Semiconductor material bonding platform and semiconductor material bonding equipment

Abstract

The present invention discloses a semiconductor material bonding platform and a semiconductor material bonding device, which belong to the technical field of semiconductor material processing equipment. The semiconductor material bonding platform includes a displacement platform and a pressure platform. The displacement platform is configured to move within a plane to adjust the horizontal position of the pressure platform thereon; the pressure platform includes a base plate, which is directly or indirectly connected to the displacement platform. The drive plate is slidably connected to the base plate and can move along a first direction relative to the base plate. The supporting plate is slidably connected to the driving plate, and the supporting plate and the driving plate both have mutually fitting wedge surfaces, and the wedge surface is the mounting surface of the sliding mechanism between the supporting plate and the driving plate. The angle between the wedge surface and the base plate is 5° to 10°. The supporting plate is configured so that when the driving plate moves along the first direction, the supporting plate moves along the second direction, and the second direction is perpendicular to the plane. The present invention can improve the load capacity of the semiconductor material bonding platform and improve the bonding accuracy of semiconductor materials.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor material processing equipment, and in particular to a semiconductor material bonding platform and semiconductor material bonding equipment. Background Art

[0002] In the field of semiconductor manufacturing, the wafer bonding process is a core link in realizing advanced technologies such as three-dimensional integrated circuit stacking and MEMS device packaging. To ensure bonding accuracy, the marked positions of the upper and lower wafers need to be precisely aligned in advance using a visual system. Specifically, a camera is usually used to capture the position information of the wafer, and the upper and lower wafers are aligned by adjusting the motion platform that supports the wafer. However, due to the limited focal depth range of the camera, when the thickness or size of the bonded wafer changes, the axial distance between the wafer and the focal plane of the camera needs to be adjusted to obtain a clear image. Therefore, the axial distance between the wafer and the focal plane of the camera needs to be adjusted by raising and lowering the pressure platform.

[0003] The existing wafer carrier adopts a lifting drive structure of lead screw and linear bearing / guide rail. Its mechanical rigidity is limited by the structure and cannot directly support the high-load working conditions of large-size wafers or composite bonding heads. After the upper and lower wafers are aligned, the wafer carrier needs to be lowered to its original position first. During the bonding process, the wafer carrier and the auxiliary mechanism at the original position share the bonding load. In the process of the wafer carrier being lowered to its original position, the mechanical gap will cause the wafer posture to shift, resulting in failure of precision alignment, making the current wafer alignment accuracy within the range of ±3μm or even larger, resulting in the position matching accuracy and interface interconnection of the bonding equipment when processing small-size chips / wafers being greatly limited, making it difficult to meet the stringent requirements of high-precision bonding processes.

[0004] This section provides background information related to the present application which is not necessarily prior art. Summary of the Invention

[0005] The object of the present invention is to provide a semiconductor material bonding platform and a semiconductor material bonding device, which can improve the load capacity of the semiconductor material bonding platform and improve the bonding accuracy of the semiconductor material.

[0006] To achieve the above objectives, the following technical solutions are provided:

[0007] A semiconductor material bonding platform, characterized by comprising: a displacement platform and a pressure platform, wherein the displacement platform is configured to move in a plane to adjust the horizontal position of the pressure platform thereon;

[0008] The pressure-bearing platform includes a bottom plate, which is directly or indirectly connected to the displacement platform;

[0009] a driving plate, the driving plate being slidably connected to the base plate and movable along a first direction relative to the base plate;

[0010] A carrying plate, the carrying plate being slidably connected to the driving plate, the carrying plate and the driving plate both having mutually fitting wedge-shaped surfaces, the wedge-shaped surfaces being mounting surfaces of a sliding mechanism between the carrying plate and the driving plate;

[0011] The angle between the wedge-shaped surface and the bottom plate is 5° to 10°;

[0012] The carrying plate is configured so that when the driving plate moves along the first direction, the carrying plate moves along a second direction, and the second direction is perpendicular to the plane.

[0013] As an optional solution for the semiconductor material bonding platform, the platform includes at least two rows of parallel wedge-shaped surfaces in the lateral direction between the driving plate and the carrier plate.

[0014] As an optional solution for the semiconductor material bonding platform, the wedge-shaped surface is discontinuous in the first direction, forming at least two parallel wedge-shaped facets.

