Detector assembly repairing process based on failure caused by mutual gold fusion

Abstract

The invention relates to the technical field of detector assembly repair, and discloses a detector assembly repair process based on failure due to mutual gold fusion, which comprises the following steps: detecting the failure condition of a detector assembly failed due to mutual gold fusion; removing the oxide layer and the residual mutual melting metal at the failure part of the detector assembly; determining the type, the shape and the size of a coating material according to the material characteristics of the detector assembly, the failure condition and the special requirements of a repair process; welding the coating material to the failure part of the detector assembly; performing room-temperature aging treatment on the welded detector assembly; carrying out high-temperature vacuum roasting treatment on the treated detector assembly; carrying out surface cleaning treatment on the repaired detector assembly and carrying out temperature alternating treatment on a detector chip in the detector assembly; and detecting the repaired detector assembly again. The method can be used for efficiently, reliably and comprehensively repairing the detector assembly which fails due to mutual gold fusion, and the service life of the detector assembly is effectively prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of detector component repair, and more particularly, to a repair process for detector components based on gold interdiffusion failure. Background Art

[0002] During the long-term use of detectors, gold interdiffusion failure is one of the main factors leading to the performance degradation or even complete failure of detector components. Gold interdiffusion failure usually occurs when the detector is under complex working conditions, and the gold material inside the component reacts abnormally with other substances, resulting in a sharp deterioration of the physical and electrical properties of the component. As a result, the detector cannot work properly, and the key performance indicators such as sensitivity and accuracy of the detector are significantly reduced.

[0003] The current repair processes on the market for such problems have obvious shortcomings. Most traditional repair methods rely on manual experience and relatively crude detection equipment, making it difficult to accurately determine the specific location and scope of influence of gold interdiffusion failure. This lack of a precise target for the repair work. In addition, during the repair process, due to the limitations of technical means, it is easy to accidentally damage other intact parts of the detector component, further reducing the reliability of the detector. Moreover, the repaired detector components have poor stability and often cannot maintain a normal working state for a long time, failing to meet the stringent requirements of modern industry and scientific research for high stability and long life of detectors.

[0004] Therefore, it is urgent to develop a new and highly targeted repair process for detector components based on gold interdiffusion failure.

[0005] In view of this, the present invention proposes a repair process for detector components based on gold interdiffusion failure to solve the above problems. Summary of the Invention

[0006] In view of this, the present invention proposes a repair process for detector components based on gold interdiffusion failure, which aims to solve the problems of poor repair effect, poor stability and extending the life of the repaired detector components existing in the existing detector component repair processes.

[0007] On the one hand, the present invention proposes a repair process for detector components based on gold interdiffusion failure, including:

[0008] Detecting the failure situation of the detector component with gold interdiffusion failure;

[0009] Removing the oxide layer and residual interdiffused metal at the failure part of the detector component;

[0010] Determining the type, shape and size of the coating material according to the material properties of the detector component, the failure situation and the special requirements of the repair process;

[0011] Weld the coating material to the failed part of the detector assembly;

[0012] Perform room-temperature aging treatment on the detector assembly after welding to obtain the treated detector assembly;

[0013] Perform high-temperature vacuum baking treatment on the treated detector assembly to obtain the repaired detector assembly;

[0014] Perform surface cleaning treatment on the repaired detector assembly and perform temperature cycling treatment on the detector chip inside the detector assembly;

[0015] Detect the repaired detector assembly again.

[0016] Further, the process of removing the oxide layer and residual mutual-fusion metal at the failed part of the detector assembly includes:

[0017] Place the detector assembly in an environment with a high vacuum degree and perform low-temperature baking pretreatment;

[0018] Control the parameters of the vacuum degree, baking temperature, and baking time.

[0019] Further, the process of determining the type, shape, and size of the coating material according to the material characteristics of the detector assembly, the failure situation, and the special requirements of the repair process includes:

[0020] Select a gold alloy material according to the chemical composition and physical properties of the gold material in the detector assembly;

[0021] Prepare the gold alloy material into a repair part according to the shape and size of the failed part of the detector assembly.

