Laser heating device and semiconductor laser

Abstract

The invention discloses a laser heating device and a semiconductor laser, and the laser heating device comprises a plurality of laser assemblies which are used for outputting light beams; a plurality of first steps are formed on the first surface of the first laser heat sink, the first steps are in a step shape, each first step is provided with a plurality of laser assemblies, and the second surface of the first laser heat sink is used for forming a first heat dissipation channel; the second laser heat sink is arranged opposite to the first laser heat sink, a plurality of second steps are formed on the first surface of the second laser heat sink and are in a step shape, each second step is provided with a plurality of laser assemblies, and the second surface of the second laser heat sink is used for forming a second heat dissipation channel; the first surface of the second laser heat sink is opposite to the first surface of the first laser heat sink. By means of the mode, the distance between the first laser heat sink and the second laser heat sink in the combined position is effectively reduced, then the light spot distance is reduced, and therefore the uniformity of output light beams is improved.

Description

Technical Field

[0001] The present application relates to the technical field of lasers, and particularly to a laser heating device and a semiconductor laser. Background Art

[0002] In modern industrial production and daily life, heating technology always occupies a very crucial position. Its application scope is extensive, covering many fields from material processing, component manufacturing to food cooking, providing important support for meeting people's diverse needs. In recent years, as an emerging heating method, laser heating has developed rapidly with its unique advantages and has received extensive attention and application.

[0003] In the laser heating device of a traditional laser, the design of the stepped heat sink is usually placed forward, and a heat dissipation channel is provided at the bottom, that is, the heat dissipation channels of the two stepped heat sinks are arranged oppositely. This design limits the thickness of the step at the bottom, resulting in too large a spot spacing at the combined position of the spots of the two sets of laser components when the steps are combined face to face, thus leading to poor uniformity of the output beam. Summary of the Invention

[0004] The present application mainly provides a laser heating device and a semiconductor laser to solve the problem that when the steps are combined face to face, the spot spacing at the combined position of the spots of the two sets of laser components is too large, resulting in poor uniformity of the output beam.

[0005] The present application provides a laser heating device, including: Multiple laser components for outputting a beam; A first laser heat sink, on the first surface of which multiple first steps are formed. The multiple first steps are in a stepped shape, and each first step is provided with multiple laser components. The second surface of the first laser heat sink is used to form a first heat dissipation channel; A second laser heat sink, arranged opposite to the first laser heat sink. On the first surface of the second laser heat sink, multiple second steps are formed. The multiple second steps are in a stepped shape, and each second step is provided with multiple laser components. The second surface of the second laser heat sink is used to form a second heat dissipation channel; The first surface of the second laser heat sink is arranged opposite to the first surface of the first laser heat sink; A first support wall, a second support wall, a third support wall and a fourth support wall. Multiple first steps are arranged between the first support wall and the second support wall, and multiple second steps are arranged between the third support wall and the fourth support wall.

[0006] Among them, any two of the multiple first steps are arranged in parallel, and the number of laser components on any two of the first steps is not equal; any two of the multiple second steps are arranged in parallel, and the number of laser components on any two of the second steps is not equal.

[0007] Among them, among the multiple first steps, along the length direction of the laser heating device, the number of laser components on the first steps decreases sequentially; among the multiple second steps, along the length direction of the laser heating device, the number of laser components on the second steps decreases sequentially.

[0008] Among them, the laser heating device includes a first cover plate and a second cover plate. The first cover plate is arranged between the first support wall and the second support wall, and the first cover plate, the second surface of the first laser heat sink, the first support wall, and the second support wall form the first heat dissipation channel; the second cover plate is arranged between the third support wall and the fourth support wall, and the second cover plate, the second surface of the second laser heat sink, the third support wall, and the fourth support wall form the second heat dissipation channel.

[0009] Among them, the first heat dissipation channel includes a first input channel and a first output channel communicating with the first input channel, and the second heat dissipation channel includes a second input channel and a second output channel communicating with the second input channel.

