Connector device

Abstract

The present invention easily releases heat of an IC built in a connector. A connector device (1) is provided with: a circuit board (10); a connector (20) provided on the circuit board (10); and a housing (70) that houses the circuit board (10) and at least a portion of the connector (20). The connector (20) has a sub-substrate (35), an IC (36) mounted on the sub-substrate (35), and a heat transfer unit (e.g., a heat sink (39) and a shield cover (38)) that transfers heat of the IC (36) to the housing (70).

Description

Technical Field

[0001] The present disclosure relates to a connector device. Background Art

[0002] A board connector provided on a board is disclosed in Patent Document 1.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2021-061188 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] When an IC (Integrated Circuit) is built in such a connector, heat generation of the IC becomes a problem.

[0008] An object of the present disclosure is to provide a technique for easily releasing heat of an IC built in a connector.

[0009] Means for Solving the Problems

[0010] The connector device of the present disclosure includes: a circuit board; a connector provided on the circuit board; and a housing that houses at least a part of the circuit board and the connector, wherein the connector has a sub-board, an IC mounted on the sub-board, and a heat transfer portion that transfers heat of the IC to the housing.

[0011] Effects of the Invention

[0012] According to the connector device of the present disclosure, heat of an IC built in the connector can be easily released. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a perspective view of the connector device according to the first embodiment.

[0014] Figure 2 is an exploded perspective view of the connector device with a partial cutaway.

[0015] Figure 3 is an exploded perspective view of the relay connector portion.

[0016] Figure 4 is an exploded perspective view of the housing.

[0017] Figure 5It is a top view cross-sectional view of a connector device obtained by cutting along the plane of the fastening portion of the bolt.

[0018] Figure 6 It is Figure 5 a cross-sectional view taken along line A-A.

[0019] Figure 7 It is Figure 5 a cross-sectional view taken along line B-B.

[0020] Figure 8 It is a top view cross-sectional view of the connector device in the second embodiment obtained by cutting along the plane of the fastening portion of the bolt.

[0021] Figure 9 It is a view corresponding to Figure 7 of the connector device in the third embodiment.

[0022] Figure 10 It is Figure 9 a cross-sectional view taken along line C-C.

[0023] Figure 11 It is a view corresponding to Figure 7 of the connector device in the fourth embodiment.

[0024] Figure 12 It is Figure 11 a cross-sectional view taken along line D-D.

[0025] Figure 13 It is a view corresponding to Figure 6 of the connector device in the fifth embodiment.

[0026] Figure 14 It is Figure 13 a cross-sectional view taken along line E-E. Detailed implementation manners

[0027] [Description of the embodiments of the present disclosure]

[0028] First, the embodiments of the present disclosure will be listed and described.

[0029] 〔1〕A connector device includes: a circuit board; a connector provided on the circuit board; and a housing that houses at least a part of the circuit board and the connector, wherein the connector has a sub-board, an IC mounted on the sub-board, and a heat transfer portion that transfers the heat of the IC to the housing.

[0030] According to this structure, the heat of the IC can be released to the housing via the heat transfer portion.

[0031] 〔2〕The connector device according to 〔1〕, wherein, the connector has a shielding cover covering the IC, the shielding cover forms at least a part of the heat transfer portion.

[0032] With this structure, the heat of the IC can be released to the housing by the shielding cover covering the IC.

[0033] 〔3〕The connector device according to 〔2〕, wherein, the housing has an opening, the shielding cover has: an extended portion extending to the outside of the housing through the opening; and a cover-side protruding portion extending along the outer surface of the housing from the front end of the extended portion, the cover-side protruding portion is fixed to the outer surface of the housing using bolts.

[0034] With this structure, the cover-side protruding portion can be fixed to the housing from the outside of the housing using bolts. Thus, the cover-side protruding portion is pressed against the housing, and heat is more easily transferred from the shielding cover to the housing.

[0035] 〔4〕The connector device according to 〔3〕, wherein, the connector has an outer conductor fixed to the outer surface of the housing, the outer conductor and the cover-side protruding portion are jointly fastened to the outer surface of the housing using the bolts.

[0036] With this structure, the shielding cover can be pressed against the housing by the structure for fixing the outer conductor to the housing.