[0022] Further, the process of welding the coating material to the failed part of the detector assembly includes:

[0023] Control the quality, volume, and coating morphology of the coating material through real-time monitoring and closed-loop control technology, and control the imprint area of the solder joint on the original electrode at the failed part of the detector assembly and the height of the solder joint in the longitudinal direction.

[0024] Further, when detecting the failure situation of the detector assembly that fails due to gold mutual fusion, use a high-precision microscope and an X-ray diffractometer for detection.

[0025] Further, the vacuum degree of the low-temperature baking pretreatment is in Pascals; the baking temperature of the low-temperature baking pretreatment is 50°C - 80°C; the baking time of the low-temperature baking pretreatment is 2 hours - 4 hours.

[0026] Further, the temperature of the room temperature aging treatment is 45°C - 55°C, and the duration of the room temperature aging treatment is 48 hours - 72 hours.

[0027] Further, the temperature of the high-temperature vacuum baking treatment is 70°C - 80°C; the vacuum degree of the high-temperature vacuum baking treatment is 4×10 -4 Pa, and the duration of the high-temperature vacuum baking treatment is 16 hours - 24 hours.

[0028] Further, the process of performing temperature cycling treatment on the detector chip in the detector assembly includes:

[0029] Using a refrigerator to cool the temperature of the detector to 80K;

[0030] The vacuum degree is less than 4×Pa, the cooling rate is not less than 0.89K / s, the holding time at 80K is not less than 3 minutes, the rewarming time is not less than 1 hour, and the number of cycling treatments is not less than 10 times.

[0031] Further, the imprint area accounts for 70% - 80% of the area of the corresponding region of the original electrode, and the height does not exceed 0.4mm.

[0032] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0033] The repair process of the present invention can accurately lock and effectively repair the parts failed due to gold eutectic through the methods of detection, repair, and re-detection, realizing efficient, reliable, and comprehensive repair of the detector assembly failed due to gold eutectic, effectively extending its service life, and significantly reducing the repair cost, providing strong support for the wide application and long-term stable operation of the detector.

[0034] The repair process of the present invention determines the type, shape, and size of the coating material according to the material characteristics of the detector assembly, the failure situation, and the special requirements of the repair process. On the premise of ensuring the repair quality, it also significantly improves the economy and practicability of the repair process, providing an economically feasible solution for the large-scale application and maintenance of the detector.

[0035] The repair process of the present invention performs surface cleaning treatment on the repaired detector assembly and temperature cycling treatment on the detector chip in the detector assembly, which can qualitatively improve the stability and reliability of the repaired detector assembly, extend the service life of the detection assembly, and enable the detection assembly to operate stably in various extremely complex working environments, meeting the stringent requirements for detector performance in modern high-end application fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Upon reading the following detailed description of the preferred embodiments, various other advantages and benefits will become apparent to those of ordinary skill in the art. The drawings are provided only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Also, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0037] Figure 1 FIG. is a flowchart of a repair process for a detector component based on the failure of gold interfusion according to an embodiment of the present invention. Detailed Embodiments

[0038] Hereinafter, exemplary embodiments of the present disclosure will be described in more detail with reference to the drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be completely conveyed to those skilled in the art. It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. Hereinafter, the present invention will be described in detail with reference to the drawings and in conjunction with the embodiments.

[0039] During the long-term use of the detector, the failure of gold interfusion is one of the main factors leading to the performance degradation or even complete failure of the detector component.

[0040] The current repair processes on the market for such problems have obvious shortcomings. Most traditional repair methods rely on manual experience and relatively crude detection equipment, making it difficult to accurately determine the specific location and scope of influence of the gold interfusion failure, which makes the repair work lack a precise target orientation. In addition, during the repair implementation process, due to the limitations of technical means, it is easy to cause accidental damage to other intact parts of the detector component, further reducing the reliability of the detector. Moreover, the repaired detector component shows poor stability and often has difficulty maintaining a normal working state for a long time, unable to meet the strict requirements of modern industry and scientific research for the high stability and long life of the detector.