[0010] Among them, a first input port and a first output port are arranged on the second surface of the first laser heat sink. The first input port and the first output port are arranged along the width direction of the laser heating device. The first input port communicates with the first input channel, and the first output port communicates with the first output channel; a second input port and a second output port are arranged on the second surface of the second laser heat sink. The second input port and the second output port are arranged along the width direction of the laser heating device. The second input port communicates with the second input channel, and the second output port communicates with the second output channel.

[0011] Among them, the laser heating device further includes a plurality of first collimating lenses and a plurality of second collimating lenses. The plurality of first collimating lenses and the plurality of second collimating lenses are arranged corresponding to the plurality of laser components, and the first collimating lenses and the second collimating lenses are sequentially arranged on the light-emitting side of the corresponding laser components.

[0012] Among them, multiple said laser components on multiple said first steps are connected in series in sequence, multiple said laser components on multiple said second steps are connected in series in sequence, and the last said laser component among multiple said laser components on multiple said first steps is connected to the last said laser component among multiple said laser components on multiple said second steps.

[0013] This application also provides a semiconductor laser, including the laser heating device as described above.

[0014] The beneficial effects of this application are as follows: In this application, the first laser heat sink and the second laser heat sink are oppositely arranged, and multiple first steps in a stepped shape are formed on the first surface of the first laser heat sink, multiple second steps in a stepped shape are formed on the first surface of the second laser heat sink, and the first surface of the second laser heat sink is oppositely arranged with the first surface of the first laser heat sink; compared with the traditional laser heating device, in this application, by arranging the first surface of the second laser heat sink oppositely with the first surface of the first laser heat sink, multiple second steps in a stepped shape are arranged oppositely with multiple first steps in a stepped shape. When the steps are combined face to face, there is no need to be restricted by the step thickness, which can effectively reduce the distance between the first laser heat sink and the second laser heat sink at the combined position, and further reduce the spot distance, thereby improving the uniformity of the output beam. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. Among them: Figure 1 is a schematic structural diagram of an embodiment of the laser heating device provided by this application; Figure 2 is Figure 1 a schematic structural diagram of an embodiment of the first laser heat sink in ; Figure 3 is Figure 2 a schematic structural diagram of an embodiment of the second surface of the first laser heat sink in ; Figure 4 is Figure 1 a schematic structural diagram of an embodiment of the second laser heat sink in ; Figure 5 is Figure 4 a schematic structural diagram of an embodiment of the second surface of the second laser heat sink in ; Figure 6 is a schematic structural diagram of an embodiment of multiple laser components of the laser heating device provided by this application; Figure 7 isFigure 6 Structural schematic diagram of an embodiment in which multiple laser components are connected. Detailed implementation mode

[0016] Hereinafter, embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, so they are only examples and cannot be used to limit the protection scope of the present application.

[0017] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above accompanying drawings are intended to cover non-exclusive inclusion.

[0018] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features.

[0019] Referring to "embodiment" herein means that a specific feature, structure or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The occurrence of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0020] In the description of the embodiments of this application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0021] In the description of the embodiments of this application, the term "multiple" means two or more (including two). Similarly, "multiple groups" means two or more groups (including two groups), and "multiple pieces" means two or more pieces (including two pieces).

[0022] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0023] In the laser heating device of a traditional laser, the stepped heat sink is usually designed to be placed forward, and a heat dissipation channel is provided at the bottom, that is, the heat dissipation channels of the two stepped heat sinks are arranged opposite to each other. This design limits the thickness of the steps at the bottom, resulting in too large a spot spacing at the combination position of the spots of the two sets of laser components when the steps are combined in opposite directions, thereby resulting in poor uniformity of the output beam.

