allow fluid media such as air or special coolant to pass through, effectively dissipating heat from the integrated circuit and solving the problem of difficult heat dissipation of the medium-high frequency transformer. The overall structure is simple and compact, and the structure is stable. It can dissipate heat in time and reduce losses when the power circuit passes high-frequency current, and can reduce the copper consumption by 30% compared with the traditional integrated current.

[0029] One specific implementation manner of a method for producing a heat dissipation structure of a power integrated circuit disclosed in the present invention includes the following steps.

[0030] Step S1, prefabricate a circuit board, process a circuit on one side or both sides of a single copper plate, and encapsulate it with an insulating material to prepare a circuit board with an insulating outer cover.

[0031] Step S2: Pre-fabricate a cavity heat dissipation channel. Open heat dissipation slots 33 in the insulating outer cover of the circuit board in Step S1. Stack the two circuit boards with heat dissipation slots 33 opened, and set the heat dissipation slots 33 of adjacent two circuit boards opposite to each other so that the two heat dissipation slots 33 enclose a cavity heat dissipation channel. Then press them together so that the insulating layer between adjacent two circuit boards forms a cavity heat dissipation channel.

[0032] Step S3: Machine the shape of the product prepared in Step S2.

[0033] The production method of the power integrated circuit heat dissipation structure in this embodiment has reasonable process design, simple overall process, and good economic benefits. The integrated circuit produced by this method has good heat dissipation performance.

[0034] Embodiment 2

[0035] The present invention discloses a second specific embodiment of a power integrated circuit heat dissipation structure. Please refer to Figure 2 , the heat dissipation structure includes multiple circuit boards 1 stacked in sequence from top to bottom. An insulating layer 2 is provided between adjacent two circuit boards 1, and a cavity heat dissipation channel is provided in each circuit board 1.

[0036] As a preferred solution, the circuit board 1 includes a first copper plate 11 and a second copper plate 12. The first copper plate 11 and the second copper plate 12 are aligned in the height direction. A first heat dissipation groove 31 is opened on the end face of the first copper plate 11 facing the second copper plate 12, and a second heat dissipation groove 32 is opened on the end face of the second copper plate 12 facing the first copper plate 11. In the assembled state, the first heat dissipation groove 31 and the second heat dissipation groove 32 are aligned in the vertical direction so that a cavity heat dissipation channel 3 is formed between them.

[0037] Optionally, the depth or width of the first heat dissipation groove 31 and the depth or width of the second heat dissipation groove 32 can be set according to actual needs. The depth or width of the heat dissipation groove can directly affect the volume of the cavity heat dissipation channel, and the height of the cavity heat dissipation channel can be defined according to the actual required heat dissipation effect to meet the overcurrent during the operation of the high-frequency transformer and the skin effect of the high-frequency copper wire.

[0038] As a preferred solution, the insulating layer 2 is one or a combination of two or more of epoxy resin, FR-4 material, PI material, and ceramic material. The combination of epoxy resin and FR-4 or PI or ceramic can meet the insulation requirements.

[0039] Compared with the prior art, the heat dissipation structure of this embodiment realizes circulating heat dissipation by arranging a hollow heat dissipation channel inside the circuit board 1, through which fluid media such as air or special coolant can pass, effectively dissipating heat from the integrated circuit and solving the problem of difficult heat dissipation of medium and high-frequency transformers. The overall structure is simple and compact, with stable structure, capable of dissipating heat in time and reducing losses when high-frequency current passes through the power circuit, and the copper consumption can be reduced by 30% compared with the traditional integrated current.

[0040] The present invention discloses a second specific implementation manner of a production method of a heat dissipation structure for a power integrated circuit, including the following steps.

[0041] Including the following steps: Step a, prefabricate a hollow heat dissipation channel. Take two copper plates. First, open a first heat dissipation groove on the bottom surface of one of the copper plates, and then open a second heat dissipation groove on the top surface of the other copper plate.

[0042] Step b, etch the circuit. Etch the corresponding circuit on each copper plate in step a.