[0015] As an optional solution for the semiconductor material bonding platform, the wedge-shaped facets on the driving plate and the wedge-shaped facets on the carrier plate have a relative positional relationship with each other;

[0016] The sliding mechanism is arranged between the driving plate and the wedge-shaped surface of the carrying plate.

[0017] As an optional solution for the semiconductor material bonding platform, the wedge angles of any two of the wedge-shaped facets are the same.

[0018] As an optional solution for the semiconductor material bonding platform, guide mechanisms are provided on two opposite sides of the carrier plate, and the guide mechanisms are used to limit the directional movement of the carrier plate.

[0019] As an optional solution for the semiconductor material bonding platform, the guide mechanism includes a guide slider and a guide rail;

[0020] A first mounting plate is formed extending perpendicularly to the carrying plate;

[0021] A second mounting plate is formed extending perpendicularly to the bottom plate;

[0022] The guide slider or the guide rail is mounted on the first mounting plate or the second mounting plate respectively.

[0023] As an optional solution for the semiconductor material bonding platform, the pressure platform further includes a first limiter, which is arranged on the base plate and is used to abut the driving plate to limit the movement range of the driving plate along the first direction.

[0024] As an optional solution for the semiconductor material bonding platform, the pressure platform also includes a detection device and a second limiter, the second limiter is arranged on the side of the driving plate along the first direction toward the detection device, and the second limiter is protruded in the direction toward the base plate. The detection device is configured to limit the movement of the driving plate along the first direction after the second limiter moves to the detection position of the detection device.

[0025] A semiconductor material bonding device, characterized in that it comprises: a semiconductor material bonding platform as described in any of the aforementioned embodiments, the carrier plate carries a chuck, and the chuck is used to carry semiconductor materials; the semiconductor materials include wafers or chips.

[0026] As an optional solution for the semiconductor material bonding equipment, an intermediate mechanism is further included between the carrier plate and the chuck, and the intermediate mechanism includes a heating mechanism, a cooling mechanism, or a combination of a heating mechanism and a cooling mechanism.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The semiconductor material bonding platform and semiconductor material bonding equipment provided by the present invention include a displacement platform and a pressure platform. The displacement platform can adjust the position of the wafer according to the position information obtained by the camera, thereby realizing the alignment of the wafer. The pressure platform can adjust the distance between semiconductor materials of different specifications and the camera, thereby obtaining more accurate position information. At the same time, the driving plate and the supporting plate in the pressure platform cooperate through the wedge surface and the sliding structure between the wedge surfaces to realize the lifting and lowering of the supporting platform, and the angle between the wedge surface and the bottom plate is 5° to 10°, so that the load force can be dispersed from the load direction to other directions, thereby improving the load capacity of the pressure platform, so that the semiconductor material can be bonded without lowering the pressure platform after the camera obtains the position information, thereby improving the alignment accuracy of the semiconductor material from ±3μm to nanometer level, and improving the bonding accuracy of the semiconductor material. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0030] Figure 1 This is an axial schematic diagram of a semiconductor material bonding device according to an embodiment of the present invention;

[0031] Figure 2 This is an axial schematic diagram of a pressure-bearing platform in a semiconductor material bonding platform according to an embodiment of the present invention;

[0032] Figure 3 Schematic diagram of an explosion of a pressure-bearing platform in a semiconductor material bonding platform according to an embodiment of the present invention;

[0033] Figure 4 This is an axial schematic diagram of a pressure-bearing platform in a semiconductor material bonding platform according to an embodiment of the present invention, without showing a supporting plate;

[0034] Figure 5 Schematic cross-sectional view of a semiconductor material bonding platform in an embodiment of the present invention in which the pressure-bearing platform is not moved;

[0035] Figure 6 is a cross-sectional schematic diagram of a semiconductor material bonding platform in an embodiment of the present invention after the pressure platform moves along the second direction;

[0036] Figure 7 for Figure 3 A schematic diagram of an enlarged structure at P in the middle;

[0037] Figure 8 for Figure 3 Schematic diagram of the enlarged structure after the limit plate at position P in the middle moves to the detection position of the detection device.