[0024] Please refer to Figures 1-5 shown in Figure 1 which is a schematic structural diagram of an embodiment of the laser heating device provided by the present application; Figure 2 is Figure 1 a schematic structural diagram of an embodiment of the first laser heat sink in Figure 3 is Figure 2 a schematic structural diagram of an embodiment of the second surface of the first laser heat sink in Figure 4 is Figure 1 a schematic structural diagram of an embodiment of the second laser heat sink in Figure 5 is Figure 4 a schematic structural diagram of an embodiment of the second surface of the second laser heat sink in. The laser heating device 100 of this embodiment includes a first laser heat sink 10, a second laser heat sink 20, a plurality of laser components 30, a first support wall 40, a second support wall 50, a third support wall 60, and a fourth support wall 70.

[0025] Among them, the plurality of laser components 30 are used to output light beams. The laser components 30 include, but are not limited to, laser diodes or laser chips.

[0026] A plurality of first steps 11 are formed on the first surface 101 of the first laser heat sink 10. The plurality of first steps 11 are in a stepped shape, and each first step 11 is provided with a plurality of laser components 30. The second surface 102 of the first laser heat sink 10 is used to form a first heat dissipation channel 12.

[0027] Among them, the laser heat sink is a component used to absorb and conduct the heat generated by the laser components 30 and dissipate the heat to the surrounding environment; the laser heat sink is usually made of a material with high thermal conductivity, including, but not limited to, copper, aluminum, diamond, or graphene.

[0028] In some embodiments, the first surface 101 of the first laser heat sink 10 has a plurality of first steps 11 in a stepped shape, and a plurality of laser assemblies 30 are arranged on each first step 11, so that the plurality of laser assemblies 30 form a layered layout on the first laser heat sink 10.

[0029] As Figure 2 and Figure 3 shown, the first surface 101 of the first laser heat sink 10 forms 7 first steps 11, and the 7 first steps 11 are in a stepped shape, and a plurality of laser assemblies 30 are arranged on each first step 11; the second surface 102 of the first laser heat sink 10 is used to form the first heat dissipation channel 12.

[0030] The second laser heat sink 20 is disposed opposite to the first laser heat sink 10. The first surface 201 of the second laser heat sink 20 forms a plurality of second steps 21, the plurality of second steps 21 are in a stepped shape, and a plurality of laser assemblies 30 are arranged on each second step 21. The second surface 202 of the second laser heat sink 20 is used to form the second heat dissipation channel 22.

[0031] Wherein, the first heat dissipation channel 12 and the second heat dissipation channel 22 are used to quickly export the heat generated when the plurality of laser assemblies 30 work.

[0032] In some embodiments, the first surface 201 of the second laser heat sink 20 has a plurality of second steps 21 in a stepped shape, and the plurality of second steps 21 are correspondingly arranged with the plurality of first steps 11 formed on the first surface 101 of the first laser heat sink 10; a plurality of laser assemblies 30 are arranged on each second step 21, and the plurality of laser assemblies 30 form a layered layout on the second laser heat sink 20; and the second heat dissipation channel 22 formed on the second surface 202 of the second laser heat sink 20 is correspondingly arranged with the first heat dissipation channel 12 formed on the second surface 102 of the first laser heat sink 10.

[0033] As Figures 2-5 shown, the first surface 201 of the second laser heat sink 20 forms 7 second steps 21, the 7 second steps 21 correspond one-to-one with the 7 first steps 11, and the laser assemblies 30 on each second step 21 correspond to the laser assemblies 30 on the corresponding first step 11; the second heat dissipation channel 22 formed on the second surface 202 of the second laser heat sink 20 corresponds to the first heat dissipation channel 12 formed on the second surface 102 of the first laser heat sink 10.

[0034] The first surface 201 of the second laser heat sink 20 is disposed opposite to the first surface 101 of the first laser heat sink 10.