[0043] Step c, prepare a single circuit board. Stack the etched copper plates, and align the first heat dissipation groove and the second heat dissipation groove in the height direction so that the first heat dissipation groove and the second heat dissipation groove form a hollow heat dissipation flow channel. Finally, fix the two copper plates by pressing, and prepare a single circuit board with a hollow heat dissipation channel after encapsulation with an insulating material.

[0044] Step d, press multiple circuit boards. Stack and press at least two circuit boards with hollow heat dissipation flow channels prepared in step c to form a four-layer copper double-sided circuit.

[0045] Step e, perform shape processing on the product prepared in step d.

[0046] The production method of the heat dissipation structure of the power integrated circuit in this embodiment has reasonable process design, simple overall process, and good economic benefits. The integrated circuit produced by this method has good heat dissipation performance.

[0047] Embodiment 3

[0048] The present invention discloses a third specific implementation manner of a heat dissipation structure for a power integrated circuit. Please refer to Figure 3 , which includes multiple circuit boards 1 stacked layer by layer from top to bottom. An insulating layer 2 is formed between adjacent two circuit boards 1. Hollow heat dissipation channels 3 are provided inside each circuit board 1 and each insulating layer 2. It should be noted that the structure of the hollow heat dissipation channel 3 inside the circuit board 1 is the same as that of the hollow heat dissipation channel 3 inside the circuit board 1 in Embodiment 1, and the structure of the hollow heat dissipation channel 3 in the insulating layer 2 is the same as that of the hollow heat dissipation channel 3 in the insulating layer 2 in Embodiment 2.

[0049] The heat dissipation structure of the power integrated circuit in this embodiment has a better heat dissipation effect than those in Embodiment 1 and Embodiment 2.

[0050] The present invention discloses a third specific embodiment of a production method for a heat dissipation structure of a power integrated circuit, including the following steps.

[0051] Step A: Prepare a circuit board with a hollow heat dissipation channel. Take two copper plates. First, open a first heat dissipation groove on the bottom surface of one of the copper plates, and then open a second heat dissipation groove on the top surface of the other copper plate. Etch the corresponding circuits on each copper plate. Stack the etched copper plates, and align the first heat dissipation groove and the second heat dissipation groove in the height direction so that the first heat dissipation groove and the second heat dissipation groove form a hollow heat dissipation flow channel. Finally, fix the two copper plates by pressing, and after encapsulating with an insulating material, a circuit board with a hollow heat dissipation channel is prepared, and an insulating outer cover is formed on the outer peripheral side of the circuit board.

[0052] Step B: Open heat dissipation grooves 33 on the insulating outer cover of the circuit board in Step A. Stack the two circuit boards with heat dissipation grooves 33 opened, and set the heat dissipation grooves 33 of adjacent two circuit boards opposite to each other so that the two heat dissipation grooves 33 enclose a hollow heat dissipation channel, and then press and fix them so that the insulating layer between adjacent two circuit boards forms a hollow heat dissipation channel.

[0053] Step C: Perform shape processing on the product prepared in Step S2.

[0054] The production method of the heat dissipation structure of the power integrated circuit in this embodiment has a reasonable process design, a simple overall process, and good economic benefits. The integrated circuit produced by this method has good heat dissipation performance.

[0055] Finally, it should be noted that what is disclosed in a heat dissipation structure of a power integrated circuit and its production method according to an embodiment of the present invention is only a preferred embodiment of the present invention, only for explaining the technical solution of the present invention, rather than limiting it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation structure for a power integrated circuit, characterized in that, It includes at least two layers of circuit boards stacked one above the other from top to bottom. An insulating layer is formed between adjacent circuit boards, and hollow heat dissipation channels are provided on each of the circuit boards and / or the insulating layer.

2. The heat dissipation structure of a power integrated circuit according to claim 1, wherein The insulating layer includes an insulating outer cover encapsulated on the outer peripheral side of the circuit board, and the insulating outer cover is provided with heat dissipation grooves for forming the hollow heat dissipation channels.

