MASK cleaning device for verifying effect of semiconductor cleaning agent

Abstract

The invention relates to the technical field of MASK cleaning devices for verifying the effect of a semiconductor cleaning agent, and discloses a MASK cleaning device for verifying the effect of a semiconductor cleaning agent, the MASK cleaning device comprises a box body, the top of the box body is fixedly connected with a supporting plate, and the top of the supporting plate is fixedly connected with a supporting frame; a plurality of supporting rods are fixedly connected to the inner wall of the bottom of the box, circular semiconductors are arranged at the ends, away from the box, of the supporting rods, and a circular frame is fixedly connected to the bottom of the supporting plate. During cleaning, through shaking and moving, a brush can uniformly clean the surface of a semiconductor plate, the surface of the semiconductor plate can be rapidly covered, the brush makes full contact with the surface of the semiconductor plate, attachments on the surface of the semiconductor plate can be effectively shattered during vibration, the attachments are cleaned to one side while the brush rotates, and the surface of the semiconductor plate is cleaned. And when the brush shakes and cleans attachments, the semiconductor plate can be quickly and effectively cleaned.

Description

Technical Field

[0001] The present invention relates to the technical field of MASK cleaning device equipment for verifying the effect of semiconductor cleaning agents, and in particular to a MASK cleaning device for verifying the effect of semiconductor cleaning agents. Background Art

[0002] With the continuous improvement of wafer manufacturing process, the requirements for cleaning process, as an important part of wafer manufacturing process, are also constantly upgraded. The tank wet process equipment widely used in batch wafer wet cleaning, etching, photoresist removal and other processes in the field of integrated circuits also needs to be constantly innovated and its performance continuously improved to ensure the increasingly fierce market competition.

[0003] Generally, when cleaning semiconductors, machines mainly use a brush to rotate and clean organic matter attached to the surface of the substrate. Since the attached matter on the surface of the semiconductor board is unevenly scattered and the semiconductor board cannot be fully covered during cleaning, the surface of the semiconductor board will not be cleaned thoroughly, affecting the cleaning speed. In addition, the speed and strength of the machine rotation cannot be controlled during cleaning, which can easily cause damage to the semiconductor surface and increase costs and labor. Summary of the invention

[0004] The object of the present invention is to provide a MASK cleaning device for verifying the effect of semiconductor cleaning agents, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a MASK cleaning device for verifying the effect of semiconductor cleaning agent, comprising a box body, a support plate is fixedly connected to the top of the box body, a support frame is fixedly connected to the top of the support plate, a plurality of support rods are fixedly connected to the bottom inner wall of the box body, a circular semiconductor is arranged at one end of the support rod away from the box body, a circular frame is fixedly connected to the bottom of the support plate, and further comprising; The rotating mechanism includes a motor fixedly connected to the top of the support frame, the output end of the motor is fixedly connected to a hollow column, the bottom of the hollow column is rotatably connected to the side wall of the support plate, a plurality of fixed blocks are fixedly connected to the inner wall of the bottom of the hollow column, a spring is fixedly connected to one side of the plurality of fixed blocks away from the inner wall of the hollow column, and an end of the spring away from the fixed block is fixedly connected to a limiting plate.

[0006] Transmission mechanism, the transmission mechanism includes a circular plate fixedly connected to the bottom of several first limit plates. A limit groove is provided at the bottom of the circular plate. A telescopic rod is slidably connected to the inner wall of the limit groove. The bottom of the telescopic rod is fixedly connected to a first limit post. One end of the first limit post away from the circular plate is fixedly connected to the bottom of the support plate. A transmission shaft is fixedly connected to the bottom of the circular plate. The top of the transmission shaft penetrates through the top outer wall of the circular plate and extends to the outside. The extended end of the transmission shaft is fixedly connected to a circular plate. Several clamping plates are slidably connected to the outer surface of the circular plate. A first rotating block is fixedly connected to the outer surface of the clamping plate. One side of the first rotating block away from the clamping plate is fixedly connected to an elastic column. A second rotating block is fixedly connected to the outer surface of the elastic column. One end of the second rotating block away from the elastic column is fixedly connected to the inner wall of the hollow column. One end of the transmission shaft away from the circular plate is fixedly connected to a first brush.

