Power-on test device of Internet of Things communication module mainboard

Abstract

The invention relates to the technical field of power-on testing, and discloses a power-on testing device of an Internet of Things communication module mainboard, which comprises a processing table, a base is fixedly mounted on one side above the processing table, the mainboard is placed above the base, and a clamping mechanism is arranged between the base and the mainboard. And a testing mechanism is arranged above the processing table on one side of the base. The two lower baffles are placed on the two sides of the lower portion of the main board, then the handle is pressed downwards, when the copper plate below the upper baffles makes contact with a circuit above the main board, whether the main board is powered on or not can be known by observing the universal meter, after testing is completed, the handle is loosened, and the upper baffles can be reset to be separated from the main board through the springs; therefore, the next test is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of power-on testing, and more specifically, to a power-on testing device for the main board of an Internet of Things communication module. Background Art

[0002] An Internet of Things communication module is a module integrating functions such as communication chips, baseband processing, and radio frequency transceivers. It enables Internet of Things devices to transmit and interact data with the cloud or other devices through various communication networks, realizing remote monitoring, management, and intelligent control of the devices. The main board, also known as the motherboard, system board, or main circuit board, is one of the most basic and important components of a computer. The main board is generally a rectangular circuit board on which the main circuit systems of the computer are installed. Generally, there are components such as a BIOS chip, an I / O control chip, keyboard and panel control switch interfaces, indicator light plug-ins, expansion slots, and DC power supply connectors for the main board and plug-in cards.

[0003] With the rapid development of Internet of Things technology, the application of the main board of Internet of Things communication modules is becoming more and more extensive. In the production process, power-on testing of the main board of Internet of Things communication modules is a key link to ensure product quality. The traditional power-on testing method is to use a multimeter. By clamping the positive and negative poles of the multimeter on the main board and then observing the multimeter, it is possible to know whether the main board is powered on. However, it is inconvenient to operate by clamping the positive and negative poles of the multimeter on the main board with clips, and after the test is completed, the clips need to be removed one by one, resulting in low efficiency. Therefore, we designed a power-on testing device for the main board of Internet of Things communication modules. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a power-on testing device for the main board of an Internet of Things communication module to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A power-on testing device for the main board of an Internet of Things communication module, including a processing table. One side above the processing table is fixedly installed with a base. A main board is placed above the base, and a clamping mechanism is arranged between the base and the main board. A testing mechanism is arranged above the processing table on one side of the base.

[0006] As a preferred technical solution of the present invention, the clamping mechanism includes two slots and two baffles. The two baffles are respectively placed on both sides of the main board. The two slots are respectively opened on both sides of the base. Plug plates are slidably arranged in the two slots. One end of the plug plate passes through the slot and is fixed on the side wall of the baffle. The other end of the plug plate is fixed with a plurality of springs. One ends of the plurality of springs are fixed at the bottom inside the slot, and the plurality of springs are in a stretched state.

[0007] As a preferred technical solution of the present invention, a rubber pad is fixed on the side wall of the baffle.

[0008] As a preferred technical solution of the present invention, the testing mechanism includes a U-shaped frame and a multimeter. The U-shaped frame is fixed above the processing table. A lower plate is fixed below the U-shaped frame. An upper plate is arranged directly above the lower plate, and a pushing mechanism is connected above the upper plate. Lower baffles are arranged on both sides above the lower plate, and a lower sliding mechanism is arranged between the lower baffles and the lower plate. Upper baffles are arranged on both sides below the upper plate, and an upper sliding mechanism is arranged between the upper baffles and the upper plate. One side of the upper baffle is connected to the lower baffle through a sliding mechanism. A copper plate is fixed below the upper baffle. The multimeter is placed on one side above the processing table, and the two copper plates are connected to the positive and negative poles of the multimeter through wires.

[0009] As a preferred technical solution of the present invention, the pushing mechanism includes two sliding rods and two sliding holes. The two sliding holes are respectively opened on both sides above the U-shaped frame. One ends of the two sliding rods are respectively fixed on both sides above the upper plate. The other ends of the two sliding rods respectively pass through the two sliding holes and extend upward, and a handle is fixed between the two sliding rods. Springs are sleeved on one side of the two sliding rods. One end of the spring is fixed above the upper plate, and the other end of the spring is fixed on the side wall of the U-shaped frame.

