Spectrum sensor module and electronic equipment with spectrum sensor module

Abstract

The invention provides a spectrum sensor module and electronic equipment with the spectrum sensor module, the spectrum sensor module comprises a spectrum sensing assembly, a support and an optical assembly, the spectrum sensing assembly comprises a spectrum chip and a circuit board, the spectrum chip is electrically connected with the circuit board, and the optical assembly is electrically connected with the support. The optical assembly is arranged on the support and supported on a light sensing path of the spectrum chip, and the optical assembly comprises a light uniformizing unit, a diaphragm and a lens which are sequentially arranged in the optical axis direction of the spectrum chip so that incident light can be guided to the light incident surface of the spectrum chip through the optical assembly.

Description

Spectral sensor module and electronic device with spectral sensor module Technical Field

[0001] The present invention relates to the field of spectral technology, and in particular to a spectral sensor module and an electronic device with the spectral sensor module. Background Art

[0002] Spectral imaging technology typically uses sensors to acquire optical signals, followed by varying degrees of data processing to ultimately obtain spectral information. The sensors used in this process can acquire information in the frequency domain of the light being measured. Implementation methods include: a photodetector array with a light modulation structure, or a combination of a filter array (or filter structure) and a photodetector array; the filters (or filter structures) can employ narrowband, broadband, or periodic filtering in the frequency or wavelength domain. This computational reconstruction technique avoids the spatial optical path required for traditional spectroscopy, resulting in a smaller spectrometer or spectral camera.

[0003] With the application of spectral imaging technology in various fields, spectral sensors are gradually developing towards miniaturization and micro-scaling. During this miniaturization process, spectrometers or spectral cameras need to address various optical issues. Because computational spectral chips are sensitive to the principal angle of the incident light signal, variations in the principal angle of the incident light signal in actual use will significantly affect the accuracy of spectral recovery. In other words, the unstable angle and intensity of the incident light in existing spectral sensors can lead to inaccurate recovered spectral information or large fluctuations in the results of multiple recovery attempts.

[0004] In addition, electronic devices based on spectral sensing technology, such as facial recognition devices, are increasingly used in various terminal devices. Such electronic devices not only require higher spectral recovery performance, but are also increasingly moving towards miniaturization.

[0005] Summary of the Invention

[0006] A major advantage of the present invention is that it provides a spectral sensor module and an electronic device with a spectral sensor module, wherein the spectral sensor module includes an optical component, wherein the optical component is configured to receive a light signal from a photographed target and guide the light signal to the spectral chip, which is beneficial to improving the optical characteristics of the spectral sensor.

[0007] In one aspect, the present application provides a spectral sensor module, comprising: a spectral sensing component, the spectral sensing component comprising a spectral chip and a circuit board, wherein the spectral chip is electrically connected to the circuit board; a bracket; an optical component, the optical component being disposed on the bracket and supported in the light-sensing path of the spectral chip, wherein the optical component comprises a light-homogenizing unit, an aperture, and a lens arranged in sequence along the optical axis direction of the spectral chip, so that incident light is guided to the light-entering surface of the spectral chip through the light-homogenizing unit, the aperture, and the lens of the optical component. According to one embodiment of the present invention, the lens comprises a lens body and a lens bracket supporting the lens body, and the lens body is supported by the lens bracket between the aperture and the spectral chip.

[0008] According to one embodiment of the present invention, the lens body and the lens holder are an integrated structure, and the lens body is integrally formed on the inner side of the lens holder.

[0009] According to one embodiment of the present invention, the lens body includes a light incident surface and a light exit surface, and at least one of the light incident surface and the light exit surface of the lens body is an aspherical surface.

[0010] According to one embodiment of the present invention, along the direction of the main optical axis, the distance between the light incident surface of the lens body and the light exit surface of the aperture is set to D1, and the distance between the light exit surface of the lens body and the light incident surface of the spectral chip is set to D2. The distance D1 is related to the curvature radius of the light surface and the aperture L of the aperture, and the distance D2 is related to the curvature radius of the light exit surface.

[0011] According to one embodiment of the present invention, the curved surface of the light incident surface is composed of any point (x1, y1) on the curved surface, where y1 is determined by parameters x1 and r1, and the curved surface of the light exit is composed of any point (x2, y2), where y2 is determined by x2 and r2, and y1=f font (x,r1,K1,d1,e1,h1),y2=f back (x, r2, K2, d2, e2, h2), where K1 and K2 are the conic parameters of the aspheric surface, and d1, e1, h1, d2, e2, h2 are polynomial coefficients.

[0012] According to an embodiment of the present invention, the distance D2 determines the angle between the light guided onto the spectral chip and the main optical axis.

[0013] According to one embodiment of the present invention, the distance D2 determines the uniformity of the light directed onto the spectral chip and the intensity of the light spot, wherein the uniformity is the size of the light spot with consistent intensity and angle directed onto the spectral chip.

[0014] According to one embodiment of the present invention, the bracket includes a first bracket unit and a second bracket unit, wherein the first bracket unit is arranged on the outside of the spectral chip, the second bracket unit is located above the first bracket unit, and the second bracket unit has a light-through hole, and the aperture of the optical component is formed by the second bracket unit.

[0015] According to one embodiment of the present invention, the optical assembly further comprises a filter unit, wherein the filter unit is arranged between the aperture and the lens.

[0016] According to one embodiment of the present invention, the lens holder further includes a supporting end and a fixing end integrally extending downward from the supporting end, wherein the fixing end of the lens holder is fixed to the circuit board of the spectral sensing component.

[0017] According to an embodiment of the present invention, the filter unit is supported by the lens holder of the lens between the lens body and the aperture.

[0018] According to one embodiment of the present invention, the filter unit is attached to the inner surface of the bracket, and the filter unit is held inside the lens bracket of the lens.

[0019] According to one embodiment of the present invention, a light-shielding material is provided on the outer side of the lens holder.

[0020] According to one embodiment of the present invention, the optical component further includes a light homogenizing unit, wherein the light homogenizing unit is arranged on the light incident side of the aperture, and an opaque layer is provided on the light homogenizing unit.

[0021] According to an embodiment of the present invention, the light homogenizing unit is provided on a portion of the opaque layer, and the aperture is provided and formed on a light-transmitting portion of the light-transmitting light homogenizing unit.

[0022] According to one embodiment of the present invention, the aperture is arranged at a plurality of different positions of the light-transmitting portion of the light-homogenizing unit.

[0023] According to one embodiment of the present invention, the device further comprises a cover plate, wherein the cover plate is arranged above the bracket, the cover plate has a wedge-shaped groove, and the light homogenizing unit is inverted in the wedge-shaped groove of the cover plate.

