Production process of embedded circuit board

Abstract

The invention provides a production process of an embedded circuit board, which comprises the following steps: forming a base hole in a substrate, the base hole being used for accommodating a chip; positioning the substrate and the chip by using a fixing piece, and pressing the substrate and the chip on the first laminate; the fixing piece is removed; a pickling chamber and a plasma cleaning chamber which are integrally arranged are provided, the chip and the substrate are transferred to a lifting device, the lifting device drives the chip and the substrate to ascend into the plasma cleaning chamber, and plasma cleaning is conducted on the chip and the substrate; the chip and the substrate are driven to descend into the pickling chamber through the lifting device, the water spraying assembly in the pickling chamber is driven to move to the position above the chip and the substrate, and pickling liquid is evenly sprayed to the chip and the substrate; taking out the chip and the substrate; laminating the substrate and the chip on a second layer plate, wherein the first layer plate and the second layer plate are respectively positioned on two opposite sides of the chip; and manufacturing circuits and welding components on the first layer plate and the second layer plate. The production efficiency can be improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit board production, and particularly relates to a production process of an embedded circuit board. Background Art

[0002] An embedded circuit board is a special electronic device that integrates multiple functional modules such as a microprocessor, a memory, and input / output interfaces on a single circuit board. It has a high degree of integration and can achieve complex functions within a limited space. In the existing conventional methods for manufacturing embedded circuit boards, chips are usually positioned using tape and then pressed. After the first pressing, residual glue is generated, which will affect the subsequent second pressing. Therefore, it is necessary to clean the chips after the first pressing. In the prior art, the two processes of plasma cleaning and acid pickling use different devices, resulting in low production efficiency. Summary of the Invention

[0003] The present invention aims to at least solve the above-mentioned technical problems existing in the prior art. For this purpose, the present invention provides a production process of an embedded circuit board, which can improve production efficiency.

[0004] A production process of an embedded circuit board according to an embodiment of the present invention includes: opening a base hole on a substrate, where the base hole is used to accommodate a chip; positioning the substrate and the chip using a fixing member, and pressing the substrate and the chip onto a first layer board; removing the fixing member; providing an acid pickling chamber and a plasma cleaning chamber that are integrally provided, transferring the chip and the substrate onto a lifting device, driving the chip and the substrate to rise into the plasma cleaning chamber by the lifting device, and performing plasma cleaning on the chip and the substrate; driving the chip and the substrate to descend into the acid pickling chamber by the lifting device, driving a water spraying assembly in the acid pickling chamber to move above the chip and the substrate, and uniformly spraying acid pickling solution onto the chip and the substrate; taking out the chip and the substrate; pressing the substrate and the chip onto a second layer board, where the first layer board and the second layer board are respectively located on opposite sides of the chip; using a laser to drill pin holes on the first layer board and the second layer board, where the pin holes are used to expose the pins of the chip; electroplating to fill the holes, and electroplating a conductive layer in the pin holes; manufacturing circuits on the first layer board and the second layer board, and soldering components.

[0005] According to the embodiments of the present invention, it has at least the following beneficial effects: When performing the first lamination, it is inevitable to use fixing parts to fix the chip and the substrate. After removing the fixing parts, residual glue will be left on the chip and the substrate. Therefore, plasma cleaning is first used to remove organic pollutants such as surface grease and residual photoresist and fine particles with high-energy active particles, removing the organic layer that may hinder the contact of the acid solution, making the pickling reaction more uniform and thorough. Then pickling is carried out, and an acidic solution is used to dissolve inorganic pollutants such as metal oxides and rust. The staged treatment ensures that both organic and inorganic pollutants are effectively removed, guaranteeing the quality of subsequent electroplating and lamination. Moreover, the pickling and plasma cleaning of the chip and the substrate are both completed on the lifting device, avoiding long-distance transfer between different devices and effectively improving production efficiency.

[0006] According to some embodiments of the present invention, transferring the chip and the substrate to the lifting device in the pickling chamber includes: controlling the lifting device to descend until the carrier platform on the lifting device descends into the pickling chamber, opening the box door on the side of the pickling chamber, placing the chip and the substrate on the wafer stage above the carrier platform, and closing the box door.