[0007] Further, a shaking mechanism is provided at the bottom of the support plate. The shaking mechanism includes several first transmission rods fixedly connected to the outer surface of the circular plate. A sliding groove is provided at the top of the first transmission rod. A slider is slidably connected inside the sliding groove. Among them, a toothed disc is fixedly connected to the inner wall of the top of the circular frame.

[0008] Further, a vibrating column is fixedly connected to the top of the slider. A vibrating block is fixedly connected to the side of the vibrating column away from the first transmission rod. The vibrating block is slidably connected to the side wall of the toothed disc.

[0009] Further, a damping mechanism is provided on the outer surface of the transmission shaft. The damping mechanism includes a hollow cylinder provided on the outer surface of the first transmission rod. Several sliding grooves are provided at the top of the hollow cylinder. The sliding grooves are slidably connected to the first transmission rod. Several support columns are fixedly connected to the top of the hollow cylinder. The top of the support column is fixedly connected to the inner wall of the bottom of the hollow column. A conical block is provided inside the hollow cylinder. The inner wall of the conical block is fixedly connected to the outer surface of the transmission shaft.

[0010] Further, two elastic plates are slidably connected to the outer surface of the bottom of the conical block. The two elastic plates are respectively fixedly connected to the inner wall of the hollow cylinder. An airbag is fixedly connected to the end of the elastic plate away from the conical block. A second spring is fixedly connected to the bottom of the airbag. A hose is fixedly connected to the end of the airbag away from the elastic plate. The end of the hose away from the hollow cylinder penetrates through the outer wall of the hollow cylinder and is fixedly connected to the first brush. An air cushion is provided at the extended end of the hose. The outer surface of the air cushion is fixedly connected to the inner wall of the bottom of the first brush. The air cushion and the hose are in a communicating setting.

[0011] Further, a cleaning mechanism is provided at the bottom of the hollow cylinder. The cleaning mechanism includes two third limit rods fixedly connected to the outer surface of the transmission shaft. A second transmission rod is rotatably connected to the side of the third limit rod away from the transmission shaft. A third transmission rod is rotatably connected to the end of the second transmission rod away from the transmission shaft.

[0012] Furthermore, the bottom of the transmission rod 2 is rotatably connected to a spring 3, one end of the spring 3 away from the transmission rod 2 is fixedly connected to the side wall of the transmission shaft, and one end of the transmission rod 3 away from the transmission rod 2 is rotatably connected to a moving block, and the side wall of the moving block is open.

[0013] Furthermore, two limit columns 2 are slidably connected to the opening of the moving block, and one end of the limit column 2 close to the transmission shaft is fixedly connected to a limit plate, and the bottom of the limit plate is fixedly connected to the top of the brush 1. The left and right sides of the moving block are rotatably connected to transmission rods 4, and the end of the transmission rod 4 away from the moving block is rotatably connected to brush 2.

[0014] The present invention has the following beneficial effects: (1) In the present invention, when the motor rotates, the output end of the motor drives the hollow column to rotate. When the hollow column rotates, it drives the fixed block fixed on its surface to rotate. During the rotation, the spring 1 is squeezed by the thrust. During the squeezing, the limit plate 1 is pushed to rotate by the reverse force. While pushing, the limit plate 1 rotates, which drives the circular plate and the transmission shaft to rotate at the same time. When the circular plate rotates, it drives the limit groove inside it to rotate. Since there is a telescopic rod in the limit groove at the bottom, and the limit column 1 is fixed on the bottom of the support plate and the extension rod at the same time, when the circular plate rotates, it rotates in the limit groove, and then drives the transmission shaft to rotate and drives the circular plate to rotate at the same time. When the transmission shaft rotates, it drives the transmission rod 1 to rotate. When the transmission rod 1 rotates, it drives the vibration column to rotate and slide in the groove of the transmission rod 1. When the vibration column rotates, it drives the vibration column above The movable block vibrates on the teeth of the gear plate and is transmitted to the transmission shaft through the vibration column during vibration. At this time, the transmission shaft moves up and down and left and right while rotating. At the same time, the circular plate will rotate and move in the clamping plate. The elastic column next to the clamping plate will prevent the transmission shaft from being out of control during rotation through the elastic force of the spring. The rotating blocks on both sides of the elastic column are to prevent the circular plate from moving up and down at the same time and causing friction. At that time, the semiconductor plate will be cleaned by a pair of brushes at the bottom of the transmission shaft. During cleaning, the brush can evenly clean the surface of the semiconductor plate through shaking and moving, and can quickly cover its surface, so that the brush can fully contact the semiconductor surface, and can effectively shatter the attachments on its surface during vibration, and clean the attachments to one side while the brush rotates. When the brush cleans the attachments while shaking, the semiconductor plate can be cleaned quickly and effectively.