[0038] Reference numerals:

[0039] 100, displacement platform; 200, pressure platform; 300, chuck; 400, intermediate mechanism;

[0040] 10. Bottom plate; 11. First mounting plate; 12. Second mounting plate; 13. Cover plate;

[0041] 2. driving plate; 20. first wedge-shaped surface; 21. first wedge-shaped facet;

[0042] 3. Loading plate; 30. Second wedge-shaped surface; 31. Second wedge-shaped facet;

[0043] 4. Sliding mechanism; 5. Guide mechanism; 50. Guide slider; 51. Guide rail;

[0044] 61. First position-limiting member; 62. Detection device; 63. Second position-limiting member;

[0045] 7. Driving device; 8. Linear transmission parts; 9. Linear guide rail. DETAILED DESCRIPTION

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0047] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0048] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0049] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0050] Figure 1 This is an axial schematic diagram of a semiconductor material bonding platform in an embodiment of the present invention. Figure 2 This is an axial schematic diagram of a pressure-bearing platform in a semiconductor material bonding platform in an embodiment of the present invention. Figure 3Schematic diagram of an explosion of a pressure-bearing platform in a semiconductor material bonding platform in an embodiment of the present invention. Figure 4 This is an axial schematic diagram of a pressure-bearing platform in a semiconductor material bonding platform in an embodiment of the present invention, not showing a supporting plate. Figure 5 This is a cross-sectional schematic diagram of a semiconductor material bonding platform in an embodiment of the present invention in which the pressure platform has not moved. Figure 6 It is a cross-sectional schematic diagram of a pressure-bearing platform in a semiconductor material bonding platform in an embodiment of the present invention after moving along the second direction. Figure 7 for Figure 3 Schematic diagram of an enlarged structure at P in the figure. Figure 8 for Figure 3 The first direction in the figure is the X direction, the horizontal direction in the figure is the Y direction, and the second direction in the figure is the Z direction.

[0051] See also Figures 1 to 6 , an embodiment of the present invention provides a semiconductor material bonding platform, which includes a displacement platform 100 and a pressure platform 200. The displacement platform 100 is configured to move within a plane to adjust the horizontal position of the pressure platform 200 thereon; the pressure platform 200 includes a base plate 10, which is directly or indirectly connected to the displacement platform 100. The driving plate 2 is slidably connected to the base plate 10 and can move along a first direction X relative to the base plate 10. The supporting plate 3 is slidably connected to the driving plate 2, and the supporting plate 3 and the driving plate 2 both have mutually matching wedge surfaces, and the wedge surface is the mounting surface of the sliding mechanism 4 between the supporting plate 3 and the driving plate 2. The angle between the wedge surface and the base plate 10 is 5° to 10°. The supporting plate 3 is configured so that when the driving plate 2 moves along the first direction X, the supporting plate 3 moves along the second direction Z, the second direction Z is perpendicular to the plane, and the first direction X is parallel to the plane.

[0052] The semiconductor material bonding platform includes a displacement platform 100 and a pressure platform 200. The pressure platform 200 is located on the displacement platform 100. The displacement platform 100 can move on the plane to adjust the horizontal position of the carrying platform, thereby adjusting the position of the semiconductor material on the carrying platform to align the semiconductor material with the position of the semiconductor material on other devices to facilitate subsequent bonding of the semiconductor materials.

[0053] Optionally, the embodiment of the present application does not restrict the displacement direction of the displacement platform 100, as long as the load-bearing platform can move within a plane. For example, the displacement platform 100 includes a displacement component that moves in a single direction; the displacement platform 100 may also include a displacement component that moves in multiple directions, where "moving in multiple directions" refers to moving in multiple directions within a plane.

[0054] The pressure platform 200 includes a bottom plate 10 , which can be directly connected to the displacement platform 100 ; the bottom plate 10 can also be connected to the displacement platform 100 via a transition structure.

[0055] The pressure platform 200 further includes a driving plate 2 , which can be movably connected to the base plate 10 via a sliding structure. The driving plate 2 can move back and forth along the first direction X relative to the base plate 10 .

[0056] Optionally, a driving device 7 and a linear transmission member 8 are provided between the driving plate 2 and the base plate 10. The driving device 7 is fixedly connected to the base plate 10, and the linear transmission member 8 is slidably connected to the driving plate 2. The driving device 7 drives the linear transmission member 8 to drive the driving plate 2 to move along the first direction X.

[0057] Optionally, the driving device 7 includes a driving motor, such as a servo motor.

[0058] Optionally, the linear transmission element 8 may include a ball screw. Optionally, the ball screw may be connected to the drive motor via a coupling. The end of the ball screw connected to the drive motor may be fixed to the base plate 10 via a bearing seat. The end of the ball screw away from the drive motor may be unfixed, or alternatively, fixed to the base plate 10 or other structure.