[0007] According to some embodiments of the present invention, driving the chip and the substrate to rise into the plasma cleaning chamber by the lifting device includes: controlling the lifting device to rise so that the carrier platform on the lifting device moves against the partition plate located between the plasma cleaning chamber and the pickling chamber, and making the wafer stage above the carrier platform move into the partition hole opened at the center of the partition plate.

[0008] According to some embodiments of the present invention, performing plasma cleaning on the chip and the substrate includes: controlling the air extraction device communicated with the pickling chamber to extract the air in the pickling chamber, and extracting the air in the plasma cleaning chamber through the ventilation holes on the partition plate, injecting process gas into the plasma cleaning chamber, and energizing the electrodes at the top of the plasma cleaning chamber and the electrodes of the carrier platform to ionize the process gas into plasma.

[0009] According to some embodiments of the present invention, driving the chip and the substrate to descend into the pickling chamber by the lifting device includes: stopping the air extraction device to make the air pressure in the pickling chamber equal to the atmospheric pressure, controlling the lifting device to descend so that the carrier platform is separated from the partition plate and moves to a position lower than the nozzle of the water spraying assembly.

[0010] According to some embodiments of the present invention, driving the water spraying assembly in the pickling chamber to move above the chip and the substrate includes: controlling the output shaft of the rotary motor located outside the pickling chamber to rotate, the output shaft drives the spray pipe of the water spraying assembly located in the pickling chamber to swing horizontally, and controlling the nozzle on the spray pipe to move above the wafer stage on the lifting device.

[0011] According to some embodiments of the present invention, a water inlet pipe is vertically connected to the lower end of the pickling chamber, and the upper end of the water inlet pipe extends into the pickling chamber. An installation plate is provided at the lower end of the water inlet pipe, and the installation plate is used to seal the lower end of the water inlet pipe. A rotary motor 802 is bolted below the installation plate, and the output shaft passes through the installation plate. A rotary seal is provided between the output shaft and the installation plate. The output shaft passes through the water inlet pipe, and a spray pipe is rotatably installed in the water inlet pipe. A square groove is provided on the inner wall of the spray pipe, and the upper end of the output shaft is embedded in the groove to drive the spray pipe to rotate.

[0012] According to some embodiments of the present invention, uniformly spraying the pickling solution onto the chip and the substrate includes: controlling the horizontal rotation of the chip and the substrate on the lifting device, controlling the reciprocating movement of the nozzle on the spray pipe through the rotary motor, and the movement path of the nozzle passes through the rotation axis of the wafer stage. Sequentially input pickling solution and deionized water into the water inlet pipe, and control the air extraction device to extract the accumulated liquid in the pickling chamber.

[0013] According to some embodiments of the present invention, taking out the chip and the substrate includes: controlling the nozzle on the spray pipe to move above the wafer stage to exit through the rotary motor, then introducing dry inert gas into the pickling chamber to dry the chip and the substrate, opening the chamber door, and taking out the chip and the substrate.

[0014] According to some embodiments of the present invention, after completing the soldering of components, use a cleaning agent to remove the soldering residues, and then perform electrical performance testing and appearance inspection.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and some additional aspects and advantages will become apparent from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following further describes the present invention in conjunction with the drawings and embodiments, where: Figure 1 is a schematic cross-sectional view of a pickling chamber and a plasma cleaning chamber according to an embodiment of the present invention; Figure 2 is Figure 1 an enlarged view of part A in Figure 3 is a schematic diagram of a fixing member connecting a substrate and a chip according to an embodiment of the present invention; Figure 4 is a schematic diagram when the first layer of board is laminated according to an embodiment of the present invention; Figure 5 is a schematic diagram after removing the fixing member according to an embodiment of the present invention; Figure 6 is a schematic diagram when the second layer of board is laminated according to an embodiment of the present invention; Figure 7 Schematic diagram of an air extraction device according to an embodiment of the present invention; Figure 8 Schematic diagram of a water spraying assembly according to an embodiment of the present invention; Figure 9 Schematic diagram of a pickling chamber according to an embodiment of the present invention. Detailed implementation manners

[0017] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as a limitation to the present invention.