[0010] As a preferred technical solution of the present invention, the lower sliding mechanism includes a lower convex-shaped sliding plate and a lower convex-shaped sliding groove. The lower convex-shaped sliding groove is opened on both sides above the lower plate. The lower convex-shaped sliding plate is fixed at the bottom of the lower baffle, and the lower convex-shaped sliding plate is slidably arranged in the lower convex-shaped sliding groove.

[0011] As a preferred technical solution of the present invention, the upper sliding mechanism includes an upper convex-shaped sliding plate and an upper convex-shaped sliding groove. The upper convex-shaped sliding groove is opened on both sides below the upper plate. The upper convex-shaped sliding plate is fixed above the upper baffle, and the upper convex-shaped sliding plate is slidably arranged in the upper convex-shaped sliding groove.

[0012] As a preferred technical solution of the present invention, the sliding mechanism includes an annular plate and a side sliding hole. The annular plate is fixed on one side above the lower baffle. One end of the upper baffle passes through the annular plate and extends outward. The side sliding hole is opened on one side of the upper baffle. A sliding rod is fixed on one side of the inner wall of the annular plate. One end of the sliding rod passes through the side sliding hole and is fixed on the other side of the inner wall of the annular plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] 1. In the present invention, by placing the main board above the base, the clamping mechanism can position the main board, so that the main board can be better powered on for testing.

[0015] 2. In the present invention, two lower baffles are placed on both sides under the main board, and then the handle is pressed downwards. When the copper plate under the upper baffle contacts the circuit above the main board, it can be known whether the main board is powered on by observing the multimeter. After the test is completed, the handle is released, and the upper baffle can be reset and separated from the main board through the spring, so as to facilitate the next test.

[0016] 3. In the present invention, the upper baffle and the lower baffle can be connected through a sliding mechanism. When it is necessary to adjust the positions of the upper baffle and the lower baffle, only need to pull it and slide it left and right. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is the front view structural schematic diagram of a power-on test device for the main board of an Internet of Things communication module according to the present invention;

[0018] Figure 2 is the side view structural schematic diagram of a power-on test device for the main board of an Internet of Things communication module according to the present invention;

[0019] Figure 3 is the top view structural schematic diagram of a power-on test device for the main board of an Internet of Things communication module according to the present invention;

[0020] Figure 4 is the front view structural schematic diagram of the test mechanism of a power-on test device for the main board of an Internet of Things communication module according to the present invention;

[0021] Figure 5 is the enlarged schematic diagram of the structure of part A of a power-on test device for the main board of an Internet of Things communication module according to the present invention.

[0022] In the figure: 1, processing table; 2, base; 3, plug board; 4, slot; 5, spring; 6, baffle; 7, U-shaped frame; 8, lower baffle; 9, lower plate; 10, upper baffle; 11, upper plate; 12, spring; 13, sliding rod; 14, handle; 15, lower convex sliding plate; 16, lower convex sliding groove; 17, upper convex sliding plate; 18, upper convex sliding groove; 19, multimeter; 20, annular plate; 21, sliding rod; 22, copper plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Embodiment 1

[0025] As Figures 1 to 5As shown in the figure, the present invention provides a power-on test device for an Internet of Things communication module main board, including a processing table 1. One side above the processing table 1 is fixedly installed with a base 2. A main board is placed above the base 2, and a clamping mechanism is arranged between the base 2 and the main board. A test mechanism is arranged above the processing table 1 on one side of the base 2. By placing the main board above the base 2, the main board can be positioned by the clamping mechanism, so that the main board can be better tested for power-on.

[0026] Among them, the clamping mechanism includes two slots 4 and two baffles 6. The two baffles 6 are respectively placed on both sides of the main board. A rubber pad is fixed on the side wall of the baffle 6. The friction force of the side wall of the baffle 6 can be increased through the rubber pad. The two slots 4 are respectively opened on both sides of the base 2. Plug boards 3 are slidably arranged in the two slots 4. One end of the plug board 3 passes through the slot 4 and is fixed on the side wall of the baffle 6. The other end of the plug board 3 is fixed with a plurality of springs 4. One end of the plurality of springs 4 is fixed at the inner bottom of the slot 4, and the plurality of springs 4 are in a stretched state. By placing the two baffles 6 on both sides of the main board respectively, since the springs 4 are in a stretched state, a force can be applied to the baffle 6 through the springs 4, so that the main board can be clamped and positioned.