[0037] 〔5〕The connector device according to 〔2〕, wherein, the shielding cover has an elastically deformable elastic contact piece and is arranged in a state of being pressed against the housing by the elastic force of the elastic contact piece.

[0038] With this structure, the shielding cover is pressed against the housing, and heat is more easily transferred from the shielding cover to the housing.

[0039] 〔6〕The connector device according to 〔1〕, wherein, the connector has an outer conductor forming at least a part of the heat transfer portion.

[0040] With this structure, the heat of the IC can be released to the housing by the outer conductor of the connector.

[0041] 〔7〕The connector device according to any one of 〔1〕 to 〔6〕, wherein, the heat transfer portion is made of metal.

[0042] According to this structure, the heat of the IC is more easily transferred to the housing.

[0043] [8] The connector device according to any one of [1] to [7], wherein the connector has a mounting connector portion mounted on the circuit board and a relay connector portion connected to the mounting connector portion, the sub-board and the IC are provided in the relay connector portion.

[0044] According to this structure, by preparing a plurality of relay connector portions with different types of mounted ICs, a connector corresponding to a variety of communication specifications can be configured according to the type of the relay connector portion connected to the mounting connector portion.

[0045] [Details of the embodiments of the present disclosure]

[0046] Hereinafter, specific examples of the present disclosure will be described with reference to the drawings. It should be noted that the present invention is not limited to these examples, and is represented by the claims, and is intended to include all changes within the meaning and scope equivalent to the claims.

[0047] [First Embodiment]

[0048] [Outline of the connector device 1]

[0049] Figure 1 The connector device 1 of the first embodiment is disclosed. The connector device 1 is mounted on a vehicle, for example. As Figure 2 shown, the connector device 1 includes a circuit board 10, a connector 20 provided on the circuit board 10, and a housing 70 that houses at least a part of the circuit board 10 and the connector 20.

[0050] In the present embodiment, the side where the connector 20 is provided with respect to the circuit board 10 is defined as the upper side. The side where the other-side connector (not shown) is fitted with respect to the connector 20 is defined as the front side. The direction orthogonal to the vertical direction and the front-rear direction is defined as the width direction. In the drawings, the upper side, the lower side, the front side, and the rear side are respectively marked as "U", "L", "F", and "B".

[0051] [Circuit board 10]

[0052] As Figure 2 shown, the circuit board 10 is plate-shaped. The thickness direction of the circuit board 10 is the vertical direction. A mounting surface 11 is formed on the circuit board 10. The mounting surface 11 is formed on the upper surface of the circuit board 10.

[0053] [Connector 20]

[0054] The connector 20 is a board connector provided on the circuit board 10. AsFigure 2 As shown, the connector 20 has a mounting connector portion 21 mounted on the circuit board 10 and a relay connector portion 22 connected to the mounting connector portion 21.

[0055] As Figure 2 shown, the mounting connector portion 21 is configured as a card-edge connector, for example. The relay connector portion 22 is detachably connected to the mounting connector portion 21. An insertion groove is formed on the front surface of the mounting connector portion 21. The relay connector portion 22 is connected to the mounting connector portion 21 by inserting the relay connector portion 22 into the insertion groove from the front.

[0056] A mating connector (not shown) is connected to the relay connector portion 22. A plurality of relay connector portions 22 are prepared in advance according to, for example, the number of in-vehicle devices and the communication specifications (such as communication speed, etc.) of the vehicle. And by connecting the relay connector portion 22 corresponding to the specifications of the vehicle to which it is mounted to the mounting connector portion 21, the connector device 1 can accommodate multiple types of vehicles.

[0057] As Figure 3 shown, the relay connector portion 22 has a fitting member 31, an inner conductor 32, an outer conductor 33, a dielectric 34, a sub-board 35, an IC (Integrated Circuit) 36, a relay portion 37, a shielding cover 38, a heat sink 39, a first fixing member 40A, and a second fixing member 40B.

[0058] As Figure 3 shown, the fitting member 31 fits with a mating connector (not shown). The fitting member 31 has insulation and is made of resin, for example. The fitting member 31 has a square tubular cover portion 31A and a rear wall portion 31B that covers the rear surface of the cover portion 31A.