[0018] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0019] In the description of the present invention, the meaning of several is more than one, the meaning of multiple is more than two, and understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0021] In the description of the present invention, the description with reference to terms such as "an embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples" or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0022] Refer to Figures 1 to 9As shown in the figure, a production process of an embedded circuit board according to an embodiment of the present invention includes the following steps: A base hole 110 is opened on a substrate 100. The base hole 110 is used to accommodate a chip 200. The chip 200 is placed into the base hole 110, and a fixing member 300 is used to position the substrate 100 and the chip 200. The fixing member 300 is selected as a common high-temperature tape used for fixing in the electronic component manufacturing process. The substrate 100 and the chip 200 are pasted onto the fixing member 300 to play a role in fixing and positioning. The substrate 100 and the chip 200 are pressed onto a first layer board 400. Usually, the lower ends of the substrate 100 and the chip 200 are pasted to the fixing member 300, and the upper ends of the substrate 100 and the chip 200 are press-fitted and connected to the first layer board 400. Due to the fixing effect of the fixing member 300, the position accuracy of the first layer board 400, the substrate 100, and the chip 200 during the pressing process can be improved.

[0023] The fixing member 300 is removed. Since the fixing member 300 will affect subsequent processing, the fixing member 300 needs to be removed. Since removing the fixing member 300 only requires tearing it off and the labor intensity is not high, manual operation is adopted. A pickling chamber 500 and a plasma cleaning chamber 700 are provided integrally. The pickling chamber 500 and the plasma cleaning chamber 700 are connected by flanges and bolts. The chip 200 and the substrate 100 are transferred to a lifting device 600 in the pickling chamber 500, and the lifting device 600 drives the chip 200 and the substrate 100 to rise into the plasma cleaning chamber 700 for plasma cleaning of the chip 200 and the substrate 100. Due to the influence of the pressing process and the fixing member 300, there will be some residual glue on the chip 200 and the substrate 100, so the chip 200 and the substrate 100 need to be cleaned to avoid affecting subsequent processing. The lifting device 600 drives the chip 200 and the substrate 100 to descend into the pickling chamber 500, and the water spraying assembly 800 in the pickling chamber 500 is driven to move above the chip 200 and the substrate 100, and the pickling solution is evenly sprayed onto the chip 200 and the substrate 100. Plasma cleaning is carried out first and then pickling for decontamination in stages. Plasma cleaning uses high-energy active particles to remove organic pollutants such as surface grease and residual photoresist and micro-particles, removing the organic layer that may hinder the contact of the pickling solution, making the pickling reaction more uniform and thorough. Pickling uses an acidic solution to dissolve inorganic pollutants such as metal oxides and rust. Staged treatment ensures that both organic and inorganic pollutants are effectively removed.

[0024] The chip 200 and the substrate 100 are taken out. After the pollutants are effectively removed, the chip 200 and the substrate 100 are moved to the next process.

[0025] Press the substrate 100 and the chip 200 onto the second layer board 410 to further ensure the bonding strength and stability between the chip 200 and the substrate 100. Control the temperature, pressure, and time to avoid material deformation caused by over-pressing. The second layer board 410 is located on the side of the chip 200 and the substrate 100 away from the first layer board 400, and the first layer board 400 and the second layer board 410 are respectively located on opposite sides of the chip 200; bury the chip 200 and the substrate 100 between the first layer board 400 and the second layer board 410.

[0026] According to the circuit design drawing, determine the drilling positions and hole diameters, and use a laser drilling machine to drill pin holes on the first layer board 400 and the second layer board 410. The pin holes are used to expose the pins of the chip 200; since both sides of the chip 200 are surrounded by the first layer board 400 and the second layer board 410, openings need to be made to electrically connect the pins of the chip 200.

[0027] Electroplating to fill the holes, electroplate a conductive layer in the pin holes to form a conductive layer in the pin holes so that the chip 200 can be connected to an external circuit; Fabricate circuits on the first layer board 400 and the second layer board 410 and solder components.

