Airborne side wall air cooling heat dissipation module structural member

Abstract

The invention discloses an airborne side wall air cooling heat dissipation module structural member, which comprises a cold plate assembly and a carrier plate assembly, and is characterized in that the cold plate assembly comprises a frame body assembly and a first uniform temperature plate; the first uniform-temperature plate is made of copper alloy, sintered columns are uniformly distributed in the first uniform-temperature plate, a composite liquid absorption core is filled in combination with a micro-nano machining technology, and nanofluid is adopted as a phase change working medium; the frame body assembly is made of aluminum alloy 6063; the first uniform-temperature plate is used for transferring heat of a chip on the carrier plate assembly to the left side and the right side, the periphery of the first uniform-temperature plate is fixed to the face, facing the carrier plate assembly, of the frame assembly through high-temperature tin soldering, a heat conduction boss is arranged at the position, corresponding to the chip on the carrier plate assembly, of the first uniform-temperature plate, and heat conduction silicone grease is brushed on the heat conduction boss; and wear-resistant heat-conducting coatings are plated on planes, in contact with the side walls of the case, of the two sides of the combined cold plate assembly. The heat dissipation requirements that the maximum power consumption of a single chip is 30W, the maximum power consumption of a single module is 75W and the maximum power consumption of a whole machine is 450W are met.

Description

Technical Field

[0001] The present invention relates to the technical fields of avionics equipment, structural design of airborne equipment, air-cooled heat dissipation of electronic equipment, etc., and particularly relates to a module structural member for air-cooled heat dissipation on the side wall of an airborne high-power electronic equipment. Background Art

[0002] The integrated display control processing subsystem of an aircraft is an important subsystem in the aircraft display control system. It needs to complete communication and cross-linking with other aircraft systems, obtain data, target parameters and control messages. At the same time, it also needs to complete various integrated functions such as image generation, video splicing, map processing, synthetic vision, and voice processing. It has powerful functions and puts forward higher requirements for software and hardware resources, which means that this subsystem generates a large amount of heat and has higher heat dissipation requirements. The power consumption of a single chip is up to more than 30W at most, and the total power consumption of a single module has far exceeded that of traditional modules and reached more than 75W. At the same time, the entire subsystem adopts a module interconnection architecture based on 3U VPX standard modules. Due to factors such as weight, the equipment chassis adopts a form of air-cooled heat dissipation on the side wall. The heat generated by the module during operation must first be conducted to the chassis structural member through the module structural member, and then conducted to the air duct fin structure on the side wall of the chassis, and dissipated into the air through convection. The heat transfer path is relatively long and the path thermal resistance is relatively large.

[0003] In the prior art, for the side wall air-cooled chassis based on 3U VPX standard modules, although it reduces the equipment weight to a certain extent, it is not very friendly to module heat dissipation and generally can only meet the heat dissipation requirements with a single module's maximum power consumption not exceeding 30W. Therefore, in the face of the current high power consumption and high heat source concentration with a single chip power consumption of 30W and a single module power consumption of 75W, it is difficult to meet the requirements of the II-level derating design of airborne avionics equipment by means of the prior art in order to ensure the reliability and service life of electronic equipment to the greatest extent.

[0004] Therefore, the present invention proposes a module structural member for air-cooled heat dissipation on the side wall of an aircraft, which meets the heat dissipation performance requirements for high-power and high heat flux density module products that the traditional 3UVPX module structure does not have. At the same time, it retains the advantages of easy disassembly, maintenance, and relatively low total weight of the traditional side wall air-cooled chassis based on 3UVPX standard modules, and has little impact on the hardware part. It is a brand-new air-cooled heat dissipation structure type based on 3U VPX standard modules and has great application prospects in the structural design of airborne avionics equipment. Summary of the Invention

[0005] The object of the present invention is to provide a modular structural component for air-cooled heat dissipation on the side wall of an airborne device. Under the premise of considering indicators such as weight, strength, and environmental adaptability, it can meet the heat dissipation requirements of a 3U VPX module with a maximum total power consumption of 75W and a maximum single-chip power consumption of 30W, and has great application prospects in the airborne display control subsystem.

