Structure for electromagnetic interference (EMI) shielding

Abstract

Apparatuses and techniques are disclosed for manufacturing apparatuses for use as test platforms and commercial equipment. In one aspect, an apparatus includes a non-conductive frame and a first shielding structure. The first shielding structure is part of the non-conductive frame. The first shielding structure includes a first laser-activated surface structure, a first base metal disposed on the first laser-activated surface structure, and a first plating metal disposed on the first base metal.

Description

BACKGROUND OF THE DISCLOSURE 1. Technical Field

[0002] Aspects of the present disclosure generally relate to electronic devices incorporating electromagnetic interference (EMI) shielding structures for semiconductor devices and manufacturing techniques therefor.

[0003] 2. Description of Related Art

[0004] Integrated circuit technology has made great progress in improving computing power through miniaturization of active components. Various packaging technologies can be found in many electronic devices, including processors, servers, radio frequency (RF) integrated circuits, etc. Advanced packaging and processing technologies allow complex devices, such as multi-die devices and system-on-chip (SOC) devices, which may include functional blocks, where each functional block is designed to perform a specific function, such as, for example, microprocessor functions, graphics processing unit (GPU) functions, communication functions (e.g., wireless local area network (WLAN), wireless cellular modem, Bluetooth, and other communications), etc.

[0005] In addition, strict tests are also required to verify the performance of semiconductor devices, especially for RF semiconductor devices and components. For example, in some conventional RF designs, there are multiple daughter cards inserted into a main baseband card. These daughter cards typically use shielding compartments under each daughter card, which may result in high manufacturing costs and unreliable operation.

[0006] Accordingly, there is a need for systems, devices, and methods that overcome the deficiencies of conventional shielding structure designs, including the methods, systems, and devices provided herein in the following disclosure. SUMMARY OF THE INVENTION

[0007] A simplified summary of one or more aspects related to the present disclosure is presented below. Accordingly, the following summary should not be considered an exhaustive overview of all contemplated aspects, nor should it be considered to identify key or critical elements of all contemplated aspects or to delineate the scope associated with any particular aspect. Thus, the sole purpose of the following summary is to present some concepts related to one or more aspects involving the mechanisms disclosed herein in a concise form before the detailed description presented below.

[0008] According to aspects disclosed herein, at least one aspect includes a device comprising: a non-conductive frame; and a first shielding structure, wherein the first shielding structure is part of the non-conductive frame, and wherein the first shielding structure comprises: a first laser-activated surface structure; a first base metal disposed on the first laser-activated surface structure; and a first plated metal disposed on the first base metal.

[0009] In accordance with various aspects disclosed herein, at least one aspect includes a method for manufacturing a device, the method comprising: forming a non-conductive frame; and forming a first shielding structure, wherein the first shielding structure is part of the non-conductive frame, and wherein forming the first shielding structure includes: forming a first laser-activated surface structure; forming a first base metal on the first laser-activated surface structure; and forming a first plated metal disposed on the first base metal.

[0010] Based on the drawings and the detailed description, other objects and advantages associated with the aspects disclosed herein will be apparent to those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] When considered in conjunction with the drawings, the aspects of the present disclosure and many of the attendant advantages thereof become better understood, and thus will be more readily appreciated in their entirety, by reference to the following detailed description, which is presented by way of illustration only and is not intended to limit the present disclosure.

[0012] Figure 1A Illustrates a partial view of a device including a non-conductive frame in accordance with one or more aspects of the present disclosure.

[0013] Figure 1B Illustrates a partial view of a device including a non-conductive frame in accordance with one or more aspects of the present disclosure.

[0014] Figure 1C Illustrates a partial view of a device including a top structure in perspective and cross-sectional views in accordance with at least one aspect of the present disclosure.

[0015] Figure 2A Illustrates a partial cross-sectional view of a first shielding structure of a device including a non-conductive frame in accordance with one or more aspects of the present disclosure.

[0016] Figure 2B Illustrates a partial cross-sectional view of a second shielding structure of a device including a non-conductive frame in accordance with one or more aspects of the present disclosure.

[0017] Figure 3A Illustrates a partial perspective exploded view of a device including a non-conductive frame in accordance with at least one aspect of the present disclosure.

[0018] Figure 3B Illustrates a partial top view of a device including a non-conductive frame in accordance with one or more aspects of the present disclosure.

[0019] Figure 3C Illustrates a partial cross-sectional view of a device including a non-conductive frame in accordance with one or more aspects of the present disclosure.

[0020] Figures 4A to 4D A manufacturing technique according to one or more aspects of the present disclosure is illustrated.

[0021] Figure 5 A flow chart of a method for manufacturing the aforementioned device according to one or more aspects of the present disclosure is illustrated.

[0022] Figure 6 An integrated device according to one or more aspects of the present disclosure is illustrated.

[0023] Figure 7 A mobile device in accordance with one or more aspects of the present disclosure is illustrated.

[0024] Figure 8 Various electronic devices that can be integrated with any of the devices disclosed according to one or more aspects of the present disclosure are illustrated.

[0025] As a matter of practice, the features depicted in the drawings may not be drawn to scale. Accordingly, the dimensions of the depicted features may be arbitrarily enlarged or reduced for clarity. As a matter of practice, certain drawings are simplified for clarity. Therefore, the drawings may not depict all components of a particular device or method. In addition, similar reference numerals are used throughout the specification and drawings to indicate similar features. DETAILED DESCRIPTION

[0026] Various aspects of the present disclosure are provided in the following description and related drawings for various examples provided for illustrative purposes. Alternative aspects may be designed without departing from the scope of the present disclosure. Additionally, well-known elements of the present disclosure will not be described in detail or will be omitted to avoid making the relevant details of the present disclosure difficult to understand.

[0027] The words "exemplary" and / or "example" are used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" and / or "example" is not necessarily to be construed as preferred or advantageous over other aspects. Likewise, the term "aspects of the disclosure" does not require that all aspects of the disclosure include the discussed feature, advantage, or mode of operation.

[0028] Those skilled in the art will appreciate that any of a variety of different techniques and methods may be used to represent the information and signals described below. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the following description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof, which depends in part on the specific application, in part on the desired design, in part on the corresponding technology, and so on.

[0029] In certain described exemplary embodiments, instances are identified where various component structures and operational portions may be taken from known conventional techniques and then arranged in accordance with one or more of the disclosed aspects. In such instances, internal details of the known conventional component structures and / or operational portions may be omitted to help avoid potentially obscuring the concepts illustrated in the exemplary aspects disclosed herein.

