Cooling system

Abstract

The invention provides a cooling system. The cooling system includes: a blower; a metal housing; a semiconductor module housed in the metal case and disposed on the lower surface of the upper wall of the metal case; and a resin duct configured to cover at least a part of the upper surface of the upper wall of the metal housing and guide cooling air from the blower along the upper surface of the upper wall between an upstream end connected to the blower and a downstream end open to the outside. The resin duct includes a first resin portion formed of a thermoplastic resin and a second resin portion formed of a thermosetting resin. The second resin portion of the resin duct is located above the semiconductor module and is supported by the first resin portion.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a cooling system. Background Art

[0002] A cooling system is disclosed in Japanese Unexamined Patent Application Publication No. 2010-41809, which includes: a metal housing; a semiconductor module housed in the metal housing and disposed on the lower surface of the upper wall of the metal housing; and a cooling water flow path provided on the upper wall side of the metal housing. In this cooling system, the semiconductor module in the metal housing is cooled by cooling water flowing in the cooling water flow path. Summary of the Invention

[0003] In a cooling system, there is a structure (i.e., an air-cooled type) in which air is used instead of cooling water to cool the semiconductor module in the metal housing. In such a structure, the semiconductor module sometimes malfunctions and overheats. In this case, the metal housing sometimes melts and a hole is formed in the metal housing. If a hole is formed in the metal housing, foreign matter will enter the metal housing through the hole.

[0004] In this specification, a technology that can suppress the intrusion of foreign matter into the metal housing is provided.

[0005] In a first aspect of the present technology, the cooling system may include: a blower; a metal housing; a semiconductor module housed in the metal housing and disposed on the lower surface of the upper wall of the metal housing; and a resin pipe configured to cover at least a part of the upper surface of the upper wall of the metal housing and guide the cooling air from the blower along the upper surface of the upper wall between the upstream end connected to the blower and the downstream end open to the outside.

[0006] Alternatively, the resin pipe may include a first resin portion made of a thermoplastic resin and a second resin portion made of a thermosetting resin.

[0007] Alternatively, the second resin portion of the resin pipe may be located above the semiconductor module and supported by the first resin portion.

[0008] As described above, if the semiconductor module overheats, the metal housing sometimes melts and a hole is formed in the metal housing. In this case, high-temperature gas flows out of the hole in the metal housing. According to the above structure, due to the gas flowing out of the hole in the metal housing, the first resin portion made of the thermoplastic resin in the resin pipe melts. On the other hand, the second resin portion made of the thermosetting resin does not melt. Since the first resin portion melts, the second resin portion located above the semiconductor module falls and can at least partially block the hole in the metal housing. Therefore, the intrusion of foreign matter into the metal housing can be suppressed.

[0009] In the second mode, it is also possible that, in the above first mode, a plurality of fins are provided on the upper surface of the upper wall of the metal housing, and the plurality of fins respectively extend along a first direction from the upstream end toward the downstream end and are arranged along a second direction orthogonal to the first direction.

[0010] It is also possible that the second resin portion includes a plurality of resin extension portions, and the plurality of resin extension portions respectively extend along the first direction and are arranged along the second direction.

[0011] It is also possible that the plurality of resin extension portions are respectively disposed above the space between two adjacent fins among the plurality of fins.

[0012] In the above structure, in the case where the semiconductor module overheats, it is assumed that a hole is formed between two adjacent fins in the second direction. Regarding this point, according to the above structure, when the first resin portion melts and the resin extension portion of the second resin portion drops, the resin extension portion can fall more reliably between two adjacent fins. Therefore, the hole formed due to the melting of the upper wall can be blocked more reliably.

[0013] In the third mode, it is also possible that, in the above second mode, in the first direction, both ends of the resin extension portion are located at positions outside the two ends of the semiconductor module.

[0014] The melting of the metal housing is caused by the overheating of the semiconductor module. Therefore, in the case where the upper wall of the metal housing melts and a hole is formed in the upper wall, it is assumed that the formation of the hole occurs within the range where the semiconductor module is disposed. Thus, in the first direction, if both ends of the resin extension portion are located at positions outside the two ends of the semiconductor module, the hole formed due to the melting of the upper wall can be blocked more reliably.

[0015] In the fourth mode, it is also possible that, in the above second or third mode, in the second direction, two resin extension portions located on both sides of the plurality of resin extension portions are located at positions outside the semiconductor module.

[0016] As described above, in the case where the upper wall of the metal housing melts and a hole is formed in the upper wall, it is assumed that the formation of the hole occurs within the range where the semiconductor module is disposed. Thus, in the second direction, if two resin extension portions located on both sides of the plurality of resin extension portions are located at positions outside the semiconductor module, the hole formed due to the melting of the upper wall can be blocked more reliably.