[0015] (2) When the hollow column of the present invention rotates, it will drive the supporting column below to rotate synchronously, and when it rotates, it will drive the hollow tube to rotate. When the hollow tube rotates, it will drive the two hoses on the outer wall to rotate. When the brush rotates, it will drive the hollow tube to rotate at the same time. When the transmission shaft vibrates downward, it will drive the conical block to move at the same time. When the conical block moves, the elastic plate is squeezed to both sides through its outer shape of wide at the top and narrow at the bottom. When the elastic plate is squeezed, it drives the air bag inside it to transmit gas. When the air bag is squeezed, the internal gas is transmitted to the air cushion through the hose. When the transmission shaft moves upward, When moving, the spring 2 under the airbag will restore the airbag to its original shape to prepare for reciprocating movement. When the spring plate expands and squeezes the inner tube through the rubber ring, the air cushion can squeeze the semiconductor from the bottom, which can reduce the elastic non-reset of the airbag after squeezing and restore it to its state before deformation, helping to maintain its original shape and reduce deformation caused by elastic reset to avoid damage to the semiconductor surface, thereby better protecting the integrity of its surface. This method can effectively prevent damage to the semiconductor plate due to force during the cleaning process.

[0016] (3) In the present invention, when the transmission shaft moves upward, the transmission rod 2 is pushed downward by squeezing, and when the transmission rod 2 moves, the transmission rod 3 below is pushed to move. Since the limit column 2 is fixed to the fixed column, when the transmission rod 3 moves, the moving block below is pushed to move downward. In order to prevent the moving block from deviating from the original moving state when it moves up and down, the disc outside the limit column 2 is provided so that the groove inside the moving block can slide on the outer surface of the limit column 2. When the moving block slides downward, the transmission rods 4 on its left and right sides can rotate on its surface. Therefore, when the moving block slides downward, it will push the transmission rod 4 to move in the opposite direction. The air cushion extends outward, and at the same time pushes the fixed block below it to swing. Since the fixed block is above the brush, the brush can be brought closer when the transmission shaft moves upward to clean the attachments on the bottom of the air cushion. When the air cushion performs shock absorption on the semiconductor board, the attachments are easily adhered to its surface. When it performs shock absorption on the semiconductor surface again, it is easy to damage it. By continuously swinging, the relative movement between the brush and the air cushion is increased, the friction and adhesion between the particles are reduced, the retention of attached materials on the semiconductor surface is reduced, and the secondary damage when cleaning the semiconductor board is reduced, thereby reducing costs.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0019] Figure 1 Schematic diagram of the overall structure of the present invention; Figure 2 Schematic diagram of the partial sectional structure of the overall of the present invention; Figure 3 Schematic diagram of the internal part structure of the main body of the present invention; Figure 4 Schematic diagram of the rotating mechanism of the present invention; Figure 5 Schematic diagram of the shaking mechanism of the present invention; Figure 6 Schematic diagram of the shock absorption mechanism of the present invention; Figure 7 Schematic diagram of the partial sectional structure of the shock absorption mechanism of the present invention; Figure 8 Schematic diagram of the cleaning mechanism of the present invention; Figure 9 Enlarged view of part A of the cleaning mechanism of the present invention.