[0041] Therefore, the present invention proposes a repair process for a detector component based on the failure of gold interfusion to solve the above problems.

[0042] Refer to Figure 1 As shown, in some embodiments of the present application, a repair process for a detector component based on the failure of gold interfusion includes:

[0043] S1. Detect the failure situation of the detector component with gold interfusion failure;

[0044] S2. Remove the oxide layer and residual interfusion metal at the failure part of the detector component;

[0045] S3. Determine the type, shape, and size of the coating material based on the material properties of the detector component, the failure situation, and the special requirements of the repair process;

[0046] S4. Weld the coating material to the failed part of the detector component;

[0047] S5. Perform room-temperature aging treatment on the welded detector component to obtain the treated detector component;

[0048] S6. Perform high-temperature vacuum baking treatment on the treated detector component to obtain the repaired detector component;

[0049] S7. Perform surface cleaning treatment on the repaired detector component and perform temperature cycling treatment on the detector chip inside the detector component;

[0050] S8. Detect the repaired detector component again.

[0051] Specifically, use a high-precision microscope and an X-ray diffractometer for detection to determine the failure situation of the gold interfusion. The failure situation includes the specific location of the gold interfusion, the severity, the potential impact on the surrounding structure, and the proportion of the area of gold layer loss in the size of the original gold disc.

[0052] It can be understood that detecting the failure situation provides accurate data basis for the subsequent repair work of the detector component.

[0053] Specifically, use an innovative method that combines chemical corrosion and physical grinding to pre-treat the failed part of the detection component. First, mechanically scrape with a metal pin to remove the porous and fluffy intermetallic compound formed by the gold reaction on the failed electrode. Then, place the detector component in an environment with a high vacuum degree for low-temperature baking pre-treatment to ensure that the surface of the repair area reaches a highly clean and flat state, laying a solid foundation for the effective adhesion of the subsequent coating material and the smooth progress of the repair operation.

[0054] Specifically, when determining the type, shape, and size of the coating material based on the material properties of the detector component, the failure situation, and the special requirements of the repair process, prepare the coating material into a metal microsphere structure with a diameter less than 15 microns, stir it into a paste with low-temperature glue to obtain a repair paste. Then, through precision machining technology, prepare the coating material into a repair part that perfectly fits the geometric shape and dimensional accuracy of the failed part.

[0055] It can be understood that the repair paste after the above treatment can achieve a perfect combination with the original component.

[0056] Specifically, the repair paste is welded to the failed part of the detector assembly. After welding, the detector assembly is first subjected to room temperature aging treatment, and then high-temperature vacuum baking and thermal shock treatment are carried out to obtain the repaired detector assembly.

[0057] Specifically, the repaired detector assembly is subjected to surface cleaning treatment to remove the residual welding impurities and other superfluous substances on the surface of the repaired detector assembly.

[0058] It can be understood that surface cleaning treatment of the repaired detector assembly to remove the residual welding impurities and other superfluous substances on the surface can provide long-term anti-corrosion and anti-oxidation protection for the assembly, and significantly reduce the risk of gold eutectic failure occurring again.

[0059] Specifically, a high-precision microscope and X-ray diffractometer are used to detect the situation of the repair point, and the morphology of the solder joints after repair is compared to confirm that there are no defects such as detachment and microcracks.

[0060] Specifically, the optoelectronic performance of the repaired detector assembly is detected. If the detector performance is qualified, the repair of the detector assembly is completed.

[0061] It can be understood that high-temperature vacuum baking treatment is carried out to effectively eliminate the residual stress generated during the welding process, optimize the microstructure inside the assembly, and improve the overall structural stability of the assembly.

[0062] It can be understood that surface cleaning treatment of the repaired detector assembly is to provide long-term anti-corrosion and anti-oxidation protection for the assembly, and significantly reduce the risk of gold eutectic failure occurring again.

