Three-dimensional measurement monitoring system and monitoring method of endoscope probe

Abstract

The present invention discloses a three-dimensional measurement and monitoring system and monitoring method for an endoscopic probe, and relates to the field of three-dimensional measurement and monitoring technology. The three-dimensional measurement and monitoring system for the endoscopic probe includes: a measurement position matching analysis module, a curvature analysis module, and a measurement accuracy analysis module. The present invention performs a measurement position matching analysis on the reflected light phase state of the target to be measured at the end of the first monitoring period to determine whether to update the reflector parameters, and at the same time determines whether to optimize the measurement strategy based on the obtained curvature change rate, and then performs a measurement accuracy analysis at the end of the second monitoring period to determine whether to update the probe parameters, thereby achieving an improvement in the accuracy of crack recognition of highly reflective metal surfaces during three-dimensional measurement and monitoring, and solving the problem of low accuracy in crack area recognition of highly reflective metal surfaces during three-dimensional measurement and monitoring by endoscopic probes in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of three-dimensional measurement and monitoring, and in particular to a three-dimensional measurement and monitoring system and a monitoring method for an endoscopic probe. Background Art

[0002] With the continuous advancement of industrial manufacturing technology, the requirements for product quality and production processes are increasing. In many industrial fields, the surface quality of components is directly related to product performance and reliability. However, traditional endoscopic probes focus primarily on acquiring two-dimensional images and have limited capabilities for measuring three-dimensional topography. In the industrial field, three-dimensional measurement of components with highly reflective surfaces faces many challenges. Highly reflective surfaces easily cause light reflection and scattering, which interferes with the measurement signal and thus affects measurement accuracy. In addition, factors such as vibration and temperature changes in the industrial environment can also affect measurement results. Therefore, it is of great practical significance to develop a three-dimensional measurement and monitoring system for endoscopic probes that can adapt to highly reflective surfaces and have high precision and stability.

[0003] Existing technologies, through a multi-technology integrated optical imaging and data processing system, combined with core principles such as laser triangulation, structured light projection, phase scanning and multi-view stereo vision, can achieve high-precision three-dimensional shape and size detection of complex workpiece surface structures.

[0004] For example, the endoscopic probe, three-dimensional measuring endoscope and flaw detection method disclosed in the invention patent announcement with announcement number CN116539627B include: extending the endoscopic probe to the position to be detected; unfolding the first camera and the second camera; unfolding the first reflector and the second reflector, and adjusting the reflection inclination angles of the first reflector and the second reflector so that the field of view of the first camera and the field of view of the second camera coincide with each other; the light emitting structure swings back and forth in the field of view of the first camera and the field of view of the second camera to emit a scanning light beam; comparing the brightness values ​​of the light spots in the first camera and the second camera, or comparing the current brightness in the first camera or the second camera with the previous brightness value; when the difference in brightness value exceeds a set threshold, calibrating the position as a defect position; and measuring the defect position by the first camera and the second camera.

[0005] For example, the invention patent announcement with announcement number CN116482227B discloses a pipeline corrosion monitoring method, device, and system, which include: building a three-dimensional model of the pipeline using preset static data; measuring the static data and environmental data of the pipeline and updating the three-dimensional model after the pipeline enters the operation stage; collecting real-time dynamic data of multiple areas in the pipeline through multiple sensors after the pipeline enters the operation stage; preprocessing and storing the collected dynamic data; generating a digital twin of the pipeline based on the static data, environmental data, preprocessed dynamic data, and the three-dimensional model; and monitoring the degree of corrosion in the pipeline based on the current dynamic data in the digital twin.

[0006] However, in the process of implementing the technical solutions of the invention in the embodiments of the present application, the present application found that the above technology has at least the following technical problems:

[0007] In the existing technology, when an endoscope is inspecting the surface of a complex workpiece, factors such as surface roughness and material absorption characteristics directly affect the quality of the three-dimensional point cloud. In addition, the existing three-dimensional model is not adaptable enough to complex curved surfaces, making it difficult to simultaneously take into account high resolution and a large field of view, which in turn leads to an imbalance in the light distribution in the imaging area and reduces the accuracy of crack feature extraction. There is also a problem of low accuracy in identifying crack areas on highly reflective metal surfaces during three-dimensional measurement and monitoring by the endoscope probe. Summary of the Invention

[0008] The embodiments of the present application solve the problem in the prior art of low accuracy in identifying crack areas on highly reflective metal surfaces during three-dimensional measurement and monitoring with an endoscopic probe by providing a three-dimensional measurement and monitoring system and method for the endoscopic probe, thereby improving the accuracy of crack identification on highly reflective metal surfaces during three-dimensional measurement and monitoring.

[0009] An embodiment of the present application provides a three-dimensional measurement and monitoring system for an endoscopic probe, comprising: a measurement position matching analysis module, a curvature analysis module and a measurement accuracy analysis module; wherein the measurement position matching analysis module is used to perform a measurement position matching analysis on the phase state of reflected light of the target to be measured at the end of the first monitoring period based on the acquired three-dimensional coordinate data, and obtain a measurement position matching analysis result, the three-dimensional coordinate data is used to reflect the stereo matching state of the endoscopic probe in a preset monitoring area corresponding to the surface of the target to be measured when the endoscopic probe is inserted into the surface of the target to be measured, and there is at least one probe monitoring point in the preset monitoring area, and the measurement position matching analysis is used to quantify the degree of conformity between the surface crack position of the target to be measured and the corresponding reference crack monitoring position; the curvature analysis module is used to determine whether to update the reflector parameters based on the measurement position matching analysis result, and at the same time determine whether to perform measurement based on the acquired curvature change rate. Strategy optimization, reflector parameter update means that when the measurement position matching analysis result does not meet the requirements, the reflection inclination angle corresponding to the detachable reflector in the endoscope probe is updated based on the obtained measurement position matching analysis value. The measurement strategy optimization means adjusting the lens magnification and light source wavelength to improve the balance between the resolution and field of view of the endoscope probe; the measurement accuracy analysis module is used to perform measurement accuracy analysis on the cross-sectional view of the target to be measured at the end of the second monitoring period based on the acquired three-dimensional measurement data, and obtain the measurement accuracy analysis result. At the same time, based on the measurement accuracy analysis result, it is determined whether to update the probe parameters. The measurement accuracy analysis is used to quantify the accuracy of the endoscope probe in crack measurement of the target surface to be measured. The cross-sectional view is used to visualize the changes in the crack state of the target surface to be measured during the second monitoring period. The probe parameter update means adjusting the light source current and probe inclination to suppress ambient light interference.

[0010] The embodiment of the present application provides a three-dimensional measurement and monitoring method for an endoscopic probe, comprising the following steps: step 1, performing a measurement position matching analysis on the phase state of reflected light of the target to be measured at the end of the first monitoring period based on the acquired three-dimensional coordinate data, and obtaining a measurement position matching analysis result, wherein the three-dimensional coordinate data is used to reflect the stereo matching state of the endoscopic probe in a preset monitoring area corresponding to the surface of the target to be measured when the endoscopic probe is inserted into the surface of the target to be measured, and at least one probe monitoring point is provided in the preset monitoring area, and the measurement position matching analysis is used to quantify the degree of conformity between the surface crack position of the target to be measured and the corresponding reference crack monitoring position; step 2, judging whether to update the reflector parameters based on the measurement position matching analysis result, and judging whether to optimize the measurement strategy based on the acquired curvature change rate, and the reflector parameter update indicates the measurement position When the position matching analysis result does not meet the requirements, the reflection inclination angle corresponding to the detachable reflector in the endoscope probe is updated based on the obtained measurement position matching analysis value. The measurement strategy optimization means adjusting the lens magnification and light source wavelength to improve the balance between the resolution and field of view of the endoscope probe; in step three, based on the obtained three-dimensional measurement data, a measurement accuracy analysis is performed on the cross-sectional view of the target to be measured at the end of the second monitoring period to obtain the measurement accuracy analysis result. At the same time, based on the measurement accuracy analysis result, it is determined whether to update the probe parameters. The measurement accuracy analysis is used to quantify the accuracy of the endoscope probe in crack measurement of the target surface to be measured. The cross-sectional view is used to visualize the changes in the crack state of the target surface to be measured during the second monitoring period. The probe parameter update means adjusting the light source current and the probe inclination angle to suppress ambient light interference.