[0030] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly dictates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0031] Traditionally, EMI shielding has been performed around each baseband circuit card assembly (CCA) using a metal sheet or can shield. Traditional designs are costly and unreliable because warping often occurs, causing the shield to fall off. Accordingly, aspects disclosed herein include direct laser structuring on plastic to replace the traditional shielding metal sheet or can. In some aspects, portions of the plastic frame are wrapped with metal for shielding.

[0032] In some exemplary aspects, a modem test platform (MTP) may have one or more EMI shielding compartments, such as for a first CCA and a second CCA, such as a wireless local area network (WLAN) connectivity CCA and one or more other RF CCAs inserted into the main baseband CCA. As discussed herein, one or more EMI shielding compartments may be formed in part by one or more shielding structures. These compartments have traditionally been formed by large and expensive conventional surface-mounted shields on the baseband CCA. In contrast, the disclosed aspects provide a convenient integrated solution by incorporating these compartments into a non-conductive frame that forms the perimeter of the internal MTP body. The redesigned frame includes these compartments under the first CCA and the second CCA (e.g., RF CCAs such as WLAN, RF modems, RF amplifiers, etc.). To achieve shielding, the plastic compartments are coated with direct laser structuring (LDS) metal. This new design allows for the desired shielding while eliminating the costly conventional shields. It also provides a clean and convenient single-piece frame that can be secured to the baseband card in a single simple operation.

[0033] In accordance with various aspects disclosed, a variety of processes can be employed to achieve a metal-on-non-conductive material (e.g., metal-on-plastic) configuration, such as LDS or Laser Manufactured Antenna (LMA). In some aspects, LDS shielded compartments can include various types of metal-plastic design practices. Additionally, the aspects disclosed should not be limited to plastic materials, as any non-conductive material compatible with LDS, LMA, or similar processes can be used. In some aspects, the LDS / LMA process can include a combination of two or more non-conductive thermoplastic materials, such as polycarbonate / acrylonitrile butadiene styrene (PC-ABS), glass-filled polycarbonate (PC), polyethylene terephthalate (PET) / polybutylene terephthalate (PBT), liquid crystal polymer (LCP), silicone, and similar materials. In some aspects, the LDS shielded compartment metal can be nickel-plated copper, but other metal combinations can also be used, such as copper sandwiched between two layers of nickel, gold, gold / palladium, tin, silver, and other highly conductive metals.

[0034] In some aspects, the non-conductive frame can be a rigid frame. In other aspects, the non-conductive frame can be a flexible frame. In some aspects, the non-conductive frame can be used in various test applications, such as for MTP designs. In some aspects, the non-conductive can be a straight-edge rectangular shape, as generally illustrated herein for convenience, but the aspects disclosed and claimed are not limited to a specific geometry. Additionally, in various aspects, the shield structure can have many different styles, such as rectangular or other geometries, smooth surfaces, contact bumps on the surface, movable hinges, insert molding features, etc. Thus, the various illustrations in the respective figures provided herein should not be construed as limiting the aspects disclosed and claimed.

[0035] In some aspects, the "top" of the EMI shield structure is provided by a CCA inserted into the baseband CCA. In some aspects, the shield structure can also be configured for applications without a daughter card as the "top". For example, the shield structure can include an upper "top" integrated into the non-conductive frame design and also coated in the LDS metal. In this way, multiple shield structures can be present on the non-conductive frame, which are configured to address different potential shield configurations in one platform, thus eliminating multiple traditional metal plate shields.

[0036] Figure 1AIllustrates a partial view of an apparatus 100 including a non-conductive frame 101 in accordance with at least one aspect of the present disclosure. More specifically, a top perspective view of the non-conductive frame 101 is provided. As shown, a first shielding structure 110 is formed as part of the non-conductive frame. A second shielding structure 120 is formed as part of the non-conductive frame. As shown and discussed herein, in some aspects, the non-conductive frame is plastic and can be an injection molded glass-filled polycarbonate including a laser-activated additive. It should be understood that the laser-activated additive is a chemical additive in a thermoplastic material (or other non-conductive material) that, when activated by a laser, produces a chemical reaction and a rough surface suitable for the adhesion of fine metal particles during the metallization process. Accordingly, the aspects disclosed are not limited to any particular additive. Additionally, in some aspects, the first shielding structure 110 is a rectangular frame having an opening 111 in the middle of the rectangular frame. The opening 111 may allow unobstructed through-passage as compared to conventional designs that rely on cross braces. Similarly, in some aspects, the second shielding structure 120 is a rectangular frame having an opening 121 in the middle of the rectangular frame, which also allows unobstructed through-passage. In addition to the first shielding structure 110 and the second shielding structure 120, a plurality of other conductive structures 105 (note that not all conductive structures are labeled for clarity) can be formed in the non-conductive frame 101 using techniques similar to those used to form the first shielding structure 110 and the second shielding structure 120 (e.g., LDS). Further discussion of the formation of the first shielding structure 110 and the second shielding structure 120 will be provided in the following disclosure.

[0037] Figure 1B Illustrates a partial view of an apparatus 100 including a non-conductive frame 101 in accordance with at least one aspect of the present disclosure. More specifically, a bottom perspective view of the non-conductive frame 101 is provided. As shown, the first shielding structure 110 wraps around to the bottom side such that both the top surface and the bottom surface of the first shielding structure 110 have conductive surfaces. Similarly, the second shielding structure 120 wraps around to the bottom side such that both the top surface and the bottom surface of the second shielding structure 120 have conductive surfaces. In addition to the first shielding structure 110 and the second shielding structure 120, a plurality of other conductive structures 105 (note that not all conductive structures are labeled for clarity) can be formed in the non-conductive frame 101 as seen from the bottom perspective view.

