Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, a part of the second electrode is insulated from the first isolation part on at least one side in the isolation opening through the insulating layer, and a part of the second electrode is electrically connected with the first isolation part on at least one side in the remaining sides in the isolation opening, so that the second electrode is electrically connected with the first isolation part on one side insulated from the first isolation part through the insulating layer. Even if the light-emitting material layer is in contact with the first isolation part on the side, the light-emitting material layer on the side cannot be connected with the isolation structure to form an electric leakage path, so that it can be ensured that the light-emitting efficiency of the light-emitting device cannot be reduced due to electric leakage, and under the condition of the same light-emitting brightness, the power consumption of the display panel can be reduced, and the service life of the display panel can be prolonged.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and more particularly, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered as the next generation display technology after liquid crystal display technology. It has been widely used in various consumer electronic products such as smart phones, TVs, laptop computers, desktop computers, vehicle-mounted displays, and wearable devices due to its excellent color and picture quality, and has become the mainstream technology in display panels. In the process of manufacturing traditional display panels, the light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of traditional OLED processes on the display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN 118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A record the relevant content of the fine metal maskless technology for reference.

[0003] However, the process performance of current OLED display products still needs to be further improved. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for manufacturing the display panel, and an electronic device.

[0005] In a first aspect of the present application, a display panel is provided, the display panel comprising:

[0006] a substrate;

[0007] an isolation structure, located on the substrate and enclosing an isolation opening on the substrate, the isolation structure comprising a first isolation portion and a second isolation portion stacked in sequence in a direction away from the substrate;

[0008] a light-emitting device, at least partially located in the isolation opening, in a direction away from the substrate, the light-emitting device comprising a first electrode, a light-emitting material layer, and a second electrode;

[0009] An insulating layer covers the protruding portion where a part of the first isolation portion protrudes relative to the second isolation portion. A part of the second electrode is insulated from the first isolation portion on at least one side of the isolation opening through the insulating layer, and a part of the second electrode is electrically connected to the first isolation portion on at least one side of the remaining side of the isolation opening.

[0010] In a possible implementation manner of the present application, the insulating layer includes a first insulating portion and a second insulating portion that are connected to each other;

[0011] The first insulating portion is located between the first isolation portion and the second isolation portion, and the second insulating portion covers at least a part of the protruding portion where the first isolation portion protrudes relative to the second isolation portion;

[0012] The second insulating portion covers a side of the protruding portion facing away from the substrate, and the second insulating portion also covers a side of the protruding portion facing the light-emitting device;

[0013] Preferably, the orthographic projection of the first insulating portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, and at least a part of the side of the first isolation portion facing away from the substrate is attached to the side of the second isolation portion facing the substrate.

[0014] In a possible implementation manner of the present application, the orthographic projection of the light-emitting material layer on the substrate partially overlaps with the orthographic projection of the protruding portion on the substrate;

[0015] Preferably, the contour line of the orthographic projection of the light-emitting material layer on the substrate is located within the orthographic projection of the protruding portion on the substrate;

[0016] Preferably, the light-emitting material layer covers at least a part of the second insulating portion;

[0017] Preferably, a part of the light-emitting material layer is located on the side of the insulating layer facing away from the substrate and covers a part of the second insulating portion.

[0018] In a possible implementation manner of the present application, within one isolation opening, the isolation opening includes opposite first and second sides. The insulating layer covers at least the first isolation portion located on the second side, and the second electrode is electrically connected to at least the isolation structure on the first side;

[0019] Preferably, on the first side of the isolation opening, the light-emitting material layer is spaced apart from the first isolation portion;

[0020] On the second side of the isolation opening, the light-emitting material layer is in contact with the insulating layer.

[0021] In a possible implementation manner of the present application, on the second side of the isolation opening, the orthographic projection contour line of the second electrode on the substrate is located within the orthographic projection of the light-emitting material layer on the substrate, and the orthographic projection of the light-emitting material layer on the substrate is located outside the orthographic projection of the second isolation portion on the substrate;

[0022] Preferably, on the second side of the isolation opening, the orthographic projection of the second electrode on the substrate is located outside the orthographic projection of the first isolation portion on the substrate;

[0023] Preferably, on the first side of the isolation opening, the orthographic projection contour line of the light-emitting material layer on the substrate is located within the orthographic projection of the second electrode on the substrate, and the orthographic projection of the light-emitting material layer on the substrate is located outside the orthographic projection of the first isolation portion on the substrate;

[0024] Preferably, on the first side of the isolation opening, the second electrode is also electrically connected to the second isolation portion.

[0025] In a possible implementation manner of the present application, the isolation opening further includes a third side and a fourth side that are oppositely arranged, and the isolation opening is formed by sequentially connecting and enclosing the first side, the third side, the second side, and the fourth side, and the insulating layer further covers at least a part of the first isolation portion located on the third side or the fourth side of the isolation opening.

[0026] In a possible implementation manner of the present application, within one isolation opening, the isolation opening includes an opposite first side and a second side, the orthographic projection of the light-emitting material layer on the substrate is located within the orthographic projection range of the second electrode on the substrate, the second electrode is in contact with the first isolation portion and the second isolation portion located on the first side of the isolation opening, and the second electrode is also in contact with the second isolation portion located on the second side of the isolation opening.

[0027] In a possible implementation manner of the present application, the light-emitting material layer includes a hole injection layer and a hole transport layer, and the hole injection layer and the hole transport layer are insulated from the isolation structure.

[0028] In a possible implementation manner of the present application, the display panel further includes a pixel defining layer, the pixel defining layer is located on the side of the isolation structure facing the substrate, and the isolation structure is located on the side of the pixel defining layer away from the substrate;

[0029] The pixel defining layer includes a pixel opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate, and at least part of the light-emitting device is located within the pixel opening;

[0030] Preferably, the pixel defining layer is an inorganic pixel defining layer;

[0031] Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride;

[0032] Preferably, a part of the insulating layer contacts with a side of the pixel defining layer away from the substrate, and a positive projection of the insulating layer on the substrate is located within a positive projection of the pixel defining layer on the substrate.

