An automatic bending device for an FPC flexible circuit board and its bending method

Abstract

The present invention discloses an automatic bending device for flexible printed circuit boards (FPCs) and a bending method thereof, relating to the technical field of FPC bending. The device comprises a bending box, wherein a curing mechanism is provided in the middle portion of the upper end of the bending box, an air pipe rack is provided on one side of the upper end of the bending box, four FPC substrate mechanisms distributed in a circular array are provided inside the curing mechanism, and a coating mechanism is provided on one side of the upper end of the bending box for cooperating with the curing mechanism to perform glue pre-pressing treatment on the FPC inside the FPC substrate mechanism. The air guide in the present invention extracts air above the substrate, allowing the thin film to fit tightly to the surface of the FPC circuit board, helping the glue to spread quickly on the surface of the FPC circuit board. The negative pressure accelerates the flow and diffusion of the glue, ensuring that the glue can evenly cover the area to be bonded, especially the circuit connection points in complex shapes or confined spaces.

Description

Technical Field

[0001] The present invention relates to the technical field of FPC bending, and in particular to an automatic bending device for an FPC flexible circuit board and a bending method thereof. Background Art

[0002] For example, the announcement number is CN116056345B, and the name is FPC flexible circuit board automatic bending mechanism. This invention solves the problem that existing FPCs are difficult to bend or easily rebound after bending during the automatic bending process; it realizes the automatic bending of FPC flexible circuit boards without excessive human intervention, and can quickly bend FPCs according to actual needs, without the risk of displacement or rebound, ensuring that each FPC has the same shape and size after bending.

[0003] During the bending process of the aforementioned FPC flexible circuit boards, there are problems such as low positioning accuracy and stress concentration in the bending area, which can easily lead to copper foil breakage or structural damage. Especially when bending FPCs with complex circuit layouts, the internal circuits lack effective support, which can easily cause deformation or even failure, affecting circuit performance. To address these issues and improve the accuracy, stability, and automation level of the FPC bending process, this application provides an automatic bending device and bending method for FPC flexible circuit boards. Through precise adsorption positioning, pre-pressing, automatic bonding of reinforcement sheets, and hot air-assisted bending, these devices enhance the mechanical strength of the bending area and prevent stress concentration damage to meet these requirements. Summary of the Invention

[0004] The purpose of this application is to provide an FPC flexible circuit board automatic bending device and a bending method thereof, which can effectively solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present application provides the following technical solutions: an automatic bending device for an FPC flexible circuit board, comprising a bending box, a curing mechanism provided at the middle portion of the upper end of the bending box, an air pipe rack provided on one side of the upper end of the bending box, four FPC substrate mechanisms distributed in a circular array provided inside the curing mechanism, a laminating mechanism provided on one side of the upper end of the bending box for cooperating with the curing mechanism to perform a dispensing and pre-pressing treatment on the FPC inside the FPC substrate mechanism, and a bending mechanism provided on one side of the upper end of the bending box for providing additional support to the FPC bending area;

[0006] The FPC substrate mechanism includes a substrate board that provides a bending path for the FPC flexible circuit board, a pressing groove is opened at the upper end of the substrate board, an FPC circuit board is set on the outer surface of the substrate board, and a reinforcing sheet that provides additional support for the FPC circuit board is pasted on the bending area of the outer surface of the FPC circuit board.

[0007] Wherein, the curing mechanism includes a rotating disk, a rotating assembly is provided at the bottom of the rotating disk, and the rotating assembly is installed in the middle of the upper end of the bending box, the substrate plate is installed inside the rotating disk, and a mounting shell is provided at the upper end of the rotating disk, a plurality of control valves are provided inside the mounting shell, and an air suction pipe and an air retracting and releasing pipe are provided on one side of the control valve, an air control box is provided at the upper end of the mounting shell, and the air control box is communicated with the control valve, a connecting pipe is provided at the upper end of the air control box, and one end of the connecting pipe extends to the interior of the air pipe rack.

[0008] Among them, an adsorption cavity is opened inside the substrate plate, a plurality of ventilation holes are opened on the upper surface of the substrate plate, an air guide plate is provided at the upper end of the substrate plate, the air suction pipe passes through the substrate plate and communicates with the interior of the adsorption cavity, and the air retraction and discharge pipe communicates with the interior of the air guide plate.

[0009] The substrate plate is in the shape of a quarter disk, and the air guide plate is in the shape of a quarter ring.