[0024] According to another aspect of the present invention, there is provided an electronic device, comprising:

[0025] An electronic device body; and any one of the spectral sensor modules, wherein the spectral sensor module is mounted on the electronic device body and electrically connected to the electronic device body.

[0026] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and accompanying drawings.

[0027] Another advantage of the present invention is to provide a spectral sensor module and an electronic device with a spectral sensor module, wherein the optical components of the spectral sensor module are configured to make the intensity of the incident light guided onto the spectral chip uniform, and the intensity uniformity may include the incident light guided onto the spectral chip being angularly uniform and surface uniform.

[0028] Another advantage of the present invention is to provide a spectral sensor module and an electronic device with a spectral sensor module, wherein the optical component of the spectral sensor module includes a lens, wherein the incident light passes through the lens before being guided to the spectral chip, the light incident surface of the lens is a plane, or the light incident surface of the lens is a curved surface, and the light exit surface of the lens is a curved surface, which is conducive to the miniaturization of the spectral sensor.

[0029] Another advantage of the present invention is to provide a spectral sensor module and an electronic device with a spectral sensor module, wherein the lens of the spectral sensor module includes a lens body and a lens bracket supporting the lens body, wherein the lens and the lens bracket are an integrated structure, which is conducive to simplifying the overall structure of the spectral sensor and simplifying the assembly steps. The spectral sensor module provided in this application can better restore spectral information, more accurately and stably.

[0030] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1 is a schematic structural diagram of a spectral chip according to a preferred embodiment of the present invention.

[0032] FIG2 is a schematic diagram of the planar structure of the spectral chip according to a preferred embodiment of the present invention.

[0033] FIG3 is a schematic diagram of the structural framework of the spectral chip according to a preferred embodiment of the present invention.

[0034] FIG4 is a structural block diagram of the spectral sensor module according to a preferred embodiment of the present invention.

[0035] FIG5 is a schematic structural diagram of the spectral sensor module according to a preferred embodiment of the present invention.

[0036] FIG6 is a schematic structural diagram of another spectral sensor module according to another preferred embodiment of the present invention.

[0037] FIG7 is a schematic structural diagram of another spectral sensor module according to another preferred embodiment of the present invention.

[0038] FIG8 is a schematic structural diagram of another spectral sensor module according to another preferred embodiment of the present invention.

[0039] FIG9 is a schematic cross-sectional view of another spectral sensor module according to another preferred embodiment of the present invention.

[0040] FIG10 is a schematic diagram of an optical path of another spectral sensor module according to another preferred embodiment of the present invention.

[0041] 11A and 11B are schematic structural diagrams of the lens structure of the spectral sensor according to the preferred embodiment of the present invention.

[0042] 12A and 12B are schematic diagrams of the lens structure of the spectral sensor according to the above preferred embodiment of the present invention.

[0043] FIG. 13A and FIG. 13B are response curves obtained by changing the lens structure of the spectral sensor according to the preferred embodiment of the present invention.

[0044] 14A to 14C are response curves of the spectral sensor corresponding to different lens structures of the spectral sensor according to the preferred embodiment of the present invention.

[0045] FIG15 is a schematic structural diagram of another spectral sensor module according to another preferred embodiment of the present invention. DETAILED DESCRIPTION

[0046] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0047] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0048] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0049] Referring to Figures 1 to 5 of the accompanying drawings of this application, a spectral sensor module according to a preferred embodiment of the present application is described below. The spectral sensor module includes a spectral sensing component 10, an optical component 20 disposed in the light-sensing path of the spectral sensing component 10, and a bracket 30. The optical component 20 is secured to the bracket 30, which holds the optical component 20 in the light-sensing path of the spectral sensing component 10. Preferably, in this preferred embodiment of the present application, one end of the bracket 30 is secured to the light-entering side of the spectral sensing component 10.

[0050] The spectral sensing component 10 includes a spectral chip 11 and a circuit board 12, wherein the spectral chip 11 is disposed on the circuit board 12 and is electrically connected to the circuit board 12. Incident light passes through the optical component 20 along the light-sensing path of the spectral chip 11 and reaches the upper surface of the spectral chip 11, wherein the spectral chip 11 obtains its corresponding spectral information based on the incident light. The optical component 20 is configured to receive a light signal from a photographed target and guide the light signal to the spectral chip 11, wherein the optical component 20 is configured to ensure that the incident light guided to the spectral chip 11 has a uniform light intensity. It is worth mentioning that the uniform light intensity may include that the incident light guided to the spectral chip 11 is angularly uniform and surface uniform.

[0051] The spectral chip 11 includes a photodetection layer 111 and an optical modulation layer 112 located on the sensing path of the photodetection layer 111. The photodetection layer 111 is configured to obtain a response signal of the incident light passing through the optical modulation layer 112, wherein the optical modulation layer 112 is used to filter the incident light, and the optical modulation layer 112 is arranged on the light incident side of the optical detection layer 111.

[0052] In the spectral sensor of the embodiment of the present application, the spectral chip includes a filter structure 1121 (the filter structure 1121 is arranged on the light modulation layer 112) and the photodetection layer 111, and the filter structure 1121 is located on the photosensitive path of the photodetection layer 111, wherein the filter structure 1121 is a broadband filter structure 1121 in the frequency domain or wavelength domain. The pass spectra of different wavelengths of each filter structure 1121 are not exactly the same. The filter structure 1121 can be a structure or material with filtering properties such as a metasurface, a photonic crystal, a nanocolumn, a multilayer film, a dye, a quantum dot, a MEMS (microelectromechanical system), an FP etalon (FP standard), a cavity layer (resonant cavity layer), a waveguide layer (waveguide layer), a diffraction element, etc. For example, in the embodiment of the present application, the filter structure 1121 can be the light modulation layer in Chinese patent CN201921223201.2. The light modulation layer 112 is provided with a modulation structure, wherein the shapes of the modulation structure can be the same or different, and the modulation units formed by the modulation structure can be periodic or different.

[0053] As shown in Figures 1 and 2 below, the light modulation layer 112 is provided with a plurality of filter structures 1121, and the filter structures 1121 can be of the same shape or different shapes, wherein the plurality of filter structures 1121 constitute a filter unit (modulation unit), and the filter units can be arranged periodically.

[0054] In particular, the optical modulation layer 112 includes at least one filter unit that modulates the light reaching the optical modulation layer 112, wherein each of the filter structures 1121 can be a micro-nanohole or a micro-nanocolumn. The filter unit corresponds to at least one sensing unit of the photodetection layer 11, wherein the spectral chip 11 uses the filter unit of the optical modulation layer 112 to modulate the optical signal from the target to obtain a modulated optical response signal, and uses the photodetection layer 111 to receive the modulated optical response signal and provide a differential response to it.