[0020] In the accompanying drawings, the list of components represented by each reference numeral is as follows: In the figure: 1, box body; 101, support plate; 102, support rod; 2, rotating mechanism; 201, motor; 202, hollow column; 203, first spring; 204, first limiting plate; 3, transmission mechanism; 301, circular plate; 302, transmission shaft; 303, first limiting column; 304, circular plate; 305, clamping plate; 306, elastic column; 307, first brush; 4, shaking mechanism; 401, first transmission rod; 402, vibrating column; 403, vibrating block; 404, gear disk; 5, shock absorption mechanism; 501, hollow cylinder; 502, support column; 503, conical block; 504, elastic plate; 505, airbag; 506, second spring; 507, hose; 508, air cushion; 6, cleaning mechanism; 601, third limiting rod; 602, second transmission rod; 603, third spring; 604, third transmission rod; 605, moving block; 606, second limiting column; 607, fourth transmission rod; 608, second brush. Detailed implementation manners

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] Please refer to Figure 1 - Figure 9 As shown in the figure, the present invention is a MASK cleaning device for verifying the effect of semiconductor cleaning agents, including a box body 1. A support plate 101 is fixedly connected to the top of the box body 1, and a support frame is fixedly connected to the top of the support plate 101. A plurality of support rods 102 are fixedly connected to the bottom inner wall of the box body 1. A circular semiconductor is provided at one end of the support rod 102 away from the box body 1. A circular frame is fixedly connected to the bottom of the support plate 101. The device further includes; A rotating mechanism 2, which includes a motor 201 fixedly connected to the top of the support frame. The output end of the motor 201 is fixedly connected to a hollow column 202. The bottom of the hollow column 202 is rotatably connected to the side wall of the support plate 101. A plurality of fixing blocks are fixedly connected to the bottom inner wall of the hollow column 202. One side of the plurality of fixing blocks away from the inner wall of the hollow column 202 is fixedly connected to a first spring 203. One end of the first spring 203 away from the fixing block is fixedly connected to a first limiting plate 204.

[0023] A transmission mechanism 3, which includes a circular plate 301 fixedly connected to the bottom of the plurality of first limiting plates 204. A limiting groove is opened at the bottom of the circular plate 301. An expansion rod is slidably connected to the inner wall of the limiting groove. The bottom of the expansion rod is fixedly connected to a first limiting column 303. One end of the first limiting column 303 away from the circular plate 301 is fixedly connected to the bottom of the support plate 101. A transmission shaft 302 is fixedly connected to the bottom of the circular plate 301. The top of the transmission shaft 302 penetrates through the top outer wall of the circular plate 301 and extends to the outside. A circular plate 304 is fixedly connected to the extended end of the transmission shaft 302. A plurality of clamping plates 305 are slidably connected to the outer surface of the circular plate 304. A first rotating block is fixedly connected to the outer surface of the clamping plate 305. An elastic column 306 is fixedly connected to one side of the first rotating block away from the clamping plate 305. A second rotating block is fixedly connected to the outer surface of the elastic column 306. One end of the second rotating block away from the elastic column 306 is fixedly connected to the inner wall of the hollow column 202. A first brush 307 is fixedly connected to one end of the transmission shaft 302 away from the circular plate 304. Since there is an expansion rod in the bottom limiting groove and the first limiting column 303 is fixed to both the bottom of the support plate 101 and the expansion rod, when the circular plate 301 rotates, it will rotate in the limiting groove, and then drive the transmission shaft 302 to rotate and drive the circular plate 304 to rotate at the same time.

[0024] A shaking mechanism 4 is provided at the bottom of the support plate 101, and the shaking mechanism 4 includes a plurality of transmission rods 401 fixedly connected to the outer surface of the circular plate 301, a slide groove is provided at the top of the transmission rod 401, and a slider is slidably connected inside the slide groove, and when the transmission shaft 302 rotates, the transmission rod 401 is driven to rotate, and when the transmission rod 401 rotates, the vibration column 402 is driven to rotate and slide in the groove of the transmission rod 401; wherein, a toothed disc 404 is fixedly connected to the top inner wall of the circular frame, so that the brush can fully contact the surface of the semiconductor, and can effectively shatter the attachments on its surface during vibration.

