Flash evaporation equipment and flash evaporation method

Abstract

The invention relates to flash evaporation equipment and a flash evaporation method. The flash evaporation equipment comprises a first cavity, a processing module, a driving module, a measuring module and a vacuum pumping module, the processing module is electrically connected with the driving module, the measuring module and the vacuum pumping module, and the first cavity is formed by surrounding a cavity side wall, a movable cavity top and a cavity bottom; the measuring module is used for detecting the target size of the substrate under the condition that the substrate is placed in the first cavity; the processing module is used for determining the required volume of the first cavity based on the target size to obtain a target volume; the driving module is used for driving the top of the first cavity to move towards the bottom of the cavity, so that the volume of the first cavity is a target volume; and the vacuum air extraction module is used for extracting air in the first cavity after the volume of the first cavity is the target volume so as to form a target film on the substrate. The flash evaporation method is applied to the flash evaporation equipment.

Description

Technical Field

[0001] This application relates to the technical field of device manufacturing, and particularly to a flash evaporation device and a flash evaporation method. Background Art

[0002] Perovskite thin films have become a research hotspot for new-generation photovoltaic materials due to their excellent optoelectronic properties. Currently, perovskite thin films are usually fabricated by flash evaporation process. The flash evaporation process is an efficient thin film preparation method that can partially volatilize the solvent in the wet film by rapid evacuation, thereby enabling the formation of a uniform and dense thin film in a short time.

[0003] However, existing flash evaporation devices usually adopt a cavity with a fixed volume, which is difficult to meet the process requirements of substrates with different sizes, resulting in significant differences in the flash evaporation effect and efficiency for substrates of different sizes. Obviously, this is not conducive to improving the consistency of the film-forming quality of perovskite thin films. Summary of the Invention

[0004] Based on this, it is necessary to provide a flash evaporation device and a flash evaporation method that can improve the film-forming quality of substrates with different sizes.

[0005] In a first aspect, this application provides a flash evaporation device, including a first cavity, a processing module, a driving module, a measuring module, and a vacuum pumping module; the processing module is electrically connected to the driving module, the measuring module, and the vacuum pumping module respectively, and the first cavity is surrounded by a cavity sidewall, a movable cavity top, and a cavity bottom;

[0006] The measuring module is configured to detect the target size of the substrate when the substrate is placed in the first cavity;

[0007] The processing module is configured to determine the required volume of the first cavity based on the target size to obtain a target volume;

[0008] The driving module is configured to drive the cavity top to move relative to the cavity bottom so that the volume of the first cavity is the target volume;

[0009] The vacuum pumping module is configured to extract the air inside the first cavity after it reaches the target volume to form a target thin film on the substrate.

[0010] In a second aspect, this application provides a flash evaporation method, which is applied to the flash evaporation device according to any item of the first aspect of this application, and the method includes:

[0011] Placing the substrate in the first cavity and detecting the target size of the substrate;

[0012] Determining the target volume corresponding to the target size according to the preset correspondence between the size and the volume;

[0013] Adjust the volume of the first cavity so that the volume of the first cavity is the target volume;

[0014] Extract the air inside the cavity after it reaches the target volume to form a target thin film on the substrate.

[0015] In the above flash evaporation device and flash evaporation method, the flash evaporation device includes a first cavity, a processing module, a driving module, a measurement module, and a vacuum pumping module; the processing module is electrically connected to the driving module, the measurement module, and the vacuum pumping module respectively. The first cavity is surrounded by a cavity side wall, a movable cavity top, and a cavity bottom; the measurement module is used to detect the target size of the substrate when the substrate is placed in the first cavity; the processing module is used to determine the required volume of the first cavity based on the target size to obtain the target volume; the driving module is used to drive the cavity top to move relative to the cavity bottom so that the volume of the first cavity is the target volume; the vacuum pumping module is used to extract the air inside the first cavity after it reaches the target volume to form a target thin film on the substrate. By using the flash evaporation device provided in this application, the volume of the first cavity can be dynamically adjusted according to the target size of the substrate, so that the flash evaporation device can adapt to the flash evaporation process requirements of different-sized substrates, ensuring that the solvents of different-sized substrates can volatilize evenly. At the same time, it can also make the temperature difference between the edge part and the center part of different-sized substrates smaller, thereby significantly improving the film-forming quality of different-sized substrates. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 It is a schematic structural diagram of a flash evaporation device provided by an embodiment of the present application;