[0010] Wherein, the bending mechanism includes a support frame, which is installed at the upper end of the bending box. An electric push rod is provided on one side of the support frame, a mounting plate is provided at the lower end of the electric push rod, and support sheets are respectively provided on both sides of the mounting plate.

[0011] Among them, a pressure block is provided at the bottom of the support sheet, and a winding drum and a film unwinding drum are rotatably installed at the bottom of the support sheet and on both sides of the pressure block, and the outer surfaces of the film unwinding drum and the winding drum are jointly wrapped with a patch film, and the patch film covers the lower surface of the pressure block, and a driving motor is provided on one side of the winding drum, and the driving motor is installed on one side of the support sheet.

[0012] Wherein, the laminating mechanism includes a mounting frame, which is installed at the upper end of the bending box, a screw rod assembly is provided at the upper end of the mounting frame, a mounting frame is provided at the upper end of the screw rod assembly, a top cover is provided at the upper end of the mounting frame, a push rod is provided at the lower end of the top cover, a cover plate is provided at the lower end of the push rod, and a wedge is provided at the lower end of the cover plate.

[0013] The inner wall of the installation frame is provided with a thin film, a plastic frame is provided at the center of the thin film, a plurality of through holes with equal spacing are opened at the lower end of the plastic frame, and rubber sheets are provided on both sides of the plastic frame.

[0014] Wherein, a capsule bag is arranged inside the plastic frame, a leakage hole corresponding to the position of the through hole is opened at the lower end of the capsule bag, and a permeable sheet is arranged at the lower end of the capsule bag.

[0015] The present invention also provides an automatic bending method for an FPC flexible circuit board. The specific bending method is as follows:

[0016] S1. When the FPC flexible circuit board is bent, the FPC flexible circuit board is placed on the surface of the FPC substrate mechanism, and the laminating mechanism pre-presses the FPC flexible circuit board. In addition, the laminating mechanism also dispenses glue on the surface of the FPC flexible circuit board during the pre-pressing and bending process.

[0017] S2. The curing mechanism rotates and removes the FPC after being processed by the laminating mechanism. The curing mechanism then heats the surface of the FPC to cure the glue applied by the laminating mechanism on the surface of the FPC, thereby providing additional support for the circuit.

[0018] S3. The FPC flexible circuit board processed by the curing mechanism will be moved to the bottom of the bending mechanism, and the bending mechanism will perform the final bending process on the FPC flexible circuit board. During the bending process of the FPC flexible circuit board, the bending mechanism will also add flexible support at the bending part of the FPC flexible circuit board.

[0019] In summary, the technical effects and advantages of the present invention are:

[0020] 1. The air guide in the present invention extracts air from above the substrate, allowing the thin film to fit tightly against the surface of the FPC circuit board, ensuring that there are no bubbles or gaps between the thin film and the FPC, thereby improving the uniformity and consistency of the subsequent glue dispensing process. The glue can be more evenly distributed on the surface of the FPC circuit board through the structural design of the permeable sheet and through holes. Especially for the coating requirements of internal wiring, the air guide continues to extract air to help the glue spread rapidly on the surface of the FPC circuit board. The negative pressure accelerates the flow and diffusion of the glue, ensuring that the glue can evenly cover the areas that need to be bonded, especially the circuit connection points with complex shapes or narrow spaces. When the cover moves downward, the wedge squeezes into the interior of the rubber sheet and squeezes part of the FPC circuit board into the pressing groove. By applying pressure to specific areas, preliminary shape adjustment can be completed before bending. The pre-pressing treatment helps to improve the mechanical strength of these areas, especially in places that need to withstand greater stress, such as near connectors or high-density wiring areas.

[0021] 2. The present invention opens the connecting pipe between the retractable and exhaust air pipe and the air intake pipe through a control valve, so that the two share the air intake channel. The retractable and exhaust air pipe draws air from the top of the FPC circuit board through the air guide plate to achieve negative pressure adsorption and fixation. This method can accurately position the FPC, avoid displacement or damage caused by mechanical clamps, and is suitable for high-cleanliness scenarios. When the substrate board moves to the bottom of the laminating mechanism, the air guide plate continuously draws air to form a negative pressure environment, which helps the laminating material to fit tightly, improves the glue adhesion effect, and ensures uniform glue dispensing. The system then switches to blowing mode, and the air guide plate guides hot air to preheat the FPC, soften the material to facilitate bending and forming, reduce stress concentration, and prevent copper foil breakage. At the same time, the hot air activates the glue molecules and enhances their bonding to the FPC surface. The air guide plate design ensures uniform heat distribution, avoids local overheating or uneven curing, and improves the colloid curing quality and structural stability.