[0025] A vibration column 402 is fixedly connected to the top of the slider, and a vibration block 403 is fixedly connected to the side of the vibration column 402 away from the transmission rod 401. The vibration block 403 is slidably connected to the side wall of the toothed disk 404. When the vibration column 402 rotates, it drives the upper vibration block 403 to vibrate on the teeth of the toothed disk 404, and the vibration is transmitted to the transmission shaft 302 through the vibration column 402.

[0026] A shock absorbing mechanism 5 is provided on the outer surface of the transmission shaft 302, and the shock absorbing mechanism 5 includes a hollow cylinder 501 arranged on the outer surface of the transmission rod 401, and a plurality of sliding grooves are opened on the top of the hollow cylinder 501, and the sliding grooves are slidably connected to the transmission rod 401, and a plurality of support columns 502 are fixedly connected to the top of the hollow cylinder 501, and the top of the support column 502 is fixedly connected to the inner wall of the bottom of the hollow column 202, and a conical block 503 is provided inside the hollow cylinder 501, and the inner wall of the conical block 503 is fixedly connected to the outer surface of the transmission shaft 302, and the hollow cylinder 501 will rotate when rotating, and when the hollow cylinder 501 rotates, it will drive the two hoses 507 on the outer wall to rotate, and when the brush 307 rotates, it will drive the hollow cylinder 501 to rotate at the same time, and when the transmission shaft 302 vibrates downward, it will drive the conical block 503 to move at the same time.

[0027] The outer surface of the bottom of the conical block 503 is slidably connected to two elastic plates 504, and the two elastic plates 504 are respectively fixedly connected to the inner wall of the hollow cylinder 501, and the end of the elastic plate 504 away from the conical block 503 is fixedly connected to an air bag 505, and the bottom of the air bag 505 is fixedly connected to a spring 2 506, and the end of the air bag 505 away from the elastic plate 504 is fixedly connected to a hose 507, and the end of the hose 507 away from the hollow cylinder 501 penetrates the outer wall of the hollow cylinder 501 and is connected to the brush 3 07 is fixedly connected, and an air cushion 508 is provided at the extended end of the hose 507. The outer surface of the air cushion 508 is fixedly connected to the bottom inner wall of the brush 307, and the air cushion 508 is connected to the hose 507. When the airbag 505 is squeezed, the internal gas is transmitted to the air cushion 508 through the hose 507. When the transmission shaft 302 moves upward, the spring 2 506 under the airbag 505 will restore the airbag 505 to its original shape to prepare for reciprocating movement.

[0028] A cleaning mechanism 6 is provided at the bottom of the hollow cylinder 501, and the cleaning mechanism 6 includes two limit rods 3 601 fixedly connected to the outer surface of the transmission shaft 302. The limit rod 3 601 is rotatably connected to the transmission rod 2 602 at one end away from the transmission shaft 302, and the transmission rod 2 602 is rotatably connected to the transmission rod 3 604 at one end away from the transmission shaft 302. When the transmission rod 2 602 moves, it pushes the transmission rod 3 604 below to move. Since the limit column 2 606 is fixed on the fixed column, when the transmission rod 3 604 moves, it pushes the moving block 605 below to move downward. The disc on the outer side of the limit column 2 606 prevents the moving block 605 from deviating from the original motion state when moving up and down.

[0029] The bottom of the transmission rod 2 602 is rotatably connected to a spring 3 603, and one end of the spring 3 603 away from the transmission rod 2 602 is fixedly connected to the side wall of the transmission shaft 302. The end of the transmission rod 3 604 away from the transmission rod 2 602 is rotatably connected to a moving block 605, and the side wall of the moving block 605 is open. Since the fixed block is above the brush, when the transmission shaft 302 moves upward, the brush 2 608 can be brought closer to clean the attachments at the bottom of the air cushion 508.