[0018] Figure 2 It is a schematic structural diagram of another flash evaporation device provided by an embodiment of the present application;

[0019] Figure 3 It is a schematic structural diagram of another flash evaporation device provided by an embodiment of the present application;

[0020] Figure 4 It is a schematic structural diagram of another flash evaporation device provided by an embodiment of the present application;

[0021] Figure 5 It is a schematic structural diagram of another flash evaporation device provided by an embodiment of the present application;

[0022] Figure 6 This is a schematic flowchart of a flash evaporation method provided by an embodiment of the present application. Detailed implementation manners

[0023] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the specification of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0025] It can be understood that the terms "first", "second", etc. used in the present application can be used herein to describe various objects, but these objects are not limited by these terms. These terms are only used to distinguish the first object from another object. For example, without departing from the scope of the present application, the first cavity can be referred to as the second cavity, and similarly, the second cavity can be referred to as the first cavity. Both the first cavity and the second cavity are cavities, but they are not the same cavity.

[0026] It can be understood that in the following embodiments, "connection", if there is an electrical signal or data transmission between the connected circuits, modules, units, etc., should be understood as "electrical connection", "communication connection", etc.

[0027] It can be understood that "at least one" means one or more, and "a plurality" means two or more. "At least a part of an element" means a part or all of the element.

[0028] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprising", "including" or "having", etc. specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the related listed items.

[0029] This application is made by the inventors based on the understanding and research of the following problems:

[0030] With the rapid development of semiconductor devices, there are now more and more semiconductor devices of different sizes. Existing flash evaporation equipment usually uses a cavity with a fixed volume. For small-sized substrates, the vacuum pumping rate of a large-volume cavity is relatively low, which can lead to uneven evaporation of the solvent on the substrate surface. At the same time, during the process of pumping the large-volume cavity to vacuum, the temperature difference between the edge part and the center part of the substrate will be relatively large, which will further affect the film crystallization quality. Therefore, flash evaporating a small-sized substrate in a large-volume cavity will not only result in poor film formation quality of the small-sized substrate but also consume a large amount of energy.

[0031] Based on this, the present application provides a flash evaporation device. As Figure 1 shown, a flash evaporation device according to an embodiment includes a first cavity, a processing module 102, a driving module 104, a measuring module 106, and a vacuum pumping module 108; the processing module 102 is electrically connected to the driving module 104, the measuring module 106, and the vacuum pumping module 108 respectively, and the first cavity is surrounded by a cavity side wall 110, a movable cavity top 112, and a cavity bottom 114.

[0032] The measuring module 106 is configured to detect the target size of the substrate when the substrate is placed in the first cavity.

[0033] The processing module 102 is configured to determine the required volume of the first cavity based on the target size to obtain a target volume.

[0034] The driving module 104 is configured to drive the cavity top 112 to move relative to the cavity bottom 114 so that the volume of the first cavity is the target volume.

[0035] The vacuum pumping module 108 is configured to pump out the air inside the first cavity after it reaches the target volume to form a target film on the substrate.

[0036] Among them, a flash evaporation device refers to a device that rapidly reduces the pressure through vacuum pumping so that the solvent on the substrate surface can be rapidly evaporated or dried in a short time. The core principle of a flash evaporation device is that a liquid will undergo rapid vaporization when the pressure suddenly decreases.

[0037] Optionally, the measuring module 106 may include a laser sensor, an infrared sensor, an ultrasonic sensor, or other devices with distance measurement functions or size measurement functions. Optionally, the measuring module 106 may be located on the side surface of the cavity top 112 facing the cavity bottom 114 as Figure 1 shown, or may be located on the cavity bottom 114. It should be noted that Figure 1 the setting position of the measuring module 106 in

[0038] Optionally, the processing module 102 may be a single chip microcomputer, a programmable logic controller, a field programmable gate array or other devices with data processing capabilities.

[0039] Optionally, the vacuum pumping module 108 may include a vacuum tube, a solenoid valve, and a vacuum pump. The vacuum tube refers to a pipeline component that realizes the connection between the vacuum pump and the first cavity; the vacuum tube is used to guide the air in the first cavity to the vacuum pump. The solenoid valve refers to a valve component that controls air or flow through electromagnetic force, and is used in the flash evaporation device to achieve precise control of the air extraction amount by controlling the valve angle. The vacuum pump refers to a pump component used to extract air from the first cavity to form a vacuum state in the first cavity.