[0063] It can be understood that when the repaired detector assembly is detected again, a comprehensive and strict detection is carried out on the repaired detector assembly, including multiple dimensions such as detailed inspection of the appearance of the detector assembly, accurate testing of electrical performance, and long-term stability testing. Through a series of strict tests, it is ensured that the performance of the repaired assembly not only fully recovers, but even exceeds the original design requirements, reaching excellent performance.

[0064] It can be seen that the repair process of the present invention can accurately lock and effectively repair the parts failed due to gold eutectic through the methods of detection, repair, and re-detection, realizing efficient, reliable, and comprehensive repair of the detector assembly failed due to gold eutectic, effectively extending its service life, and significantly reducing the repair cost, providing strong support for the wide application and long-term stable operation of the detector.

[0065] Refer to Figure 1As shown, in some embodiments of the present application, the process of removing the oxide layer and residual mutual-fused metal at the failure site of the detector assembly includes: placing the detector assembly in an environment with a high vacuum degree for low-temperature baking pretreatment; controlling the parameters of the vacuum degree, baking temperature, and baking time.

[0066] Specifically, before the pretreatment of the oxide layer and residual mutual-fused metal, the detector assembly detected to have a gold mutual-fusion failure problem needs to be placed in an environment with a high vacuum degree for low-temperature baking pretreatment. By precisely controlling parameters such as the vacuum degree, baking temperature, and baking time, the moisture, dust, and other impurity pollutants adsorbed on the surface of the assembly are completely removed.

[0067] It can be understood that the above operations can create a clean and stable basic environment for subsequent repair operations, avoiding the introduction of new interference factors during the repair process.

[0068] Refer to Figure 1 As shown, in some embodiments of the present application, the process of determining the type, shape, and size of the coating material according to the material characteristics of the detector assembly, the failure situation, and the special requirements of the repair process includes: selecting a gold alloy material according to the chemical composition and physical properties of the gold material in the detector assembly; preparing the gold alloy material into a repair part according to the shape and size of the failure site of the detector assembly.

[0069] Specifically, the type of the coating material is selected as a high-quality gold alloy material that highly matches the chemical composition and physical properties of the gold material in the original assembly. Using precision processing equipment and accurate coating equipment, such as CNC machining centers, wire cutting machines, etc., the coating material is processed into a repair part that perfectly fits the shape and size of the failure site.

[0070] It can be understood that the above operations can ensure perfect combination of the coating material and the original assembly, and strictly detect the surface quality and accuracy of the repair part to ensure that it meets the requirements of the repair process.

[0071] Refer to Figure 1 As shown, in some embodiments of the present application, the process of welding the coating material to the failure site of the detector assembly includes: controlling the quality, volume, and coating morphology of the coating material through real-time monitoring and closed-loop control technology, and controlling the imprint area of the solder joint on the original electrode at the failure site of the detector assembly and the height of the solder joint in the longitudinal direction.

[0072] Specifically, using high-precision precision positioning and coating equipment, the prepared repair part is precisely welded to the target position of the gold mutual-fusion failure.

[0073] It can be understood that during the welding process, by means of real-time monitoring and closed-loop control technologies, strictly controlling the quality, volume, and coating morphology of the coating material can make the coated material precisely match the shape of the failed part, better conform to the original structure, contribute to restoring the normal function of the detector assembly, and at the same time avoid problems such as stress concentration caused by irregular morphology, thereby improving the reliability after repair.

[0074] It can be understood that controlling the imprint area of the solder joint on the original electrode at the failed part of the detector assembly to meet the requirements enables the solder joint to make good contact and connection with the original electrode, thereby improving the electrical performance of the detector. Controlling the height of the solder joint precisely in the longitudinal direction is conducive to heat dissipation and preventing electrical interference, improving the stability and safety of the detector assembly.

[0075] Refer to Figure 1 As shown, in some embodiments of the present application, when detecting the failure situation of a detector assembly that fails due to gold interdiffusion, a high-precision microscope and an X-ray diffractometer are used for detection.