[0055] As shown in Figure 3 below, the optical component 20 is located in the photosensitive path of the photodetection layer 111. The light of the subject is adjusted by the optical component 20 and then modulated by the light modulation layer 112, and then guided to the photodetection layer 111 for response. The optical component 20 is configured to make the incident light guided to the spectral chip 11 have uniform light intensity. The uniform light intensity can include guiding the incident light on the spectral chip 11 to be angularly uniform and surface uniform. If the light is uneven, it will affect the effect of spectral recovery, resulting in lower efficiency. As an example, in this preferred embodiment of the present application, the photodetection layer 111 of the spectral chip 11 can be a CMOS photodetection layer (CIS), CCD, array light detector, etc. The spectral chip 11 of the spectral sensor module further includes a data processing unit 113, which can be a processing unit such as MCU, CPU, GPU, FPGA, NPU, ASIC, etc., which can export the data generated by the photodetection layer 111 to the outside for processing. The data processing unit 113 of the spectral chip reconstructs the differential response to obtain original spectral information of the measured target.

[0056] In practical applications, the spectral chip 11 is sensitive to the principal ray angle of the light signal incident on the modulation layer. Therefore, if it is too sensitive, the accuracy and stability of spectral recovery will be affected. It should be noted that the principal ray angle at any specific position of the spectral chip 11 represents the angle between the principal ray of the light signal directed onto the spectral chip 11 and the normal line, where the principal ray represents the line connecting the point where the light signal from the subject is emitted and the point on the surface of the light modulation layer 112 of the spectral chip 11 that arrives, and the normal line represents the line perpendicular to the surface of the light modulation layer 112 of the spectral chip 11.

[0057] Therefore, in this preferred embodiment of the present application, the optical component 20 is located in the light-sensing path of the spectral chip 11. Incident light is guided by the optical component 20 to the surface of the spectral chip 11 at a set angle of incidence and uniform intensity, thereby maintaining a constant angle of incidence for each optical signal incident on the same sensing unit. It is understood that the cone angle of light received by the spectral chip 11 at each location on the upper surface of the optical modulation layer of the spectral chip 11 must also remain stable and cannot vary significantly.

[0058] Therefore, the light spot obtained at the corresponding position of the light modulation layer 112 needs to be uniform, so that the light intensity on the corresponding photosensitive unit is uniform and the angular sensitivity is small.

[0059] The optical assembly 20 includes a light homogenizer 21 and an aperture 22. These light homogenizer 21 and aperture 22 are located in the light sensing path of the spectral chip 11. The light homogenizer 21 is used to homogenize the incident light, and the aperture 22 is used to control the size of the light spot and the amount of light passing through. The spectral information acquired by the spectral sensor module can be used to restore ambient light parameters such as color temperature, illumination, and brightness.

[0060] This preferred embodiment of the present application further introduces the algorithm principle of spectrum recovery, in which it is necessary to obtain the response information of the modulation unit in the corresponding modulation layer.

[0061] After the incident light passes through the light homogenizing unit 21 and reaches the light modulating unit on the surface of the light modulating layer 112, the light cone angle is kept within a certain range, and the angle can have better consistency and stability, so that the spectral information can be better restored. The spectral restoration can be performed using the areas with better angular distribution in the center of the light spot (the center areas of multiple light spots can be combined to restore the spectrum together). Preferably, the modulation units are selected at different positions in the light modulating layer to select the light response data that is better than the restored one. The specific algorithm principles include:

[0062] The intensity signal of the incident light of the object at different wavelengths λ is denoted as f(λ), and the transmission spectrum curve of the filter structure 1121 is denoted as T(λ). Assume that the light modulation layer 112 has m groups of filter structures 1121, and the transmission spectrum of each group is different from each other, that is, the modulation unit as described above, which can be denoted as Ti(λ) (i=1,2,3,…,m) as a whole. There are corresponding physical pixels under each group of modulation structures to detect the light intensity Ii in the response information modulated by the modulation structure. In a specific embodiment of the present application, one physical pixel corresponds to a group of modulation structure units for illustration, but it is not limited to this. In other embodiments, multiple physical pixels can also be grouped to correspond to a group of modulation units.

[0063] The relationship between the spectrum distribution of ambient light and the measurement value of the light detector array (photodetection layer 111) can be expressed by the following formula: Ii = Σ(f(λ)·Ti(λ)·R(λ))

[0064] Wherein, R(λ) is the response of the photodetector, which is expressed as: Si(λ)=Ti(λ)·R(λ)

[0065] The above formula can be expanded into matrix form:

[0066] Here, Ii (i=1, 2, 3, …, m) is the response of the photodetector (the photodetection layer 111) after the incident light of the object passes through the modulation structure, which corresponds to the light intensity measurement values ​​of m photodetector units, also known as m "physical pixels", which is a vector of length m. S is the system's response to light of different wavelengths, which is determined by two factors: the transmittance of the filter structure 1121 and the quantum efficiency of the photodetector response. S is a matrix, and each row vector corresponds to the response of a broadband filter unit (i.e., the photodetector unit and its corresponding filter structure 1121) to ambient light of different wavelengths. Here, the ambient light is discretely and uniformly sampled, with a total of n sampling points. The number of columns of S is the same as the number of sampling points of the ambient light. Here, f(λ) is the spectrum of the incident light at different wavelengths λ, that is, the spectrum of the object to be measured.

[0067] In this preferred embodiment of the present application, the response parameter S of the system is known, and the spectrum f of the input light can be obtained by inversely calculating the light intensity reading I of the photodetector (the photodetection layer 111) using an algorithm. The process can adopt different data processing methods depending on the specific situation, including but not limited to: least squares, pseudo-inverse, equalization, least squares norm, artificial neural network, etc.

[0068] The above takes a physical pixel of the photodetection layer 111 corresponding to a group of structural units of the light modulation layer 112 as an example to illustrate how to use m groups of physical pixels (i.e., pixel points of the photodetection layer) and their corresponding m groups of structural units (the same structure on the modulation layer is defined as a structural unit) to restore a spectral information, also called a "spectral pixel". It is worth noting that, in the embodiment of the present application, multiple physical pixels may correspond to a group of modulation structural units. It can be further defined that a group of modulation structural units and the corresponding at least one physical pixel constitute a unit pixel. In principle, at least one unit pixel constitutes a spectral pixel. The acquired spectral information can be used to restore the color temperature information, brightness information, illumination information and other light information of the subject or environment, and can further perform white balance adjustment according to the restored color temperature to adjust the brightness or chromaticity information of the light source or display.