[0040] The cavity sidewall 110 refers to a vertical wall perpendicular to the cavity bottom 114 and the movable cavity top 112. The cavity sidewall 110 is used to maintain the shape and structural integrity of the first cavity, and can provide sealing performance for the first cavity to prevent gas leakage from the first cavity.

[0041] The movable chamber top 112 refers to a component that can move relative to the chamber bottom 114 to change the volume or shape of the first chamber. Since the chamber top 112 is movable, the flash evaporation device can adapt to the flash evaporation process requirements of substrates of different sizes, significantly improving the film formation quality of substrates of different sizes.

[0042] The cavity bottom 114 refers to the bottom surface of the bottom support structure of the first cavity. The cavity bottom 114 is used to place the substrate. Optionally, the substrate can be placed on a placement table, and then the placement table with the substrate placed on the cavity bottom 114 is placed in the first cavity to prevent the substrate from being contaminated during the flash evaporation process.

[0043] The space cavity surrounded by the cavity sidewall 110 , the movable cavity top 112 and the cavity bottom 114 should have sufficient sealing to ensure the flash evaporation effect of the substrate, that is, the first cavity should have sufficient sealing.

[0044] The substrate refers to a thin sheet material with a flat surface and capable of realizing a specific optoelectronic function. Since the substrate of this embodiment needs to be flash evaporated in a flash evaporation device to form a target thin film on the substrate, a solvent capable of forming the target thin film is coated on the surface of the substrate on one side close to the top 112 of the cavity.

[0045] Optionally, the target size of the substrate may be the length of a certain side of the substrate, the length of a diagonal side of the substrate, or the area of ​​the substrate.

[0046] Optionally, the driving module 104 can be used to drive the top 112 of the cavity to move towards the bottom 114 of the cavity, or to drive the top 112 of the cavity to move away from the bottom 114 of the cavity, so that the volume of the first cavity is the target volume. That is to say, the driving module 104 can be used to drive the top 112 of the cavity to move up and down in the vertical direction of the flash evaporation device relative to the ground, and by moving the top 112 of the cavity closer to or away from the bottom 114 of the cavity, the volume of the first cavity can be adjusted dynamically according to the target size of the substrate.

[0047] Optionally, the volume of the first cavity can be 5L - 15L, 5L - 20L, 5L - 25L or other volume ranges. Correspondingly, the range of the target volume is the same as the volume range of the first cavity. Exemplarily, when the volume of the first cavity is 5L - 20L, the possible range of the target volume is also 5L - 20L.

[0048] Specifically, the air inside the first cavity is extracted after it reaches the target volume, so that the solvent on the substrate volatilizes to form a target thin film on the substrate.

[0049] Specifically, in order for the processing module 102 to determine the required volume of the first cavity based on the target size to obtain the target volume, there is a corresponding relationship between the size and volume of the substrate. Based on the corresponding relationship between the size and volume of the substrate, the corresponding relationship between the target size and the target volume can be determined.

[0050] Optionally, there may be a positive correlation between the target size and the target volume. Exemplarily, when the target size represents the diagonal length of the substrate as 100 mm, the target volume can be 5L; when the target size represents the diagonal length of the substrate as 200 mm, the target volume can be 10L.

[0051] Optionally, the target volume can be determined by the target size and the solvent on the substrate. Specifically, it can be determined by the target size and the solvent system. Based on this, the processing module 102 can be used to determine the required volume of the first cavity based on the target size and the solvent on the substrate to obtain the target volume.

[0052] Optionally, the corresponding relationship between the size and volume of the substrate can be set by the user in the processing module 102 in advance. That is to say, the processing module 102 stores a preset corresponding relationship between the size and volume of the substrate.

[0053] Optionally, the processing module 102 can also be used to determine the flash evaporation parameters based on the solvent on the substrate, so that the vacuum pumping module 108 extracts the air inside the first cavity after it reaches the target volume, to form a target thin film on the substrate.

[0054] Optionally, the flash evaporation parameters include parameters related to the flash evaporation process, such as the flash evaporation cycle, flash evaporation stage, and pumping speed. Exemplarily, when the volatility of the solvent on the substrate is relatively high, the flash evaporation parameters may include two flash evaporation stages. In the first flash evaporation stage, air inside the first cavity after reaching the target volume can be pumped out at a relatively high pumping speed. In order to ensure uniform evaporation of the solvent by reducing the evaporation speed of the solvent in the later stage of the flash evaporation process, in the second flash evaporation stage, air inside the first cavity after reaching the target volume can be pumped out at a relatively low pumping speed, so as to ensure that a target thin film with high uniformity can be formed on the substrate.