3. The heat dissipation structure of a power integrated circuit according to claim 2, characterized in that, The insulating layer is one or a combination of two or more of epoxy resin, FR-4 material, PI material, and ceramic material.

4. A heat dissipation structure for a power integrated circuit according to claim 1 or 2, characterized in that, The circuit board includes a first copper plate and a second copper plate. The first copper plate and the second copper plate are aligned in the height direction. A first heat dissipation groove is provided on the end face of the first copper plate facing the second copper plate, and a second heat dissipation groove is provided on the end face of the second copper plate facing the first copper plate. In the assembled state, the first heat dissipation groove and the second heat dissipation groove are aligned in the vertical direction so that a hollow heat dissipation channel is formed therebetween.

5. The heat dissipation structure of a power integrated circuit according to claim 2, characterized in that, The heat dissipation grooves of adjacent two circuit boards are arranged opposite to each other so that the two heat dissipation grooves enclose the hollow heat dissipation channel.

6. A production method of a heat dissipation structure for a power integrated circuit, characterized in that It includes the following steps. Step a: Preparing the hollow heat dissipation channel. Take two copper plates. First, a first heat dissipation groove is formed on the bottom surface of one of the copper plates, and then a second heat dissipation groove is formed on the top surface of the other copper plate. Step b: Etching the circuit. Etch the corresponding circuits on each of the copper plates in step a. Step c: Preparing a single circuit board. The etched copper plates are stacked, and the first heat dissipation groove and the second heat dissipation groove are aligned in the height direction so that the first heat dissipation groove and the second heat dissipation groove form a hollow heat dissipation flow channel. Finally, the two copper plates are fixed by pressing, and after being encapsulated with an insulating material, a single circuit board with a hollow heat dissipation channel is prepared. Step d: Pressing multiple circuit boards. Stack and press at least two circuit boards with hollow heat dissipation flow channels prepared in step c to form a four-layer copper double-sided circuit. Step e: Machining the shape of the product prepared in step d.

7. A production method of a heat dissipation structure for a power integrated circuit, characterized in that, It includes the following steps. Step S1: Preparing the circuit board. Machine the circuit on one side or both sides of a single copper plate, and encapsulate it with an insulating material to prepare a circuit board with an insulating outer cover. Step S2: Preparing the hollow heat dissipation channel. Open heat dissipation grooves on the insulating outer cover of the circuit board in step S1. Stack the two circuit boards with heat dissipation grooves opened, and arrange the heat dissipation grooves of adjacent two circuit boards opposite to each other so that the two heat dissipation grooves enclose the hollow heat dissipation channel, and then press to make the insulating layer between adjacent two circuit boards form a hollow heat dissipation channel. Step S3: Machining the shape of the product prepared in step S2.

8. A production method of a heat dissipation structure for a power integrated circuit, characterized in that It includes the following steps. Step A: Prepare a circuit board with a hollow heat dissipation channel. Take two copper plates. First, open a first heat dissipation groove on the bottom surface of one of the copper plates, and then open a second heat dissipation groove on the top surface of the other copper plate. Etch the corresponding circuits on each copper plate. The etched copper plates are stacked, and the first heat dissipation groove and the second heat dissipation groove are aligned in the height direction so that the first heat dissipation groove and the second heat dissipation groove form a hollow heat dissipation flow channel. Finally, fix the two copper plates by pressing, and after encapsulating with an insulating material, a circuit board with a hollow heat dissipation channel is prepared, and an insulating outer cover is formed on the outer peripheral side of the circuit board; Step B: Open heat dissipation slots on the insulating outer cover of the circuit board in Step A. Stack the two circuit boards with heat dissipation slots opened, and set the heat dissipation slots of adjacent two circuit boards opposite to each other so that the two heat dissipation slots enclose a hollow heat dissipation channel, and then press and fix so that the insulating layer between adjacent two circuit boards forms a hollow heat dissipation channel; Step C: Machine the shape of the product prepared in Step S2.

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