[0030] Two limit columns 606 are slidably connected to the opening of the moving block 605, and one end of the limit column 606 close to the transmission shaft 302 is fixedly connected to the limit plate, and the bottom of the limit plate is fixedly connected to the top of the brush 1 307. The left and right sides of the moving block 605 are rotatably connected to the transmission rod 4 607, and the end of the transmission rod 4 607 away from the moving block 605 is rotatably connected to the brush 2 608, so that the groove inside the moving block 605 can slide on the outer surface of the limit column 606. When the moving block 605 slides downward, the transmission rods 4 607 on its left and right sides can rotate on its surface, so when the moving block 605 slides downward, it will push the transmission rod 4 607 to extend outward, and at the same time push the fixed block below it to swing.

[0031] When in use, the required semiconductor board is placed in the groove of the support rod 102, and then the motor 201 is started, and the hollow column 202 is driven to rotate through the output end of the motor 201. When the hollow column 202 rotates, it drives the fixed block fixed on its surface to rotate. During the rotation, the spring 1 203 is squeezed by the thrust, and the limit plate 1 204 is pushed to rotate by the reverse force during the squeezing. While pushing, when the limit plate 1 204 rotates, it drives the circular plate 301 and the transmission shaft 302 to rotate at the same time.

[0032] When the circular plate 301 rotates, it will drive the limiting groove inside it to rotate. Since there is a telescopic rod in the limiting groove at the bottom, and the limiting column 103 is fixed on the bottom of the support plate 101 and the extension rod at the same time, when the circular plate 301 rotates, it will rotate in the limiting groove, and then it will drive the transmission shaft 302 to rotate and drive the circular plate 304 to rotate. When the transmission shaft 302 rotates, it will drive the transmission rod 1 401 to rotate. When the transmission rod 1 401 rotates, it will drive the vibration column 402 to rotate and slide in the groove of the transmission rod 1 401. When the vibration column 402 rotates, it will drive the vibration block 403 above to vibrate on the teeth of the toothed disk 404. During the vibration, it is transmitted to the transmission shaft 302 through the vibration column 402. At this time, the transmission shaft 302 moves up and down and left and right while rotating, and the circular plate 304 will rotate and move in the clamping plate 305, and the elastic column 306 beside the clamping plate 305 will prevent the transmission shaft 302 from being uncontrolled during rotation through the elastic force of the spring, and the rotating blocks on both sides of the elastic column 306 will prevent the circular plate 304 from not being able to move up and down at the same time and causing friction. At that time, the semiconductor board will be cleaned by the brush 307 at the bottom of the transmission shaft 302. During cleaning, the brush can evenly clean the surface of the semiconductor board through shaking and moving, and can quickly cover its surface, so that the brush can fully contact the semiconductor surface, and can effectively shatter the attachments on its surface during vibration, and clean the attachments to one side while the brush rotates. When the brush cleans the attachments while shaking, the semiconductor board can be cleaned quickly and effectively.

[0033] When the hollow column 202 rotates, it will drive the support column 502 below to rotate synchronously, and when it rotates, it will drive the hollow cylinder 501 to rotate. When the hollow cylinder 501 rotates, it will drive the two hoses 507 on the outer wall to rotate. When the brush 307 rotates, it will drive the hollow cylinder 501 to rotate at the same time. When the transmission shaft 302 vibrates downward, it will drive the conical block 503 to move at the same time. When the conical block 503 moves, the elastic plate 504 is squeezed to both sides through its outer shape of wide at the top and narrow at the bottom. When the elastic plate 504 is squeezed, it drives the air bag 505 inside it to transmit gas. When the air bag 505 is squeezed, the internal gas is transmitted to the air cushion 5 through the hose 507. 08, when the transmission shaft 302 moves upward, the spring 2 506 below the airbag 505 will restore the airbag 505 to its original shape in preparation for reciprocating movement. When the spring plate expands and squeezes the inner tube through the rubber ring, the air cushion 508 can squeeze the semiconductor from the bottom, which can reduce the elastic non-reset of the airbag 505 after squeezing and restore it to the state before deformation, which helps to maintain the original shape and reduce deformation caused by elastic reset to avoid damage to the semiconductor surface, thereby better protecting the integrity of its surface. This method can effectively prevent damage to the semiconductor board due to force during the cleaning process.