[0006] The object of the present invention is achieved through the following technical solutions:

[0007] A modular structural component for air-cooled heat dissipation on the side wall of an airborne device, including a cold plate assembly and a carrier plate assembly. The heat of the carrier plate assembly is transferred to the side wall of the chassis through the left and right sides of the cold plate assembly for air-cooled heat dissipation. The cold plate assembly includes a frame assembly and a first heat pipe.

[0008] The materials of the first heat pipe are all copper alloy, with sintered columns evenly distributed inside, filled with a composite wick using micro-nano processing technology, and using nanofluid as the phase change working medium; the material of the frame assembly is aluminum alloy 6063.

[0009] The first heat pipe is used to transfer the heat of the chips on the carrier plate assembly to the left and right sides. The four sides of the first heat pipe are fixed on the side facing the carrier plate assembly of the frame assembly by high-temperature soldering. Heat conduction bosses are provided on the first heat pipe corresponding to the chips on the carrier plate assembly, and heat conduction silicone grease is brushed on the heat conduction bosses.

[0010] Wear-resistant heat conduction coatings are plated on the planes where the two sides of the combined cold plate assembly are in contact with the side wall of the chassis.

[0011] Preferably, if the first heat pipe encounters the screw hole through holes of the carrier plate assembly, then cylindrical protrusions are provided, and threaded holes for embedding thread sleeves are provided in the centers of the cylindrical protrusions.

[0012] Preferably, if the left and right sides of the cold plate assembly need to be leveled, it is achieved through pressing plate parts. The left and right sides of the first heat pipe and the two pressing plate parts are connected by high-temperature soldering. The material of the pressing plate parts is aluminum alloy 6063.

[0013] Preferably, the first heat pipe is first chemically nickel-plated before being welded to the frame assembly, and the welding surfaces of the frame assembly and the pressing plate parts are also chemically nickel-plated before welding. Then, after the first heat pipe is welded to the frame assembly and the pressing plate parts are welded to the first heat pipe, a round of machining is carried out on the whole. At this time, the machining will take the surface of the heat conduction bosses on the first heat pipe as the reference surface, so that the joints between different parts are smooth and beautiful in transition. Finally, the non-contact surfaces of the first heat pipe are chemically nickel-plated for the second time, and the surfaces of the non-welded surfaces of the frame assembly and the pressing plate parts are subjected to golden conductive oxidation treatment.

[0014] Preferably, a module structural member for airborne sidewall air-cooled heat dissipation further includes a daughter card assembly, and the cold plate assembly further includes a second heat spreader, which is used to transfer the heat of the chips on the daughter card assembly to the left and right sides. The structural principle of the second heat spreader is the same as that of the first heat spreader.

[0015] Preferably, a module structural member for airborne sidewall air-cooled heat dissipation further includes a locking bar mechanism and a puller mechanism, and the locking bar mechanism and the puller mechanism are fixed to the frame assembly by standard parts, i.e., screws.

[0016] Preferably, the threaded hole features on the frame assembly should be embedded with threaded steel sleeves.

[0017] The beneficial effects of the present invention are as follows:

[0018] For the sidewall air-cooled chassis based on the 3U VPX standard module, although the equipment weight is reduced to a certain extent, it is not very friendly to the module heat dissipation. Generally, it can only meet the heat dissipation requirements of a single module with a maximum power consumption not exceeding 30W. Therefore, in the face of the current high power consumption and high heat source concentration situation where the power consumption of a single chip reaches 30W and the power consumption of a single module reaches 75W, it is difficult to meet the requirements of the II-level derating design of airborne avionics equipment by means of existing technologies in order to ensure the reliability and service life of electronic equipment to the greatest extent.