[0076] It can be understood that a high-precision microscope and an X-ray diffractometer are used to conduct a comprehensive and detailed scan of the detector assembly without dead angles. With the help of advanced data analysis algorithms, the X-ray fluorescence spectrum data collected is deeply mined and analyzed, so as to accurately define the specific position coordinates, range size, and degree of gold interdiffusion failure, providing detailed and accurate information basis for subsequent repair work.

[0077] Refer to Figure 1 As shown, in some embodiments of the present application, the vacuum degree of the low-temperature baking pretreatment is in Pascals; the baking temperature of the low-temperature baking pretreatment is 50°C - 80°C; the baking time of the low-temperature baking pretreatment is 2 hours - 4 hours.

[0078] Specifically, when placing the detector assembly in an environment with a high vacuum degree for low-temperature baking pretreatment, the vacuum degree is preferably 10 -3 Pascals, the baking temperature is preferably 60°C, and the baking time is preferably 2.5 hours.

[0079] Refer to Figure 1 As shown, in some embodiments of the present application, the temperature of the room-temperature aging treatment is 45°C - 55°C, and the duration of the room-temperature aging treatment is 48 hours - 72 hours.

[0080] Specifically, the temperature of the room-temperature aging treatment is 45°C, and the duration of the room-temperature aging treatment is preferably 72 hours.

[0081] Refer to Figure 1As shown, in some embodiments of the present application, the temperature of the high-temperature vacuum baking treatment is selected to be 70°C - 80°C; the vacuum degree of the high-temperature vacuum baking treatment is 4×10 -4 Pa, and the duration of the high-temperature vacuum baking treatment is 16 hours - 24 hours.

[0082] Specifically, the temperature of the high-temperature vacuum baking treatment is preferably 80°C, and the duration of the high-temperature vacuum baking treatment is preferably 21 hours.

[0083] It can be understood that after the repair is completed, the detector assembly is subjected to high-temperature vacuum baking treatment. By controlling the temperature and time, the residual stress generated during the welding process can be effectively eliminated, the microstructure inside the assembly can be optimized, and the overall structural stability of the assembly can be improved.

[0084] Referring to Figure 1 As shown, in some embodiments of the present application, the process of performing temperature cycling treatment on the detector chip in the detector assembly includes: using a refrigerator to cool the temperature of the detector to 80K; the vacuum degree is less than 4×10 -4 Pa, the cooling rate is not less than 0.89K / s, the holding time at 80K is not less than 3 minutes, the rewarming time is not less than 1 hour, and the number of cycling treatments is not less than 10 times.

[0085] Specifically, a throttle refrigerator or a Stirling refrigerator can be used to cool the detector, or liquid nitrogen can also be used.

[0086] Referring to Figure 1 As shown, in some embodiments of the present application, the imprint area of the solder joint on the original electrode at the failure site of the detector assembly is controlled to account for 70% - 80% of the area of the corresponding region of the original electrode, and the height of the solder joint in the longitudinal direction is controlled not to exceed 0.4mm.

[0087] It can be understood that by strictly controlling the parameters in the processes of low-temperature baking pretreatment, room-temperature aging treatment, high-temperature vacuum baking treatment, and temperature cycling treatment, any potential damage to other normal parts of the detector assembly during the repair process is effectively avoided, ensuring the integrity and reliability of the detector assembly.

[0088] In the above embodiments, a repair process for a detector assembly based on Au-In eutectic failure can accurately lock and effectively repair the failure site due to Au-In eutectic failure through the methods of detection, repair, and re-detection, achieving efficient, reliable, and comprehensive repair of the detector assembly with Au-In eutectic failure, effectively extending its service life, and significantly reducing the repair cost, providing strong support for the wide application and long-term stable operation of the detector.

[0089] The repair process of the present invention determines the type, shape, and size of the coating material based on the material properties of the detector component, the failure situation, and the special requirements of the repair process. On the premise of ensuring the repair quality, it also significantly improves the economy and practicability of the repair process, providing an economically feasible solution for the large-scale application and maintenance of detectors.