[0055] Optionally, the flash evaporation parameters can be pre-set by the user in the processing module 102, that is to say, the processing module 102 stores the corresponding relationship between the solvent and the flash evaporation parameters.

[0056] Optionally, after the target thin film is formed on the substrate, that is, after one flash evaporation cycle ends, the driving module 104 can drive the top 112 of the cavity to move to the corresponding initial position of the top 112 of the cavity to wait for the flash evaporation operation of the next substrate.

[0057] In an exemplary embodiment, the target thin film is a perovskite thin film.

[0058] Among them, the perovskite thin film refers to a new type of semiconductor material thin film that can be widely used in optoelectronic devices such as solar cells, light-emitting diodes, and photodetectors.

[0059] In this embodiment, since the volume of the first cavity can be dynamically adjusted according to the target size of the substrate, the flash evaporation device can not only meet the flash evaporation process requirements of large-size substrates but also those of small-size substrates. Further, the flash evaporation device provided in this embodiment can avoid the defect that the solvent volatilizes unevenly on the surface of the substrate due to the low vacuum pumping rate during the flash evaporation of the small-size substrate in a large-volume cavity, which can not only significantly improve the film-forming effect of the small-size substrate but also reduce the energy consumption of the flash evaporation device.

[0060] Specifically, during the flash evaporation process, as air is extracted, the temperature inside the cavity will decrease. If flash evaporation is performed on a small-sized substrate in a large-volume cavity, due to the large height difference in the vertical direction between the top and the bottom of the large-volume cavity, in this case, the heat distribution uniformity in the large-volume cavity during the flash evaporation process is poor. Consequently, there will be a large temperature difference between the edge part and the central part of the substrate. In this embodiment, since during the flash evaporation of the small-sized substrate, the first cavity can be dynamically adjusted to a small-volume first cavity, thereby reducing the height difference in the vertical direction between the movable cavity top and the cavity bottom. Furthermore, during the flash evaporation process, the heat in the first cavity can have a more uniform heat distribution. Based on this, by dynamically adjusting the volume of the first cavity to optimize the temperature field, the temperature difference between the edge part and the central part of the small-sized substrate is small, further significantly improving the film-forming quality of the small-sized substrate.

[0061] Meanwhile, in this embodiment, since the volume of the first cavity can be dynamically adjusted according to the target size of the substrate, different-sized substrates can thus complete the formation of the target film in the flash evaporation equipment provided in this embodiment, overcoming the drawbacks in the prior art where the cavity volume cannot be adjusted and the substrate needs to be flash-evaporated in different flash evaporation equipment or the cavity needs to be replaced, significantly reducing the operation complexity of the flash evaporation process.

[0062] The above-mentioned flash evaporation equipment includes a first cavity, a processing module, a driving module, a measuring module, and a vacuum pumping module; the processing module is electrically connected to the driving module, the measuring module, and the vacuum pumping module respectively. The first cavity is surrounded by a cavity sidewall, a movable cavity top, and a cavity bottom; the measuring module is used to detect the target size of the substrate when the substrate is placed in the first cavity; the processing module is used to determine the required volume of the first cavity based on the target size to obtain the target volume; the driving module is used to drive the cavity top to move relative to the cavity bottom so that the volume of the first cavity is the target volume; the vacuum pumping module is used to extract the air inside the first cavity after it becomes the target volume to form a target film on the substrate. By using the flash evaporation equipment provided in this application, the volume of the first cavity can be dynamically adjusted according to the target size of the substrate, thereby enabling the flash evaporation equipment to adapt to the flash evaporation process requirements of different-sized substrates, ensuring that the solvents of different-sized substrates can volatilize uniformly. At the same time, it can also make the temperature difference between the edge part and the central part of different-sized substrates small. Furthermore, it significantly improves the film-forming quality of different-sized substrates.