[0034] When the transmission shaft 302 moves upward, the transmission rod 2 602 is pushed downward by squeezing, and when the transmission rod 2 602 moves, the transmission rod 3 604 below is pushed to move. Since the limiting column 2 606 is fixed to the fixed column, when the transmission rod 3 604 moves, it pushes the moving block 605 below to move downward. The disc on the outer side of the limiting column 2 606 is used to prevent the moving block 605 from deviating from the original motion state when moving up and down, so that the groove inside the moving block 605 can slide on the outer surface of the limiting column 2 606. When the moving block 605 slides downward, the transmission rods 4 607 on its left and right sides can rotate on its surface. Therefore, when the moving block 605 slides downward, The transmission rod 4 607 is pushed to extend outward, and the fixed block below it is pushed to swing while extending. Since the fixed block is above the brush, the brush 2 608 can be brought closer when the transmission shaft 302 moves upward to clean the attachments at the bottom of the air cushion 508. When the air cushion 508 performs shock absorption on the semiconductor board, the attachments are easily adhered to its surface. When it performs shock absorption on the semiconductor surface again, it is easy to damage it. By continuously swinging, the relative movement between the brush and the air cushion 508 is increased, the friction and adhesion between the particles are reduced, and the retention of attached materials on the semiconductor surface is reduced, thereby reducing the secondary damage to the semiconductor board when cleaning it, thereby reducing costs.

[0035] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A MASK cleaning device for verifying the effect of a semiconductor cleaning agent, comprising a box body (1), a support plate (101) is fixedly connected to the top of the box body (1), a support frame is fixedly connected to the top of the support plate (101), a plurality of support rods (102) are fixedly connected to the bottom inner wall of the box body (1), a circular semiconductor is arranged at one end of the support rod (102) away from the box body (1), a circular frame is fixedly connected to the bottom of the support plate (101), and it is characterized in that, Further comprising; A rotating mechanism (2), the rotating mechanism (2) includes a motor (201) fixedly connected to the top of the support frame, the output end of the motor (201) is fixedly connected with a hollow column (202), the bottom of the hollow column (202) is rotatably connected to the side wall of the support plate (101), the inner wall of the bottom of the hollow column (202) is fixedly connected with a plurality of fixed blocks, one side of the plurality of fixed blocks away from the inner wall of the hollow column (202) is fixedly connected with a first spring (203), and one end of the first spring (203) away from the fixed block is fixedly connected with a first limiting plate (204); A transmission mechanism (3), the transmission mechanism (3) includes a circular plate (301) fixedly connected to the bottom of a plurality of first limiting plates (204), a limiting groove is formed in the bottom of the circular plate (301), a telescopic rod is slidably connected to the inner wall of the limiting groove, the bottom of the telescopic rod is fixedly connected with a first limiting column (303), one end of the first limiting column (303) away from the circular plate (301) is fixedly connected to the bottom of the support plate (101), a transmission shaft (302) is fixedly connected to the bottom of the circular plate (301), the top of the transmission shaft (302) penetrates through the top outer wall of the circular plate (301) and extends to the outside, a circular plate (304) is fixedly connected to the extended end of the transmission shaft (302), a plurality of clamping plates (305) are slidably connected to the outer surface of the circular plate (304), a first rotating block is fixedly connected to the outer surface of the clamping plate (305), a resilient column (306) is fixedly connected to one side of the first rotating block away from the clamping plate (305), a second rotating block is fixedly connected to the outer surface of the resilient column (306), and one end of the second rotating block away from the resilient column (306) is fixedly connected to the inner wall of the hollow column (202), and a first brush (307) is fixedly connected to one end of the transmission shaft (302) away from the circular plate (304).