[0028] When pressing for the first time, it is inevitable to use the fixture 300 to fix the chip 200 and the substrate 100. After removing the fixture 300, residual glue will be left on the chip 200 and the substrate 100. Therefore, first use plasma cleaning to remove organic pollutants such as surface grease and residual photoresist and fine particles with high-energy active particles, removing the organic layer that may hinder the contact of the acid solution, making the pickling reaction more uniform and thorough, and then perform pickling, using an acidic solution to dissolve inorganic pollutants such as metal oxides and rust. The staged treatment ensures that both organic and inorganic pollutants are effectively removed, guaranteeing the quality of subsequent electroplating and pressing. Moreover, the pickling and plasma cleaning of the chip 200 and the substrate 100 are both completed on the lifting device 600, avoiding long-distance transfer between different devices and effectively improving production efficiency.

[0029] Refer to Figures 1 to 5As shown, it can be understood that transferring the chip 200 and the substrate 100 onto the lifting device 600 in the pickling chamber 500 specifically includes the following steps: The lifting device 600 selects common driving methods such as air cylinders, electric push rods, or motor lead screws to achieve vertical lifting. The main body of the lifting device 600 is arranged in a closed housing, and the housing is bolted to the bottom of the pickling chamber 500. The telescopic end of the lifting device 600 passes through the housing and is connected to the carrier platform 610. The telescopic end of the lifting device 600 is sealed with the housing through a sliding sealing ring. The function of the housing is to prevent the pickling solution from damaging the lifting device 600. The carrier platform 610 is horizontally arranged for installing the substrate stage 620, and the substrate stage 620 is used to support the chip 200. The substrate stage 620 is usually made of insulating materials to meet the process requirements of plasma cleaning. Control the lifting device 600 to descend until the carrier platform 610 on the lifting device 600 descends into the pickling chamber 500. Open the chamber door 510 on the side of the pickling chamber 500, and through manual or robotic transfer, place the chip 200 and the substrate 100 on the substrate stage 620 above the carrier platform 610, and then close the chamber door 510 on the side of the pickling chamber 500. The purpose of setting the chamber door 510 is to form a closed environment for the pickling chamber 500 after the chamber door 510 is closed to facilitate vacuum pumping.

[0030] Referring to Figures 4 to 9 As shown, it can be understood that driving the chip 200 and the substrate 100 to rise into the plasma cleaning chamber 700 by the lifting device 600 includes the following steps: Control the lifting device 600 to rise. The plasma cleaning chamber 700 is located above the pickling chamber 500, and the plasma cleaning chamber 700 and the pickling chamber 500 are separated by a partition 900. Move the carrier platform 610 to abut against the partition 900 located between the plasma cleaning chamber 700 and the pickling chamber 500, and move the substrate stage 620 into the partition hole 910 opened at the center of the partition 900. The size of the carrier platform 610 is larger than the size of the partition hole 910, and the carrier platform 610 is aligned with the partition hole 910 in the vertical direction. Therefore, the upper edge of the carrier platform 610 abuts against the partition 900 to prevent the electromagnetic field in the plasma cleaning chamber 700 from leaking into the pickling chamber 500. The substrate stage 620 passes through the partition hole 910 to lift the chip 200 and the substrate 100 on the substrate stage 620 into the plasma cleaning chamber 700.

[0031] Referring to Figures 1 to 9As shown, it can be understood that the plasma cleaning of the chip 200 and the substrate 100 includes the following steps: controlling the air extraction device 920 connected to the pickling chamber 500 to extract the air in the pickling chamber 500, controlling the air extraction device 920 to extract the air in the plasma cleaning chamber 700 through multiple ventilation holes on the partition 900. The function of the ventilation holes on the partition 900 is to connect the plasma cleaning chamber 700 and the pickling chamber 500. The diameter of a single ventilation hole is less than 1 mm, so that the electromagnetic field in the plasma cleaning chamber 700 cannot enter the pickling chamber 500 through the ventilation holes, and the fumes generated by plasma cleaning can also be discharged through the ventilation holes. The plasma cleaning chamber 700 is connected with an air pipe. Process gas is injected into the plasma cleaning chamber 700 through the air pipe. The process gas is selected from hydrogen, argon or nitrogen. The electrodes at the top of the plasma cleaning chamber 700 and the electrodes inside the carrier platform 610 are energized by using a radio frequency power supply, so that the process gas becomes a plasma state and bombards the surfaces of the chip 200 and the substrate 100 through the plasma, removing organic substances such as residual glue on the surfaces of the chip 200 and the substrate 100.