[0063] In an exemplary embodiment, the flash evaporation device further includes a temperature detection module and a pressure detection module; the processing module is further connected to the temperature detection module and the pressure detection module respectively; the temperature detection module is located at the bottom of the cavity; the pressure detection module is located on the side wall of the cavity; the temperature detection module is used to detect the real-time temperature value of the first cavity; the pressure detection module is used to detect the real-time pressure value of the first cavity; the processing module is further used to adjust the real-time temperature value to make the adjusted real-time temperature value within the preset temperature range when the real-time temperature value is outside the preset temperature range; the processing module is further used to adjust the real-time pressure value to make the adjusted real-time pressure value within the preset pressure range when the real-time pressure value is outside the preset pressure range.

[0064] In this embodiment, the processing module can also be used to ensure that the real-time temperature value and the real-time pressure value in the first cavity are respectively within a suitable temperature range and a suitable pressure range, so as to ensure that the film-forming effect of the solvent on the substrate will not be overly affected by the temperature value and the pressure value.

[0065] In an exemplary embodiment, the top of the cavity is a movable baffle.

[0066] The processing module is further used to determine the moving distance of the top of the cavity based on the target volume to obtain the target distance.

[0067] The driving module is specifically used to drive the baffle to move the target distance relative to the bottom of the cavity so that the volume of the first cavity is the target volume.

[0068] Among them, the area size of the first cavity in the horizontal direction parallel to the ground is stored in the processing module. Thus, after obtaining the target volume, the processing module can determine the size of the target distance based on the target volume and the area size of the first cavity on the horizontal plane.

[0069] Optionally, the movable baffle can include a carbon fiber baffle, a metal baffle or other baffles.

[0070] Optionally, the driving module can be used to drive the baffle to move the target distance towards the bottom of the cavity, or can also be used to drive the baffle to move away from the bottom of the cavity so that the volume of the first cavity is the target volume.

[0071] Optionally, the driving module can be an electric driving module or a pneumatic driving module.

[0072] In this embodiment, the processing module determines the moving distance of the top of the cavity based on the target volume to obtain the target distance. Thus, the driving module can drive the baffle to move the target distance relative to the bottom of the cavity, so that the volume of the first cavity is the target volume. Based on this, the processing module can improve the accuracy of the volume of the first cavity after dynamic adjustment by improving the moving accuracy of the top of the cavity, and significantly improve the film forming quality of different-sized substrates.

[0073] In an exemplary embodiment, the driving module includes an electric push rod, and the electric push rod is fixedly connected to the baffle.

[0074] The driving module is specifically configured to control the electric push rod to drive the baffle to move the target distance relative to the bottom of the cavity, so that the volume of the first cavity is the target volume.

[0075] Wherein, the electric push rod is a component that can convert electrical energy into mechanical energy under the drive of an electric motor, and realize the linear motion of the push rod to drive the baffle to move the target distance relative to the bottom of the cavity.

[0076] Optionally, the driving module can be used to control the electric push rod to push the baffle to move the target distance towards the bottom of the cavity, or can be used to control the electric push rod to pull the baffle away from the bottom of the cavity to move the target distance, so that the volume of the first cavity is the target volume.

[0077] In this embodiment, the driving module includes an electric push rod. Thus, the driving module can achieve high-precision control of the moving distance of the baffle. Based on this, the driving module can ensure that the baffle can be adjusted to an accurate height position in the vertical direction. Furthermore, by improving the moving accuracy of the top of the cavity, that is, the baffle, the accuracy of the volume of the first cavity after dynamic adjustment is improved, and the film forming quality of different-sized substrates is significantly improved.

[0078] In an exemplary embodiment, the driving module includes a pneumatic component, and the pneumatic component includes a second cavity surrounded by a pneumatic side wall, a pneumatic top and a baffle.

[0079] The driving module is specifically configured to control the pressure in the second cavity to drive the baffle to move the target distance relative to the bottom of the cavity, so that the volume of the first cavity is the target volume.

[0080] Wherein, the first cavity and the second cavity are arranged adjacent to each other. There is a negative correlation between the volume of the first cavity and the volume of the second cavity. The greater the pressure in the second cavity, the smaller the volume of the first cavity. Conversely, the smaller the pressure in the second cavity, the larger the volume of the first cavity.

[0081] Optionally, the driving module can be used to increase the pressure in the second cavity to drive the baffle to move the target distance towards the bottom of the cavity, or can be used to decrease the pressure in the second cavity to drive the baffle away from the bottom of the cavity to move the target distance.

