Encoder chip sensor calibration detection platform

Abstract

The invention relates to the technical field of encoder detection, and provides an encoder chip sensor calibration detection platform, which comprises a bearing platform, and is characterized in that the bearing platform is provided with a calibration detection module capable of moving along the arrangement direction of encoder chips so as to respectively detect the positions of a plurality of encoder chip top sensors which are arranged in order; a discharging unit is arranged on the calibration detection module and can move in the direction perpendicular to the arrangement direction of the encoder chips; the discharging unit comprises an upper clamping part and a lower clamping part. According to the invention, the defects in the prior art are overcome, the design is reasonable, the structure is compact, the upper clamping part and the lower clamping part are matched, a fault chip can be automatically transferred to a designated position, manual computer recording and manual classification are not needed, and the working efficiency is obviously improved. When a fault chip is disassembled, the ejector pin can be completely separated from the test seat by ensuring the movement distance of the chip, and the lower clamping part does not move horizontally when vertically moving upwards to push the chip, so that secondary damage is effectively avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of encoder detection, and in particular to a calibration detection platform for encoder chip sensors. Background Art

[0002] In the detection work of encoder chip sensors, traditional methods often rely on manual operation. Workers need to install encoder chip sensors onto the detection platform one by one. During this process, the pins at the bottom of the encoder chip need to be accurately inserted into the upward-protruding test sockets. Subsequently, the detection work is carried out with the aid of a calibration detection mold. However, once a fault is detected in the encoder chip, the system can only record and display it on the computer. Workers need to closely monitor the computer screen at all times and manually remove and separate the faulty encoder chip from the detection platform based on the recorded information. This detection mode not only has a cumbersome process, but also greatly reduces the detection efficiency and increases the labor cost and time cost. For this reason, we propose a calibration detection platform for encoder chip sensors. Summary of the Invention

[0003] (1) Technical Problems to be Solved

[0004] Aiming at the deficiencies of the prior art, the present invention provides a calibration detection platform for encoder chip sensors, which overcomes the deficiencies of the prior art, is reasonably designed and has a compact structure, and solves the problem that when detecting an encoder chip, it is necessary to manually remove the faulty encoder chip.

[0005] (2) Technical Solutions

[0006] To achieve the above object, the present invention is realized through the following technical solutions: A calibration detection platform for encoder chip sensors, including a bearing platform, on which a calibration detection module is provided that can move along the arrangement direction of the encoder chips to respectively detect the positions of the sensors on the tops of several neatly arranged encoder chips. A blanking unit is provided on the calibration detection module, and the blanking unit can move along a direction perpendicular to the arrangement direction of the encoder chips;

[0007] The blanking unit includes an upper clamping part and a lower clamping part. The upper clamping part is arranged on the top of the lower clamping part, and the two can move relatively towards or away from each other. When the upper clamping part and the lower clamping part move relatively towards each other, the probes at the bottom of the encoder chip are separated from the test sockets on the bearing platform.

[0008] Preferably, the blanking unit further includes a guiding structure perpendicular to the arrangement direction of the encoder chips. The upper clamping part and the lower clamping part are symmetrically arranged on both sides of the guiding structure. The upper clamping part can move along the guiding direction of the guiding structure, and the lower clamping part can move along the guiding direction of the guiding structure and the direction perpendicular to the guiding direction, so that after the upper clamping part and the lower clamping part move to the upper and lower sides of the encoder chips, the lower clamping part pushes up the bottom of the encoder chip and cooperates with the upper clamping part to clamp the encoder chip.

[0009] Preferably, the guiding structure includes a guiding frame. Both side walls of the guiding frame are provided with sliding grooves for the sliders to slide. The upper parts of the opposite sides of the two sliders are connected to the upper clamping part.

[0010] Both of the two sliders are penetrated with inclined grooves. A limiting groove is arranged between the two sliding grooves. The limiting groove penetrates through the two sliding grooves and is arranged in cooperation with the inclined grooves. A push rod is inserted into the limiting groove and the first inclined groove together. Both ends of the push rod are connected to the lower clamping part.

[0011] The limiting groove is vertically upwardly opened towards the encoder chip, so that the push rod drives the lower clamping part to move vertically upward under the cooperation of the inclined groove and the limiting groove.