[0035] In some embodiments, the first surface 201 of the second laser heat sink 20 is disposed opposite to the first surface 101 of the first laser heat sink 10, such that the plurality of second steps 21 in a stepped shape are disposed opposite to the plurality of first steps 11 in a stepped shape; at this time, the second surface 202 of the second laser heat sink 20 is disposed opposite to the second surface 102 of the first laser heat sink 10, so that the second heat dissipation channel 22 is disposed opposite to the first heat dissipation channel 12.

[0036] As Figure 1 shown, the plurality of second steps 21 of the second laser heat sink 20 are disposed opposite to the plurality of first steps 11 of the first laser heat sink 10, and the high-level steps among the plurality of second steps 21 are opposite to the high-level steps among the plurality of first steps 11, and the low-level steps among the plurality of second steps 21 are opposite to the low-level steps among the plurality of first steps 11.

[0037] The plurality of first steps 11 are disposed between the first support wall 40 and the second support wall 50, and the plurality of second steps 21 are disposed between the third support wall 60 and the fourth support wall 70.

[0038] As Figure 2 shown, the first laser heat sink 10 is disposed between the first support wall 40 and the second support wall 50, such that the plurality of first steps 11 formed by the first surface 101 of the first laser heat sink 10 are disposed between the first support wall 40 and the second support wall 50.

[0039] As Figure 4 shown, the second laser heat sink 20 is disposed between the third support wall 60 and the fourth support wall 70, such that the plurality of second steps 21 formed by the first surface 201 of the second laser heat sink 20 are disposed between the third support wall 60 and the fourth support wall 70.

[0040] In some embodiments, when the second laser heat sink 20 and the first laser heat sink 10 are disposed opposite to each other, the fourth support wall 70 abuts against the first support wall 40, and the third support wall 60 abuts against the second support wall 50 to form the laser heating device 100.

[0041] As Figure 1 shown, after the fourth support wall 70 abuts against the first support wall 40 and the third support wall 60 abuts against the second support wall 50, the laser heating device 100 forms a light outlet, and the light beams output by the plurality of laser components 30 are emitted through the light outlet.

[0042] By disposing the plurality of first steps 11 between the first support wall 40 and the second support wall 50 and disposing the plurality of second steps 21 between the third support wall 60 and the fourth support wall 70, the laser heating device 100 has high structural stability, ensuring that the laser heating device 100 can withstand large thermal stress and mechanical stress during high-power laser output.

[0043] In this embodiment, the first surface 201 of the second laser heat sink 20 is disposed opposite to the first surface 101 of the first laser heat sink 10, so that a plurality of second steps 21 in a stepped shape are disposed opposite to a plurality of first steps 11 in a stepped shape. When the steps are combined facing each other, there is no need to be restricted by the step thickness, which can effectively reduce the distance between the first laser heat sink 10 and the second laser heat sink 20 at the combined position, thereby reducing the spot distance and improving the uniformity of the output beam.

[0044] According to some embodiments of the present application, any two of the plurality of first steps 11 are parallel to each other, and the number of laser components 30 on any two first steps 11 is not equal; any two of the plurality of second steps 21 are parallel to each other, and the number of laser components 30 on any two second steps 21 is not equal.

[0045] As Figure 2 shown, any two of the seven first steps 11 are parallel to each other, and the seven first steps 11 are parallel to each other. The number of laser components 30 on each first step 11 is not equal. As Figure 4 shown, any two of the seven second steps 21 are parallel to each other, and the seven second steps 21 are parallel to each other. The number of laser components 30 on each second step 21 is not equal.

[0046] In this embodiment, any two of the plurality of first steps 11 are parallel to each other, and any two of the plurality of second steps 21 are parallel to each other. The parallel steps can ensure that the beams output by the laser components 30 disposed on the first steps 11 and the second steps 21 have a certain directional consistency in space, which helps to achieve a more uniform beam distribution in the target area; and the parallel step structure can improve the structural stability of the first laser heat sink 10 and the second laser heat sink 20, so that the first laser heat sink 10 and the second laser heat sink 20 can better withstand thermal stress during high-power laser output.