[0059] The inner conductor 32 has conductivity and is made of metal, for example. As Figure 3 shown, the inner conductor 32 extends in the front-rear direction. A plurality of inner conductors 32 are provided at intervals in a direction orthogonal to the front-rear direction. As Figure 6 shown, the front end portion of the inner conductor 32 projects into the cover portion 31A, and the rear end portion of the inner conductor 32 projects rearward beyond the rear wall portion 31B. The inner conductor 32 is electrically connected to the conductive path of the sub-board 35 via the relay portion 37.

[0060] The outer conductor 33 has conductivity and is made of metal, for example. As Figure 3 shown, the outer conductor 33 has a first outer conductor member 41 and a second outer conductor member 42. The second outer conductor member 42 is connected to the first outer conductor member 41 by being clamped to the first outer conductor member 41.

[0061] The first outer conductor member 41 covers the outer periphery of the inner conductor 32. The first outer conductor member 41 has a wall portion 43 having a thickness in the front-rear direction. An inner conductor insertion hole 44 through which the inner conductor 32 is inserted is formed in the wall portion 43. The first outer conductor member 41 has a cylindrical portion 45 that protrudes forward in a cylindrical shape from the peripheral edge portion of the inner conductor insertion hole 44. The cylindrical portion 45 penetrates through the rear wall portion 31B of the fitting member 31 and protrudes into the cover portion 31A. As Figure 5 shown, the first outer conductor member 41 has an outer conductor side protruding portion 46 fixed to the housing 70. The outer conductor side protruding portion 46 protrudes from the upper and lower centers on both sides in the width direction of the wall portion 43 toward both sides in the width direction. The outer conductor side protruding portion 46 extends along the outer surface 70A of the housing 70. A through hole 46A through which a bolt 80 passes is formed in the outer conductor side protruding portion 46. The outer conductor side protruding portion 46 is fixed to the housing 70 using the bolt 80. As Figure 3 shown, the first outer conductor member 41 has a locking portion 47 for locking the second outer conductor member 42. The locking portion 47 is provided at a position rearward of the wall portion 43.

[0062] The second outer conductor member 42 is locked to the locking portion 47 and is disposed on the rear side of the first outer conductor member 41. As Figure 3 and Figure 6 shown, the second outer conductor member 42 has an outer conductor bottom portion 48 and mounting portions 49 that stand up upward from both sides in the width direction of the outer conductor bottom portion 48. The outer conductor bottom portion 48 is plate-shaped. The plate thickness direction of the outer conductor bottom portion 48 is the up-down direction. The sub-substrate 35 is mounted so as to be supported by the mounting portions 49 on both sides in the width direction. The second outer conductor member 42 and the sub-substrate 35 are fixed to the circuit board 10 by the above-described first fixing member 40A. The first fixing member 40A includes a male screw portion 40C, a head portion 40D provided at the base end portion of the male screw portion 40C, and a female screw portion 40E recessed and formed at the base end portion of the head portion 40D. The male screw portion 40C is inserted from above through the insertion hole 35A of the sub-substrate 35 and the insertion hole 48A of the outer conductor bottom portion 48, and is screwed and fastened to the mounting hole 10A of the circuit board 10. Thereby, the sub-substrate 35 and the second outer conductor member 42 are fixed to the circuit board 10.

[0063] As Figure 6 shown, the dielectric 34 is disposed between the inner conductor 32 and the outer conductor 33.

[0064] As Figure 6 shown, the sub-substrate 35 is plate-shaped. The sub-substrate 35 is arranged in parallel with the circuit board 10. The plate thickness direction of the sub-substrate 35 is the up-down direction. The sub-substrate 35 is a substrate built into the connector 20. The sub-substrate 35 is detachably connected to the mounting connector portion 21. As Figure 5 shown, the sub-substrate 35 has a sub-substrate main body 51 and a sub-ground circuit 52.

[0065] As Figure 3 shown, the sub - substrate main body 51 is plate - shaped. The sub - substrate main body 51 has insulation properties and is made of resin, for example. A sub - mounting surface 53 is formed on the sub - substrate main body 51. The sub - mounting surface 53 is formed on the upper surface of the sub - substrate main body 51.