[0059] When the drive plate 2 needs to move in the first direction X, the drive motor can provide driving force to rotate the lead screw, and the nut will convert the rotation angle of the lead screw into linear motion. The drive plate 2 can be connected to the nut through the nut seat, thereby achieving the desired movement of the drive plate 2 in the first direction X. When the support plate 3 bears a large load (such as during the bonding process), the drive motor can provide a preset torque to provide support for the drive plate 2, reducing the possibility of the drive plate 2 moving in the first direction X under the influence of the support plate 3, thereby improving the load capacity of the support plate 3.

[0060] Optionally, a linear guide rail 9 may be provided on the base plate 10 , and the driving plate 2 is slidably connected to the linear guide rail 9 to improve the accuracy of the reciprocating motion of the driving plate 2 along the first direction X.

[0061] The pressure platform 200 also includes a support plate 3, which is slidably connected to the drive plate 2. Specifically, when the drive plate 2 reciprocates in a first direction X, the support plate 3 can reciprocate in a second direction Z. Optionally, the second direction Z is parallel to the direction in which the support plate 3 and the camera are arranged side by side when capturing the position of the semiconductor material. The first direction X is parallel to a plane, that is, the plane can be a plane extending from the first direction X. The second direction Z is perpendicular to the plane, that is, the first direction X is perpendicular to the second direction Z.

[0062] As an example, the driving plate 2 includes a first wedge surface 20, and the supporting plate 3 includes a second wedge surface 30. The first wedge surface 20 and the second wedge surface 30 cooperate with each other, that is, the shape, area and wedge angle of the first wedge surface 20 are matched with the shape, area and wedge angle of the second wedge surface 30.

[0063] A sliding mechanism 4 is further provided between the first wedge surface 20 and the second wedge surface 30. The sliding mechanism 4 enables relative sliding between the drive plate 2 and the carrier plate 3. The sliding mechanism 4 can improve the sliding precision between the drive plate 2 and the carrier plate 3, reduce friction, and improve transmission efficiency. Optionally, the sliding mechanism 4 includes a sliding rail and a sliding block, one of which is connected to the first wedge surface 20 and the other is connected to the second wedge surface 30.

[0064] In some examples, the wedge angle of the first wedge surface 20 is 5° to 10°. For example, the wedge angle of the first wedge surface 20 is α, and α is 5°, 6°, 7°, 8°, 9°, or 10°.

[0065] In some examples, the wedge angle of the second wedge surface 30 is 5° to 10°. For example, the wedge angle of the second wedge surface 30 is β, and β is 5°, 6°, 7°, 8°, 9°, or 10°.

[0066] Optionally, the wedge angle of the first wedge surface and the wedge angle of the second wedge surface are the same.

[0067] Taking the example of the first direction X being the horizontal direction and the second direction Z being the vertical direction, it can be understood that the wedge surface can decompose the load (such as gravity, pressure) along the second direction Z received by the support plate 3 through the inclined surface into a horizontal component and a vertical component. The vertical component acts on the first wedge surface 20 and the second wedge surface 30, generating a positive pressure and forming a friction force. The horizontal component can push the first wedge surface 20 and the second wedge surface 30 to wedge relative to each other, converting part of the vertical load into a horizontal force. When the wedge angle is 5° to 10°, the vertical force is diverted. When the support plate 3 is subjected to a vertical load (such as gravity, external pressure), the wedge angle causes part of the force (through the horizontal component) to be directed in the horizontal direction, rather than being transmitted entirely in the vertical direction to the drive plate 2, thereby reducing the possibility of the drive plate 2 and the support plate 3 being in a relative position.

[0068] In summary, the semiconductor material bonding platform includes a displacement platform 100 and a pressure platform 200. The displacement platform 100 can adjust the position of the wafer according to the position information obtained by the camera, thereby realizing the alignment of the wafer. The pressure platform 200 can adjust the distance between semiconductor materials of different specifications and the camera, thereby obtaining more accurate position information. At the same time, the driving plate 2 and the supporting plate 3 in the pressure platform 200 cooperate through the wedge surface and the sliding structure between the wedge surfaces to realize the lifting and lowering of the supporting platform, and the angle between the wedge surface and the bottom plate 10 is 5° to 10°, so that the load force can be dispersed from the load direction to other directions, thereby improving the load capacity of the pressure platform 200, so that the semiconductor material can be bonded without lowering the pressure platform 200 after the camera obtains the position information, and the alignment accuracy of the semiconductor material is improved from ±3μm to nanometer level, thereby improving the bonding accuracy of the semiconductor material.