[0033] In a possible implementation manner of the present application, the insulating layer further includes a third insulating portion connected to the second insulating portion, and the third insulating portion is located on a side of the pixel defining layer away from the substrate;

[0034] Preferably, the material of the insulating layer includes an inorganic material;

[0035] Preferably, the insulating layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride.

[0036] In a possible implementation manner of the present application, the second isolation portion includes a support portion and a top portion stacked in a direction away from the substrate, and a positive projection of the support portion on the substrate is located within a positive projection of the top portion on the substrate;

[0037] In a cross-section perpendicular to the plane where the substrate is located and passing through the geometric centers of two adjacent isolation openings, the shape of the support portion is trapezoidal, and a top surface of the support portion on a side away from the substrate is located within a positive projection of a bottom surface of the support portion on a side close to the substrate on the substrate;

[0038] Preferably, a part of the insulating layer is located between the support portion and the first isolation portion;

[0039] Preferably, a positive projection of the insulating layer on the substrate is located outside a positive projection of the top surface of the support portion on the substrate;

[0040] Preferably, the material of the first isolation portion includes molybdenum or titanium, the material of the support portion includes aluminum, silver or copper, and the material of the top portion includes titanium or molybdenum;

[0041] Preferably, the material of the first isolation portion includes molybdenum, the material of the support portion includes silver, and the material of the top portion includes titanium.

[0042] In a second aspect of the present application, there is also provided a method for manufacturing a display panel, the method including:

[0043] Providing a substrate;

[0044] An isolation structure composed of a first isolation portion and a second isolation portion stacked in sequence and an isolation opening surrounded by the isolation structure are fabricated on the substrate, and an insulating layer that at least partially covers the protruding portion of the first isolation portion protruding relative to the second isolation portion is fabricated on one side of the isolation opening;

[0045] A light-emitting device is fabricated in the isolation opening. Wherein, in a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode. Part of the second electrode is insulated from the first isolation portion on at least one side in the isolation opening through the insulating layer, and part of the second electrode is electrically connected to the first isolation portion on at least one side of the remaining side in the isolation opening.

[0046] In a possible implementation manner of the present application, the step of fabricating an isolation structure composed of a first isolation portion and a second isolation portion stacked in sequence and an isolation opening surrounded by the isolation structure on the substrate, and fabricating an insulating layer that at least partially covers the protruding portion of the first isolation portion protruding relative to the second isolation portion on one side of the isolation opening includes:

[0047] A first isolation material layer is fabricated on the substrate, and the first isolation material layer is patterned to form a first opening exposing part of the substrate, thereby obtaining the first isolation portion;

[0048] An insulating material layer is fabricated on the first isolation portion and the substrate, and the insulating material layer is patterned to obtain an insulating layer that at least partially covers the first isolation portion;

[0049] A second isolation material layer and a third isolation material layer are sequentially fabricated on the first isolation portion, the insulating layer, and the substrate, and the second isolation material layer and the third isolation material layer are patterned to remove the second isolation material layer and the third isolation material layer at the position of the first opening, thereby obtaining the isolation opening and the isolation structure. Wherein, the patterned second isolation material layer and third isolation material layer form the second isolation portion.

[0050] In a possible implementation manner of the present application, the step of fabricating an insulating material layer on the first isolation portion and the substrate, and patterning the insulating material layer to obtain an insulating layer that at least partially covers the first isolation portion includes:

[0051] An insulating material layer is fabricated on the first isolation portion and the substrate;

[0052] Part of the insulating material layer located on the first isolation portion and part of the insulating material layer located in the first opening are etched away to form an insulating layer extending from a partial surface of the first isolation portion to the first opening.

[0053] In a possible implementation manner of the present application, before the step of fabricating an isolation structure composed of a first isolation portion and a second isolation portion stacked in sequence and an isolation opening formed by enclosing the isolation structure on the substrate, and fabricating an insulating layer covering at least the protruding portion of the first isolation portion protruding relative to the second isolation portion on one side of the isolation opening, the method further includes:

[0054] Fabricating a pixel defining layer on the substrate;

[0055] Before the step of fabricating a light-emitting device in the isolation opening, the method further includes:

[0056] Etching the pixel defining layer exposed in the isolation opening to form a pixel opening, wherein the isolation opening and the pixel opening are in communication.

[0057] In a possible implementation manner of the present application, in one of the isolation openings, the isolation opening includes opposite first and second sides, and the step of fabricating a light-emitting device in the isolation opening includes:

[0058] Controlling the evaporation parameters of the light-emitting material layer to form a film by evaporation of the light-emitting material layer near the second side in the corresponding isolation opening;

[0059] Controlling the evaporation parameters of the second electrode to form a film by evaporation of the second electrode near the first side in the corresponding isolation opening.

[0060] In a third aspect of the present application, there is also provided an electronic device, and the electronic device includes a display panel in any one of the possible implementation manners in the first aspect or a display panel prepared in any one of the possible implementation manners in the second aspect. Description of the Drawings

[0061] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0062] Figure 1 Illustrates the positional relationship diagram between the isolation structure and the isolation opening in this embodiment;

[0063] Figure 2 Illustrates Figure 1 One of the cross-sectional schematic diagrams at the AA position in

[0064] Figure 3 Illustrates Figure 1The second cross-sectional schematic diagram at the AA position;

[0065] Figure 4 Illustrates Figure 1 The third cross-sectional schematic diagram at the AA position;

[0066] Figure 5 Illustrates the schematic diagram of the projection relationship of the light-emitting material layer, the second electrode, and the first isolation part on the second side;

[0067] Figure 6 Illustrates the schematic diagram of the projection relationship of the light-emitting material layer, the second electrode, and the first isolation part on the first side;

[0068] Figure 7 Illustrates Figure 1 The fourth cross-sectional schematic diagram at the AA position;

[0069] Figure 8 Illustrates Figure 1 The fifth cross-sectional schematic diagram at the AA position;

[0070] Figure 9 Illustrates Figure 1 The sixth cross-sectional schematic diagram at the AA position;

[0071] Figure 10 Illustrates Figure 1 The seventh cross-sectional schematic diagram at the AA position;

[0072] Figure 11 Illustrates the flow schematic diagram of the manufacturing method of the display panel provided in this embodiment;

[0073] Figure 12 Is Figure 11 The corresponding process chart;

[0074] Figure 13 Illustrates the implementation of Figure 11 The flow schematic diagram of step S12;

[0075] Figure 14a And Figure 14b Is Figure 13 The corresponding process chart;

[0076] Figure 15 Illustrates one of the partial process charts of this embodiment;

[0077] Figure 16 Illustrates another partial process chart of this embodiment;

[0078] Figure 17 Illustrates the evaporation process chart of the light-emitting material layer and the second electrode.