[0012] Preferably, a driving motor is provided on the guiding frame. A pair of cams are provided on the output shaft of the driving motor. The pair of cams are respectively abutted against the side walls of the sliders to push the two sliders to move synchronously. Springs are connected between the two sliders and the guiding frame to ensure that the sliders reset when not stressed.

[0013] Preferably, discs are provided at both ends of the push rod. The two discs are respectively attached to the inner walls of the two sliding grooves, and the diameter of the disc is greater than the width of the limiting groove. Guide plates extending downward are provided on both sides of the push rod. Strip-shaped grooves for the guide plates to penetrate into are opened on both sides of the guiding frame.

[0014] Preferably, a pushing unit is further provided on the calibration detection module. The pushing unit includes a fixing plate connected to the calibration detection module. A track groove for the guiding block to slide in is opened in the fixing plate. The direction of the track groove is perpendicular to the arrangement direction of the encoder chips. A vertical plate is provided on the side of the guiding block away from the fixing plate. The bottom of the vertical plate is connected to the top of the blanking unit.

[0015] Preferably, an inclined groove is opened in the guiding block. A guiding groove cooperating with the inclined groove is opened in the track groove. A moving rod is inserted into the inclined groove and the guiding groove together. The end of the moving rod is connected to the vertical plate. The guiding groove is vertically downwardly opened towards the encoder chip.

[0016] Preferably, two stoppers are provided on the moving rod, and the two stoppers respectively abut against the side walls of the fixed plate and the guide block facing away from each other. Long slots for inserting the vertical plate are symmetrically formed on the upper and lower sides of the guide block, and a cylinder with an output end connected to the guide block is provided inside the fixed plate.

[0017] Preferably, a waste box is provided on the bearing platform in the moving direction of the blanking unit.

[0018] Preferably, the upper clamping part includes an upper clamping arm on the side wall of the slider and an upper clamping plate on the side of the upper clamping arm away from the slider, and a soft pad is provided at the bottom of the upper clamping plate;

[0019] The lower clamping part includes a lower clamping arm connected to the end of the push rod and a lower clamping plate connected to the side of the lower clamping arm away from the push rod, and a soft pad is provided at the top of the lower clamping plate.

[0020] (III) Beneficial effects

[0021] The embodiment of the present invention provides an encoder chip sensor calibration and detection platform, which has the following beneficial effects:

[0022] 1. Through the cooperation of the upper clamping part and the lower clamping part, the faulty chips can be automatically transferred to the designated position, without manual monitoring of computer records and manual classification, significantly improving work efficiency.

[0023] 2. When disassembling the faulty chips, it can ensure that the movement distance of the chips completely separates the thimble from the test socket, and the lower clamping part will not move horizontally when pushing the chips vertically upward, effectively avoiding secondary damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a three-dimensional schematic diagram of the connection structure of the blanking unit and the pushing unit of the present invention;

[0026] Figure 3 It is a three-dimensional schematic diagram of the blanking unit structure of the present invention;

[0027] Figure 4 It is a three-dimensional exploded schematic diagram of the blanking unit structure of the present invention;

[0028] Figure 5 It is a three-dimensional schematic diagram of the guide frame structure of the present invention;

[0029] Figure 6 It is a three-dimensional schematic diagram of the pushing unit structure of the present invention;

[0030] Figure 7 It is a three-dimensional schematic diagram of the fixed plate structure of the present invention;

[0031] Figure 8This is a three-dimensional schematic diagram of the structural disassembly of the pusher unit of the present invention.

[0032] In the figure: 1, bearing platform; 2, calibration detection module; 31, fixing plate; 32, track groove; 33, guiding block; 34, vertical plate; 35, inclined groove; 36, guiding groove; 37, moving rod; 38, retaining piece; 39, long slot; 40, cylinder; 411, guiding frame; 412, sliding groove; 413, slider; 414, inclined slot; 415, limiting slot; 416, push rod; 417, strip-shaped slot; 418, spring; 421, upper clamping arm; 422, upper clamping plate; 431, lower clamping arm; 432, lower clamping plate; 433, disc; 434, guide plate; 441, driving motor; 442, cam; 5, waste box. Specific embodiments