[0017] In the fifth mode, it is also possible that, in any one of the above first to fourth modes, the thermoplastic resin is polypropylene and the thermosetting resin is phenolic resin.

[0018] According to the above structure, relative to the temperature assumed during the melting of the upper wall of the metal housing, the first resin portion can be reliably melted while maintaining the shape of the second resin portion. Thus, the hole formed due to the melting of the upper wall can be more reliably blocked. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Hereinafter, the features, advantages, and technical and industrial significance of exemplary embodiments of the present invention will be described with reference to the drawings, in which like reference numerals denote like elements, and in which: Figure 1 is a perspective view of the cooling system 2; Figure 2 is a front cross-sectional view of the cooling system 2; Figure 3 is a top view of the cooling system 2; Figure 4A is a view showing a situation when the semiconductor module 44A overheats; Figure 4B is a view showing Figure 4A a subsequent view of; Figure 5A is a view showing Figure 4B a subsequent view of; Figure 5B is a view showing Figure 5A a subsequent view of. DETAILED DESCRIPTION

[0020] As Figure 1 shown, the cooling system 2 includes an intake duct 10, a blower 12, an exhaust duct 14, and a converter housing 16. The cooling system 2 is mounted on an electrified vehicle. The electrified vehicle is a battery electric vehicle that uses a battery to rotate a drive motor, a fuel cell electric vehicle that uses electricity generated by a fuel cell to rotate a drive motor, a hybrid electric vehicle that includes both a drive motor and an internal combustion engine, and the like. Hereinafter, for ease of understanding, the extending direction of the exhaust duct 14 is defined as the "front-rear direction", and based on this, the "left-right direction" and the "up-down direction" are defined as shown in Figure 1 . In addition, the "front-rear direction" and the "left-right direction" defined here do not limit the posture of the cooling system 2 during use.

[0021] Structure of the Converter Housing 16

[0022] The converter housing 16 is a metal housing. The converter housing 16 includes a housing bottom wall 20 (see Figure 2 ), a housing upper wall 22, a housing right wall 24 (seeFigure 2 ), the left wall 26 of the housing, the front wall 28 of the housing, and the rear wall of the housing (not shown). A plurality of fins 30 extending in the front-rear direction are provided on the upper surface 22A of the upper wall 22 of the housing. The plurality of fins 30 are arranged in the left-right direction. The plurality of fins 30 are arranged at equal intervals in the left-right direction.

[0023] As Figure 2 shown, a DC-DC converter 40 is housed in the converter housing 16. In addition, in Figure 2 , the DC-DC converter 40 is simply shown. The DC-DC converter 40 includes a plurality of circuit boards 42A, 42B and a plurality of semiconductor modules 44A, 44B. The plurality of semiconductor modules 44A, 44B are mounted on the lower surface 22B of the upper wall 22 of the converter housing 16.

[0024] Structure of the intake duct 10

[0025] Figure 1 The upstream end of the intake duct 10 opens to the outside, and the downstream end of the intake duct 10 is connected to the blower 12. The blower 12 sucks cooling air through the intake duct 10 and sends the cooling air to the exhaust duct 14.

[0026] Structure of the exhaust duct 14

[0027] The exhaust duct 14 is a resin duct. The exhaust duct 14 extends in the front-rear direction. The upstream end (i.e., the rear end) of the exhaust duct 14 is connected to the blower 12, and the downstream end (i.e., the front end) of the exhaust duct 14 opens to the outside. The exhaust duct 14 is arranged to cover a part of the upper surface 22A of the upper wall 22 of the converter housing 16. Specifically, the exhaust duct 14 covers the upper surface 22A of the upper wall 22 in the range where the semiconductor modules 44A, 44B are arranged. The exhaust duct 14 guides the cooling air from the blower 12 along the upper surface 22A between the upstream end and the downstream end.

[0028] The exhaust duct 14 has an upper duct portion 50 and a lower duct portion 52. The upper duct portion 50 extends from the upstream end to the downstream end. The upstream end (i.e., the rear end) of the upper duct portion 50 is connected to the intake duct 10. The position of the downstream end (i.e., the front end) of the upper duct portion 50 in the front-rear direction is substantially the same as the front end of the converter housing 16. The lower duct portion 52 is provided between the intake duct 10 and the converter housing 16. The lower duct portion 52 is fixed to the upper duct portion 50 from below by screws (not shown) or the like.