[0066] As Figure 5 and Figure 7 shown, the sub - ground circuit 52 is provided on the sub - substrate main body 51 (more specifically, the sub - mounting surface 53). An IC 36 mounted on the sub - mounting surface 53 is electrically connected to the sub - ground circuit 52. The sub - ground circuit 52 has a sub - extended circuit 54 that extends in the front - rear direction along the sub - mounting surface 53. A plurality of sub - extended circuits 54 are provided at intervals in the width direction.

[0067] The IC 36 is configured to resin - mold an IC chip. As Figure 6 shown, the IC 36 is mounted on the sub - mounting surface 53 (upper surface) of the sub - substrate 35.

[0068] The shielding cover 38 has conductivity and is made of metal, for example. The shielding cover 38 is formed by bending a metal plate, for example. As Figure 3 and Figure 5 shown, the shielding cover 38 has a cover main body 38A, a pair of extended portions 38B, and a pair of cover - side protruding portions 38C. The cover main body 38A covers the IC 36 from above. In addition, the cover main body 38A covers the IC 36 in the front - rear direction and the width direction. The pair of extended portions 38B are formed to extend forward from both sides in the width direction of the cover main body 38A. The pair of cover - side protruding portions 38C protrude from the front - end portions of the pair of extended portions 38B so as to be separated from each other in the width direction.

[0069] The heat sink 39 is made of resin such as silicon or acrylic, for example. As Figure 6 shown, the heat sink 39 is disposed in a state of being sandwiched vertically between the IC 36 and the shielding cover 38. The heat sink 39 is disposed in a state of being in contact with the IC 36 and the shielding cover 38.

[0070] As Figure 3 shown, the second fixing member 40B includes a male screw portion 40F and a head 40G provided at the base end portion of the male screw portion 40F. As Figure 6 shown, the male screw portion 40F is inserted through the insertion hole 38D of the shielding cover 38 from above and screwed into and fastened to the female screw portion 40E of the first fixing member 40A. Thus, the shielding cover 38 is fixed to the sub - substrate 35.

[0071] (Housing 70)

[0072] The housing 70 has conductivity and is made of metal, for example. As Figure 1As shown, the housing 70 is box-shaped. As Figure 2 and Figure 6 shown, the housing 70 houses the circuit board 10 and a part of the connector 20. The housing 70 has an opening 71. The relay connector portion 22 is inserted into the housing 70 through the opening 71 and is connected to the mounting connector portion 21 mounted on the circuit board 10.

[0073] As Figure 4 shown, the housing 70 has a housing main body 72 and a cover 73. The housing main body 72 houses the circuit board 10 and a part of the connector 20. A board insertion port 74 is formed in the housing main body 72. The circuit board 10 is inserted into the housing main body 72 through the board insertion port 74.

[0074] As Figure 1 and Figure 4 shown, the cover 73 covers the board insertion port 74. The cover 73 is fixed to the housing main body 72. The cover 73 is fixed to the housing main body 72 using housing bolts 75. A plurality (four in this embodiment) of housing bolts 75 are inserted through insertion holes 76 at a plurality of portions (four portions in this embodiment) of the cover 73 and are screwed into and fastened to housing-side mounting holes 77 of the housing main body 72. The above-described opening 71 is provided in the cover 73.

[0075] As Figure 5 shown, the relay connector portion 22 inserted through the opening 71 is fixed to the outer surface 70A of the housing 70 using a bolt 80. Mounting holes 78 are formed in the outer surface 70A of the housing 70. The mounting holes 78 are provided on both sides in the width direction of the opening 71. A pair of cover-side protruding portions 38C of the shielding cover 38 are disposed behind a pair of outer-conductor-side protruding portions 46. Through holes 38E penetrating the cover-side protruding portions 38C in the front-rear direction are formed in the respective cover-side protruding portions 38C. Through holes 46A penetrating the outer-conductor-side protruding portions 46 in the front-rear direction are formed in the respective outer-conductor-side protruding portions 46. The through holes 38E and the through holes 46A are arranged in the front-rear direction. The bolt 80 penetrates through the through hole 46A and the through hole 38E and is screwed into and fastened to the mounting hole 78. Thereby, the outer conductor 33 and the cover-side protruding portions 38C are jointly fastened to the outer surface 70A of the housing 70.