[0069] Furthermore, since the light modulation layer 112 of the spectral chip 11 in the embodiment of the present application carries spatial position information, the acquired spectral information also carries the position information of the object or environment, so the color temperature or illumination and other light information of multiple regions or different regions can be adjusted according to different position information.

[0070] Furthermore, in this preferred embodiment of the present application, in order to achieve the above-mentioned acquisition of spectral information, a new design is added to the optical structure of the light homogenization unit 21. Under the same field of view (FOV), a larger angle of the subject's light spot can be obtained, that is, a larger range of the modulation structure layer area can be covered, which is more conducive to selecting available response parameters. Because different systems and modulation structure layers respond differently to incident light, that is, Si(λ) = Ti(λ)·R(λ), different locations on the spectral chip 11 have different corresponding response parameters. Therefore, a wider range of responses can be obtained, which is more conducive to spectral recovery, or spectral recovery of incident light in a larger space.

[0071] As shown in Figures 4 and 5 , the captured light (i.e., incident light) passes through the light homogenization unit 21 of the optical assembly 20, the aperture 22, and the spectral chip 11 in sequence on its optical path to the spectral chip 11. Preferably, in this preferred embodiment of the present application, the light homogenization unit 21 can be, but is not limited to, a light homogenization sheet or film, so that the incident light can obtain light with uniform intensity, and that incident light of different wavelength bands can obtain light with substantially consistent light intensity within a set range.

[0072] In the embodiment of the present application, a beam of light coming from different incident angles is illuminated by the homogenizing unit 21 with a uniform distributed intensity on each pixel of the spectral chip 11. To ensure relatively stable light intensity and to ensure that incident light of different wavelengths can obtain corresponding spectral information, the homogenizing unit 21 must meet a certain transmittance. Due to the different thicknesses of the homogenizing unit 21, the transmittance and homogenizing effect will also vary. It is understood that different materials have different homogenizing effects. Therefore, different homogenizing units can be selected based on the size of the resulting light spot and the position of the modulation structure.

[0073] As shown in Figure 6, the optical assembly 20 further includes a lens 23, which is positioned on the light-exiting side of the light-homogenizing unit 21 and the aperture 22 of the optical assembly 20. That is, incident light passes through the light-homogenizing unit 21 and the aperture 22 to reach the lens 23, where it is then guided to the light-entering surface of the spectral chip 11. The lens 23 is located on the inner side of the bracket 30 and is fixed to the same side of the spectral sensing assembly 10 as the spectral chip 11. The lens 23 adjusts the intensity and spot size of the incident light to suit the needs of the spectral chip 11.

[0074] Preferably, in this preferred embodiment of the present application, the lens 23 is fixed to the circuit board 12 of the spectral sensing component 10 , wherein the optical axis center of the lens 23 is consistent with the light sensing path of the spectral chip 11 of the spectral sensing component 10 .

[0075] The lens 23 includes a lens body 231 and a lens holder 232 supporting the lens body 231, wherein the lens 23 is an integrated structure, that is, the lens body 231 is integrally formed on the inner side of the lens holder 232. Preferably, in this preferred embodiment of the present application, the lens holder 232 is a cylindrical structure, wherein the lens body 231 is integrally formed on the inner side of the lens holder 232.

[0076] The lens bracket 232 of the lens 23 is fixed to the spectrum sensing component 10 , and the lens bracket 232 supports and fixes the lens body 231 in the light sensing path of the spectrum chip 11 .

[0077] It is worth mentioning that in this preferred embodiment of the present application, the lens body 231 is integrally formed inside the lens bracket 232, and the position of the lens body 231 can be adjusted through the lens bracket 232, which is conducive to reducing assembly errors and improving assembly accuracy and yield.

[0078] The lens body 231 further has a light incident surface 2311 and a light exit surface 2312, wherein the light incident surface 2311 of the lens body 231 faces the external environment, and the light exit surface 2312 of the lens body 231 faces the spectral chip 11, that is, the incident light enters the lens 23 through the light incident surface 2311 of the lens body 231, and is emitted to the spectral chip 11 through the light exit surface 2312 of the lens body 231.

[0079] Preferably, in this preferred embodiment of the present application, the lens body 231 of the lens 23 is an aspherical mirror. Alternatively, in another optional embodiment of the present application, the lens body 231 of the lens 23 is a spherical mirror.

[0080] As an example, in a specific example of the present application, the light incident surface 2311 of the lens body 231 is a plane, or the light incident surface 2311 of the lens body 231 is a curved surface, and the light emitting surface 2312 of the lens body 231 is a curved surface.

[0081] In this preferred embodiment of the present application, along the direction of the main optical axis, the aperture of the diaphragm 22 is L, the distance D1 is related to the curvature radius of the light surface and the aperture L of the diaphragm, and the distance D2 determines the angle between the light guided onto the spectral chip and the main optical axis. If the aperture L of the diaphragm is reduced alone, the intensity of the light spot guided onto the detection layer of the spectral sensor chip will be reduced or a relatively uniform light spot cannot be obtained. Therefore, in order to obtain a smaller spectral sensor module, it is necessary to adjust the distance D1 between the light entrance surface 2311 of the lens body 231 and the light exit surface of the diaphragm 22, and the distance D2 between the light exit surface 2312 of the lens body 231 and the light entrance surface of the spectral chip 11. D1 and D2 are related to the aperture L, and the three need to be adjusted with each other.

[0082] Furthermore, the two surfaces of the lens body 231 (i.e., the light incident surface 2311 and the light emitting surface 2312) respectively correspond to curved surfaces composed of different curvature radii. Since the curvatures of different coordinate points on the two curved surfaces are different, if the curvature radius of any point on the light incident surface is r1, and the curvature radius of any point on the light emitting surface is r2, the intersection of the curved surface and the principal optical axis is taken as the origin, the direction along the principal optical axis to the light emitting surface is the positive direction of the x-axis, and the direction perpendicular to the principal optical axis is the y-axis. Of course, other coordinate system settings can also be used, which are not specifically limited here. This is just an example to illustrate. Suppose the function of y1 and x1 of any point (x1, y1) on the light incident surface 2311 is y1=f(x1, r1), and the corresponding parameter r1 in the function is the curvature radius r1 of the point (x1, y1) on the light incident surface 2311. The function of coordinates y2 and x2 of any point on the light-emitting surface 2312 of the lens body 231 is y2=f(x2, r2). The curvature radius of the coordinate (x2, y2) is r2. The specific curvature of the aspheric surface is also related to the cone parameter K. Therefore, the specific functional relationship is: y1=f font (x, r1, K1, d1, e1, h1), y2==f back (x,r2,K2,d2,e2,h2), where d2, e2, h2 are the polynomial coefficients.