[0038] Figure 1CA partial view of the device 100 including a top structure 150 is illustrated in perspective and cross-sectional views in accordance with at least one aspect of the present disclosure. More specifically, a bottom perspective view (i) and a cross-sectional view (ii) of the top structure 150 are provided. As shown, the top structure 150 includes a non-conductive portion 152 and a conductive portion formed by LDS / LMA, the conductive portion being disposed on the non-conductive portion 152 forming a top shield 154, which in some aspects also wraps around to the bottom side such that both the inner top surface and the bottom surface of the top shield 154 have conductive surfaces. Referring to the cross-sectional view (ii) of the top structure 150, as shown, the top structure 150 includes a top shield 154 disposed on the non-conductive portion 152. The top shield 154 extends to enclose the area below the top (the "top") to form a fully enclosed shielding cavity. In some aspects, the shielding cavity of the top shield 154 allows CCAs and / or other components to be shielded (e.g., components on a baseband CCA, a printed circuit board (PCB), etc.). In some aspects, the top shield 154 can be coupled to a shielding structure (e.g., 110, 120, not shown) on the non-conductive frame 101 (not illustrated). In some aspects, the top shield 154 can be removable or permanently attached to the non-conductive frame 101. Thus, the top shield 154 structure can be configured for applications without a daughter card as the "top" and allows multiple shielding structures on the non-conductive frame 101 to be configured to address different potential shielding configurations in one platform.

[0039] It should be understood that the foregoing illustration and the associated text are provided merely to facilitate discussion of the aspects disclosed herein. The specific configurations of the non-conductive frame 101, the first shielding structure 110, the second shielding structure 120, and the conductive structure 105 should not be construed as limiting the aspects disclosed or claimed herein. For example, there may be more or fewer than two shielding structures. Additionally, the relative positions and geometries of each of these shielding structures within the non-conductive frame 101 may vary depending on the various components they are designed to accommodate. Similarly, the number, configuration, and position of the conductive structure 105 may vary depending on the various designs, and in some aspects, there may be no conductive structure 105.

[0040] Figure 2AFIG. 0 illustrates a partial cross-sectional view of a first shielding structure 110 of an apparatus 100 including a non-conductive frame 101 in accordance with at least one aspect of the present disclosure. More specifically, a partial cross-section of the first shielding structure 110 is provided. As shown, the first shielding structure 110 wraps from a top side 102 to a bottom side 103 such that both the top surface and the bottom surface of the first shielding structure 110 have conductive surfaces. In some aspects, the first shielding structure 110 includes a first laser-activated surface structure 112, a first base metal 114 disposed on the first laser-activated surface structure 112, and a first plated metal 116 disposed on the first base metal 114. Thus, the first shielding structure 110 is substantially covered by the first plated metal 116 and the first base metal 114. The laser-activated surface structure is formed using a plastic containing a laser-activated additive. Then, laser processing / activation can be used to initiate a chemical reaction to form very fine metal particles on the laser-treated surface. Using a laser for processing / activation allows for the formation of complex surface shapes with high resolution. The laser-activated surface is different from the untreated portion of the non-conductive frame 101 and forms a laser-activated surface structure, such as the first laser-activated surface structure 112 of the first shielding structure 110. Further, as used herein, the term “substantially covered” indicates that while there may be small portions of the first shielding structure 110 that may not have the first plated metal 116 and the first base metal 114 covering the surface of the first shielding structure 110, most of the surface of the first shielding structure 110 will be covered. Additionally, in some aspects, substantially covered may include a specific pattern that still allows for effective EMI shielding, as is known in the art. In some aspects, the first base metal 114 and the first plated metal 116 are at least one of laser direct structuring (LDS) metals or laser manufactured antenna (LMA) metals. In some aspects, the first base metal 114 is at least one of copper, nickel, tin, aluminum, silver, gold, or combinations thereof. In some aspects, the first plated metal 116 is at least one of copper, nickel, tin, aluminum, silver, gold, or combinations thereof. For example, the first base metal 114 may be nickel and the first plated metal 116 may be copper. However, the aspects disclosed are not limited to this design, and the aspects disclosed and claimed herein include other metal combinations, including the case where the first plated metal 116 and the first base metal 114 are the same. In some aspects, the thickness of the first base metal and the first plated metal may be about 20 micrometers (um) or in the range of 20 um to 50 um. As used herein, about and in the range of indicate that a particular number or range may have some variation, as is typically expected from standard manufacturing practices, etc. For example, in some aspects, the value or range may vary plus or minus ten percent. In some aspects, the first shielding structure 110 may have a substantially smooth surface (e.g., the surface of the first plated metal 116). In some aspects, the first shielding structure 110 may have a plurality of protrusions (not illustrated) on at least one surface.For example, the top surface on the top side 102, the bottom surface on the bottom side 103, or both the top and bottom surfaces of the first shielding structure 110 may have a plurality of protrusions or other projections or irregular surfaces to facilitate coupling to the first plated metal 116.

[0041] Figure 2B FIG. Figure 2B illustrates a partial cross-sectional view of a second shielding structure 120 of a device 100 including a non-conductive frame 101 in accordance with at least one aspect of the present disclosure. As shown, the second shielding structure 120 wraps from the top side 102 to the bottom side 103 such that both the top and bottom surfaces of the second shielding structure 120 have conductive surfaces. In some aspects, the second shielding structure 120 includes a second laser-activated surface structure 122, a second base metal 124 disposed on the second laser-activated surface structure 122, and a second plated metal 126 disposed on the second base metal 124. Accordingly, the second shielding structure 120 is substantially covered by the second plated metal 126 and the second base metal 124. As used herein, the term "substantially covered" means that although there may be a small portion of the second shielding structure 120 where the second plated metal 126 and the second base metal 124 may not have a surface covering the second shielding structure 120, most of the surface of the second shielding structure 120 will be covered. In some aspects, the second base metal 124 and the second plated metal 126 are at least one of laser direct structuring (LDS) metals or laser manufactured antenna (LMA) metals. In some aspects, the second base metal 124 is at least one of copper, nickel, tin, aluminum, silver, gold, or combinations thereof. In some aspects, the second plated metal 126 is at least one of copper, nickel, tin, aluminum, silver, gold, or combinations thereof. For example, the second base metal 124 may be nickel, and the second plated metal 126 may be copper or other metal combinations, as discussed above. In some aspects, the second shielding structure 120 may have a substantially smooth surface (e.g., the surface of the second plated metal 126). In some aspects, the second shielding structure 120 may have a plurality of protrusions on at least one surface. For example, the top surface on the top side 102, the bottom surface on the bottom side 103, or both the top and bottom surfaces of the second shielding structure 120 may have a plurality of protrusions or other projections or irregular surfaces to facilitate coupling to the second plated metal 126.