[0011] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0012] 1. By performing a measurement position matching analysis on the phase state of the reflected light of the target at the end of the first monitoring period, it is determined whether to update the reflector parameters. At the same time, based on the obtained curvature change rate, it is determined whether to optimize the measurement strategy. Subsequently, a measurement accuracy analysis is performed at the end of the second monitoring period to determine whether to update the probe parameters. This achieves refined control of the three-dimensional measurement process of highly reflective metal surfaces, thereby improving the accuracy of crack identification in the three-dimensional measurement and monitoring process of highly reflective metal surfaces, and effectively solves the problem of low accuracy in crack area identification in the three-dimensional measurement and monitoring process of highly reflective metal surfaces using endoscopic probes in the prior art.

[0013] 2. By obtaining the difference between the lens screen brightness and the maximum allowable lens screen brightness in the database, and combining it with the lens screen brightness correction value in the database for correction processing, the lens screen brightness analysis value is obtained. At the same time, the obtained lens screen brightness analysis value, lens reflection inclination analysis value, and lens center distance analysis value are coupled and calculated to obtain the measurement position matching analysis value, thereby achieving improved accuracy in obtaining the measurement position matching analysis value. In the dimensional measurement of industrial parts, the measurement position can be determined more accurately, the measurement error caused by position deviation can be reduced, the reliability of the measurement results can be improved, and a more accurate basis for product quality control can be provided.

[0014] 3. By obtaining the difference between the point cloud density and the total number of data points per unit area in the cross-sectional view, compensation processing is performed in combination with the point cloud density compensation value in the database to obtain the point cloud density analysis value. At the same time, the obtained speckle noise intensity analysis value and the crack depth harmonic amplitude analysis value are inversely proportionally processed and coupled with the point cloud density analysis value to obtain the measurement accuracy analysis value, thereby achieving an improvement in the accuracy of obtaining the measurement accuracy analysis value. In non-destructive testing, defects such as cracks inside the material can be more accurately detected, thereby improving the sensitivity and reliability of detection and ensuring the safety of engineering structures.

[0015] 4. The system determines whether to update the probe parameters based on the measurement accuracy analysis results, achieving intelligent monitoring and control. When the measurement accuracy does not meet the standard, the system automatically updates the probe parameters, covering key parameters such as the light source current and probe inclination angle. Utilizing the PID control algorithm and point cloud enhancement algorithm, combined with the measurement accuracy analysis value deviation, the reflected light source current deviation, and the speckle noise intensity deviation, it accurately outputs the update amplitude. After one update, if the accuracy meets the standard, the update is completed and monitoring continues. Otherwise, a recalibration instruction is sent, forming a closed-loop control. This design ensures that the endoscope probe can automatically adjust to the optimal state in different measurement scenarios, improving the accuracy and reliability of three-dimensional measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a three-dimensional measurement and monitoring system for an endoscopic probe provided in an embodiment of the present application;

[0017] Figure 2 A flow chart of measurement position matching analysis and reflector parameter optimization provided in an embodiment of the present application;

[0018] Figure 3 A flow chart of curvature analysis and measurement strategy optimization provided in an embodiment of the present application;

[0019] Figure 4 A flow chart of measurement accuracy analysis and probe parameter optimization provided in an embodiment of the present application;

[0020] Figure 5 A logical framework diagram of a three-dimensional measurement and monitoring method for an endoscopic probe provided in an embodiment of the present application. DETAILED DESCRIPTION

[0021] The embodiment of the present application solves the problem of low accuracy in crack area identification during three-dimensional measurement and monitoring of highly reflective metal surfaces by an endoscope probe in the prior art by providing a three-dimensional measurement and monitoring system and a monitoring method for an endoscope probe. A measurement position matching analysis module performs a measurement position matching analysis on the reflected light phase state of the target to be measured at the end of the first monitoring period according to the acquired three-dimensional coordinate data to obtain a measurement position matching analysis result. Then, a curvature analysis module determines whether to update the reflector parameters according to the measurement position matching analysis result, and determines whether to optimize the measurement strategy based on the acquired curvature change rate. Finally, a measurement accuracy analysis module performs a measurement accuracy analysis on the cross-sectional view of the target to be measured at the end of the second monitoring period according to the acquired three-dimensional measurement data to obtain a measurement accuracy analysis result. At the same time, based on the measurement accuracy analysis result, a determination is made as to whether to update the probe parameters, thereby improving the accuracy of crack identification during three-dimensional measurement and monitoring of highly reflective metal surfaces.

[0022] The technical solution in the embodiment of the present application is to solve the problem of low accuracy in identifying crack areas on the highly reflective metal surface during three-dimensional measurement and monitoring by an endoscopic probe. The overall idea is as follows:

[0023] By performing a measurement position matching analysis on the reflected light phase state of the target at the end of the first monitoring period, it is determined whether the reflector parameters should be updated. At the same time, based on the obtained curvature change rate, it is determined whether the measurement strategy should be optimized. Subsequently, a measurement accuracy analysis is performed at the end of the second monitoring period to determine whether the probe parameters should be updated. This achieves the effect of improving the accuracy of crack identification on highly reflective metal surfaces during three-dimensional measurement monitoring.

[0024] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0025] like Figure 1 As shown, this is a structural schematic diagram of a three-dimensional measurement and monitoring system for an endoscopic probe provided in an embodiment of the present application. The three-dimensional measurement and monitoring system for an endoscopic probe provided in an embodiment of the present application includes: a measurement position matching analysis module, a curvature analysis module and a measurement accuracy analysis module.

[0026] Among them, the measurement position matching analysis module is used to perform a measurement position matching analysis on the reflected light phase state of the target to be measured at the end of the first monitoring period based on the acquired three-dimensional coordinate data to obtain a measurement position matching analysis result. The three-dimensional coordinate data is used to reflect the stereo matching state of the endoscope probe in the preset monitoring area corresponding to the surface of the target to be measured when it is inserted into the surface of the target to be measured. The three-dimensional coordinate data includes the lens screen brightness, the lens reflection inclination angle and the lens center distance. There is at least one probe monitoring point (such as grid division) in the preset monitoring area. The measurement position matching analysis is used to quantify the degree of conformity between the surface crack position of the target to be measured and the corresponding reference crack monitoring position.

[0027] The curvature analysis module is used to determine whether to update the reflector parameters based on the measurement position matching analysis results, and to determine whether to optimize the measurement strategy based on the obtained curvature change rate. The reflector parameter update means that when the measurement position matching analysis results do not meet the requirements, the reflection inclination angle corresponding to the detachable reflector in the endoscope probe is updated based on the obtained measurement position matching analysis value. The detachable reflector includes a first reflector and a second reflector. The curvature change rate is used to quantify the curvature change in the crack area where the target to be measured is located. The measurement strategy optimization means adjusting the lens magnification and light source wavelength to improve the balance between the resolution and field of view of the endoscope probe.

[0028] The measurement accuracy analysis module is used to perform measurement accuracy analysis on the cross-sectional view of the target to be measured at the end of the second monitoring period based on the acquired three-dimensional measurement data, obtain measurement accuracy analysis results, and determine whether to update the probe parameters based on the measurement accuracy analysis results. The measurement accuracy analysis is used to quantify the accuracy of the endoscope probe in crack measurement of the target surface to be measured. The cross-sectional view is used to visualize the changes in the crack state on the target surface to be measured during the second monitoring period. The probe parameter update means adjusting the light source current and probe inclination to suppress ambient light interference. The three-dimensional measurement data includes point cloud density (i.e., the number of effective points per unit area in the cross-sectional view), speckle noise intensity, and crack depth harmonic amplitude. The point cloud density is used to quantify the geometric resolution and measurement reliability of the anatomical structure of the target surface to be measured in the cross-sectional view. The speckle noise intensity is used to quantify the degree of interference of the scattering characteristics of the target surface to be measured in the cross-sectional view on the three-dimensional measurement accuracy of the crack. The crack depth harmonic amplitude is used to quantify the extension degree and fracture risk of the crack on the target surface to be measured in the cross-sectional view.

