Electronic equipment

Abstract

The embodiment of the invention discloses electronic equipment, and relates to the field of electronic devices. The heat dissipation performance of the electronic equipment is improved. According to the specific scheme, the electronic equipment comprises an equipment body, a support and a sound wave oscillator. The equipment main body has a heat dissipation surface; a sound wave emitting surface of the sound wave oscillator faces the equipment body, the sound wave oscillator is rotationally connected with the support, and when the sound wave oscillator is in a first state, in the direction perpendicular to the heat dissipation surface, the projection of the sound wave emitting surface on the heat dissipation surface is overlapped with the heat dissipation surface. Therefore, sound waves excited by the sound wave emitting surface can be transmitted to the position near the heat dissipation surface, and air convection of a boundary layer near the heat dissipation surface is promoted when the sound waves are transmitted to the position near the heat dissipation surface. The high-temperature airflow near the heat dissipation surface escapes away from the heat dissipation surface to cool the heat dissipation surface, so that the heat dissipation performance of the electronic equipment is improved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of electronic devices, and in particular, to an electronic device. Background Art

[0002] With the development of electronic product technology, the functions of electronic devices have also increased accordingly. While the functions of electronic devices increase, the working power consumption and heat generation of electronic devices also increase accordingly. The increase in heat generation will affect the performance of electronic devices and the user experience. Therefore, improving the heat dissipation performance of electronic devices has become an urgent problem to be solved for electronic devices. Summary of the Invention

[0003] Embodiments of the present application provide an electronic device, aiming to improve the heat dissipation performance of the electronic device.

[0004] To achieve the above object, the present application adopts the following technical solutions.

[0005] Embodiments of the present application provide an electronic device. The electronic device includes a device body, a bracket, and an acoustic oscillator. The device body has a heat dissipation surface; the bracket is connected to the device body. The acoustic emission surface of the acoustic oscillator faces the device body, the acoustic oscillator is rotatably connected to the bracket, and when the acoustic oscillator is in the first state, in a direction perpendicular to the heat dissipation surface, the projection of the acoustic emission surface on the heat dissipation surface at least partially overlaps with the heat dissipation surface. Thus, the heat dissipation surface is on the sound wave propagation path emitted by the acoustic emission surface. When the acoustic oscillator works, the sound waves excited by the acoustic emission surface propagate in the direction of the device body. The sound waves excited by the acoustic emission surface can propagate to the vicinity of the heat dissipation surface. When the sound waves propagate to the vicinity of the heat dissipation surface, it promotes the air convection of the boundary layer near the heat dissipation surface. The air flow with a higher temperature near the heat dissipation surface escapes away from the heat dissipation surface, and the escaping air flow carries the heat absorbed from the heat dissipation surface, reducing the temperature on the heat dissipation surface. In addition, the air flow with a lower temperature flows to the vicinity of the heat dissipation surface for subsequent air flow circulation to dissipate heat for the device body. This air flow circulation cools down the device body.

[0006] In some feasible ways, the bracket includes a base and a sliding rod. The base is connected to the device body, one end of the sliding rod is slidably connected to the base, and the other end is rotatably connected to the acoustic oscillator. Thus, through the relative sliding of the base and the sliding rod, the base and the acoustic oscillator approach or move away from each other, so that the acoustic emission surface of the acoustic oscillator and the heat dissipation surface approach or move away from each other. The closer the distance between the acoustic emission surface and the heat dissipation surface, the smaller the loss of the sound waves excited by the acoustic emission surface, the greater the disturbance of the sound waves transmitted to the gas layer on the surface of the heat dissipation surface, and the better the heat dissipation performance. In addition, the closer the distance between the acoustic oscillator and the base, the smaller the volume occupied by the heat dissipation device.

[0007] In some realizable ways, the electronic device further includes: a perturbation structure disposed on the heat dissipation surface. In a direction perpendicular to the heat dissipation surface, the projection of the acoustic wave emission surface on the heat dissipation surface and the projection of the perturbation structure on the heat dissipation surface at least partially overlap. Thus, when the acoustic wave excited by the acoustic wave emission surface propagates to the vicinity of the perturbation structure, the air layer near the perturbation structure escapes after being oscillated by the acoustic wave, and the direction of the flowing air changes after colliding with the perturbation structure. In this way, the perturbation structure has the effect of increasing the degree of disorder of the air layer flow near the heat dissipation surface, preventing high-temperature gas from staying in the air layer near the heat dissipation surface, accelerating the heat dissipation speed, and improving the heat dissipation efficiency.

[0008] In some realizable ways, in a direction perpendicular to the heat dissipation surface, the distance between the geometric center of the projection of the acoustic wave emission surface on the heat dissipation surface and the geometric center of the projection of the perturbation structure on the heat dissipation surface is less than or equal to 10 mm. The distance between the geometric centers of the two projections is relatively close. When the acoustic wave excited by the acoustic wave emission surface propagates to the vicinity of the heat dissipation surface, the oscillation of the air layer near the perturbation structure caused by the acoustic wave is the most intense, and the effect of the perturbation structure in increasing the degree of disorder of the air layer flow near the heat dissipation surface is more obvious.

[0009] In some realizable ways, the perturbation structure includes a plurality of convex portions, and the plurality of convex portions are spaced apart on the heat dissipation surface, and the convex portions protrude in a direction away from the heat dissipation surface. Thus, after the flowing air collides with the convex portions, the direction of the flowing air changes, increasing the degree of disorder of the air flow and improving the heat dissipation performance.

[0010] In some realizable ways, the acoustic wave oscillator includes an oscillator main body, a piezoelectric element, and an acoustic impedance matching layer. The oscillator main body is rotatably connected to the bracket. The piezoelectric element is disposed between the oscillator main body and the acoustic impedance matching layer, and the projection of the acoustic impedance matching layer on the surface of the piezoelectric element covers the piezoelectric element; the acoustic wave emission surface is located on the surface of the acoustic impedance matching layer facing away from the piezoelectric element, and the specific acoustic impedance of the acoustic impedance matching layer is greater than the specific acoustic impedance of air and less than the specific acoustic impedance of the piezoelectric element.

[0011] In some realizable ways, the specific acoustic impedance of the acoustic impedance matching layer is 5.0*10^4 Pa s / m - 1.0*10^6 Pa s / m. Thus, when the specific acoustic impedance of the acoustic impedance matching layer is within this range, the energy propagation efficiency can be effectively improved and the loss can be reduced.

[0012] In some realizable ways, when the acoustic oscillator is in an operating state, the acoustic oscillator forms a vortex on the gas layer on the surface of the heat dissipation surface. Thus, the vortex makes the gas flow on the surface of the heat dissipation surface turbulent or non-laminar. The vortex separates the thinner gas layer on the surface of the heat dissipation surface from the surface of the heat dissipation surface, and then the air flow in other positions flows to the surface of the heat dissipation surface and separates again, and so on in a cycle, effectively improving the problem of poor heat conduction rate of the laminar air flow on the surface of the heat dissipation surface. In other words, the vortex formed on the gas layer on the surface of the heat dissipation surface can quickly dissipate the gas layer with a higher temperature on the surface of the heat dissipation surface, and the air flow with a lower temperature in other areas, such as the area near the bracket, is driven by the vortex gas on the gas layer on the surface of the heat dissipation surface to fill the surface of the heat dissipation surface to dissipate heat for the heat dissipation surface, and so on in a cycle.

[0013] In some realizable ways, the electronic device further includes: a damping structure, and the bracket is connected to the acoustic oscillator through the damping structure. Thus, the damping structure has the function of reducing vibration, can weaken the vibration of the acoustic wave emitted by the acoustic oscillator on the bracket, and relieve the influence of the vibration of the acoustic oscillator on the user.

[0014] In some realizable ways, the bracket is detachably connected to the device body. Thus, the bracket and the device body can be connected when heat dissipation of the device body is required, and the bracket and the device body can be separated when heat dissipation of the device body is not required, which is convenient for the storage of the electronic device.