[0042] Figure 3AIllustrates a partial perspective exploded view of a device 100 including a non-conductive frame 101 in accordance with at least one aspect of the present disclosure. More specifically, a partial exploded view is illustrated. As shown, the non-conductive frame 101 includes a first shielding structure 110 and a second shielding structure 120. A baseband CCA 340 is disposed on the bottom side of the non-conductive frame 101. In some aspects, the baseband CCA 340 has a first exposed conductive trace 341 (e.g., copper) configured to be coupled to the first shielding structure 110. In some aspects, the baseband CCA 340 has a second exposed conductive trace 342 (e.g., copper) configured to be coupled to the second shielding structure 120. The first shielding structure 110 is configured to be coupled to a first CCA 310 to provide EMI shielding. The second shielding structure 120 is configured to be coupled to a second CCA 320 to provide EMI shielding.

[0043] Figure 3B Illustrates a partial top view of a device 100 including a non-conductive frame 101 in accordance with at least one aspect of the present disclosure. As shown, the non-conductive frame 101 is coupled to a baseband CCA 340 disposed on the bottom side of the non-conductive frame 101. A first shielding structure 110 (not visible) of the non-conductive frame 101 is coupled to a first CCA 310 to provide EMI shielding. A first dashed line 312 defines a shielding compartment (chamber or cavity) between the first CCA 310 and the baseband CCA 340 for shielding components within a first perimeter indicated by the first dashed line 312. A second shielding structure 120 (not visible) of the non-conductive frame 101 is coupled to a second CCA 320 to provide EMI shielding. A second dashed line 322 defines a shielding compartment (chamber or cavity) between the second CCA 320 and the baseband CCA 340 for shielding components within a second perimeter indicated by the second dashed line 322.

[0044] Figure 3CExemplified is a partial cross-sectional view of an apparatus 300 including a non-conductive frame 101 in accordance with at least one aspect of the present disclosure. As shown, the non-conductive frame 101 is disposed above a baseband CCA 340. In some aspects, the baseband CCA is coupled to a first shielding structure 110 via a first conductive gasket 351 and to a second shielding structure 120 via a second conductive gasket 352. In some aspects, a first CCA 310 is coupled to the first shielding structure 110 via a third conductive gasket 353. In some aspects, a second CCA 320 is coupled to the second shielding structure 120 via a fourth conductive gasket 354. As shown, the baseband CCA 340 is disposed on the bottom side of the non-conductive frame 101, and the first CCA 310 and the second CCA 320 are disposed on the top side of the non-conductive frame 101 opposite the bottom side. In some aspects, when assembled, the baseband CCA 340, the first conductive gasket 351, the first shielding structure 110, the third conductive gasket 353, and the first CCA 310 form a first shielding compartment (or cavity) between the first CCA 310 and the baseband CCA 340. In some aspects, when assembled, the baseband CCA 340, the second conductive gasket 352, the second shielding structure 120, the fourth conductive gasket 354, and the second CCA 320 form a second shielding compartment (or cavity) between the second CCA 320 and the baseband CCA 340.

[0045] To fully exemplify the aspects of the present disclosure, a manufacturing method is presented. Other manufacturing methods are possible, and the manufacturing method discussed is only for helping to understand the concepts disclosed herein.

[0046] Figures 4A to 4D Exemplified is a manufacturing technique in accordance with one or more aspects of the present disclosure. Referring to Figure 4A , a perspective view and a partial cross-sectional view of an apparatus 400 including a non-conductive frame 401 are exemplified. In some aspects, at this part of the manufacturing process, the non-conductive frame 401 is formed by injection molding a glass-filled polycarbonate containing a laser-activated additive. Alternative manufacturing techniques and materials can be used to form a suitable three-dimensional structure, such as the non-conductive frame 401.

[0047] Figure 4BFIG. 0 illustrates a cross-sectional view of an apparatus 400 including a non-conductive frame 401. At this part of the manufacturing process, laser activation and patterning (e.g., laser etching of plastic to form a conductive pattern) are performed to form a first laser-activated surface structure 412. It should be understood that plastics containing laser-activated additives can be used to facilitate metallization on a portion of the non-conductive frame 401. By using plastics containing laser-activated additives, laser activation can be used to initiate a chemical reaction to form very fine metal particles on the laser-treated surface (desired surface). These surfaces are different from the untreated portion of the non-conductive frame 401 and form a laser-activated surface structure, such as the first laser-activated surface structure 412 of the first shielding structure 410.

[0048] Figure 4C FIG. 4 illustrates a partial cross-sectional view of an apparatus 400 including a non-conductive frame 401 and a first shielding structure 410. At this part of the manufacturing process, a first base metal 414 can be deposited onto the treated surface (e.g., the first laser-activated surface structure 412). In some aspects, the metallization process for depositing the first base metal 414 can include an electroless plating process. In some aspects, the non-conductive frame 401 having the first laser-activated surface structure 412 can be immersed in an electroless copper (or other metal) bath. It should be understood that when forming the shielding compartment discussed above, the laser etching should continuously wrap around from the top side 402 to the bottom side 403 of the non-conductive frame 401. As shown, the first laser-activated surface structure 412 and the first base metal 414 each wrap around from the top side 402 to the bottom side 403 of the non-conductive frame 401.

[0049] Figure 4D FIG. 8 illustrates a perspective view and a partial cross-sectional view of an apparatus 400 including a non-conductive frame 401 and a first shielding structure 410. At this part of the manufacturing process, a first plated metal 416 can be deposited onto the first base metal 414. In some aspects, an electroplating process can be used to deposit the first plated metal 416. As shown, the first laser-activated surface structure 412, the first base metal 414, and the first plated metal 416 each wrap around from the top side 402 to the bottom side 403 of the non-conductive frame 401 to form a continuous shield and similar to Figure 1A and Figure 1B the final structure illustrated in FIG., as shown in the associated perspective view.

[0050] It should be understood that a similar process can be used to form additional metal plating structures on the non-conductive frame 401, such as one or more additional shielding structures, e.g., a second shielding structure 420 and one or more additional conductive structures 405.

[0051] It will be appreciated that the foregoing manufacturing processes are provided only as a general illustration of aspects of the present disclosure and are not intended to limit the present disclosure or the appended claims. Further, many details of manufacturing processes known to those skilled in the art may be omitted or combined in the various overview process sections to facilitate understanding of the disclosed aspects without presenting every detail and / or all possible process variations in detail.