[0032] Referring to Figures 1 to 9 As shown, it can be understood that driving the chip 200 and the substrate 100 to descend into the pickling chamber 500 by the lifting device 600 includes the following steps: cutting off the radio frequency power supply, stopping the air extraction device 920, injecting nitrogen into the plasma cleaning chamber 700 through the air pipe. During pickling, the chip 200 and the substrate 100 are under the protection of the inert gas nitrogen, which can prevent the chip 200 and the substrate 100 from being oxidized by oxygen in the air. Making the air pressure in the pickling chamber 500 equal to the atmospheric pressure, controlling the lifting device 600 to descend, separating the carrier platform 610 from the partition 900, and moving the wafer stage 620 to a height lower than the nozzle 801 of the water spraying assembly 800. The wafer stage 620 moves into the pickling chamber 500 for the step of pickling.

[0033] Referring to Figures 1 to 9As shown, it can be understood that moving the water spraying assembly 800 in the pickling chamber 500 above the chip 200 and the substrate 100 includes the following steps: controlling the rotation motor 802 to drive the output shaft 803 to rotate. The output shaft 803 is arranged in the water inlet pipe 810 and then drives the spray pipe 820 located in the pickling chamber 500 to rotate, and controlling the nozzle 801 on the spray pipe 820 to move above the substrate table 620. The lower end of the pickling chamber 500 is vertically connected to the water inlet pipe 810, and the water spraying assembly 800 is composed of the water inlet pipe 810 and the spray pipe 820. The upper end of the water inlet pipe 810 extends into the pickling chamber 500. An installation plate is provided at the lower end of the water inlet pipe 810, and the installation plate is used to seal the lower end of the water inlet pipe 810. The rotation motor 802 is bolted below the installation plate. The output shaft 803 vertically penetrates the installation plate and enters the water inlet pipe 810. The upper end of the output shaft of the rotation motor 802 extends out of the upper end of the water inlet pipe 810. A rotary seal is provided between the output shaft 803 and the installation plate. The rotary seal is a prior art and will not be described in detail. The output shaft 803 is arranged in the water inlet pipe 810, the spray pipe 820 is rotatably installed on the water inlet pipe 810, a square groove is provided on the inner wall of the spray pipe 820, and the upper end of the output shaft 803 is embedded in the groove to drive the spray pipe 820 to rotate. One section of the spray pipe 820 is vertically sleeved on the outer wall of the water inlet pipe 810, and the other section extends horizontally. The nozzle 801 is arranged on the side wall of the part of the spray pipe 820 far from the water inlet pipe 810. Setting the rotation motor 802 outside the pickling chamber 500 can avoid the pickling solution from corroding the rotation motor 802, improve the service life of the rotation motor 802, and also has the advantage of being convenient for replacement.