[0022] 3. In the present invention, a reinforcing sheet is pre-placed on the surface of the FPC circuit board before the pressure block applies pressure. This sheet provides additional support before bending, reducing stress concentration and cracking that may occur during the bending process, and increasing the mechanical strength of the FPC in the bending area. Furthermore, after the reinforcing sheet contacts the FPC, the pressure block continues to apply pressure to complete the bending action. The design of the pressure block and the reinforcing sheet ensure uniform pressure distribution during the bending process of the FPC circuit board, avoiding local overpressure or underpressure. This uniform pressure distribution reduces the risk of internal copper foil breakage or other damage caused by excessive bending. After bending is completed, the reinforcing sheet is firmly attached to the FPC's bending area, providing long-term support. The reinforcing sheet enhances the tensile strength of the bending area and prevents deformation or damage to the FPC during subsequent use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a first-person perspective schematic diagram of the FPC flexible circuit board automatic bending device;

[0025] Figure 2 This is a partial first-person perspective schematic diagram of the FPC flexible circuit board automatic bending device;

[0026] Figure 3 A partial second-view perspective schematic diagram of the FPC flexible circuit board automatic bending device;

[0027] Figure 4A partial third-view perspective diagram of the FPC flexible circuit board automatic bending device;

[0028] Figure 5 Schematic diagram of the three-dimensional connection structure of the curing mechanism;

[0029] Figure 6 Schematic diagram of the internal three-dimensional connection structure of the curing mechanism;

[0030] Figure 7 Schematic diagram of the three-dimensional connection structure of the laminating mechanism;

[0031] Figure 8 It is a schematic diagram of the three-dimensional connection structure of the thin film and the plastic frame;

[0032] Figure 9 It is a schematic diagram of the partial three-dimensional connection structure of the laminating mechanism;

[0033] Figure 10 Schematic diagram of the three-dimensional connection structure of the cover plate and the wedge;

[0034] Figure 11 Schematic diagram of the three-dimensional connection structure of the thin film and the capsule package;

[0035] Figure 12 Schematic diagram of the three-dimensional connection structure of the through hole and the rubber sheet;

[0036] Figure 13 Schematic diagram of the three-dimensional connection structure of the capsule package and the permeable sheet;

[0037] Figure 14 A schematic diagram of the three-dimensional connection structure of the FPC substrate mechanism from a first-person perspective;

[0038] Figure 15 A schematic diagram of the three-dimensional connection structure of the FPC substrate mechanism from a second perspective;

[0039] Figure 16 It is a cross-sectional view of the three-dimensional connection structure of the FPC substrate mechanism;

[0040] Figure 17 It is a schematic diagram of the three-dimensional connection structure of the FPC circuit board;

[0041] Figure 18 A schematic diagram of the first-person perspective three-dimensional connection structure of the bending mechanism;

[0042] Figure 19 A schematic diagram of the three-dimensional connection structure of the bending mechanism from a second perspective;

[0043] Figure 20 It is a schematic diagram of the three-dimensional connection structure of the patch coating and the pressing block;

[0044] Figure 21Schematic diagram of the three-dimensional connection structure of the pressing block.

[0045] Figure: 1, bending box; 2, laminating mechanism; 21, mounting frame; 22, screw assembly; 23, top cover; 24, push rod; 25, cover plate; 26, mounting frame; 27, thin film; 28, rubber sheet; 29, plastic frame; 211, through hole; 212, wedge; 213, capsule bag; 214, leak hole; 215, permeable sheet; 3, bending mechanism; 31, support frame; 32, electric push rod; 33, support sheet; 34, mounting plate; 35, drive Motor; 36, take-up drum; 37, patch laminating; 38, pressing block; 39, film unloading drum; 5, FPC substrate mechanism; 51, substrate board; 52, FPC circuit board; 53, reinforcement sheet; 54, air guide sheet; 55, vent hole; 56, pressing sheet groove; 57, adsorption chamber; 6, curing mechanism; 61, air control box; 62, connecting pipe; 63, mounting shell; 64, rotating disk; 65, suction pipe; 66, retractable and discharge air pipe; 67, control valve; 7, air pipe rack. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0047] Example 1, Reference Figures 1 to 21 The device is an automatic bending device for flexible printed circuit boards (FPCs), comprising a bending box 1. A curing mechanism 6 is provided in the middle of the upper end of the bending box 1. An air pipe rack 7 is provided on one side of the upper end of the bending box 1. Four FPC substrate mechanisms 5 arranged in a circular array are provided inside the curing mechanism 6. A laminating mechanism 2 is provided on one side of the upper end of the bending box 1 to perform a dispensing and pre-pressing process on the FPC inside the FPC substrate mechanisms 5 in cooperation with the curing mechanism 6. A bending mechanism 3 is provided on one side of the upper end of the bending box 1 to provide additional support for the FPC bending area.