[0083] As shown in Figures 11A and 11B, the distance D1 between the light-entering surface of the lens body 231 and the light-exiting surface of the aperture is related to the radius of curvature of the light-entering surface and the aperture L of the aperture. The distance D2 determines the angle between the light directed onto the spectral chip and the principal optical axis. D2 also determines the intensity of the light directed onto the spectral chip 11 and the size of the light spot formed, especially the diameter of the light spot that can form a uniform light spot. The relationship between the coordinates (x1, y1) of any point on the light-entering surface 2311 of the lens body 231 and the light-exiting surface 2312 of the lens body 231 is: y1 = f font (x, r1, K1, d1, e1, f1), the functional relationship of the coordinates (x2, y2) on the light-emitting surface is y2 = f back (x, r2, K2, d2, e2, f2), where. It should be noted that in the above relationship between D1 and D2, K1, d1, e1, f1 and K2, d2, e2, f2 are optimization variables for optimizing the light incident surface 2311 and the light exit surface 2312 of the lens body 231. It can be understood that in the above relationship, K1 and K2 are coefficients of the aspheric surface, d1, e1, f1 and d2, e2, f2 are power series of the corresponding aspheric surfaces, and the above are all variable parameters. As shown in Figure 11B, the relationship between the light incident surface 2311 and the light exit surface 2312 of the lens body 231 can be expressed as:

[0084] Therefore, the structures of the light incident surface and the light emitting surface of the lens body 231 can be adjusted by adjusting the above variables, so that the angle of light emission can be adjusted to make the optical direction of the light emitted parallel to the main optical axis of the lens body 231.

[0085] As shown in Figures 12A and 12B, in this preferred embodiment of the present application, by adjusting the curvature of the light incident surface 2311 and the light emitting surface 2312 of the lens body 231, as well as the distance D2 from the light emitting surface to the detection surface on the spectral chip, the light guided to the detection surface can be adjusted to be parallel or as parallel as possible. The light emitting angle of the lens body 231 and the angle of the main optical axis are within the range of ±10° in the set interval, more preferably ±5°. As shown in Figures 13A and 13B, the x-axis in the figure represents the coordinate of the lens body 231 in a certain direction (x-axis or y-axis) in the figure, and y in the figure represents the response of the spectral chip 11 to the incident light. As shown in Figure 13B, the response change curve of the spectral chip 11 obtained by changing D2 from large to small is shown, wherein the response consistency of the spectral chip 11 gradually becomes lower as the distance D2 changes. Figures 14A to 14C show several simulation graphs of the spectral chip 11 as D2 varies. Taking the response data of the spectral chip 11 along the x-axis or y-axis, it can be seen that good consistency corresponds to the flatter curve in the figure below, while poor consistency corresponds to a smaller modulation unit in the spectral chip 11. Therefore, it is necessary to select a spectral chip with a larger response consistency area. As shown in Figure 14B, this is the uniform light effect after adjusting the curved surface. As can be seen in the figure, under the same incident light, the resulting spot is more uniform and the uniform range is larger.

[0086] It is worth mentioning that in this preferred embodiment of the present application, the distance between the light incident surface 2311 of the lens body 231 and the aperture 22 can be adjusted by the lens holder 232 of the lens 23, and the distance between the light exit surface 2312 of the lens body 231 and the spectral chip 11 can be adjusted, so that the spectral chip 11 has a high consistency. In short, in this preferred embodiment of the present application, the lens holder 232 of the lens 23 can fix the lens body 231 between the aperture 22 and the spectral chip 11 based on a set distance, that is, maintain the distance between the light incident surface 2311 of the lens body 231 and the light exit surface of the aperture 22, and also maintain the distance between the light exit surface 2312 of the lens body 231 and the light incident side of the spectral chip 11, thereby preventing dimensional changes caused by assembly errors and during use.

[0087] In addition, it should be noted that the lens body 231 and the lens bracket 232 of the lens 23 are an integrated structure, thereby eliminating the structure required to install the lens and further facilitating the miniaturization of the spectral sensor module. On the other hand, the lens body 231 and the lens bracket 232 of the lens are an integrated structure, and the lens bracket 232 can maintain the lens body 231 in a specific position, thereby improving the stability of the spectral sensor module. In some embodiments, the lens body 231 and the lens bracket 232 can also be separate structures, which can be fixed together or assembled together by adhesive or other means.

[0088] It's worth noting that the lens body 231 of the lens 23 can also be implemented as a spherical mirror. While a spherical lens can certainly be used, the distance between its radius of curvature and its geometric center remains constant. Therefore, the size of the aperture 22 and the distance between the aperture 22 and the optical center of the spherical lens are relatively fixed, making further miniaturization adjustments difficult. Preferably, in this preferred embodiment of the present application, the lens body 231 of the lens 23 is an aspherical mirror. This facilitates further miniaturization adjustments based on the size of the aperture 22 and the distance between the aperture 22 and the optical center of the lens body 231, thereby facilitating miniaturization of the spectral sensor module.

[0089] As shown in Figure 5, the bracket 30 of the spectral sensor module includes a first bracket unit 31 and a second bracket unit 32. The first bracket unit 31 is positioned outside the spectral chip 11, and the light homogenizing unit 21 of the optical assembly 20 is supported by the bracket 30 above the spectral chip 11. The second bracket unit 32 is positioned above the first bracket unit 31 and has a light aperture, forming the aperture 22 of the optical assembly 20. That is, in this preferred embodiment of the present application, incident light reaches the lens 23 of the optical assembly 20 through the light aperture of the second bracket unit 32. It is worth noting that in this preferred embodiment of the present application, the first bracket unit 31 and the second bracket unit 32 of the bracket 30 function as light shielding elements, meaning that light can be blocked by the first bracket unit 31 and the second bracket unit 32. Incident light enters the interior of the bracket 30 through the aperture 22 of the optical assembly 20 (i.e., the light aperture of the second bracket unit 32).

[0090] The light homogenizing unit 21 of the optical assembly 20 is disposed above the second bracket unit 32, and the light homogenizing unit 21 of the optical assembly 20 is fixed and supported by the second bracket unit 32. The optical assembly 20 further includes a light filtering unit 24, wherein the light filtering unit 24 is disposed between the aperture 22 and the lens 23, and filters the incident light.

[0091] Preferably, in this preferred embodiment of the present application, the filter unit 24 is implemented as a filter or a filter film, wherein the filter unit 24 is attached below the aperture 22, that is, the incident light reaches the filter unit 24 through the aperture 22, and then reaches the lens 23 through the filter unit 24.

[0092] More preferably, in this preferred embodiment of the present application, the filter unit 24 is attached to the lower surface of the second bracket unit 32 .