[0029] The upper pipe portion 50 includes a pipe upper wall 60, a pipe right wall 62, a pipe left wall 64, and side edges 66 provided on the left and right sides of the upper pipe portion 50. The right side edge 66 extends rightward from the lower end of the pipe right wall 62, and the left side edge 66 extends leftward from the lower end of the pipe left wall 64. As Figure 2 shown, the upper pipe portion 50 includes a first resin portion 68 made of a thermoplastic resin and a second resin portion 70 made of a thermosetting resin. As an example, the thermoplastic resin is polypropylene, and the thermosetting resin is phenolic resin. The pipe right wall 62, the pipe left wall 64, and the side edges 66 are formed by the first resin portion 68. The pipe upper wall 60 is formed by the first resin portion 68 and the second resin portion 70. In Figure 2 , the portion formed by the first resin portion 68 is shaded, and the portion formed by the second resin portion 70 is not shaded. Although not shown in the figure, the pipe right wall 62 and the pipe left wall 64 are fixed to the converter housing 16 by screws or the like. The second resin portion 70 includes a plurality of left resin extension portions 80A to 80D and a plurality of right resin extension portions 82A to 82C that extend in the front-rear direction. Hereinafter, the plurality of left resin extension portions 80A to 80D and the plurality of right resin extension portions 82A to 82C may be collectively referred to as "left resin extension portions 80" and "right resin extension portions 82", respectively. The left resin extension portions 80 and the right resin extension portions 82 are supported by the first resin portion 68. In the present embodiment, the left resin extension portions 80 and the right resin extension portions 82 are embedded inside the first resin portion 68. In a modified example, the left resin extension portions 80 and the right resin extension portions 82 may be provided on the upper surface of the first resin portion 68 or may be adhered to the lower surface of the first resin portion 68 by an adhesive or the like.

[0030] The plurality of left resin extension portions 80A to 80D are arranged above the semiconductor module 44A. The plurality of left resin extension portions 80A to 80D are arranged at equal intervals in the left-right direction. In the left-right direction, the plurality of left resin extension portions 80A to 80D are respectively arranged between two adjacent fins 30. The length of the left resin extension portion 80 in the left-right direction is slightly shorter than the distance between two adjacent fins 30 in the left-right direction. In addition, it is sufficient that the length of the left resin extension portion 80 in the left-right direction is shorter than the distance between two adjacent fins 30. The left end of the left resin extension portion 80A arranged at the leftmost side is located on the left side of the left end of the semiconductor module 44A. The right end of the left resin extension portion 80D arranged at the rightmost side is located on the right side of the right end of the semiconductor module 44A. Refer to Figure 3 to describe the dimensions of the left resin extension portion 80 in the front-rear direction. In Figure 3 , for ease of understanding, the semiconductor modules 44A, 44B, the left resin extension portion 80, and the right resin extension portion 82 are represented by double-dot dash lines. As Figure 3As shown, the front and rear ends of the left resin extension portion 80 are located at positions outside the front and rear ends of the semiconductor module 44A. That is, the length of the left resin extension portion 80 in the front-rear direction is longer than the length of the semiconductor module 44A in the front-rear direction.

[0031] As Figure 2 shown, a plurality of right resin extension portions 82A to 82C are arranged above the semiconductor module 44B. The plurality of right resin extension portions 82A to 82C are arranged at equal intervals in the left-right direction. In the left-right direction, the plurality of right resin extension portions 82A to 82C are respectively arranged between two adjacent fins 30. The length of the right resin extension portion 82 in the left-right direction is slightly shorter than the distance between two adjacent fins 30. The left end portion of the right resin extension portion 82A arranged at the leftmost side is located at a position to the left of the left end portion of the semiconductor module 44B. The right end portion of the right resin extension portion 82C arranged at the rightmost side is located at a position to the right of the right end portion of the semiconductor module 44B. As Figure 3 shown, the front and rear ends of the right resin extension portion 82 are located at positions outside the front and rear ends of the semiconductor module 44B. That is, the length of the right resin extension portion 82 in the front-rear direction is longer than the length of the semiconductor module 44B in the front-rear direction. In the present embodiment, the left resin extension portion 80 and the right resin extension portion 82 have the same shape and size, but in a modified example, the left resin extension portion 80 and the right resin extension portion 82 may also have different shapes and sizes.