[0047] According to some embodiments of the present application, referring to Figure 6 shown, Figure 6 is a schematic structural diagram of an embodiment of a plurality of laser components of a laser heating device provided by the present application. Among the plurality of first steps 11 in this embodiment, along the length direction of the laser heating device 100, the number of laser components 30 on the first steps 11 decreases in sequence; among the plurality of second steps 21, along the length direction of the laser heating device 100, the number of laser components 30 on the second steps 21 decreases in sequence.

[0048] As Figure 6As shown, for example, along the length direction of the laser heating device 100, the number of laser assemblies 30 on the first step 11 decreases successively, being 9, 8, 7, 6, 5, and 2 respectively. That is, the lower half 110 includes 37 laser assemblies 30 on the first laser heat sink 10; along the length direction of the laser heating device 100, the number of laser assemblies 30 on the second step 21 decreases successively, being 9, 8, 7, 6, 5, and 2 respectively. That is, the upper half 120 includes 37 laser assemblies 30 on the second laser heat sink 20.

[0049] In this embodiment, the number of laser assemblies 30 on the first step 11 decreases successively, and the number of laser assemblies 30 on the second step 21 decreases successively. By setting the decreasing number of laser assemblies 30, the energy distribution can be optimized according to the energy requirements of the target area. For example, a higher energy output may be required in the starting area of the laser heating device 100, so more laser assemblies 30 are set; while in the area far from the starting point, the energy requirement may gradually decrease, so the number of laser assemblies 30 also decreases accordingly.

[0050] According to some embodiments of the present application, the laser heating device 100 includes a first cover plate 80 and a second cover plate 90. Among them, the first cover plate 80 and the second cover plate 90 include, but are not limited to, sealing plates.

[0051] The first cover plate 80 is arranged between the first support wall 40 and the second support wall 50. The first cover plate 80, the second surface 102 of the first laser heat sink 10, the first support wall 40, and the second support wall 50 form a first heat dissipation channel 12.

[0052] As Figure 3 shown, the first cover plate 80 is arranged on the second surface 102 of the first laser heat sink 10, and the first cover plate 80 is arranged between the first support wall 40 and the second support wall 50. At this time, the first cover plate 80, the second surface 102 of the first laser heat sink 10, the first support wall 40, and the second support wall 50 form a first heat dissipation channel 12. The first surface 101 of the first laser heat sink 10 absorbs the heat of multiple laser assemblies 30 and conducts the heat into the first heat dissipation channel 12 on the second surface 102 of the first laser heat sink 10.

[0053] The second cover plate 90 is arranged between the third support wall 60 and the fourth support wall 70. The second cover plate 90, the second surface 202 of the second laser heat sink 20, the third support wall 60, and the fourth support wall 70 form a second heat dissipation channel 22.

[0054] As Figure 5As shown, the second cover plate 90 is disposed on the second surface 202 of the second laser heat sink 20, and the second cover plate 90 is disposed between the third support wall 60 and the fourth support wall 70; at this time, the second cover plate 90, the second surface 202 of the second laser heat sink 20, the third support wall 60 and the fourth support wall 70 form a second heat dissipation channel 22, and the first surface 201 of the second laser heat sink 20 absorbs the heat of the plurality of laser components 30 and conducts the heat to the second heat dissipation channel 22 on the second surface 202 of the second laser heat sink 20.

[0055] In this embodiment, the first cover plate 80, the second surface 102 of the first laser heat sink 10, the first support wall 40 and the second support wall 50 form a first heat dissipation channel 12, and the second cover plate 90, the second surface 202 of the second laser heat sink 20, the third support wall 60 and the fourth support wall 70 form a second heat dissipation channel 22. By combining the cover plate with the surface and support walls of the laser heat sink to form a heat dissipation channel, the entire heat dissipation channel structure is compact and does not occupy extra space, making it easy to miniaturize and highly integrate the laser heating device 100.