[0069] In some optional embodiments, at least two rows of parallel wedge-shaped surfaces are included in the transverse direction Y between the driving plate 2 and the supporting plate 3 .

[0070] The transverse direction Y and the first direction X jointly define a plane, and the transverse direction Y intersects the first direction X. Optionally, the transverse direction Y is perpendicular to the first direction X.

[0071] Optionally, a connecting surface may be provided between two adjacent rows of wedge-shaped surfaces, and the connecting surface may be parallel to the bottom plate 10. Optionally, the connecting surface may serve as an avoidance structure, and a supporting plate or other mechanism may be provided on the side of the connecting surface facing the supporting plate.

[0072] Optionally, two rows of wedge surfaces in the at least two rows of wedge surfaces are located at both ends in the transverse direction Y; illustratively, the number of first wedge surfaces 20 includes two rows, the two rows of first wedge surfaces 20 are located at both ends of the driving plate 2 along the transverse direction Y, and the two rows of first wedge surfaces 20 are respectively formed by the edges of the driving plate 2 along the transverse direction Y extending into the driving plate 2; the number of second wedge surfaces 30 includes two rows, the two rows of second wedge surfaces 30 are located at both ends of the supporting plate 3 along the transverse direction Y, and the two rows of second wedge surfaces 30 are respectively formed by the edges of the supporting plate 3 along the transverse direction Y extending into the supporting plate 3.

[0073] It is understood that any two rows of wedge-shaped surfaces being arranged in parallel means that the planes on which the two rows of wedge-shaped surfaces are located are parallel. Optionally, any two rows of wedge-shaped surfaces can be arranged in the same plane, or any two rows of wedge-shaped surfaces can also be arranged in a non-coplanar manner.

[0074] In these optional embodiments, by setting up multiple rows of parallel wedge surfaces, it is beneficial to increase the number of sliding mechanisms 4 in the transverse direction Y, so that the load force on the supporting plate 3 can be transmitted to the driving plate 2 by multiple sliding mechanisms 4, so that when the supporting plate 3 is subjected to force, multiple rows of wedge surfaces are all subjected to force, which is beneficial to offset the lateral moment, offset the torque caused by the offset load, and improve the load capacity at any position of the supporting plate 3.

[0075] In some optional embodiments, the wedge-shaped surface is discontinuous in the first direction X, and is formed to include at least two parallel wedge-shaped facets.

[0076] Exemplarily, the first wedge surface 20 includes at least two first wedge surface sections 21 arranged in parallel.

[0077] Exemplarily, the second wedge surface 30 includes at least two second wedge surface portions 31 arranged in parallel.

[0078] Optionally, the dimensions of the two parallel wedge-shaped facets along the second direction Z may be the same; further, the two parallel wedge-shaped facets are coplanarly arranged away from the end face or edge of the side of the base plate 10 .

[0079] It can be understood that the at least two wedge-shaped facets are arranged in parallel, and the “parallel arrangement” here means that the wedge angles of the at least two wedge-shaped facets are the same.

[0080] In these optional embodiments, the arrangement of multiple wedge-shaped facets can reduce the height of each wedge-shaped facet and increase the total height displacement, thereby reducing the space occupied in the second direction Z, improving the structural integration of the semiconductor material bonding platform, and reducing the space occupied by the semiconductor material bonding platform.

[0081] In some optional embodiments, the wedge-shaped facets on the driving plate 2 and the wedge-shaped facets on the supporting plate 3 are in a relative positional relationship with each other. The sliding mechanism 4 is disposed between the wedge-shaped facets of the driving plate 2 and the supporting plate 3 .

[0082] As an example, the plurality of first wedge-shaped facets 21 and the plurality of second wedge-shaped facets 31 are arranged relative to each other along the second direction Z, and the plurality of first wedge-shaped facets 21 and the plurality of second wedge-shaped facets 31 are arranged in a one-to-one correspondence.

[0083] Exemplarily, the number of the sliding mechanisms 4 includes multiple ones, and the number of the multiple sliding mechanisms 4 is set in a one-to-one correspondence with the number of the multiple first wedge-shaped facets 21, that is, a sliding mechanism 4 is provided between each first wedge-shaped facet 21 and each second wedge-shaped facet 31.