[0032] Effects of the first resin portion 68 and the second resin portion 70

[0033] Refer to Figure 4A , Figure 4B , Figure 5A , Figure 5B , and the effects of the first resin portion 68 and the second resin portion 70 will be described. In Figure 4A , Figure 4B , Figure 5A , Figure 5B , a situation where the semiconductor module 44A is damaged by melting in response to overheating of the semiconductor module 44A is assumed. Figure 4A represents the state just before the semiconductor module 44A is about to be damaged by melting. In Figure 4A , Figure 4B , Figure 5A , Figure 5B , the left resin extension portion 80 and the right resin extension portion 82 are shown in gray.

[0034] As Figure 4BAs shown, as the semiconductor module 44A overheats, the semiconductor module 44A is damaged by melting. In addition, the portion of the upper wall 22 of the converter housing 16 that contacts the semiconductor module 44A melts. As a result, a hole 90 that communicates the outside with the inside of the converter housing 16 is formed in the upper wall 22 of the converter housing 16. Then, the high-temperature gas rises through the hole 90 ( Figure 4B arrow F).

[0035] As Figure 5A shown, when the high-temperature gas reaches the upper wall 60 of the upper duct portion 50, the portion of the upper wall 60 formed of the first resin portion 68 (i.e., the thermoplastic resin) melts. On the other hand, the portion of the upper wall 60 formed of the second resin portion 70 (i.e., the thermosetting resin) does not melt. As a result, the plurality of left resin extension portions 80A to 80D of the second resin portion 70 are no longer supported by the first resin portion 68, and the plurality of left resin extension portions 80A to 80D fall.

[0036] As Figure 5B shown, the plurality of left resin extension portions 80A to 80D that have fallen are placed on the upper surface 22A of the upper wall 22 of the converter housing 16. That is, the hole 90 formed due to the melting of the upper wall 22 of the housing is blocked by the plurality of left resin extension portions 80A to 80D. Therefore, it is possible to prevent (conductive) foreign matter from entering the converter housing 16 through the hole 90.

[0037] Effects of this embodiment

[0038] As described above, as Figures 1 to 3 shown, a cooling system 2, a blower 12, a converter housing 16, a semiconductor module 44A, and an exhaust duct 14 are provided. The converter housing 16 is an example of a "metal housing". The semiconductor module 44A is housed in the converter housing 16 and is disposed on the lower surface 22B of the upper wall 22 of the converter housing 16. The exhaust duct 14 is an example of a "resin duct". The exhaust duct 14 is arranged to cover at least a part of the upper surface 22A of the upper wall 22 of the converter housing 16, and guides the cooling air from the blower 12 along the upper surface 22A of the upper wall 22 between the upstream end connected to the blower 12 and the downstream end open to the outside. The exhaust duct 14 includes a first resin portion 68 made of a thermoplastic resin and a second resin portion 70 made of a thermosetting resin. The second resin portion 70 of the exhaust duct 14 is located above the semiconductor modules 44A and 44B and is supported by the first resin portion 68.

[0039] As Figure 4A , Figure 4B , Figure 5A , Figure 5BAs shown, if the semiconductor module 44A overheats, the converter housing 16 melts, and sometimes a hole 90 is formed in the converter housing 16. In this case, high-temperature gas flows out from the hole 90 of the converter housing 16. According to the above structure, the first resin portion 68 made of thermoplastic resin in the exhaust pipe 14 melts due to the gas flowing out from the hole 90 of the converter housing 16. On the other hand, the second resin portion 70 made of thermosetting resin does not melt. Since the first resin portion 68 melts, the second resin portion 70 located above the semiconductor module 44A drops, and can at least partially block the hole 90 of the converter housing 16. Therefore, the intrusion of foreign matter into the converter housing 16 can be suppressed.

[0040] In addition, as Figure 1 shown, a plurality of fins 30 are provided on the upper surface 22A of the housing upper wall 22 of the converter housing 16. The plurality of fins 30 each extend in the front-rear direction from the upstream end to the downstream end and are arranged in the left-right direction. The front-rear direction is an example of the "first direction". The left-right direction is an example of the "second direction". As Figure 2 shown, the second resin portion 70 includes a plurality of left resin extension portions 80 that respectively extend in the front-rear direction and are arranged in the left-right direction. The plurality of left resin extension portions 80 are respectively disposed above between two adjacent fins 30 among the plurality of fins 30.

[0041] In the above structure, in the case where the semiconductor module 44A overheats, it is assumed that a hole 90 is formed between two adjacent fins 30 in the left-right direction. In this regard, according to the above structure, when the first resin portion 68 melts and the left resin extension portion 80 of the second resin portion 70 drops, the left resin extension portion 80 can be made to drop more reliably between the two adjacent fins 30. Therefore, the hole 90 formed due to the melting of the housing upper wall 22 can be blocked more reliably.