[0015] In some realizable ways, the electronic device further includes a mounting bracket. The mounting bracket is connected to the device body, and the bracket is rotatably connected to the mounting bracket. Thus, the bracket can rotate relative to the mounting bracket to adjust the angle between the bracket and the mounting bracket. Further adjust the included angle between the bracket and the device body, thereby changing the relative positional relationship between the acoustic oscillator connected to the bracket and the device body, so as to adjust the relative positional relationship between the heat dissipation surface and the acoustic wave emission surface, and enable more relative positions of the heat dissipation surface and the acoustic wave emission surface to be selected.

[0016] In some realizable ways, the electronic device further includes: a back clip. The back clip is connected to the device body. The back clip and the device body jointly enclose a heat dissipation channel. The heat dissipation channel has an air inlet and an air outlet. The bracket is connected to the back clip, and the acoustic oscillator is located in the heat dissipation channel. Thus, after the acoustic oscillator rotates relative to the bracket, the first projection can also partially overlap with the heat dissipation surface to dissipate heat for the heat dissipation surface. In addition, the air inlet and the air outlet of the heat dissipation channel enable air to flow inside and outside the heat dissipation channel. Under the action of the acoustic oscillator, the air with a higher temperature in the heat dissipation channel is dissipated to the outside of the heat dissipation channel through the air outlet, and the air with a lower temperature outside the heat dissipation channel enters the heat dissipation channel through the air inlet, and so on in a cycle to dissipate heat for the heat dissipation surface.

[0017] In some implementable ways, the back clip is detachably connected to the device body. In this way, the device body connected to the back clip can be replaced.

[0018] In some implementable ways, when the acoustic oscillator is in the second state, the acoustic emission surface is parallel to the heat dissipation surface. Thus, in the direction perpendicular to the heat dissipation surface, the projected area of the acoustic emission surface on the heat dissipation surface is the largest. When the sound wave excited by the acoustic emission surface propagates to the vicinity of the heat dissipation surface, it can disturb the air flow in a larger area near the heat dissipation surface, causing the temperature of this area to drop rapidly. In addition, since the acoustic emission surface and the heat dissipation surface are parallel, the distance between the acoustic emission surface and the heat dissipation surface is small along the propagation direction of the sound wave. During the process of the sound wave excited by the acoustic emission surface propagating to the vicinity of the heat dissipation surface, the loss of the sound wave is small, which can improve the utilization efficiency of the sound wave.

[0019] In some implementable ways, the distance between the acoustic emission surface and the heat dissipation surface is 0.2 mm - 5 mm. In this way, when the distance between the acoustic emission surface and the heat dissipation surface is within this range, the volume of the electronic device is relatively small, which is beneficial to the miniaturization of the electronic device. Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of an electronic device.

[0021] Figure 2 It is an exploded structural schematic diagram of a device body.

[0022] Figure 3 It is a schematic structural diagram of the rear shell provided by the embodiment of the present application.

[0023] Figure 4 It is a diagram showing the positional relationship between the first projection and the heat dissipation surface of the acoustic oscillator in different states provided by the embodiment of the present application.

[0024] Figure 5 It is a schematic structural diagram of the acoustic oscillator in the second state provided by the embodiment of the present application.

[0025] Figure 6 It is a flow simulation diagram of the air flow near the heat dissipation surface when the acoustic oscillator is working.

[0026] Figure 7a It is another schematic structural diagram of the electronic device provided by the embodiment of the present application.

[0027] Figure 7b For Figure 7a The cross-sectional schematic diagram of N-N in

[0028] Figure 8 It is an internal structural schematic diagram of another heat dissipation device provided by the embodiment of the present application.

[0029] Figure 9 A schematic structural diagram of another electronic device provided by an embodiment of the present application.

[0030] In the figure: 11 - cover plate; 12 - display screen; 13 - printed circuit board; 14 - middle frame; 15 - rear shell; 16 - frame; 20 - electronic device; 10 - device main body; 100 - heat dissipation device; 110 - bracket; 101 - heat dissipation surface; 103 - main heat dissipation area; 102 - heating element; 120 - acoustic oscillator; 121 - acoustic emission surface; 30 - first axis; 104 - first projection; 150 - perturbation structure; 130 - mounting bracket; 140 - back clip; 31 - second axis; 113 - slide bar; 112 - base; 114 - receiving groove; 115 - opening; 122 - oscillator main body; 123 - piezoelectric element; 124 - acoustic impedance matching layer; 151 - convex part; 141 - heat dissipation channel; 142 - air inlet; 143 - air outlet; 160 - damping structure; 111 - free end. Specific embodiments

[0031] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0032] Hereinafter, terms such as "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0033] In addition, in the present application, orientation terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, and they are used for relative description and clarification, and they may change accordingly with the change of the orientation of the components placed in the drawings.

[0034] Figure 1 It is a schematic structural diagram of an electronic device 20. As Figure 1 shown, the electronic device 20 includes a device main body 10 and a heat dissipation device 100. The heat dissipation device 100 is used to dissipate heat from the device main body 10. The heat dissipation device 100 is connected to the device main body 10, and the heat dissipation device 100 and the device main body 10 can be detachably connected, such as snap - connection or screw - connection. Or, the heat dissipation device 100 and the device main body 10 can be fixedly connected, such as welding or bonding, etc. Or, in some embodiments, the heat dissipation device 100 can be integrated on the device main body 10.

[0035] Exemplarily, the device body includes, but is not limited to, electronic devices such as mobile phones, tablet computers, desktop computers, laptop computers, PDAs (Personal Digital Assistants), wearable devices, display devices (such as TVs), information display devices, or smart home terminals. In the embodiments of the present application, the device body is a mobile phone for exemplary illustration.

[0036] Figure 2 FIG. 4 is an exploded structural schematic diagram of a device body 10. As Figure 2 shown, the device body 10 may include: a cover 11, a display 12, a printed circuit board (PCB) 13, a middle frame 14, and a rear case 15. In some embodiments, the rear case 15 is also referred to as a rear cover. The cover 11, the display 12, and the rear case 15 are stacked.

[0037] The cover 11 may be disposed closely against the display 12. The cover 11 is used to protect the display 12 and prevent dust. The cover 11 may be a cover glass, or may be replaced with a cover of other materials, such as an ultra-thin glass material cover, a polyethylene terephthalate (PET) material cover, etc.

[0038] The display 12 may include a liquid crystal display (LCD) panel, a light emitting diode (LED) display panel, an organic light-emitting diode (OLED) display panel, etc., and the present application does not limit this. The types of the display 12 include, but are not limited to, water-drop screens, notch screens, full screens, or punch-hole screens.

[0039] The middle frame 14 functions to support the device body 10. Figure 2 The printed circuit board 13 shown in FIG. 4 is disposed between the middle frame 14 and the rear case 15. In some embodiments, the printed circuit board 13 may also be disposed between the middle frame 14 and the display 12, and the embodiments of the present application do not limit this.

[0040] Exemplarily, the device body 10 may further include a battery (not shown in the figure). The battery may be disposed between the middle frame 14 and the rear case 15, or the battery may be disposed between the middle frame 14 and the display 12, and the present application does not limit this.

[0041] Exemplarily, electronic components can be carried on the printed circuit board 13. For example, radio frequency chips can be carried. In some embodiments, components such as input buttons, transmitters, processors, memories, batteries, charging circuits, system on chip (SoC) structures, etc. can be mounted on the printed circuit board 13 or connected to the printed circuit board 13.

[0042] In some embodiments, the device body 10 may further include a frame 16, and the frame 16 can be formed of a conductive material such as metal. The frame 16 can be disposed between the display screen 12 and the rear case 15 and extend circumferentially around the periphery of the display screen 12. The frame 16 can have four side edges surrounding the display screen 12, and the four side edges help to fix the display screen 12.