[0034] Referring to Figures 1 to 8As shown, it is understandable that the pickling liquid is uniformly sprayed onto the chip 200 and the substrate 100, including the following steps: controlling the carrying motor 611 on the carrying platform 610 to drive the substrate stage 620 on the carrying platform 610 to rotate horizontally, controlling the nozzle 801 on the nozzle 820 to move back and forth through the rotating motor 802, and the reciprocating movement path of the nozzle 801 passes through the rotation axis of the substrate stage 620 and the edge of the substrate stage 620, inputting the pickling liquid into the water inlet pipe 810, and the pickling liquid passes through the nozzle 820 and then sprays downward from the nozzle 801, and after the pickling liquid is rinsed for 2 minutes, deionized water is input into the water inlet pipe 810, and the deionized water passes through the nozzle 820 and then sprays downward from the nozzle 801 to rinse the residual pickling liquid. Control the exhaust device 920 to extract the accumulated liquid in the pickling chamber 500. The substrate stage 620 is rotatably mounted on the carrying platform 610. The carrying motor 611 of the carrying platform 610 drives the substrate stage 620 to rotate. The specific structure and installation method of the carrying motor 611 are prior art, so they are not described in detail. The nozzle 801 will pass through the rotation center of the substrate stage 620 during the movement. In conjunction with the rotation of the substrate stage 620 itself, the pickling liquid sprayed by the nozzle 801 can evenly rinse the chip 200 and the substrate 100 on the substrate stage 620. The exhaust device 920 includes a temporary storage tank 921 and a vacuum pump 922. The vacuum pump 922 is used to extract the gas in the temporary storage tank 921. The temporary storage tank 921 is connected to the bottom of the pickling chamber 500 through an exhaust pipe 923. The exhaust device 920 adopts this structure to extract both liquid and gas. The exhaust device 920 extracts the waste liquid after cleaning during the pickling process, and extracts gas to generate vacuum during the plasma cleaning process.

[0035] Reference Figures 5 to 9 As shown, it can be understood that taking out the chip 200 and the substrate 100 includes the following steps: stopping the carrying motor 611, controlling the nozzle 801 on the nozzle 820 to move to a position that avoids the substrate stage 620 in the up and down directions through the rotating motor 802, injecting dry nitrogen or other inert gas into the plasma cleaning chamber 700 through the air pipe, and then the dry inert gas is introduced into the pickling chamber 500 from the ventilation holes on the partition 900, starting to blow dry the chip 200 and the substrate 100, and the exhaust device 920 extracts the moist inert gas. Open the box door 510 and take out the chip 200 and the substrate 100. The nozzle 801 and the nozzle 820 can move to a position that does not affect the lifting of the substrate stage 620, providing sufficient vertical space for taking out the chip 200 and the substrate 100 and subsequently placing the chip 200 and the substrate 100.

[0036] It is understandable that electroplating hole filling includes the following steps: using a chemical cleaning agent to clean the hole wall, ensuring good bonding between the electroplating layer and the hole wall, and depositing metal in the hole through an electroplating process.

[0037] It is understandable that after the welding of components is completed, a cleaning agent is used to remove the welding residues, and then electrical performance testing and appearance inspection are carried out.

[0038] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those of ordinary skill in the art without departing from the gist of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A production process for an embedded circuit board, characterized in that, Including: A base hole (110) is formed on a substrate (100), and the base hole (110) is used to accommodate a chip (200); A fixing member (300) is used to position the substrate (100) and the chip (200), and the substrate (100) and the chip (200) are pressed onto a first layer board (400); The fixing member (300) is removed; An integrated pickling chamber (500) and a plasma cleaning chamber (700) are provided. The chip (200) and the substrate (100) are transferred onto a lifting device (600), and the lifting device (600) drives the chip (200) and the substrate (100) to rise into the plasma cleaning chamber (700) to perform plasma cleaning on the chip (200) and the substrate (100); The lifting device (600) drives the chip (200) and the substrate (100) to descend into the pickling chamber (500). The water spraying assembly (800) in the pickling chamber (500) is driven to move above the chip (200) and the substrate (100), and pickling solution is evenly sprayed onto the chip (200) and the substrate (100); The chip (200) and the substrate (100) are taken out; The substrate (100) and the chip (200) are pressed onto a second layer board (410), and the first layer board (400) and the second layer board (410) are respectively located on opposite sides of the chip (200); Pins holes are drilled in the first layer board (400) and the second layer board (410) using a laser, and the pins holes are used to expose the pins of the chip (200); The holes are filled by electroplating, and a conductive layer is formed by electroplating in the pins holes; Circuits are made on the first layer board (400) and the second layer board (410), and components are welded.

2. The production process of the embedded circuit board according to claim 1, characterized in that: Transferring the chip (200) and the substrate (100) onto the lifting device (600) in the pickling chamber (500) includes: controlling the lifting device (600) to descend until the carrier platform (610) on the lifting device (600) descends into the pickling chamber (500), opening the box door (510) on the side of the pickling chamber (500), placing the chip (200) and the substrate (100) on the wafer stage (620) above the carrier platform (610), and closing the box door (510).