[0048] It is worth noting that when the FPC flexible circuit board is bent, the FPC flexible circuit board is placed on the surface of the FPC substrate mechanism 5, and the laminating mechanism 2 pre-presses the FPC flexible circuit board. In addition, the laminating mechanism 2 also dispenses glue on the surface of the FPC flexible circuit board during the pre-pressing and bending process.

[0049] The curing mechanism 6 rotates and removes the FPC flexible circuit board processed by the laminating mechanism 2, and then the curing mechanism 6 heats the surface of the FPC flexible circuit board so that the glue applied by the laminating mechanism 2 on the surface of the FPC flexible circuit board solidifies, thereby providing additional support for the circuit;

[0050] Among them, by coating glue on the surface of the FPC and curing it after heating, additional mechanical support can be provided to the FPC, especially in the bending area, which helps prevent damage caused by repeated bending or external pressure. The added glue layer can help disperse stress and reduce the risk of fracture due to local stress concentration. The FPC treated in the above way can withstand more bending cycles without failure, thereby extending its service life.

[0051] The pre-pressing process ensures that the FPC maintains the correct shape and position when bending, reducing errors caused by material rebound or other factors, and the uniform heating provided by the curing mechanism 6 ensures that the glue can be fully cured.

[0052] The FPC flexible circuit board processed by the curing mechanism 6 will be moved to the bottom of the bending mechanism 3, and the bending mechanism 3 will perform the final bending process on the FPC flexible circuit board. During the bending process of the FPC flexible circuit board by the bending mechanism 3, flexible support will also be added at the bending part of the FPC flexible circuit board.

[0053] Among them, adding flexible support at the bend can help disperse stress and prevent cracks or breakage caused by excessive local stress. Flexible support can effectively alleviate fatigue damage caused by repeated bending and extend the service life of FPC.

[0054] Flexible support not only provides physical reinforcement, but also serves as an additional protective layer to prevent external environmental factors such as moisture and dust from affecting the internal circuit. When subjected to external impact, flexible support can play a certain buffering role and protect the fragile internal circuit from damage. By adding flexible support simultaneously during the bending process, the bending angle and shape can be controlled more accurately to ensure that each FPC meets the design requirements.

[0055] Flexible support can appropriately increase the local stiffness of the FPC without sacrificing its flexibility, making the entire structure more stable and reliable. For FPCs that need to form complex three-dimensional shapes, this approach can better support these special needs and ensure that the finished product meets the expected design.

[0056] Embodiment 2: Based on the curing mechanism 6 and the FPC substrate mechanism 5 proposed in embodiment 1, this embodiment provides a further technical solution for the curing mechanism 6 and the FPC substrate mechanism 5.

[0057] The FPC substrate mechanism 5 includes a substrate board 51 that provides a bending path for the FPC flexible circuit board. A pressing groove 56 is provided at the upper end of the substrate board 51. An FPC circuit board 52 is provided on the outer surface of the substrate board 51. A reinforcing sheet 53 is pasted on the bending area of the outer surface of the FPC circuit board 52 to provide additional support for the FPC circuit board 52.

[0058] An adsorption chamber 57 is provided inside the substrate plate 51, and a plurality of air vents 55 are provided on the upper surface of the substrate plate 51. An air guide plate 54 is provided at the upper end of the substrate plate 51. An air suction pipe 65 passes through the substrate plate 51 and communicates with the interior of the adsorption chamber 57. An air retracting and releasing pipe 66 communicates with the interior of the air guide plate 54. The substrate plate 51 is in the shape of a quarter disk, and the air guide plate 54 is in the shape of a quarter ring.

[0059] It is worth noting that the FPC circuit board 52 is first placed on the substrate board 51, and then the curing mechanism 6 extracts the air in the adsorption chamber 57 through the ventilation pipe, and adsorbs and fixes the FPC circuit board 52 on the surface of the substrate board 51 through the vent hole 55. Subsequently, the FPC circuit board 52 adsorbed on the surface of the substrate board 51 rotates together with the curing mechanism 6 and is sent to the bottom of the laminating mechanism 2 for pre-pressing and curing treatment.