[0082] In this embodiment, the driving module includes a pneumatic component. Thus, since the pneumatic component can rapidly generate a large air pressure driving force in a short time, the pneumatic component has a fast response speed, enabling the top of the cavity, i.e., the baffle, to move relatively quickly with respect to the bottom of the cavity, so as to quickly make the volume of the first cavity the target volume, avoiding the influence on the evaporation rate of the solvent on the substrate due to the too slow volume adjustment speed of the first cavity. Furthermore, it can significantly improve the flash evaporation efficiency of the flash evaporation device and the film forming effect of substrates of different sizes.

[0083] In an exemplary embodiment, the side wall of the cavity is a telescopic deformation structure.

[0084] Among them, the telescopic deformation structure refers to a structure that can achieve changes in size or shape through mechanical or physical principles.

[0085] Optionally, the telescopic deformation structure may include a bellows structure, an inflatable expansion structure or other deformation structures.

[0086] Optionally, the telescopic deformation structure can withstand a vacuum degree of 0 to 1 Pa.

[0087] In an exemplary embodiment, the side wall of the cavity includes a slide rail, and the baffle slides relative to the slide rail.

[0088] Among them, the slide rail refers to a component for guiding the sliding of the baffle, which can enable the baffle to move linearly along a predetermined path in the vertical direction.

[0089] Optionally, when the side wall of the cavity includes a slide rail, the driving module can be an electric push rod or a pneumatic component.

[0090] In this embodiment, the side wall of the cavity includes a slide rail, and the top of the cavity, i.e., the baffle, slides relative to the slide rail. Thus, the slide rail can reduce the friction force suffered by the top of the cavity during the process of moving relative to the bottom of the cavity, not only improving the moving speed of the top of the cavity, but also making the movement of the top of the cavity smoother and more fluent. Furthermore, it can significantly improve the flash evaporation efficiency and flash evaporation reliability of the flash evaporation device.

[0091] In an exemplary embodiment, the measuring module is further used to detect the vertical distance between the baffle and the bottom of the cavity.

[0092] The driving module is specifically configured to drive the baffle to move a target distance relative to the bottom of the cavity based on the target distance and the vertical distance, so that the volume of the first cavity is the target volume.

[0093] Among them, the vertical distance between the baffle and the bottom of the cavity is detected in real time by the measuring module during the process of the movable baffle moving relative to the bottom of the cavity.

[0094] Optionally, measurement modules may be respectively provided on the baffle and the bottom of the cavity. Thus, the measurement module located on the baffle can be used to detect the target size of the substrate, and / or the vertical distance between the baffle and the bottom of the cavity, while the measurement module located on the bottom of the cavity can be used to detect the vertical distance between the baffle and the bottom of the cavity.

[0095] Optionally, the driving module may also be specifically configured to drive the baffle to move a target distance relative to the bottom of the cavity based on the target distance, the vertical distance, and a control algorithm, so that the volume of the first cavity is the target volume. Optionally, the control algorithm may include a differential control algorithm, a fuzzy control algorithm, an adaptive control algorithm, or other algorithms.

[0096] In this embodiment, the measurement module is further configured to detect in real time the vertical distance between the top of the cavity, i.e., the baffle and the bottom of the cavity. Thus, the driving module can drive the top of the cavity to move a target distance relative to the bottom of the cavity based on the target distance and the vertically detected distance in real time. Since the vertical distance is real-time, furthermore, the driving module can combine the control algorithm and the vertical distance to ensure that the top of the cavity can be adjusted to an accurate height position in the vertical direction. Furthermore, by improving the moving accuracy of the top of the cavity, the accuracy of the volume of the first cavity after dynamic adjustment is improved, and the film forming quality of substrates of different sizes is significantly improved.

[0097] Exemplarily, as Figure 2 shown, the top of the cavity is a movable baffle 202, the driving module includes an electric push rod 204, and the side wall of the cavity includes a slide rail 206. The driving module is specifically configured to control the electric push rod 204 to drive the baffle 202 to move relative to the bottom of the cavity along the slide rail 206, so that the volume of the first cavity is the target volume.

[0098] Exemplarily, as Figure 3 shown, the top of the cavity is a movable baffle 302, the driving module includes a pneumatic component, and the pneumatic component includes a second cavity surrounded by a pneumatic side wall 304, a pneumatic top 306, and the baffle 302. The driving module is specifically configured to control the pressure in the second cavity to drive the baffle 302 to move relative to the bottom of the cavity so that the volume of the first cavity is the target volume.