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0034] Referring to the attached Figure 1-8 , an encoder chip sensor calibration detection platform includes a bearing platform 1. A calibration detection module 2 that can move along the arrangement direction of the encoder chips is provided on the bearing platform 1 to respectively detect the positions of the sensors on the tops of a number of neatly arranged encoder chips. The detection process and principle of the sensors on the encoder chips by the calibration detection module 2 belong to the prior art and will not be elaborated here. A blanking unit is provided on the calibration detection module 2. The blanking unit can move along a direction perpendicular to the arrangement direction of the encoder chips. An operator installs the encoder chips at appropriate positions on the bearing platform 1. At this time, the probes at the bottoms of the encoder chips will be inserted into the test sockets on the bearing platform 1. The test sockets on the bearing platform 1 protrude upward, so that there is a gap between the middle of the encoder chips and the top of the bearing platform 1. The calibration detection module 2 can drive the blanking unit to detect the positions of the sensors on the tops of the chips along the arrangement direction of the encoder chips;

[0035] The blanking unit includes an upper clamping part and a lower clamping part. The upper clamping part is arranged on the top of the lower clamping part, and the two can move relatively towards each other or in opposite directions. When the upper clamping part and the lower clamping part move relatively towards each other, the probe at the bottom of the encoder chip is separated from the test socket on the carrier platform 1. When it is detected that there is a fault in the encoder chip sensor or a problem with the position, it is recorded, and the calibration detection module 2 continues to move to the next position. At this time, the blanking unit moves to the position of the faulty encoder chip and moves towards the direction of the faulty encoder chip. At this time, the upper clamping part and the lower clamping part will respectively move to the upper and lower sides of the encoder chip. At this time, the upper clamping part and the lower clamping part move relatively towards each other and lift the encoder chip, so that the probe at the bottom of the encoder chip is separated from the test socket. Then, the upper clamping part and the lower clamping part cooperate to clamp the encoder chip. Then they move in the direction away from the initial position of the encoder chip. After reaching the appropriate position, the system controls the upper clamping part and the lower clamping part to perform a relative separation movement, so that the faulty encoder chip is transferred to the designated position. This process realizes the automatic classification of faulty encoder chips, eliminating the need for staff to closely monitor the computer records and then manually classify, significantly improving work efficiency.

[0036] The blanking unit further includes a guiding structure perpendicular to the arrangement direction of the encoder chips. The upper clamping part and the lower clamping part are symmetrically arranged on both sides of the guiding structure, and the upper clamping part can move along the guiding direction of the guiding structure to ensure that the upper clamping part can move above the encoder chip. The lower clamping part can move along the guiding direction of the guiding structure and the direction perpendicular to the guiding direction, so that after the upper clamping part and the lower clamping part move to the upper and lower sides of the encoder chip, the lower clamping part pushes up the bottom of the encoder chip and cooperates with the upper clamping part to clamp the encoder chip. The upper clamping part and the lower clamping part first perform a horizontal movement and move above and below the encoder chip. Subsequently, the lower clamping part starts to move upward. At the same time, the upper clamping part maintains a horizontal state and does not approach the lower clamping part. In this way, the relative upward movement distance of the lower clamping part is increased. This design can ensure that during the process of lifting the encoder chip upward, the movement distance of the chip is sufficient to completely separate the ejector pin of the faulty encoder chip from the test socket. In this way, when disassembling and classifying the faulty encoder chip, the situation of secondary damage can be effectively avoided.

[0037] The guiding structure includes a guiding frame 411. Sliding grooves 412 for the sliders 413 to slide are opened on both side walls of the guiding frame 411. The upper parts of the opposite sides of the two sliders 413 are connected to the upper clamping part to keep the upper clamping part moving horizontally when disassembling and clamping the faulty encoder chip;

[0038] Both sides of the slider 413 are provided with inclined slots 414 running through them. A limiting slot 415 is provided between the two sliding slots 412. The limiting slot 415 runs through the two sliding slots 412 on both sides and is arranged in cooperation with the inclined slot 414. A push rod 416 is inserted into both the limiting slot 415 and the first inclined slot 414. Both ends of the push rod 416 are connected to the lower clamping part. When the slider 413 moves in the sliding slot 412, the cooperation between the inclined slot 414 and the limiting slot 415 can drive the push rod 416 to move, further driving the horizontal movement of the lower clamping part;

[0039] The limiting slot 415 is vertically upwardly opened on the side facing the encoder chip, so that under the cooperation of the inclined slot 414 and the limiting slot 415, the push rod 416 drives the lower clamping part to move vertically upward. When the push rod 416 moves to the vertically upward section of the limiting slot 415, the inclined slot 414 of the slider 413 will push the push rod 416 upward, further enabling the lower clamping part to move vertically upward, thereby maintaining an upward thrust on the faulty encoder chip, and the lower clamping part will not move horizontally when pushing the encoder chip upward, effectively ensuring that the encoder chip will not be damaged twice during disassembly.