[0079] Icon: 1 - display panel; 11 - substrate; 12 - isolation structure; 1201 - isolation opening; 1201a - first side; 1201b - second side; 1201c - third side; 1201d - fourth side; 121 - first isolation part; 1211 - protruding part; 122 - second isolation part; 1221 - supporting part; 1222 - top; 13 - light-emitting device; 131 - first electrode; 132 - light-emitting material layer; 133 - second electrode; 14 - insulating layer; 141 - first insulating part; 142 - second insulating part; 143 - third insulating part; 15 - pixel defining layer; 1501 - pixel opening; 161 - first encapsulation layer; 1611 - encapsulation unit; 162 - second encapsulation layer; 163 - third encapsulation layer; 21 - first isolation material layer; 211 - first opening; 22 - second isolation material layer; 23 - third isolation material layer; 30 - insulating material layer; 40 - pixel defining material layer. Detailed implementation manners

[0080] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. The components of the embodiments of the present application described and illustrated herein generally may be arranged and designed in a variety of different configurations.

[0081] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0082] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0083] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship in which the inventive product is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0084] It should be noted that, without conflict, different features in the embodiments of the present application may be combined with each other.

[0085] Improving the density of light-emitting devices (i.e., pixel density) in a display panel is an important way to improve the display effect. However, currently, the display panel fabricated by the Fine Metal Mask (FMM) technology is limited by the technology and cannot further increase the density of light-emitting devices. After long-term research, the inventors found that, in order to solve the technical problem that the density of light-emitting devices cannot be further increased, an isolation structure is provided in some display panels. When the light-emitting material layer and the cathode are deposited in one layer, the light-emitting material layer and the cathode can be disconnected at the position of the isolation structure. Different color light-emitting devices, that is, light-emitting device patterning, can be formed in different isolation openings through multiple deposition and multiple etching processes.

[0086] In the above display panel, there is a problem that the luminous efficiency of the light-emitting device is not high. In order to solve the above-mentioned technical problems, the inventors have innovatively designed the following technical solutions. The specific implementation solutions of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the above prior art solutions are all the results obtained by the inventors after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed by the present embodiment for the above problems should be the contributions made by the inventors to the present application during the invention and creation process, rather than being understood as the technical content well-known to those skilled in the art.

[0087] Please refer to Figure 1 and Figure 2 , Figure 1 which illustrate the positional relationship diagram between the isolation structure and the isolation opening. Figure 2 Illustrate Figure 1 The cross-sectional schematic diagram at the AA position in. In this embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting device 13, and an insulating layer 14. The substrate 11 is a multi-layer structure, and the substrate 11 at least includes a plurality of conductive layers and an interlayer insulating layer located between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device 13 is formed in the substrate 11. Among them, the conductive layer can be a metal conductive layer.

[0088] The isolation structure 12 is located on one side of the substrate 11. The isolation structure 12 encloses a plurality of isolation openings 1201 on the substrate 11. The isolation openings 1201 can be used to accommodate the light-emitting devices 13, wherein at least a part of the light-emitting devices 13 is located within the isolation openings 1201. In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 which are stacked. The isolation structure 12 forms an undercut structure, and through this undercut structure, the light-emitting device layers (such as the light-emitting material layer and the electrode layer) deposited over the entire surface can be disconnected at this position, so as to independently form the film layers of the light-emitting devices in different isolation openings 1201.

[0089] At least a part of the light-emitting devices 13 is disposed within the isolation openings 1201, and the light-emitting devices 13 and the isolation openings 1201 are in one-to-one correspondence, and one light-emitting device 13 is disposed in one isolation opening 1201. The display panel 1 includes light-emitting devices 13 of multiple different light-emitting colors. Exemplarily, the display panel 1 includes red light-emitting devices, blue light-emitting devices, and green light-emitting devices. Among them, adjacent red light-emitting devices, blue light-emitting devices, and green light-emitting devices can form a pixel unit. By controlling the light-emitting brightness of the red light-emitting devices, blue light-emitting devices, and green light-emitting devices in each pixel unit, the display brightness and color of each pixel unit can be controlled, and thus the display of the picture on the display panel 1 can be realized.

[0090] Specifically, in the direction away from the substrate 11, the light-emitting device 13 includes a first electrode 131, a light-emitting material layer 132, and a second electrode 133 which are sequentially stacked. Among them, the first electrode 131 can be the anode of the light-emitting device 13, and the second electrode 133 can be the cathode of the light-emitting device 13.

[0091] The insulating layer 14 covers the protruding portion 1211 of the first isolation portion 121 protruding relative to the second isolation portion 122. A part of the second electrode 133 is insulated from the first isolation portion 121 of at least one of the isolation openings 1201 through the insulating layer 14, and a part of the second electrode 133 is electrically connected to the first isolation portion 121 of at least one side of the remaining sides of the isolation openings 1201.

[0092] Exemplarily, please refer to Figure 2 , in a cross-section perpendicular to the plane where the substrate 11 is located and passing through the center connection line of two adjacent isolation openings 1201, the isolation opening 1201 includes an opposite first side 1201a (the right side of the isolation opening 1201 in the figure) and a second side 1201b (the left side of the isolation opening 1201 in the figure). The second electrode 133 is insulated from the first isolation portion 121 of the second side 1201b through the insulating layer 14, and the second electrode 133 is electrically connected to the isolation structure 12 of the first side 1201a.