[0090] The repair process of the present invention performs surface cleaning treatment on the repaired detector component and temperature cycling treatment on the detector chip inside the detector component, which can qualitatively improve the stability and reliability of the repaired detector component, extend the service life of the detection component, and enable the detection component to operate stably in various extremely complex working environments, meeting the stringent requirements for detector performance in modern high-end application fields.

[0091] The specific implementation process of the present invention:

[0092] S1. Place the detector component stably on the special detection table of the X-ray fluorescence spectrometer. According to the size, shape, and material properties of the detector component, set the scanning parameters, including the scanning range, scanning step size, exposure time, etc. Start the scanning program to perform a comprehensive scan of the component. After the scan is completed, use professional data processing software to perform a series of processing operations on the collected massive X-ray fluorescence spectrum data, such as noise reduction, filtering, feature extraction, etc. By comparing and analyzing with the standard spectrum database, determine the specific location and scope of the gold interdiffusion failure, and make clear and definite marks on the surface of the component.

[0093] S2. First, use a metal through-pin to mechanically scrape to remove the porous and fluffy intermetallic compound formed by the gold reaction on the failed electrode.

[0094] S3. Place the marked detector component in a vacuum oven, set the vacuum degree to 10 -3 Pascal, and continuously pump air through a vacuum pump to ensure the stability of the vacuum environment. Set the baking temperature to 60 °C and the baking time to 2.5 hours, and start the baking program. During the baking process, monitor the temperature and vacuum degree changes in the oven in real time to ensure the smooth progress of the pretreatment process.

[0095] S4. When determining the type, shape, and size of the coating material according to the material properties of the detector component, the failure situation, and the special requirements of the repair process, prepare the coating material into a metal microsphere structure with a diameter less than 15 microns, stir it into a paste with low-temperature glue to obtain a repair paste. Then use high-precision precision positioning and coating equipment to accurately weld the prepared repair part to the target position of the gold interdiffusion failure.

[0096] S5. First, perform a room-temperature aging treatment on the detector assembly after coating the material. The temperature is 45°C and the duration is 72 hours. During the process, strictly control the relative humidity to be less than 40%.

[0097] S6. Carry out a high-temperature vacuum baking treatment on the repaired detector assembly. The temperature is selected as 80°C, the vacuum degree is better than 4×10 -4 Pa, and the duration is 24 hours to obtain the repaired detector assembly.

[0098] S7. Perform a temperature cycling treatment on the detector chip in the repaired detector assembly. The vacuum degree is preferably 4×10 - 4 Pa. Use a throttle refrigerator to cool the detector to about 80K. Control the duration from room temperature to 80K to be 3 minutes, the low-temperature holding time to be 4 minutes, the warm-up time to be 1.5 hours, and the number of temperature cycles to be 15 times.

[0099] S8. Use a high-precision microscope and an X-ray diffractometer to detect the repair points, compare the morphology of the soldered joints after repair, and confirm that there are no defects such as peeling and microcracks.

[0100] S9. Perform a surface cleaning treatment on the repaired detector assembly to remove the excess substances on the surface of the repaired detector assembly.

[0101] S10. Detect the responsivity, noise, etc. of the optoelectronic performance of the repaired detector assembly. If the detector performance is qualified, the repair of the detector assembly is completed.

[0102] Those skilled in the art should understand that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0103] The present application is described with reference to the flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or block in the flowcharts and / or block diagrams can be implemented by computer program instructions, and the combination of the processes and / or blocks in the flowcharts and / or block diagrams can also be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate for implementing in the process Figure 1 each process or multiple processes and / or blocks Figure 1A gardening device with functions specified in one or more boxes.

[0104] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, such that the instructions stored in the computer-readable memory produce a manufactured article including the instruction gardening device, and the instruction gardening device implements the functions specified in the process Figure 1 One process or multiple processes and / or boxes Figure 1 A function specified in one box or multiple boxes.