[0043] Figure 2 In, the frame 16 and the middle frame 14 are connected as an integrally formed part, and the frame 16 and the middle frame 14 together play a supporting role for the entire device body 10. The rear case 15 and the cover plate 11 are respectively covered along opposite sides of the frame 16 to form the outer shell or housing of the electronic device. In other embodiments, the frame 16 and the middle frame 14 can be connected by means of elastic pieces, threaded parts or welding.

[0044] In some embodiments, the rear case 15, the cover plate 11, the frame 16 and the middle frame 14 can be collectively referred to as the outer shell or housing of the device body 10. It should be understood that the "outer shell or housing" can be used to refer to a part or all of any one of the rear case 15, the cover plate 11, the frame 16 and the middle frame 14, or refer to a part or all of any combination of the rear case 15, the cover plate 11, the frame 16 and the middle frame 14. In the embodiments of the present application, the rear case 15 is taken as an example of the outer shell of the device body 10 for description.

[0045] When the device body 10 is working, some components in the device body 10 will generate heat, such as transmitters, processors, memories and electrical connectors arranged on the printed circuit board 13. The display screen 12 and the driver of the display screen 12 will also generate heat after working for a long time. The devices that generate heat when the aforementioned device body 10 is working are hereinafter named as heat generating elements 102.

[0046] It can be understood that the heat generating element 102 can include at least one of the components that generate heat when the aforementioned device body 10 is working. In some embodiments, the heat generating element 102 can be the component with the highest temperature when the device body 10 is working. Among them, the "heat generation" in the heat generating element 102 does not limit the function of the element to generate heat or provide heat, but means that the component may generate heat in the working state.

[0047] When the device main body 10 is working, the heat generated by the heating element 102 is transferred to the heat dissipation surface 101 of the device main body 10 through the conduction of components such as the middle frame 14 or the rear case 15. Dissipating the heat on the heat dissipation surface 101 can effectively improve the heat dissipation performance of the device main body 10.

[0048] It can be understood that the aforementioned heat dissipation surface 101 may refer to the outer surface of the device main body 10. In some embodiments, the heat dissipation surface 101 is the outer surface of the device main body 10, which is different from the inner surface of the device main body 10. An air flow (such as an air current) can flow near the heat dissipation surface 101 to dissipate heat for this heat dissipation surface 101. In some embodiments, the heat dissipation surface 101 is the surface with a relatively high temperature among the outer surfaces of the device main body 10. For example, the surface of the rear case 15 facing away from the printed circuit board 13 is the heat dissipation surface 101. Exemplarily, in the thickness direction of the device main body 10, the area of the projection of the printed circuit board 13 on the outer surface of the device main body 10 is the heat dissipation surface 101. In the embodiments of the present application, the surface of the rear case 15 facing away from the printed circuit board 13 is used as the heat dissipation surface 101 as an example for description.

[0049] It can be understood that the embodiments of the present application do not limit that the device main body 10 can only dissipate heat through the heat dissipation device 100. For example, other heat dissipation structures can also be provided on the device main body 10, and this heat dissipation structure can be arranged inside the device main body 10. This heat dissipation structure can include: a fan, a liquid cooling device, etc.

[0050] Figure 3 It is a schematic structural diagram of the rear case 15 provided by the embodiments of the present application. Figure 3 In it, in the thickness direction of the rear case 15, the area of the projection of the components with relatively high power on the printed circuit board 13 (as shown in Figure 2 ) on the rear case 15 is the main heat dissipation area 103, and the main heat dissipation area 103 is located on the heat dissipation surface 101. For example, when the device main body 10 is working, the area of the projection of the components with relatively high power in the heating element 102 on the heat dissipation surface 101 is the main heat dissipation area 103. The aforementioned components with relatively high power can include a system on chip, a corresponding power supply circuit, a central processing unit (CPU), a graphics processing unit (GPU), etc.

[0051] The embodiments of the present application do not limit the positional relationship between the main heat dissipation area 103 and the heat dissipation surface 101. For example, the main heat dissipation area 103 can cover the geometric center of the heat dissipation surface 101, or the main heat dissipation area 103 can deviate from covering the geometric center of the heat dissipation surface 101.

[0052] Please return Figure 1, in an embodiment of the present application, the heat dissipation device 100 includes a bracket 110 and an acoustic oscillator 120. The bracket 110 is connected to the device main body 10, and the acoustic oscillator 120 is rotatably connected to the bracket 110. The acoustic oscillator 120 has an acoustic emission surface 121, and the acoustic emission surface 121 faces the device main body 10. For example, the device main body 10 is located downstream of the propagation direction of the sound waves emitted from the acoustic emission surface 121 of the acoustic oscillator 120, and the device main body 10 is on the propagation path of the sound waves emitted from the acoustic emission surface 121.

[0053] Since the acoustic oscillator 120 is rotatably connected to the bracket 110, the acoustic oscillator 120 can have multiple states. By the relative rotation of the acoustic oscillator 120 and the bracket 110, the acoustic oscillator 120 can be switched among the aforementioned multiple states. When the acoustic oscillator 120 is in the first state, in the direction perpendicular to the heat dissipation surface 101, the projection of the acoustic emission surface 121 on the heat dissipation surface 101 overlaps at least partially with the heat dissipation surface 101. Define the direction perpendicular to the heat dissipation surface 101 as the x direction. In the x direction, the projection of the acoustic emission surface 121 on the heat dissipation surface 101 is the first projection 104, and the first projection 104 and the heat dissipation surface 101 overlap at least partially. Then the heat dissipation surface 101 is on the propagation path of the sound waves emitted from the acoustic emission surface 121.

[0054] In this way, when the acoustic oscillator 120 operates, the acoustic emission surface 121 excites sound waves, and the sound waves propagate in the direction of the device main body 10. The sound waves excited by the acoustic emission surface 121 can propagate to the vicinity of the heat dissipation surface 101. When the sound waves propagate to the vicinity of the heat dissipation surface 101, it promotes the air convection near the heat dissipation surface 101. The airflow with a higher temperature near the heat dissipation surface 101 escapes and moves away from the heat dissipation surface 101, and the escaping airflow takes away the heat from the heat dissipation surface 101, reducing the temperature on the heat dissipation surface 101. In addition, the airflow with a lower temperature flows to the vicinity of the heat dissipation surface 101 for subsequent airflow circulation, and this airflow circulation cools down the device main body 10.

[0055] Exemplarily, the acoustic emission surface 121 is located on the surface of the acoustic oscillator 120. The acoustic emission surface 121 is also called the excitation plane. The acoustic emission surface 121 is the non-constrained surface of the sound source. The acoustic emission surface 121 is used to excite the air layer near the acoustic emission surface 121 and propagate sound waves in the air. Among them, the propagation direction of the sound waves excited by the acoustic oscillator 120 is perpendicular to the acoustic emission surface 121.

[0056] Among them, the projection of the acoustic emission surface 121 on the heat dissipation surface 101 overlaps at least partially with the heat dissipation surface 101, including: the projection of the acoustic emission surface 121 on the heat dissipation surface 101 is located within the heat dissipation surface 101. Or, part of the projection of the acoustic emission surface 121 on the heat dissipation surface 101 is located within the heat dissipation surface 101, and part of the projection is located outside the heat dissipation surface 101.

[0057] Since the acoustic oscillator 120 is rotatably connected to the bracket 110, the acoustic oscillator 120 can have multiple states. It can be understood that the present application does not limit that the projection of the acoustic emission surface 121 of the acoustic oscillator 120 on the heat dissipation surface 101 overlaps at least partially with the heat dissipation surface 101 in each state. For example, in at least one state (such as the aforementioned first state), the projection of the acoustic emission surface 121 of the acoustic oscillator 120 on the heat dissipation surface 101 overlaps at least partially with the heat dissipation surface 101, and the embodiments of the present application can allow the projection of the acoustic emission surface 121 of the acoustic oscillator 120 on the heat dissipation surface 101 not to overlap with the heat dissipation surface 101 in some states.