[0076] (Functions and Effects of the Connector Device 1)

[0077] As Figure 6 shown, the IC 36 is in contact with the heat sink 39, and the heat sink 39 is in contact with the shielding cover 38. As Figure 5As shown, the extended portion 38B of the shielding cover 38 extends to the outside of the housing 70 via the opening 71. The cover-side protruding portion 38C protruding from the extended portion 38B is fixed to the outer surface of the housing 70 using bolts 80. Therefore, the heat of the IC 36 is transferred to the housing 70 via the heat sink 39 and the shielding cover 38. Thus, according to this structure, the heat of the IC 36 can be released to the housing 70 via the heat sink 39 and the shielding cover 38. In addition, by fixing the cover-side protruding portion 38C to the housing 70 using bolts 80, the cover-side protruding portion 38C is pressed against the housing 70. Therefore, heat is more easily transferred from the shielding cover 38 to the housing 70. Moreover, the cover-side protruding portion 38C and the outer conductor 33 are fastened to the housing 70 together. That is, according to this structure, by using the structure of fixing the outer conductor 33 to the housing 70, the shielding cover 38 can be pressed against the housing 70.

[0078] In addition, the IC 36 is electrically connected to the sub-grounding circuit 52. As Figure 7 shown, the sub-extended circuit 54 of the sub-grounding circuit 52 is electrically connected to the cover body 38A of the shielding cover 38. As Figure 6 shown, the shielding cover 38 is electrically connected to the housing 70 by fixing the cover-side protruding portion 38C to the housing 70 using bolts 80. Therefore, the heat of the IC 36 is transferred to the housing 70 via the sub-grounding circuit 52 and the shielding cover 38. Thus, according to this structure, the heat of the IC 36 can be released to the housing 70 via the sub-grounding circuit 52 and the shielding cover 38. Moreover, the sub-grounding circuit 52 and the shielding cover 38 are made of metal. Therefore, the heat of the IC 36 is more easily transferred to the housing 70.

[0079] <Second Embodiment>

[0080] In the second embodiment, a structure in which the shielding cover contacts the inner surface of the housing will be described. In addition, in the description of the second embodiment, the same reference numerals are given to the same structures as those in the first embodiment, and the detailed description thereof is omitted.

[0081] As Figure 8 shown, the connector device 201 of the second embodiment includes a shielding cover 238 instead of the shielding cover 38 of the first embodiment. The connector device 201 of the second embodiment is otherwise common to the connector device 1 of the first embodiment.

[0082] The shielding cover 238 has electrical conductivity and is made of metal, for example. The shielding cover 238 is formed by bending a metal plate, for example. The shielding cover 238 has a cover body 38A, a pair of arm portions 238B, and a pair of elastic contact pieces 238C. The pair of arm portions 238B extend forward from both sides in the width direction of the cover body 38A. The pair of elastic contact pieces 238C turn back outward in the width direction from the tip portions of the pair of arm portions 238B. Each elastic contact piece 238C is cantilever-supported by each arm portion 238B and flexes and deforms in the width direction with each arm portion 238B as a fulcrum.

[0083] The shielding cover 238 is inserted into the opening 71 of the housing 70 in a state where the pair of elastic contact pieces 238C are flexed inward in the width direction. In a state where the shielding cover 238 is inserted into the opening 71, the pair of elastic contact pieces 238C are deformed by the elastic force so as to expand outward in the width direction and press the inner peripheral surface of the opening 71. That is, the elastic contact pieces 238C are pressed against the inner surface 70B of the housing 70.

[0084] As described above, in the connector device 201 of the second embodiment, the elastic contact piece 238C of the shielding cover 238 contacts the inner surface 70B of the housing 70. According to this structure, the heat of the IC 36 transmitted to the shielding cover 238 can be released to the housing 70. Moreover, the elastic contact piece 238C is arranged in a state of being pressed against the housing 70 by the elastic force of the elastic contact piece 238C. According to this structure, heat is more easily transferred from the shielding cover 238 to the housing 70.

[0085] <Third Embodiment>

[0086] In the third embodiment, another structure for bringing the shielding cover into contact with the inner surface of the housing will be described. In addition, in the description of the third embodiment, the same reference numerals are given to the same structures as those in the first embodiment, and the detailed description thereof is omitted.