[0029] By continuously scanning key areas (such as crack areas) in a time series, a dynamic cross-sectional view S(t,z), i.e., a cross-sectional view, is generated, where t is time and z is the depth coordinate; the lens screen brightness is monitored by a highlight sensor in the lens area of ​​the endoscope probe (i.e., the imaging area of ​​the endoscope probe); the lens reflection inclination angle represents the inclination angle of the corresponding lens of the endoscope probe relative to the horizontal direction, which is monitored by the inclination sensor of the lens part of the endoscope probe; the lens center distance is monitored by a laser ranging sensor in the lens area of ​​the endoscope probe; the point cloud density is monitored by a high-definition camera in the lens area of ​​the endoscope probe; the speckle noise intensity is monitored by an image sensor in the lens area of ​​the endoscope probe; and the crack depth harmonic amplitude is monitored by an ultrasonic transducer in the lens area of ​​the endoscope probe.

[0030] In this example, due to the complex reflective properties of highly reflective metal surfaces, traditional measurement methods struggle to accurately determine the measurement position. This system, however, quantifies the degree of correspondence between the crack location on the target surface and the corresponding reference crack monitoring location, ensuring that the measurement location accurately corresponds to the actual crack area on the target. By integrating multiple modules, including measurement position matching analysis, curvature analysis, and measurement accuracy analysis, this example effectively improves the accuracy of crack identification on highly reflective metal surfaces during three-dimensional measurement and monitoring, providing strong support for safe operations in critical sectors such as aerospace.

[0031] Doctors can use this flowchart to intuitively understand how the system collaboratively optimizes measurement parameters through multiple modules to improve crack detection accuracy. Engineers can refer to the flowchart to quickly locate parameter update logic, such as the trigger conditions for reflection angle adjustment and light source wavelength optimization.

[0032] Furthermore, the process of acquiring three-dimensional coordinate data is as follows: obtaining the surface reflection light intensity of the target to be measured at the end of the first monitoring period; if the obtained surface reflection light intensity is less than the maximum allowable surface reflection light intensity in the database, then obtaining the lens screen brightness of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period; otherwise, sending a light source power increase instruction, the light source power increase instruction is used to prompt the preset personnel to start the backup LED array to improve the clarity of the crack area on the surface of the target to be measured; if the obtained lens screen brightness is less than the maximum allowable lens screen brightness in the database, then obtaining the lens reflection inclination angle and lens center distance of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period; otherwise, sending a lens screen brightness reduction instruction, the lens screen brightness reduction instruction is used to prompt the preset personnel to adjust the brightness of the display terminal to a preset value (set by the preset personnel) to avoid overheating of the endoscope probe due to high brightness.

[0033] like Figure 2As shown, it is a flow chart of measurement position matching analysis and reflector parameter optimization provided in an embodiment of the present application, and the specific logic is: obtain three-dimensional coordinate data, preset the monitoring area grid division, and provide a basis for subsequent analysis; when just inserted into the target surface to be measured, collect the phase state of the reflected light, and perform measurement position matching analysis. If the matching does not meet the requirements, update the reflector parameters, and optimize the measurement strategy based on the curvature change rate; perform measurement accuracy analysis on the cross-sectional view according to the three-dimensional measurement data, and if the accuracy does not meet the requirements, update the probe parameters; repeat the above steps continuously, drive parameter optimization through quantitative analysis, form a closed-loop feedback, gradually improve the measurement position matching and accuracy, and realize accurate identification and positioning of cracks.

[0034] The measured position matching degree analysis is performed on the phase state of the reflected light of the target at the end of the first monitoring period based on the acquired three-dimensional coordinate data, specifically:

[0035] First, the difference between the lens screen brightness and the maximum allowable lens screen brightness in the database is obtained, and the lens screen brightness correction value in the database is combined for correction processing to obtain the lens screen brightness analysis value. The specific restriction expression is: , where Indicates the brightness analysis value of the lens screen of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period. Indicates the lens screen brightness correction value, Indicates the brightness of the lens screen of the endoscope probe at the end of the first monitoring period of the target to be measured. It represents the maximum allowable lens screen brightness. The units of lens screen brightness and maximum allowable lens screen brightness are the same, both are nits. The maximum allowable lens screen brightness is represented by the sum and average of the maximum values ​​of the historical lens screen brightness of the corresponding endoscope probe at the end of each historical monitoring period in the database.

[0036] Then, the relative difference between the lens reflection inclination angle and the lens reflection inclination angle set in the database is obtained, and the lens reflection inclination angle correction value in the database is combined for correction processing to obtain the lens reflection inclination angle analysis value. The specific restriction expression is: , where Indicates the lens reflection inclination analysis value of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period. Indicates the lens reflection inclination correction value, Indicates the reflection angle of the endoscope probe lens of the target to be measured at the end of the first monitoring period. Indicates the set lens reflection inclination angle. The lens reflection inclination angle (usually set between 0°-90°, because reflections exceeding 90° are rare in conventional optical systems and have different meanings) has the same unit as the set lens reflection inclination angle, both of which are degrees (°). The set lens reflection inclination angle is represented by the sum and average of the historical lens reflection inclination angles of the corresponding endoscope probes at the end of the historical monitoring period in the database.

[0037] Next, the relative difference between the lens center distance and the lens center distance set in the database is obtained, and the lens center distance correction value in the database is combined for correction processing to obtain the lens center distance analysis value. The specific restriction expression is: , where Indicates the lens center distance analysis value of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period. Indicates the lens center distance correction value, Indicates the lens center distance of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period. Indicates the set lens center distance. The units of the lens center distance and the set lens center distance are the same, both are millimeters (mm). The set lens center distance is represented by the sum and average of the historical lens center distances of the corresponding endoscope probes at the end of the historical monitoring period in the database.

[0038] Finally, the obtained lens screen brightness analysis value, lens reflection inclination analysis value and lens center distance analysis value are coupled and calculated to obtain the measurement position matching analysis value, which represents the quantitative data of the influence of the three-dimensional coordinate data on the alignment process of the corresponding surface crack position of the target to be measured. The specific restriction expression is: , where It represents the matching analysis value of the measurement position of the target to be measured corresponding to the endoscope probe at the end of the first monitoring period. It represents the surface reflected light intensity of the target at the end of the first monitoring period. It represents the maximum allowable surface reflected light intensity. The unit of surface reflected light intensity and maximum allowable surface reflected light intensity is the same, candela (cd). The maximum allowable surface reflected light intensity is represented by the sum and average of the maximum values ​​of the historical surface reflected light intensities at the end of each historical monitoring period in the database.

[0039] The aforementioned database is a database established before the design of the three-dimensional measurement monitoring system of the endoscopic probe for storing various types of setting data. The database includes but is not limited to preset measurement position matching analysis values, preset curvature change rates, preset measurement accuracy analysis values, and the first monitoring period and the second monitoring period. The various values ​​are directly set by technical personnel. The setting basis of the preset measurement position matching analysis value can be determined according to the actual three-dimensional measurement scene of the target to be measured. For example, the preset measurement position matching analysis value is represented by the result of summing and averaging the historical measurement position matching analysis values ​​of the corresponding endoscopic probes of the target to be measured at the end of the historical monitoring period in the database. In addition, the various values ​​in the database can be set and fine-tuned by technical personnel according to actual debugging.