[0052] It should be understood from the foregoing that there are various methods for manufacturing a device (e.g., 100, 300, 400) including a non-conductive frame (e.g., 101, 401) as disclosed herein. Figure 5 A flowchart of a method 500 for manufacturing a device (e.g., 100, 400) is illustrated. At 510, the manufacturing process includes forming a non-conductive frame (e.g., 101, 401). As discussed herein, in some aspects, forming may be performed by injection molding. At 520, the manufacturing process includes forming a first shielding structure (e.g., 110, 410), where the first shielding structure is part of the non-conductive frame. In some aspects, forming the first shielding structure includes forming a first laser-activated surface structure; forming a first base metal on the first laser-activated surface structure; and forming a first plated metal disposed on the first base metal.

[0053] At 530, the manufacturing process optionally includes forming a second shielding structure (e.g., 120, 420), where the first shielding structure is part of the non-conductive frame. In some aspects, forming the second shielding structure includes forming a second laser-activated surface structure; forming a second base metal on the second laser-activated surface structure; and forming a second plated metal disposed on the second base metal.

[0054] It will be appreciated from the foregoing disclosure that additional processes for manufacturing the aspects disclosed herein will be apparent to those skilled in the art and literal reproductions of the processes discussed above will not be provided or illustrated in the included drawings. It should be understood that the sequence of manufacturing processes is not necessarily in any order and that later processes may be discussed earlier to provide examples of the breadth of the disclosed aspects.

[0055] The foregoing devices and functionality may be designed and stored in a computer file (e.g., register transfer level (RTL), geometric data stream (GDS), Gerber, etc.) stored on a computer-readable medium. Some or all of such files may be provided to a manufacturing processor for manufacturing a device based on such files. The resulting product may include various elements having semiconductor wafers, which are subsequently diced into semiconductor die and packaged into semiconductor packages, integrated devices, stacked package devices, system-on-chip devices, etc., which may then be used in the various devices described herein.

[0056] It should be understood that aspects disclosed herein may be described as functional equivalents of structures, materials, and / or devices described and / or recognized by those skilled in the art. For example, in one aspect, an apparatus may include components for performing the various functions discussed above. It should be understood that the foregoing aspects are provided only as examples, and the claimed aspects are not limited to the specific references and / or illustrations cited as examples.

[0057] Figure 6Illustrates components of an integrated device 600 in accordance with one or more aspects of the present disclosure. In view of the aspects discussed above, it should be understood that a commercial device (e.g., a mobile phone, etc.) may include EMI shielding and may use one or more CCAs or may have components shielded by a top structure (e.g., top structure 150). The integrated device 600 may include similar features as disclosed with respect to device 100 discussed above. In some aspects, the non-conductive frame 601 includes a first shielding structure 610 and a second shielding structure 620. The first shielding structure 610 is configured to be coupled to a first CCA 615 to provide EMI shielding. The second shielding structure 620 is configured to be coupled to a second CCA 625. In some aspects, the non-conductive frame 601 may be mounted on a printed circuit board (PCB) (e.g., PCB 670), a package substrate, or a similar structure. In some aspects, the PCB 670 is also coupled to a power supply 680 (e.g., a power management integrated circuit (PMIC)), which allows the first shielding structure 610, the first CCA 615, the second shielding structure 620, the second CCA 625, and any other components coupled to or embedded in the PCB 670 to be electrically coupled to the PMIC 680. In some aspects, it should be understood that the non-conductive frame 601 may be fully or partially integrated into the PCB 670. For example, the non-conductive portion of the PCB 670 may replace a portion of the non-conductive frame 601. In some aspects, one or more power supply (VDD) lines 671 and one or more ground (GND) lines 672 may be coupled to the PMIC 680 to distribute power to the PCB 670. The VDD lines 671 and the GND lines 672 may each be formed by traces, shapes, or patterns in one or more metal layers of the PCB 670, which are coupled by one or more vias through insulating layers that separate the metal layers in the PCB 670. The PCB 670 may have one or more PCB capacitors (PCB cap) 675, which may be used to regulate power signals, as is known to those skilled in the art. It should be understood that the illustrated configurations and descriptions are provided merely to assist in illustrating the aspects disclosed herein. For example, the PCB 670 may have more or fewer metal layers and insulating layers, there may be multiple lines for providing power to various components, etc. Thus, the foregoing illustrative examples and associated figures should not be construed as limiting the aspects disclosed and claimed herein.

[0058] Figure 7 Illustrates a mobile device 700 in accordance with aspects of the present disclosure. In some aspects, the mobile device 700 may include various CCAs that may be tested and verified using a modem test platform and / or integrated into one or more circuits, including aspects of the non-conductive frame and EMI shielding disclosed herein.

[0059] In some aspects, the mobile device 700 may be configured as a wireless communication device. As shown, the mobile device 700 includes a processor 701. The processor 701 may be communicatively coupled to a memory 732 via a link, which may be a die-to-die or chip-to-chip link. The mobile device 700 also includes a display 728 and a display controller 726, where the display controller 726 is coupled to the processor 701 and the display 728. The mobile device 700 may include an input device 730 (e.g., a physical or virtual keyboard), a power supply 744 (e.g., a battery), a speaker 736, a microphone 738, and a wireless antenna 742. In some aspects, the power supply 744 may directly or indirectly provide a power voltage for operating some or all of the components of the mobile device 700.

[0060] In some aspects, Figure 7 may include a decoder / encoder (codec) 734 (e.g., an audio and / or voice codec) coupled to the processor 701; a speaker 736 and a microphone 738 coupled to the codec 734; and wireless circuitry 740 coupled to the wireless antenna 742 and the processor 701 (the wireless circuitry may include a modem, RF circuitry, filters, etc., and may be mounted and / or shielded using aspects disclosed herein).

[0061] It should be noted that although Figure 7 the mobile device 700 is depicted, a similar architecture may be used to implement devices including a set-top box, a music player, a video player, an entertainment unit, a navigation device, a personal digital assistant (PDA), a fixed-location data unit, a computer, a laptop computer, a tablet, a communication device, a mobile phone, a base station, or other similar devices.

[0062] Figure 8 Illustrated are various electronic devices 810, 820, and 830 according to aspects of the present disclosure that may include components that are tested and verified using a device or that have integrated components. For example, a mobile phone device 810, a laptop computer device 820, and a fixed-location terminal device 830 may each generally be considered user equipment (UE) and may include one or more non-conductive frames, PCBs, integrated devices, etc. having a shielding structure as disclosed herein. The integrated devices 812, 822, and 832 may, for example, correspond to the integrated devices described in the present disclosure with respect to, for example Figure 6 the integrated devices described. However, it should be understood that the disclosed aspects include any device having a non-conductive frame and one or more shielding structures as disclosed herein.