3. The production process of the embedded circuit board according to claim 1, characterized in that: Driving the chip (200) and the substrate (100) to rise into the plasma cleaning chamber (700) by the lifting device (600) includes: controlling the lifting device (600) to rise, making the carrier platform (610) on the lifting device (600) move to abut against a partition board (900) located between the plasma cleaning chamber (700) and the pickling chamber (500), and making the wafer stage (620) above the carrier platform (610) move into a partition hole (910) opened at the center of the partition board (900).

4. The production process of the embedded circuit board according to claim 3, characterized in that: Plasma cleaning the chip (200) and the substrate (100) includes: controlling the air extraction device (920) communicated with the pickling chamber (500) to extract the air in the pickling chamber (500), and extracting the air in the plasma cleaning chamber (700) through the ventilation holes on the partition plate (900), injecting process gas into the plasma cleaning chamber (700), and energizing the electrodes at the top of the plasma cleaning chamber (700) and the electrodes of the carrier platform (610) to ionize the process gas into plasma.

5. The production process of the embedded circuit board according to claim 3, characterized in that: Driving the chip (200) and the substrate (100) to descend into the pickling chamber (500) by the lifting device (600) includes: stopping the air extraction device (920) to make the air pressure in the pickling chamber (500) equal to the atmospheric pressure, controlling the lifting device (600) to descend so that the carrier platform (610) is separated from the partition plate (900) and moves to a position lower than the nozzle (801) of the water spraying assembly (800).

6. The production process of the embedded circuit board according to claim 1, characterized in that: Driving the water spraying assembly (800) in the pickling chamber (500) to move above the chip (200) and the substrate (100) includes: controlling the output shaft (803) of the rotary motor (802) located outside the pickling chamber (500) to rotate, the output shaft (803) driving the spray pipe (820) of the water spraying assembly (800) located in the pickling chamber (500) to swing horizontally, and controlling the nozzle (801) on the spray pipe (820) to move above the substrate stage (620) on the lifting device (600).

7. The production process of the embedded circuit board according to claim 6, characterized in that: A water inlet pipe (810) is vertically connected to the lower end of the pickling chamber (500), and the upper end of the water inlet pipe (810) extends into the pickling chamber (500). An installation plate is provided at the lower end of the water inlet pipe (810) for closing the lower end of the water inlet pipe (810). The rotary motor 802 is bolted below the installation plate. The output shaft (803) passes through the installation plate, and a rotary seal is provided between the output shaft (803) and the installation plate. The output shaft (803) passes through the water inlet pipe (810), the spray pipe (820) is rotatably installed in the water inlet pipe (810), a square groove is provided on the inner wall of the spray pipe (820), and the upper end of the output shaft (803) is embedded in the groove to drive the spray pipe (820) to rotate.

8. The production process of the embedded circuit board according to claim 6, characterized in that: Uniformly spraying the pickling solution onto the chip (200) and the substrate (100) includes: controlling the horizontal rotation of the chip (200) and the substrate (100) on the lifting device (600), controlling the nozzle (801) on the spray pipe (820) to reciprocate through the rotary motor (802), and the moving path of the nozzle (801) passes through the rotation axis of the substrate stage (620). Sequentially inputting the pickling solution and deionized water into the water inlet pipe (810), and controlling the air extraction device (920) to extract the accumulated liquid in the pickling chamber (500).

9. The production process of the embedded circuit board according to claim 6, characterized in that: Taking out the chip (200) and the substrate (100) includes: controlling the nozzle (801) on the nozzle pipe (820) to move above the substrate stage (620) through the rotation motor (802), then introducing dry inert gas into the pickling chamber (500) to dry the chip (200) and the substrate (100), opening the chamber door (510), and taking out the chip (200) and the substrate (100).

10. The production process of the embedded circuit board according to claim 1, characterized in that: After completing the welding of components, use a cleaning agent to remove the welding residues, and then conduct electrical performance testing and appearance inspection.

Images