[0040] The database stores preset correction values ​​that are closely related to the measurement position matching analysis values. A predefined mapping relationship is established between these correction values ​​and the corresponding lens screen brightness, lens reflection inclination, and lens center distance. It is worth noting that this mapping is not set arbitrarily. It can be one-to-one or many-to-one. For example, in actual applications, when it is necessary to evaluate the accuracy of the matching process of the crack position on the surface of the target to be measured, the real-time lens screen brightness, lens reflection inclination, and lens center distance can be directly input into this preset mapping relationship, so that the lens screen brightness correction value, lens reflection inclination correction value, and lens center distance correction value that match the lens screen brightness, lens reflection inclination, and lens center distance can be quickly and accurately obtained.

[0041] Importantly, to ensure consistency and comparability of the evaluation, the lens screen brightness correction value, lens reflection tilt correction value, and lens center distance correction value in this example are all limited to between 0 and 1, and the sum of the three is 1.

[0042] In this embodiment, the measurement position matching analysis value changes with the lens screen brightness, lens reflection tilt deviation (i.e. ) and lens center distance deviation (i.e. ) increases with the increase of the lens reflection inclination angle. When the lens reflection inclination angle deviates, the direction of the reflected light will change. If the brightness of the lens screen increases at this time, the reflected light offset caused by the reflection inclination angle deviation may cause the light intensity received by the local area of ​​the lens to exceed the normal range, resulting in local overexposure and interfering with the analysis of the phase state of the reflected light; conversely, if the screen brightness decreases, the signal after the reflected light offset may be submerged in the background noise, making it difficult to accurately capture.

[0043] If there is a deviation in the brightness of the lens screen at this time, the uniformity of the lighting in the field of view will be seriously affected. When the center distance of the lens increases, the originally uniform lighting may become dispersed due to the increase in distance. If the screen brightness deviation further exacerbates this situation, the difference in lighting intensity in different areas of the field of view will become greater, resulting in a lack of consistency in the analysis of the phase state of the reflected light from the target surface to be measured.

[0044] By comprehensively considering multiple sources of information such as lens screen brightness, reflection inclination, and lens center distance, a fusion analysis is performed, and different deviation information is associated with information such as the phase state of reflected light and the surface characteristics of the target to be measured. This improves the accuracy and reliability of the measurement position matching analysis, thereby achieving improved accuracy in crack identification on highly reflective metal surfaces during three-dimensional measurement and monitoring, and effectively solving the problem of low accuracy in crack area identification on highly reflective metal surfaces during three-dimensional measurement and monitoring using endoscopic probes in the existing technology.

[0045] Furthermore, it is determined whether to update the reflector parameters according to the measurement position matching analysis result, specifically: if the obtained measurement position matching analysis value is not greater than the measurement position matching analysis value preset in the database, it indicates that the measurement position matching meets the expected requirements and a curvature analysis instruction is sent; if the obtained measurement position matching analysis value is greater than the measurement position matching analysis value preset in the database, it indicates that the measurement position matching analysis result does not meet the curvature analysis requirements and the reflection inclination deviation is obtained, and the reflector parameters are updated at the same time; the reflection inclination deviation includes a first reflection inclination deviation and a second reflection inclination deviation; the reflector parameters include a first reflection inclination (i.e., the reflection inclination corresponding to the first reflector) and a second reflection inclination (i.e., the reflection inclination corresponding to the second reflector). The first reflection inclination angle deviation is used to reflect the deviation in the spatial relationship between the first reflector in the endoscope probe corresponding to the target to be measured at the end of the first monitoring period and the surface of the target to be measured, that is, the absolute value of the difference between the set reflection angle (set by the preset personnel) of the first reflector in the endoscope probe corresponding to the target to be measured at the end of the first monitoring period and the actual measured reflection angle of the target to be measured; the second reflection inclination angle deviation is used to reflect the deviation in the spatial relationship between the second reflector in the endoscope probe corresponding to the target to be measured at the end of the first monitoring period and the surface of the target to be measured, that is, the absolute value of the difference between the set reflection angle (set by the preset personnel) of the second reflector in the endoscope probe corresponding to the target to be measured at the end of the first monitoring period and the actual measured reflection angle of the target to be measured.

[0046] Among them, the reflector parameter update is specifically as follows: the obtained measurement position matching analysis value deviation and the first reflection inclination deviation are inputted together into the particle swarm optimization algorithm to output the first reflection inclination update amplitude (i.e., the reflection inclination update amplitude corresponding to the first reflector) to update the set reflection angle of the first reflector in the endoscope probe corresponding to the end of the first monitoring period. At the end of the first reflection inclination update, it is determined whether the offset of the monitored lens center distance relative to the target center distance is within the corresponding offset allowable range in the database. If so, the first reflection inclination update is continued until the re-acquired measurement position matching analysis value is less than the preset measurement position matching analysis value in the database. The first reflection inclination update is completed, otherwise the preset personnel are prompted to check the lens distortion coefficient; the obtained measurement position matching analysis value deviation and the second reflection inclination deviation are inputted together into the particle swarm optimization algorithm to output the second reflection inclination update amplitude (i.e., the reflection inclination update amplitude corresponding to the second reflector) to update the corresponding The set reflection angle of the second reflector in the endoscope probe. At the end of the second reflection tilt update, it is determined whether the monitored offset of the lens center distance relative to the target center distance is within the corresponding offset allowable range in the database, that is, the range corresponding to the maximum and minimum values ​​of the historical lens center distance of the endoscope probe at the end of the historical monitoring period in the database, including the case where it is equal to the maximum and minimum values ​​of the historical lens center distance. If so, the second reflection tilt update is continued until the re-acquired measurement position matching analysis value is less than the preset measurement position matching analysis value in the database, and the second reflection tilt update is completed. Otherwise, the preset personnel is prompted to check the lens distortion coefficient. The lens distortion coefficient is used to quantify and correct the geometric distortion introduced by the lens of the endoscope probe during the imaging process; the measurement position matching analysis value deviation is used to quantify the degree of difference between the obtained measurement position matching analysis value and the preset measurement position matching analysis value, that is, the difference between the obtained measurement position matching analysis value and the preset measurement position matching analysis value.

[0047] In this embodiment, the measurement position matching deviation and the reflection inclination deviation are input into the particle swarm optimization algorithm to quickly and accurately locate the optimal update amplitude of the reflection inclination. Compared with experience or simple trial adjustment, the parameter update accuracy and efficiency are greatly improved, and the number of adjustments and time costs are reduced. After updating the reflection inclination, the lens center distance offset is judged to promptly discover the source problem that may cause geometric distortion, avoid error accumulation, and work together with distortion correction to ensure the measurement geometric accuracy. It can flexibly adapt to different measurement requirements and standards and improve measurement quality.

[0048] like Figure 3The figure shows a flow chart for curvature analysis and measurement strategy optimization provided by an embodiment of the present application. The specific logic is as follows: first, the curvature change rate is obtained, and then the curvature change in the crack area is quantitatively analyzed. A determination is made as to whether the curvature change rate exceeds a threshold. If so (i.e., the obtained curvature change rate is greater than a preset curvature change rate), measurement strategy optimization is initiated, sequentially adjusting the lens magnification and light source wavelength. After the optimization is complete, the optimization results are recorded, and the curvature analysis process ends. This logic continuously monitors curvature changes and dynamically adjusts the measurement strategy, ensuring accurate measurement under varying curvature conditions. It is suitable for monitoring complex surfaces or targets with significant curvature changes.

[0049] Based on the obtained curvature change rate, it is determined whether to optimize the measurement strategy. Specifically, the ambient light radiation intensity of the crack area where the target to be measured is located at the end of the first monitoring period is obtained. If the obtained ambient light radiation intensity is less than the maximum allowable ambient light radiation intensity in the database, the curvature change rate is obtained based on the curvature and arc length of the edge of the crack area. Otherwise, the light source power increase instruction is sent again. The maximum allowable ambient light radiation intensity is represented by the sum and average of the maximum values ​​of the historical ambient light radiation intensities of the crack area at the end of each historical monitoring period in the database; if the obtained curvature change rate is not greater than the preset curvature change rate in the database, a measurement accuracy analysis is performed. Otherwise, the measurement strategy is optimized. The preset curvature change rate is represented by the sum and average of the historical curvature change rates of the crack area at the end of the historical monitoring period in the database.