[0063] Figure 8The devices 810, 820, 830 illustrated are merely non-limiting examples. Other electronic devices may also include features as described in this disclosure, including but not limited to a group of devices (e.g., electronic devices) including the following: mobile devices, handheld personal communication system (PCS) units, portable data units (such as personal digital assistants), global positioning system (GPS)-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed-location data units (such as meter reading equipment), communication devices, smart phones, tablet computers, computers, wearable devices, servers, routers, electronic devices implemented in a motor vehicle (e.g., an autonomous vehicle), Internet of Things (IoT) devices, access points, base stations, devices in a motor vehicle, or any other device that sends or receives voice, data, or computer instructions or any combination thereof.

[0064] It should be understood that aspects disclosed herein may be described as functional equivalents of structures, materials, and / or devices as described and / or recognized by those of ordinary skill in the art. For example, in one aspect, an apparatus may include components for performing the various functions discussed above. It should be understood that the foregoing aspects are provided only as examples, and the claimed aspects are not limited to the specific references and / or illustrations cited as examples.

[0065] Figures 1A to 8 One or more of the components, processes, features, and / or functions illustrated may be rearranged and / or combined into a single component, process, feature, or function, or incorporated into several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from the disclosure. In some specific implementations, Figures 1A to 8 and the corresponding descriptions may be used to fabricate, build, provide, and / or produce integrated devices. In some specific implementations, the device may include dies, integrated devices, die packages, ICs, device packages, semiconductor devices, system-in-package (SiP), system-on-chip (SoC), package-on-package (PoP) devices, etc.

[0066] As used herein, the terms “user equipment” (or “UE”), “user device”, “user terminal”, “client device”, “communication device”, “wireless device”, “wireless communication device”, “handheld device”, “mobile device”, “mobile terminal”, “mobile station”, “cellular phone”, “access terminal”, “subscriber equipment”, “subscriber terminal”, “subscriber station”, “terminal” and variations thereof may be used interchangeably to refer to any suitable mobile or stationary device capable of receiving wireless communications and / or navigation signals. These terms include, but are not limited to, music players, video players, entertainment units, navigation devices, communication devices, smart phones, personal digital assistants, fixed-location terminals, tablet computers, computers, wearable devices, laptop computers, servers, in-vehicle equipment in motor vehicles, and / or other types of portable electronic devices that are typically carried by an individual and / or have communication capabilities (e.g., wireless, cellular, infrared, short-range radio, etc.). These terms are also intended to include devices that communicate with another device that is capable of receiving wireless communications and / or navigation signals (such as via short-range wireless, infrared, wired connection, or other connections), regardless of whether satellite signal reception, auxiliary data reception, and / or location-related processing occur at the device or at the other device. A UE can be implemented by any of several types of devices, including but not limited to printed circuit (PC) cards, compact flash devices, external or internal modems, wireless or wired telephones, smart phones, tablet computers, consumer tracking devices, asset tags, etc.

[0067] Wireless communication between electronic devices can be based on different technologies, such as code division multiple access (CDMA), W-CDMA, time division multiple access (TDMA), frequency division multiple access (FDMA), orthogonal frequency division multiplexing (OFDM), global system for mobile communications (GSM), 3GPP long term evolution (LTE), 5G new radio, Bluetooth (BT), Bluetooth low energy (BLE), IEEE 802.11 (WiFi), and IEEE 802.15.4 (Zigbee / Thread), or other protocols that may be used in wireless communication networks or data communication networks.

[0068] Nothing described or illustrated in this application is intended to dedicate any component, act, feature, benefit, advantage, or equivalent to the public, whether or not the same is recited in the claims.

[0069] In addition, those skilled in the art will appreciate that the various illustrative logical blocks, modules, circuits, and algorithmic acts described in connection with the examples disclosed herein can be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and acts are described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0070] Although some aspects have been described in connection with devices, it should be understood that these aspects also constitute a description of corresponding methods, and thus a block or component of a device should also be understood as a corresponding method act or a feature of a method act. Similarly, aspects described in connection with or as method acts also constitute a description of corresponding logical / functional blocks or details or features of a corresponding device. Some or all of the method acts may be performed by a hardware apparatus (or using a hardware apparatus), such as, for example, a microprocessor, a programmable computer, or an electronic circuit. In some examples, some or more of the most important method acts may be performed by such apparatus.

[0071] In the above detailed description, it can be seen that different features are grouped together in the examples. This manner of disclosure should not be interpreted as intending that the example clauses have more features than those expressly recited in each clause. On the contrary, aspects of the present disclosure may include less than all of the features of the individual example clauses disclosed. Accordingly, the following clauses are hereby incorporated into the description, where each clause may stand on its own as a separate example. Although each dependent clause may refer in the clause to a particular combination with one of the other clauses, the aspects of that dependent clause are not limited to the particular combination. It should be understood that other example clauses may also include combinations of aspects of the dependent clause with the subject matter of any other dependent clause or independent clause or any feature with other dependent and independent clauses. Aspects disclosed herein expressly include such combinations, unless expressly stated or readily inferred not to be intended to use a particular combination (e.g., conflicting aspects, such as defining an element as both an electrical insulator and an electrical conductor). In addition, it is also contemplated that aspects of the clauses may be included in any other independent clause, even if the clause does not directly depend on the independent clause.

[0072] Specific implementation examples are described in the following numbered clauses:

[0073] Clause 1. A device, the device comprising: a non-conductive frame; and a first shielding structure, wherein the first shielding structure is part of the non-conductive frame, and wherein the first shielding structure comprises: a first laser-activated surface structure; a first base metal disposed on the first laser-activated surface structure; and a first plated metal disposed on the first base metal.

[0074] Clause 2. The device according to Clause 1, the device further comprising: a second shielding structure, wherein the second shielding structure is part of the non-conductive frame, and wherein the second shielding structure comprises: a second laser-activated surface structure; a second base metal disposed on the second laser-activated surface structure; and a second plated metal disposed on the second base metal.

[0075] Clause 3. The device according to Clause 2, wherein the first shielding structure is configured to shield a first circuit card assembly (CCA), and the second shielding structure is configured to shield a second CCA.