[0084] In some optional embodiments, the wedge angles of any two wedge-shaped facets are the same, so that the load borne by the first wedge surface 20 and the load borne by the second wedge surface 30 are equal in magnitude and opposite in direction, forming a balanced couple, reducing the generation of additional lateral torque, thereby reducing the possibility of component tilt or local stress concentration on the contact surface, and improving the reliability and service life of the semiconductor material bonding platform.

[0085] Exemplarily, the first wedge surface 20 includes a plurality of first wedge facets 21 arranged along the first direction X and the transverse direction Y. In the first direction X, the wedge angles of any two first wedge facets 21 are the same; and in the transverse direction Y, the wedge angles of any two first wedge facets 21 are the same; and the wedge angles of any first wedge facets 21 in the first direction X and any first wedge facets 21 in the transverse direction Y are the same.

[0086] Exemplarily, the second wedge surface 30 includes a plurality of second wedge facets 31 arranged along the first direction X and the transverse direction Y. In the first direction X, the wedge angles of any two second wedge facets 31 are the same; in the transverse direction Y, the wedge angles of any two second wedge facets 31 are the same; and the wedge angles of any second wedge facets 31 in the first direction X and any second wedge facets 31 in the transverse direction Y are the same.

[0087] Furthermore, the wedge angles of any first wedge facet 21 in the first direction X and any second wedge facet 31 in the first direction X are the same; and the wedge angles of any first wedge facet 21 in the transverse direction Y and any second wedge facet 31 in the transverse direction Y are the same; and the wedge angles of any first wedge facet 21 in the first direction X and any second wedge facet 31 in the transverse direction Y are the same; and the wedge angles of any first wedge facet 21 in the transverse direction Y and any second wedge facet 31 in the first direction X are the same.

[0088] In some optional embodiments, guide mechanisms 5 are provided on two opposite sides of the carrying plate 3 , and the guide mechanisms 5 are used to limit the directional movement of the carrying plate 3 .

[0089] Exemplarily, the guide mechanism 5 limits the movement of the carrier plate 3 along the second direction Z to reduce the possibility of the carrier plate 3 moving along the first direction X or other directions, improve the transmission efficiency and the movement accuracy along the second direction Z, and thereby improve the camera's acquisition accuracy of the wafer's position information and improve the bonding accuracy.

[0090] In some optional embodiments, the guide mechanism 5 includes a guide slider 50 and a guide rail 51. A first mounting plate 11 extends perpendicularly from the carrier plate 3. A second mounting plate 12 extends perpendicularly from the base plate 10. The guide slider 50 or the guide rail 51 is mounted on the first mounting plate 11 or the second mounting plate 12, respectively.

[0091] Optionally, the first mounting plate 11 is located at an edge of the carrying plate 3 along the transverse direction Y.

[0092] Optionally, the first mounting plate 11 and the supporting plate 3 may be an integral structure, or alternatively, a separate structure.

[0093] Optionally, the second mounting plate 12 is located at an edge of the base plate 10 along the transverse direction Y.

[0094] Optionally, the second mounting plate 12 and the base plate 10 may be an integral structure, or alternatively, a separate structure.

[0095] In some examples, the guide slider 50 is mounted on the first mounting plate 11 , and the guide rail 51 is mounted on the second mounting plate 12 ; of course, the guide slider 50 can also be mounted on the second mounting plate 12 , and the guide rail 51 can be mounted on the first mounting plate 11 .

[0096] Optionally, the guide rail 51 may be formed to extend along the second direction Z. The guide slider 50 may perform reciprocating motion on the guide rail 51 .

[0097] Optionally, the pressure platform 200 may further include a cover plate 13, which is disposed opposite the base plate 10 and connected to the second mounting plate 12. The drive plate 2 and at least a portion of the carrier plate 3 may be located within the accommodation space enclosed by the cover plate 13, the base plate 10, and the second mounting plate 12. Optionally, the cover plate 13 may be provided with an escape opening, through which a portion of the carrier plate 3 may extend out of the cover plate 13, thereby reducing the possibility of interference with the cover plate 13 during the ascent or descent of the semiconductor material. Furthermore, the provision of the cover plate 13 may improve the overall rigidity and stability of the pressure platform 200.

[0098] In these optional embodiments, the above-mentioned configuration is helpful in simplifying the overall structure of the guide mechanism 5 . At the same time, the mounting plate provides an installation space for the guide mechanism 5 , thereby reducing the difficulty of assembling the semiconductor material bonding platform.