[0060] Among them, fixing the FPC circuit board 52 by adsorption can ensure its accurate position on the substrate board 51, avoiding the slight displacement or offset that may be caused by mechanical clamps. High-precision positioning helps the consistency and accuracy of subsequent process steps such as lamination, dispensing and bending. The continuous operation from adsorption and fixation to lamination and then to curing is achieved through the rotation mechanism, which reduces the time loss in the intermediate links and improves the efficiency of the entire production line.

[0061] During the pre-pressing process, the adsorption-fixed FPC can better fit the substrate plate 51, ensuring that there are no bubbles or other defects between the coating material and the FPC surface, thereby ensuring the quality of the coating. Fixing the FPC by adsorption rather than physical clamping can avoid local deformation or damage caused by excessive clamping force, and the adsorption method will not cause scratches or contamination to the FPC surface.

[0062] The curing mechanism 6 includes a rotating disk 64, a rotating assembly is provided at the bottom of the rotating disk 64, and the rotating assembly is installed in the middle of the upper end of the bending box 1, the substrate plate 51 is installed inside the rotating disk 64, and a mounting shell 63 is provided at the upper end of the rotating disk 64. A plurality of control valves 67 are provided inside the mounting shell 63, and an air suction pipe 65 and an air retracting and releasing pipe 66 are provided on one side of the control valve 67. An air control box 61 is provided at the upper end of the mounting shell 63, and the air control box 61 is communicated with the control valve 67. A connecting pipe 62 is provided at the upper end of the air control box 61, and one end of the connecting pipe 62 extends to the interior of the air pipe rack 7.

[0063] It is worth noting that the rotating disk 64 is driven to rotate by the rotating assembly, and then the substrate 51 is driven to rotate by the rotating disk 64. When the FPC circuit board 52 is placed on the surface of the substrate 51, the air inside the adsorption chamber 57 is extracted through the suction pipe 65. When the FPC circuit board 52 is placed on the substrate 51, the control valve 67 opens the connecting pipe between the retractable and discharge air pipe 66 and the suction pipe 65, so that the retractable and discharge air pipe 66 can share an suction pipe with the suction pipe 65. The retractable and discharge air pipe 66 extracts the air above the FPC circuit board 52 through the air guide sheet 54. When the substrate 51 moves to the bottom of the coating mechanism 2, the air drawn by the air guide sheet 54 can cooperate with the coating mechanism 2. The membrane mechanism 2 performs glue dispensing on the surface of the FPC circuit board 52, and when the rotating disk 64 rotates to drive the substrate board 51 to move out, the control valve 67 cuts off the pipeline connecting the retractable air pipe 66 and the suction pipe 65. At this time, the retractable air pipe 66 is connected to the blowing pipe inside the air control box 61, and air is blown into the inside of the retractable air pipe 66 through the blowing pipe, so that the gas blown out of the retractable air pipe 66 is guided by the air guide plate 54 to blow on the surface of the FPC circuit board 52. The hot air blown out through the retractable air pipe 66 can solidify the colloid on the surface of the FPC circuit board 52, and the hot air blown out through the air guide plate 54 can preheat the surface of the FPC circuit board 52.

[0064] Among them, the control valve 67 opens the connecting pipe between the retractable and exhaust air pipe 66 and the intake pipe 65, so that the two share an intake pipe. The retractable and exhaust air pipe 66 extracts air from the upper part of the FPC circuit board 52 through the air guide plate 54 to achieve adsorption and fixation of the FPC. Through the negative pressure adsorption method, the position of the FPC on the substrate is ensured to be accurate, avoiding the slight displacement or offset that may be caused by mechanical clamps. Compared with mechanical clamping, the adsorption method will not cause scratches or damage to the FPC surface, and is particularly suitable for application scenarios that require high cleanliness.