[0056] According to some embodiments of the present application, referring to Figure 3 and Figure 5 As shown, the first heat dissipation channel 12 of this embodiment includes a first input channel 121 and a first output channel 122 communicating with the first input channel 121, and the second heat dissipation channel 22 includes a second input channel 221 and a second output channel 222 communicating with the second input channel 221.

[0057] Among them, the first input channel 121 is used to introduce the heat dissipation medium into the first heat dissipation channel 12; the first output channel 122 is used to discharge the heat dissipation medium that has passed through the first heat dissipation channel 12. The second input channel 221 is used to introduce the heat dissipation medium into the second heat dissipation channel 22; the second output channel 222 is used to discharge the heat dissipation medium that has passed through the second heat dissipation channel 22.

[0058] The heat dissipation medium, also called the cooling medium, includes but is not limited to air, water or other cooling liquids.

[0059] In this embodiment, through the settings of the first input channel 121, the first output channel 122, the second input channel 221 and the second output channel 222, the heat dissipation medium can smoothly flow through the first heat dissipation channel 12 and the second heat dissipation channel 22, absorb and carry away the heat of the laser components 30, and ensure that the laser components 30 operate within the normal working temperature range.

[0060] According to some embodiments of the present application, referring to Figure 3 and Figure 5As shown, a first input port 13 and a first output port 14 are provided on the second surface 102 of the first laser heat sink 10 of this embodiment. The first input port 13 and the first output port 14 are arranged along the width direction of the laser heating device 100. The first input port 13 is communicated with the first input channel 121, and the first output port 14 is communicated with the first output channel 122.

[0061] In some embodiments, the heat dissipation medium enters the first input channel 121 through the first input port 13, then reaches the first output channel 122 communicated with the first input channel 121, and finally is discharged through the first output port 14, so as to export the heat of the laser assembly 30.

[0062] As Figure 3 shown, the first input port 13 and the first output port 14 are arranged on the second surface 102 of the first laser heat sink 10. The first input port 13 and the first output port 14 are arranged along the width direction of the laser heating device 100 and are located on one side of the high-level step among the plurality of first steps 11. The first input channel 121 and the first output channel 122 are communicated on one side of the low-level step among the plurality of first steps 11. At this time, the heat dissipation medium can effectively export the heat of the plurality of laser assemblies 30 through the first input port 13, the first input channel 121, the first output channel 122, and the first output port 14.

[0063] A second input port 23 and a second output port 24 are provided on the second surface 202 of the second laser heat sink 20. The second input port 23 and the second output port 24 are arranged along the width direction of the laser heating device 100. The second input port 23 is communicated with the second input channel 221, and the second output port 24 is communicated with the second output channel 222.

[0064] In some embodiments, the heat dissipation medium enters the second input channel 221 through the second input port 23, then reaches the second output channel 222 communicated with the second input channel 221, and finally is discharged through the second output port 24, so as to export the heat of the laser assembly 30.

[0065] As Figure 5 shown, the second input port 23 and the second output port 24 are arranged on the second surface 202 of the second laser heat sink 20. The second input port 23 and the second output port 24 are arranged along the width direction of the laser heating device 100 and are located on one side of the high-level step among the plurality of second steps 21. The second input channel 221 and the second output channel 222 are communicated on one side of the low-level step among the plurality of second steps 21. At this time, the heat dissipation medium can effectively export the heat of the plurality of laser assemblies 30 through the second input port 23, the second input channel 221, the second output channel 222, and the second output port 24.

[0066] Optionally, for the convenience of processing, a first input port 13, a first output port 14, a first input channel 121, and a first output channel 122 are pre-milled on the second surface 102 of the first laser heat sink 10, and a second input port 23, a second output port 24, a second input channel 221, and a second output channel 222 are pre-milled on the second surface 202 of the second laser heat sink 20. After being sealed by the first cover plate 80 and the second cover plate 90 respectively, a first heat dissipation channel 12 and a second heat dissipation channel 22 are respectively formed.