[0019] Therefore, a module structural member for airborne sidewall air-cooled heat dissipation proposed by the present invention meets the heat dissipation performance requirements for high-power and high-heat flux density module products that are not available in traditional 3U VPX module structures. At the same time, it retains the advantages of easy disassembly, maintenance, and low total weight of the traditional sidewall air-cooled chassis based on the 3U VPX standard module, and has little impact on the hardware part. It is a brand-new air-cooled heat dissipation structure type based on the 3U VPX standard module and has great application prospects in the structural design of airborne avionics equipment. Finally, through simulation and testing, it is proved that the module structural member meets the heat dissipation requirements of a single chip with a maximum power consumption of 30W, a single module with a maximum of 75W, and the whole machine with a maximum of 450W. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of a module structural member for airborne sidewall air-cooled heat dissipation of the present invention;

[0021] Figure 2 is a schematic structural diagram of the cold plate assembly in the present invention;

[0022] Figure 3 is a schematic diagram of the heat dissipation principle of the cold plate assembly in the present invention.

[0023] Label description: 1 - cold plate assembly, 2 - carrier board assembly, 3 - daughter card assembly, 4 - standard part screw, 5 - frame assembly, 6 - first heat spreader, 7 - second heat spreader, 8 - pressure plate part, 9 - locking bar mechanism, 10 - extractor mechanism, 11 - high-temperature solder layer, 12 - thermal grease, 13 - high-power chip of carrier board assembly, 14 - high-power chip of daughter card assembly, 15 - docking connector between carrier board and daughter card, 16 - wear-resistant and heat-conducting coating, 17 - chassis structure, 18 - air-cooled air duct on the side wall of the chassis. Detailed implementation mode

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0025] See Figures 1 to 3 As shown, a module structural part for air-cooled heat dissipation on the side wall of an airborne device in this embodiment includes a cold plate assembly 1, a carrier board assembly 2, a daughter card assembly 3 and several standard part screws 4. The carrier board assembly is provided with a VPX connector, which is the connector of the module to the outside. The carrier board assembly and the daughter card assembly are connected through a docking connector 15. The daughter card assembly is an optional item, which may not exist, or there may be one with a larger area, or two with smaller areas. As an example, in this embodiment, there is 1 high-power chip on each of the carrier board assembly and the daughter card assembly that needs heat dissipation, and the cold plate assembly is required to dissipate heat from these two high-power chips.

[0026] See Figure 2 As shown, the left and right sides of the cold plate assembly are used to transfer the heat of the carrier board assembly 2 and the daughter card assembly 3 to the chassis, and include a frame assembly 5, a first heat spreader 6, a second heat spreader 7, two locking bar mechanisms 9, an extractor mechanism 10 and two pressure plate parts 8, etc.

[0027] The materials of the first heat spreader and the second heat spreader are both copper alloy, the general thickness of the plate surface is 2 mm, the wall thickness on both sides does not exceed 0.5 mm, the width of the welded closed area around is not more than 2.5 mm, sintered columns are evenly distributed inside, a composite wick is filled by combining micro-nano processing technology, and nano-fluid is used as the phase change working medium. The materials of the frame assembly and the pressure plate part are aluminum alloy 6063.

[0028] The first heat pipe 6 is used to dissipate heat from the chip 13 on the carrier board assembly 2, and the second heat pipe 7 is used to dissipate heat from the chip 14 on the daughter card assembly 3. If there is no daughter card assembly 3, the second heat pipe 7 may not be required. The structural principles of the first heat pipe 6 and the second heat pipe are the same. The four sides of the first heat pipe 6 are fixed to the side of the frame assembly facing the carrier board assembly by high-temperature soldering, and the four sides of the second heat pipe 6 are fixed to the side of the frame assembly facing the daughter card assembly by high-temperature soldering. The high-temperature solder layer 11 formed between the first heat pipe 6 and the frame assembly and between the second heat pipe 7 and the daughter card assembly 3 can reduce the contact thermal resistance between the first heat pipe 6, the second heat pipe 7 and the frame assembly 5, enabling the best heat transfer.

[0029] Thermal conductive bosses are provided on the first heat pipe and the second heat pipe corresponding to the chips on the carrier board assembly and the daughter card assembly, generally in the form of rectangular block protrusions. Thermal conductive grease 12 is applied to the thermal conductive bosses. The purpose of the thermal conductive bosses is to reduce the gap between the first heat pipe and the second heat pipe and the top of the chip through the boss structure, reducing it to less than 0.1, and then applying and filling thermal conductive grease in this gap to reduce the thermal resistance.