[0076] Clause 4. The device according to Clause 3, wherein the first CCA and the second CCA are each a radio frequency card.

[0077] Clause 5. The device according to any one of Clauses 2 to 4, the device further comprising: a baseband circuit card assembly (CCA) coupled to the first shielding structure through a first conductive washer and coupled to the second shielding structure through a second conductive washer; a first circuit card assembly (CCA) coupled to the first shielding structure through a third conductive washer; and a second CCA coupled to the second shielding structure through a fourth conductive washer, wherein the baseband CCA is disposed on the bottom side of the non-conductive frame, and wherein the first CCA and the second CCA are disposed on the top side of the non-conductive frame opposite to the bottom side.

[0078] Clause 6. The device according to any one of Clauses 1 to 5, wherein the non-conductive frame is a glass-filled polycarbonate containing a laser-activated additive.

[0079] Clause 7. The device according to any one of Clauses 1 to 6, wherein the first shielding structure is a rectangular frame having an opening in the middle of the rectangular frame.

[0080] Clause 8. The device according to any one of Clauses 1 to 7, wherein the first shielding structure is substantially covered by the first base metal and the first plated metal.

[0081] Clause 9. The device according to Clause 8, wherein the first shielding structure has a substantially smooth surface.

[0082] Clause 10. The device according to any one of Clauses 8 to 9, wherein the first shielding structure has a plurality of protrusions on at least one surface.

[0083] Clause 11. The device according to any one of Clauses 1 to 10, wherein the first base metal and the first plated metal are at least one of laser direct structuring (LDS) metals or laser manufactured antenna (LMA) metals.

[0084] Clause 12. The device according to Clause 11, wherein the thickness of the first base metal and the first plated metal is in the order of 20 micrometers to 50 micrometers.

[0085] Clause 13. The device according to any one of Clauses 1 to 12, wherein the first base metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof, and wherein the first plated metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof.

[0086] Clause 14. The device according to any one of Clauses 1 to 13, wherein the device includes a modem test platform having one or more electromagnetic interference (EMI) shielding compartments, and wherein at least one EMI shielding compartment is partially formed by the first shielding structure.

[0087] Clause 15. The device according to any one of Clauses 1 to 14, wherein the device includes at least one of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

[0088] Clause 16. A method for manufacturing a device, the method comprising: forming a non-conductive frame; and forming a first shielding structure, wherein the first shielding structure is part of the non-conductive frame, and wherein forming the first shielding structure includes: forming a first laser-activated surface structure; forming a first base metal on the first laser-activated surface structure; and forming a first plated metal disposed on the first base metal.

[0089] Clause 17. The method according to Clause 16, the method further comprising: forming a second shielding structure, wherein the second shielding structure is part of the non-conductive frame, and wherein forming the second shielding structure comprises: forming a second laser-activated surface structure; forming a second base metal disposed on the second laser-activated surface structure; and forming a second plated metal disposed on the second base metal.

[0090] Clause 18. The method according to Clause 17, wherein forming the first laser-activated surface structure comprises laser activation and patterning of the first shielding structure, wherein forming the first base metal on the first laser-activated surface structure comprises an electroless plating process for depositing the first base metal; and wherein forming the first plated metal comprises electroplating the first plated metal on the first base metal.

[0091] Clause 19. The method according to Clause 18, wherein forming the second laser-activated surface structure comprises laser activation and patterning of the second shielding structure, wherein forming the second base metal on the second laser-activated surface structure comprises an electroless plating process for depositing the second base metal; and wherein forming the second plated metal comprises electroplating the second plated metal on the second base metal.

[0092] Clause 20. The method according to any one of Clauses 17 to 19, the method further comprising: coupling a baseband circuit card assembly (CCA) to the first shielding structure via a first conductive gasket, and coupling the baseband CCA to the second shielding structure via a second conductive gasket; coupling a first circuit card assembly (CCA) to the first shielding structure via a third conductive gasket; and coupling a second CCA to the second shielding structure via a fourth conductive gasket, wherein the baseband CCA is disposed on the bottom side of the non-conductive frame, and wherein the first CCA and the second CCA are disposed on the top side of the non-conductive frame opposite the bottom side.

[0093] Clause 21. The method according to any one of Clauses 16 to 20, wherein the non-conductive frame is formed by an injection molding process using glass-filled polycarbonate containing a laser-activated additive.

[0094] Clause 22. The method according to any one of Clauses 16 to 21, wherein the first shielding structure is a rectangular frame having an opening in the middle of the rectangular frame.

[0095] Clause 23. The method according to any one of Clauses 16 to 22, wherein the first shielding structure is substantially covered by the first base metal and the first plated metal.

[0096] Clause 24. The method according to Clause 23, wherein the first shielding structure has a substantially smooth surface.

[0097] Clause 25. The method according to any one of Clauses 23 to 24, wherein the first shielding structure has a plurality of protrusions on at least one surface.

[0098] Clause 26. The method according to any one of Clauses 16 to 25, wherein the first shielding structure is formed by at least one of a laser direct structuring (LDS) process or a laser manufactured antenna (LMA) process.

[0099] Clause 27. The method according to Clause 26, wherein the thicknesses of the first base metal and the first plated metal are on the order of 20 micrometers to 50 micrometers.

[0100] Clause 28. The method according to any one of Clauses 16 to 27, wherein the first base metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof, and wherein the first plated metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof.

[0101] Clause 29. The method according to any one of Clauses 16 to 28, wherein the apparatus includes a modem test platform having one or more electromagnetic interference (EMI) shielding compartments, and wherein at least one EMI shielding compartment is partially formed by the first shielding structure.

[0102] Clause 30. The method according to any one of Clauses 16 to 29, wherein the apparatus includes at least one of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

[0103] Those skilled in the art will understand that information and signals can be represented using any of a variety of different technologies and methods. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0104] In addition, those skilled in the art should understand that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the aspects disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability of hardware and software, the various illustrative components, boxes, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and the design constraints imposed on the overall system. Those skilled in the art can implement the described functionality in different ways for each particular application, but such specific implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0105] The methods, sequences, and / or algorithms described in connection with the aspects disclosed herein can be embodied directly in hardware, in software modules executed by a processor, or in a combination of both. The software modules can reside in random access memory (RAM), flash memory, read only memory (ROM), erasable programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An example storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In an alternative, the storage medium can be integral to the processor. The processor and the storage medium can reside in an ASIC. The ASIC can reside in a user terminal (e.g., UE). In an alternative, the processor and the storage medium can reside as discrete components in an electronic device.