[0067] According to some embodiments of the present application, the laser heating device 100 further includes a plurality of first collimating lenses 31 and a plurality of second collimating lenses 32. The plurality of first collimating lenses 31 and the plurality of second collimating lenses 32 are correspondingly arranged with the plurality of laser assemblies 30, and the first collimating lens 31 and the second collimating lens 32 are sequentially arranged on the light-emitting side of the corresponding laser assembly 30.

[0068] Among them, the first collimating lens 31 includes, but is not limited to, a fast-axis collimating lens; the second collimating lens 32 includes, but is not limited to, a slow-axis collimating lens.

[0069] In some embodiments, the plurality of laser assemblies 30 on the plurality of first steps 11 and the plurality of laser assemblies 30 on the plurality of second steps 21 are arranged horizontally in the same direction. The first collimating lens 31 and the second collimating lens 32 are sequentially arranged on the light-emitting side of the corresponding laser assembly 30. The first collimating lens 31 is used to perform fast-axis collimation on the light beam output by the laser assembly 30, and the second collimating lens 32 is used to perform slow-axis collimation on the light beam after fast-axis collimation, so that the light beams output by the plurality of laser assemblies 30 of the laser heating device 100 are parallel light spots after fast-axis collimation and slow-axis collimation.

[0070] In some embodiments, the step height differences of the plurality of first steps 11 are the same, the step height differences of the plurality of second steps 21 are the same, and the step height difference of the first step 11 is the same as the height difference of the second step 21. The spot heights of the laser assemblies 30 arranged on the plurality of first steps 11 and the laser assemblies 30 arranged on the plurality of second steps 21 are the same. The first laser heat sink 10 and the second laser heat sink 20 are combined facing each other, that is, when the first laser heat sink 10 and the second laser heat sink 20 are arranged oppositely, the spot height of the laser assembly 30 on the high step among the plurality of first steps 11 is the same as the spot height of the laser assembly 30 on the high step among the adjacent plurality of second steps 21.

[0071] Since the step height differences of the plurality of first steps 11 are the same, the step height differences of the plurality of second steps 21 are the same, and the step height difference of the first step 11 is the same as the height difference of the second step 21, the spots emitted by the plurality of laser assemblies 30 in the laser heating device 100 are circularly distributed.

[0072] According to some embodiments of the present application, refer to Figure 7 as shown in Figure 7 which is Figure 6 a schematic structural diagram of an embodiment in which multiple laser components in

[0073] are connected. In this embodiment, the multiple laser components 30 on the multiple first steps 11 are connected in series in sequence, the multiple laser components 30 on the multiple second steps 21 are connected in series in sequence, and the last laser component 30 among the multiple laser components 30 on the multiple first steps 11 is connected to the last laser component 30 among the multiple laser components 30 on the multiple second steps 21.

[0073] As Figure 7 shown, the laser components 30 of adjacent steps among the multiple first steps 11 are connected through a transfer electrode, and the negative electrode of the last laser component 30 on the previous first step 11 is connected to the positive electrode of the first laser component 30 on the next first step 11 through a connection line 130, so that the multiple laser components 30 on the multiple first steps 11 are connected in series in sequence to form a circuit series; the laser components 30 on the multiple second steps 21 are connected in series in the same manner as the laser components on the multiple first steps 11; the negative electrode of the last laser component 30 on the multiple first steps 11 is connected to the positive electrode of the first laser component 30 on the multiple second steps 21 through a connection line 130 to form a complete circuit connection of the laser heating device 100.

[0074] In this embodiment, by connecting the multiple laser components 30 in series in sequence, the light beams output by each laser component 30 can be superimposed on each other, so that the energy distribution of the output light beam in the target area is more uniform.

[0075] Another embodiment of the present application further provides a semiconductor laser, including the laser heating device 100 of the above embodiment.