[0058] Exemplarily, the acoustic oscillator 120 is rotatably connected to the bracket 110 so that the acoustic oscillator 120 can rotate about the first axis 30. In some embodiments, the acoustic emission surface 121 is parallel to the first axis 30. Herein, the aforementioned parallel does not limit the angle between the acoustic emission surface 121 and the first axis 30 to be 0°. For example, the angle between the acoustic emission surface 121 and the first axis 30 can be 0° to 10°. For example, it can be 0°, 1°, 2°, 3°, 4°, 5°, 6°, 7°, 8°, 9° or 10°. The same applies to the subsequent description of parallel.

[0059] In some embodiments, the first axis 30 can be parallel to the heat dissipation surface 101, and the acoustic emission surface 121 is parallel to the first axis 30. Thus, during the rotation of the acoustic oscillator 120 about the first axis 30, in most states, in the direction perpendicular to the heat dissipation surface 101, the projection of the acoustic emission surface 121 on the heat dissipation surface 101 overlaps at least partially with the heat dissipation surface 101.

[0060] It can be understood that since the acoustic oscillator 120 and the bracket 110 can rotate relative to each other, the position and shape of the first projection 104 are not unique, and the position and shape of the first projection 104 can change as the acoustic oscillator 120 and the bracket 110 rotate relative to each other.

[0061] Such as Figure 3As shown, in some embodiments, the electronic device may further include a perturbation structure 150 disposed on the heat dissipation surface 101. In the direction perpendicular to the heat dissipation surface 101, the projection of the acoustic wave emission surface 121 on the heat dissipation surface 101 (the first projection 104) and the projection of the perturbation structure 150 on the heat dissipation surface 101 at least partially overlap. When the acoustic wave excited by the acoustic wave emission surface 121 propagates to the vicinity of the perturbation structure 150, the air layer near the perturbation structure 150 escapes after being oscillated by the acoustic wave, and the moving direction of the escaping air flow changes after colliding with the perturbation structure 150. Thus, the perturbation structure 150 has the effect of intensifying the disorder degree of the air layer flow near the heat dissipation surface 101, preventing the air layer near the heat dissipation surface 101 from staying near the heat dissipation surface 101 due to laminar flow, accelerating the heat dissipation speed, and improving the heat dissipation efficiency.

[0062] Among them, the projection of the aforementioned acoustic wave emission surface 121 on the heat dissipation surface 101 (the first projection 104) and the projection of the perturbation structure 150 on the heat dissipation surface 101 at least partially overlap, including: the projection of the acoustic wave emission surface 121 on the heat dissipation surface 101 coincides with the projection of the perturbation structure 150 on the heat dissipation surface 101; or, a part of the projection of the acoustic wave emission surface 121 on the heat dissipation surface 101 is located within the projection of the perturbation structure 150 on the heat dissipation surface 101, and a part of the projection of the acoustic wave emission surface 121 on the heat dissipation surface 101 is located outside the projection of the perturbation structure 150 on the heat dissipation surface 101; or, the entire projection of the acoustic wave emission surface 121 on the heat dissipation surface 101 is located within the area enclosed by the projection of the perturbation structure 150 on the heat dissipation surface 101.

[0063] In some embodiments, in the direction perpendicular to the heat dissipation surface 101, the distance between the geometric center of the projection of the acoustic wave emission surface 121 on the heat dissipation surface 101 and the geometric center of the projection of the perturbation structure 150 on the heat dissipation surface 101 is less than or equal to 10 mm. In other words, the distance between the geometric center of the first projection 104 and the geometric center of the projection of the perturbation structure 150 on the heat dissipation surface 101 is less than or equal to 10 mm. For example, the aforementioned distance can be 10 mm, 9 mm, 8 mm, 7 mm, 6 mm, 5 mm, 4 mm, 3 mm, 2 mm, 1 mm or 0 mm, etc. Thus, when the acoustic wave excited by the acoustic wave emission surface 121 propagates to the vicinity of the heat dissipation surface 101, the oscillation of the air layer near the perturbation structure 150 caused by the acoustic wave is the most intense, and the effect of the perturbation structure 150 intensifying the disorder degree of the air layer flow near the heat dissipation surface 101 is more obvious.

[0064] Exemplarily, the first projection 104 may be a regular shape, such as a circle, a square, or an ellipse, etc., or an irregular shape. In an embodiment where the first projection 104 is an irregular shape, the geometric center of the foregoing first projection 104 is the center of the circumcircle of the first projection 104. Similarly, the projection of the perturbation structure 150 on the heat dissipation surface 101 may be a regular shape or an irregular shape. In an embodiment where the projection of the perturbation structure 150 on the heat dissipation surface 101 is an irregular shape, the geometric center of the projection of the foregoing perturbation structure 150 on the heat dissipation surface 101 is the center of the circumcircle of the projection of the perturbation structure 150 on the heat dissipation surface 101.

[0065] In some embodiments, at least a part of the perturbation structure 150 may be located within the main heat dissipation region 103. In this way, when the sound wave excited by the sound wave emission surface 121 dissipates heat from the main heat dissipation region 103 with a higher temperature, the heat dissipation efficiency of the main heat dissipation region 103 can be improved. It can be understood that in other embodiments, the perturbation structure 150 may not be located within the main heat dissipation region 103.

[0066] In some embodiments, the perturbation structure 150 includes a plurality of convex portions 151, and the plurality of convex portions 151 are distributed at intervals on the heat dissipation surface 101, and the convex portions 151 protrude in a direction away from the heat dissipation surface 101. After the flowing air collides with the convex portions 151, the direction of the flowing air is changed, the degree of turbulence of the air flow is increased, and the heat dissipation performance is improved.

[0067] In some embodiments, the height H of the convex portion 151 is 0.2 times to 0.5 times the wavelength of the sound wave emitted by the sound wave oscillator 120. For example, the height H is 0.2 times, 0.22 times, 0.24 times, 0.25 times, 0.3 times, 0.35 times, 0.4 times, 0.45 times, or 0.5 times the wavelength of the sound wave emitted by the sound wave oscillator 120, etc. In this way, when the height of the convex portion 151 is within the foregoing range, the air flow perturbation near the convex portion 151 can be more easily generated. The height H of the foregoing convex portion 151 is: along the direction perpendicular to the heat dissipation surface 101, the dimension of the convex portion 151.

[0068] The embodiments of the present application do not limit the shape of the convex portion 151. For example, the convex portion 151 is a hemispherical shape, an ellipsoidal shape, a long strip structure, or a prism, etc. In some other embodiments, the perturbation structure 150 may be a groove or other structures, and is not limited to the protruding structure.

[0069] Please return to Figure 1, the embodiments of the present application do not limit the way the acoustic oscillator 120 is rotatably connected to the bracket 110. Exemplarily, the acoustic oscillator 120 and the bracket 110 can be connected by a hinge. The embodiments of the present application do not limit the maximum angle by which the acoustic oscillator 120 can rotate about the first axis 30. Exemplarily, the aforementioned maximum angle is 5° - 180°. For example, the maximum angle by which the acoustic oscillator 120 can rotate about the first axis 30 can be 5°, 10°, 20°, 25°, 30°, 40°, 60°, 80°, 100°, 110°, 130°, 150°, or 180°, etc. In some embodiments, the maximum angle can be 15° - 60°.

[0070] As described above, since the acoustic emission surface 121 can rotate relative to the bracket 110, during the rotation of the acoustic emission surface 121, the shape of the first projection 104 may change, and the position of the first projection 104 may also change.