[0050] Among them, the measurement strategy is optimized, specifically: the obtained curvature change rate deviation and the probe anti-shake response time deviation are input together into the proportional-integral-derivative (PID) control algorithm of the endoscope probe to output the increase amplitude of the light source wavelength (such as 5mm offset along the magnetic field direction to reduce ambient light absorption), and at the same time obtain the curvature change rate deviation reduction amplitude; if the obtained curvature change rate deviation reduction amplitude is less than the set reduction amplitude (set by the preset personnel), a zoom lens switching instruction is sent, otherwise the current resolution is maintained and the preset amplitude of the light source wavelength is continued to be increased (to reduce the measurement blind spot caused by the curvature) until The measurement accuracy analysis is performed until the deviation of the re-acquired curvature change rate is no more than 0; the curvature change rate deviation is used to quantify the degree of difference between the preset curvature change rate and the acquired curvature change rate, that is, the difference between the preset curvature change rate and the acquired curvature change rate; the probe anti-shake response time deviation is used to quantify the degree of difference between the maximum allowable anti-shake response time of the endoscopic probe and the actual anti-shake response time of the endoscopic probe corresponding to the target to be measured at the end of the first monitoring period, that is, the difference between the maximum allowable anti-shake response time and the actual anti-shake response time; the reduction amplitude of the curvature change rate deviation represents the difference between the acquired curvature change rate deviation and the curvature change rate deviation acquired after a measurement strategy optimization.

[0051] In this embodiment, the curvature change rate deviation and the probe anti-shake response time deviation are jointly input into the PID control algorithm, and the geometric feature changes of the target to be measured and the dynamic stability of the probe are comprehensively considered to output the increase in the wavelength of the light source. Compared with a single parameter adjustment or fixed strategy, it can more accurately adapt to different measurement scenarios, quickly respond to changes in complex working conditions, and effectively reduce measurement errors caused by ambient light interference and curvature changes; during the measurement process, the light source wavelength and lens magnification are continuously adjusted according to the deviation changes, so that the measurement system can adapt to the influence of various factors such as the curvature change of the target to be measured, ambient light interference, and probe jitter in real time, ensuring that high-quality measurement data can be obtained in different monitoring periods to meet the needs of high-precision and high-reliability measurement.

[0052] like Figure 4 The figure shows a flow chart for measurement accuracy analysis and probe parameter optimization provided by an embodiment of the present application. The specific logic is as follows: 3D measurement data is acquired, a cross-sectional view is generated for the second monitoring period, measurement accuracy analysis is performed, and the accuracy is determined to determine whether it exceeds a threshold. If so (i.e., the acquired measurement accuracy analysis value is greater than a preset measurement accuracy analysis value), probe parameter optimization is initiated, sequentially adjusting the light source current and probe tilt angle to suppress ambient light interference. After optimization is complete, the optimization results are recorded, the current probe parameters are maintained, and the measurement accuracy analysis ends. This logic continuously monitors measurement accuracy and dynamically adjusts probe parameters to effectively suppress environmental interference, ensuring high-precision crack measurement under various conditions.

[0053] The measurement accuracy analysis of the cross-sectional view of the target to be measured at the end of the second monitoring period is performed based on the acquired three-dimensional measurement data, specifically:

[0054] First, the difference between the point cloud density and the total number of data points per unit area in the cross-sectional view is obtained, and the point cloud density compensation value in the database is combined for compensation processing to obtain the point cloud density analysis value. The specific restriction expression is: , where It represents the point cloud density analysis value of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period. Indicates the point cloud density compensation value, It represents the point cloud density of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period. Indicates the total number of data points.

[0055] Then, the difference between the speckle noise intensity and the maximum allowable speckle noise intensity in the database is obtained, and the speckle noise intensity compensation value in the database is combined for compensation processing to obtain the speckle noise intensity analysis value. The specific restriction expression is: , where It represents the speckle noise intensity analysis value of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period, represents the speckle noise intensity compensation value, represents the speckle noise intensity of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period, Represents the maximum allowable speckle noise intensity. The units of speckle noise intensity and maximum allowable speckle noise intensity are the same, decibel (dB). The maximum allowable speckle noise intensity is expressed by averaging the maximum values ​​of the historical speckle noise intensities of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view of the database at the end of each historical monitoring period.

[0056] Then, the difference between the crack depth harmonic amplitude and the maximum allowable crack depth harmonic amplitude in the database is obtained, and the crack depth harmonic amplitude compensation value in the database is combined for compensation processing to obtain the crack depth harmonic amplitude analysis value. The specific restriction expression is: , where It represents the crack depth harmonic amplitude analysis value of the target crack to be measured in the cross-sectional view corresponding to the endoscope probe at the end of the second monitoring period. Indicates the crack depth harmonic amplitude compensation value, It represents the harmonic amplitude of the crack depth of the target crack to be measured in the cross-sectional view corresponding to the end of the second monitoring period of the endoscope probe, It represents the maximum allowable crack depth harmonic amplitude. The unit of the crack depth harmonic amplitude is the same as that of the maximum allowable crack depth harmonic amplitude, both of which are micrometers (μm). The maximum allowable crack depth harmonic amplitude is represented by the sum and average of the maximum values ​​of the historical crack depth harmonic amplitudes of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view in the database at the end of each historical monitoring period.

[0057] Finally, the obtained speckle noise intensity analysis value and the crack depth harmonic amplitude analysis value are inversely proportionally processed and coupled with the point cloud density analysis value to obtain the measurement accuracy analysis value. The measurement accuracy analysis value represents the quantitative data of the three-dimensional measurement process of the surface crack of the target to be measured in the cross-sectional view by the three-dimensional measurement data. The measurement accuracy analysis value The specific restriction expression is: , where It represents the measurement accuracy analysis value of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period.

[0058] The database stores preset compensation values ​​that are closely related to the measurement accuracy analysis values. A predefined mapping relationship is established between these compensation values ​​and the corresponding point cloud density, speckle noise intensity, and crack depth harmonic amplitude. It is worth noting that this mapping is not set arbitrarily. It can be a one-to-one correspondence or a many-to-one relationship. For example, in practical applications, when it is necessary to evaluate the accuracy of the three-dimensional measurement process of cracks on the surface of the target to be measured, the point cloud density, speckle noise intensity, and crack depth harmonic amplitude obtained in real time can be directly input into this preset mapping relationship, and the point cloud density compensation value, speckle noise intensity compensation value, and crack depth harmonic amplitude compensation value that match the point cloud density, speckle noise intensity, and crack depth harmonic amplitude can be quickly and accurately obtained.

[0059] It is particularly important that, in order to ensure the consistency and comparability of the evaluation, the value ranges of the point cloud density compensation value, the speckle noise intensity compensation value, and the crack depth harmonic amplitude compensation value in this example are all limited to between 0 and 1, and the sum of the three is 1.

[0060] In this embodiment, the measurement accuracy analysis value decreases with the increase of speckle noise intensity and crack depth harmonic amplitude, and increases with the increase of point cloud density. Specifically, when the speckle noise intensity increases, the reflected light signal of the highly reflective metal surface collected by the endoscopic probe is severely disturbed, resulting in a large number of irregular noise points in the imaging image. These noise points will be converted into erroneous point cloud data during the three-dimensional reconstruction process, making the point cloud distribution chaotic, reducing the number of valid point clouds, and lowering the point cloud density.