[0093] The spectral sensor module further includes a cover plate 40, wherein the cover plate 40 is arranged above the bracket 30, and the cover plate 40 is provided with a light-transmitting area, wherein the light-transmitting area of ​​the cover plate 40 corresponds to the light homogenizing unit 21 and the aperture 22 of the optical component 20, and the light homogenizing unit 21 is fixed to the upper end of the bracket 30 by the cover plate 40.

[0094] It can be understood that in this preferred embodiment of the present application, the first bracket unit 31 and the second bracket unit 32 of the bracket 30 form the outer shell of the spectral sensor module, and the bracket 30 protects and supports the optical component 20 inside.

[0095] As shown in Figure 6, the cover plate 40 is used to fit and fix the light homogenizing unit 21. The aperture 22 is provided under the light homogenizing unit 21, wherein the incident light enters the aperture 22 after passing through the light homogenizing unit 21. The aperture 22 is formed on the second bracket unit 32 of the bracket 30, so as to simplify the structure of the spectral sensor module, which is conducive to the miniaturization and micro-miniaturization of the spectral sensor module.

[0096] In this preferred embodiment of the present invention, the lens 23 has an H-shaped structure, that is, the longitudinal cross-section of the lens 23 is “H”-shaped, and the lens holder 232 of the lens 23 is supported on the outside of the lens body 231 .

[0097] In detail, the lens bracket 232 of the lens 23 further includes a supporting end 2321 and a fixing end 2322 integrally extending downward from the supporting end 2321 , wherein the fixing end 2322 of the lens bracket 232 is fixed to the circuit board 12 of the spectral sensing component 10 .

[0098] The lens body 231 of the lens 23 is integrally formed inside the lens holder 232, and is separated into two mutually spaced spaces by the lens body 231 inside the lens holder 232. On the light-entering side of the lens body 231, the lens body 231 and the supporting end 2321 of the lens holder 232 form a first lens space 2323. On the light-exiting side of the lens body 231, the head lens body 231 and the fixed end 2322 of the lens holder 232 form a second lens space 2324. The spectral chip 11 is located in the second lens space 2324 of the lens 23.

[0099] It is worth mentioning that the second lens space 2324 formed by the lens 23 is a sealed structure, which can prevent the entry of debris and reduce the entry of stray light.

[0100] As shown in Figure 6, the filter unit 24 is supported by the lens bracket 232 of the lens 23 between the lens body 231 and the aperture 212. The incident light passes through the aperture 22 and enters the light incident surface of the lens 23. After being refracted by the lens 23, it is emitted through the light exit surface of the lens 23 and reaches the modulation layer of the spectral chip 11.

[0101] It is worth mentioning that in this preferred embodiment of the present application, the aperture 22 is formed on the bracket 30 , wherein the light homogenizing unit 21 of the optical component 20 is fixed to the top of the bracket 30 by a cover plate 40 .

[0102] It should be noted that in this preferred embodiment of the present application, the fixed end 2322 of the lens bracket 232 of the lens 23 is fixed to the surface of the circuit board 12 of the spectral sensing component 10, and the supporting end 2321 of the lens bracket 232 supports the filter unit 24 so as to fix the filter unit 24 on the inner side of the bracket 30.

[0103] After passing through the light homogenizing unit 21, the captured incident light enters the aperture 22. The aperture 22 is formed at the top of the bracket 30, which also serves as a housing to protect the spectral chip 11. The incident light passes through the aperture 22 and enters the lens 23 disposed below the aperture 22. The lens 23 is an aspherical lens. The lens bracket 232 of the lens 23 is configured to ensure that the distance from the light entrance surface 2311 of the lens body 231 to the aperture 22 is within a set value range, and the distance from the light exit surface 2312 of the lens body 231 to the spectral chip 11 is within a set value range, which is beneficial for improving the spectral recovery performance of the spectral chip 11.

[0104] As shown in Figure 7, another optional embodiment of the present application is explained in the following description. Unlike the above-mentioned preferred embodiment, in this preferred embodiment of the present application, the filter unit 24 is attached to the inner surface of the bracket 30, and the filter unit 24 is retained inside the lens bracket 232 of the lens 23. In other words, in this preferred embodiment of the present application, the filter unit 24 is retained within the second lens space 2324 of the lens bracket 232 of the lens 23. The support end 2321 of the lens bracket 232 is supported below the bracket 30, and the second lens space 2324 formed by the support end 2321 of the light-transmitting bracket 232 and the bracket 30 is a sealed structure that can prevent foreign matter from entering.

[0105] Preferably, in this preferred embodiment of the present application, the supporting end 2321 of the lens bracket 232 is connected to the lower end surface of the bracket 30, and the fixing end 2322 of the lens bracket 232 is fixed to the circuit board 12 of the spectral photosensitive component 10, so that the first lens space 2323 and the second lens space 2324 of the lens bracket 232 are two mutually isolated and sealed light transmission spaces. It can be understood that the lens bracket 232 is disposed between the bracket 30 and the spectral photosensitive component 10, and supports the bracket 30 via the lens bracket 232. Since the aperture 22 is formed in the light-through hole of the bracket 30, the lens body 231 can be supported by the lens bracket 232 and maintained in a specific position, so that the distance between the light incident surface 2311 of the lens body 231 and the light exit surface of the aperture 22 is within a set range, and the distance between the light exit surface 2312 of the lens body 231 and the spectral chip 11 is within a set range, so as to improve the stability of the spectral sensor module.

[0106] Preferably, in this preferred embodiment of the present application, the lens 23 is integrally injection-molded to form an H-shaped lens, and the material of the H lens can be glass or plastic.

[0107] Furthermore, an outer side of the lens bracket 232 of the lens 23 is provided with a light-proof material, that is, a light-shielding material.

[0108] It is worth mentioning that in another optional embodiment of the present application, the filter unit 24 is disposed below the aperture 22, that is, the filter unit 24 is attached to the inner side of the bracket 30. Alternatively, in another optional embodiment of the present application, the filter unit 24 is disposed on the light incident side of the light homogenizing unit 21, that is, the filter unit 24 is attached above the light homogenizing unit 21.

[0109] As shown in Figures 8 to 10, the filter unit 24 can be a filter or a filter film. The filter unit 24 can be disposed on the light incident surface or the light exit surface of the light homogenizing unit 21. The filter unit 24 filters out the impact of other unnecessary wavelength bands on the required light, thereby obtaining spectral information corresponding to the incident light of different wavelength bands.

[0110] To this end, the captured light is irradiated onto the upper surface of the light homogenizing unit 21, and after homogenization, passes through the diaphragm 22 arranged under the light homogenizing unit 21, and reaches the filtering unit 24 after passing through the diaphragm 22. After filtering, light of the corresponding set wavelength band is obtained and then irradiated onto the upper surface of the spectral chip 11.