[0093] The inventor found that an important reason for the reduction in the luminous efficiency of the light-emitting device 13 is the leakage of the first electrode 131 of the light-emitting device 13, which causes the voltage between the first electrode 131 and the second electrode 133 to drop. The main reason for the leakage of the first electrode 131 is that the light-emitting material layer 132 is connected to the isolation structure 12, and the first electrode 131 forms a leakage path through the light-emitting material layer 132 and the isolation structure 12. In the above solution provided in this embodiment, part of the second electrode 133 is insulated from the first isolation part 121 on at least one side in the isolation opening 1201 through the insulating layer 14, and part of the second electrode 133 is electrically connected to the first isolation part 121 on at least one side of the remaining side in the isolation opening 1201. In this way, on the side where the second electrode 133 is insulated from the first isolation part 121 through the insulating layer 14, even if the light-emitting material layer 132 contacts the first isolation part 121 on this side, the light-emitting material layer 132 on this side will not be connected to the isolation structure 12 to form a leakage path. In this way, it can be ensured that the light-emitting efficiency of the light-emitting device 13 will not be reduced due to leakage. Under the condition of the same luminous brightness, the power consumption of the display panel 1 can be reduced, and the service life of the display panel 1 can be extended.

[0094] Further, please refer to Figure 3 , the insulating layer 14 includes a first insulating part 141 and a second insulating part 142 that are connected to each other. Among them, the first insulating part 141 and the second insulating part 142 are arranged in the same layer, that is, both of them can be obtained by the same manufacturing process. The first insulating part 141 is located between the first isolation part 121 and the second isolation part 122. The second insulating part 142 covers at least a part of the protruding part 1211 of the first isolation part 121 protruding relative to the second isolation part 122.

[0095] The second insulating part 142 covers a part of the side surface of the protruding part 1211 facing away from the substrate 11, and the second insulating part 142 also covers a part of the side surface of the protruding part 1211 facing the light-emitting device 13.

[0096] Optionally, the orthographic projection of the first insulating part 141 on the substrate 11 is located within the orthographic projection of the second isolation part 122 on the substrate 11, and at least a part of the side surface of the first isolation part 121 facing away from the substrate 11 is attached to the side surface of the second isolation part 122 facing the substrate 11.

[0097] Exemplarily, in this embodiment, the second insulating part 142 completely covers the protruding part 1211 of the first isolation part 121 protruding relative to the second isolation part 122, and the orthographic projection of the protruding part 1211 on the substrate 11 is located within the orthographic projection of the second insulating part 142 on the substrate 11.

[0098] Further, please refer to Figure 4, in this embodiment, the display panel 1 further includes a pixel definition layer 15. The pixel definition layer 15 is located on the side of the isolation structure 12 facing the substrate 11, and the isolation structure 12 is located on the side of the pixel definition layer 15 away from the substrate 11. The pixel definition layer 15 includes a plurality of pixel openings 1501, and at least part of the first electrode 131 is exposed from the position of the pixel openings 1501. In this embodiment, the pixel definition layer 15 can be an organic pixel definition layer or an inorganic pixel definition layer. Preferably, the pixel definition layer 15 is an inorganic pixel definition layer. When the pixel definition layer 15 is an inorganic pixel definition layer, the pixel definition layer 15 can be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed by alternating silicon oxide and silicon nitride.

[0099] In this embodiment, the pixel opening 1501 communicates with the corresponding isolation opening 1201. Exemplarily, the orthographic projection of the pixel opening 1501 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11. At least part of the light-emitting device 13 is located within the corresponding pixel opening 1501.

[0100] In this embodiment, part of the insulating layer 14 is in contact with the side of the pixel definition layer 15 away from the substrate 11. Specifically, as Figure 4 shown, part of the second insulating portion 142 is in contact with the side of the pixel definition layer 15 away from the substrate 11. The orthographic projection of the insulating layer 14 on the substrate 11 is located within the orthographic projection of the pixel definition layer 15 on the substrate 11.

[0101] In this embodiment, the material of the insulating layer 14 includes an inorganic material, that is, the insulating layer 14 is an inorganic insulating layer. Among them, the insulating layer 14 can be a single-layer inorganic insulating structure or a multi-layer inorganic insulating structure. When the insulating layer 14 is a single-layer inorganic insulating structure, the insulating layer 14 can be a single-layer structure of silicon oxide or silicon nitride; when the insulating layer 14 is a multi-layer inorganic insulating structure, the insulating layer 14 can be a stacked structure formed by alternating silicon oxide and silicon nitride.

[0102] In this embodiment, please refer to Figure 4 and Figure 5 , within one isolation opening 1201, the isolation opening 1201 includes an opposite first side 1201a and a second side 1201b. The insulating layer 14 at least covers the first isolation portion 121 located on the second side 1201b, and the second electrode 133 is at least electrically connected to the isolation structure 12 on the first side 1201a.

[0103] Exemplarily, on the first side 1201a of the isolation opening 1201, the light-emitting material layer 132 is spaced apart from the first isolation portion 121. That is, on the first side 1201a, the light-emitting material layer 132 is not in contact with the first isolation portion 121.

[0104] On the second side 1201b of the isolation opening 1201, the light-emitting material layer 132 is in contact with the insulating layer 14.

[0105] In this embodiment, please refer to Figure 4 again. The orthographic projection of the insulating layer 14 on the substrate 11 may be located within the orthographic projection of the first electrode 131 on the substrate 11. Exemplarily, the edge of the first insulating portion 141 away from the second insulating portion 142 is flush with one edge of the first electrode 131. In this way, the height of the insulating layer 14 can be lifted by the first electrode 131, thereby increasing the difficulty of covering the light-emitting material layer 132.