[0027] Embodiment 2

[0028] Referring to Figures 1-5 , as another preferred embodiment of the present invention, different from Embodiment 1, the test mechanism includes a U-shaped frame 7 and a multimeter 19. The U-shaped frame 7 is fixed above the processing table 1. A lower plate 9 is fixedly installed below the U-shaped frame 7. An upper plate 11 is arranged directly above the lower plate 9, and a pushing mechanism is connected above the upper plate 11. Lower baffles 8 are arranged on both sides above the lower plate 9, and a lower sliding mechanism is arranged between the lower baffles 8 and the lower plate 9. Upper baffles 10 are arranged on both sides below the upper plate 11, and an upper sliding mechanism is arranged between the upper baffles 10 and the upper plate 11. One side of the upper baffle 10 is connected to the lower baffle 8 through a sliding mechanism. A copper plate 22 is fixed below the upper baffle 10. The multimeter 19 is placed on one side above the processing table 1, and the two copper plates 22 are connected to the positive and negative poles of the multimeter 19 through wires. By placing the two lower baffles 8 on both sides below the main board and driving the upper plate 11 to move downward by pushing the pushing mechanism, the two upper baffles 10 can be driven to move downward when the upper plate 11 moves downward. When the copper plate 22 below the upper baffle 10 contacts the circuit above the main board, it can be known whether the main board is powered on by observing the multimeter 19.

[0029] Among them, the pushing mechanism includes two sliding rods 13 and two sliding holes. The two sliding holes are respectively opened on both sides above the U-shaped frame 7. One ends of the two sliding rods 13 are respectively fixed on both sides above the upper plate 11. The other ends of the two sliding rods 13 respectively pass through the two sliding holes and extend upward. A handle 14 is fixed between the two sliding rods 13. Springs 12 are sleeved on one side of the two sliding rods 13. One end of the spring 12 is fixed above the upper plate 11, and the other end of the spring 12 is fixed on the side wall of the U-shaped frame 7. By pushing down the handle 14, the upper plate 11 can be driven to move downward. When the upper plate 11 moves downward, the spring 12 will deform. After the test is completed, when the handle 14 is released, the spring 12 will reset and drive the upper baffle 10 to reset and separate from the main board, so as to facilitate the next test.

[0030] Among them, the lower sliding mechanism includes a lower convex-shaped sliding plate 15 and a lower convex-shaped sliding groove 16. The lower convex-shaped sliding groove 16 is opened on both sides above the lower plate 9. The lower convex-shaped sliding plate 15 is fixed to the bottom of the lower baffle 8, and the lower convex-shaped sliding plate 15 is slidably arranged in the lower convex-shaped sliding groove 16. By sliding the lower convex-shaped sliding plate 15 in the lower convex-shaped sliding groove 16, the position of the lower baffle 8 can be adjusted. The upper sliding mechanism includes an upper convex-shaped sliding plate 17 and an upper convex-shaped sliding groove 18. The upper convex-shaped sliding groove 18 is opened on both sides below the upper plate 11. The upper convex-shaped sliding plate 15 is fixed above the upper baffle 10, and the upper convex-shaped sliding plate 15 is slidably arranged in the upper convex-shaped sliding groove 16. By sliding the upper convex-shaped sliding plate 15 in the upper convex-shaped sliding groove 16, the position of the upper baffle 10 can be adjusted.

[0031] Among them, the sliding mechanism includes an annular plate 20 and a side sliding hole. The annular plate 20 is fixed on one side above the lower baffle 8. One end of the upper baffle 10 passes through the annular plate 20 and extends outward. The side sliding hole is opened on one side of the upper baffle 10. One side of the inner wall of the annular plate 20 is fixed with a sliding rod 21. One end of the sliding rod 21 passes through the side sliding hole and is fixed on the other side of the inner wall of the annular plate 20. By sliding one side of the upper baffle 10 in the annular plate 20, the upper baffle 10 and the lower baffle 8 can be slidably connected. When pulling the upper baffle 10 or the lower baffle 8 to move, the upper baffle 10 and the lower baffle 8 can be driven to move simultaneously.

[0032] Working principle and usage process of the present invention: By placing the main board above the base 2, and placing the two baffles 6 on both sides of the main board respectively. Since the spring 4 is in a stretched state, a force can be exerted on the baffle 6 through the spring 4, thereby clamping and positioning the main board. By placing the two lower baffles 8 on both sides below the main board, pushing the handle 14 downward can drive the upper plate 11 to move downward. When the upper plate 11 moves downward, the spring 12 will deform to drive the upper plate 11 to move downward. The downward movement of the upper plate 11 can drive the two upper baffles 10 to move downward. When the copper plate 22 below the upper baffle 10 comes into contact with the circuit above the main board, by observing the multimeter 19, it can be known whether the main board is powered on. After the test is completed, release the handle 14, and the spring 12 will reset, driving the upper baffle 10 to reset and separate from the main board, so as to facilitate the next test.