[0065] When the substrate plate 51 moves to the bottom of the laminating mechanism 2, the air guide plate 54 continues to extract the air above and cooperates with the laminating mechanism 2 to perform glue dispensing on the surface of the FPC circuit board 52. The negative pressure environment formed by the air extraction helps the laminating material to fit tightly to the FPC surface. The negative pressure environment can help the glue to adhere better to the FPC surface, ensuring that the gluing process is more uniform. In addition, hot air preheating can soften the FPC material, making it easier to form in the subsequent bending process, reducing stress concentration, and preventing copper foil from breaking. The preheating treatment can activate the glue molecules and promote their better bonding with the FPC surface, thereby enhancing the bonding strength. The hot air distribution is guided by the air guide plate 54 to ensure that the FPC surface is heated evenly, avoiding local overheating or uneven curing. The uniform hot air distribution allows the colloid to cure more thoroughly, reducing the possibility of uncured and enhancing the stability of the overall structure.

[0066] Embodiment 3: Based on the laminating mechanism 2 provided in embodiment 1, this embodiment provides a further technical solution of the laminating mechanism 2.

[0067] The coating mechanism 2 includes a mounting frame 21, which is mounted on the upper end of the bending box 1. A screw assembly 22 is provided at the upper end of the mounting frame 21, a mounting frame 26 is provided at the upper end of the screw assembly 22, a top cover 23 is provided at the upper end of the mounting frame 26, a push rod 24 is provided at the lower end of the top cover 23, a cover plate 25 is provided at the lower end of the push rod 24, and a wedge block 212 is provided at the lower end of the cover plate 25.

[0068] The inner wall of the mounting frame 26 is provided with a thin film 27 , and a plastic frame 29 is provided at the center of the thin film 27 . The lower end of the plastic frame 29 is provided with a plurality of through holes 211 distributed at equal intervals. Rubber sheets 28 are provided on both sides of the plastic frame 29 .

[0069] A capsule package 213 is disposed inside the plastic frame 29 . A leakage hole 214 corresponding to the position of the through hole 211 is opened at the lower end of the capsule package 213 . A permeable sheet 215 is disposed at the lower end of the capsule package 213 .

[0070] It is worth noting that when the substrate plate 51 moves to the bottom of the mounting frame 26, the screw assembly 22 pushes the mounting frame 26 to move. When the mounting frame 26 is moved to the top of the substrate plate 51, the push rod 24 pushes the cover plate 25 to squeeze the capsule bag 213, and the capsule bag 213 squeezes the plastic frame 29. Moreover, the air guide 54 extracts the air above the substrate plate 51, and the thin film 27 also moves to the top of the substrate plate 51. Since the thin film 27 is made of rubber material, the air in the gap between the thin film 27 and the FPC circuit board 52 is extracted by the air guide 54 and then adhered to the surface of the FPC circuit board 52, and the capsule bag 213 is squeezed by the plastic frame 29. After the package 213 is squeezed, the glue inside will leak out through the leak hole 214 onto the surface of the permeable sheet 215. The glue then flows through the permeable sheet 215 into the through hole 211. Because the thin film 27 is adsorbed on the surface of the FPC circuit board 52 and the air between the thin film 27 is extracted by the air guide 54, the plastic frame 29 can be closely attached to the surface of the FPC circuit board 52. After the glue flowing out of the through hole 211 is adsorbed on the surface of the FPC circuit board 52, the air extracted by the air guide 54 can accelerate the diffusion of the glue on the surface of the FPC circuit board 52, so that the glue can be applied to the wiring of the internal circuits of the FPC circuit board 52.

[0071] When the cover plate 25 moves downward, the wedge block 212 will be driven to squeeze into the rubber sheet 28, and then the wedge block 212 will squeeze part of the FPC circuit board 52 into the pressing groove 56, thereby pre-pressing the bent area of the pressing groove 56.

[0072] Among them, the air guide sheet 54 extracts the air above the substrate board 51, so that the thin film 27 can fit tightly on the surface of the FPC circuit board 52, ensuring that there are no bubbles or gaps between the thin film 27 and the FPC, thereby improving the uniformity and consistency of the subsequent gluing process. The glue can be more evenly distributed on the surface of the FPC circuit board 52 through the structural design of the penetration sheet 215 and the through hole 211. In particular, for the coating requirements of the internal circuit wiring, the air guide sheet 54 continues to extract air to help the glue spread quickly on the surface of the FPC circuit board 52, and accelerates the flow and diffusion of the glue through the negative pressure effect, ensuring that the glue can evenly cover the area that needs to be bonded, especially the circuit connection points in complex shapes or narrow spaces.

[0073] When the cover 25 moves downward, the wedge 212 squeezes into the rubber sheet 28 and squeezes part of the FPC circuit board 52 into the pressing groove 56. By applying pressure to specific areas, preliminary shape adjustment can be completed before bending. The pre-pressing treatment helps to improve the mechanical strength of these areas, especially in places that need to withstand greater stress, such as near connectors or high-density wiring areas.