[0061] When the point cloud density decreases, the intervals between point cloud data become larger, making it difficult to accurately reflect the subtle structure and changes of the metal surface. At this time, the point cloud error caused by speckle noise accounts for a relatively larger proportion of the overall data, and the impact of noise on measurement accuracy becomes more significant. This is because the sparse point cloud cannot provide enough information to suppress or correct noise interference, causing the measurement results to deviate from the true value, further reducing the measurement accuracy.

[0062] When the intensity of speckle noise increases, the noise signal and the crack depth harmonic signal are superimposed on each other, making the harmonic characteristics unclear. For example, under noise interference, the crack depth harmonic signal that originally has a certain frequency and amplitude may be submerged by the noise, resulting in the inability to accurately extract harmonic information, making it difficult to accurately judge the depth and shape of the crack. Speckle noise may also cause distortion of the crack depth harmonic signal. The irregular changes in noise will cause the waveform of the harmonic signal to distort, changing parameters such as the frequency, amplitude, and phase of the harmonics. This distortion will lead to deviations in the measurement of the crack depth harmonic amplitude, reducing the measurement accuracy analysis value and affecting the accuracy of crack identification.

[0063] Taking the above-mentioned mutual influence mechanism into consideration helps to improve the overall quality of three-dimensional measurement and monitoring, enhance the accuracy of crack identification, reduce measurement errors caused by external interference, ensure that the system can operate stably under different working conditions, avoid long-term invalid measurements, and achieve a balance between measurement efficiency and accuracy. This in turn improves the accuracy of crack identification on highly reflective metal surfaces during three-dimensional measurement and monitoring, effectively solving the problem of low accuracy in crack area identification on highly reflective metal surfaces during three-dimensional measurement and monitoring using endoscopic probes in the prior art.

[0064] Furthermore, whether to update the probe parameters is determined based on the measurement accuracy analysis results. Specifically, when the obtained measurement accuracy analysis value is not less than the maximum measurement accuracy analysis value preset in the database, it indicates that the three-dimensional measurement result of the surface crack of the target to be measured meets the expected requirements and a three-dimensional measurement monitoring instruction for the third monitoring period is sent. The preset maximum measurement accuracy analysis value is represented by the sum and average of the maximum values ​​of the historical measurement accuracy analysis values ​​of the endoscopic probe corresponding to the crack of the target to be measured in the cross-sectional view in the database at the end of each historical monitoring period; when the obtained measurement accuracy analysis value is within the allowable range of the measurement accuracy analysis value in the database, a super-resolution reconstruction instruction is sent. The super-resolution reconstruction instruction is used to prompt the preset personnel to start super-resolution reconstruction to ensure that the clarity of the endoscopic probe is improved while the three-dimensional measurement is accurate. The allowable range of the measurement accuracy analysis value represents the range corresponding to the maximum and minimum values ​​of the historical measurement accuracy analysis values ​​of the endoscopic probe corresponding to the crack of the target to be measured in the cross-sectional view in the database at the end of the historical monitoring period; when the obtained measurement accuracy analysis value is less than the measurement accuracy analysis value preset in the database, the probe parameters are updated. The probe parameters include light source current and probe inclination.

[0065] Among them, the probe parameter update is specifically as follows: the obtained measurement accuracy analysis value deviation and the reflected light source current deviation are input together into the PID control algorithm of the endoscope probe to output the light source current update amplitude, and the obtained measurement accuracy analysis value deviation and the speckle noise intensity deviation are input together into the point cloud enhancement algorithm of the endoscope probe to output the probe tilt angle update amplitude; if the measurement accuracy analysis value obtained again after one probe parameter update is not less than the preset maximum value of the measurement accuracy analysis value, the probe parameter update is completed and the three-dimensional measurement monitoring instruction of the third monitoring period is sent, otherwise the endoscope probe recalibration instruction is sent, and the preset measurement accuracy analysis value is represented by the sum and average of the minimum values ​​of the historical measurement accuracy analysis values ​​of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view in the database at the end of each historical monitoring period; the measurement accuracy analysis value deviation is used to quantify the degree of difference between the preset measurement accuracy analysis value and the obtained measurement accuracy analysis value, that is, the preset The difference between the measurement accuracy analysis value and the obtained measurement accuracy analysis value; the reflected light source current deviation is used to quantify the degree of difference between the maximum allowable reflected light end current of the endoscope probe and the actual reflected light end current of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period, that is, the difference between the maximum allowable reflected light end current and the actual reflected light end current (measured by the Hall effect current sensor embedded in the reflected light end power supply circuit in the endoscope probe). The maximum allowable reflected light end current is represented by the sum and average of the maximum values ​​of the historical reflected light end currents of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view in the database at the end of each historical monitoring period; the speckle noise intensity deviation is used to quantify the degree of difference between the maximum allowable speckle noise intensity of the endoscope probe and the actual speckle noise intensity of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period, that is, the difference between the maximum allowable speckle noise intensity and the actual speckle noise intensity.

[0066] In this embodiment, a PID control algorithm is used to output the light source current update amplitude based on the measurement accuracy analysis value deviation and the reflected light source current deviation, precisely regulating the light source intensity and ensuring stable and appropriate reflected light. Simultaneously, a point cloud enhancement algorithm is used to output the probe tilt angle update amplitude based on the measurement accuracy analysis value deviation and the speckle noise intensity deviation, effectively reducing speckle noise interference and improving point cloud quality. Compared to single algorithms or manual adjustments, this example comprehensively considers the interactions between multiple parameters, such as light source current, probe tilt angle, measurement accuracy, and speckle noise intensity, and achieves multi-parameter joint optimization through an algorithm. This optimization approach avoids the imbalance of other parameters caused by adjusting a single parameter, more effectively improving the overall performance of the endoscope probe and ensuring the accuracy and reliability of measurement results.

[0067] like Figure 5As shown, it is a logical framework diagram of a three-dimensional measurement and monitoring method of an endoscopic probe provided by an embodiment of the present application. The three-dimensional measurement and monitoring method of an endoscopic probe provided by an embodiment of the present application includes the following steps: Step 1, performing a measurement position matching analysis on the reflected light phase state of the target to be measured at the end of the first monitoring period based on the acquired three-dimensional coordinate data, and obtaining a measurement position matching analysis result. The three-dimensional coordinate data is used to reflect the stereo matching state of the endoscopic probe in the preset monitoring area corresponding to the surface of the target to be measured when the endoscopic probe is inserted into the surface of the target to be measured. There is at least one probe monitoring point in the preset monitoring area. The measurement position matching analysis is used to quantify the degree of conformity between the surface crack position of the target to be measured and the corresponding reference crack monitoring position; Step 2, judging whether to update the reflector parameters based on the measurement position matching analysis result, and judging whether to perform measurement based on the acquired curvature change rate. Measurement strategy optimization, reflector parameter update means updating the reflection inclination angle corresponding to the detachable reflector in the endoscope probe based on the obtained measurement position matching analysis value when the measurement position matching analysis result does not meet the requirements. Measurement strategy optimization means adjusting the lens magnification and light source wavelength to improve the balance between the resolution and field of view of the endoscope probe; step three, based on the obtained three-dimensional measurement data, a measurement accuracy analysis is performed on the cross-sectional view of the target to be measured at the end of the second monitoring period to obtain the measurement accuracy analysis result, and at the same time, based on the measurement accuracy analysis result, it is determined whether to update the probe parameters. The measurement accuracy analysis is used to quantify the accuracy of the endoscope probe in crack measurement of the target surface to be measured, and the cross-sectional view is used to visualize the changes in the crack state of the target surface to be measured during the second monitoring period. The probe parameter update means adjusting the light source current and probe inclination to suppress ambient light interference.

[0068] In this embodiment, the second monitoring period is an iterative extension of the first monitoring period, that is, the initial conditions of the second monitoring period are determined by the optimization results at the end of the first monitoring period, forming a closed-loop feedback control. By monitoring and quantifying in divided time periods, the accuracy of the measurement position matching analysis and the measurement accuracy analysis is improved, which is particularly suitable for the measurement of complex three-dimensional structures such as highly reflective metal surfaces. Compared with traditional qualitative or semi-quantitative analysis, the quantitative analysis method in this example can more accurately evaluate the accuracy of the measurement position, facilitate timely discovery and correction of position deviations, further improve measurement accuracy, and provide strong support for accurate identification and positioning of cracks.