[0076] In summary, in the present application, the first surface 201 of the second laser heat sink 20 is arranged opposite to the first surface 101 of the first laser heat sink 10, so that the multiple second steps 21 in a stepped shape are arranged opposite to the multiple first steps 11 in a stepped shape. When the steps are combined face to face, there is no need to be limited by the step thickness, which can effectively reduce the distance between the first laser heat sink 10 and the second laser heat sink 20 at the combined position, thereby reducing the spot distance, and thus improving the uniformity of the output light beam.

[0077] The above are only the implementation manners of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A laser heating device, characterized in that, Comprising: A plurality of laser components for outputting light beams; A first laser heat sink, on the first surface of which a plurality of first steps are formed, the plurality of first steps being in a stepped shape, with a plurality of the laser components disposed on each of the first steps, and the second surface of the first laser heat sink being used for forming a first heat dissipation channel; A second laser heat sink, disposed opposite to the first laser heat sink, on the first surface of which a plurality of second steps are formed, the plurality of second steps being in a stepped shape, with a plurality of the laser components disposed on each of the second steps, and the second surface of the second laser heat sink being used for forming a second heat dissipation channel; The first surface of the second laser heat sink is disposed opposite to the first surface of the first laser heat sink; A first support wall, a second support wall, a third support wall, and a fourth support wall, with the plurality of first steps disposed between the first support wall and the second support wall, and the plurality of second steps disposed between the third support wall and the fourth support wall.

2. The laser heating device according to claim 1, characterized in that, Any two of the plurality of first steps are parallel to each other, and the number of laser components on any two of the first steps is not equal; any two of the plurality of second steps are parallel to each other, and the number of laser components on any two of the second steps is not equal.

3. The laser heating device according to claim 2, characterized in that, Among the plurality of first steps, along the length direction of the laser heating device, the number of laser components on the first steps decreases sequentially; among the plurality of second steps, along the length direction of the laser heating device, the number of laser components on the second steps decreases sequentially.

4. The laser heating device according to claim 1, wherein The laser heating device includes a first cover plate and a second cover plate. The first cover plate is disposed between the first support wall and the second support wall, and the first cover plate, the second surface of the first laser heat sink, the first support wall, and the second support wall form the first heat dissipation channel; the second cover plate is disposed between the third support wall and the fourth support wall, and the second cover plate, the second surface of the second laser heat sink, the third support wall, and the fourth support wall form the second heat dissipation channel.

5. The laser heating device according to claim 4, wherein, The first heat dissipation channel includes a first input channel and a first output channel communicating with the first input channel, and the second heat dissipation channel includes a second input channel and a second output channel communicating with the second input channel.

6. The laser heating device according to claim 5, characterized in that, The second surface of the first laser heat sink is provided with a first input port and a first output port, the first input port and the first output port being disposed along the width direction of the laser heating device, the first input port communicating with the first input channel, and the first output port communicating with the first output channel; the second surface of the second laser heat sink is provided with a second input port and a second output port, the second input port and the second output port being disposed along the width direction of the laser heating device, the second input port communicating with the second input channel, and the second output port communicating with the second output channel.

7. The laser heating device according to claim 1, characterized in that, The laser heating device further includes a plurality of first collimating lenses and a plurality of second collimating lenses. The plurality of first collimating lenses and the plurality of second collimating lenses are arranged corresponding to the plurality of laser components, and the first collimating lens and the second collimating lens are sequentially arranged on the light-emitting side of the corresponding laser component.

8. The laser heating device according to claim 1, characterized in that The plurality of laser components on the plurality of first steps are sequentially connected in series, the plurality of laser components on the plurality of second steps are sequentially connected in series, and the last laser component among the plurality of laser components on the plurality of first steps is connected to the last laser component among the plurality of laser components on the plurality of second steps.

9. A semiconductor laser, characterized in that, It includes the laser heating device according to any one of claims 1-8.

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