[0040] A driving motor 441 is provided on the guiding frame 411. A pair of cams 442 are provided on the output shaft of the driving motor 441. The pair of cams 442 are respectively in contact with the side walls of the sliders 413 to push the two sliders 413 to move synchronously. Springs 418 are connected between the two sliders 413 and the guiding frame 411 to ensure that the sliders 413 return to their original positions when not under force. When the driving motor 441 is started, the two cams 442 rotate synchronously, further pushing the two sliders 413 to move synchronously in the sliding slots 412, facilitating the synchronous movement of the upper and lower clamping parts on both sides to disassemble the faulty encoder chip.

[0041] Both ends of the push rod 416 are provided with discs 433. The two discs 433 are respectively attached to the inner walls of the two sliding slots 412, and the diameter of the disc 433 is greater than the width of the limiting slot 415 to ensure the stability of the movement of the push rod 416 in the sliding slot 412. Guide plates 434 extending downward are provided on both sides of the push rod 416. Strip-shaped slots 417 for the guide plates 434 to penetrate are opened on both sides of the guiding frame 411, and the bottom of the guide plate 434 extends out of the strip-shaped slot 417 to ensure the stability of the movement of the lower clamping part in the horizontal and vertical directions.

[0042] The calibration detection module 2 is also provided with a pushing unit. The pushing unit can move along with the calibration detection module 2. The pushing unit includes a fixing plate 31 connected to the calibration detection module 2. An orbital groove 32 for a guiding block 33 to slide therein is formed in the fixing plate 31. The direction of the orbital groove 32 is perpendicular to the arrangement direction of the encoder chips. A vertical plate 34 is provided on the side of the guiding block 33 facing away from the fixing plate 31. The bottom of the vertical plate 34 is connected to the top of the guiding frame 411. The guiding block 33 moves in the orbital groove 32 in a direction perpendicular to the arrangement of the encoder chips, and drives the blanking unit to move, so as to move the faulty encoder chip clamped on the blanking unit to a suitable position for collection.

[0043] An inclined groove 35 is formed in the guiding block 33, and a guiding groove 36 matching the inclined groove 35 is formed in the orbital groove 32. A moving rod 37 is inserted into the inclined groove 35 and the guiding groove 36 together. The end of the moving rod 37 is connected to the vertical plate 34. The guiding groove 36 is vertically downwardly opened on the side facing the encoder chips. During the process of the guiding block 33 moving towards the encoder chips in the guiding frame 411, after the moving rod 37 moves to the position where the guiding groove 36 is vertically downward, under the push of the inclined groove 35, the moving rod 37 drives the vertical plate 34 to move downward, and the blanking unit moves downward to the faulty encoder chip. After controlling the blanking unit to clamp the faulty encoder chip, control the guiding block 33 to move away from the encoder chips. At this time, the moving rod 37 will first drive the vertical plate 34 to move upward, so that the blanking unit drives the faulty encoder chip to move upward, and then the moving rod 37 drives the vertical plate 34 to move away from the encoder chips, so that the blanking unit drives the faulty encoder chip to move to the blanking position. During the blanking process, first control the faulty encoder chip to move upward, and then control it to move to the blanking position, which can avoid being blocked by other structures on the bearing platform 1 when directly horizontally moving the encoder chip, facilitating transportation.

[0044] Two retaining pieces 38 are provided on the moving rod 37. The two retaining pieces 38 respectively abut against the side walls of the fixing plate 31 and the guiding block 33 facing away from each other to ensure the stability of the moving rod 37 moving in the guiding groove 36. Long strip grooves 39 for the vertical plate 34 to be inserted are symmetrically opened on the upper and lower sides of the guiding block 33 to ensure the stability of the vertical plate 34 moving in the horizontal and vertical directions. A cylinder 40 with an output end connected to the guiding block 33 is provided in the fixing plate 31. When the cylinder 40 is started, the guiding block 33 can reciprocate in the orbital groove 32, facilitating the movement of the blanking unit.