[0069] In summary, the embodiment of the present application performs a measurement position matching analysis on the phase state of the reflected light of the target to be measured at the end of the first monitoring period to determine whether to update the reflector parameters, and at the same time determines whether to optimize the measurement strategy based on the obtained curvature change rate, and then performs a measurement accuracy analysis at the end of the second monitoring period to determine whether to update the probe parameters, thereby achieving refined control of the three-dimensional measurement process of highly reflective metal surfaces, and further achieving improved accuracy in crack identification of highly reflective metal surfaces during three-dimensional measurement monitoring, effectively solving the problem of low accuracy in crack area identification during three-dimensional measurement monitoring of highly reflective metal surfaces by endoscopic probes in the prior art.

[0070] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0071] The present invention is described with reference to flowcharts and / or block diagrams of systems, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0072] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0073] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0074] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0075] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A three-dimensional measurement and monitoring system for an endoscopic probe, characterized in that: include: Measurement position matching analysis module, curvature analysis module and measurement accuracy analysis module; wherein the measurement position matching analysis module is used to perform a measurement position matching analysis on the phase state of the reflected light of the target to be measured at the end of the first monitoring period based on the acquired three-dimensional coordinate data to obtain a measurement position matching analysis result, wherein the three-dimensional coordinate data is used to reflect the stereo matching state of the endoscope probe in the preset monitoring area corresponding to the surface of the target to be measured when the endoscope probe is inserted into the surface of the target to be measured, and the three-dimensional coordinate data includes the lens screen brightness, the lens reflection inclination angle and the lens center distance. There is at least one probe monitoring point in the preset monitoring area, and the measurement position matching analysis is used to quantify the degree of conformity between the surface crack position of the target to be measured and the corresponding reference crack monitoring position; The curvature analysis module is used to determine whether to update the reflector parameters based on the measurement position matching analysis result, and to determine whether to optimize the measurement strategy based on the obtained curvature change rate. The reflector parameter update means updating the reflection inclination corresponding to the detachable reflector in the endoscope probe based on the obtained measurement position matching analysis value when the measurement position matching analysis result does not meet the requirements. The curvature change rate is obtained based on the curvature and arc length of the edge of the crack area, and is used to quantify the curvature change of the crack area where the target to be measured is located. The measurement strategy optimization means adjusting the lens magnification and light source wavelength to improve the balance between the resolution and field of view of the endoscope probe; The measurement accuracy analysis module is configured to perform a measurement accuracy analysis on a cross-sectional view of the target to be measured at the end of a second monitoring period based on the acquired three-dimensional measurement data to obtain a measurement accuracy analysis result, and to determine whether to update probe parameters based on the measurement accuracy analysis result. The three-dimensional measurement data includes point cloud density, speckle noise intensity, and crack depth harmonic amplitude. The measurement accuracy analysis is configured to quantify the accuracy of crack measurement performed by the endoscopic probe on the surface of the target to be measured. The cross-sectional view is configured to visualize changes in the crack state of the surface of the target to be measured during the second monitoring period. The probe parameter update represents adjusting the light source current and the probe inclination angle to suppress ambient light interference.

2. A three-dimensional measurement and monitoring system for an endoscopic probe according to claim 1, characterized in that: The process of obtaining the three-dimensional coordinate data is as follows: Obtaining the surface reflected light intensity of the target to be measured at the end of the first monitoring period; if the obtained surface reflected light intensity is less than the maximum allowable surface reflected light intensity in the database, obtaining the lens screen brightness of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period; otherwise, sending a light source power increase instruction, wherein the light source power increase instruction is used to prompt a preset personnel to start a spare LED array to improve the clarity of the crack area on the surface of the target to be measured; If the obtained lens screen brightness is less than the maximum allowable lens screen brightness in the database, the lens reflection inclination angle and lens center distance of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period are obtained, otherwise a lens screen brightness reduction instruction is sent. The lens screen brightness reduction instruction is used to prompt the preset personnel to adjust the brightness of the display terminal to a preset value to avoid overheating of the endoscope probe due to high brightness. The lens reflection inclination angle represents the inclination angle of the corresponding lens of the endoscope probe relative to the horizontal direction monitored by the inclination sensor of the lens part of the endoscope probe, and the lens center distance is obtained by monitoring the laser ranging sensor in the lens area of ​​the endoscope probe.

3. The three-dimensional measurement and monitoring system of an endoscopic probe according to claim 2, characterized in that: The measurement position matching degree analysis of the reflected light phase state of the target to be measured at the end of the first monitoring period is performed based on the acquired three-dimensional coordinate data, specifically: Obtain the difference between the lens screen brightness and the maximum allowable lens screen brightness in the database, and perform correction processing based on the lens screen brightness correction value in the database to obtain a lens screen brightness analysis value; Obtaining the relative difference between the lens reflection inclination angle and the lens reflection inclination angle set in the database, and performing correction processing based on the lens reflection inclination angle correction value in the database to obtain a lens reflection inclination angle analysis value; Obtaining the relative difference between the lens center distance and the lens center distance set in the database, and performing correction processing based on the lens center distance correction value in the database to obtain the lens center distance analysis value; The obtained lens screen brightness analysis value, lens reflection tilt analysis value and lens center distance analysis value are coupled and calculated to obtain a measurement position matching analysis value, which represents quantitative data on the degree of influence of the three-dimensional coordinate data on the alignment process of the corresponding surface crack position of the target to be measured.

4. The three-dimensional measurement and monitoring system of an endoscopic probe according to claim 1, characterized in that: The determination of whether to update the reflector parameters according to the measurement position matching analysis result is specifically as follows: If the obtained measurement position matching analysis value is not greater than the measurement position matching analysis value preset in the database, it indicates that the measurement position matching meets the expected requirements and a curvature analysis instruction is sent; If the obtained measurement position matching analysis value is greater than the measurement position matching analysis value preset in the database, it indicates that the measurement position matching analysis result does not meet the curvature analysis requirements and the reflection inclination deviation is obtained, and the reflector parameters are updated at the same time; The reflection inclination angle deviation includes a first reflection inclination angle deviation and a second reflection inclination angle deviation; The first reflection inclination angle deviation is used to reflect the deviation in the spatial relationship between the first reflector in the endoscope probe and the surface of the target to be measured at the end of the first monitoring period; The second reflection inclination angle deviation is used to reflect the deviation in the spatial relationship between the second reflector in the endoscope probe and the surface of the target to be measured at the end of the first monitoring period; The reflector parameters include a first reflection inclination angle and a second reflection inclination angle.

5. The three-dimensional measurement and monitoring system of an endoscopic probe according to claim 4, characterized in that: The reflector parameter update is specifically as follows: The obtained measurement position matching analysis value deviation and the first reflection inclination angle deviation are inputted into the particle swarm optimization algorithm to output the first reflection inclination angle update amplitude. At the end of the first reflection inclination angle update, it is determined whether the monitored offset of the lens center distance relative to the target center distance is within the corresponding offset allowable range in the database. If so, the first reflection inclination angle update is continued until the re-acquired measurement position matching analysis value is less than the measurement position matching analysis value preset in the database. The first reflection inclination angle update is completed. Otherwise, the preset personnel are prompted to check the lens distortion coefficient. The obtained measurement position matching analysis value deviation and the second reflection tilt angle deviation are inputted into the particle swarm optimization algorithm together to output the second reflection tilt angle update amplitude. At the end of the second reflection tilt angle update, it is determined whether the monitored offset of the lens center distance relative to the target center distance is within the corresponding offset allowable range in the database. If so, the second reflection tilt angle update is continued until the re-acquired measurement position matching analysis value is less than the measurement position matching analysis value preset in the database. The second reflection tilt angle update is completed. Otherwise, the preset personnel are prompted to check the lens distortion coefficient. The measurement position matching analysis value deviation is used to quantify the degree of difference between the obtained measurement position matching analysis value and a preset measurement position matching analysis value.