[0106] In one or more example aspects, the functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality may be stored on or transmitted via a computer-readable medium as one or more instructions or code. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. As used herein, disk and disc include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0107] While the foregoing disclosure illustrates example aspects of the present disclosure, it should be noted that various changes and modifications may be made herein without departing from the scope of the present disclosure as defined by the appended claims. Additionally, the functions, steps, and / or acts of the method claims according to aspects of the present disclosure described herein need not be performed in any particular order. Further, although elements of the present disclosure may be described or claimed in the singular, the plural is also contemplated unless explicitly stated to be limited to the singular.

Claims

1. An apparatus, the apparatus comprising: A non-conductive frame; And A first shielding structure, wherein the first shielding structure is part of the non-conductive frame, and wherein the first shielding structure comprises: A first laser-activated surface structure; A first base metal disposed on the first laser-activated surface structure; and A first plated metal disposed on the first base metal.

2. The apparatus according to claim 1, the apparatus further comprising: A second shielding structure, wherein the second shielding structure is part of the non-conductive frame, and wherein the second shielding structure comprises: A second laser-activated surface structure; A second base metal disposed on the second laser-activated surface structure; and A second plated metal disposed on the second base metal.

3. The apparatus according to claim 2, wherein the first shielding structure is configured to shield a first circuit card assembly (CCA), and the second shielding structure is configured to shield a second CCA.

4. The apparatus according to claim 3, wherein the first CCA and the second CCA are each a radio frequency card.

5. The apparatus according to claim 2, the apparatus further comprising: A baseband circuit card assembly (CCA) coupled to the first shielding structure through a first conductive gasket and coupled to the second shielding structure through a second conductive gasket; A first circuit card assembly (CCA) coupled to the first shielding structure through a third conductive gasket; And A second CCA coupled to the second shielding structure through a fourth conductive gasket, Wherein the baseband CCA is disposed on the bottom side of the non-conductive frame, and wherein the first CCA and the second CCA are disposed on the top side of the non-conductive frame opposite to the bottom side.

6. The apparatus according to claim 1, wherein the non-conductive frame is a glass-filled polycarbonate containing a laser-activated additive.

7. The apparatus according to claim 1, wherein the first shielding structure is a rectangular frame having an opening in the middle of the rectangular frame.

8. The apparatus according to claim 1, wherein the first shielding structure is substantially covered by the first base metal and the first plated metal.

9. The apparatus according to claim 8, wherein the first shielding structure has a substantially smooth surface.

10. The apparatus according to claim 8, wherein the first shielding structure has a plurality of protrusions on at least one surface.

11. The apparatus according to claim 1, wherein the first base metal and the first plated metal are at least one of laser direct structuring (LDS) metal or laser manufactured antenna (LMA) metal.

12. The apparatus according to claim 11, wherein the thickness of the first base metal and the first plated metal is on the order of 20 microns to 50 microns.

13. The device according to claim 1, wherein the first base metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof, and wherein the first plated metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof.

14. The device according to claim 1, wherein the device includes a modem test platform having one or more electromagnetic interference (EMI) shielding compartments, and wherein at least one EMI shielding compartment is partially formed by the first shielding structure.

15. The device according to claim 1, wherein the device includes at least one of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

16. A method for manufacturing a device, the method comprising: forming a non-conductive frame; and forming a first shielding structure, wherein the first shielding structure is part of the non-conductive frame, and wherein forming the first shielding structure includes: forming a first laser-activated surface structure; forming a first base metal on the first laser-activated surface structure; and forming a first plated metal disposed on the first base metal.

17. The method according to claim 16, the method further comprising: forming a second shielding structure, wherein the second shielding structure is part of the non-conductive frame, and wherein forming the second shielding structure includes: forming a second laser-activated surface structure; forming a second base metal disposed on the second laser-activated surface structure; and forming a second plated metal disposed on the second base metal.

18. The method according to claim 17, wherein forming the first laser-activated surface structure includes laser activation and patterning of the first shielding structure, wherein forming the first base metal on the first laser-activated surface structure includes an electroless plating process for depositing the first base metal; and wherein forming the first plated metal includes electroplating the first plated metal on the first base metal.

19. The method according to claim 18, wherein forming the second laser-activated surface structure includes laser activation and patterning of the second shielding structure, wherein forming the second base metal on the second laser-activated surface structure includes an electroless plating process for depositing the second base metal; and wherein forming the second plated metal includes electroplating the second plated metal on the second base metal.

20. The method according to claim 17, the method further comprising: coupling a baseband circuit card assembly (CCA) to the first shielding structure via a first conductive gasket, and coupling the baseband CCA to the second shielding structure via a second conductive gasket; Couple a first circuit card assembly (CCA) to the first shielding structure via a third conductive washer; and couple a second CCA to the second shielding structure via a fourth conductive washer, wherein the baseband CCA is disposed on a bottom side of the non-conductive frame, and wherein the first CCA and the second CCA are disposed on a top side of the non-conductive frame opposite the bottom side.

21. The method of claim 16, wherein the non-conductive frame is formed by an injection molding process using glass-filled polycarbonate with a laser-activated additive.

22. The method of claim 16, wherein the first shielding structure is a rectangular frame having an opening in the middle of the rectangular frame.

23. The method of claim 16, wherein the first shielding structure is substantially covered by the first base metal and the first plated metal.

24. The method of claim 23, wherein the first shielding structure has a substantially smooth surface.

25. The method of claim 23, wherein the first shielding structure has a plurality of protrusions on at least one surface.

26. The method of claim 16, wherein the first shielding structure is formed by at least one of a laser direct structuring (LDS) process or a laser manufactured antenna (LMA) process.

27. The method of claim 26, wherein the thickness of the first base metal and the first plated metal is on the order of 20 micrometers to 50 micrometers.

28. The method of claim 16, wherein the first base metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof, and wherein the first plated metal is at least one of copper, nickel, tin, aluminum, silver, gold, or a combination thereof.

29. The method of claim 16, wherein the apparatus includes a modem test platform having one or more electromagnetic interference (EMI) shielding compartments, and wherein at least one EMI shielding compartment is partially formed by the first shielding structure.

30. The method of claim 16, wherein the apparatus includes at least one of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

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