[0099] In some optional embodiments, the pressure platform 200 further includes a first limiter 61 , which is disposed on the base plate 10 and is configured to abut against the driving plate 2 to limit the movement range of the driving plate 2 along the first direction X.

[0100] Optionally, the first stopper 61 may be provided on an edge of the base plate 10 along the first direction X, and the first stopper 61 may protrude from the base plate 10 in a direction toward the drive plate 2. When the drive plate 2 moves along the first direction X, the drive plate 2 abuts against the first stopper 61, thereby preventing the drive plate 2 from further moving and limiting the range of movement of the drive plate 2 along the first direction X.

[0101] The embodiment of the present application provides the first limiting member 61 , which is beneficial for limiting the movement range of the driving plate 2 , while simplifying the limiting structure and reducing the manufacturing cost.

[0102] like Figure 7 and Figure 8 As shown, in some optional embodiments, the pressure platform 200 also includes a detection device 62 and a second limit member 63, the second limit member 63 is arranged on the side of the driving plate 2 toward the detection device 62 along the first direction X, and the second limit member 63 is protruded in the direction toward the base plate 10, and the detection device 62 is configured to limit the movement of the driving plate along the first direction X after the second limit member 63 moves to the detection position of the detection device 62.

[0103] Exemplarily, the detection device 62 may be located on one or both sides of the orthographic projection of the drive plate 2 on the base plate 10 along the first direction X. For example, two detection devices 62 may be provided, and the two detection devices 62 may be provided on both sides of the orthographic projection of the drive plate 2 on the base plate 10 along the first direction X. Two second stoppers 63 may be provided, and the two second stoppers 63 may be provided on both sides of the orthographic projection of the drive plate 2 on the base plate 10 along the first direction X. Optionally, the detection devices 62 and the second stoppers 63 are provided in a one-to-one correspondence.

[0104] A gap may be provided between the edge of the driving plate 2 along the first direction X and the base plate 10, and the detection device 62 is located in the gap between the driving plate 2 and the base plate 10. When the driving plate 2 moves above the detection device 62, the second limit member 63 may trigger the detection device 62 so that the detection device 62 detects a position signal and transmits the position signal to the control unit at the same time, and the control unit controls the driving plate 2 to stop moving.

[0105] The second limiting member 63 may include a first limiting portion extending away from the driving plate 2 along the first direction X and a second limiting portion extending toward the base plate 10. The first limiting portion and the second limiting portion are connected to avoid the possibility of interference between the driving plate 2 and the detection device 62 when the second limiting portion triggers the detection device 62.

[0106] Optionally, the detection device 62 can be located on the side of the first limit member 61 away from the drive plate 2. When the second limit member 63 triggers the detection device 62, the distance between the edge of the drive plate 2 close to the first limit member 61 and the first limit member 61 is smaller than the extension size of the first limit portion, so that when the drive plate 2 moves to the position where the second limit member 63 triggers the detection device 62, the drive plate 2 is not in contact with the first limit member 61. When the detection device 62 fails, the drive plate 2 contacts the first limit member 61 to limit the movement of the drive plate 2, thereby reducing the possibility of the drive plate 2 colliding with the detection device 62 and further improving the limiting effect.

[0107] like Figure 1 As shown, an embodiment of the present invention provides a semiconductor material bonding device, which includes a semiconductor material bonding platform. A carrier plate 3 on the semiconductor material bonding platform carries a chuck 300, which is used to support semiconductor materials. The semiconductor materials include wafers or chips.

[0108] This embodiment provides a semiconductor material bonding device, including the semiconductor material bonding platform of any of the above-mentioned embodiments. Since the semiconductor material bonding device provided in this embodiment includes the semiconductor material bonding platform of any of the above-mentioned embodiments, the semiconductor material bonding device provided in this embodiment has the beneficial effects of the semiconductor material bonding platform of any of the above-mentioned embodiments, which will not be repeated here.

[0109] In some optional embodiments, an intermediate mechanism 400 is further provided between the carrier plate 3 and the chuck 300 . The intermediate mechanism 400 includes a heating mechanism, a cooling mechanism, or a combination of a heating mechanism and a cooling mechanism.

[0110] The intermediate mechanism 400 can heat or cool the semiconductor material.

[0111] Alternatively, the heating mechanism may comprise a heating plate.