[0111] It's worth noting that the aperture 22 can be a light-through hole formed during the injection molding process of a plastic part, or it can be an opaque coating formed on the upper and / or lower surfaces of the light homogenizing unit 21, forming an aperture of a predetermined size, thereby allowing light to pass only through the aperture. In short, in another optional embodiment of the present application, the aperture 22 is an opaque coating formed on the light homogenizing unit 21, wherein the coating structure has an aperture that allows incident light to pass through, and this aperture serves as the aperture of the aperture 22.

[0112] Optionally, in another optional embodiment of the present application, the aperture 22 is an opaque coating formed on the upper surface and / or lower surface of the filter unit 24, and forms an aperture hole of a set size to allow light to pass through.

[0113] The injection-molded aperture can be formed into a predetermined shape, such as a cylindrical or trapezoidal shape. The trapezoidal shape can have a large opening and a small outlet. The light homogenizing unit 21 is attached to the upper surface of the bracket 30; alternatively, the light homogenizing unit 21 is pressed against the upper surface of the bracket 30 by the cover plate 40. Alternatively, in another embodiment of the present application, the cover plate 40 has a wedge-shaped groove, and the light homogenizing unit 21 is inverted within the wedge-shaped groove of the cover plate 40.

[0114] As shown in Figure 9, in another optional embodiment of the present application, unlike the preferred embodiment described above, the filter unit 24 is disposed on the light incident surface of the aperture 22. That is, the filter unit 24 is attached to the upper end surface of the light homogenizing unit 21, and the aperture 22 is formed on the lower end surface of the light homogenizing unit 21. Incident light first strikes the filter unit 24, which then captures incident light of a predetermined wavelength band, and then homogenizes the light. To this end, the homogenizing unit 21 is disposed below the filter unit 24. The filter unit 24, the homogenizing unit 21, and the aperture 22 are sequentially disposed on the optical path from the incident light to the spectral chip 11.

[0115] In a specific example of the present application, a light homogenizing unit 21, an aperture 22, and a filter unit 24 are sequentially arranged along the optical path of incident light striking the spectral chip 11. The light homogenizing unit 21 can be a light homogenizing sheet or film, and its specific material can be polytetrafluoroethylene (PET), PTFE, glass, etc. After passing through the filter unit 24, the incident light passes through the lens body 231 of the lens 23. The lens 23 is used to refract the incident light, achieving a wider spot size for the incident light reaching the spectral chip 11.

[0116] After the lens body 231 of the lens 23 adjusts the incident light, the angle of the light incident on the spectral chip 11 is more uniform, more consistent, and less angularly sensitive. The spectral chip 11 is electrically connected to the circuit board 12. The optical device is encapsulated in the bracket 30, which is used to protect and support the formation of the optical path. The cover plate 40 can be separately provided and connected together by bonding.

[0117] The cover plate 40 is provided with a wedge-shaped groove, which is used to match the light homogenizing unit 21. The light homogenizing unit 21 is set in the wedge-shaped groove of the cover plate 40. The wedge-shaped groove can be set around the outer periphery of the light homogenizing plate, or set at four opposite corners to engage and fix the light homogenizing unit 21. It is understood that the thickness of the cover plate 40 is not less than the thickness of the light homogenizing unit 21. In this embodiment, the thickness of the cover plate 40 is the same as the thickness of the light homogenizing unit 21.

[0118] Furthermore, the circuit board 12 includes a circuit board body 121 and a substrate 122 disposed on the circuit board body 121 , wherein the spectral chip 11 is disposed on one side of the substrate 122 .

[0119] Furthermore, the spectral sensor module further includes a protective cover (not shown in the figure), which can be a Fresnel lens, cover glass, etc., for protecting the internal optical elements.

[0120] Referring to FIG. 15 of the accompanying drawings of the present application, a further embodiment is provided. The difference from the above embodiment is that the original bracket 30 is replaced by a molded body 50 in this embodiment.

[0121] In detail, the spectral sensor module includes a spectral sensing component 10, an optical component 20 arranged in the light-sensitive path of the spectral sensing component 10, and a molded body 50, wherein the spectral sensing component 10 includes a spectral chip 11 and a circuit board 12, wherein the spectral chip 11 and the circuit board 12 are point-connected, the optical component 20 is fixed to the spectral chip 11, and the molded body 50 is integrally formed on the spectral chip 11, the circuit board 12 and the optical component 20 through a molding or injection molding process, and the spectral chip 11, the circuit board 12 and the optical component 20 are fixed by the molded body 50.

[0122] It is understood that during the processing, the spectral chip 11 is attached to the surface of the circuit board 12, and the optical component 20 is fixed to the upper surface of the spectral chip 11, for example, by using adhesives. The corresponding semi-finished products are then placed in a mold, and molding material is injected into the mold. After solidification, the mold is opened to obtain the mold body 50, thereby obtaining the spectral sensor module. As shown in Figure 15, when the spectral chip 11 is fixed to the upper surface of the circuit board 12 and the optical component 20 is fixed to the spectral chip 11, the mold body 50 is formed above the circuit board 12 and around the optical component 20 and the spectral chip 11 by injection molding or molding, thereby fixing the spectral chip 11 and the optical component 20 in a specific position.

[0123] Preferably, a paneling process is adopted in the process of forming the molded body, that is, multiple semi-finished products are placed in a mold, so that the multiple semi-finished products can form a molded body together, and then cut or divided to obtain multiple individual spectral sensor modules.

[0124] Furthermore, the optical assembly described in this embodiment is consistent with the above embodiments, namely, the optical assembly 20 includes a light homogenizing unit 21 and an aperture 22. The light homogenizing unit 21 and the aperture 22 are arranged in the light-sensing path of the spectral chip 11, wherein the light homogenizing unit 21 is used to homogenize the incident light, and the aperture 22 is used to control the size of the light spot and the amount of light passing through. The light homogenizing unit 21 can be a light homogenizing sheet or a light homogenizing film, and the specific material can be polytetrafluoroethylene (PET), PTFE, glass, etc. Furthermore, the optical assembly 20 includes a lens 23, which includes a lens body 231 and a lens holder 232 that supports the lens body. The lens 23 is a one-piece structure, that is, the lens body 231 is integrally formed on the inner side of the lens holder 232. Preferably, in this preferred embodiment of the present application, the lens holder 232 is a cylindrical structure, wherein the lens body 231 is integrally formed on the inner side of the lens holder 232.

[0125] Compared with the above embodiment, this embodiment fixes the circuit board 12, the spectral chip 11 and the optical component 20 through the molded body 50, which to a certain extent reduces the overall size of the spectral sensor module, that is, is conducive to miniaturization. At the same time, the presence of the molded body 50 increases the overall strength of the spectral sensor module.