[0071] Figure 4 It is a position relationship diagram of the first projection 104 and the heat dissipation surface 101 when the acoustic oscillator provided by the embodiments of the present application is in different states. Figure 4 In FIG. a, it shows the position relationship between the first projection 104 and the heat dissipation surface 101 when the acoustic oscillator 120 (as Figure 1 shown) is in the first state. In FIG. a, the first projection 104 is within the heat dissipation surface 101, and the first projection 104 is located outside the main heat dissipation area 103. FIG. b shows the position relationship between the first projection 104 and the heat dissipation surface 101 when the acoustic oscillator 120 is in the second state. In FIG. b, the first projection 104 is within the heat dissipation surface 101, and the first projection 104 is located within the main heat dissipation area 103. The area of the first projection 104 in the second state is larger than the area of the first projection 104 in the first state. FIG. c shows the position relationship between the first projection 104 and the heat dissipation surface 101 when the acoustic oscillator 120 is in the third state. In FIG. c, the first projection 104 is within the heat dissipation surface 101, and the first projection 104 is located within the main heat dissipation area 103. The area of the first projection 104 in the third state is smaller than the area of the first projection 104 in the second state. FIG. d shows the position relationship between the first projection 104 and the heat dissipation surface 101 when the acoustic oscillator 120 is in the fourth state. In FIG. d, the first projection 104 is within the heat dissipation surface 101, and a part of the first projection 104 is located within the main heat dissipation area 103 and a part is located outside the main heat dissipation area 103.

[0072] In the state where the first projection 104 and the main heat dissipation area 103 partially overlap, for example Figure 4In FIGS. b, c, and d, when the sound waves excited by the sound wave emission surface 121 propagate to the vicinity of the heat dissipation surface 101, the air flow near the main heat dissipation region 103 is disturbed, causing the air flow with a higher temperature near the main heat dissipation region 103 to escape, thereby cooling the main heat dissipation region 103. Since the main heat dissipation region 103 is the region with a higher temperature on the heat dissipation surface 101, cooling the main heat dissipation region 103 can significantly improve the heat dissipation performance of the device body and enable the heat dissipated by the device body to be quickly dissipated. In addition, the main heat dissipation region 103 is relatively close to the component with more heat dissipation in the heat generating component 102 (as shown in Figure 2 ), which can shorten the heat dissipation path of the aforementioned component with more heat dissipation and improve the heat dissipation performance of such a component.

[0073] It can be understood that if it is desired that the first projection 104 is in the main heat dissipation region 103, the relative positions of the bracket 110 and the heat dissipation surface 101 can be adjusted to adjust the relative positions of the sound wave emission surface 121 and the heat dissipation surface 101, so that the first projection 104 and the main heat dissipation region 103 at least partially overlap in more states of the sound wave oscillator 120. Alternatively, the sound wave oscillator 120 can also be rotated relative to the bracket 110 so that the first projection 104 and the main heat dissipation region 103 at least partially overlap in more states of the sound wave oscillator 120.

[0074] It can be understood that the positional relationship between the first projection 104 and the heat dissipation surface 101 is not limited to Figure 4 the FIGS. a, b, c, and d shown in. In some states of the sound wave oscillator 120, the first projection 104 can also be located outside the heat dissipation surface 101, etc.

[0075] Figure 5 FIG. is a schematic structural diagram of the sound wave oscillator 120 provided in the embodiment of the present application in the second state. Figure 5 In, the sound wave emission surface 121 is parallel to the heat dissipation surface 101, so the distance between the sound wave emission surface 121 and the heat dissipation surface 101 is relatively small. The propagation direction of the sound waves excited by the sound wave emission surface 121 is perpendicular to the heat dissipation surface 101. When the sound waves excited by the sound wave emission surface 121 are transmitted to the heat dissipation surface 101, the disturbance of the sound waves to the air layer near the heat dissipation surface 101 is greater, and better heat dissipation can be achieved. Secondly, since the sound wave emission surface 121 is parallel to the heat dissipation surface 101, the distances from each point on the sound wave emission surface 121 to the heat dissipation surface 101 are close or equal. A standing wave sound field is more easily formed between the sound wave emission surface 121 and the heat dissipation surface 101, and the heat dissipation performance is better.

[0076] In addition, during the process of the sound wave excited by the sound wave emitting surface 121 propagating to the vicinity of the heat dissipation surface 101, since the distance between the sound wave emitting surface 121 and the heat dissipation surface 101 is small, the transmission path of the sound wave is short and the loss is small, which can improve the utilization efficiency of the sound wave. In addition, the sound wave emitting surface 121 and the heat dissipation surface 101 are parallel, and the area of the first projection 104 is the largest. The sound wave excited by the sound wave emitting surface 121 can disturb the air flow in a larger area near the heat dissipation surface 101, increasing the heat dissipation performance of the heat dissipation device 100.

[0077] In some embodiments, no other structural members may be provided between the sound wave emitting surface 121 and the heat dissipation surface 101. For example, only an air layer is included between the sound wave emitting surface 121 and the heat dissipation surface 101. In this way, the sound wave excited by the sound wave emitting surface 121 is not easily disturbed. When the sound wave excited by the sound wave emitting surface 121 is transmitted to the heat dissipation surface 101, the disturbance of the sound wave to the air layer near the heat dissipation surface 101 is greater, and better heat dissipation can be achieved. It can be understood that solid particles such as dust may be allowed to exist in the aforementioned air layer. For example, solid particles with a volume fraction of 20% or less may exist in the aforementioned air. Droplets may be allowed to exist in the aforementioned air layer. For example, the humidity of the aforementioned air layer is greater than or equal to 85%.

[0078] The embodiments of the present application do not limit the distance between the sound wave emitting surface 121 and the heat dissipation surface 101. In some embodiments, the distance between the sound wave emitting surface 121 and the heat dissipation surface 101 is 0.2 mm - 5 mm. For example, the distance between the sound wave emitting surface 121 and the heat dissipation surface 101 may be 0.2 mm, 0.3 mm, 0.5 mm, 0.8 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm or 5 mm, etc. When the distance between the sound wave emitting surface 121 and the heat dissipation surface 101 is within the aforementioned range, the sound wave excited by the sound wave emitting surface 121 propagates to the heat dissipation surface 101 to form an air flow, and the air flow exchanges heat with the heat dissipation surface 101 to cool the device main body 10. In addition, when the distance between the sound wave emitting surface 121 and the heat dissipation surface 101 is within this range, the volume of the electronic device 20 is relatively small, which is beneficial to the miniaturization of the electronic device 20.

[0079] Figure 6 It is a flow simulation diagram of the air flow near the heat dissipation surface 101 when the sound wave oscillator 120 is working. Figure 6 In, when the sound wave oscillator 120 is in the working state, the sound wave oscillator 120 forms a vortex on the air layer on the surface of the heat dissipation surface 101. The aforementioned vortex refers to a situation where the flow path of the air flow is in a vortex shape or a spiral shape. This vortex is different from laminar flow, and the direction of the air flow in the vortex changes relatively quickly.

[0080] During the process that the sound wave excited by the sound wave oscillator 120 propagates to the heat dissipation surface 101, in the propagation direction of the sound wave, it is not blocked or interfered by other components except the air layer, or is blocked or interfered by other components except the air layer to a small extent. The sound wave oscillator 120 can form Figure 6 the eddy current shown in the figure. The path of the gas flow is an eddy current or a non-laminar flow, which separates the air layer on the surface of the heat dissipation surface 101 from the surface of the heat dissipation surface 101. Then, the air flow at other positions flows to the surface of the heat dissipation surface 101 and then separates again, and so on in a cycle, effectively improving the problem that the heat conduction rate of the air flow on the surface of the heat dissipation surface 101 is poor due to laminar flow. In other words, the eddy current formed on the air layer on the surface of the heat dissipation surface 101 can quickly dissipate the air layer with a higher temperature on the surface of the heat dissipation surface 101. The air flow with a lower temperature in other areas, such as the area near the bracket 110, is filled to the surface of the heat dissipation surface 101 under the drive of the eddy current gas on the air layer on the surface of the heat dissipation surface 101 to dissipate heat for the heat dissipation surface 101, and so on in a cycle, achieving the purpose of dissipating heat for the heat dissipation surface 101.