[0099] Exemplarily, as Figure 4 shown, the top of the cavity is a movable baffle 402, the driving module includes an electric push rod 404, and the side wall of the cavity is a deformable structure 406 that can be stretched. The driving module is configured to control the electric push rod 404 to drive the baffle 402 to move relative to the bottom of the cavity, causing the deformable structure 406 that can be stretched to deform, so that the volume of the first cavity is the target volume.

[0100] In an exemplary embodiment, the top of the cavity includes a plurality of movable sliders; the driving module includes motor components, and the motor components are electrically connected to the respective sliders.

[0101] The driving module is specifically configured to control one or more of the plurality of sliders to move relative to the bottom of the cavity so that the volume of the first cavity is the target volume.

[0102] Among them, each of the plurality of sliders can move independently relative to the bottom of the cavity.

[0103] Optionally, the slider can be in the shape of a cuboid, so that the plurality of movable sliders can ensure the sealing of the top of the cavity through a combination relationship.

[0104] Optionally, the surface of the slider is smooth, so that the sliding friction between the sliders can be reduced and the moving smoothness of the sliders can be improved.

[0105] Optionally, the motor component can be a motor, an electric cylinder or other components with an electric drive function.

[0106] Optionally, the driving module can be used to control one or more of the plurality of sliders to move towards the bottom of the cavity, or can be used to control one or more of the plurality of sliders to move away from the bottom of the cavity so that the volume of the first cavity is the target volume.

[0107] In an exemplary embodiment, the driving module is specifically configured to control one or more of the plurality of sliders to move relative to the bottom of the cavity so that the shape of the top of the cavity presents a preset shape and the volume of the first cavity is the target volume.

[0108] Among them, the preset shape can be a shape in which the middle part of the top of the cavity bulges upward in the vertical direction, and the degree of bulge is higher the closer it is to the center point of the top of the cavity, that is, a convex-up shape. This shape is similar to a conical shape, with its center point being the highest point and gradually decreasing along the direction away from the center point.

[0109] Exemplarily, in order to make the top of the cavity present a convex-up shape, among the plurality of sliders, the closer a slider is to the center point of the top of the cavity, the higher its position in the vertical direction, and the farther a slider is from the center point of the top of the cavity, the lower its position in the vertical direction, under the condition that the volume of the first cavity is the target volume. That is to say, after one or more of the plurality of sliders move relative to the bottom of the cavity, under the condition that the volume of the first cavity is the target volume, the height of the position of the slider in the vertical direction is negatively correlated with the distance between the slider and the center point of the top of the cavity.

[0110] In this embodiment, the top of the cavity includes a plurality of movable sliders, and the motor components are electrically connected to each slider respectively. Therefore, the movement of each slider among the plurality of sliders can be independently carried out, making the shape of the top of the cavity highly variable. Thus, the dynamic adjustment of the volume of the first cavity has a high degree of flexibility. At the same time, since not only the volume of the first cavity can be dynamically adjusted, but also the shape of the top of the cavity in this embodiment can be dynamically adjusted. Furthermore, by making the shape of the top of the cavity present a preset shape, the flow field and pressure field in the first cavity can be optimized, so that the gas molecules volatilized from the solvent on the substrate during the flash evaporation process can diffuse in a direction away from the center of the top of the cavity, so that the gas molecules will not condense into liquid above the substrate and drip onto the substrate, avoiding the gas molecules from affecting the evaporation uniformity of the solvent on the substrate in turn, and significantly improving the film-forming quality of the target film on the substrate.

[0111] Exemplarily, as Figure 5 shown in (a) of, the top 502 of the cavity includes a plurality of movable sliders; as Figure 5 shown in (b) of, the driving module is specifically configured to control one or more sliders among the plurality of sliders to move relative to the bottom of the cavity so that the shape of the top 502 of the cavity presents a preset shape and the volume of the first cavity is a target volume.

[0112] It can be understood that the above flash evaporation device can also adopt other forms, rather than being limited to the forms already mentioned in the above embodiments, as long as it can achieve the function of dynamically adjusting the volume of the first cavity according to the target size of the substrate to improve the film-forming quality of substrates of different sizes.

[0113] Based on the flash evaporation device as Figure 6 shown, an embodiment of the present application provides a flash evaporation method. In an exemplary embodiment, as Figure 6 shown, a flash evaporation method is provided. Taking the flash evaporation device in Figure 6 as an example for illustration, it includes the following steps 602 to step 608, where:

[0114] 602, Place the substrate in the first cavity and detect the target size of the substrate.