[0106] Exemplarily, the orthographic projection of the light-emitting material layer 132 on the substrate 11 ( Figure 5 the rectangular area enclosed by b2, b5, b10, and b7 in Figure 5 ) partially overlaps with the orthographic projection of the protruding portion 1211 (

[0107] the rectangular area enclosed by b1, b3, b8, and b6 in

[0108] ) on the substrate 11. Specifically, the contour line b2b7 of the orthographic projection of the light-emitting material layer 132 on the substrate 11 is located within the orthographic projection of the protruding portion 1211 on the substrate 11. With such a design, the light-emitting material layer 132 originally overlapping with the protruding portion 1211 can be separated from the protruding portion 1211 by the insulating layer 14, avoiding the formation of a leakage path due to the overlap of the light-emitting material layer 132 and the protruding portion 1211. Figure 4 and Figure 5 . On the second side 1201b of the isolation opening 1201, the contour line b4b9 of the orthographic projection of the second electrode 133 on the substrate 11 is located within the orthographic projection of the light-emitting material layer 132 on the substrate 11 ( Figure 5 the rectangular area enclosed by b2, b5, b10, and b7 in Figure 5 ), and the orthographic projection of the light-emitting material layer 132 on the substrate 11 is located outside the orthographic projection of the second isolation portion 122 on the substrate 11 ( Figure 5 the rectangular area enclosed by b1, b2, b7, and b6 in Figure 5outside the rectangular area enclosed by b1, b3, b8 and b6 in the figure).

[0109] Please refer to Figure 4 and Figure 6 In the first side 1201a of the isolation opening 1201, the orthographic projection contour line a4a9 of the light-emitting material layer 132 on the substrate 11 is located within the orthographic projection of the second electrode 133 on the substrate 11 ( Figure 6 within the rectangular area enclosed by a2, a5, a10 and a7 in the figure), and the orthographic projection of the light-emitting material layer 132 on the substrate 11 ( Figure 6 within the rectangular area enclosed by a4, a5, a10 and a9 in the figure) is located outside the orthographic projection of the first isolation portion 121 on the substrate 11 ( Figure 6 within the rectangular area enclosed by a1, a3, a8 and a6 in the figure). That is, on the first side 1201a of the isolation opening 1201, the second electrode 133 extends relative to the light-emitting material layer 132. Optionally, on the first side 1201a of the isolation opening 1201, the second electrode 133 is also electrically connected to the second isolation portion 122.

[0110] Exemplarily, please refer to Figure 1 again. The isolation opening 1201 further includes a third side 1201c and a fourth side 1201d that are oppositely arranged. The isolation opening 1201 is formed by sequentially connecting and enclosing the first side 1201a, the third side 1201c, the second side 1201b, and the fourth side 1201d. The insulating layer 14 further covers at least a part of the first isolation portion 121 located on the third side 1201c or the fourth side 1201d of the isolation opening 1201.

[0111] In this embodiment, in order to make the light-emitting material layer 132 and the second electrode 133 satisfy the above position relationship, when manufacturing the light-emitting material layer 132, the evaporation parameters of the light-emitting material layer 132 (such as evaporation angle and direction) can be adjusted so that the light-emitting material layer 132 is formed in the isolation opening 1201 close to the second side 1201b. That is, the distance between the light-emitting material layer 132 and the second isolation portion 122 on the second side 1201b is less than the distance between the light-emitting material layer 132 and the second isolation portion 122 on the first side 1201a. When manufacturing the second electrode 133, the evaporation parameters of the second electrode 133 (such as evaporation angle and direction) can be adjusted so that the second electrode 133 is formed in the isolation opening 1201 close to the first side 1201a. That is, the distance between the second electrode 133 and the second isolation portion 122 on the second side 1201b is greater than the distance between the second electrode 133 and the second isolation portion 122 on the first side 1201a.

[0112] In a possible implementation manner of this embodiment, on the first side 1201a of the isolation opening 1201, the second electrode 133 is further electrically connected to the second isolation portion 122. Specifically, the second electrode 133 and the second isolation portion 122 are electrically connected by overlapping. In this case, the distance between the second electrode 133 and the second isolation portion 122 is 0.

[0113] In the above embodiment, the second electrode 133 is only connected to the first isolation portion 121 on the first side 1201a. In other embodiments, the second electrode 133 can be connected to the first isolation portions 121 on both the first side 1201a and the second side 1201b. Please refer to Figure 7 , in this case, the orthographic projection of the light-emitting material layer 132 on the substrate 11 is within the orthographic projection range of the second electrode 133 on the substrate 11. The second electrode 133 contacts the first isolation portion 121 and the second isolation portion 122 located on the first side 1201a of the isolation opening 1201, and the second electrode 133 also contacts the second isolation portion 122 located on the second side 1201b of the isolation opening 1201.

[0114] In this embodiment, the main reason for the formation of a leakage path after the light-emitting material layer 132 and the isolation structure 12 are connected is that the film layer with high conductivity in the light-emitting material layer 132 is connected to the isolation structure 12. The film layer with high conductivity in the light-emitting material layer 132 includes a hole injection layer and a hole transport layer. In this embodiment, the insulation between the light-emitting material layer 132 and the isolation structure 12 means that at least the film layer with high conductivity in the light-emitting material layer 132 and the isolation structure 12 are insulated, that is, the hole injection layer, the hole transport layer and the isolation structure 12 are insulated.

[0115] Further, please refer to Figure 8 , the insulating layer 14 further includes a third insulating portion 143 connected to the second insulating portion 142, where the third insulating portion 143 is located on the side of the pixel defining layer 15 away from the substrate 11. Such a design can increase the adhesion between the isolation structure 12 and the pixel defining layer 15 through the insulating layer 14 and improve the structural stability between the two.

[0116] In this embodiment, please refer to Figure 4 again, the second isolation portion 122 includes a support portion 1221 and a top portion 1222 stacked in the direction away from the substrate 11, and the orthographic projection of the support portion 1221 on the substrate 11 is within the orthographic projection of the top portion 1222 on the substrate 11.