[0030] If the first heat pipe and the second heat pipe encounter the screw holes and through holes of the carrier board assembly and the daughter card assembly, cylindrical protrusions are provided. A threaded hole for embedding a threaded sheath is provided in the center of the cylindrical protrusion to ensure the thread strength by embedding the threaded sheath. Figure 2 As an example, cylindrical protrusions are provided on the second heat pipe.

[0031] The left and right sides of the cold plate assembly are used to transfer heat to the chassis, so they need to be leveled. If the method of directly growing protrusions from the first heat pipe and the second heat pipe is used for leveling, since the material on the first heat pipe and the second heat pipe is copper alloy, and the density of copper alloy is greater than that of aluminum alloy, it will be heavier if directly grown. And in airborne equipment, the requirement for weight reduction is relatively high. Therefore, in this embodiment, a pressing plate part is used to level the left and right sides of the cold plate assembly. Figure 2 As an example, the left and right sides of the second heat pipe and the two pressing plate parts 8 are connected by high-temperature soldering.

[0032] Before the surfaces of the first heat pipe 6 and the second heat pipe 7 are welded to the frame assembly 5, electroless nickel plating treatment is first carried out. On the one hand, electroless nickel plating on the contact surface with the frame assembly 5 can ensure the reliability of soldering. On the other hand, electroless nickel plating on the non-contact surface with the frame assembly 5 can play an anti-corrosion protection role for the first heat pipe 6 and the second heat pipe 7. The welding surfaces of the frame assembly and the pressing plate parts should also be subjected to electroless nickel plating treatment before welding. At this time, the surfaces of the first heat pipe, the second heat pipe and the frame assembly, except for the contact surfaces, all have a slightly larger volume as a margin. Then, after the first heat pipe and the second heat pipe are welded to the frame assembly and the pressing plate parts are welded to the second heat pipe, a round of machining is carried out on the whole. At this time, the machining will take the surface of the heat conduction boss on the heat pipe as the reference surface to machine other surfaces on the cold plate assembly. The purpose of doing this is to provide the tolerance accuracy of the relative dimensions between each surface, and at the same time enable the joints between different parts to have a smooth and beautiful transition. Since the machining at this time will damage the nickel layers on other surfaces except the contact surfaces during the first electroless nickel plating, it is necessary to carry out a second electroless nickel plating treatment on the non-contact surfaces of the first and second heat pipes to play an anti-corrosion protection role for the first heat pipe 6 and the second heat pipe 7, and carry out a golden conductive oxidation treatment on the surfaces of the non-welding surfaces of the frame assembly and the pressing plate parts. The conductive oxidation treatment plays a certain protection role for the aluminum alloy parts and at the same time can play a better role in contact conduction.

[0033] The locking bar mechanism 9 is a fixing device, which consists of several trapezoidal blocks. By rotating the screw head feature on it with a screwdriver, a force perpendicular to the installation surface of the locking bar can be applied, so as to firmly press the whole module in the chassis slot. Of course, at this time, the other side of the locking bar is also pressed in the chassis slot.

[0034] The extractor mechanism 10 is used for assisting extraction. Generally, the module is inserted into the chassis, and the VPX connectors on the carrier board assembly are inserted into the VPX connectors in the chassis. It can be inserted smoothly when inserting, but it is not very convenient to pull out the module. Therefore, an assisting extraction mechanism is needed to pull out the module through the lever principle.

[0035] The locking bar mechanism 9 and the extractor mechanism 10 are fixed to the frame assembly 5 by conventional fixing methods such as standard screws. Threaded steel sleeves should be embedded in the threaded hole features on the frame assembly to increase the thread strength.

[0036] Wear-resistant and heat-conducting coatings 16 are plated on the planes where both sides of the cold plate assembly contact the chassis to reduce the contact thermal resistance between the module and the chassis structural parts.