[0087] As Figure 9 shown, the connector device 301 of the third embodiment includes a circuit board 10, a connector 320 provided on the circuit board 10, and a housing 370 that houses a part of the circuit board 10 and the connector 320. The connector 320 is different from the connector 20 of the first embodiment in that it has a shielding cover 338 instead of the shielding cover 38, and is otherwise common. The housing 370 is different from the housing 70 of the first embodiment in that the top wall 371 is stepped, and is otherwise common.

[0088] The shielding cover 338 has electrical conductivity and is made of metal, for example. The shielding cover 338 is formed by bending a metal plate, for example. As Figure 9 and Figure 10As shown, the shielding cover 338 covers the IC 36 from above. The shielding cover 338 has a front plate portion 340, a rear plate portion 341, a pair of side plate portions 342, a top plate portion 343, and a protruding portion 344. The front plate portion 340 covers the front side of the IC 36. The rear plate portion 341 covers the rear side of the IC 36. The pair of side plate portions 342 cover both sides in the width direction of the IC. The top plate portion 343 covers the upper side of the IC 36. The top plate portion 343 is connected to the upper end portions of the front plate portion 340, the rear plate portion 341, and the pair of side plate portions 342 respectively. The protruding portion 344 protrudes upward from the top plate portion 343. The protruding portion 344 is provided on both sides in the width direction of the top plate portion 343. The protruding portion 344 is formed, for example, by cutting up a metal plate.

[0089] The top wall 371 of the housing 370 has a first top wall portion 372, a second top wall portion 373, and a stepped portion 374. The second top wall portion 373 is connected to the first top wall portion 372 via the stepped portion 374 and is disposed at a position lower than the first top wall portion 372. The protruding portion 344 contacts the lower surface of the second top wall portion 373. That is, the shielding cover 338 contacts the inner surface 370B of the housing 370.

[0090] As Figure 9 shown, a heat sink 39 is sandwiched between the top plate portion 343 of the shielding cover 338 and the IC 36. The heat sink 39 is disposed in a state of contacting the top plate portion 343 of the shielding cover 338 and the IC 36. The heat of the IC 36 is transferred to the shielding cover 338 via the heat sink 39.

[0091] As Figure 9 shown, the front plate portion 340 of the shielding cover 338 is electrically connected to the sub-ground circuit 52. Therefore, the heat of the IC 36 is transferred to the shielding cover 338 via the sub-ground circuit 52.

[0092] The heat transferred to the shielding cover 338 is transferred from the protruding portion 344 to the housing 370. That is, according to the connector device 301 of the third embodiment, it is possible to use the shielding cover 338 to retreat to the inner surface 370B of the housing 370.

[0093] <Fourth Embodiment>

[0094] In the fourth embodiment, a structure that can release the heat of the IC to the housing without using a shielding cover will be described. In addition, in the description of the fourth embodiment, the same reference numerals are given to the same structures as those in the first embodiment, and the detailed description is omitted.

[0095] As Figure 11As shown, the connector device 401 of the fourth embodiment includes a circuit board 10, a connector 420 provided on the circuit board 10, and a housing 470 that houses a part of the circuit board 10 and the connector 420. The connector 420 is different from the connector 20 of the first embodiment in that it has a conductive member 440 instead of the shielding cover 38, and is otherwise common. The housing 470 is different from the housing 70 of the first embodiment in that the top wall 471 is stepped, and is otherwise common.

[0096] The top wall 471 of the housing 470 has a first top wall portion 472, a second top wall portion 473, and a stepped portion 474. The second top wall portion 473 is connected to the first top wall portion 472 via the stepped portion 474 and is disposed at a position lower than the first top wall portion 472.

[0097] As Figure 12 shown, the conductive members 440 are respectively provided on the sub-extension circuits 54 on both sides in the width direction. Each conductive member 440 is disposed between the sub-ground circuit 52 of the sub-board 35 and the second top wall portion 473 and is electrically connected to the sub-ground circuit 52 and the second top wall portion 473. The conductive member 440 has a contact conductive portion 441 that contacts the second top wall portion 473, a biasing member 442 disposed between the contact conductive portion 441 and the sub-ground circuit 52, and a guiding portion 443 that guides the contact conductive portion 441 in the vertical direction. The biasing member 442 is, for example, a spring member that biases the contact conductive portion 441 in a direction away from the sub-ground circuit 52. The contact conductive portion 441 is pressed against the second top wall portion 473. That is, the conductive member 440 is pressed against the sub-ground circuit 52 and the inner surface 470B of the housing 470.