[0074] Embodiment 4: Based on the bending mechanism 3 provided in embodiment 1, this embodiment provides a further technical solution for the bending mechanism 3.

[0075] The bending mechanism 3 includes a support frame 31, which is installed at the upper end of the bending box 1. An electric push rod 32 is provided on one side of the support frame 31, and a mounting plate 34 is provided at the lower end of the electric push rod 32. Support plates 33 are respectively provided on both sides of the mounting plate 34.

[0076] A pressure block 38 is provided at the bottom of the support sheet 33. A winding drum 36 and a film unwinding drum 39 are rotatably installed at the bottom of the support sheet 33 and on both sides of the pressure block 38. The outer surfaces of the film unwinding drum 39 and the winding drum 36 are jointly wound with a patch coating 37. The patch coating 37 covers the lower surface of the pressure block 38. A drive motor 35 is provided on one side of the winding drum 36, and the drive motor 35 is installed on one side of the support sheet 33.

[0077] It is worth noting that when the substrate 51 moves to the bottom of the mounting plate 34, the mounting plate 34 is moved by the electric push rod 32, and then the mounting plate 34 will also drive the support plate 33 to move, and then the support plate 33 drives the pressure block 38 to press the FPC circuit board 52 placed on the upper end of the substrate 51 downward, and the patch film 37 provided will first contact the FPC circuit board 52, and the surface of the patch film 37 provided is provided with a reinforcing sheet 53. When the reinforcing sheet 53 attached to the surface of the patch film 37 contacts the FPC circuit board 52, the pressure block 38 at this time The FPC circuit board 52 will be continuously squeezed to bend the FPC circuit board 52, and the reinforcing sheet 53 will be adhered to the surface of the FPC circuit board 52 through the squeezing of the pressure block 38, and the bending area of the FPC circuit board 52 will be supported by the reinforcing sheet 53. After the FPC circuit board 52 is bent, the driving motor 35 drives the winding drum 36 to rotate, and the winding drum 36 rewinds the patch film 37 to drive the unused reinforcing sheet 53 in the film unwinding drum 39 to move to the bottom of the pressure block 38 to achieve continuous bending support for the FPC circuit board 52.

[0078] Among them, before the pressure block 38 applies pressure, the reinforcing sheet 53 has been pre-placed on the surface of the FPC circuit board 52. The reinforcing sheet 53 can provide additional support before bending, reduce stress concentration and cracks that may occur during the bending process, and increase the mechanical strength of the FPC in the bending area. Moreover, after the reinforcing sheet 53 has contacted the FPC, the pressure block 38 continues to apply pressure to complete the bending action. The design of the pressure block 38 and the reinforcing sheet 53 ensure the uniform distribution of pressure during the bending process of the FPC circuit board 52, avoiding the problem of local overpressure or underpressure. Through uniform pressure distribution, the risk of internal copper foil breakage or other damage caused by excessive bending is reduced.

[0079] After the bending is completed, the reinforcing sheet 53 is firmly attached to the bending area of the FPC to provide long-term support therefor. The reinforcing sheet 53 enhances the tensile strength of the bending area to prevent the FPC from being deformed or damaged during subsequent use.