[0117] In a cross-section perpendicular to the plane where the substrate 11 is located and passing through the geometric centers of two adjacent isolation openings 1201, the shape of the support portion 1221 is trapezoidal, and the orthographic projection of the top surface of the support portion 1221 on the side away from the substrate 11 on the substrate 11 is within the orthographic projection of the bottom surface of the support portion 1221 on the side close to the substrate 11 on the substrate 11.

[0118] A partial insulating layer 14 is located between the support portion 1221 and the first isolation portion 121. Exemplarily, the orthographic projection of the insulating layer 14 on the substrate 11 is located outside the orthographic projection of the top surface of the support portion 1221 on the substrate 11. Designed in this way, the insulating layer 14 will not extend to the range of the top surface of the support portion 1221, which can ensure that the top surface of the support portion 1221 will not become uneven and have grooves due to the presence of the insulating layer 14 below it, facilitating encapsulation, and can avoid the residue of etching solution on it.

[0119] In this embodiment, the material of the first isolation portion 121 includes molybdenum or titanium; the material of the support portion 1221 includes aluminum, silver or copper; the material of the top portion 1222 includes titanium or molybdenum. Preferably, the material of the first isolation portion 121 includes molybdenum, the material of the support portion 1221 includes silver, and the material of the top portion 1222 includes titanium.

[0120] Further, please refer to Figure 9 , the display panel 1 further includes a thin film encapsulation film layer, the thin film encapsulation film layer is located on the light-emitting side of the light-emitting device 13, the thin film encapsulation film layer includes a first encapsulation layer 161, the first encapsulation layer 161 includes a plurality of encapsulation units 1611, and different encapsulation units 1611 are used to encapsulate the light-emitting devices 13 in different isolation openings 1201. The encapsulation unit 1611 extends from the surface of the light-emitting device 13 through the second isolation portion 122 to the side wall of the isolation opening 1201 away from the substrate 11, that is, the encapsulation unit 1611 will be attached to the side wall of the second isolation portion 122 facing the isolation opening 1201.

[0121] Exemplarily, two adjacent encapsulation units 1611 for encapsulating light-emitting devices 13 of different colors are disconnected on the side of the isolation structure 12 away from the substrate 11; two adjacent encapsulation units 1611 for encapsulating light-emitting devices 13 of the same color can be connected to each other on the side of the isolation structure 12 away from the substrate 11.

[0122] Further, please refer to Figure 10 , in this embodiment, the thin film encapsulation film layer further includes a second encapsulation layer 162, the second encapsulation layer 162 is located on the side of the encapsulation unit 1611 away from the substrate 11, and the second encapsulation layer 162 at least covers the encapsulation unit 1611.

[0123] The second encapsulation layer 162 has a flat surface on the side away from the substrate 11.

[0124] Further, please refer to Figure 10 again, the thin film encapsulation film layer further includes a third encapsulation layer 163, and the third encapsulation layer 163 is located on the side of the second encapsulation layer 162 away from the substrate 11.

[0125] Optionally, the first encapsulation layer 161 and the third encapsulation layer 163 are inorganic encapsulation layers, and the second encapsulation layer 162 is an organic encapsulation layer. For example, the first encapsulation layer 161 and the third encapsulation layer 163 can be formed by Chemical Vapor Deposition (CVD), and the second encapsulation layer 162 can be formed by Ink-Jet Printing (IJP).

[0126] It can be understood that the display panel 1 may further include film layers such as a touch control function layer, an optical adhesive layer, a polarizer, and a cover plate that are sequentially stacked on the side of the third encapsulation layer 163 away from the substrate 11. The above-mentioned film layers are conventional film layers of the display panel 1 and will not be elaborated here.

[0127] Based on the same inventive concept, this embodiment also provides a method for manufacturing a display panel. Please refer to Figure 11 and Figure 12 , where Figure 11 illustrates a schematic flow chart of the method for manufacturing the display panel provided in this embodiment, Figure 12 is Figure 11 the corresponding process chart. The method for manufacturing the display panel provided in this embodiment will be described in detail below with reference to Figure 11 and Figure 12 .

[0128] Step S11: Provide a substrate 11.

[0129] In this embodiment, the substrate 11 is a multi-film layer structure. The substrate 11 at least includes a plurality of conductive layers and an interlayer insulating layer located between adjacent conductive layers. A pixel driving circuit for providing a driving signal for the light-emitting device is formed in the substrate 11. Exemplarily, the conductive layer includes a metal conductive layer.

[0130] Step S12: Fabricate an isolation structure 12 composed of a first isolation portion 121 and a second isolation portion 122 stacked in sequence and an isolation opening 1201 surrounded by the isolation structure 12 on the substrate 11, and fabricate an insulating layer 14 that at least partially covers the protruding portion 1211 of the first isolation portion 121 protruding relative to the second isolation portion 122 on one side of the isolation opening 1201.

[0131] Step S13: Fabricate a light-emitting device 13 in the isolation opening 1201.

[0132] In the direction away from the substrate 11, the light-emitting device 13 includes a first electrode 131, a light-emitting material layer 132, and a second electrode 133. Part of the second electrode 133 is insulated from the first isolation portion 121 on at least one side in the isolation opening 1201 through the insulating layer 14, and part of the second electrode 133 is electrically connected to the first isolation portion 121 on at least one side of the remaining side in the isolation opening 1201.

[0133] In a possible implementation manner of this embodiment, please refer to Figure 13 , Figure 14a and Figure 14b , step S12 can be implemented in the following manner.

[0134] Step S121: Fabricate a first isolation material layer 21 on the substrate 11, and perform patterning on the first isolation material layer 21 to form a first opening 211 that exposes a part of the substrate 11, thereby obtaining a first isolation portion 121.

[0135] Step S122: Fabricate an insulating material layer 30 on the first isolation portion 121 and the substrate 11, and perform patterning on the insulating material layer 30 to obtain an insulating layer 14 that at least partially covers the first isolation portion 121.

[0136] In this embodiment, step S122 can be implemented in the following manner.

[0137] First, fabricate an insulating material layer 30 on the first isolation portion 121 and the substrate 11.