[0098] As described above, in the connector device 401 of the fourth embodiment, the IC 36 is electrically connected to the sub-ground circuit 52. The conductive member 440 contacts the sub-ground circuit 52, and the housing 470 contacts the conductive member 440. According to this structure, the heat of the IC 36 can be released to the housing 470 via the sub-ground circuit 52 and the conductive member 440. Moreover, the conductive member 440 is pressed against the sub-ground circuit 52 and the housing 470. According to this structure, the heat of the IC 36 is more easily transferred to the housing 470 via the sub-ground circuit 52 and the conductive member 440.

[0099] <Fifth Embodiment>

[0100] In the fifth embodiment, a structure that can release the heat of an IC to a housing using an outer conductor of a connector will be described. In addition, in the description of the fifth embodiment, the same reference numerals are given to the same structures as those in the first embodiment, and detailed descriptions thereof are omitted.

[0101] As Figure 13As shown, the connector device 501 of the fifth embodiment includes a circuit board 10, a connector 520 provided on the circuit board 10, and a housing 70 that houses a part of the circuit board 10 and the connector 520.

[0102] The connector 520 is common to the connector 20 of the first embodiment in that it includes a sub-board 535 in place of the sub-board 35, includes a heat sink 539 in place of the heat sink 39, and the outer conductor side protrusion 46 of the outer conductor 33 is individually fixed to the housing 70. The connector 520 is common to the connector 20 of the first embodiment in other aspects.

[0103] As Figure 13 and Figure 14 shown, the sub-board 535 has a sub-board main body 51 and a sub-ground circuit 552. The sub-ground circuit 552 is provided on the sub-board main body 51 (more specifically, the sub-mounting surface 53). An IC 36 mounted on the sub-mounting surface 53 is electrically connected to the sub-ground circuit 552. The sub-ground circuit 552 has a sub-extended circuit 554 that extends in the front-rear direction along the sub-mounting surface 53. A plurality of sub-extended circuits 554 are provided at intervals in the width direction. The sub-extended circuits 554 are provided on both the upper and lower surfaces of the sub-board main body 51. The sub-extended circuits 554 on the upper and lower surfaces are electrically connected via via holes 555 that penetrate the sub-board main body 51 in the thickness direction.

[0104] The heat sink 539 is provided between the sub-extended circuit 554 provided on the lower surface of the sub-board main body 51 and the upper surface of the outer conductor bottom 48 of the outer conductor 33, and contacts the sub-extended circuit 554 and the outer conductor bottom 48.

[0105] The outer conductor side protrusion 46 of the outer conductor 33 is fixed to the housing 70 using bolts 80 (see Figure 8 ). Thus, the outer conductor 33 contacts the housing 70 in a state of being pressed by the housing 70.

[0106] As described above, in the connector device 501 of the fifth embodiment, the IC 36 is electrically connected to the sub-ground circuit 552. The sub-ground circuit 552 contacts the heat sink 539, and the heat sink 539 contacts the outer conductor 33. The outer conductor 33 contacts the housing 70. According to this structure, the heat of the IC 36 can be released to the housing 70 via the sub-ground circuit 552, the heat sink 539, and the outer conductor 33. Moreover, the outer conductor side protrusion 46 of the outer conductor 33 is pressed by the housing 70. According to this structure, the heat of the outer conductor 33 is easily transferred to the housing 70.

[0107] [Other Embodiments of the Present Disclosure]

[0108] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive.

[0109] (1) In each of the above embodiments, the connector has a structure in which the mounting connector portion and the relay connector portion are independent of each other, but it may also have a structure in which the mounting connector portion and the relay connector portion are integrated.