[0115] 604, According to the preset correspondence between the size and the volume, determine the target volume corresponding to the target size.

[0116] 606, Adjust the volume of the first cavity so that the volume of the first cavity is the target volume.

[0117] 608, Extract the air inside the cavity after it becomes the target volume to form a target film on the substrate.

[0118] The above flash evaporation method can determine the target volume corresponding to the target size of the substrate according to the corresponding relationship between the preset size and volume, so as to adjust the volume of the first cavity to the target volume. Thus, substrates of different sizes can be flash-evaporated in the first cavity with a suitable size to meet the flash evaporation process requirements of substrates of different sizes. Therefore, by using the flash evaporation method provided in this embodiment, it can ensure that the solvents of substrates of different sizes can volatilize uniformly. At the same time, it can also make the temperature difference between the edge part and the central part of substrates of different sizes smaller. Furthermore, it significantly improves the film forming quality of substrates of different sizes.

[0119] It should be noted that the implementation scheme of this flash evaporation method is similar to the implementation scheme described in the above flash evaporation equipment. Therefore, the specific limitations in one or more of the above flash evaporation method embodiments can be referred to the limitations on the flash evaporation equipment in the above text, and will not be elaborated here.

[0120] In the description of this specification, the descriptions referring to terms such as "some embodiments" and "other embodiments" mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0121] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0122] The above embodiments only represent several implementation manners of the present application. The descriptions are relatively specific and detailed, but should not be construed as a limitation on the scope of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A flash evaporation device, characterized in that, It includes a first cavity, a processing module, a driving module, a measuring module, and a vacuum pumping module; the processing module is electrically connected to the driving module, the measuring module, and the vacuum pumping module respectively, and the first cavity is surrounded by a cavity side wall, a movable cavity top, and a cavity bottom; The measuring module is used to detect the target size of the substrate when the substrate is placed in the first cavity; The processing module is used to determine the required volume of the first cavity based on the target size to obtain a target volume; The driving module is used to drive the cavity top to move relative to the cavity bottom so that the volume of the first cavity is the target volume; The vacuum pumping module is used to pump out the air inside the first cavity after it reaches the target volume to form a target thin film on the substrate.

2. The device according to claim 1, characterized in that, The cavity top is a movable baffle; The processing module is further used to determine the moving distance of the cavity top based on the target volume to obtain a target distance; The driving module is specifically used to drive the baffle to move the target distance relative to the cavity bottom so that the volume of the first cavity is the target volume.

3. The device according to claim 2, characterized in that, The driving module includes an electric push rod, and the electric push rod is fixedly connected to the baffle; The driving module is specifically used to control the electric push rod to drive the baffle to move the target distance relative to the cavity bottom so that the volume of the first cavity is the target volume.

4. The device according to claim 2, characterized in that, The driving module includes a pneumatic component, and the pneumatic component includes a second cavity surrounded by a pneumatic side wall, a pneumatic top, and the baffle; The driving module is specifically used to control the pressure in the second cavity to drive the baffle to move the target distance relative to the cavity bottom so that the volume of the first cavity is the target volume.

5. The device according to claim 3 or 4, characterized in that, The cavity side wall is a telescopic deformation structure.

6. The device according to claim 3 or 4, characterized in that, The cavity side wall includes a slide rail, and the baffle slides relative to the slide rail.

7. The device according to claim 2, characterized in that, The measuring module is further used to detect the vertical distance between the cavity top and the cavity bottom; The driving module is specifically used to drive the baffle to move the target distance relative to the cavity bottom based on the target distance and the vertical distance so that the volume of the first cavity is the target volume.

8. The device according to claim 1, characterized in that, The cavity top includes a plurality of movable sliders; the driving module includes a motor component, and the motor component is electrically connected to each slider respectively; The driving module is specifically used to control one or more of the plurality of sliders to move relative to the cavity bottom so that the volume of the first cavity is the target volume.

9. The device according to claim 1, characterized in that, The target thin film is a perovskite thin film.

10. A flashing method, characterized in that Applied to the flash evaporation device described in claim 1, the method includes: Placing the substrate in the first cavity and detecting the target size of the substrate; Determining the target volume corresponding to the target size according to the preset correspondence between the size and the volume; Adjusting the volume of the first cavity so that the volume of the first cavity is the target volume; Pumping out the air inside the cavity after it reaches the target volume to form a target thin film on the substrate.

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