[0080] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An automatic bending device for flexible printed circuit boards (FPC), comprising a bending box (1), characterized in that: A curing mechanism (6) is provided at the middle of the upper end of the bending box (1), an air pipe rack (7) is provided on one side of the upper end of the bending box (1), four FPC substrate mechanisms (5) distributed in a ring array are provided inside the curing mechanism (6), a laminating mechanism (2) is provided on one side of the upper end of the bending box (1) for performing a glue pre-pressing treatment on the FPC inside the FPC substrate mechanism (5) in cooperation with the curing mechanism (6), and a bending mechanism (3) is provided on one side of the upper end of the bending box (1) for providing additional support to the FPC bending area; The FPC substrate mechanism (5) comprises a substrate plate (51) that provides a bending path for the FPC flexible circuit board, a pressing groove (56) is provided at the upper end of the substrate plate (51), an FPC circuit board (52) is provided on the outer surface of the substrate plate (51), and a reinforcing sheet (53) that provides additional support for the FPC circuit board (52) is adhered to the bending area of the outer surface of the FPC circuit board (52); The curing mechanism (6) includes a rotating disk (64), a rotating assembly is provided at the bottom of the rotating disk (64), and the rotating assembly is installed at the middle of the upper end of the bending box (1), the substrate plate (51) is installed inside the rotating disk (64), the upper end of the rotating disk (64) is provided with a mounting shell (63), a plurality of control valves (67) are provided inside the mounting shell (63), and a suction pipe (65) and a retractable air pipe (66) are provided on one side of the control valve (67), an air control box (61) is provided at the upper end of the mounting shell (63), and the air control box (61) is connected to the control valve (67), a connecting pipe (62) is provided at the upper end of the air control box (61), and one end of the connecting pipe (62) extends to the inside of the air pipe rack (7); An adsorption cavity (57) is provided inside the substrate plate (51), a plurality of vent holes (55) are provided on the upper surface of the substrate plate (51), an air guide plate (54) is provided at the upper end of the substrate plate (51), the air suction pipe (65) passes through the substrate plate (51) and communicates with the interior of the adsorption cavity (57), and the air retraction and release pipe (66) communicates with the interior of the air guide plate (54); The laminating mechanism (2) includes a mounting frame (21), the mounting frame (21) is mounted on the upper end of the bending box (1), the upper end of the mounting frame (21) is provided with a screw assembly (22), the upper end of the screw assembly (22) is provided with a mounting frame (26), the upper end of the mounting frame (26) is provided with a top cover (23), the lower end of the top cover (23) is provided with a push rod (24), the lower end of the push rod (24) is provided with a cover plate (25), and the lower end of the cover plate (25) is provided with a wedge block (212).

2. The FPC automatic bending device according to claim 1, characterized in that: The substrate plate (51) is in the shape of a quarter disk, and the air guide plate (54) is in the shape of a quarter ring.

3. The FPC automatic bending device according to claim 1, characterized in that: The bending mechanism (3) comprises a support frame (31), the support frame (31) being mounted on the upper end of the bending box (1), an electric push rod (32) being provided on one side of the support frame (31), a mounting plate (34) being provided at the lower end of the electric push rod (32), and support plates (33) being provided on both sides of the mounting plate (34).

4. The FPC automatic bending device according to claim 3, characterized in that: A pressure block (38) is provided at the bottom of the support sheet (33), and a winding drum (36) and a film unwinding drum (39) are rotatably installed at the bottom of the support sheet (33) and on both sides of the pressure block (38), and a patch coating (37) is wound around the outer surfaces of the film unwinding drum (39) and the winding drum (36), and the patch coating (37) covers the lower surface of the pressure block (38). A driving motor (35) is provided on one side of the winding drum (36), and the driving motor (35) is installed on one side of the support sheet (33).

5. The FPC automatic bending device according to claim 1, characterized in that: The inner wall of the installation frame (26) is provided with a thin film (27), a plastic frame (29) is provided at the center of the thin film (27), a plurality of through holes (211) distributed at equal intervals are opened at the lower end of the plastic frame (29), and rubber sheets (28) are provided on both sides of the plastic frame (29).

6. The FPC automatic bending device according to claim 5, characterized in that: A capsule bag (213) is provided inside the plastic frame (29), a leakage hole (214) corresponding to the position of the through hole (211) is opened at the lower end of the capsule bag (213), and a permeable sheet (215) is provided at the lower end of the capsule bag (213).

7. A method for automatically bending an FPC flexible circuit board, using the FPC flexible circuit board automatic bending device according to any one of claims 1 to 6, characterized in that: The specific bending method is as follows: S1, when the FPC flexible circuit board is bent, the FPC flexible circuit board is placed on the surface of the FPC substrate mechanism (5), and the laminating mechanism (2) pre-presses the FPC flexible circuit board, and the laminating mechanism (2) also dispenses glue on the surface of the FPC flexible circuit board during the process of pre-pressing and bending the FPC flexible circuit board; S2, the curing mechanism (6) rotates and removes the FPC flexible circuit board processed by the coating mechanism (2), and then the curing mechanism (6) heats the surface of the FPC flexible circuit board so that the glue coated on the surface of the FPC flexible circuit board by the coating mechanism (2) is cured to provide additional support for the circuit; S3. The FPC flexible circuit board processed by the curing mechanism (6) will be moved to the bottom of the bending mechanism (3). The bending mechanism (3) will perform the final bending process on the FPC flexible circuit board. During the bending process of the FPC flexible circuit board by the bending mechanism (3), flexible support will also be added to the bending part of the FPC flexible circuit board.

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