[0037] See Figure 3According to the working principle shown, when the high-power chips on the carrier board assembly and the daughter card assembly are working, the heat is conducted to the heat-conducting protrusions on the first heat pipe and the second heat pipe through thermal grease respectively. Then, on the one hand, a small part of the heat is conducted to the aluminum alloy frame assembly through the high-temperature solder layer, and on the other hand, most of the heat is quickly transferred to both sides through the phase change heat transfer principle of the heat pipe. Finally, it is conducted to the chassis structure 17 through the wear-resistant heat-conducting coatings on both sides of the cold plate assembly, and finally convectively exchanges heat to the air through the air-cooling ducts 18 on the side walls of the chassis.

[0038] It can be understood that for those of ordinary skill in the art, equivalent substitutions or changes can be made according to the technical solutions and inventive concepts of the present invention, and all such changes or substitutions should fall within the protection scope of the appended claims of the present invention.

Claims

1. An airborne sidewall air-cooled heat dissipation module structure, comprising a cold plate assembly and a carrier plate assembly, which transfers the heat of the carrier plate assembly to the sidewall of the chassis through the left and right sides of the cold plate assembly for air-cooled heat dissipation, characterized in that The cold plate assembly includes a frame assembly and a first heat pipe; The materials of the first heat pipe are all copper alloy, with sintered columns evenly distributed inside, a composite wick is filled by combining micro-nano processing technology, and nanofluid is used as the phase change working medium; the material of the frame assembly is aluminum alloy 6063; The first heat pipe is used to transfer the heat of the chips on the carrier plate assembly to the left and right sides. The four sides of the first heat pipe are fixed on the side of the frame assembly facing the carrier plate assembly by high-temperature soldering. Heat conduction bosses are arranged on the first heat pipe corresponding to the chips on the carrier plate assembly, and heat conduction silicone grease is brushed on the heat conduction bosses; Wear-resistant heat conduction coatings are plated on the planes where both sides of the combined cold plate assembly contact the side wall of the chassis.

2. The modular structural member for air-cooled heat dissipation on the side wall of an airborne device according to claim 1, characterized in that If the first heat pipe will encounter the screw hole through holes of the carrier plate assembly, then cylindrical protrusions are provided, and threaded holes for embedding thread sleeves are opened in the centers of the cylindrical protrusions.

3. The modular structural member for air-cooled heat dissipation on the airborne sidewall according to claim 1, characterized in that If the left and right sides of the cold plate assembly need to be leveled, it is achieved through pressing plate parts. The left and right sides of the first heat pipe and the two pressing plate parts are connected by high-temperature soldering. The material of the pressing plate parts is aluminum alloy 6063.

4. The modular structural member for air-cooled heat dissipation on the airborne sidewall according to claim 3, characterized in that The first heat pipe is first chemically nickel-plated before being welded to the frame assembly, and the welding surfaces of the frame assembly and the pressing plate parts are also chemically nickel-plated before welding. Then, after the first heat pipe is welded to the frame assembly and the pressing plate parts are welded to the first heat pipe, a round of machining is carried out on the whole. At this time, the machining will take the surface of the heat conduction boss on the first heat pipe as the reference surface to make the joints between different parts transition smoothly and beautifully. Finally, the non-contact surface of the first heat pipe is chemically nickel-plated for the second time, and the non-welded surfaces of the frame assembly and the pressing plate parts are subjected to golden conductive oxidation treatment.

5. A modular structural member for air-cooled heat dissipation on the side wall of an aircraft, characterized in that, according to any one of claims 1 to 4 It also includes a daughter card assembly. The cold plate assembly also includes a second heat pipe. The second heat pipe is used to transfer the heat of the chips on the daughter card assembly to the left and right sides. The structural principle of the second heat pipe is the same as that of the first heat pipe.

6. The modular structural member for air-cooled heat dissipation on the airborne sidewall according to claim 1, characterized in that It also includes a locking bar mechanism and a puller mechanism. The locking bar mechanism and the puller mechanism are fixed to the frame assembly by standard parts screws.

7. The modular structural member for air-cooled heat dissipation on the airborne sidewall according to claim 6, wherein Threaded steel sleeves should be embedded in the threaded hole features on the frame assembly.

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