[0081] The embodiments of the present application do not limit the connection manner between the bracket 110 and the device main body 10. In some embodiments, the bracket 110 and the device main body 10 are detachably connected, such as snap connection or screw connection. In this way, the device main body 10 can be replaced, so that the heat dissipation device 100 dissipates heat for different device main bodies 10. In addition, when it is necessary to dissipate heat for the device main body 10, the bracket 110 and the device main body 10 are connected, and when it is not necessary to dissipate heat for the device main body 10, the bracket 110 and the device main body 10 are separated, which is convenient for the storage of the electronic device 20. In addition, in the embodiments where the bracket 110 and the device main body 10 are snap-connected, the position of the first projection 104 on the heat dissipation surface 101 can be changed by adjusting the snap-connection position between the bracket 110 and the device main body 10 to dissipate heat for different positions on the heat dissipation surface 101.

[0082] In some embodiments, as Figure 5 shown, the electronic device 20 may further include a mounting bracket 130. The mounting bracket 130 is connected to the device main body 10, and the mounting bracket 130 is rotatably connected to the bracket 110. In this way, the bracket 110 can rotate relative to the mounting bracket 130 to adjust the angle between the bracket 110 and the mounting bracket 130. Further adjust the included angle between the bracket 110 and the device main body 10, so as to change the relative position relationship between the sound wave oscillator 120 connected to the bracket 110 and the device main body 10, and adjust the relative position relationship between the heat dissipation surface 101 and the sound wave emission surface 121, so that there are more relative positions to choose from for adjusting the heat dissipation surface 101 and the sound wave emission surface 121.

[0083] Figure 5 In the figure, the mounting bracket 130 is rotatably connected to the bracket 110 around the second axis 31. The embodiments of the present application do not limit the angular relationship between the second axis 31 and the first axis 30.Figure 5 In the example, the second axis 31 is parallel to the first axis 30, and the second axis 31 is parallel to the heat dissipation surface 101. The distance between the heat dissipation surface 101 and the acoustic wave emission surface 121 can be adjusted by the relative rotation of the mounting bracket 130 and the bracket 110. For example, rotate the mounting bracket 130 and the bracket 110 so that the distance between the heat dissipation surface 101 and the acoustic wave emission surface 121 in the x direction is the target distance, and then rotate the acoustic wave oscillator 120 so that the positional relationship between the first projection 104 and the heat dissipation surface 101 is the target positional relationship. The foregoing target positional relationship is, for example, Figure 4 any one of the positional relationships in Figures a, b, c, or d in

[0084] In some embodiments, the second axis 31 and the first axis 30 are not limited to being parallel. Exemplarily, the included angle between the second axis 31 and the first axis 30 can be 30° - 150°, for example, it can be 30°, 40°, 50°, 70°, 80°, 90°, 100°, 120°, 130°, 140°, or 150°, etc.

[0085] The embodiments of the present application do not limit the manner in which the mounting bracket 130 is connected to the device main body 10. In some embodiments, the mounting bracket 130 and the device main body 10 are fixedly connected. For example, the mounting bracket 130 and the device main body 10 are fixedly connected through a welding layer or an adhesive layer, or the mounting bracket 130 and the rear shell 15 of the device main body 10 (such as Figure 2 shown) are connected as an integrally formed part. In this way, the mounting bracket 130 and the device main body 10 do not separate, and the integration degree is relatively high. In other embodiments, the mounting bracket 130 and the device main body 10 are detachably connected. For example, the mounting bracket 130 and the device main body 10 are magnetically connected, screwed, or snap-connected, etc. In this way, it is convenient to replace the device main body 10 connected to the mounting bracket 130.

[0086] The embodiments of the present application do not limit the manner in which the mounting bracket 130 is rotatably connected to the bracket 110. Exemplarily, the mounting bracket 130 is rotatably connected to the bracket 110 through a hinge.

[0087] It can be understood that in some embodiments, the mounting bracket 130 and the bracket 110 can adopt other connection methods, not limited to rotational connection. For example, the mounting bracket 130 and the bracket 110 can be snap-connected, screwed, or welded.

[0088] The embodiments of the present application do not limit the shape of the bracket 110. Figure 5 In

[0089] In some embodiments, in order to better abut the free end 111 against the operation tabletop, structures such as clamping members, anti-slip components or gaskets can be provided at the free end 111, and the embodiments of the present application do not limit this.

[0090] The embodiments of the present application do not limit Figure 5 the placement orientation of the illustrated electronic device 20. Exemplarily, in some embodiments, the free end 111 can abut against the operation tabletop (such as a desktop). In other embodiments, the bracket 110 has opposite s1 end and s2 end along the x direction. The s1 end can abut against the operation tabletop (such as a desktop), or the s2 end can abut against the operation tabletop (such as a desktop).

[0091] In other embodiments, the bracket 110 can be connected to the device body 10 through other components, not limited to Figure 5 the illustrated mounting bracket 130.

[0092] Figure 7a is another schematic structural diagram of the electronic device 20 provided by the embodiments of the present application. Please refer to Figure 7a , the electronic device 20 can further include a back clip 140. The back clip 140 is connected to the device body 10, and the back clip 140 and the device body 10 jointly enclose a heat dissipation channel 141. Figure 7b For Figure 7a the cross-sectional schematic diagram of N-N in. Please refer to Figure 7b , the heat dissipation channel 141 has an air inlet 142 and an air outlet 143. Both the air inlet 142 and the air outlet 143 are communicated with the heat dissipation channel 141. The bracket 110 is connected to the back clip 140, and the acoustic oscillator 120 is located in the heat dissipation channel 141.

[0093] In this way, after the acoustic oscillator 120 rotates relative to the bracket 110, the first projection 104 can also partially overlap with the heat dissipation surface 101 to dissipate heat from the heat dissipation surface 101. In addition, the air inlet 142 and the air outlet 143 of the heat dissipation channel 141 enable air to flow inside and outside the heat dissipation channel 141. Under the action of the acoustic oscillator 120, the air with a higher temperature inside the heat dissipation channel 141 is dissipated to the outside of the heat dissipation channel 141 through the air outlet 143, and the air with a lower temperature outside the heat dissipation channel 141 enters the heat dissipation channel 141 through the air inlet 142. In this way, the cycle is carried out to dissipate heat from the heat dissipation surface 101.

[0094] The embodiments of the present application do not limit the connection manner between the back clip 140 and the device body 10. Exemplarily, the back clip 140 is detachably connected to the device body 10. For example, the back clip 140 is screwed, clamped or magnetically attracted to the device body 10, etc. In this way, the device body 10 connected to the back clip 140 can be replaced.

[0095] The embodiments of the present application do not limit the dimensional relationship between the back clip 140 and the heat dissipation surface 101. In some embodiments, the size of the back clip 140 is smaller than that of the heat dissipation surface 101. For example, the projection of the back clip 140 on the heat dissipation surface 101 is located within the heat dissipation surface 101. In other embodiments, the size of the back clip 140 may be larger than that of the heat dissipation surface 101. For example, part of the projection of the back clip 140 on the heat dissipation surface 101 is located within the heat dissipation surface 101, and part of the projection is located outside the heat dissipation surface 101.

[0096] The embodiments of the present application do not limit the connection manner between the back clip 140 and the bracket 110. Exemplarily, the back clip 140 and the bracket 110 are fixedly connected through a welding layer or an adhesive layer, etc., or the back clip 140 and the bracket 110 are connected as an integrally formed part. In the embodiments where the back clip 140 and the bracket 110 are connected as an integrally formed part, the back clip 140 can be regarded as a part of the bracket 110.

[0097] In some embodiments, in order to shorten the distance that the sound wave excited by the sound wave emission surface 121 propagates in the air and reduce the loss of the sound wave from the sound wave emission surface 121 to the heat dissipation surface 101. The length of the bracket 110 can be extended to make the sound wave emission surface 121 closer to the heat dissipation surface 101. Or, the bracket 110 can be set as a structure with adjustable length to change the distance that the sound wave propagates from the sound wave emission surface 121 to the heat dissipation surface 101.