[0033] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0034] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An energization test device for an Internet of Things communication module main board, including a processing table (1), characterized in that: Above one side of the processing table (1), a base (2) is fixedly installed. Above the base (2), a main board is placed, and a clamping mechanism is arranged between the base (2) and the main board. Above the processing table (1) on one side of the base (2), a testing mechanism is arranged.

2. The power-on test device for the motherboard of an Internet of Things communication module according to claim 1, characterized in that: The clamping mechanism includes two slots (4) and two baffles (6). The two baffles (6) are respectively placed on both sides of the main board. The two slots (4) are respectively opened on both sides of the base (2). In each of the two slots (4), a plug board (3) is slidably arranged. One end of the plug board (3) passes through the slot (4) and is fixed on the side wall of the baffle (6). The other end of the plug board (3) is fixed with a plurality of springs (4). One ends of the plurality of springs (4) are fixed on the inner bottom of the slot (4), and the plurality of springs (4) are in a stretched state.

3. The power-on test device for the motherboard of an Internet of Things communication module according to claim 2, characterized in that: A rubber pad is fixed on the side wall of the baffle (6).

4. The power-on test device for the main board of an Internet of Things communication module according to claim 1, characterized in that: The testing mechanism includes a U-shaped frame (7) and a multimeter (19). The U-shaped frame (7) is fixed above the processing table (1). A lower plate (9) is fixedly installed below the U-shaped frame (7). Above the lower plate (9), an upper plate (11) is arranged. Above the upper plate (11), a pushing mechanism is connected. On both sides above the lower plate (9), lower baffles (8) are arranged. Between the lower baffles (8) and the lower plate (9), a lower sliding mechanism is arranged. On both sides below the upper plate (11), upper baffles (10) are arranged. Between the upper baffles (10) and the upper plate (11), an upper sliding mechanism is arranged. One side of the upper baffle (10) is connected to the lower baffle (8) through a sliding mechanism. Below the upper baffle (10), a copper plate (22) is fixed. The multimeter (19) is placed on one side above the processing table (1). Between the two copper plates (22) and the positive and negative poles of the multimeter (19), they are connected by wires.

5. The power-on test device for the motherboard of an Internet of Things communication module according to claim 4, characterized in that: The pushing mechanism includes two slide rods (13) and two slide holes. The two slide holes are respectively opened on both sides above the U-shaped frame (7). One ends of the two slide rods (13) are respectively fixed on both sides above the upper plate (11). The other ends of the two slide rods (13) respectively pass through the two slide holes and extend upward. Between the two slide rods (13), a handle (14) is fixed. On one side of each of the two slide rods (13), a spring (12) is sleeved. One end of the spring (12) is fixed above the upper plate (11). The other end of the spring (12) is fixed on the side wall of the U-shaped frame (7).

6. The power-on test device for the motherboard of an Internet of Things communication module according to claim 4, characterized in that: The lower sliding mechanism includes a lower convex-shaped sliding plate (15) and a lower convex-shaped sliding groove (16). The lower convex-shaped sliding groove (16) is opened on both sides above the lower plate (9). The lower convex-shaped sliding plate (15) is fixed at the bottom of the lower baffle (8), and the lower convex-shaped sliding plate (15) is slidably arranged in the lower convex-shaped sliding groove (16).

7. An energization test device for an Internet of Things communication module main board according to claim 4, characterized in that: The upper sliding mechanism includes an upper convex-shaped sliding plate (17) and an upper convex-shaped sliding groove (18). The upper convex-shaped sliding groove (18) is opened on both sides below the upper plate (11). The upper convex-shaped sliding plate (15) is fixed above the upper baffle (10), and the upper convex-shaped sliding plate (15) is slidably arranged in the upper convex-shaped sliding groove (16).

8. An energization test device for the main board of an Internet of Things communication module, characterized in that: The sliding mechanism includes an annular plate (20) and a side sliding hole. The annular plate (20) is fixed on one side above the lower baffle (8). One end of the upper baffle (10) passes through the annular plate (20) and extends outward. The side sliding hole is formed on one side of the upper baffle (10). One side of the inner wall of the annular plate (20) is fixed with a sliding rod (21). One end of the sliding rod (21) passes through the side sliding hole and is fixed on the other side of the inner wall of the annular plate (20).

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