[0138] Next, etch away a part of the insulating material layer 30 located on the first isolation portion 121 and a part of the insulating material layer 30 located in the first opening 211 to form an insulating layer 14 that extends from a partial surface of the first isolation portion 121 to the first opening 211.

[0139] Step S123: Sequentially fabricate a second isolation material layer 22 and a third isolation material layer 23 on the first isolation portion 121, the insulating layer 14, and the substrate 11, and perform patterning on the second isolation material layer 22 and the third isolation material layer 23 to remove the second isolation material layer 22 and the third isolation material layer 23 at the position of the first opening 211, thereby obtaining an isolation opening 1201 and an isolation structure 12.

[0140] In this embodiment, the patterned second isolation material layer 22 and third isolation material layer 23 form a second isolation portion 122.

[0141] Further, please refer to Figure 15 , before step S12, the method provided in this embodiment further includes fabricating a pixel defining material layer 40 on the substrate 11.

[0142] Before step S13, please refer to Figure 16 , the method provided in this embodiment further includes etching the pixel defining material layer 40 exposed by the isolation opening 1201 to form a pixel opening 1501 and a pixel defining layer 15. Among them, the isolation opening 1201 and the pixel opening 1501 are communicated.

[0143] Exemplarily, within an isolation opening 1201, the isolation opening 1201 includes opposite first side 1201a and second side 1201b. Please refer to Figure 17 , step S13 can be implemented in the following manner.

[0144] First, control the evaporation parameters of the light-emitting material layer 132 so that the light-emitting material layer 132 is evaporated and formed into a film near the second side 1201b in the corresponding isolation opening 1201.

[0145] Among them, the evaporation parameters include the evaporation angle and the evaporation direction. Specifically, by adjusting the evaporation angle and / or the evaporation direction, the light-emitting material layer 132 is evaporated and formed into a film near the second side 1201b in the corresponding isolation opening 1201.

[0146] Next, control the evaporation parameters of the second electrode 133 so that the second electrode 133 is evaporated and formed into a film near the first side 1201a in the corresponding isolation opening 1201.

[0147] Specifically, by adjusting the evaporation angle and / or the evaporation direction, the second electrode 133 is evaporated and formed into a film near the first side 1201a in the corresponding isolation opening 1201.

[0148] Based on the same inventive concept, an embodiment of the present application further provides an electronic device. The electronic device includes the display panel provided by the present application, or includes a display panel prepared by the display panel manufacturing method provided by this embodiment. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with a display function.

[0149] An embodiment of the present application provides a display panel, a manufacturing method of the display panel, and an electronic device. In the display panel, part of the second electrode is insulated from the first isolation part on at least one side of the isolation opening through an insulating layer, and part of the second electrode is electrically connected to the first isolation part on at least one side of the remaining side in the isolation opening. In this way, on the side where the second electrode is insulated from the first isolation part through the insulating layer, even if the light-emitting material layer contacts the first isolation part on this side, the light-emitting material layer on this side will not be connected to the isolation structure to form a leakage path. In this way, it can be ensured that the light-emitting device will not have its light-emitting efficiency reduced due to leakage. Under the condition of the same light-emitting brightness, the power consumption of the display panel can be reduced, and the service life of the display panel can be extended.

[0150] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that, The display panel includes: a substrate; an isolation structure located on the substrate and enclosing an isolation opening on the substrate, the isolation structure including a first isolation portion and a second isolation portion stacked in sequence in a direction away from the substrate; a light-emitting device, at least partially located in the isolation opening, in a direction away from the substrate, the light-emitting device including a first electrode, a light-emitting material layer, and a second electrode; an insulating layer covering an extending portion of the first isolation portion protruding relative to the second isolation portion, and at least a part of the second electrode is insulated from at least one side of the first isolation portion in the isolation opening through the insulating layer, and at least a part of the second electrode is electrically connected to at least one side of the first isolation portion on the remaining side in the isolation opening.

2. The display panel according to claim 1, wherein The insulating layer includes a first insulating portion and a second insulating portion connected to each other; The first insulating portion is located between the first isolation portion and the second isolation portion, and the second insulating portion covers at least a part of the extending portion of the first isolation portion protruding relative to the second isolation portion; The second insulating portion covers a side surface of the extending portion facing away from the substrate, and the second insulating portion also covers a side surface of the extending portion facing the light-emitting device; Preferably, a positive projection of the first insulating portion on the substrate is located within a positive projection of the second isolation portion on the substrate, and at least a part of a side surface of the first isolation portion facing away from the substrate is in contact with a side surface of the second isolation portion facing the substrate.

3. The display panel according to claim 2, wherein A positive projection of the light-emitting material layer on the substrate partially overlaps a positive projection of the extending portion on the substrate; Preferably, a contour line of a positive projection of the light-emitting material layer on the substrate is located within a positive projection of the extending portion on the substrate; Preferably, the light-emitting material layer covers at least a part of the second insulating portion; Preferably, at least a part of the light-emitting material layer is located on a side of the insulating layer facing away from the substrate and covers at least a part of the second insulating portion.

4. The display panel according to claim 1, characterized in that, In one isolation opening, the isolation opening includes opposite first and second sides, the insulating layer covers at least the first isolation portion located on the second side, and the second electrode is electrically connected to at least the isolation structure on the first side; Preferably, on the first side of the isolation opening, the light-emitting material layer is spaced apart from the first isolation portion; On the second side of the isolation opening, the light-emitting material layer is in contact with the insulating layer.

5. The display panel according to claim 4, wherein On the second side of the isolation opening, a contour line of a positive projection of the second electrode on the substrate is located within a positive projection of the light-emitting material layer on the substrate, and a positive projection of the light-emitting material layer on the substrate is located outside a positive projection of the second isolation portion on the substrate; Preferably, on the second side of the isolation opening, a positive projection of the second electrode on the substrate is located outside a positive projection of the first isolation portion on the substrate; Preferably, on the first side of the isolation opening, a contour line of a positive projection of the light-emitting material layer on the substrate is located within a positive projection of the second electrode on the substrate, and a positive projection of the light-emitting material layer on the substrate is located outside a positive projection of the first isolation portion on the substrate; Preferably, on the first side of the isolation opening, the second electrode is also electrically connected to the second isolation portion.