[0042] In addition, as Figure 3 shown, in the front-rear direction, both ends of the left resin extension portion 80 are located at positions outside the both ends of the semiconductor module 44A.

[0043] The melting of the converter housing 16 is caused by the overheating of the semiconductor module 44A. Therefore, in the case where the housing upper wall 22 of the converter housing 16 melts and a hole 90 is formed in the housing upper wall 22, it is assumed that the formation of the hole 90 occurs within the range where the semiconductor module 44A is disposed. Thus, in the front-rear direction, if both ends of the left resin extension portion 80 are located at positions outside the both ends of the semiconductor module 44A, the hole 90 formed due to the melting of the housing upper wall 22 can be blocked more reliably.

[0044] In addition, as Figure 2As shown, in the left - right direction, there are two positions located on both sides of the left - hand resin extension portion 80 and outside the semiconductor module 44A.

[0045] In the left - right direction, if there are two positions located on both sides of the left - hand resin extension portion 80 and outside the semiconductor module 44A, the holes 90 formed due to the melting of the upper wall 22 of the housing can be blocked more reliably.

[0046] In addition, the thermoplastic resin is polypropylene and the thermosetting resin is phenolic resin.

[0047] According to the above structure, with respect to the temperature assumed when the upper wall 22 of the converter housing 16 melts, the shape of the second resin portion 70 can be maintained, and the first resin portion 68 can be reliably melted. Thus, the holes 90 formed due to the melting of the upper wall 22 of the housing can be blocked more reliably.

[0048] Above, specific examples of the technology disclosed in this specification have been described in detail, but these are merely examples and do not limit the claims. The technology described in the claims includes technologies obtained by various deformations and changes of the above - exemplified specific examples.

[0049] First modification example

[0050] It is also possible not to provide the fins 30 on the upper wall 22 of the converter housing 16. In this modification example, the size of the cross - sectional shape of the second resin portion 70 orthogonal to the up - down direction is larger than the size of the cross - sectional shape of the semiconductor module 44A. In addition, in other modification examples, in the structure where the fins 30 are not provided on the upper wall 22 of the converter housing 16, the size of the cross - sectional shape of the second resin portion 70 orthogonal to the up - down direction may also be smaller than the size of the cross - sectional shape of the semiconductor module 44A.

[0051] Second modification example

[0052] At least one of the front and rear ends of the left - hand resin extension portion 80 may also be located inside the front and rear ends of the semiconductor module 44A.

[0053] Third modification example

[0054] The second resin portion 70 may also not have at least one of the left - hand resin extension portion 80A located on the far left and the left - hand resin extension portion 80D located on the far right.

[0055] Fourth modification example

[0056] It is also possible not to provide the right - hand resin extension portion 82 above the semiconductor module 44B.

[0057] Fifth modification example

[0058] The "thermoplastic resin" and "thermosetting resin" are not limited to polypropylene and phenolic resin, respectively.

[0059] In addition, the technical elements described in this specification or the drawings exhibit technical effectiveness either individually or through various combinations, and are not limited to the combinations recited in the claims at the time of application. In addition, the technologies exemplified in this specification or the drawings can achieve multiple purposes simultaneously, and achieving one of the purposes itself has technical effectiveness.

Claims

1. A cooling system comprising: a blower; a metal housing; a semiconductor module housed in the metal housing and disposed on the lower surface of the upper wall of the metal housing; and a resin duct configured to cover at least a part of the upper surface of the upper wall of the metal housing and guide cooling air from the blower along the upper surface of the upper wall between an upstream end connected to the blower and a downstream end open to the outside, the resin duct including a first resin portion made of a thermoplastic resin and a second resin portion made of a thermosetting resin, the second resin portion of the resin duct being located above the semiconductor module and supported by the first resin portion.

2. The cooling system according to claim 1, wherein a plurality of fins are provided on the upper surface of the upper wall of the metal housing, the plurality of fins extending respectively along a first direction from the upstream end toward the downstream end and arranged along a second direction orthogonal to the first direction, the second resin portion includes a plurality of resin extension portions extending respectively along the first direction and arranged along the second direction, the plurality of resin extension portions are respectively disposed above between two adjacent fins of the plurality of fins.

3. The cooling system according to claim 2, wherein in the first direction, both ends of the resin extension portion are located at positions outside the both ends of the semiconductor module.

4. The cooling system according to claim 3, wherein in the second direction, two resin extension portions located on both sides of the plurality of resin extension portions are located at positions outside the semiconductor module.

5. The cooling system according to claim 1, wherein the thermoplastic resin is polypropylene, the thermosetting resin is phenolic resin.

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