[0110] Reference Numerals

[0111] 1... Connector device

[0112] 10... Circuit board

[0113] 10A... Mounting hole

[0114] 11... Mounting surface

[0115] 20... Connector

[0116] 21... Mounting connector portion

[0117] 22... Relay connector portion

[0118] 31... Fitting member

[0119] 31A... Cover portion

[0120] 31B... Rear wall portion

[0121] 32... Inner conductor

[0122] 33... Outer conductor

[0123] 34... Dielectric

[0124] 35... Substrate

[0125] 35A... Insertion through hole

[0126] 36... IC

[0127] 37... Relay portion

[0128] 38... Shield cover

[0129] 38A... Cover body

[0130] 38B... Extension portion

[0131] 38C... Cover side protruding portion

[0132] 38D... Insertion through hole

[0133] 38E... Through hole

[0134] 39... Heat sink

[0135] 40A... First fixing member

[0136] 40B... Second fixing member

[0137] 40C…Male threaded portion

[0138] 40D…Head portion

[0139] 40E…Female threaded portion

[0140] 40F…Male threaded portion

[0141] 40G…Head portion

[0142] 41…First outer conductor member

[0143] 42…Second outer conductor member

[0144] 43…Wall portion

[0145] 44…Inner conductor insertion hole

[0146] 45…Cylindrical portion

[0147] 46…Outer conductor side protruding portion

[0148] 46A…Through hole

[0149] 47…Engaging portion

[0150] 48…Outer conductor bottom

[0151] 48A…Insertion hole

[0152] 49…Mounting portion

[0153] 51…Substrate main body

[0154] 52…Sub-grounding circuit

[0155] 53…Sub-mounting surface

[0156] 54…Sub-extended circuit

[0157] 70…Housing

[0158] 70A…Outer surface

[0159] 70B…Inner surface

[0160] 71…Opening portion

[0161] 72…Housing main body

[0162] 73…Cover

[0163] 74…Substrate insertion port

[0164] 75…Housing bolt

[0165] 76…Insertion hole

[0166] 77…Housing side mounting hole

[0167] 78… Mounting hole

[0168] 80… Bolt

[0169] 201… Connector device

[0170] 238… Shielding cover

[0171] 238B… Arm

[0172] 238C… Elastic contact piece

[0173] 301… Connector device

[0174] 320… Connector

[0175] 338… Shielding cover

[0176] 340… Front plate part

[0177] 341… Rear plate part

[0178] 342… Side plate part

[0179] 343… Top plate part

[0180] 344… Protrusion

[0181] 370… Housing

[0182] 370B… Inner surface

[0183] 371… Top wall

[0184] 372… First top wall part

[0185] 373… Second top wall part

[0186] 374… Step part

[0187] 401… Connector device

[0188] 420… Connector

[0189] 440… Conductive member

[0190] 441… Contact conductive part

[0191] 442… Biasing member

[0192] 443… Guide part

[0193] 470… Housing

[0194] 470B… Inner surface

[0195] 471… Top wall

[0196] 472… First top wall part

[0197] 473…Second top wall part

[0198] 474…Step part

[0199] 501…Connector device

[0200] 520…Connector

[0201] 535…Substrate

[0202] 539…Heat sink

[0203] 552…Sub-ground circuit

[0204] 554…Sub-extension circuit

[0205] 555…Via hole

Claims

1. A connector device, comprising: A circuit board; A connector provided on the circuit board; and A housing that houses at least a part of the circuit board and the connector, The connector has a sub-board, an IC mounted on the sub-board, and a heat transfer portion that transfers heat of the IC to the housing.

2. The connector device according to claim 1, wherein The connector has a shielding cover that covers the IC, The shielding cover constitutes at least a part of the heat transfer portion.

3. The connector device according to claim 2, wherein The housing has an opening, The shielding cover has: an extended portion that extends outward from the housing through the opening; and a cover-side protruding portion that extends along the outer surface of the housing from the front end of the extended portion, The cover-side protruding portion is fixed to the outer surface of the housing using bolts.

4. The connector device according to claim 3, wherein The connector has an outer conductor fixed to the outer surface of the housing, The outer conductor and the cover-side protruding portion are jointly fastened to the outer surface of the housing using the bolts.

5. The connector device according to claim 2, wherein The shielding cover has an elastically deformable elastic contact piece and is arranged in a state of being pressed against the housing by the elastic force of the elastic contact piece.

6. The connector device according to claim 1, wherein The connector has an outer conductor that constitutes at least a part of the heat transfer portion.

7. The connector device according to claim 1, wherein The heat transfer portion is made of metal.

8. The connector device according to any one of claims 1 to 6, wherein The connector has a mounting connector portion mounted on the circuit board and a relay connector portion connected to the mounting connector portion, The sub-board and the IC are provided on the relay connector portion.

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