6. The three-dimensional measurement and monitoring system of an endoscopic probe according to claim 1, characterized in that: The determination of whether to optimize the measurement strategy based on the obtained curvature change rate is specifically as follows: Obtain the ambient light radiation intensity of the crack area where the target to be measured is located at the end of the first monitoring period. If the obtained ambient light radiation intensity is less than the maximum allowable ambient light radiation intensity in the database, obtain the curvature change rate based on the curvature and arc length of the edge of the crack area; otherwise, send a light source power increase instruction again; If the obtained curvature change rate is not greater than the curvature change rate preset in the database, the measurement accuracy analysis is performed, otherwise the measurement strategy optimization is performed; The measurement strategy optimization is specifically as follows: The obtained curvature change rate deviation and probe anti-shake response time deviation are input into the PID control algorithm of the endoscope probe to output the increase amplitude of the light source wavelength and the decrease amplitude of the curvature change rate deviation; If the obtained curvature change rate deviation decreases less than the set decrease, a zoom lens switching command is sent; otherwise, the current resolution is maintained and the wavelength of the light source is continuously increased by the preset range until the newly obtained curvature change rate deviation is no greater than 0, and then measurement accuracy analysis is performed; The curvature change rate deviation is used to quantify the difference between the preset curvature change rate and the obtained curvature change rate; The probe anti-shake response time deviation is used to quantify the difference between the maximum allowable anti-shake response time of the endoscope probe and the actual anti-shake response time of the endoscope probe corresponding to the target to be measured at the end of the first monitoring period.

7. The three-dimensional measurement and monitoring system of an endoscopic probe according to claim 1, characterized in that: The measurement accuracy analysis of the cross-sectional view of the target to be measured at the end of the second monitoring period is performed based on the acquired three-dimensional measurement data, specifically: Obtaining the degree of difference between the point cloud density and the total number of data points per unit area in the cross-sectional view, and performing compensation processing in combination with the point cloud density compensation value in the database to obtain a point cloud density analysis value. The point cloud density is used to quantify the geometric resolution and measurement reliability of the anatomical structure of the target surface to be measured in the cross-sectional view; Obtaining the difference between the speckle noise intensity and the maximum allowable speckle noise intensity in the database, and performing compensation processing in combination with the speckle noise intensity compensation value in the database to obtain a speckle noise intensity analysis value. The speckle noise intensity is used to quantify the degree to which the scattering characteristics of the surface of the target to be measured in the cross-sectional view interfere with the three-dimensional measurement accuracy of the crack; Obtaining the difference between the crack depth harmonic amplitude and the maximum allowable crack depth harmonic amplitude in the database, and performing compensation processing in combination with the crack depth harmonic amplitude compensation value in the database to obtain a crack depth harmonic amplitude analysis value. The crack depth harmonic amplitude is used to quantify the extent of crack propagation and fracture risk on the surface of the target to be measured in the cross-sectional view; The obtained speckle noise intensity analysis value and the crack depth harmonic amplitude analysis value are inversely proportionally processed, and the result is coupled with the point cloud density analysis value to obtain a measurement accuracy analysis value. The measurement accuracy analysis value represents the quantitative data of the three-dimensional measurement process of the surface crack of the target to be measured in the cross-sectional view using the three-dimensional measurement data.

8. The three-dimensional measurement and monitoring system of an endoscopic probe according to claim 7, characterized in that: The determination of whether to update the probe parameters based on the measurement accuracy analysis result is specifically as follows: When the obtained measurement accuracy analysis value is not less than the maximum measurement accuracy analysis value preset in the database, it indicates that the three-dimensional measurement result of the surface crack of the target to be measured meets the expected requirements and a three-dimensional measurement monitoring instruction for the third monitoring period is sent; When the obtained measurement accuracy analysis value is within the allowable range of the measurement accuracy analysis value in the database, a super-resolution reconstruction instruction is sent, wherein the super-resolution reconstruction instruction is used to prompt the preset personnel to start super-resolution reconstruction to ensure that the clarity of the endoscope probe is improved while the three-dimensional measurement is accurate; When the acquired measurement accuracy analysis value is less than the measurement accuracy analysis value preset in the database, the probe parameters are updated, where the probe parameters include the light source current and the probe inclination angle.

9. The three-dimensional measurement and monitoring system of an endoscopic probe according to claim 8, characterized in that: The probe parameter update is specifically as follows: The obtained measurement accuracy analysis value deviation and reflected light source current deviation are inputted into the PID control algorithm of the endoscope probe to output the light source current update amplitude. Meanwhile, the obtained measurement accuracy analysis value deviation and speckle noise intensity deviation are inputted into the point cloud enhancement algorithm of the endoscope probe to output the probe tilt angle update amplitude. If the measurement accuracy analysis value reacquired after one probe parameter update is not less than the preset maximum value of the measurement accuracy analysis value, the probe parameter update is completed and a three-dimensional measurement monitoring instruction for the third monitoring period is sent, otherwise an endoscope probe recalibration instruction is sent; The measurement accuracy analysis value deviation is used to quantify the degree of difference between the preset measurement accuracy analysis value and the obtained measurement accuracy analysis value; The reflected light source current deviation is used to quantify the difference between the maximum allowable reflected light end current of the endoscope probe and the actual reflected light end current of the endoscope probe corresponding to the target crack to be measured in the cross-sectional view at the end of the second monitoring period; The speckle noise intensity deviation is used to quantify the difference between the maximum allowable speckle noise intensity of the endoscopic probe and the actual speckle noise intensity of the endoscopic probe corresponding to the target crack to be detected in the cross-sectional view at the end of the second monitoring period.

10. A three-dimensional measurement and monitoring method for an endoscopic probe, characterized in that: The following steps are involved: Step 1: Performing a measurement position matching analysis on the phase state of reflected light of the target to be measured at the end of the first monitoring period based on the acquired three-dimensional coordinate data to obtain a measurement position matching analysis result, wherein the three-dimensional coordinate data is used to reflect the stereo matching state of the endoscope probe in the preset monitoring area relative to the surface of the target to be measured when the endoscope probe is inserted into the surface of the target to be measured, and the three-dimensional coordinate data includes the lens screen brightness, the lens reflection inclination angle, and the lens center distance. There is at least one probe monitoring point in the preset monitoring area, and the measurement position matching analysis is used to quantify the degree of conformity between the surface crack position of the target to be measured and the corresponding reference crack monitoring position; Step 2: Determine whether to update the reflector parameters based on the measurement position matching analysis result, and determine whether to optimize the measurement strategy based on the obtained curvature change rate. The reflector parameter update means updating the reflection inclination corresponding to the detachable reflector in the endoscope probe based on the obtained measurement position matching analysis value when the measurement position matching analysis result does not meet the requirements. The curvature change rate is obtained based on the curvature and arc length of the edge of the crack area, and is used to quantify the curvature change of the crack area where the target to be measured is located. The measurement strategy optimization means adjusting the lens magnification and light source wavelength to improve the balance between the resolution and field of view of the endoscope probe. Step three: Perform a measurement accuracy analysis on a cross-sectional view of the target to be measured at the end of the second monitoring period based on the acquired three-dimensional measurement data to obtain a measurement accuracy analysis result. At the same time, determine whether to update the probe parameters based on the measurement accuracy analysis result. The three-dimensional measurement data includes point cloud density, speckle noise intensity, and crack depth harmonic amplitude. The measurement accuracy analysis is used to quantify the accuracy of crack measurement of the target surface by the endoscope probe. The cross-sectional view is used to visualize changes in the crack state of the target surface to be measured during the second monitoring period. The probe parameter update represents adjusting the light source current and probe inclination to suppress ambient light interference.

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