6. The display panel according to claim 4, characterized in that, The isolation opening further includes a third side and a fourth side which are oppositely arranged, and the isolation opening is formed by sequentially connecting and enclosing the first side, the third side, the second side, and the fourth side. The insulating layer further covers at least a part of the first isolation portion located on the third side or the fourth side of the isolation opening.

7. The display panel according to claim 1, wherein Within one isolation opening, the isolation opening includes an opposite first side and a second side. The orthographic projection of the light-emitting material layer on the substrate is within the orthographic projection of the second electrode on the substrate. The second electrode is in contact with the first isolation portion and the second isolation portion located on the first side of the isolation opening, and the second electrode is also in contact with the second isolation portion located on the second side of the isolation opening.

8. The display panel according to claim 1, characterized in that, The light-emitting material layer includes a hole injection layer and a hole transport layer, and the hole injection layer and the hole transport layer are insulated from the isolation structure.

9. The display panel according to claim 1, wherein The display panel further includes a pixel defining layer, and the pixel defining layer is located on the side of the isolation structure facing the substrate, and the isolation structure is located on the side of the pixel defining layer away from the substrate; The pixel defining layer includes a pixel opening, and the orthographic projection of the pixel opening on the substrate is within the orthographic projection of the isolation opening on the substrate. At least a part of the light-emitting device is located within the pixel opening; Preferably, the pixel defining layer is an inorganic pixel defining layer; Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternately stacking silicon oxide and silicon nitride; Preferably, a part of the insulating layer is in contact with the side of the pixel defining layer away from the substrate, and the orthographic projection of the insulating layer on the substrate is within the orthographic projection of the pixel defining layer on the substrate.

10. The display panel according to claim 9, characterized in that, The insulating layer further includes a third insulating portion connected to the second insulating portion, and the third insulating portion is located on the side of the pixel defining layer away from the substrate; Preferably, the material of the insulating layer includes an inorganic material; Preferably, the insulating layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternately stacking silicon oxide and silicon nitride.

11. The display panel according to claim 1, characterized in that, The second isolation portion includes a support portion and a top portion which are stacked in a direction away from the substrate, and the orthographic projection of the support portion on the substrate is within the orthographic projection of the top portion on the substrate; In a cross-section perpendicular to the plane where the substrate is located and passing through the geometric centers of two adjacent isolation openings, the shape of the support portion is trapezoidal, and the orthographic projection of the top surface of the support portion on the side away from the substrate on the substrate is within the orthographic projection of the bottom surface of the support portion on the side close to the substrate on the substrate; Preferably, a part of the insulating layer is located between the support portion and the first isolation portion; Preferably, the orthographic projection of the insulating layer on the substrate is outside the orthographic projection of the top surface of the support portion on the substrate; Preferably, the material of the first isolation portion includes molybdenum or titanium, the material of the support portion includes aluminum, silver, or copper, and the material of the top portion includes titanium or molybdenum; Preferably, the material of the first isolation portion includes molybdenum, the material of the support portion includes silver, and the material of the top portion includes titanium.

12. A method for manufacturing a display panel, characterized in that, The method includes: providing a substrate; fabricating an isolation structure composed of a first isolation portion and a second isolation portion stacked in sequence and an isolation opening surrounded by the isolation structure on the substrate, and fabricating an insulating layer on one side of the isolation opening that at least partially covers the protruding portion of the first isolation portion protruding from the second isolation portion; fabricating a light-emitting device in the isolation opening, wherein, in a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode, and a part of the second electrode is insulated from the first isolation portion on at least one side in the isolation opening through the insulating layer, and a part of the second electrode is electrically connected to the first isolation portion on at least one side of the remaining side in the isolation opening.

13. The manufacturing method of the display panel according to claim 12, characterized in that, The step of fabricating an isolation structure composed of a first isolation portion and a second isolation portion stacked in sequence and an isolation opening surrounded by the isolation structure on the substrate, and fabricating an insulating layer on one side of the isolation opening that at least partially covers the protruding portion of the first isolation portion protruding from the second isolation portion includes: fabricating a first isolation material layer on the substrate and patterning the first isolation material layer to form a first opening exposing a part of the substrate, thereby obtaining the first isolation portion; fabricating an insulating material layer on the first isolation portion and the substrate, and patterning the insulating material layer to obtain an insulating layer that at least partially covers the first isolation portion; sequentially fabricating a second isolation material layer and a third isolation material layer on the first isolation portion, the insulating layer, and the substrate, patterning the second isolation material layer and the third isolation material layer, and removing the second isolation material layer and the third isolation material layer at the position of the first opening to obtain an isolation opening and an isolation structure, wherein the patterned second isolation material layer and third isolation material layer form the second isolation portion.

14. The manufacturing method of the display panel according to claim 13, characterized in that, The step of fabricating an insulating material layer on the first isolation portion and the substrate, and patterning the insulating material layer to obtain an insulating layer that at least partially covers the first isolation portion includes: fabricating an insulating material layer on the first isolation portion and the substrate; etching and removing a part of the insulating material layer located on the first isolation portion and a part of the insulating material layer located in the first opening to form an insulating layer extending from a part of the surface of the first isolation portion to the first opening.

15. The manufacturing method of the display panel according to claim 13, characterized in that, In one of the isolation openings, the isolation opening includes opposite first and second sides, and the step of fabricating a light-emitting device in the isolation opening includes: controlling the evaporation parameters of the light-emitting material layer to cause the light-emitting material layer to be deposited into a film near the second side in the corresponding isolation opening; controlling the evaporation parameters of the second electrode to cause the second electrode to be deposited into a film near the first side in the corresponding isolation opening.

16. An electronic device, characterized in that, The electronic device includes the display panel described in any one of claims 1-11, or the display panel prepared by the method for preparing the display panel described in any one of claims 12-15.

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