[0126] Specific scenarios, such as the consumer electronics field, have stricter size requirements for spectral sensor modules. To enable the spectral sensor module to be assembled into consumer electronic devices, there are certain height requirements for the spectral sensor module, for example, less than 1.5mm. Due to the presence of lenses and the height requirements of various components, the height of the spectral sensor module is between 1-1.5mm. In this preferred embodiment of the present application, the thickness of the uniform light film is 0.07mm, the thickness of the glass substrate and the aperture formed on the glass substrate is 0.2mm, the lens height is 0.5mm, the thickness of the spectral chip is 0.15mm, the thickness of the circuit board is 0.2-0.3mm, and the thickness of the adhesive can be between 0.005-0.01mm.

[0127] According to another aspect of the present application, the present invention further provides an electronic device, comprising an electronic device host and a spectral sensor module mounted on the electronic device host, wherein the spectral sensor module is the same as the spectral sensor module of the preferred embodiment described above. The electronic device can be, but is not limited to, a facial recognition device, a mobile phone, a computer, or other intelligent camera device.

[0128] It is understandable that the electronic device receives incident light through the spectral chip 11 of the spectral sensor module, modulates the incident light to obtain a response signal, and obtains spectral information of the incident light using the response signal and a calculated spectrum recovery algorithm.

[0129] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. Spectral sensor module, characterized in that: include: A spectrum sensing component, comprising a spectrum chip and a circuit board, wherein the spectrum chip is electrically connected to the circuit board; Bracket; An optical component is arranged on the bracket and supported in the light-sensitive path of the spectral chip, wherein the optical component includes a light-homogenizing unit, an aperture and a lens arranged in sequence along the optical axis direction of the spectral chip, so that the incident light is guided to the light-entering surface of the spectral chip through the light-homogenizing unit, the aperture and the lens of the optical component. 2 . The spectral sensor module according to claim 1 , wherein the lens comprises a lens body and a lens holder supporting the lens body, and the lens body is supported by the lens holder between the aperture and the spectral chip. 3 . The spectral sensor module according to claim 2 , wherein the lens body and the lens holder are an integrated structure, and the lens body is integrally formed on the inner side of the lens holder. 4 . The spectral sensor module according to claim 1 , wherein the lens body comprises a light incident surface and a light exiting surface, and at least one of the light incident surface and the light exiting surface of the lens body is an aspherical surface.

5. The spectral sensor module according to claim 4, wherein along the direction of the main optical axis, the distance between the light incident surface of the lens body and the light exit surface of the aperture is set to D1, and the distance between the light exit surface of the lens body and the light incident surface of the spectral chip is set to D2, the distance D1 is related to the curvature radius of the light surface and the aperture L of the aperture, and the distance D2 is related to the curvature radius of the light exit surface.

6. The spectral sensor module according to claim 4, wherein the curved surface of the light incident surface is composed of any point (x1, y1) on the curved surface, wherein y1 is determined by parameters x1 and r1, and the curved surface of the light exiting surface is composed of any point (x2, y2), wherein y2 is determined by x2 and r2, and y1=f font (x,r1,K1,d1,e1,h1),y2=f back (x, r2, K2, d2, e2, h2), where K1 and K2 are the conic parameters of the aspheric surface, and d1, e1, h1, d2, e2, h2 are polynomial coefficients. 7 . The spectral sensor module according to claim 5 , wherein the distance D2 determines the angle between the light guided onto the spectral chip and the main optical axis.

8. The spectral sensor module according to claim 5, wherein the distance D2 determines the uniformity of the light directed onto the spectral chip and the intensity of the light spot, wherein the uniformity refers to the size of the light spot with consistent intensity and angle directed onto the spectral chip.

9. The spectral sensor module according to claim 1, wherein the bracket includes a first bracket unit and a second bracket unit, wherein the first bracket unit is arranged on the outside of the spectral chip, the second bracket unit is located above the first bracket unit, and the second bracket unit has a light hole, and the aperture of the optical component is formed by the second bracket unit. 10 . The spectral sensor module according to claim 1 , wherein the optical assembly further comprises a filter unit, wherein the filter unit is disposed between the aperture and the lens.

11. The spectral sensor module according to claim 10, wherein the lens bracket further comprises a supporting end and a fixing end integrally extending downward from the supporting end, wherein the fixing end of the lens bracket is fixed to the circuit board of the spectral sensing component. 12 . The spectral sensor module according to claim 11 , wherein the filter unit is supported by the lens holder of the lens between the lens body and the aperture. 13 . The spectral sensor module according to claim 11 , wherein the filter unit is attached to an inner surface of the bracket, and the filter unit is held inside the lens bracket of the lens. The spectral sensor module according to claim 11 , wherein a light shielding material is provided on the outer side of the lens holder. 15 . The spectral sensor module according to claim 1 , wherein the optical component further comprises a light homogenizing unit, wherein the light homogenizing unit is disposed on the light incident side of the aperture, and an opaque layer is disposed on the light homogenizing unit. 16 . The spectral sensor module according to claim 15 , wherein the light homogenizing unit is provided on a portion of the light-opaque layer, and the aperture is provided on a light-transmitting portion of the light-transmitting light homogenizing unit. 17 . The spectral sensor module according to claim 15 , wherein the aperture is provided at a plurality of light-transmitting parts of the light-dodging unit at different positions. 18 . The spectral sensor module according to claim 16 , further comprising a cover plate, wherein the cover plate is disposed above the bracket, the cover plate has a wedge-shaped groove, and the light homogenizing unit is inverted in the wedge-shaped groove of the cover plate.

19. Spectral sensor module, characterized in that: include: A spectrum sensing component, comprising a spectrum chip and a circuit board, wherein the spectrum chip is electrically connected to the circuit board; An optical assembly fixed to a spectral chip, wherein the optical assembly includes a light homogenizing unit, an aperture, and a lens sequentially arranged along the optical axis of the spectral chip, so that incident light is guided to a light incident surface of the spectral chip via the light homogenizing unit, the aperture, and the lens of the optical assembly; as well as A molded body, wherein the molded body is integrally formed with the spectral chip, the circuit board, and the optical component, and is used to fix the spectral chip, the circuit board, and the optical component. 20 . The spectral sensor according to claim 19 , wherein the lens comprises a lens body and a lens holder supporting the lens body, wherein the lens is an integrated structure, ie, the lens body is integrally formed inside the lens holder.

21. An electronic device, characterized in that include: Electronic device body; and The spectral sensor module according to any one of claims 1 to 20, wherein the spectral sensor module is mounted on the electronic device body and electrically connected to the electronic device body.

Images