[0098] Please return to Figure 5 , in some embodiments, the bracket 110 includes a base 112 and a slide rod 113. The base 112 is connected to the device body 10, and one end of the slide rod 113 is slidably connected to the base 112, and the other end of the slide rod 113 is rotatably connected to the sound wave oscillator 120. In this way, through the relative sliding of the base 112 and the slide rod 113, the base 112 and the sound wave oscillator 120 approach or move away from each other, so that the sound wave emission surface 121 of the sound wave oscillator 120 and the heat dissipation surface 101 approach or move away from each other. The closer the distance between the sound wave emission surface 121 and the heat dissipation surface 101, the smaller the loss of the sound wave excited by the sound wave emission surface 121 during the propagation to the heat dissipation surface 101, the greater the disturbance to the gas layer after the sound wave is transmitted to the gas layer on the surface of the heat dissipation surface 101, and the better the heat dissipation performance. In addition, the closer the distance between the sound wave oscillator 120 and the base 112, the smaller the volume occupied by the heat dissipation device 100.

[0099] The embodiments of the present application do not limit the manner of the sliding connection between the base 112 and the slide rod 113. In some embodiments, a slide rail is provided on the base 112, a slider is provided on the slide rod 113, and the slider is slidably connected to the slide rail. Conversely, a slide rail is provided on the slide rod 113, a slider is provided on the base 112, and the slider is slidably connected to the slide rail.

[0100] The embodiments of the present application do not limit the relative sliding direction of the slide bar 113 and the base 112. Figure 5 In Figure 5 , the sliding direction of the slide bar 113 and the base 112 is the y direction, and the x direction and the y direction can be perpendicular to each other. After the acoustic oscillator 120 moves relative to the base 112 in the y direction, the distance between the acoustic oscillator 120 and the heat dissipation surface 101 in the x direction can be adjusted.

[0101] Exemplarily, the perpendicularity between the x direction and the y direction is not limited to the angle between the x direction and the y direction being 90°. Exemplarily, the angle between the x direction and the y direction is 85° - 95°. For example, the angle between the x direction and the y direction can be 85°, 87°, 88°, 89°, 90°, 91°, 92°, 93° or 95°, etc. The same applies to the subsequent descriptions of perpendicularity.

[0102] In some embodiments, the angle between the x direction and the y direction is not limited to perpendicularity either. For example, the angle between the x direction and the y direction can be 30° - 60°. For example, the angle between the x direction and the y direction can be 30°, 35°, 40°, 45°, 50°, 55° or 60°, etc.

[0103] For the connection manner between the base 112 and the device main body 10, please refer to the description of the connection manner between the foregoing bracket 110 and the device main body 10. For the connection manner between the slide bar 113 and the acoustic oscillator 120 in a rotational connection, please refer to the description of the rotational connection manner between the foregoing bracket 110 and the acoustic oscillator 120, which will not be elaborated here.

[0104] It can be understood that Figure 7a the bracket 110 in Figure 7a can also include Figure 5 the slide bar 113 and the base 112 that slide relative to each other as shown in Figure 5 , which will not be elaborated here.

[0105] As described above, the embodiments of the present application do not limit the shape of the bracket 110. In some embodiments, the bracket 110 can be a box-shaped structure. The sliding connection between the slide bar 113 and the base 112 can enable the acoustic oscillator 120 to be received in the box-shaped structure or protrude from the box-shaped structure.

[0106] Figure 8 It is a schematic internal structure diagram of another heat dissipation device 100 provided by the embodiments of the present application. Please refer to Figure 8, a receiving groove 114 may be provided on the bracket 110, and the receiving groove 114 has an opening 115 on the surface of the bracket 110. The acoustic oscillator 120 is located in the receiving groove 114 and is rotatably connected to the receiving groove 114. When the acoustic oscillator 120 is in the first state, in the direction perpendicular to the acoustic emission surface 121, the projection of the opening 115 on the acoustic emission surface 121 at least partially overlaps with the acoustic emission surface 121. In this way, the acoustic oscillator 120 is received in the receiving groove 114, reducing the influence of dust in the air on the acoustic oscillator 120, and the acoustic wave excited by the acoustic emission surface 121 can pass through the opening 115 and propagate to the heat dissipation surface 101 (such as Figure 7b as shown).

[0107] The projection of the aforementioned opening 115 on the acoustic emission surface 121 at least partially overlapping with the acoustic emission surface 121 includes: the projection of the opening 115 on the acoustic emission surface 121 overlapping with the acoustic emission surface 121, the projection of the opening 115 on the acoustic emission surface 121 being located within the acoustic emission surface 121, and the projection of the opening 115 on the acoustic emission surface 121 covering the entire acoustic emission surface 121.

[0108] In some embodiments, the size of the opening 115 is larger than the size of the acoustic emission surface 121, so that during the process of the acoustic wave excited by the acoustic emission surface 121 passing through the opening 115, the interference of the receiving groove 114 on the acoustic wave is small.

[0109] In an embodiment where the bracket 110 includes a sliding rod 113 and a base 112, the receiving groove 114 may be provided on the base 112, and the sliding rod 113 is located in the receiving groove 114. The sliding rod 113 and the base 112 can be slid according to requirements so that the acoustic emission surface 121 is located outside the opening 115. For example, when it is necessary to dissipate heat from the heat dissipation surface 101, the sliding rod 113 and the base 112 slide relative to each other so that the acoustic emission surface 121 is located outside the opening 115, which is beneficial to improving the heat dissipation performance.

[0110] In some embodiments, the heat dissipation device 100 can be integrated into structures such as a charging stand. For example, the bracket 110 can be connected to a charging coil, or the charging coil can be integrated on the bracket 110, so that the heat dissipation device 100 combines the functions of a charging structure and a heat dissipation structure.

[0111] When the acoustic oscillator 120 is in the working state, the acoustic oscillator 120 emits acoustic waves, and the acoustic oscillator 120 has a reaction force on the bracket 110, and this reaction force causes the bracket 110 to vibrate slightly. In order to reduce this slight vibration and improve the user experience of the electronic device 20. The electronic device 20 may further include a vibration damping structure.

[0112] In the electronic device 20 including a mounting bracket 130 (such as Figure 5In the embodiment shown, the mounting bracket 130 is located outside the receiving groove 114, and the mounting bracket 130 is connected to the outer wall of the receiving groove 114.

[0113] Figure 9 FIG. 4 is a schematic structural diagram of another electronic device 20 provided by an embodiment of the present application. Figure 9 The electronic device 20 includes Figure 8 the heat dissipation device 100 shown in FIG. 5. Figure 9 In an example, the electronic device 20 may further include a mounting bracket 130. The mounting bracket 130 is connected to the device main body 10. For example, the mounting bracket 130 is attached to the heat dissipation surface 101. The mounting bracket 130 is rotatably connected to the base 112, so that the acoustic wave emitting surface 121 can rotate around the second axis 31.

[0114] Exemplarily, when it is necessary to dissipate heat from the heat dissipation surface 101, the acoustic wave oscillator 120 can move relative to the base 112 to make the acoustic wave emitting surface 121 approach the heat dissipation surface 101. The mounting bracket 130 and the base 112 can rotate relative to each other to make the acoustic wave emitting surface 121 rotate around the second axis 31 to adjust the angle between the heat dissipation surface 101 and the acoustic wave emitting surface 121 to make the heat dissipation surface 101 and the acoustic wave emitting surface 121 parallel. After the acoustic wave excited by the acoustic wave emitting surface 121 is transmitted to the heat dissipation surface 101, eddy currents are formed on the gas layer on the surface of the heat dissipation surface 101. The gas layer with a higher temperature on the surface of the heat dissipation surface 101 can be quickly dissipated, so as to achieve the purpose of dissipating heat from the heat dissipation surface 101.

[0115] As Figure 8 shown, the electronic device 20 may further include a vibration damping structure 160. The bracket 110 is connected to the acoustic wave oscillator 120 through the vibration damping structure 160. The vibration damping structure 160 has the function of reducing vibration, and can weaken the vibration of the acoustic wave emitted by the acoustic wave oscillator 120 on the bracket 110, and relieve the influence of the vibration of the acoustic wave oscillator 120 on the user. For example, when the user holds the bracket 110, the setting of the vibration damping structure 160 can reduce the vibration of the bracket 110 caused by the acoustic wave oscillator 120, thereby weakening the vibration transmitted to the user's hand and improving the user experience.