[0112] Optionally, the cooling mechanism may include a plate, such as a water-cooled plate or an air-cooled plate.

[0113] In these optional embodiments, the intermediate mechanism 400 is provided to facilitate heating or cooling the semiconductor material during the bonding process, thereby maintaining the semiconductor material within a suitable bonding temperature range and improving the bonding yield.

[0114] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A semiconductor material bonding platform, characterized in that: include: A displacement platform (100) and a pressure platform (200), wherein the displacement platform (100) is configured to move within a plane to adjust the horizontal position of the pressure platform (200) thereon; The pressure-bearing platform (200) comprises a bottom plate (10), and the bottom plate (10) is directly or indirectly connected to the displacement platform; a driving plate (2), the driving plate (2) being located on the upper side of the base plate (10), being slidably connected to the base plate (10), and being movable in a first direction relative to the base plate (10); A bearing plate (3), the bearing plate (3) being slidably connected to the driving plate (2), the bearing plate (3) and the driving plate (2) both having mutually matching wedge-shaped surfaces, the wedge-shaped surfaces being mounting surfaces of a sliding mechanism between the bearing plate (3) and the driving plate (2); The included angle between the wedge-shaped surface and the bottom plate (10) is 5° to 10°; The carrying plate (3) is configured such that when the driving plate (2) moves along the first direction, the carrying plate (3) moves along a second direction, the second direction being perpendicular to the plane and the first direction being parallel to the plane.

2. The semiconductor material bonding platform according to claim 1, characterized in that: At least two rows of parallel wedge-shaped surfaces are included in the transverse direction of the driving plate (2) and the supporting plate (3).

3. The semiconductor material bonding platform according to claim 1 or 2, characterized in that: The wedge-shaped surface is discontinuous in the first direction, and is formed to include at least two parallel wedge-shaped facets.

4. The semiconductor material bonding platform according to claim 3, characterized in that: The wedge-shaped facet on the driving plate (2) and the wedge-shaped facet on the carrying plate (3) have a relative positional relationship with each other; The sliding mechanism is arranged between the wedge-shaped facets of the driving plate (2) and the supporting plate (3).

5. The semiconductor material bonding platform according to claim 4, characterized in that: The wedge angles of any two of the wedge-shaped facets are the same.

6. The semiconductor material bonding platform according to claim 1, characterized in that: The supporting plate (3) is provided with guide mechanisms (5) on two opposite sides along its own transverse direction, and the guide mechanisms (5) are used to limit the directional movement of the supporting plate (3) in the second direction, and the transverse direction, the first direction and the second direction intersect each other.

7. The semiconductor material bonding platform according to claim 6, characterized in that: The guide mechanism (5) comprises a guide slider (50) and a guide rail (51); A first mounting plate (11) is formed extending perpendicularly to the carrying plate (3); A second mounting plate (12) is formed extending perpendicularly to the bottom plate (10); The guide slide block (50) or the guide rail (51) is mounted on the first mounting plate (11) or the second mounting plate (12), respectively.

8. The semiconductor material bonding platform according to claim 1, characterized in that: The pressure-bearing platform (200) further comprises a first limiting member (61), the first limiting member (61) being arranged on the bottom plate (10), and the first limiting member (61) being used to abut against the driving plate (2) to limit the movement range of the driving plate (2) along the first direction.

9. The semiconductor material bonding platform according to claim 1, characterized in that: The pressure platform (200) further includes a detection device (62) and a second limiter (63), wherein the second limiter (63) is arranged on the side of the drive plate (2) along the first direction, and the second limiter (63) is protruded in the direction toward the base plate (10). The detection device (62) is arranged on the edge of the base plate (10) along the first direction, and the detection device (62) is configured to limit the movement of the drive plate (2) along the first direction after the second limiter (63) moves to the detection position of the detection device (62).

10. A semiconductor material bonding device, characterized in that: include: The semiconductor material bonding platform according to any one of claims 1 to 9, wherein the carrier plate (3) carries a chuck (300), and the chuck (300) is used to carry semiconductor materials; the semiconductor materials include wafers or chips.

11. The semiconductor material bonding device according to claim 10, characterized in that: An intermediate mechanism (400) is further provided between the carrier plate (3) and the chuck (300), and the intermediate mechanism (400) comprises a heating mechanism, a cooling mechanism, or a combination of a heating mechanism and a cooling mechanism.

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