[0045] The bearing platform 1 is provided with a waste box 5 in the moving direction of the blanking unit. When the blanking unit moves above the waste box 5, the control driving motor 441 is started. At this time, the cam 442 rotates. Under the action of the spring 418, the slider 413 moves in the chute 412, further causing the upper clamping part and the lower clamping part to move towards the guiding frame 411. During this process, the lower clamping part moves downward, so that the upper clamping part and the lower clamping part no longer clamp the encoder chip. Driven by the lower clamping part, the encoder chip will hit the guiding frame 411 and then fall into the waste box 5 for collection.

[0046] The upper clamping part includes an upper clamping arm 421 on the side wall of the slider 413 and an upper clamping plate 422 on the side of the upper clamping arm 421 away from the slider 413, ensuring that the two upper clamping plates 422 can clamp different positions on the top of the encoder chip. A soft pad is provided at the bottom of the upper clamping plate 422 to prevent damage to the encoder chip when the upper clamping plate 422 clamps the top of the encoder chip.

[0047] The lower clamping part includes a lower clamping arm 431 connected to the end of the push rod 416 and a lower clamping plate 432 connected to the side of the lower clamping arm 431 away from the push rod 416, ensuring that the two lower clamping plates 432 can clamp different positions on the bottom of the encoder chip. A soft pad is provided at the top of the lower clamping plate 432 to prevent damage to the encoder chip when the lower clamping plate 432 clamps the bottom of the encoder chip.

[0048] Working principle: Manually install the encoder chip at a suitable position on the bearing platform 1, calibrate the detection module 2 to move along the chip arrangement direction, and detect the position of the top sensor of the chip.

[0049] During the detection process of the calibration detection module 2, if a fault or position problem is detected in the encoder chip sensor, it will be recorded, and then it will continue to move to the next position. At this time, the upper clamping plate 422 and the lower clamping plate 432 will move to the position of the faulty encoder chip. First, the air cylinder 40 is started, so that the guide block 33 moves in the track groove 32 towards the encoder chip. During this process, the vertical plate 34 will drive the upper clamping plate 422 and the lower clamping plate 432 to move downward, and make them respectively located in front of the upper and lower sides of the faulty encoder chip. Then, the driving motor 441 is started. At this time, the cam 442 will push the slider 413 towards the faulty encoder chip. When the upper clamping plate 422 and the lower clamping plate 432 move above and below the faulty encoder chip, the lower clamping plate 432 moves vertically upward and jacks up the faulty encoder chip. Then, the air cylinder 40 is started again to make the air cylinder 40 move in the direction. At this time, the upper clamping plate 422 and the lower clamping plate 432 will first drive the faulty encoder chip to move upward, and then move towards the waste box 5. When the upper clamping plate 422 and the lower clamping plate 432 drive the faulty encoder chip to move above the waste box 5, the driving motor 441 is started in the reverse direction. At this time, the upper clamping plate 422 and the lower clamping plate 432 release the clamping of the faulty encoder chip, and the faulty encoder chip falls into the waste box 5 for collection.

[0050] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0051] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An encoder chip sensor calibration and detection platform, comprising a bearing platform (1), wherein a calibration and detection module (2) capable of moving along the arrangement direction of encoder chips is arranged on the bearing platform (1) to respectively detect the positions of the top sensors of a plurality of neatly arranged encoder chips. It is characterized in that: A blanking unit is provided on the calibration detection module (2), and the blanking unit can move perpendicular to the arrangement direction of the encoder chips. The blanking unit includes an upper clamping part and a lower clamping part. The upper clamping part is arranged on the top of the lower clamping part, and the two can move relatively towards or away from each other. When the upper clamping part and the lower clamping part move relatively towards each other, the probes at the bottom of the encoder chip are separated from the test sockets on the carrier platform (1).