2. The MASK cleaning device for verifying the effect of semiconductor cleaning agent according to claim 1, wherein: A shaking mechanism (4) is arranged at the bottom of the support plate (101), the shaking mechanism (4) includes a plurality of first transmission rods (401) fixedly connected to the outer surface of the circular plate (301), a chute is formed in the top of the first transmission rod (401), and a slider is slidably connected inside the chute; Wherein, a toothed disc (404) is fixedly connected to the inner wall of the top of the circular frame.

3. A MASK cleaning device for verifying the effect of a semiconductor cleaning agent according to claim 2, characterized in that: The top of the slider is fixedly connected with a vibrating column (402), one side of the vibrating column (402) away from the first transmission rod (401) is fixedly connected with a vibrating block (403), and the vibrating block (403) is slidably connected to the side wall of the toothed disc (404).

4. A MASK cleaning device for verifying the effect of a semiconductor cleaning agent according to claim 3, characterized in that: A shock-absorbing mechanism (5) is provided on the outer surface of the transmission shaft (302). The shock-absorbing mechanism (5) includes a hollow cylinder (501) provided on the outer surface of the first transmission rod (401). A plurality of sliding grooves are provided at the top of the hollow cylinder (501), and the sliding grooves are slidably connected to the first transmission rod (401). A plurality of support columns (502) are fixedly connected to the top of the hollow cylinder (501), and the top of the support columns (502) is fixedly connected to the inner wall of the bottom of the hollow column (202). A tapered block (503) is provided inside the hollow cylinder (501), and the inner wall of the tapered block (503) is fixedly connected to the outer surface of the transmission shaft (302).

5. A MASK cleaning device for verifying the effect of a semiconductor cleaning agent according to claim 4, characterized in that: Two elastic plates (504) are slidably connected to the outer surface of the bottom of the tapered block (503). The two elastic plates (504) are respectively fixedly connected to the inner wall of the hollow cylinder (501). One end of the elastic plate (504) away from the tapered block (503) is fixedly connected to an airbag (505). A second spring (506) is fixedly connected to the bottom of the airbag (505). One end of the airbag (505) away from the elastic plate (504) is fixedly connected to a hose (507). One end of the hose (507) away from the hollow cylinder (501) penetrates through the outer wall of the hollow cylinder (501) and is fixedly connected to a first brush (307). An air cushion (508) is provided at the extended end of the hose (507), and the outer surface of the air cushion (508) is fixedly connected to the inner wall of the bottom of the first brush (307). The air cushion (508) and the hose (507) are in a communicating setting.

6. A MASK cleaning device for verifying the effect of a semiconductor cleaning agent according to claim 5, characterized in that: A cleaning mechanism (6) is provided at the bottom of the hollow cylinder (501). The cleaning mechanism (6) includes two third limiting rods (601) fixedly connected to the outer surface of the transmission shaft (302). A second transmission rod (602) is rotatably connected to the side of the third limiting rod (601) away from the transmission shaft (302). A third transmission rod (604) is rotatably connected to the end of the second transmission rod (602) away from the transmission shaft (302).

7. A MASK cleaning device for verifying the effect of a semiconductor cleaning agent according to claim 6, characterized in that: A third spring (603) is rotatably connected to the bottom of the second transmission rod (602). One end of the third spring (603) away from the second transmission rod (602) is fixedly connected to the side wall of the transmission shaft (302). A moving block (605) is rotatably connected to the end of the third transmission rod (604) away from the second transmission rod (602). The side wall of the moving block (605) is open.

8. A MASK cleaning device for verifying the effect of a semiconductor cleaning agent according to claim 7, characterized in that: Two second limiting columns (606) are slidably connected to the opening of the moving block (605). One end of the second limiting column (606) close to the transmission shaft (302) is fixedly connected to a limiting plate, and the bottom of the limiting plate is fixedly connected to the top of the first brush (307). A fourth transmission rod (607) is rotatably connected to both the left side and the right side of the moving block (605). A second brush (608) is rotatably connected to the end of the fourth transmission rod (607) away from the moving block (605).

Images