[0105] These computer program instructions can also be loaded onto a computer or other programmable data processing device, such that a series of operation steps are executed on the computer or other programmable device to produce a computer-implemented process. Thus, the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in the process Figure 1 One process or multiple processes and / or boxes Figure 1 A function specified in one box or multiple boxes.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications or equivalent replacements can still be made to the specific implementation manners of the present invention. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention shall be covered by the protection scope of the claims of the present invention.

Claims

1. A repair process for a detector component based on the failure of mutual melting of indium and gold, characterized in that, Including: Detecting the failure condition of the detector component failed due to gold alloying; Removing the oxide layer and residual alloyed metal at the failed part of the detector component; Determining the type, shape and size of the coating material according to the material properties of the detector component, the failure condition and the special requirements of the repair process; Welding the coating material to the failed part of the detector component; Performing room temperature aging treatment on the detector component after welding to obtain the treated detector component; Performing high temperature vacuum baking treatment on the treated detector component to obtain the repaired detector component; Performing surface cleaning treatment on the repaired detector component and performing temperature cycling treatment on the detector chip inside the detector component; Detecting the repaired detector component again.

2. A repair process for a detector component based on the failure of mutual melting of indium-gold, as described in claim 1, characterized in that, The process of removing the oxide layer and residual alloyed metal at the failed part of the detector component includes; Placing the detector component in an environment with high vacuum degree and performing low temperature baking pretreatment; Controlling the parameters of vacuum degree, baking temperature and baking time.

3. A repair process for a detector assembly based on the failure of mutual melting of indium and gold according to claim 2, characterized in that, The process of determining the type, shape and size of the coating material according to the material properties of the detector component, the failure condition and the special requirements of the repair process includes: Selecting a gold alloy material according to the chemical composition and physical properties of the gold material in the detector component; Preparing the gold alloy material into a repair part according to the shape and size of the failed part of the detector component.

4. A repair process for a detector assembly based on the failure of mutual melting of indium and gold according to claim 1, characterized in that, The process of welding the coating material to the failed part of the detector component includes: Controlling the quality, volume and coating morphology of the coating material through real-time monitoring and closed-loop control technology, and controlling the imprint area of the solder joint on the original electrode at the failed part of the detector component and the height of the solder joint in the longitudinal direction.

5. A repair process for a detector assembly based on the failure of mutual fusion of indium and gold according to claim 1, characterized in that, When detecting the failure condition of the detector component failed due to gold alloying, a high-precision microscope and an X-ray diffractometer are used for detection.

6. A repair process for a detector component based on the failure of mutual fusion of indium and gold according to claim 2, characterized in that, The vacuum degree of the low-temperature baking pretreatment is 10 -3 -10 -5 Pa; the baking temperature of the low-temperature baking pretreatment is 50°C - 80°C; the baking time of the low-temperature baking pretreatment is 2 hours - 4 hours.

7. A repair process for a detector assembly based on the failure of mutual melting of indium gold as claimed in claim 1, characterized in that, The temperature of the room temperature aging treatment is 45°C - 55°C, and the duration of the room temperature aging treatment is 48 hours - 72 hours.

8. A repair process for a detector component based on the failure of mutual fusion of indium and gold according to claim 1, characterized in that, The temperature of the high-temperature vacuum roasting treatment is 70°C - 80°C; the vacuum degree of the high-temperature vacuum roasting treatment is 4×10 -4 Pa, and the duration of the high-temperature vacuum roasting treatment is 16 hours - 24 hours.

9. A repair process for a detector assembly based on the failure of indium-gold intermetallic fusion according to claim 1, characterized in that, The process of performing temperature cycling treatment on the detector chip inside the detector component includes: Using a refrigerator to cool the temperature of the detector to 80K; The vacuum degree is less than 4×10 -4 Pa, the cooling rate is not less than 0.89 K / s, the low-temperature holding time at 80 K is not less than 3 minutes, the rewarming time is not less than 1 hour, and the number of alternating treatments is not less than 10 times.

10. A repair process for a detector component based on the failure of mutual melting of indium gold as described in claim 4, characterized in that, The imprint area accounts for 70% - 80% of the area of the corresponding region of the original electrode, and the height does not exceed 0.4mm.

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