2. The calibration and detection platform for an encoder chip sensor according to claim 1, wherein: The blanking unit further includes a guiding structure perpendicular to the arrangement direction of the encoder chips. The upper clamping part and the lower clamping part are symmetrically arranged on both sides of the guiding structure. The upper clamping part can move along the guiding direction of the guiding structure, and the lower clamping part can move along the guiding direction of the guiding structure and the direction perpendicular to the guiding direction. So that after the upper clamping part and the lower clamping part move to the upper and lower sides of the encoder chip, the lower clamping part pushes up the bottom of the encoder chip and cooperates with the upper clamping part to clamp the encoder chip.

3. The calibration and detection platform for an encoder chip sensor according to claim 2, characterized in that: The guiding structure includes a guiding frame (411). Sliding grooves (412) for the sliders (413) to slide are opened on both side walls of the guiding frame (411). The upper parts of the opposite sides of the two sliders (413) are connected to the upper clamping part. Oblique grooves (414) are respectively formed through the two sliders (413). A limiting groove (415) is formed between the two sliding grooves (412). The limiting groove (415) penetrates through the two sliding grooves (412) and is arranged in cooperation with the oblique grooves (414). A push rod (416) is inserted into the limiting groove (415) and the first oblique groove (414) together. Both ends of the push rod (416) are connected to the lower clamping part. The limiting groove (415) is vertically upwardly opened towards the encoder chip, so that the push rod (416) drives the lower clamping part to move vertically upward under the cooperation of the oblique groove (414) and the limiting groove (415).

4. The calibration and detection platform for an encoder chip sensor according to claim 3, characterized in that: A driving motor (441) is provided on the guiding frame (411). A pair of cams (442) are provided on the output shaft of the driving motor (441). The pair of cams (442) are respectively abutted against the side walls of the sliders (413) to push the two sliders (413) to move synchronously. Springs (418) are connected between the two sliders (413) and the guiding frame (411) to ensure that the sliders (413) reset when not stressed.

5. The calibration and detection platform for an encoder chip sensor according to claim 4, characterized in that: Discs (433) are respectively provided at both ends of the push rod (416). The two discs (433) are respectively attached to the inner walls of the two sliding grooves (412), and the diameter of the discs (433) is greater than the width of the limiting groove (415). Guide plates (434) extending downward are respectively provided on both sides of the push rod (416). Strip-shaped grooves (417) for the guide plates (434) to penetrate into are opened on both sides of the guiding frame (411).

6. A calibration and detection platform for an encoder chip sensor according to any one of claims 1-5, characterized in that: The calibration detection module (2) is also provided with a material pushing unit, and the material pushing unit comprises a fixed plate (31) connected to the calibration detection module (2), a track groove (32) is provided in the fixed plate (31) for the guide block (33) to slide therein, and the direction of the track groove (32) is perpendicular to the arrangement direction of the encoder chip, and a vertical plate (34) is provided on the side of the guide block (33) away from the fixed plate (31), and the bottom of the vertical plate (34) is connected to the top of the material unloading unit.

7. The calibration and detection platform for an encoder chip sensor according to claim 6, characterized in that: An oblique groove (35) is provided in the guide block (33), a guide groove (36) matching the oblique groove (35) is provided in the track groove (32), a moving rod (37) is inserted into the oblique groove (35) and the guide groove (36), an end of the moving rod (37) is connected to the vertical plate (34), and the guide groove (36) is vertically downwardly opened toward one side of the encoder chip.

8. The calibration and detection platform for an encoder chip sensor according to claim 7, wherein: The moving rod (37) is provided with two baffles (38), the two baffles (38) respectively abut against the side walls of the fixed plate (31) and the guide block (33) which are away from each other, the upper and lower sides of the guide block (33) are symmetrically provided with long grooves (39) for the vertical plate (34) to be inserted, and the fixed plate (31) is provided with a cylinder (40) whose output end is connected to the guide block (33).

9. The calibration and detection platform for an encoder chip sensor according to claim 7, wherein: The carrying platform (1) is provided with a waste box (5) in the direction in which the unloading unit moves.

10. A calibration and detection platform for an encoder chip sensor according to claim 6, characterized in that: The upper clamping portion comprises an upper clamping arm (421) connected to the side wall of the slider (413) and an upper clamping plate (422) connected to the side of the upper clamping arm (421) away from the slider (413); The lower clamping part comprises a lower clamping arm (431) connected to the end of the push rod (416), and a lower clamping plate (432) connected to a side of the lower clamping arm (431) away from the push rod (416).

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