[0116] In some embodiments, the vibration damping structure 160 may be an elastic structure. The elastic structure includes but is not limited to springs, elastic rubbers, elastic foams, etc. The embodiment of the present application does not limit the thickness of the vibration damping structure 160. Exemplarily, the thickness of the vibration damping structure 160 is 0.1 mm - 2 mm. For example, the thickness of the vibration damping structure 160 can be 0.1 mm, 0.2 mm, 0.4 mm, 0.5 mm, 0.8 mm, 1 mm, 1.2 mm, 1.5 mm, 1.6 mm, 1.8 mm or 2 mm, etc.

[0117] In an embodiment where the bracket 110 includes a slide bar 113 and a base 112, one end of the slide bar 113 away from the base 112 is connected to the acoustic wave oscillator 120 through a damping structure 160.

[0118] The embodiments of the present application do not limit the frequency of the acoustic waves emitted by the acoustic wave oscillator 120. In some embodiments, the frequency of the acoustic waves emitted by the acoustic wave oscillator 120 is 2 MHz (megahertz) to 10 MHz. In other words, the acoustic wave oscillator 120 is an ultrasonic acoustic wave oscillator. The acoustic waves with a frequency of 2 MHz (megahertz) to 10 MHz cannot be perceived by the ears of a user (such as a human), reducing the impact of noise on the user.

[0119] It can be understood that in other embodiments of the present application, the acoustic waves emitted by the acoustic wave oscillator 120 may not be ultrasonic waves, and the embodiments of the present application do not limit this.

[0120] Please return Figure 5 , in some embodiments, the acoustic wave oscillator 120 may include an oscillator body 122, a piezoelectric element 123, and an acoustic impedance matching layer 124. Among them, the oscillator body 122 is rotatably connected to the bracket 110, the piezoelectric element 123 is disposed between the oscillator body 122 and the acoustic impedance matching layer 124, and the projection of the acoustic impedance matching layer 124 on the surface of the piezoelectric element 123 covers the piezoelectric element 123.

[0121] The acoustic wave emitting surface 121 is located on the surface of the acoustic impedance matching layer 124 facing away from the piezoelectric element 123. The specific acoustic impedance of the acoustic impedance matching layer 124 is greater than the specific acoustic impedance of air and less than the specific acoustic impedance of the piezoelectric element 123. In this way, the setting of the acoustic impedance matching layer 124 can improve the driving efficiency of the acoustic waves excited by the acoustic wave oscillator 120 on the air. The acoustic impedance matching layer 124 can most effectively reduce the reflection energy loss at the interface between the acoustic impedance matching layer 124 and the air, improve the energy propagation efficiency, and reduce the heat loss.

[0122] Exemplarily, the specific acoustic impedance of the acoustic impedance matching layer 124 is 5.0*10^4 Pa s / m (Pascal-second per meter) - 1.0*10^6 Pa s / m. For example, the specific acoustic impedance of the acoustic impedance matching layer 124 is 5.0*10^4 Pa s / m, 7*10^4 Pa s / m, 8*10^4 Pa s / m, 1*10^5 Pa s / m, 3*10^5 Pa s / m, 5*10^5 Pa s / m, 8*10^5 Pa s / m, 9*10^5 Pa s / m, or 1.0*10^6 Pa s / m, etc. When the specific acoustic impedance of the acoustic impedance matching layer 124 is within this range, the energy propagation efficiency can be effectively improved and the loss can be reduced.

[0123] Exemplarily, the material of the acoustic impedance matching layer 124 can be, for example, rubber, fluorinated polymer, polyurethane, or the like.

[0124] Exemplarily, the material of the piezoelectric element 123 includes at least one of piezoelectric single crystals, piezoelectric polycrystals (piezoelectric ceramics), piezoelectric polymer polymers, piezoelectric composite materials, and piezoelectric semiconductors. Among them, the piezoelectric single crystals include: piezoelectric quartz crystals, lithium niobate, lithium tantalate, Rochelle salt, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, or potassium bitartrate, etc. The piezoelectric polycrystals include: barium titanate, lead titanate, sodium potassium niobate, lead metaniobate, lead zirconate titanate, lead barium metaniobate, etc. The piezoelectric polymer polymers include: polyvinylidene fluoride, etc.

[0125] In the description of this specification, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0126] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that, The electronic device includes: A device body having a heat dissipation surface; A bracket connected to the device body; and An acoustic oscillator, the acoustic emission surface of the acoustic oscillator facing the device body, the acoustic oscillator being rotatably connected to the bracket. When the acoustic oscillator is in a first state, in a direction perpendicular to the heat dissipation surface, the projection of the acoustic emission surface on the heat dissipation surface overlaps at least partially with the heat dissipation surface.

2. The electronic device according to claim 1, wherein The bracket includes a base and a sliding rod. The base is connected to the device body, one end of the sliding rod is slidably connected to the base, and the other end is rotatably connected to the acoustic oscillator.

3. The electronic device according to claim 1 or 2, characterized in that, The electronic device further includes: a perturbation structure disposed on the heat dissipation surface. In a direction perpendicular to the heat dissipation surface, the projection of the acoustic emission surface on the heat dissipation surface overlaps at least partially with the projection of the perturbation structure on the heat dissipation surface.

4. The electronic device according to claim 3, wherein In a direction perpendicular to the heat dissipation surface, the distance between the geometric center of the projection of the acoustic emission surface on the heat dissipation surface and the geometric center of the projection of the perturbation structure on the heat dissipation surface is less than or equal to 10 mm.

5. The electronic device according to claim 3 or 4, characterized in that, The perturbation structure includes a plurality of convex portions, and the plurality of convex portions are spaced apart on the heat dissipation surface, and the convex portions protrude in a direction away from the heat dissipation surface.

6. The electronic device according to any one of claims 1-5, characterized in that, The acoustic oscillator includes an oscillator body, a piezoelectric element, and an acoustic impedance matching layer. The oscillator body is rotatably connected to the bracket, the piezoelectric element is disposed between the oscillator body and the acoustic impedance matching layer, and the projection of the acoustic impedance matching layer on the surface of the piezoelectric element covers the piezoelectric element; The acoustic emission surface is located on the surface of the acoustic impedance matching layer facing away from the piezoelectric element, and the specific acoustic impedance of the acoustic impedance matching layer is greater than the specific acoustic impedance of air and less than the specific acoustic impedance of the piezoelectric element.

7. The electronic device according to claim 6, characterized in that, The specific acoustic impedance of the acoustic impedance matching layer is 5.0×10^4 Pa s / m - 1.0×10^6 Pa s / m.

8. The electronic device according to any one of claims 1-7, characterized in that, When the acoustic oscillator is in a working state, the acoustic oscillator forms a vortex on the air layer on the surface of the heat dissipation surface.

9. The electronic device according to any one of claims 1-8, characterized in that, The electronic device further includes: a damping structure, and the bracket is connected to the acoustic oscillator through the damping structure.

10. The electronic device according to any one of claims 1-9, wherein The bracket is detachably connected to the device body.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The electronic device further includes a mounting bracket, the mounting bracket is connected to the device body, and the bracket is rotatably connected to the mounting bracket.

12. The electronic device according to any one of claims 5-11, characterized in that, The electronic device further includes: a back clip, the back clip is connected to the device body, the back clip and the device body jointly enclose a heat dissipation channel, the heat dissipation channel has an air inlet and an air outlet, the bracket is connected to the back clip, and the acoustic oscillator is located in the heat dissipation channel.

13. The electronic device according to claim 12, characterized in that, The back clip is detachably connected to the device body.

14. The electronic device according to any one of claims 1-13, characterized in that, When the acoustic oscillator is in a second state, the acoustic emission surface is parallel to the heat dissipation surface.

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